LG BC808-25LT1G, BC808-40LT1G Service Manual

LG BC808-25LT1G, BC808-40LT1G Service Manual

BC808-25LT1G,

BC808-40LT1G

General Purpose

Transistors

PNP Silicon

Features

These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

 

 

 

 

Collector − Emitter Voltage

VCEO

−25

V

Collector − Base Voltage

VCBO

−30

V

Emitter − Base Voltage

VEBO

−5.0

V

Collector Current − Continuous

IC

−500

mAdc

THERMAL CHARACTERISTICS

 

 

 

Characteristic

Symbol

Max

Unit

 

 

 

 

Total Device Dissipation FR−5 Board,

PD

 

 

(Note 1) TA = 25°C

 

225

mW

Derate above 25°C

 

1.8

mW/°C

 

 

 

 

Thermal Resistance,

RqJA

556

°C/W

Junction−to−Ambient

 

 

 

 

 

 

 

Total Device Dissipation Alumina

PD

 

 

Substrate, (Note 2)

 

 

 

TA = 25°C

 

300

mW

Derate above 25°C

 

2.4

mW/°C

 

 

 

 

Thermal Resistance,

RqJA

417

°C/W

Junction−to−Ambient

 

 

 

 

 

 

 

Junction and Storage Temperature

TJ, Tstg

−55 to +150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

1.FR−5 = 1.0 x 0.75 x 0.062 in.

2.Alumina = 0.4 x 0.3 x 0.024 in 99.5% alumina.

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COLLECTOR

3

1

BASE

2

EMITTER

3

1

2

SOT−23

CASE 318

STYLE 6

MARKING DIAGRAM

5x M G

G

1

5x = Device Code

x = F or G

M = Date Code*

G= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation and/or overbar may vary depending upon manufacturing location.

ORDERING INFORMATION

See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.

Semiconductor Components Industries, LLC, 2009

1

Publication Order Number:

August, 2009 − Rev. 2

 

BC808−25LT1/D

BC808−25LT1G, BC808−40LT1G

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted.)

Characteristic

 

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

Collector−Emitter Breakdown Voltage

 

V(BR)CEO

−25

V

(IC = −10 mA)

 

 

 

 

 

 

Collector−Emitter Breakdown Voltage

 

V(BR)CES

−30

V

(VEB = 0, IC = −10 mA)

 

 

 

 

 

 

Emitter−Base Breakdown Voltage

 

V(BR)EBO

−5.0

V

(IE = −1.0 mA)

 

 

 

 

 

 

Collector Cutoff Current

 

ICBO

 

 

 

nA

(VCB = −20 V)

 

 

−100

(VCB = −20 V, TJ = 150°C)

 

 

−5.0

mA

ON CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

DC Current Gain

 

hFE

 

 

 

(IC = −100 mA, VCE = −1.0 V)

BC808−25

 

160

400

 

 

BC808−40

 

250

600

 

(IC = −500 mA, VCE = −1.0 V)

 

 

40

 

Collector−Emitter Saturation Voltage

 

VCE(sat)

−0.7

V

(IC = −500 mA, IB = −50 mA)

 

 

 

 

 

 

Base−Emitter On Voltage

 

VBE(on)

−1.2

V

(IC = −500 mA, IB = −1.0 V)

 

 

 

 

 

 

SMALL−SIGNAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

Current−Gain − Bandwidth Product

 

fT

100

MHz

(IC = −10 mA, VCE = −5.0 Vdc, f = 100 MHz)

 

 

 

 

 

 

Output Capacitance

 

Cobo

10

−0.7

pF

(VCB = −10 V, f = 1.0 MHz)

 

 

 

 

 

 

ORDERING INFORMATION

Device

Specific Marking

Package

Shipping

BC808−25LT1G

5F

SOT−23

3000/Tape & Reel

 

(Pb−Free)

 

 

 

 

 

 

 

 

BC808−40LT1G

5G

SOT−23

3000/Tape & Reel

 

(Pb−Free)

 

 

 

 

 

 

 

 

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

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