LG GD570 Service Manual

Service Manual Model : GD570

Internal Use Only

Service Manual

GD570

Date: June, 2010 / Issue 1.0

Table Of Contents

1. INTRODUCTION ..................................................................5

1.1 Purpose ............................................................................................... 5

1.2 Regulatory Information ............................................................... 5

1.3 Abbreviations ................................................................................... 7

2. PERFORMANCE ...................................................................9

2.1 Product Name .................................................................................. 9

2.2 Supporting Standard .................................................................... 9

2.3 Main Parts : GSM Solution ........................................................... 9

2.4 HW Features ....................................................................................10

2.5 SW Features ....................................................................................12

2.6 HW SPEC. .........................................................................................14

2.7 GD570 Figures ...............................................................................19

3. TECHNICAL BRIEF .............................................................20

3.1 GENERAL DESCRIPTION .............................................................20

3.2 GSM MODE ......................................................................................22

3.3 UMTS MODE ...................................................................................25

3.4 GPS MODE .......................................................................................28

3.5 LO GENERATION and DISTRIBUTION CIRCUIT ...................28

3.6 OFF-CHIP RF COMPONENTS ....................................................29

3.7 Digital Baseband(DBB/MSM6290) .........................................36

3.8 Hardware Architecture ...............................................................37

3.9 Subsystem(MSM6290) ................................................................39

3.10 Power Block ..................................................................................42

3.11 External memory interface ....................................................47

3.12 H/W Sub System .........................................................................50

3.13 Audio and sound ........................................................................58

3.14 Camera Interface ........................................................................65

3.15 Motion Sensor .............................................................................71

3.16 LG GD570 Main Features.........................................................72

3.17 Main Component .......................................................................73

4.5 Checking WCDMA Block ............................................................87

4.6 Checking GSM Block ................................................................ 100

4.7 Checking Bluetooth Block ..................................................... 109

4.8 Checking GPS Block ..................................................................112

4.9 Power ON Troubleshooting ...................................................114

4.10 Charger Troubleshooting .................................................... 116

4.11 USB Troubleshooting ............................................................. 119

4.12Audio trouble ............................................................................ 122

4. 13 3M Camera trouble shooting ............................................138

4.14 LCD trouble shooting ............................................................ 140

4.15 SIM Detect Troubleshooting ..............................................143

4.16 Keypad Backlight Troubleshooting .................................145

4.17 Coin type DC coreless MOTOR ........................................... 147

4.18 Motion Sensor on/oﬀ trouble ............................................149

5. DOWNLOAD ................................................................... 151

6. BLOCK DIAGRAM ........................................................... 164

7. CIRCUIT DIAGRAM ........................................................ 167

8. BGA Pin Map .................................................................. 177

9. PCB LAYOUT ................................................................... 183

10. RF CALIBRATION ......................................................... 191

10.1 Conﬁguration of Tachyon .................................................... 191

10.2 How to use Tachyon ............................................................... 193

11. EXPLODED VIEW & REPLACEMENT

PART LIST .................................................................... 195

13.1 EXPLODED VIEW ......................................................................195

13.2 Replacement Parts..................................................................197

13.3 Accessory ...................................................................................223

4. TROUBLE SHOOTING .......................................................78

4.1 RF Component...............................................................................78

4.2 SIGNAL PATH ..................................................................................80

4.3 Checking TCXO Block ..................................................................83

4.4 Checking Front End Module (FEM) Block ...........................85

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LGE Internal Use Only

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Only for training and service purposes

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

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LGE Internal Use Only

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated

by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat

which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective

package as described.

2. INTRODUCTION

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Only for training and service purposes

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

Offset Phase Locked LoopOPLL

Light Emitting DiodeLED

Low Drop OutputLDO

Liquid Crystal DisplayLCD

Intermediate FrequencyIF

International Portable User IdentityIPUI

Global System for Mobile CommunicationsGSM

General Purpose Interface BusGPIB

Gaussian Minimum Shift KeyingGMSK

Flexible Printed Circuit BoardFPCB

Electrostatic DischargeESD

Electrical Erasable Programmable Read-Only MemoryEEPROM

Digital Signal ProcessingDSP

dB relative to 1 milli wattdBm

Digital Communication SystemDCS

Digital to Analog ConverterDAC

Constant Current – Constant VoltageCC-CV

Bit Error RatioBER

BasebandBB

Automatic Power ControlAPC

1. INTRODUCTION

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LGE Internal Use Only

1. INTRODUCTION

Wireless Application Protocol

WAP

Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

Voltage Controlled OscillatorVCO

Universal Asynchronous Receiver/TransmitterUART

Time Division Multiple AccessTDMA

Time Division DuplexTDD

Travel AdapterTA

Side Tone Masking RatingSTMR

Pseudo SRAMPSRAM

Static Random Access MemorySRAM

Sending Loudness RatingSLR

Subscriber Identity ModuleSIM

Surface Acoustic WaveSAW

Real Time ClockRTC

Root Mean SquareRMS

Receiving Loudness RatingRLR

Radio FrequencyRF

Public Switched Telephone NetworkPSTN

Phase Locked LoopPLL

Programmable Gain AmplifierPGA

Printed Circuit BoardPCB

Power Amplifier ModulePAM

1. INTRODUCTION

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Only for training and service purposes

2. PERFORMANCE

2.1 Product Name

GD570 : WCDMA1700/2100+GSM850/EGSM/DCS/PCS

(HSDPA 7.2Mbps / GPRS Class 10 / EDGE Class 10)

2.2 Supporting Standard

Item Feature Comment

Supporting Standard WCDMA(FDD1,4)/EGSM/GSM850/DCS1800/PCS1900 with

seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, C

Frequency Range WCDMA(FDD1) TX : 1920 – 1980 MHz

WCDMA(FDD1) RX : 2100 – 2170 MHz WCDMA(FDD4) TX : 1710 – 1755 MHz WCDMA(FDD4) RX : 2110 – 2155 MHz GSM850 TX : 824 – 849 MHz GSM850 RX : 869 – 894 MHz EGSM TX : 880 – 915 MHz EGSM RX : 925 – 960 MHz DCS1800 TX : 1710 – 1785 MHz DCS1800 RX : 1805 – 1880 MHz PCS1900 TX : 1850 – 1910 MHz PCS1900 RX : 1930 – 1990 MHz

Application Standard WAP 2.0, JAVA MIDP V2.1

2.3 Main Parts : GSM Solution

Item Part Name Comment

Digital Baseband MSM6290 : Qualcomm Analog Baseband PM6658 : Qualcomm RF Chip RTR6285 : Qualcomm

2. PERFORMANCE

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LGE Internal Use Only

2. PERFORMANCE

2.4 HW Features

Item Feature Comment

Form Factor Folder type

1) Capacity Standard : Li-Ion, 900mAh

Battery

2) Packing Type : Soft Pack

Size Standard :

108.4 x 51.5 x 14.4mm

Weight 3.49 oz With Battery Volume 80.39cc PCB All Layer (10) , 0.8T Stand by time 2G Over 400 hrs

3G Up to 340 hrs

@ Paging Period 5 (2G)

@ DRX 7 (3G) Charging time 2.5 hrs @ Power Off / 550mA Talk time 2G Up to 320mins

3G Up to 270 mins

@ Power Level 1 (2G/PCS)

@ Tx = 12dBm (3G) RX sensitivity WCDMA(FDD1) : -106.7 dBm

WCDMA(FDD4) : -106.7 dBm EGSM : -105 dBm GSM850 : -105 dBm DCS 1800 : -105 dBm

PCS 1900 : -105 dBm WCDMA/ GSM/ GPRS

WCDMA : 24dBm/3.84MHz,+1/-3dBm

EGSM : 33dBm

GSM850 : 33 dBm

DCS 1800 : 30 dBm

PCS 1900 : 30 dBm

Class3(WCDMA) Class4 (EGSM) Class4 (GSM850) Class1 (PCS) Class1 (DCS)

TX output power

EDGE EGSM : 27 dBm

GSM 850 : 27 dBm

DCS 1800 : 26 dBm

PCS 1900 : 26 dBm

E2 (EGSM) E2 (GSM850) E2 (PCS)

E2 (DCS) GPRS compatibility GPRS Class 10 EDGE compatibility EDGE Class 10 SIM card type Plug-In SIM

3V /1.8V

Display Main LCD

TFT Main LCD(2.8’, 240 x 400)

Built-in Camera 2M CMOS Fixed Focus Camera Status Indicator Yes

Keypad Function Key : 24

Side Key : 3

Function Key: Call, Back, End,

Soft left/right, Voicemail,

Alphanumeric, Multitasking key,

#, *

Side Key : CAM, Multi, Volume up

/down

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Only for training and service purposes

2. PERFORMANCE

Item Feature Comment

ANT Main : Internal Fixed Type

BT : Internal Chip Type

GPS : Internal Fpcb Type System connector 5 Pin Ear Phone Jack 5 Pin PC synchronization No Memory NAND Flash : 2Gbit

SDRAM : 1Gbit Speech coding FR, EFR, HR,AMR Data & Fax Built in Data & Fax Not support Vibrator Built in Vibrator BlueTooth V2.1+ EDR MIDI(for Buzzer

Function)

SW Decoded 72Poly

Music Player MP3/AAC/AAC+ Video Player MPEG4, H.263, H.264

Camcorder MPEG4, H.263

Voice Recording Yes Speaker Phone mode Support

Yes

Travel Adapter Yes Cableless CDROM No No in Box Stereo Headset Yes Data Cable Yes T-Flash (External Memory)

No No in Box

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LGE Internal Use Only

2. PERFORMANCE

2.5 SW Features

Item Feature Comment

RSSI 0 ~ 7 Levels Battery Charging 0 ~ 3 Levels Key Volume 0 ~ 7 Levels

Audio Volume 1 ~ 7 Levels Time / Date Display Yes Multi-Language Yes English/Spanish/French Quick Access Mode Dialing / Contact / Web2go / Menu /

Faves/ Message / Camera /Call history

Hot Key & 5-Way Navi Key

Speed Dial Yes (1~9) Voice mail center -> 1 key CLIP / CLIR Yes

Phone Book Picture + Name + 5 Numbers + 3 E-

mails + 3 Messengers + 4 Group Select + Web Address + Company + Address + Ringtone + Birthday + Anniversary day + 1 Memo + External Display + Secret Lighting

Total 1000 Member

Last Dial Number Yes Total Call DB Max 100

LDN (SIM) N/A Last Received Number

Yes Total Call DB Max 100

LDN (SIM) N/A Last Missed Number Yes Total Call DB Max 100

LDN (SIM) N/A Search by Name Name, Number and E-Mail Group 30 Fixed Dial Number Yes Service Dial Number Yes Own Number Yes Voice Memo Yes Call Reminder Yes Minute Minder Network Selection Automatic Mute Yes Call Divert Yes Call Barring No Call Charge (AoC) No Call Duration Yes SMS / EMS 500 EMS : Release4

(Except Text align) SMS Over GPRS Yes EMS Melody / Picture Send / Receive / Save

Receive only MMS MPEG4 Send / Receive / Save

Yes

Yes Long Message MAX 1736 Characters SMS 12 pages (Sending)

Cell Broadcast No Download Over the WAP

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Only for training and service purposes

2. PERFORMANCE

Item Feature Comment

Game Yes Calendar Yes Memo Yes Max 30 Task Yes Max 100 World Clock Yes Unit Convert Currency/Area/Length/Weight/Tempe

rature/ Volume/Velocity Tip Calculator Yes Stop Watch Yes Wall Paper Yes WAP Browser Over WAP 2.0 Obigo Download Melody / Wallpaper

Yes Over WAP

SIM Lock Yes Operator Dependent SIM Toolkit Class 1, 2, 3, C MMS Yes EONS Yes CPHS Yes Compliant with TMUS Spec. ENS No Camera Yes 3M / Digital Zoom : x2 / Multi-Shot JAVA Yes CLDC V1.1 / MIDP V2.1

Download Over WAP Voice Dial No IrDa No Bluetooth Yes V2.1 + EDR, HSP, HFP, OPP, OBEX,

BPP, PBAP, A2DP, AVRCP, FTP

(Server) FM radio No

GPRS Yes Class 10 EDGE Yes Class 10 Hold / Retrieve Yes Conference Call Yes Max 6 (Including owner) DTMF Yes Memo Pad Yes TTY Yes No in box (mode support) AMR Yes SyncML Yes IM Yes

Email Yes Native Client

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LGE Internal Use Only

2. PERFORMANCE

2.6 HW SPEC.

1) GSM transceiver specification

Item Specification

Phase Error

Rms : 5° Peak : 20 °

Frequency Error

GSM : 0.1 ppm DCS/PCS : 0.1 ppm

EMC(Radiated Spurious Emission Disturbance)

GSM/DCS : < -28dBm

ransmitter Output power and Burst

Timing

GSM : 5dBm – 33dBm ± 3dB

DCS/PCS : 0dBm – 30dBm ± 3dB Burst Timing <3.69us Spectrum due to modulation out to

less than 1800kHz offset

200kHz : -36dBm

600kHz : -51dBm/-56dBm

Spectrum due to modulation out to larger than 1800kHz offset to the edge of the transmit band

GSM850

1800-3000kHz :< -63dBc(-46dBm)

3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

PCS :

1800-3000kHz :< -65dBc(-51dBm)

6000kHz < : < -73dBc(-51dBm)

Spectrum due to switching transient

400kHz : -19dBm/-22dBm(5/0), -23dBm

600kHz : -21dBm/-24dBm(5/0), -26dBm Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%) Usable receiver input level range 0.012(-15 - -40dBm) Intermodulation rejection – Speech

channels

± 800kHz, ± 1600kHz

: -98dBm/-96dBm (2.439%)

AM Suppression

T GSM : -31dBm

- DCS : -29dBm

-98dBm/-96dBm (2.439%)

Timing Advance ± 0.5T

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Only for training and service purposes

2) WCDMA transmitter specification

Item Specification

Transmit Frequency Band1 : 1920 – 1980 MHz

Band4 : 1710 – 1755 MHz

Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error within ±0.1 PPM Open Loop Power Control Normal Conditions : within ±9 dB,

Extreme Conditions : within ±12 dB

Minimum Transmit Power < -50 dBm /3.84 MHz

Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power) Adjacent Channel Leakage

Power Ratio (ACLR)

> 33 dB @ ±5 MHz, > 43 dB @ ±10 MHz

Spurious Emissions |f-fc| > 12.5 MHz

< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz < -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz < -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz < -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz < -60 dBm / 3.84 MHz RW @ 869 MHz ≤ f ≤ 894 MHz < -60 dBm / 3.84 MHz RW @ 1930 MHz ≤ f ≤ 1900 MHz < -60 dBm / 3.84 MHz RW @ 2110 MHz ≤ f ≤ 2155 MHz < -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz < -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz < -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz < -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz

Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

when Interference CW Signal Level = -40 dBm Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm Peak Code Domain Error

< -15 dB at Pout t -20 dBm

2. PERFORMANCE

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LGE Internal Use Only

2. PERFORMANCE

3) WCDMA receiver specification

Item Specification

Receive Frequency Band1 : 2100 – 2170 MHz

Band4 : 2100 – 2155 MHz

Reference Sensitivity Level Band1 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz

Band4 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz Adjacent Channel Selectivity

(ACS)

ACS > 33 dB where BER < 0.001 when

Îor = -92.7 dBm / 3.84 MHz

& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz Blocking Characteristic BER < 0.001 when Îor = -104.7 dBm / 3.84 MHz

& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz

or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz Spurious Response BER < 0.001 when Îor = -104.7 dBm / 3.84 MHz

& Iblocking = -44 dBm Intermodulation BER < 0.001 when Îor= -104.7 dBm / 3.84 MHz

& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz

& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz

Inner Loop Power Control In Uplink

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24

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Only for training and service purposes

4) HSDPA transmitter specification

Item Specification

Transmit Frequency Band1 : 1920 – 1980 MHz

Band4 : 1710 – 1755 MHz

Maximum Output Power Sub-Test

1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz

HS-DPCCH

Sub-test

in table

C.10.1.4

Power

step

Power step slot

boundary

Power

step size,

P [dB]

Transmitter power step

tolerance [dB]

1 Start of

Ack/Nack

6 +/- 2.3

2 Start of CQI 1 +/- 0.6

3 Middle of CQI 0 +/- 0.6

Spectrum Emission Mask

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Frequency offset

from carrier ୞f

Minimum requirement Measurement Bandwidth

2.5 ~ 3.5 MHz

-35-15×(୞f-2.5)dBc

30 kHz

3.5 ~ 7.5 MHz

-35-1×(୞f-3.5)dBc

1 MHz

7.5 ~ 8.5 MHz

-35-10×(୞f-7.5)dBc

1 MHz

8.5 ~ 12.5 MHz -49dBc 1 MHz

Adjacent Channel Leakage Power Ratio (ACLR)

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

> 33 dB @ ±5 MHz > 43 dB @ ±10 MHz

Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

2. PERFORMANCE

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LGE Internal Use Only

2. PERFORMANCE

5) HSDPA receiver specification

Item Specification

Receive Frequency

Band1 : 2100 – 2170 MHz

Band4 : 2100 – 2155 MHz Maximum Input Level

(BLER or R), 16QAM Only

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

BLER < 10% or R >= 700kbps

6) GPS receiver specification

Item

Specification

Receive Frequency 1574.42 MHz ~ 1576.42 MHz Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding

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Only for training and service purposes

2.7 GD570 Figures

2. PERFORMANCE

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LGE Internal Use Only

3. TECHNICAL BRIEF

TECHNICAL BRIEF

3.1 GENERAL DESCRIPTION

The GD570 supports UMTS-1700(Band IV), UMTS-2100(Band I), GSM-850, GSM-900, GSM-1800, and GSM1900 based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne

Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF up-conversion followed by an offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.

[Figure 1-1] Block diagram of RF part

GGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGG GGGG

QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.

2. RTR6285 and RF

Main_Ant

HB_RF_OUT2

HB_RF_OUT3

W2100

PAM

W(AWS)

DUPLEXER

W2100

DUPLEXER

Coupler

W(AWS)

PAM

WCDMA

TX SAW

WCDMA TX SAW

LB_RF_OUT2

TX_BIAS

I_IP_CH0 I_IM_CH0 Q_IP_CH0

PDET_IN

PRX_IP PRX_IN

PRX

DRX_IP DRX_IN

WPRXHBP WPRXHBN

WPRXLBP WPRXLBN

WPRXSE2_IN

DRX_QP DRX_QN

Q_IM_CH0

I_IP_CH1 I_IM_CH1 Q_IP_CH1 Q_IM_CH1

PRX_QN

FRONT

END

Rx SAW

LNA

RTR6285

TX_IP TX_IN

LB_RF_OUT1

GPS_IN

TX_QP

I_OUT I_OUT_N Q_OUT

Rx SAW

LNA

WDRXHB2

GPS_Ant

MODULE

G850/EGSM

PAM

GCELL_INP GCELL_INN

EGSM INP

HB_RF_OUT1

RF_ON

DAC_IREF

SBDT

TX_QN

SBST

TX_ON

DAC_REF

Q_OUT_N

GSM 850 RX SAW

DCS/PCS

PAM

EGSM_INN

DCS_INP DCS_INN

GPCS_INP GPCS INN

WPRXSE2_OUT

VDDA

UMTS

Rx SAW

WB_MX_INM

WB_MX_INP

GSM 900

RX SAW

DCS1800 RX SAW

PCS1900

MSM6290

RX SAW

3. TECHNICAL BRIEF

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Only for training and service purposes

3. TECHNICAL BRIEF

A generic, high-level functional block diagram of GD570 is shown in Figure 1-1. Two antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module). The UMTS receive paths each include an LNA, an RF bandpass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s RX analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM RX baseband outputs share the same inputs to the MSM IC.

For the transmit chains, the RTR6285 IC directly translates the TX baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The RTR6285 IC outputs deliver fairly high-level RF signals that are first filtered by TX SAWs and then amplified by their respective UMTS PAs. In the GSM receive path, the received RF signals are applied through their band-pass filters and downconverted directly to baseband in the RTR6285 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing. The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into phase and amplitude components to produce an open-loop Polar topology:

1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to a constant envelope phase signal at RF;

2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier from a DAC within the MSM

GD570 power supply voltages are managed and regulated by the PM6658 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.2 GSM MODE

3.2.1 GSM RECEIVER

The GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs of RTR6285 are connected directly to the transceiver front-end circuits (filters and antenna switch module). GSM-850, GSM-900, GSM-1800, and GSM1900 receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance as shown in Figure 1-2. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins

[Figure 1-2] GSM Receiver Inputs Topologies

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Only for training and service purposes

3. TECHNICAL BRIEF

Since GSM-850, GSM-900, GSM-1800, and GSM-1900 signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate RX and TX signals in place of frequency duplexers – this is accomplished in the switch module. The GSM-850, GSM-900, GSM-1800, and GSM-1900 receive signals are routed to the RTR6285 through band selection filters and matching networks that transform single-ended 50-Ωҏsources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RTR6285 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.

The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6290 IC for further processing as shown in Figure 1-5.

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.2 GSM TRANSMITTER

The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1) include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on pass-band symmetry about the band center frequency as shown in Figure 1-3.

[Figure 1-3] GSM Transmitter Outputs Topologies

The RTR6285 IC is able to support GSM 850/900 and GSM 1800/1900 mode transmitting. Both high-band and low band outputs are followed by resistive pads to ensure that the load presented to the outputs remains close to 50ohm.

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Only for training and service purposes

3. TECHNICAL BRIEF

3.3 UMTS MODE

3.3.1 UMTS RECEIVER

The AWS Band duplexer receiver output is routed to external LNA circuits and LNA circuits within the RTR6285 device. Signal path received from diversity antenna is routed to external LNA circuits and LNA circuits within the RTR6285 device as shown in Figure 1-4. External LNA circuits are used to improve RX performance. The UMTS primary RX input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential down converter as shown in Figure 1-5. This second stage input is configured differentially to optimize second-order inter-modulation and common mode rejection performance. The gain of the UMTS front end amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS RX amplifiers drive the RF ports of the quadrature RF-to-baseband down-converters. The down-converted UMTS RX baseband outputs are routed to low-pass filters having pass-band and stopband characteristics suitable for UMTS RX processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with GSM RX to the MSM IC. The UMTS baseband outputs are turned off when the RTR6285 is down-converting GSM signals and on when the UMTS is operating.

[Figure 1-4] UMTS Receiver Inputs Topologies

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.3.2 UMTS TRANSMITTER

The UMTS TX path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The upconverter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50Ω interface.

The RTR6285 UMTS output is routed to its power amplifier through a band pass filter, and delivers fairly highlevel signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6285 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator.

UMTS TX. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6285 IC design achieves this without allowing FVCO to equal FRF. The RTR6285 IC is able to support UMTS 2100/1900/1800/1700 and 850 mode transmitting. This design guideline shows only UMTS 1700 applications.

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3. TECHNICAL BRIEF

[Figure 1-5] RTR6285 IC Functional Block Diagram

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.4 GPS MODE

3.4.1 GPS RECEIVER

The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from the GPS antenna, through external LNA included in a band-pass filter and then an impedance transformer circuit that optimally matches the impedance looking into GPS LNA within the RTR6285 device. The impedance transformer circuit topology is shown in Figure 1-6.

[Figure 1-6] GPS Input Network Topology

3.5 LO GENERATION and DISTRIBUTION CIRCUIT

The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE, GPS and UMTS band up-converters and down-converters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF-tobaseband and from baseband-to-RF. Two fully functional fraction-N synthesizers, including VCOs and loop filters, are integrated within the RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS operation. The first synthesizer (PLL1) in the RTR6285 creates the transceiver Los that support the UMTS transmitter, and all four GSM band receivers and transmitters including: GSM850, GSM900, GSM1800, and GSM1900. The second synthesizer (PLL2) in the RTR6285 IC provides the LO for the UMTS primary receiver. For the RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The third synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip loop filter-series capacitors, which significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6285 ICs have the advantage of more flexible loop bandwidth control, fast lock time, and low-integrated phase error.

RTR6285

GPS_IN

LNA

SAW

mGnwzG



nwzG

suhGt

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Only for training and service purposes

3. TECHNICAL BRIEF

3.6 OFF-CHIP RF COMPONENTS

3.6.1 GPS LNA (U101: ALM-2712)

The ALM-2712 is an LNA module, with integrated filter, designed for GPS band applications at 1.575GHz. The LNA uses AVAGO Technologies’ proprietary GaAs Enhancement-mode pHEMT process to achieve high gain with very low noise figure and high linearity Noise figure distribution is very tightly controlled. A CMOScompatible shutdown pin is included either for turning the LNA on/off, or for current adjustment. The integrated filter utilizes an Avago Technologies’ leading edge FBAR filter for exceptional rejection at Cell/PCS Band frequencies. The ALM-2712 is useable down to 1V operation. It achieves low noise figure, high gain and linearity even at 1V, making it suitable for use in critical low-power GPS applications or during low-battery situations.

[Figure 1-7] ALM-2712 Functional Block Diagram.

3.6.2 AWS LNA (U1000 BGA711L7)

The BGA711L7 is a low current single-band low noise amplifier MMIC for UMTS bands I and IV. The LNA is based upon Infineon’s proprietary and cost-effective SiGe:C technology and comes in a low profile TSLP-7-1 leadless green package. Because the matching is off chip, the 2100 MHz path can be easily converted into a 1900 MHz path by optimizing the input and output matching network. In the main features of this module, Gain is 17dB and noise figure is 1.1dB in high gain mode. and, input and output RF ports are matched to 50-Ωҏ

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.6.3 FEM, Front End Module (U1008: SKY77544)

The module consists of a GSM850/900 PA and DCS1800/PCS1900 PA block, impedance matching circuitry for 50 ȳ input and output impedances, Tx harmonic filtering, high linearity low insertion loss switches, and a CMOS Power Amplifier Control (PAC) block. A custom silicon integrated circuit contains decoder circuitry to control the RF switch while providing a low current external control interface. An integrated temperature sensor provides an analog voltage based on the temperature of the module.

Fabricated in InGaP/GaAs, the Hetero-junction Bipolar Transistor (HBT) PA blocks support the GSM850/900 bands and DCS1800/PCS1900 bands. Both PA blocks share common power supply pads to distribute current. The output of the PA block and the outputs to the seven receive pads connect to the antenna pad through a highly linear antenna switch. The WCDMA and Rx ports feature a 0 volts DC offset level, which eliminates any need for external blocking capacitors. The InGaP/GaAs die, switch die, Silicon (Si) controller die, and passive components are mounted on a multi-layer laminate substrate and the entire assembly is encapsulated with plastic overmold.

RF input and output ports of the SKY77544 are internally matched to a 50 ȳ load to reduce the number of external components for a quad-band design. Extremely low leakage current of the FEM maximizes handset standby time. Band selection and control of transmit and receive RF signal flows are performed by use of four external control pads. See Figure 1-6 shown on overleaf. Mode of operation Tx, Rx, Band (GSM850, GSM900, DCS, PCS, and UMTS) is controlled with 4 logic inputs: BS1, BS2, Mode, and TxEN. Proper timing of the TxEN input and the VAPC input ensures high isolation between the antenna and Tx-VCO while the VCO is being tuned prior to the transmit burst. The Enable input controls the initial turn-on of the PAC circuitry to minimize battery drain. The integrated power amplifier control (PAC) function provides envelope amplitude control by reducing sensitivity to input drive, temperature, power supply, and process variation.

ANT_SEL0 ANT_SEL1 ANT_SEL2 ANT_SEL3

GSM850_EGSM_TX LOW LOW LOW HIGH

DCS_PCS_TX LOW LOW HIGH HIGH

PCS_RX (RX1) HIGH LOW LOW LOW

DCS_RX (RX2) HIGH LOW LOW HIGH

EGSM_RX (RX3) HIGH LOW HIGH HIGH GSM850_RX (RX4) HIGH LOW HIGH LOW

W1700 (WCDMA2) LOW HIGH LOW LOW

W2100 (WCDMA1) LOW LOW HIGH LOW

[Table 1] Antenna Switch Module Logic

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3. TECHNICAL BRIEF

[Figure 1- 8] SKY77544 Functional Block Diagram.

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LGE Internal Use Only

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