LG G7100 Service Manual

Table Of Contents

1. INTRODUCTION................................…5

1.1 Purpose ............................................….

1.2 Regulatory Information ..........................

1.3 Abbreviations .........................................

5

5

7

2. PERFORMANCE ..............................….9

2.1 H/W Feature .....................................…..

2.2 Technical Specification ..........................

9

11

3. TECHNICAL BRIEF ............................16

3.1 General Description of RF parts ......…..

3.2 Receiver Part ...................................….

3.3 Synthesizer Part …………………………

3.4 Transmitter Part ................................….

3.5 13 MHz Clock ...................................….

3.6 Power Supplies and Control Signals .….

3.7 Digital Main Processor ......................….

3.8 Analog Main Processor ......................…

3.9 Power Management IC .....................….

3.10 Memories ........................................... .

3.11 Display and Interface ......................... .

3.12 Keypad Switches and Scanning ........ .

3.13 Microphone ........................................ .

3.14 Earpiece .....................…………………

3.15 Hands-free Interface …………………..

3.16 Headset Jack Interface ...................….

3.17 Key Back-light Illumination ..............….

3.18 LCD Back-light Illumination ……………

3.19 Speaker & MIDI IC ..........................….

3.20 CAMERA IC …………………………….

16

16

19

20

23

24

25

30

36

39

40

40

42

43

43

43

46

47

48

49

4. TROUBLE SHOOTING ................… 53

4.1 RF Components .............................….

4.2 Rx Trouble ..........................................

4.3 Tx Trouble ..........................................

4.4 Power On Trouble ..........................….

4.5 Charging Trouble ...........................….

4.6 LCD Trouble .......................................

4.7 Receiver Trouble ................................

4.8 Speaker Trouble .................................

4.9 MIC Trouble ...................................….

4.10 Vibrator Trouble ...............................

4.11 Key Backlight LED Trouble ..............

4.12 Folder on/off Trouble ………………..

4.13 SIM Detect Trouble ..........................

4.14 Earphone Trouble ............................

4.15 HFK Trouble .....................................

4.16 CAMERA Trouble ……………………

53

54

63

73

76

78

80

82

84

87

89

91

93

95

100

106

5. DISASSEMBLY INSTRUCTION .... 110

5.1 Disassembly .......................................

110

6. DOWNLOAD AND

CALIBRATION ................................ 118

6.1 Download ......................................…..

6.2 Calibration .....................................…..

118

125

7. BLOCK DIAGRAM ........................... 128

-3 -

8. CIRCUIT DIAGRAM ......................... 129

8.1 MAIN .............................................…..

8.2 Memory & MMI & PMIC ..........……….

8.3 MMI …............................................….

8.4 Audio ………..................................…..

8.5 Camera ……………………..………….

8.6 RF Circuit ………………………………

129

130

131

132

133

134

9. PCB LAYOUT .................................. 135

10. ENGINEERING MODE .................. 137

13. EXPLODED VIEW &

REPLACEMENT PART LIST ...…. 149

13.1 Exploded View ...........................……

13.2 Accessory ...............................……..

13.3 Replacement Parts

< Mechanic component > ……………..

Replacement Parts

< Main component > ………………….

149

151

152

155

10.1 BB Test [MENU 1] .....................……

10.2 RF Test [MENU 2] .....................……

10.3 MF mode [MENU 3] ...................……

10.4 Trace option [MENU 4] ..............……

10.5 Call timer [MENU 5] ..................……

10.6 Fact. Reset [MENU 6] ................……

10.7 S/W version [MENU 7] ...............……

138

140

141

142

142

142

142

11. STAND ALONE TEST ................... 143

11.1 Introduction ................................……

11.2 Setting Method ..........................……

11.3 Means of Test ............................……

143

143

144

12. AUTO CALIBRATION ................... 146

12.1 Overview ....................................……

12.2 Requirements ............................……

12.3 Menu and Settings ........................…

12.4 AGC …………………………………..

12.5 APC …………………………………...

12.6 ADC ……………………………………

12.7 Setting …………………………………

12.8 How to do calibration .................……

146

146

146

148

148

148

148

148

-4 -

1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the
features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is
not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.

-5 -

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system

boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat

which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective

package as described.

-6 -

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

Automatic Power ControlAPC

BasebandBB

Bit Error RatioBER

Constant Current – Constant VoltageCC-CV

Digital to Analog ConverterDAC

Digital Communication SystemDCS

1. INTRODUCTION

dB relative to 1 milli wattdBm

Digital Signal ProcessingDSP

Electrical Erasable Programmable Read-Only MemoryEEPROM

Electrostatic DischargeESD

Flexible Printed Circuit BoardFPCB

Gaussian Minimum Shift KeyingGMSK

General Purpose Interface BusGPIB

Global System for Mobile CommunicationsGSM

International Portable User IdentityIPUI

Intermediate FrequencyIF

Liquid Crystal DisplayLCD

Low Drop OutputLDO

Light Emitting DiodeLED

Offset Phase Locked LoopOPLL

-7 -

1. INTRODUCTION

Power Amplifier ModulePAM

Printed Circuit BoardPCB

Programmable Gain AmplifierPGA

Phase Locked LoopPLL

Public Switched Telephone NetworkPSTN

Radio FrequencyRF

Receiving Loudness RatingRLR

Root Mean SquareRMS

Real Time ClockRTC

Surface Acoustic WaveSAW

Subscriber Identity ModuleSIM

Sending Loudness RatingSLR

Static Random Access MemorySRAM

Pseudo SRAMPSRAM

Side Tone Masking RatingSTMR

Travel AdapterTA

Time Division DuplexTDD

Time Division Multiple AccessTDMA

Universal Asynchronous Receiver/TransmitterUART

Voltage Controlled OscillatorVCO

Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

Wireless Application ProtocolWAP

-8 -

2. PERFORMANCE

2.1 H/W Features

Item Feature Comment

Standard Battery

Stand by Current

Talk time Up to 3hours (GSM TX Level 7)

Stand by time Up to 200hours (Paging Period: 9, RSSI: -85 dBm)

2. PERFORMANCE

Li-ion, 770 mAh
Size: 35 × 62 × 3.8mm
Weight: 16g

Under the minimum current consumption environment
(such as paging period 9), the level of standby current
is below 4mA.

Charging time

RX Sensitivity GSM, EGSM: -105dBm, DCS: -105dBm

TX output power

GPRS compatibility Class 10

SIM card type 3V Small

Display

Status Indicator

ANT External

EAR Phone Jack Yes

PC Synchronization Yes

Standard charge: 5hours
Rapid charge: Approx. 2.5hours

GSM, EGSM: 33dBm(Level 5),
DCS: 30dBm(Level 0)

Main LCD: 128 × 160 pixel 65K Color

Sub LCD: 96 × 64 pixel 256 Color

Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Navigation Key
Confirm Key, Clear Key
Send Key, END/PWR Key

Speech coding EFR/FR/HR

Data and Fax Yes

Vibrator Yes

Loud Speaker Yes

Voice Recoding Yes

C-Mike Yes

-9 -

2. PERFORMANCE

Item Feature Comment

Receiver Yes

Travel Adapter Yes

MIDI 32 Poly

Camera VGA 640 × 320 pixel

Options Hands-free kit, CLA, Data Kit

- 10 -

2.2 Technical Specification

Item Description Specification

GSM

TX: 890 + n × 0.2 MHz
RX: 935 + n × 0.2 MHz (n=1~124)

EGSM

1 Frequency Band

TX: 890 + (n-1024) × 0.2 MHz
RX: 935 + (n-1024) × 0.2 MHz (n=975~1024)

DCS

TX: 1710 + (n-512) × 0.2 MHz
RX: 1805 + (n-512) × 0.2 MHz (n=512~885)

2. PERFORMANCE

2 Phase Error

3 Frequency Error < 0.1 ppm

4 Power Level

RMS < 5 degrees
Peak < 20 degrees

GSM, EGSM

Level Power Toler. Level Power Toler.

5 33dBm ±2dB 13 17dBm ± 3dB

6 31dBm ±3dB 14 15dBm ± 3dB

7 29dBm ±3dB 15 13dBm ± 3dB

8 27dBm ±3dB 16 11dBm ± 5dB

9 25dBm ±3dB 17 9dBm ± 5dB

10 23dBm ±3dB 18 7dBm ± 5dB

11 21dBm ±3dB 19 5dBm ± 5dB

12 19dBm ±3dB

DCS

Level Power Toler. Level Power Toler.

0 30dBm ±2dB 8 14dBm ± 3dB

1 28dBm ±3dB 9 12dBm ± 4dB

2 26dBm ±3dB 10 10dBm ± 4dB

3 24dBm ±3dB 11 8dBm ± 4dB

4 22dBm ±3dB 12 6dBm ± 4dB

5 20dBm ±3dB 13 4dBm ± 4dB

6 18dBm ±3dB 14 2dBm ± 5dB

7 16dBm ±3dB 15 0dBm ± 5dB

- 11 -

2. PERFORMANCE

Item Description Specification

GSM, EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -63

3,000~ <6,000 -65

5

Output RF Spectrum
(due to modulation)

DCS

Offset from Carrier (kHz). Max. dBc

GSM, EGSM

6,000 -71

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -65

3,000~ <6,000 -65

6,000 -73

Offset from Carrier (kHz). Max. dBm

Output RF Spectrum

6

(due to switching

transient)

- 12 -

400 -19

600 -21

1,200 -21

1,800 -24

Item Description Specification

DCS

Offset from Carrier (kHz). Max. dBm

Output RF Spectrum

6

7 Spurious Emissions Conduction, Emission Status

8 Bit Error Ratio

(due to switching

transient)

GSM, EGSM

BER (Class II) < 2.439% @-102 dBm

DCS

BER (Class II) < 2.439% @-100 dBm

400 -22

600 -24

1,200 -24

1,800 -27

2. PERFORMANCE

9 RX Level Report Accuracy ±3 dB

10 SLR 8±3 dB

Frequency (Hz) Max.(dB) Min.(dB)

11 Sending Response

12 RLR 2±3 dB

100 -

200 -

300 -12

1,000 -6

2,000 -6

3,000 -6

3,400 -9

4,000 -

-12

0

0

0

4

4

4

0

- 13 -

2. PERFORMANCE

Item Description Specification

Frequency (Hz) Max.(dB) Min.(dB)

13 Receiving Response

* Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

14 STMR 13±5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

100 -

200 -

300 -7

500 -5

1,000 -5

3,000 -5

3,400 -10

4,000

-35

-30

-12

0

2

*

0

2

2

2

17.5

22.5

-20

16 Distortion

17 Side Tone Distortion Three stage distortion < 10%

18

19 32.768KHz tolerance ≤ 30 ppm

20 Ringer Volume

System frequency
(13 MHz) tolerance

≤ 2.5 ppm

At least 80 dB under below conditions:

1. Ringer set as ringer.

2. Test distance set as 50 cm

-10

0

7

10

30.7

33.3

33.7

31.7

25.5

- 14 -

Item Description Specification

2. PERFORMANCE

21 Charge Current

22 Antenna Display

23 Battery Indicator

24 Low Voltage Warning

Fast Charge : < 500 mA

Slow Charge : < 60 mA

Antenna Bar Number Power

5

4

3

2

1

0

Battery Bar Number Voltage

0

1

2

3

3.62 ± 0.03V (Call)

3.5 ± 0.03V (Standby)

-85 dBm ~

-90 dBm ~ -86 dBm

-95 dBm ~ -91 dBm

-100 dBm ~ -96 dBm

-105 dBm ~ -101 dBm

~ -105 dBm

~ 3.62 V

3.62 ~ 3.73 V

3.73 ~ 3.82 V

3.82 V ~

25

26 Battery Type

27 Travel Charger

Forced shut down
Voltage

3.35 ± 0.03V

1 Li-ion Battery
Standard Voltage = 3.8 V
Battery full charge voltage = 4.2 V
Capacity: 770mAh

Switching-mode charger
Input: 100 ~ 240 V, 50/60 Hz
Output: 5.2 V, 600 mA

- 15 -

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 General Description of RF parts

The RF parts consists of a transmitter part,a receiver part,a synthesizer part,a voltage supply part,a
VCTCXO part. And the main RF Chipset CX74017[U603]is a single-chip dual-band transceiver for the
extended global system for mobile communication[E-GSM900MHz]/
Digital communication system[DCS1800MHz] voice and data transfer applications.
This device integrated a direct conversion receiver architecture, a transmitter based on a modulation loop
architecture and fractional-N synthesizer part with built in TXVCO and Local-VCO.

3.2 Receiver Part

The Receiver part in CX74017 contains all active circuits completely, full receiver chain with the
exception of discrete front-end RF SAW filters. The filtered and amplified signal is down converted in
the RF-mixer to the baseband output. The receiver path is supported by internal channel filtering.

DCS : 1805 ~ 1880MHz

GSM : 925 ~ 960MHz

ANT

S/W

U405(SHS-M090B)

U408(SAFSE942MAL)

U407(SAFSE1G84KA)

U603(CX74017)

0

90

VGA1 VGA2

0

90

VGA1 VGA2

DCOC

DCOC DCOC DCOC

DCOC DCOC

LO

RXQN

RXIP

RXIN

RXQP

Base

Band

Block

Figure. 3-1 Receiver Block diagram

- 16 -

3. TECHNICAL BRIEF

A. RF Front End

RF front end consists of Antenna Switch(FL405), an integrated two saw filters,(FL601),dual band
LNAs integrated in transceiver.
The Received RF signals(GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the
antenna or Mobile switch. An antenna matching circuit is between the antenna and the mobile
switch. The Antenna Switch(FL600) is used to control the Rx and Tx paths. And, the input signals

VC1 and VC2 of a FL600 are directly connected to baseband controller to switch either Tx or Rx
path on. Ant S/W module(FL600) is an antenna switch module for dual band phone.

The logic and current is given below table 3-1.

Table 3-1 The logic and current

CurrentVC2VC1

10.0 mA max2.5 to 3 V0 VGSM TX

10.0 mA max0 V2.5 to 3 VDCS TX

<0.1 mA0 V0 VGSM/DCS RX

The receiver part uses a low-IF receiver architecture that allows for the on-chip integration
of the channel selection filters, eliminating the external RF image reject filters and the IF
SAW filter required in conventional super-heterodyne architecture. The Receive part of
CX74017 integrates three differential input LNAs that are matched to the 200 Ohm
balanced-output SAW filters through external LC matching networks.

- 17 -

3. TECHNICAL BRIEF

B. Demodulator and baseband processing

In direct conversion receiver there is only one mixer down-converting received RF signal to BB signal
directly. The gain down converting mixer is 40dB at high gain mode and 22dB at low gain mode.

The Rx gain setting is done in the AGC algorithm. The nominal gain of the receiver is set as a
function of the expected signal strength at the antenna input so that a desired level is reached at the
Rx I/Q. 7 blocks in the receiver chain have variable gains, LNA, Mixer, LPF1, VGA1, gmC Filter,
Auxiliary gain control and VGA2. The gain settings can be adjustable via 3-wire bus control lines.

The baseband signals pass via integrated low-pass filters to the baseband A/D converters.
Theremainder of the channel filtering is performed by the baseband chipset. The demodulator
contains switches to maintain the sense of the baseband I/Q outputs with respect to the incoming RF
signal on both GSM900 and DCS1800.

C. DC offset compensation

Three correction loops ensure that DC offsets, generated in the CX74017, do not overload the
baseband chain at any point.

After compensation, the correction voltages are held on capacitors for the duration of the
receive slot(s). A rising edge on the RXEN signal, selected via the serial interface, placed the
DC compensation circuitry in the track mode.

- 18 -

3.3 Synthesizer Part

4/3 2/3

GSM

DCS

f

vco

CX74017

f

vco = (N+3.5+FN/2^22)

LF

Fractional-N

PLL

f

ref/R

/R

3. TECHNICAL BRIEF

2V7_VTCXO

13MHz

f

ref

13MHz

AFC

REFCLK

Base
Band

Block

/3

X2

DCS

GSM

The CX74017 includes a fully integrated UHF VCO with an on-chip LC tank.
A single sigma-delta fractional-N synthesizer can phase lock the local osillator used in both
transmit and receive path to a precision frequency reference input. Fractional-N operation offers
low phase noise and fast setting times, allowing for multiple slot applications such as GPRS.
The counter and mode settings of the synthesizer are also programmed via 3-wire interface.

f

LO

Figure.3-2 Synthesizer Block diagram

- 19 -

3. TECHNICAL BRIEF

3.4 Transmitter Part

The Transmitter part contains CX74017 active parts, PAM and Antenna Switch.
The CX74017 active part consists of a vector modulator and offset phase-locked loop block(OPLL)
including down-converter, phase detector, loop filter and dual band transmit VCO which can operate
at either final RF output frequency. The RF GMSK outputs from the transmit VCO are fed directly to
the RF power amplifiers. The peak output power and the profile of the transmitted burst are
controlled by means of a closed feedback loop. A dual band directional coupler is used to sample the
RF output from either PA. The PA outputs from the directional coupler pass to the antenna connector
via Antenna Switch.

FL600(LMSP54AA-097)

ANT

S/W

GSM : 880 ~ 925MHz

DCS : 1710 ~ 1785MHz

U601(CX77315))

TXRAMP TXPA

BANDSEL1

LO

f

LO

X2

f

f

TX

IF

Base

Band

TXVCO

/D1

PFD

LF

/D2

0

90

TXQP

TXQN

TXIP

TXIN

Block

Figure 3-3. RF Transmitter path Block Diagram

- 20 -

3. TECHNICAL BRIEF

A. IF Modulator

The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the
transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted side­band rejection and produces a GMSK modulated signal. The baseband software is able to cancel out
differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A converters.
The TX-Modulator implements a quadrature modulator. The IF-frequency input signal is split into two
precise orthogonal carriers, which are multiplied by the baseband modulation signal IT/ITX and
QT/QTX. It is used as reference signal for the OPLL.

B. OPLL

The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating
signal. The IF signal goes via external passive bandpass filter to one port of the phase detector.
The other side of the phase detector input is LO signal. The phase detector generates an error
current proportional to the phase difference between the modulated signal from the offset mixer
and the reference signal from the LO. The error current is filtered by a second order low-pass filter
to generate an output voltage which depends on the GMSK modulation and the desired channel
frequency. This voltage controls the transmit VCO such that the VCO output signal, centered on
the correct RF channel, is frequency modulated with the original GMSK data. The OPLL acts as a
tracking narrowband band pass filter tuned to the desired channel frequency. This reduces the
wideband noise floor of the modulation and up-conversion process and provides significant
filtering of spurious products.

C. Power amplifier

The CX77315[U601] is designed in a compact form factor for quad-band cellular handsets comprising
GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet
Radio Service(GPRS) multi-slot operation. The module consists of separate GSM850/900 PA and
DCS1800/PCS1900 PA blocks, impedance-matching circuitry for 50 ohm input and output
impedances, and a Power Amplifier Control (PAC) block with and internal current-sense resistor.

- 21 -

3. TECHNICAL BRIEF

Figure 3-4. Power Amplifier Block Diagram

- 22 -

3. TECHNICAL BRIEF

3.5 13 MHz Clock

The 13 MHz clock(X600) consists of a TCXO(Temperature Compensated Crystal Oscillator)
which oscillates at a frequency of 13 MHz. It is used within the CX74017 RF Main Chip,BB
Analog chip-set(U100 AD6521), Digital(U101 AD6525), CAMERA IC(U501 CLC344E) and
MIDI(U200) Chipset.

Figure 3-5. VCTCXO Circuit

- 23 -

3. TECHNICAL BRIEF

3.6 Power Supplies and Control Signals

There are two regulators used in the phone to provide RF power. One is contained inside of
ADP3522(U203), Power management IC to provide the power for the VCTCXO(X600). The other is
used to provide the power for remaining RF circuits. Figure 3-6 shows regulator 2.

Table 3-2.Power supplies and control signals.

Enable SignalPowersVoltageRegulator

Regulator 1

(U203,2V75_VTCXO)

Regulator 2

(U600,RF2.85V)

12.75V+/-

0.5V

2.85V +/-

0.5V

10.0 mA maxVTCXO

VSYNTHENRF circuitry

Figure 3-6. Regulator

- 24 -

3.7 Digital Main Processor

AD6525

3. TECHNICAL BRIEF

Figure 3-7. Example of System interconnection of AD6525 External Interface

- 25 -

3. TECHNICAL BRIEF

• AD6525 is an ADI designed processor.

• AD6522 consists of

1. BUS arbitration Subsystem

• EBUS, RBUS, PBUS, SBUS, DMABUS,
IOBUS

2. DSP Subsystem

• ADI DSP, Viterbi coprocessor,
Ciphering unit,
Cache memory/controller system

3. MCU Subsystem

• ARM7TDMI, boot ROM, Clock generation and access control module

4. Peripheral Subsystem

• MMI group
⇒ Keyboard, Display, Backlight, RTC, GPIO interface

• House Keeping group

⇒ Watchdog Timer, Interrupt controller, General Timer

• GSM system group

• Direct Memory Access group

⇒ Between PBUS,RBUS, and EBUS

- 26 -

3. TECHNICAL BRIEF

3.7.1 Interconnection with external devices

A. RTC block interface

Countered by external X-TAL

The X-TAL oscillates 32.768KHz

B. LCD module interface

The LCD module is controlled by CAMERA IC, CLC344E.

If CLC344E is in the state of by-pass mode, the LCD control signals from AD6525 are by-passed
through CLC344E. In operating mode, the CLC344E controls the LCD module through
L_MAIN_LCD_CS, L_SUBLCD_CS, L_ADD1, L_WR, L_RD, L_DATA[00-15].

Table 3-3.

LCD_RS (L_ADD1)

Description

MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pinL_MAIN_LCD_CS

This pin resets LCD module.LCD_RES

This pin determines whether the data to LCD module are display data
or control data. ADD1 can select 16 bit parallel bus. ADD1 is also used
to address flash memory.

Write control. The phone do not read data from LCD chip.L_WR

Parallel data lines. Color LCD driver chip uses the 16-bit data interface.L_ DATA

3V voltage is supplied to white colored LED driver for backlighting.2V8_VMEM

Control signal of white LED driver IC.LCD_BACKLIGHT

SUB LCD driver chip enable, Sub LCD driver IC has own CS pin.L_SUBLCD_CS

Parallel data lines, Sub LCD driver chip uses the 8-bit data in reface.L_DATA[08...15]

- 27 -

3. TECHNICAL BRIEF

C. RF interface

The AD6522 control RF parts through TX_EN, RX_EN, BAMDSEL1, DCSSEL, GSMSEL,
VSYNTHEN, TXPA, PLL_LE, PLL_DATA, PLL_CLK, PLL_PD

Table 3-4.

Transmitter Enable/DisableTX_EN2

Receiver Enable/DisableRX_EN3

PAM Band SelectBANDSEL14

Antenna switch Band Select(DCS Band)DCSSEL9

ResetDescriptionSignal NameGPO

Antenna switch Band Select(GSM Band)GSMSEL11

RF LDO Enable/DisableVSYNTHEN16

PAM Enable/DisableTXPA17

PLL Enable/DisablePLL_LE19

Serial Data to PLLPLL_DATA20

Clock to PLLPLL_CLK21

Powerdown InputPLL_PD22

D. SIM interface

The AD6525 check status periodically in call mode if SIM card is inserted or not, but the AD6525 don't
check in deep sleep mode.

Interface by SIMDATAOP, SIMCLK, SIM_RST(GPIO_23)

Table 3-5.

SIMDATAOP

Description

This pin receives and sends data to SIM card. This model support

1.8volt or 3.0 volt interface SIM card.

Clock 3.25MHz frequency.SIMCLK

Reset SIM blockSIM_RST(GPIO_23)

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3. TECHNICAL BRIEF

Figure 3-8. SIM Interface of AD6525

E. Key interface

Include 5 column and 5 row. The AD6522 detect key press by interrupt.

F. ADP3522 interrupt

There are two interrupts, EOC and CHRDET

EOC: End of Charge. AD6525 makes charging operation stop when high signal is inputted.

CHRDET: This pin is activated when the charger is inserted.

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3. TECHNICAL BRIEF

3.8 Analog Main Processor

AD6521

Figure 3-9. AD6521

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• AD6521 is an ADI designed processor.

• AD6521 consists of

1. BB Transmit section

• This section generates in-phase and quadrature BB modulated GMSK signals.

• Digital GMSK modulator, 10-bit DACs,
Reconstruction Filter

2. BB Receive section

• 2 identical ADC channels that process BB in-phase and quadrature input signals.

3. Auxiliary section

• 2 auxiliary DASs ⇒AFC DAC, IDAC
AUX ADC

• AUX ADC : 6 channels 10 bits
AFC DAC : 13 bits
10 bits

3. TECHNICAL BRIEF

4. Voiceband section

• Receive audio signal from MIC.
Send audio signal to Speaker

• It interconnect with external device like main microphone, main receiver, ear­microphone and Hands-free kit.

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3. TECHNICAL BRIEF

A. BB Transmit section

This section generates in-phase and quadrature BB modulated GMSK signals (BT = 0.3) in
accordance with GSM 05.05 Phase 2 specifications.

The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a
matched pair of reconstruction filter.

B. BB Receive section

This section consists of two identical ADC channels that process baseband in-phase(I) and
quadrature(Q) input signals.

Each channel consists of a coarse switched capacitor input filter, followed by a high-order sigma­delta modulator and a lowpass digital filter.

C. Auxiliary section

This section contains two auxiliary DACs(AFC DAC, IDAC) for system control.

This section also contains AUX ADC and Voltage Reference

AUX ADC : 6 channel 10 bits

AFC DAC : 13 bits

IDAC : 10 bits

D. Voiceband section

Receive audio signal from MIC. The phones use differential configuration.

Send audio signal to Receiver. The phones use differential configuration.

It interconnects external devices such as main microphone, main receiver, ear-phone and Hands

free kit through the VINNORP, VINNORN, VOUTNORP, VOUTNORN, VINAUXP, VINAUXN,

VOUTAUXP, VOUTAUXN

VINNORP, VINNORN: Main MIC positive/negative terminal.

VOUTNORP, VOUTNORN: Main Receiver positive/negative terminal.

VINAUXP, VINAUXN: Hands free kit microphone positive/negative terminal.

VOUTAUXP, VOUTAUXON: Hands free kit speaker positive/negative terminal.

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