LG CP150 Service Manual

Service Manual

Model : CP150

Service Manual

CP150

Date: August, 2008 / Issue 1.0

Internal Use Only

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Only for training and service purposes

The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to
equipment design as advances in engineering and manufacturing methods warrant.
This manual provides the information necessary to install, program, operate and maintain the CP150.

REVISED HISTORY

Date Issue Contents of Changes S/W Version

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1. Introduction ..................................... 7

1.1 Purpose................................................... 7

1.2. Regulatory Information........................... 7

1.3 Abbreviations .......................................... 9

2. General Performance.................... 10

2.1 Product Name ....................................... 10

2.2 Supporting Standard ............................. 10

2.3 Main Parts: GSM Solution..................... 10

2.4 HW Feature........................................... 11

2.5 S/W Features .........................................13

3. HW Circuit Description................. 16

3.1 Digital Main Processor (Locosto) .......... 16

3.2 Power Amplifier Module (SKY77318) ... 22

3.3 26 MHz Clock (DCXO).......................... 23

3.4 RTC(32.768KHz Crystal) ...................... 24

3.5 LCD Interface(8-bit Parallel interface)... 25

3.6 SIM Card Interface.................................26

3.7 KEYPAD Interface .................................27

3.8 Battery Charging Block Interface ...........28

3.9 RF Interface ...........................................29

3.10 Audio Interface.....................................31

3.11 Key LED Interface................................34

3.12 Vibrator Interface .................................35

3.13 Memory Interface .................................36

3.14 Power Block Interface ..........................37

4. TROUBLE SHOOTING .................. 38

4.1 Trouble Test Set-up ...............................38

4.2 RF Part Component ...............................39

4.3 RX Receiver Part ...................................42

4.4 TX Transmitter Part................................45

4.5 Power On Trouble..................................50

4.6 Charging Trouble ...................................52

4.7 RTC Trouble ..........................................54

4.8 LCD Trouble...........................................55

4.9 Speaker & Receiver Trouble..................57

4.10 Headphone Trouble .............................60

4.11 Microphone Trouble .............................62

4.12 SIM Card Trouble.................................64

4.13 KEY backlight Trouble .........................66

4.14 Vibrator Trouble ...................................68

5. DOWNLOAD .................................. 70

5.1 Download Setup.................................... 70

5.2 Download Procedure ............................ 71

6. BLOCK DIAGRAM ......................... 78

7. CIRCUIT DIAGRAM ....................... 79

8. BGA IC Pin Check ......................... 85

9. PCB LAYOUT................................. 89

10. Calibration

..........................................

93

10.1 What’s the Rx Calibration?

................

93

10.2 What’s the Tx Calibration?

................

93

10.3 Calibration program-HOT_KIMCHI ... 94

10.4 Calibration Setting............................. 95

10.5 Calibration Steps............................... 95

11. EXPLODED VIEW &

REPLACEMENT PART LIST ..... 101

12.1 EXPLODED VIEW ............................ 101

12.2 Replacement Parts

<Mechanic component>.................... 103

<Main component> ............................106

12.3 Accessory ..........................................117

Table of Contents

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1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the
features of the CP150.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system. There are may be risks of toll
fraud associated with your telecommunications system. System users are responsible for
programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that
this product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. LGE will not be
responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the CP150 or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the CP150 must be performed only by the LGE or its authorized agent.

The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.

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1. Introduction

1. Introduction

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1. Introduction

E. Notice of Radiated Emissions

The CP150 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.

G. Interference and Attenuation

An CP150 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference
from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following
information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.

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1. Introduction

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1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milliwatt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
FEM Front End Module
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol

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2. General Performance

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2. General Performance

2.1 Product Name

CP150 : Support GSM/GPRS

2.2 Supporting Standard

2.3 Main Parts: GSM Solution

Item Feature Comment

Supporting Standard EGSM/GSM850/DCS/PCS

Quad-Band (850/900/1800/1900)

with seamless handover

Phase 2+(include AMR)

SIM Toolkit : Class 1,2,3

Frequency Range GSM850 TX : 824.2 - 848.8

GSM850 RX : 869.2 - 893.8

EGSM TX : 880.2 - 914.8 MHz

EGSM RX : 925.2 - 959.8 MHz

DCS1800 TX : 1710.2 - 1784.8 MHz

DCS1800 RX : 1805.8 - 1879.8 MHz

PCS1900 TX : 1850.2 - 1909.8 MHz

PCS1900 RX : 1930.2 - 1989.8 MHz

Application Standard SMS : Yes

CP150

Digital Baseband TI Locosto (D6591B)

RF Chip SKY77318

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2. General Performance

2.4 HW Feature

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Item Feature Comment

Form Factor Folder type LCD : 65K CSTN, 128 x128

Battery Capacity

Standard: Li-Ion, 800mAh(Min)

Packing Type: Soft Pack

Size Standard: 88 x 47 x 18.7 mm L x W x H

Weight 81g With Battery

PCB One PCB :6 Layers, 0.8t

AVG TCVR Max : 225 mA (GSM, Power Level 5)

current (mA) Max : 90 mA (GSM, Power Level 19)

Standby Current 1.5 mA @ Paging Period 6

Standby time 500 hours @ Paging Period 6

Charging time Below 3 hours @ Power Off /800mAh

Talk time Min : 3.5hr@Power Level 5(GSM850) @ 800 mAh

Min : 4.5hr@Power Level 0(PCS)

RX sensitivity GSM 850 : -109 dBm Condition: conducted

DCS/PCS : -109 dBm

TX output power GSM 850 : 32.5 dBm Class4 (GSM850)

DCS/PCS : 29.5 dBm Class1 (PCS)

SIM card type Plug-In SIM 3V

Display Main LCD : 262k TFT

Sub LCD : 96 x 64 FSTN LCD

Backlight : White LED

Keypad Alphanumeric Key : 12 Function Key:

Function Key : 10 5 Key Navigation,

5 Key Navigation, F1, F2, C, SND, END/PWR

Antenna Internal Antenna Quad-band

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2. General Performance

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Item Feature Comment

System connector 18 Pin

Ear Phone Jack 18 Pin

PC synchronization No

Memory Flash : 128Mbit / SRAM : 64Mbit Spansion

Speech coding FR, EFR, HR, AMR

Data & Fax Yes

Vibrator Built in Vibrator

MIDI (for Buzzer SW Decoded 32Poly

Function)

Voice Recording Yes 30 sec.

Travel Adapter Yes

Options Ear-Microphone TBD

Data Cable TBD

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2. General Performance

2.5 S/W Features

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Item Feature Comment

RSSI 0~5 level

Battery Charging 0~3 level

Key Volume 0~7 level

Effect sound volume 0~7 level

Audio Volume 0~7 level

Time / Date Display Yes NITZ

Multi-language Yes

English /Spanish /French

Quick Access Mode Yes U:Message, D:Phonebook

L:My stuff, R:IM

PC Sync No

Speed Dial Yes Voice mail center -> 1 key

Speaker Phone Yes

CLIP / CLIR Yes

Phone Book Yes(2 Numbers + 1 Memo + 1 e-mail + Total 500 members

Group Select + Picture )

Last Dial Number Yes (40)

Last Received Number Yes (40)

Last Missed Number Yes (40)

Search Number/Name Yes

Group Yes Possible Rename

Fixed Dial Number Yes

Service Dial Number Yes

Own Number Yes

Voice Memo Yes

Call Reminder Yes

Network Selection Yes

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2. General Performance

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Item Feature Comment

Call Divert Yes

Call Barring Yes

Call Charge (AoC) Yes

Call Duration Yes

SMS Yes Max 100

EMS melody/Picture No

Send/ Receive/ Save

SMS Over GPRS No

E-Mail No

Long Message Yes Max. 1530 Characters

Cell Broadcast No AT&T required not supported

Download Melody / Yes

Wallpaper

Game Yes Default 1ea

Calendar Yes

Memo Pad Yes

World Clock Yes

Unit Convert Yes

Currency/Area/Length/Volume

/Weight/Temperature/Velocity

Fax & Data Built in Data & Fax support

Wall Paper Yes Default 5ea

WAP Browser Yes

Download Yes

SIM Lock Yes Operator Dependen

SIM Toolkit Class 1, 2, 3

MMS MMS

EONS Yes

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2. General Performance

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Item Feature Comment

CPHS Yes

ENS Yes

Conference Call Yes DTMF

DTMF Yes

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3. H/W Circuit Description

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3. HW Circuit Description

3.1 Digital Main Processor (Locosto)

Figure. 3-1 Locosto FUNCTIONAL BLOCK DIAGRAM

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3. HW Circuit Description

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3.1.1 Overview of Locosto

The Locosto is a GSM base band modem including RF transceiver covering the low bands GSM850
/GSM900 and high bands GSM1800/GSM1900 bands. Locosto is Dual Band, therefore, it supports by
default a low / high pair of bands at the same time:

1. GSM850 / GSM1800

2. GSM850 / GSM1900

3. GSM900 / GSM1800

4. GSM900 / GSM1900

The Locosto is optimized for voice-centric Mobile Phone applications.

The Locosto is designed as a single chip solution that integrates the digital, mixed-signal, RF
functionality and a direct-to-battery Power Management Unit.

The transceiver consists of:

• Constant gain direct conversion receiver with an analog I/Q base band interface

• Fully integrated Sigma/Delta-synthesizer capability

• Fully integrated two-band RF oscillator

• Two-band digital GMSK modulator with digital TX interface

• Digitally controlled crystal oscillator generating system clocks.

The Locosto supports a direct battery connection, hence eliminating the need for an external Power
Management Unit. The Locosto has different power down modes and an integrated power up
sequencer.

The Locosto is powered by the ARM7(104MHz) MCU and C54® DSP cores.

The operating temperature range from -40°C to 85°C. It is manufactured using the 0.13 µm CMOS
process.

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3. HW Circuit Description

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3.1.2 Features

The LOCOSTO device is an integrated solution that embeds a digital baseband(DBB) and a digital
radio processor (DRP) on the same die. The LOCOSTO device targets solutions for GSM/GPRS (low­cost global system for mobile communications/general packet radio service).

The DRP is a digital radio-frequency (RF) transceiver that supports up to a GPRS class12. The DRP is
designed for quad-band operation, supporting both the European and the US bands (E-GSM 900 and
DCS 1800 bands, GSM850 and PCS 1900 bands, respectively).

The DBB supports the processing of GSM radio signals in the switching circuit mode and the packet
data mode (GPRS) for up to class 10, including evolutions such as the SAIC and localization system
(A-GPS) in compliance with the European Telecommunications Standards Institute specification.

The LOCOSTO silicon process is a 90-nm digital CMOS technology.

The LOCOSTO device includes two versions: LOCOSTO and LOCOSTO Lite.

The LOCOSTO Lite device does not include the camera interface and the GPRS.

LOCOSTO offers the following features:

■ Dual processors:

- 104-MHz ARM7TDMI® microprocessor unit (MPU)

- 104-MHz customized digital signal processor (cDSP) c54x

■ Internal memory:

- 154KW DSP read-only memory (ROM)

- 30KW DSP static random-access memory (SRAM)

- 2.5Mb MPU SRAM

- 1.5Mb MPU ROM

■ External memory support:

- 1.8/3 V subscriber identity module (SIM) I/F

- Direct memory access (DMA) to external memory

- Burst mode, page-mode external memory: NAND and NOR flash and SRAM (frame buffer)

■ Hardware security

- Flash content

- International mobile equipment identity (IMEI) protection

- SIM lock

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■ Peripheral interfaces

- Vibrator PWM control signal

- Universal serial bus (USB) 2.0 full-speed client

- Keypad

- Universal asynchronous receiver/transmitter (UART)

- Multichannel serial interface (MCSI)

- Bluetooth

- Camera

- Primary liquid-crystal display (LCD): 8-bit parallel interface Up to QVGA (quarter video graphics
array) 256K colors

- Secondary LCD: Serial interface

■ DRP2.0 RF integrated RF:

- Digital RF 4 band GSM/GPRS up to Class 12 (On the LOCOSTO Lite device, GSM is dual-band
muxed and GPRS is not available.)

- -110 dBm sensitivity

- Digital PA driver output level +2 dBm

- 0.7 degrees RMS phase error

- Integrated digitally controlled crystal oscillator (DCXO)

■ Software support:

- GSM/GPRS layer 1,2,3 (GPRS is not available on LOCOSTO Lite.)

- Adaptive multirate (AMR), full rate (FR), half rate (HR), enhanced full rate (EFR)

- Teletypewriter (TTY)

- SAIC over GSM

- Man machine interface (MMI) for test

- Wireless application protocol (WAP), enhanced message service(EMS), multimedia message
service (MMS), JAVA

■ Multimedia support:

- Internal 300 KP camera support

- MP3 player

- Up to 32 polyphonies stereo midi player

- Up to 32 polyphonies mono midi ringer

- JPEG encode and decode

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3. HW Circuit Description

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3. HW Circuit Description

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The LOCOSTO device communicates with the analog TWL3031 external subsystem, which provides
the following capabilities:

- Handset microphone and speaker

- Headset mono/stereo audio speakers and microphone connection

- Melody ringer (hands-free) and buzzer

- Battery pack (Nimh/Li-ion) and six 7-V regulated or 20-V nonregulated charger

- Vibrator motor control

- Real-time clock (RTC) 32-kHz crystal

The following external/extra subsystems are also supported:

- TI-Bluetooth (BRF6150) wireless short-distance connectivity

- Voice/audio and data

- TI-AGPS/TWL5002 localization system (I/F provision)

- Digital camera systems (not available on LOCOSTO Lite)

- VGA camera sensor/module, for example, AGILENT ADCM-2700 (not available on LOCOSTO
Lite)

- OMAP-DMxx(GoldenEye) camera companion chip (up to 3M-pixel) (not available on LOCOSTO
Lite)

- UART cable or IrDA (infrared data association)

- Boot-manufacturing capability from the USB link

- FM radio receiver (for example, Philips TEA5767/68)

- Primary (Qcif) and secondary LCD

- NAND flash-based media storage (for example, on-board SmartMedia)

- USB carkit

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3. HW Circuit Description

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3.1.3 Asynchronous Operation Mode Concept

The Locosto can operate in either:

• The traditional synchronous mode with the 26MHz system clock synchronized on the base station

• A special asynchronous mode (XO concept).

In the asynchronous mode the 26MHz clock input is not synchronized with the base station; the
residual frequency offset is compensated in the digital signal processing domain. This processing
includes frequency and timing compensation of the baseband and voiceband signals.

3.1.4 Receiver Antenna Bar Display

RSSI Range (dBm)Antenna Bar

Over -92 ± 2 (dBm)

( -93 〜 -100 ) ± 2 (dBm)

skip

( -101 〜 -103) ± 2 (dBm)

( -104 〜 -105) ± 2 (dBm)

Less -106 ± 2 (dBm)

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3.2 Power Amplifier Module (SKY77318)

The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matching
circuitry for 50 Ω input and output impedances and a Power Amplifier Control (PAC) block with an
internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC
function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die, one
Heterojunction Bipolar Transistor (HBT) PA block supports the GSM bands and the other supports the
DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute
current.

The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate
substrate. The assembly is encapsulated with plastic overmold. RF input and output ports of the
SKY77318 are internally matched to a 50 Ω load to reduce the number of external components for a
quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA module maximizes
handset standby time. The SKY77318 also contains band select switching circuitry to select GSM
(logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal.

In Figure 1 below, the BS pin selects the PA output (DCS/PCS_OUT or GSM_OUT) and the Analog
Power Control (VAPC) controls the level of output power.

The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power
amplifier control (iPAC™) function, which is insensitive to variations in temperature, power supply,
process, and input power.

The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain. The SKY77318
Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad­band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.

The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.

3. HW Circuit Description

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Figure. 3-2 SKY77318 FUNCTIONAL BLOCK DIAGRAM

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3.3 26 MHz Clock (DCXO)

DCXO (Digitally Controlled Crystal Oscillator) and VCTCXO (Voltage Controlled Temperature
Compensated Crystal Oscillator) are two different techniques used to maintain the mobile’s reference
oscillator’s accuracy over time. The reference oscillator’s accuracy over time will vary due to initial
crystal frequency offset, temperature drift and aging. These static and dynamic frequency variations
have to be compensated, otherwise the mobile would be in danger of losing connection to the network.

The technique used to perform the frequency compensation is generally termed Automatic Frequency
Control (AFC). To summarize the operation of DCXO, GSM Baseband processor will calculate the
AFC compensation (which is continuously updated) required based on the measured frequency error.

Then the required AFC compensation is sent to the LUXO (Lineari-Zation Unit of Crystal Oscillator),
which in turns control the DCXO core and generates the 26MHz system clock.

3. HW Circuit Description

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Figure. 3-3 Locosto DCXO Overview

C107

1000p

J12

NC10

H12

NC11
NC12
NC13
NC14
NC15
NC16
NC17
NC18
NC19

SPARE3
SPARE2

XTAL

G12
L11
K11
J11
H11
L10
K10
J10

U1
U2
D15
L8

R105

1.5M

X101

W-191-866

4

GND2

1

HOT1

26MHz

R104

220K C109

HOT2

GND1

C108

0.5p
C112

4.7p

3

2

10p

DITHERING

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3.4 RTC(32.768KHz Crystal)

The integrated Real Time Clock (RTC) is able to provide programmable alarm functions and external
interrupts. Due to its extreme low power consumption the RTC can be supplied from a small backup
battery. This allows the generation of external interrupts, even when the main Locosto supply voltage
is switched off. For this purpose the RTC is powered by own voltage supply pins VDD_RTC and
VSS_RTC.

The RTC shall be driven by a 32.768 kHz (32k) clock which needs to be applied via the Triton(ABB)
OSC32KIN and OSC32KOUT pins. The clock can be fed from either an external clock source or use
the on chip 32 KHz oscillator module.

The low clock frequency and the optimized low power design give the possibility to run the chip with a
minimum of power dissipation. For example, for this specific application the 26 MHz reference
oscillator can be switched off during system standby and a low- power time reference can be kept
when the 32k clock is provided to the RTC.

The RTC consists of an Locosto specific RTC shell, containing the RTC macro, as well as the 32 kHz
oscillator, as described in the following sections. The module RTC Shell solely performs level
translation of the 32KHz clock to the VDD_LD1 power supply domain, and is not functionally
associated with the RTC.

3. HW Circuit Description

- 24 -

Figure. 3-4 Locosto RTC Interface

LED_A
LED_B

LED_C

VIBDR

CKEN

REGEN

HSDET

BM_SEL

R16
T16
P16

C16
E17
F17
U12
H12
G12
F16
M8
B16

CKEN

JACK_DETECT

OSC32KIN

OSC32KOUT

CLK32KOUT

BM_PRECH

CLK32K

MLED1

MLED2
MOTOR_P

V_RTC

C105
10p

R103

220K

C104

X100

15p

MC-146_7pF

4

12

C106
15p

3

32.768KHz

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3.5 LCD Interface(8-bit Parallel interface)

3. HW Circuit Description

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Signals Description

_LCD_§—MAIN_CS This signal enable to access to the driver IC of LCD.

LCD_D(0:7)_LCD_MAIN_CS This signal transfer display data to driver IC.

LCD_ADS, _LCD_WR This signal transfer control signal to driver IC.

LCD_RESET This signal makes driver IC to HW default status.

VRWLED This signal provide power to white LEDs.

MLED1/2 This signal be feed back from white LEDs.

V_EXTH, V_IO This signal provides power to LCD modules.

Figure 3-5-1. LCD Interface

V_EXTH

V_IO

CN301

54

1

53

LCD_D(0:7)

LCD_ADS
_LCD_WR

_LCD_MAIN_CS

_LCD_SUB_CS

LCD_D(7)
LCD_D(6)
LCD_D(5)
LCD_D(4)

LCD_D(3)
LCD_D(2)
LCD_D(1)
LCD_D(0)

EVRC14S03Q030100R

EVRC14S03Q030100R

LCD_ID

EAR_P

EAR_N

MOTOR_P

IND_LED_B

IND_LED_R

FL301

EVRC14S03Q030100R

FL303

FL305

R312
100K

4

3

2

1

9

8

7

6

9

8

7

6

R308

47K

SPK_P

SPK_N

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

G15G2

10

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

G110G2

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

G110G2

6

7

8

9

1

2

3

4

5

1

2

3

4

5

LCD_RESET

CAM_RESET

2

3

52

4

51

550

6

49

48

7

8

47

46

9

45

10

44

11

43

12

42

13

41

14

40

15

39

16

38

17

18

37

36

19

20

35

34

21

22

33

23

32

24

31

30

25

26

29

2728

C312

0.1u

VBAT

FL300

ICVE10184E050R101FR

9

8

7

6

9

8

7

6

ICVE10184E050R101FR

9

8

7

6

I2C_SDA

I2C_SCL

MLED1

MLED2

VRWLED

CAM_PWDN

C310

C311

0.1u

0.1u

C313

0.1u

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

G15G2

10

FL302
ICVE10184E050R101FR

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

G15G2

10

FL304

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

G110G2

5

1V8_CAM

CAM_D(7)
CAM_D(6)
CAM_D(5)
CAM_D(4)

CAM_D(3)
CAM_D(2)
CAM_D(1)
CAM_D(0)

2V8_CAM

CAM_MCLK
CAM_PCLK

CAM_HS

CAM_VS

CAM_D(0:7)

VA300

varistor

NA

VA301

VA302

VA303

1000p

C314

1u

0.1u

C316

C315

Z3X-BOX.COM

LGE Internal Use Only

Copyright © 2008 LG Electronics. Inc. All right reserved.

Only for training and service purposes

3. HW Circuit Description

- 26 -

3.6 SIM Card Interface

The Locosto provides SIM Interface Module. The Locosto checks status periodically during established
call mode whether SIM card is inserted or not, but it doesn't check during deep sleep mode. In order to
communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST.

Figure 3-6. SIM CARD Interface

Signals Description

SIM_RST This signal makes SIM card to HW default status.

SIM_CLK This signal is transferred to SIM card.

SIM_DATA This signal is interface datum.

V_SIM

SIM_PW_CTL

R130

10K

SIM_IO SIM_CLK

C145
22p

D101

DNI_DIODE_1006

4
5
6

10

9

GND1
VPP
IO
GND5
GND4

J100

VCC

RST
CLK

GND2
GND3

1
2
3
7
8

D102

V_SIM

C146

D103

0.1u

DNI_DIODE_1006

DNI_DIODE_1006

SIM_RST

C147
22p

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LGE Internal Use Only

Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. HW Circuit Description

- 27 -

3.7 KEYPAD Interface

Figure 3-7 KEY MATRIX Interface

V_UP

V_DN

KEYPAD

CN200

12345

SPK

EVLC14S02050VA200

VA201 EVLC14S02050

EVLC14S02050VA203

VA204 EVLC14S02050

END

KB200

VA202

EVLC14S02050

RPWON

R213 150

KBR(0)

KBR(1)

KBR(2)

KBR(3)

KBR(4)

KBC(0)

KBC(1)

KBC(2)

KBC(3)

KBC(4)

R226 680

R230 680

R233 680

R235 680

R237 680

OK

OK

1

KB201

680R228

KB206

4

KB210

7

680R232

KB215

*

680R234

680R236

680R238

2

KB202 KB205

KB207

5

KB211

8

KB216

0

KB203

KB208

KB212

KB217

3

KB204

LEFT

KB209

6

9

#

KB213

KB218

UP

RIGHT

DOWN

SOFT

KB214

CLEAR

SOFT1

MENU

SEND

CLEAR

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3.8 Battery Charging Block Interface

The ISL9221 is a high performance battery charger designed to charge single cell Li-Ion/Li-Poly
batteries with up to 500mA of current from an external power source. It is a stand-alone charging
solution, with just one external component required for complete functionality.

The ISL9221 precisely regulates battery charge voltage and current for 4.2V Li-Ion/Li-Poly battery
cells. The ISL9221 has four basic modes for the battery charge cycle: preconditioning/trickle charge;
constant current/fast charge; constant voltage; and end of charge.

- 28 -

3. HW Circuit Description

LGE Internal Use Only

Copyright © 2008 LG Electronics. Inc. All right reserved.

Only for training and service purposes

Figure 3-6. SIM CARD Interface

EOC

CHG_EN

DNI

R305

V_IO

R301

100K

VCHG_IN

VBUS_IN

5.6K

R303

U300 ISL9221

1

VDC

VUSB

_PPR

_CHG

_EN

IMIN

VDC_BYP

USB_BYP

2

3

4

5

6

PGND

BAT

IVDC

GND

IUSB

13

12

11

10

9

8

7

R306

33K

DNI

R307

16K

VBAT

R304

C304

VCHG VBUS

C305

0.1uF0.1uF

C306

0.1uF

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3.9 RF Interface

Locosto features a fully integrated constant-gain direct conversion receiver, i.e. there is no interstage
filter needed and the baseband level at the analogue IQ- interface follows directly the RF input level.

Depending on the baseband ADC dynamic range, single- or multiple-step gain switching schemes are
possible.

An integrated, selfaligning, low-pass filter ensures the receivers to function under blocking and
reference interference conditions and avoids aliasing by baseband sampling. An automatic DC-offset
compensation is implemented and can beswitched depending on the gain setting.

- 29 -

3. HW Circuit Description

LGE Internal Use Only

Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes

Figure 3-9-1. FEM interface

V_EXTH

ANT_SW1
ANT_SW2

C431

1000p

C432

1000p

C433
1000p

LMSP43QC-789TEMPFL400

11

19

VC1

20

VC2

21

VDD

9

GND1

10

GND2

12

GND3

13

GND4

14

GND5

16

GND6

18

GND7

22

GND8

NC2

GSM1900_RX1

ANT

GSM1900_RX2

GSM1800_RX1
GSM1800_RX2

GSM900_RX1
GSM900_RX2

GSM850_RX1
GSM850_RX2

GSM1800_1900_TX

NC1

GSM850_900_TX

23

24

1
2

3
4

5
6

7
8

15
17

Z3X-BOX.COM

- 30 -

3. HW Circuit Description

The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant
envelope GMSK modulation. This configuration allows a very low power design with a reduced
external component count.

The modulation is transferred between baseband- and RF-part of the PMB7880 via a digital interface
signal into the digital modulator. The following Gaussian filter shapes the digital data stream for the
GMSK modulation. Additionally a pre-distortion filter compensates the attenuation of the PLL transfer
function resulting in a very low distortion at the transmit output. The filtered digital data stream is
scaled appropriately and added to the channel word.

This sum is fed into the MASH modulator. The output of the MASH modulator is a sequence of integer
divider values representing the high resolution fractional input signal. This sequence controls the MMD
(multi modulus divider) at a sample rate of 26MHz. Thus a tightly controlled frequency modulation of
the VCO is achieved.

LGE Internal Use Only

Copyright © 2008 LG Electronics. Inc. All right reserved.

Only for training and service purposes

Figure 3-9-2. PAM (Power Amplifier Module) interface

close to DBB

0.5p

C415

3.3nH

L400

0.01u

C407

47R404

DNI

C418

ECCH0003002

C405

C2012JF1A106ZT

10u

C419

DNI

1.5p

C402

47R405

R400

15K

GND814GND9

16

21

P_GND

19

RSVD_GND

VAPC

20

17

VBATT

2

VCC1A6VCC1B

BS

1

DCS_PCS_IN

315

DCS_PCS_OUT

4

EGSM_IN

11

EGSM_OUT

ENABLE

18

GND1

5

7

GND28GND3

GND4

9

10

GND5

GND6

12

13

GND7

C400

SKY77318

U400

68p

C412
180p

C410
15p

47p

C413

C421

0.5p

27p

C423

1.5p

C422

0.5p

C403

C417

1p

1.5p

C414

L410

2.7nH

0.01u

C408

0.01u

VBAT

10nH

L404

C406

R403

10

39p

C409

VDDRF1

18nH

L403

1nH

L401

3.3nH

L411

2.2p

C401

TXLB

TXHB

TX_RAMP

PA_BAND

PA_EN

Z3X-BOX.COM

- 31 -

3. HW Circuit Description

3.10 Audio Interface

3.10.1 Uplink Path

A voice signal is converted to electrical signal with Microphone. The converted electrical voice signal is
amplified and converted to digital signal in ABB(T3031). The converted digital data is encoded to GSM
voice standard in DBB(LOCOSTO).

The audio signals from main microphone goes to MICP and MICN of ABB and the voice signal from
head-set to HSMIC of ABB. The bias voltage for microphone is 2V for main mic. and 1.8V for head-set
mic, which bias voltage is generated in ABB(MICBIAS, V_IO)

LGE Internal Use Only

Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes

Figure 3-10-1 Main Mic interface

MICBIAS

MICIP

MICIN

R214

1K

C221

C223
DNI

L200

100nH

C220

0.1u

C222 22n

22nC224

10u

R225

DNI

C225

DNI

C217

39p

VA205

L201

100nH

0R227

MIC200

1

OUT

2

G1

3

G2

4

G3

5

PWR

6

G4

SPM0204LE5-QB

Z3X-BOX.COM