LG FLATRON 29UM55 Service Manual

Printed in China

COLOR MONITOR

SER

VICE MANUAL

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

CAUTION

BEFORE SERVICING THE UNIT

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : LM14P

MODEL:

Internal Use Only

29UM55

P/NO : MFL67715298(1406-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

PRECAUTION

............................................................................................3

SERVICING PRECAUTIONS.....................................................................4

SPECIFICATIONS......................................................................................6

TIMING CHART .......................................................................................11

ADJUSTMENT .........................................................................................14

BLOCK DIAGRAM...................................................................................18

TROUBLE SHOOTING ............................................................................19

EXPLODED VIEW .................................................................................. 22

SVC. SHEET ...............................................................................................

- 2 -

Only for training and service purposes

LGE Internal Use Only

PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that

are important for safety. These parts are marked on the schematic diagram and the Exploded View. It is essential that these critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

•

Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or LIPS part, must disconnect the AC power because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1

*Base on

Adjustment standard

0.15uF

- 3 -

Only for training and service purposes

LGE Internal Use Only

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service

manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a

. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or re-connecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) is opropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500ºF to 600ºF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500ºF to 600ºF) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500ºF to 600ºF)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 4 -

Only for training and service purposes

LGE Internal Use Only

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete TransistorRemoval/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

- 5 -

Only for training and service purposes

LGE Internal Use Only

SPECIFICATIONS

1. General Specification

Item

ntent

Rem

ark

1 C

stomer BRAND

2 Us

er Model Name

29UM55

3 Sal

e region Refer to Suffix standard

4 Fe

ature 29” Wide LCD MONITOR

5 Ch

assis Name LM14P

neral

Scope

External SW

&Adj.

LEFT, RIGHT, UP, DOWN, CENTER

nction Picture Mode Ratio, ECO(Super Energy Saving), Six

Color, Audio Volume(Headphone),

Pow

er Cord

Length : 1.55±0.05 M Shape : Wall-out Color : Black Weight : 130g

Refer to Suffix

standard and power

cord table

8 Ca

ble

DVI

Length : Shape : Color : Pin :

Do not Support

Length : 1.8m Shape : Detachable Type Color : Black Weight : 102g

Support

USB

Length : Shape : Color :

Do not Support

Aud

Length : Shape : Color:

Do not Support

Length : ,Shape : ,Color: ,Pin Do not Support

9 Pow

Input: AC100~240V 50~60Hz,1.2A Max Output: DC 19V 2.1A Adapter Weight : 190g

40W

Applying module list

P/No Specification

EAJ62

987701 LM290WW2-SSA1

Etc (accessory) Manual CD - Support

- 6 -

Only for training and service purposes

LGE Internal Use Only

3. Optical Character

2. Mechanical specification

No Item Content Remark

Produ

Dimension

Width (W) Length (D) Height (H)

Before Packing 703.0mm 213.2mm 414.2cm With stand

703.0mm 64.0mm 328mm Without stand

After Packing

814mm 405mm 156mm

Produ

Weight

Only SET 5.2kg Without stand : 4.7kg

With BOX

7.5Kg

Con

tainer

Quantity

Individual (Vertical Type)

20ft 40ft

Face_up

40ftH/C

- Indi. : 1,296

- Pallet : 1,152

Ind

i. Pallet Indi.

Wood

525

462 1,080 966

4 Sta

Assy

Type Base detachable

Size

(W x D x H) 124mm x 213.2mm x 42.6mm Only stand ass’y

Til

t Degree

-5°（+/-3°）~ +20°（+/-3°）

Til

t force F1 /F2 :1.0 ~ 1.5kgf

Fol

ding Degree9 None

5 Appe

arance General Refer to Standard of LG(56)G2-1011

No I

tem Criteria

Rem

ark

Vie

wing Angle

<CR≥10>

Horizontal(R/L) : +89º/-89º ( (Typ.)

Vert

ical(Top/Bottom) : +89º/-89º (Typ.)

umi

nance(휘도)

Average Luminance (cd/m

)

0(mi

n), 250 (Typ.)

(Full white pattern, 0.7V)

Warm (6500K)

Ave

rage Luminance

(cd/m

)

(min)

(Full white pattern, 0.7V)

Medium (8000K)

Ave

rage Luminance

(cd/m

)

150(mi

(Full white pattern, 0.7V)

Cool (9300K)

Supe

r Energy

Saving On

Max 25% down from S-Energy Saving Off.

Lumi

nance

Uniformity

75%(min),

Con

trast Ratio(명암 비)

700(MIN), 1000(TYP), DFC->5,000,000:1(Typ.) / 4,000,000:1(Min) (It is measured at center point)

4 Res

ponse Time On/off:14ms(TYP, GTG),

Color

Coordinates

(색 좌표)

Minimum Normal Maximum

Whit

yp-0

.03

0.313

Typ+0.03

Warm

(6500K)

WY 0.329

Whit

e W

Typ-0

.03 0.295 Typ+0.03 Medium

WY 0.3

(8000K)

Whit

Typ-0

.03

0.283 Typ+0.03

Cool

(9300K)

RED

Typ-0

.03

0.660

Typ+0.03

Warm

(6500K)

0.331

GREEN

0.306

0.609

BLU

0.149

062

- 7 -

Only for training and service purposes

LGE Internal Use Only

4. Engineering Specification

ported Sync. Type

Separate Sync.

2 Op

erating Frequency

Horizontal

30 ∼ 90kHz

rtical

(AV)25~60 Hz,

(PC)50~75 Hz

orizontal

30 ∼ 90kHz

rtical 50 ~ 75 Hz

3 Re

solution

Max. 2560×1080 @ 60Hz

commend 2560×1080 @ 60Hz

x. 2560×1080 @ 60Hz

commend 2560×1080 @ 60Hz

4 In

put Voltage Voltage :100 – 240 Vac, 50 or 60Hz, 1.0A

5 Inrush Current Cold Start : 50 A Hot : 120 A

erating Condition

Sync

(H/V)

Video LED Wattage

Mode

On/On Active

ite

W(Typ)

Test condition

1.2560x1080@60Hz

2. burst pattern

3. 100~240V

4. After aging 30min

/On Active

ite

39W

(

Max)

EPA6

.0 On/On Active

ite

A spec

.69 W

Adjust brightness controls until the luminance of the screen is 200(cd/m2).

Sle

ep Mode

Off/On On/Off Off/Off

Off

ite

Blinking

0.5W

f Mode

(Power switch off)

- - Off < 0.5W

ECO

High,

Low,Off

Low

High

ite

Eff

iciency

15±5% (3W/h)

25±5% (5W/h)

-Test Condition (1)

30,000 HRS with 90%

Confidence level

Lamp Life : 30,000 Hours(Min)

ing Altitude

5,000 m (for Reliability) 3,000m(for FOS)

Env

iron

ment

Conditio

0peratin

Temperature

10 °C ~ 35 °C

midity 10% ~ 80%

Sto

rage

Temperature

-20 °C ~ 60 °C

midity 5% ~ 90% non-condensing

OSD

MENU Brightness 1 - 100

- 8 -

Only for training and service purposes

LGE Internal Use Only

(Monitor

block)

Contrast 1 – 100

Vol

ume 1 – 100, Mute

put HDMI1 / HDMI2/ DP

tio

Wide / Cinema1 /

Cinema2 / Original /

1:1

nc.

ECO High, Low, Off

ader mode

Reader1, Reader2,

Reader Off

ture Mode

Custom, Photo,

Cinema, Game

PBP PBP

PBP On

, Off

put

Main: HDMI1, HDMI2, DP

: HDMI1, HDMI2,

Aud

io HDMI1, HDMI2, DP

Swa

p On, Off

Sub

Full On, Off

tio Main

de, Original

tio Sub

de, Original

Pic

ture

Sharpness 0 - 10

Bla

ck Level

Low, High

(BLACK LEVEL enable

at HDMI input)

sponse

Time

High, Middle, Low

lor

Gamma

Gamma0, Gamma1,

Gamma2

16 Language: English, Germanic, French, Spanish, Italian, Swedish, Finnish, Portuguese Brazilian Portuguese, Polish, Russian, Greek, Chinese, Japanese, Korean,

lor Temp

Warm, Medium, Cool,

Custom

d 0 - 100

Gre

en 0 – 100

Blu

e 0 – 100

Six

Color

(Hue,

Saturation)

0 - 100

nguage

PC/

AV Mode N/A

Mai

n Audio HDMI1/HDMI2,DP

But

ton Sound N/A

Pow

er LED On / Off

1.2 On / Off

OSD

Lock On / Off

set Reset/Cancel

MENU (AV/TV block)

CHANNEL

CHANNEL 2~69(AIR) / 1 ~ 125(CABLE)

Function Support: No

ADD

/DEL CH ADD/DELETE

AUT

O CHANNEL ON/OFF

SELEC

T AIR/CABLE

NE TUNE 0 ~ 100

JUSTMENT

CONTRAST 0~100

Function Support: No

BRI

GHTNES

0~100

SHAR

PNESS 0~100

LOR 0~100

NT 0~100

DIO

VOL

UME

100

Function Support: No

BASS

EBLE

MUT

E ON/OFF

SOU

MON

O/STEREO

SET

LANGUAGE▶

English/German/French/Esperanto Italian/Korean…

Function Support: No

IMA

GE SIZE ▶ FULL/1:1

OSD

POSITION

ANSPAREN

0~100

- 9 -

Only for training and service purposes

LGE Internal Use Only

+ 20 hidden pages

LG FLATRON 29UM55 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual