LG GD900 Service Manual

Service Manual Model : GD900

Internal Use Only

Service Manual

GD900

Date: June, 2009 / Issue 1.0

Table Of Contents

1. INTRODUCTION ...............................................5

1.1 Purpose ......................................................................5

1.2 Regulatory Information .................................................5

1.3. ABBREVIATION ...........................................................7

2. PERFORMANCE ...............................................9

2.1 Supporting Standard ....................................................9

2.2 Main Parts : Solution ..................................................10

2.3 H/W features .............................................................10

2.4 HW Spec. ................................................................12

3. BB CIRCUIT TECHNICAL BRIEF .....................17

3.1 Functional Block Diagram ..........................................17

3.2 Baseband Processor Introduction ...............................18

3.3 Power management IC...............................................31

3.4 Power ON/OFF ..........................................................38

3.5 SIM Interface .............................................................39

3.6 T - Flash connector ....................................................40

3.7 Memory ....................................................................41

3.8 LCD Display ..............................................................42

3.9 Keypad back-light illumination ....................................44

3.10 LCD back-light illumination ......................................45

3.11 Numeric keypad back-light illumination .....................46

3.12 Battery voltage monitor ............................................47

3.13 Audio ......................................................................48

3.14 5 PIN Interface conn. & Micro USB Control IC(MUIC) ..52

3.15 WLAN/Bluetooth/FM(LBEH19UNBC) ..........................55

4. RF Circuit Technical Brief ............................58

4.1 General Description ...................................................58

4.2 GSM Part ..................................................................61

4.3 WCDMA Part .............................................................66

4.4 GSM Power Ampliﬁ er Module .....................................69

4.5 WCDMA Band1/8 Power Ampliﬁ er Module ..................70

4.6 WCDMA Band1/8 Low Noise Ampliﬁ er ........................71

4.7 WCDMA Band1 Duplexer ...........................................72

4.8 WCDMA Band8 Duplexer ...........................................73

5.4 USB Trouble ..............................................................81

5.5 SIM Detection Trouble ................................................83

5.6 Micro SD Trouble .......................................................86

5.7 Audio Trouble ............................................................88

5.8 Microphone Trouble ...................................................92

5.9 Camera Trouble .........................................................96

5.10 Main LCD Trouble ..................................................101

5.11 WiFi /Bluetooth Trouble ..........................................103

5.12 MIC FPCB .............................................................108

5.13 Speaker Module ....................................................110

5.14 Ambient Sensor .....................................................112

5.15 Main LCD Touch Sensor .........................................114

5.16 Number Key Touch Sensor .....................................116

6. Download & S/W upgrade ......................... 118

7. BLOCK DIAGRAM ........................................ 137

8. CIRCUIT DIAGRAM ...................................... 139

9. BGA Pin Map .............................................. 151

10. PCB LAYOUT .............................................155

11. RF Calibration .......................................... 159

11.1. Test Equipment Setup ...........................................159

11.2. Calibration Step ....................................................160

12. EXPLODED VIEW & REPLACEMENT

PART LIST ................................................ 165

12.1 EXPLODED VIEW ...................................................165

12.2 Replacement Parts ................................................167

12.3 Accessory ............................................................. 199

5. Trouble shooting .......................................... 74

5.1 Trouble shooting test setup ........................................74

5.2 Power ON trouble ......................................................75

5.3 Charging Trouble .......................................................79

- 3 -

LGE Internal Use Only

- 4 -

Only for training and service purposes

1. INTRODUCTION

1.1.Purpose

This manual provides the information necessary to repair, calibration, description and download the

features of the GD900.

1.2.Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system.

There might be risks of toll fraud associated with your telecommunications system. System users are

responsible for programming and configuring the equipment to prevent unauthorized use. LGE does

not warrant that this product is immune from the above case but will prevent unauthorized use of

common carrier telecommunication service of facilities accessed through or connected to it. LGE will

not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone

service until repair can be done. A telephone company may temporarily disconnect service as long as

repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the GD900 or compatibility with the net

work, the telephone company is required to give advanced written notice to the user, allowing the user

to take appropriate steps to maintain telephone service.

- 5 -

LGE Internal Use Only

1. INTRODUCTION

GD900 service manual

D. Maintenance Limitations

Maintenance limitations on the GD900 must be performed only by the LGE or its authorized agent.

The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system

and may void any remaining warranty.

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

GD900 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following

information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is

also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as

described.

- 6 -

Only for training and service purposes

GD900 service manual

◆

1. INTRODUCTION

1.3. ABBREVIATION

For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control BB Baseband BER Bit Error Ratio CC-CV Constant Current – Constant Voltage CLA Cigar Lighter Adapter DAC Digital to Analog Converter DCS Digital Communication System dBm dB relative to 1 milli-watt DSP Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory EGPRS Enhanced General Packet Radio Service EL Electroluminescence ESD Electrostatic Discharge FPCB Flexible Printed Circuit Board GMSK Gaussian Minimum Shift Keying GPIB General Purpose Interface Bus GPRS General Packet Radio Service GSM Global System for Mobile Communications IPUI International Portable User Identity IF Intermediate Frequency LCD Liquid Crystal Display LDO Low Drop Output LED Light Emitting Diode LGE LG Electronics OPLL Offset Phase Locked Loop PAM Power Amplifier Module PCB Printed Circuit Board PGA Programmable Gain Amplifier PLL Phase Locked Loop

- 7 -

LGE Internal Use Only

1. INTRODUCTION

GD900 service manual

◆

PSTN Public Switched Telephone Network RF Radio Frequency RLR Receiving Loudness Rating RMS Root Mean Square RTC Real Time Clock SAW Surface Acoustic Wave SIM Subscriber Identity Module SLR Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating TA Travel Adapter TDD Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter VCO Voltage Controlled Oscillator VCTCXO

WAP

◆ 8PSK 8 Phase Shift Keying

Voltage Control Temperature Compensated Crystal

Oscillator

Wireless Application Protocol

- 8 -

Only for training and service purposes

2. PERFORMANCE

GD900 service manual

2.1. Supporting Standard

2. PERFORMANCE

Item Feature Comment

Supporting Standard WCDMA 900 / WCDMA

2100/HSDPA GSM850/EGSM/DCS/PCS with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 3

Frequency Range GSM850 TX : 824 - 849MHz

GSM850 RX : 869 - 894MHz EGSM TX : 880 - 915 MHz EGSM RX : 925 - 960 MHz DCS TX : 1710 - 1785 MHz DCS RX : 1805 - 1880 MHz PCS TX : 1850 - 1910 MHz PCS RX : 1930 - 1990 MHz WCDMA900 TX : 880 - 915 MHz WCDMA900 RX : 925 - 960 MHz WCDMA2100 TX : 1920 - 1980 MHz WCDMA2100 RX : 2110 - 2170 MHz HSDPA TX : 880 - 915 MHz 1920 - 1980 MHz HSDPA RX : 925 - 960 MHz 2110 - 2170 MHz WLAN 802.11g : 2400 – 2483.5 MHz

Application Standard WAP 2.0, JAVA 2.1

- 9 -

LGE Internal Use Only

2. PERFORMANCE

GD900 service manual

2.2. Main Parts : Solution

Item Part name Comment

Digital Baseband PMB8878 (Infineon)

Analog Baseband PMB8878 (Infineon)

RF chip PMB6952 (Infineon)

2.3. H/W features

Item Feature Comment

Form Factor Color LCD – DOP Slide Type

1)Capacity Standard : Li-Ion, 1000mAh Battery

2) Packaging Type : Soft Pack

Item Feature Comment

Size

Weight 130g With Battery

GSM Up to 300 hours @paging period 9 Stand-by

time

Charging time Up to 2hours 30min @power

Rx sensitivity EGSM900 : -105 dBm

WCDMA Up to 300 hours @DRX=8

GSM Up to 6 hours @ Power Level 10 Talk

WCDMA Up to 4 hours @Tx=0 dBm

105 × 52.8 × 13.5mm

OFF/1000mAh

DCS1800 : -105 dBm PCS1900 : -105 dBm WCDMA2100 : -106.7 dBm

TX output

power

GSM/

GPRS

EDGE EGSM900 : 27 dBm

EGSM900 : 33 dBm DCS1800 : 30 dBm PCS1900 : 30 dBm

DCS1800 : 26 dBm PCS1900 : 26 dBm

- 10 -

Class4 (EGSM900) Class1(DCS) Class1(PCS) E2 (EGSM900) E2 (DCS) E2 (PCS)

Only for training and service purposes

GD900 service manual

GPRS compatibility GPRS Class 12 EDGE compatibility EDGE Class 12

Display Main LCD(3”, 480 x 800)/TFT

Built-in Camera 8 Mega pixel

ANT Main : Internal Fixed Type

System connector 5 Pin

Ear Phone Jack 5pin, Stereo(Canal, 2-piece)

PC synchronization Yes

Speech coding FR, EFR, HR, AMR

Vibrator Built in Vibrator

Bluetooth V2.1 with A2DP

Voice Recording Yes

2. PERFORMANCE

Speaker Phone

Yes

mode Support

Travel Adapter Yes

CDROM Yes

Stereo Headset Yes

Data Cable Yes

T-Flash Yes Not Equipped

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LGE Internal Use Only

2. PERFORMANCE

GD900 service manual

2.4. HW Spec.

2.4.1 GSM Transmitter/Receiver spec.

Item Specification

GSM 850 TX : 824 - 849 MHz RX : 869 - 894 MHz

Frequency

Phase Error

Frequency Error

EMC(Radiated Spurious Emission

Disturbance)

Transmitter Output power and

Burst Timing

Burst Timing <3.69us

Spectrum due to modulation out

to less than 1800kHz offset

EGSM TX : 880 - 915 MHz RX : 925 - 960 MHz

DCS TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz

PCS TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz

Rms : 5°

Peak : 20 °

GSM : 0.1 ppm

DCS/PCS : 0.1 ppm

GSM/DCS : < -28dBm

GSM : 5dBm – 33dBm ± 3dB

DCS/PCS : 0dBm – 30dBm ± 3dB

200kHz : -36dBm

600kHz : -51dBm/-56dBm

GSM : 1800-3000kHz :< -63dBc(-46dBm)

Spectrum due to modulation out

to larger than 1800kHz offset to

the edge of the transmit band

Spectrum due to switching

transient

Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)

Usable receiver input level range 0.012(-15 - -40dBm)

Intermodulation rejection –

Speech channels

AM Suppression

- GSM : -31dBm - DCS : 29dBm

Timing Advance ± 0.5T

3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS : 1800-3000kHz :< -65dBc(-51dBm)

6000kHz < : < -73dBc(-51dBm)

400kHz : -19dBm/-22dBm(5/0), -23dBm

600kHz : -21dBm/-24dBm(5/0), -26dBm

± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)

-98dBm/-96dBm (2.439%)

- 12 -

Only for training and service purposes

GD900 service manual

2.4.2 WCDMA Transmitter spec.

Item Specification

Transmit Frequency WCDMA900 : 880 – 915MHz

WCDMA2100 : 1920 MHz ~ 1980 MHz

Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error within ±0.1 PPM

Open Loop Power Control Normal Conditions : within ±9 dB,

Extreme Conditions : within ±12 dB

Minimum Transmit Power < -50 dBm /3.84 MHz

Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

2. PERFORMANCE

Adjacent Channel Leakage

Power Ratio (ACLR)

Spurious Emissions

|f-fc| > 12.5 MHz

Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

Peak Code Domain Error

> 33 dB @ ±5 MHz,

> 43 dB @ ±10 MHz

< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz

< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz

< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz

< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz

when Interference CW Signal Level = -40 dBc

< -15 dB at Pout t -20 dBm

- 13 -

LGE Internal Use Only

2. PERFORMANCE

GD900 service manual

A

2.4.3 WCDMA Receiver spec.

Item Specification

Receive Frequency WCDMA900 : 925 MHz ~ 960 MHz

WCDMA2100 : 2110 ~2170 MHz

Reference Sensitivity Level BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz

Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz

djacent Channel Selectivity

(ACS)

Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz

Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -44

Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz

Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

ACS > 33 dB where BER < 0.001 when Îor = -92.7 dBm / 3.84

MHz

& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz

& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz

or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz

dBm

& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz

& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz

Inner Loop Power Control In

Uplink

< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24

- 14 -

Only for training and service purposes

GD900 service manual

2.4.4 HSDPA Transmitter Spec..

Specification Item

880 MHz ~ 915 MHz 1920MHz ~ 1980 MHz Transmit Frequency

2. PERFORMANCE

Maximum Output Power

HS-DPCCH

Spectrum Emission Mask

Sub-Test 1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Sub-

test in

table

C.10.1.

5

Frequency offset from

Power

step

carrier △f

Power step slot

boundary

Minimum requirement

Power

step

size, P

[dB]

Transmitter

power step

tolerance

[dB]

+/- 2.3 6Start of Ack/Nack 1

+/- 0.6 1Start of CQI 2

+/- 0.6 0Middle of CQI 3

+/- 2.3 5End of CQI 4

Measurement

Bandwidth

2.5 ~ 3.5 MHz

3.5 ~ 7.5 MHz

7.5 ~ 8.5 MHz

Adjacent Channel

Leakage Power Ratio (ACLR)

Error Vector Magnitude

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

> 33 dB @ ±5 MHz > 43 dB @ ±10 MHz

3GPP Not Complete

- 15 -

-35-15×(△f-2.5)dBc

-35-1×(△f-3.5)dBc

-35-10×(△f-7.5)dBc

30 kHz

1 MHz

1 MHz -49dBc 8.5 ~ 12.5 MHz

LGE Internal Use Only

2. PERFORMANCE

GD900 service manual

p

(

p

y

2.4.5 HSDPA Receiver Spec..

Receive Frequency

Maximum Input Level

(BLER or R), 16QAM Only

S

ecificationItem

925 MHz ~ 960 MHz 2110 MHz ~2170 MHz

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0 BLER < 10% or R >= 700kbps

2.4.6 WLAN 802.11g Transmitter and Receiver Spec.

Specification Item

2400 MHz ~ 2483.5 MHz ( CH1~CH13 ) Transmit Frequency

Tx Power Level

Frequency Tolerance

To le r an ce

Spectrum Mask

≤ 20dBm under (Europe), ≤ 30dBm under (USA)

within ±25 PPM

within ±25 PPM Chip clock Frequency

≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz) ≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz) ≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)

(rms EVM)

Spurious Emissions

Rx Min input Sensitivity

Rx Max in

Rx Adjacent Channel Rejection

ut Sensitivit

≤ -5dB Transmitter constellation error

< -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz

PER ≤ 10%

-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps

-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps

-66dBm@48Mbps, -65dBm@54Mbps

≥ -20dBm

PER ≤ 10%,

ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps

※ACR shall be measured by setting the desired signal's strength 3 dB above the rate-dependent sensitivity specified in min input sensitivity

6,9,12,18,24,36,48,54Mbps)@ PER ≤ 10%

- 16 -

Only for training and service purposes

3. BB Circuit Technical brief

GD900 service manual

＋

3.1 Functional Block Diagram

BT

FM Radio

Filter

FilterFilter

RF

GSM850/900/1800/1900

EDGE

FEM

Duplex

WCDMA

UMTS 900/2100

EDGE

PAM

UMTS

PAM

Transceiver

Proximity

PMB6952

MOTOR

Sensor

USIM

26M

FM Radio

UART1

32K

UART1

32K

KEYPAD I/F

VIB_DRV_N

USIM I/F

32K

+

WiFi

SDRAM_ DATA

EBU_ ADDR

MP-EH

XMM6070

PMIC

PMB6821

SDIO

I2S

MMIC

NAND

NAND DATA

DATA

MIC

RCV

Audio Out

UART0

MIC

USB

I/F

I2C

FM Audio

DATA(00:15)

ADDR

Main MI C

FM Audio

Touch

Screen

MicroSD

16bit

Touch Key

moviNAND

Analog

WM8959

Speaker AMP

I2C

Headset AMP

Slide

3. BB Circuit Technical brief

Flash

LED

SDC0CLK

SDC0CLK SDC0CMD

SDC0CMD SDC0DQO

SDC0DQO SDC0DQ1

SDC0DQ1 SDC0DQ2

SDC0DQ2 SDC0DQ3

SDC0DQ3

DQ[15:0]

DQ[15:0] AD[22:0]

AD[22:0] CSb

CSb OEb

OEb WEb

NAND

Flash

Flash 2Gbit

2Gbit

SDRAM

1Gbit

1GB

WEb INTb

INTb MR

MR WAITb

WAITb

TxCLK

TxCLK TxLR

TxLR TxD

TxD RxD

RxD

I2S

3-Axis

Sensor

I2C

GPIO

2.0HS

2.0 HS

A259

USB

MUIC2

GPIO

RCV/SPK

SDIO

I2S

12M

32K

SW

AMP

SW

CAMERA 8MP

( MIPI )

MIPI CLK+

MIPI CLK+ MIPI CLK-

MIPI CLKMIPI DATA+

MIPI DATA+ MIPI DATA-

MIPI DATAVIPCLKO

VIPCLKO

MIPI

GPIO

Connector

Micro USB

Connector

Micro USB

VIP

LCD

I2C

Sub

PMIC

VIP0DATA0

VIP0DATA0 VIP0DATA1

VIP0DATA1 VIP0DATA2

VIP0DATA2 VIP0DATA5

VIP0DATA5

LCDD[23:0]

LCDD[23:0] CMD

CMD CS

CS WE/RE

WE/RE E/RW

E/RW

[PWDN]

[PWDN] [RESET]

[RESET] [STROBE –

[STROBE – CONTROL]

CONTROL]

SCL

SCL SDA

SDA

VGA

Sub PMIC

BD6088

Photo

Sensor

Ear-Mic

USB

UART

TV Out

ALC

I2C

I2C AMD

AMD

LDO

I2C

I2C AMD

AMD

I2C

I2C AMD

AMD

[Figure 3.1-1] Functional Block Diagram

- 17 -

LGE Internal Use Only

3. BB Circuit Technical brief

GD900 service manual

3.2 Baseband Processor Introduction

[Figure 3.2-1] Top level block diagram of S-GOLD®3H(PMB8878)

- 18 -

Only for training and service purposes

3. BB Circuit Technical brief

GD900 service manual

3.2.1 General description

S-GOLD®3H is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a

mixed signal baseband IC combined with a 3G coprocessor IC, providing all analog and digital

functionality for a dual mode mobile phone in a single chip. Both ICs building up the S-GOLD®3H SiP are manufactured in infineon Technologies` 1.35V 90nm

CMOS technology to meet the ever increasing demands of the market for feature rich and high

performance terminals at low costs.

The chip will support the FR, EFR, HR and AMR-NB vocoding. S-GOLD®3H support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data

application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external

hardware.

3.2.2. Block Description

z Processing core

- ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,

and the Jazelle Java extension for Java acceleration and a MOVE co-processor to accelerate

Motion Estimation algorithms with based video encoding schemes..

- TEAKLite DSP core

z ARM9-Memory

- 32k Byte Boot ROM on the AHB

- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 32k Byte Instruction Cache

- 32k Byte Data Cache

- 8k Byte Instruction Tightly coupled Memory (I-TCM)

- 8k Byte Data tightly coupled memory (D-TCM)

z TEAKLite®-Memory

- 120k x 16bit Program ROM

- 8k x 16bit Program RAM

- 72k x 16bit Data ROM

- 48k x 16bit Data XRAM

- 5k x 16bit Data YRAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

- 19 -

LGE Internal Use Only

3. BB Circuit Technical brief

GD900 service manual

z Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite®.

z Controller Bus system

The processor cores and their peripherals are connected by powerful buses.

- Multi-layer AHB for connecting the ARM and the other master capable building blocks with the

internal and external memories and with the peripheral buses.

- An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.

- A controller FPI bus for connecting the low performance controller peripherals such as keypad

etc. called hereafter fPI2 bus.

- FPI2 and FPI3 are connected asynchronously to the AHB buses. 1 DMA controller with

8channels offloads the controller from data transfers.

- 2 AHB Lite buses for connecting multi-media and high performance peripherals, called

AHB_PER1 and AHB_PER2 hereafter. These peripheral buses are connected to the multi-layer

AHB ‘backbone’ by asynchronous, burst capable AHB2AHB bridges which are shared between

accessing masters.

- The DMA controller is enabled to access AHB_PER1 by use of its first master interface and

AHB_PER2 by its second master interface.

z TEAKLite® Bus System

- 1 TEAKLite® data bus for connecting the TEAKLite® data memory and the TEAKLite® peripherals.

Also the data bus is connected into the controller system via shared RAMs to the FPI3 bus.

- 1 TEAKLite® program bus for connecting the TEAKLite® program memory to the TEAKLite®.

z Clock system

The clock system allows widely independent selection of frequencies for the essential parts of the S-

GOLD®3H. Thus power consumption and performance can be optimized for each application.

z Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms

(H.263, MPEG-4)

- Programmable PLL with four additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- 20 -

Only for training and service purposes

3. BB Circuit Technical brief

GD900 service manual

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

· GMSK Modulator: gauss-filter with B*T=0.3

· EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- f8 and f9 Cipher unit

- Advanced static and dynamic power management features including TDMA-Frame

synchronous low-power mode and enhanced CPU modes(idle and sleep modes)

- 2D engine for support of image processing and 2D graphics applications. The 2D engine is tightly

coupled to the display interface. The resulting building block consisting of 2D engine and Display

interface is called Display Content Controller (DCC)

- Security crypto box supporting

· AES, DES, 3 DES

· Hash function

· RSA acceleration

· Secret Root Key (e-fuse) and Key Management

· True Random Number Generator

- Sample Rate Converter (SRC) for audio up-sampling

- Comprehensive static and dynamic Power Management

· Various frequency options during operation mode

· 32 kHz clock in standby mode

· Sleep control in standby mode

· RAMs and ROMs in power save mode during standby mode

· Additional leakage current reduction in standby mode possible by switching off for the

TEAKLitre® subsystem.

- Extensive debug support for the controller and the DSP system

· OCDS level 2+ (run control, non-intrusive program flow trace and limited data flow

trace) for ARM

· OCDS level 1+ (run control, limited program flow trace) for the TEAKLite®

· Multi-core debug support

· 4 Monitor pins for important internal signals and most pad signals

· Cerberus debugging unit

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LGE Internal Use Only

3. BB Circuit Technical brief

GD900 service manual

- 2 General Purpose Timers with 3 32-bit timers

- Serial number

- A real time clock with alarm functions

- 2 capture/compare units with 16 channels. One channel active during sleep mode.

z 3G Coprocessor Subsystem

- ARM7 TRMI-S

· 240 kByte Instruction RAM

· 64 kByte Data RAM

· 8 kByte Boot ROM

- 20kByte Communication RAM

- HW accelerators for

· Transmit Path

· Inner and Outer Receiver for Release5 incl. HSDPA

3.2.3. RF Interface(T_OUT)

S-Gold® 3H uses this interface to control RF IC and Peripherals.

[Table 3.2.3-1] RF Interface Spec.

T_OUT Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 -

T_OUT2 ANT_SEL1

T_OUT3 2G_ANT_SELECT

T_OUT4 CHG_EOC

T_OUT5 SLIDE_OPEN Slide detect

T_OUT6 PA_MODE PAM Mode select

T_OUT7 ANT_SEL2

T_OUT8 ANT_SEL3

T_OUT9 LED_ON Proximity sensor LED ON

T_OUT10

T_IN0 WLAN_RESET_N

T_IN1 REG_ON

- 22 -

Only for training and service purposes

GD900 service manual

3.2.4. ADC channel

3. BB Circuit Technical brief

ADC block is composed of 11 external ADC channel. This block operates charging process and other

related process by reading battery voltage and other analog values.

[Table 3.2.4-1] S-Gold3 ADC channel usage

ADC channel Resource Interconnection Description

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 N.C

M3 N.C

M4 SENSOR_ADC Proximity measure

M5 N.C

M6 N.C

M7 N.C

M8 VBAT Battery supply voltage measure

M9 N.C

M10 N.C

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LGE Internal Use Only

3. BB Circuit Technical brief

GD900 service manual

3.2.5. GPIO map

Over a hundred allowable resources, GD900 is using as follows except dedicated to SIM and Memory.

GD900 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,

is shown in below table

[Table 3.2.5-1] S-Gold®3H GPIO pin Map

Port Function Net Name Description KEY MATRIX

KP_IN0 KP_IN1 KP_IN2 KP_IN3 KP_IN4 KP_IN5 KP_IN6 KP_OUT0 KP_OUT1 KP_OUT2 KP_OUT3

USIF1

USIF1_RXD_MRST USIF1_TXD_MTSR USIF1_RTS_N USIF1_CTS_N

USIF2

USIF2 _RXD_MRST USIF2 _TXD_MTSR USIF2_RTS_N USIF2_CTS_N

USIF3

USIF3 _RXD_MRST USIF3 _TXD_MTSR USIF3_SCLK

CLK

CLK32K

CAMERA I/F

KEYIN(0)

KEYIN(1)

KEYIN(2)

SLIDE_CLOSE

LED_CONTROL

MAIN_VOICE_REC_SW

AMD_INT

KEYOUT(0)

KEYOUT(1)

TV_OUT_ON

MAIN_VOICE_MIDI_SW

UART_RX UART Data

UART_TX UART Data

USB_ DAT_VP USB Data

USB_SE0_VM USB Data

MMP_WAIT

RPWRON

BT_UART_RTS Bluetooth RTS

BT_UART_CTS Bluetooth CTS

BT_UART_RX

BT_UART_TX

LIN_INVERTER

CLK32k For FM Radio, BT CLK32K

- 24 -

Only for training and service purposes

3. BB Circuit Technical brief

GD900 service manual

CIF_D0 CIF_D1 CIF_D2 CIF_D3 CIF_D4 CIF_D5 CIF_D6 CIF_D7 CIF_PCLK CIF_HSYNC CIF_VSYNC CLKOUT2 CIF_PD CIF_RESET

LCD I/F Display interface

DIF_D0 DIF_D1 DIF_D2 DIF_D3 DIF_D4 DIF_D5 DIF_D6 DIF_D7 DIF_D8 DIF_DS1 DIF_DS2 DIF_CD DIF_WR DIF_RD DIF_HD DIF_VD DIF_RESET1 DIF_RESET2

I2C

I2C1_SCL I2C1_SDA PM_INT (EINT) I2C2_SCL

MM_AD0

MM_AD1

MM_AD2

MM_AD3

MM_AD4

MM_AD5

MM_AD6

MM_AD7

NA

USB_SELECT

WL_WAKE

NA

_CHG_EN Charging enable

LIN_PWM_FREQ Linear motor frequency

MM_AD8

MM_AD9

MM_AD10

MM_AD11

MM_AD12

MM_AD13

MM_AD14

MM_AD15

DSR

MMP_CS1_N

WLAN_HOST_WAKEUP

MM_A16

MMP_WR_N

MMP_RD

NA

MMP_RESET_N

MMP_INT

A_RESET

SCL For PMIC

SDA For PMIC

PM_INT For PMIC

I2C2_SCL

- 25 -

LGE Internal Use Only

3. BB Circuit Technical brief

GD900 service manual

I2C2_SDA

SIM I/F

CC_IO CC_CLK CC_RST

I2S2

I2S2_CLK0 I2S2_CLK1 I2S2_RX I2S2_TX I2S2_WA0

External Memory

MMCI1_CMD MMCI1_DAT[0] MMCI1_CLK MMCI1_DAT[1] MMCI1_DAT[2] MMCI1_DAT[3] MMCI2_CMD MMCI2_DAT[0] MMCI2_CLK

IrDA

I2C2_SDA

SIM_IO SIM CARD DATA

SIM_CLK SIM CARD CLOCK

SIM_RST SIM CARD RESET

TOUCH_INT_KEY

EN_BAR

LIN_PWM_MAG

BT_HOST_WAKEUP

TOUCH_INT_MAIN

WLAN_CMD

WLAN_SDIO[0]

WLAN_CLK

WLAN_SDIO[1]

WLAN_SDIO[2]

WLAN_SDIO[3]

USW_INT

TOUCH_LDO_EN

LIN_MOTOR_EN Vibrator enable

IRDA_TX

IRDA_RX

I2S1

I2S1_CLK0 I2S1_CLK1 I2S1_RX I2S1_TX

I2S1_WA0

Audio I/F

EPN1 EPP1 EPPA1 EPREF EPPA2 MICN1

USB_OEn For USB

HP_AMP_SHDN

BT_PCM_CLK For Bluetooth

N.A

BT_PCM_IN For Bluetooth

BT_PCM_OUT For Bluetooth

BT_PCM_SYNC For Bluetooth

RCV_N For Receiver

RCV_P For Receiver

EAR_SPK_P For Headset

NA Reference

EAR_SPK_N For Headset

MAIN_MIC_N For Main Mic

- 26 -

Only for training and service purposes

3. BB Circuit Technical brief

GD900 service manual

MICP1 MICN2 MICP2 VMICP VMICN

ADC

M0 M1 M2 ,M6,M9,M10 M3 M4 M5 M7 M8

Reference

VREFP IREF

JTAG I/F

JTAG0_TDO JTAG0_TDI JTAG0_TMS JTAG0_TCK JTAG0_TRST_N JTAG0_RTCK JTAG1_TDO JTAG1_TDI JTAG1_TMS JTAG1_RTCK RST_N

ETM I/F

TRIG_IN MON1 MON2 TRACESYNC TRACECLK PIPESTAT[2] PIPESTAT[1] PIPESTAT[0]

MAIN_MIC_P For Main Mic

HS_MIC_N For Headset Mic

HS_MIC_P For Headset Mic

VMIC_P Power for MIC

GND Ground for MIC

BAT_ID Battery temperature measure

RF_TEMP RF block temperature measure

N.A

SENSOR_ADC

N.A

VBAT

VREFN

GND with resistor 22K(1%)

NA NA NA NA NA NA NA NA NA NA

A_RESTET

TRIG_IN

2V62_VIO ETM

GND ETM

NA NA NA NA NA

- 27 -

LGE Internal Use Only

3. BB Circuit Technical brief

GD900 service manual

TRACEPKT[0] TRACEPKT[1] TRACEPKT[2] TRACEPKT[3] TRACEPKT[4] TRACEPKT[5] TRACEPKT[6] TRACEPKT[7]

Memory

MEM_AD[0] MEM _AD[1] MEM _AD[2] MEM _AD[3] MEM _AD[4] MEM _AD[5] MEM _AD[6] MEM _AD[7] MEM _AD[8] MEM _AD[9] MEM _AD[10] MEM _AD[11] MEM _AD[12] MEM _AD[13] MEM _AD[14] MEM _AD[15] MEM _WR_n MEM _RD_n MEM _BC0_n MEM _BC1_n MEM _BC2_n MEM _BC3_n MEM _A[0] MEM _A[1] MEM _A[2] MEM _A[3] MEM _A[4] MEM _A[5] MEM _A[6]

NA NA NA NA NA NA NA NA

DATA(0)

DATA(1)

DATA(2)

DATA(3)

DATA(4)

DATA(5)

DATA(6)

DATA(7)

DATA(8)

DATA(9)

DATA(10)

DATA(11)

DATA(12)

DATA(13)

DATA(14)

DATA(15)

_WR

_RD

_BC0

_BC1

LDQS

UDQS

ADD(0)

ADD(1)

ADD(2)

ADD(3)

ADD(4)

ADD(5)

ADD(6)

- 28 -

Only for training and service purposes

3. BB Circuit Technical brief

GD900 service manual

MEM _A[7] MEM _A[8] MEM _A[9] MEM _A[10] MEM _A[11] MEM _A[12] MEM _A[13] MEM _A[14] MEM _A[15] MEM _A[16] MEM _A[17] MEM _A[18] MEM _A[19] MEM _A[20] MEM _A[21] MEM _A[22] MEM _A[23] MEM _A[24] MEM _A[25] MEM _A[26] MDM_CSA0_N MDM_ CSA1_N MDM_ CSA2_N MDM_CSA3_N MEM _CS0_n MEM _CS1_n MEM _CS2_n MEM _CS3_n MEM _ADV_n MEM _RAS_n MEM _CAS_n MEM _WAIT_n MEM _SDCLK0 MEM _BFCLK01 MEM _BFCLK02 MEM _CKE

Memory

FCDP_RBn

ADD(7)

ADD(8)

ADD(9)

ADD(10)

ADD(11)

ADD(12)

ADD(13)

ADD(14)

ADD(15)

ADD(16)

ADD(17)

ADD(18)

ADD(19)

ADD(20)

ADD(21)

ADD(22)

ADD(23)

ADD(24)

ADD(25)

ADD(26)

ADD(27)

ADD(28)

ADD(29)

BA0

_NAND_CS INTEL NOR (64MB)

_RAM_CS INTEL SDRAM (64MB)

TP

_CS3

BA1

_RAS

_CAS

_WAIT

SDCLKO For Burst mode

BFCLKO For Burst mode

SDCLK1 For Burst mode

CKE

FCDP

- 29 -

LGE Internal Use Only

3. BB Circuit Technical brief

GD900 service manual

GPIO_60

TDMA I/F

T_OUT0 T_OUT1 T_OUT2 T_OUT3 T_OUT4 T_OUT5 T_OUT6 T_OUT7 T_OUT8 T_OUT9 T_OUT10

RF I/F

RF_STR0 RF_STR1 RF_DATA RF_CLK GPIO[7] GPIO[10] GPIO[15] GPIO[16] GPIO[17] GPIO[18]]

System Port

AFC CLKOUT0 [<=26MHz] F26M F32K OSC32K RESET_n RTC_OUT SPUC_RQ_IN2

DSP

DSPIN0 DSPOUT1

_WP

TXON_PA PAM

NA

ANT_SEL1

NA

_CHG_EOC Charging terminate signal

SLIDE_OPEN Slide detect

PA_MODE PAM

ANT_SEL2

ANT_SEL3

LED_ON

NA

2G_EN

_PPR Charger detect

2G_DATA

2G_CLK

3G_LD

3G_MASTER_ON

3G_PA_MODE1

ANT_SEL4

ANT_SEL5

ANT_SEL6

AFC

CLK26M

26MHZ 26M Main Clock

32.768KHZ to 32k crystal

_RESET

RTC_OUT

PM_VCXO_EN

CLK32K

WDOG

DSPIN1

BT_WAKEUP

- 30 -

Only for training and service purposes

3. BB Circuit Technical brief

GD900 service manual

3.3. Power management IC

3.3.1. General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has

been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon

SGOLD

baseband device it is suitable for the S-GOLD lite and the E-GOLD+ baseband devices as well.

It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the

Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all

power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone

minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and

memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

• Backlight LEDs driver with current selection and PWM dimming function

• Two single LED driver outputs for signaling

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C - Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

• System debug mode

- 31 -

LGE Internal Use Only

LG GD900 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual