LG 65LB7200-TA, 65LB720T-TA, 65LB729Y-TA Schematic

Internal Use Only
North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com
LED TV
CHASSIS : LB42B
MODEL : 65LB7200/720T/729Y
65LB720/720T/729Y-TA
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL6798520 (1404-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION .............................................................. 12
BLOCK DIAGRAM ................................................................................. 20
EXPLODED VIEW .................................................................................. 21
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental sh orts of the cir cui try that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precau­tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharg­ing wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads elec­trically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective mate­rial to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or cir­cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri­ate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain­ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed when­ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LED TV used LB42B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
ea ch dra wing and spe cificat ion by part n umber in accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance: LGE TV test method followed (2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
No. Item Specication Remarks
1 Market
2 Television system
3 Channel Storage ATV / DTV - 1500EA
4 Receiving system
5 Video Input RCA PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60
6 Component Input Y/Pb/Pr
7 Head phone out
8 HDMI Input HDMI1-DTV, HDMI2-DTV, HDMI3-DTV
9 Audio Input (3EA)
10 SDPIF out (1EA) SPDIF out
11 USB Input For My Media(Movie/Photo/Music List) or For SVC
Asia, Oceania, Africa, Middle East (PAL/DVB Market)
1) Digital TV
- DVB-T(*DVB-T/T2)
2) Analogue TV PAL B/B, PAL B/G, PAL D/K, PAL-I, SECAM B/G, SECAM D/K, NTSC-M
Analog : Upper Heterodyne Digital : COFDM(DVB-T) Only DVB-T Model Digital : COFDM(DVB-T/T2) Only DVB-T2 Model
Antenna, AV1, Component, HDMI1, HDMI2, HDMI3, USB1, USB2, USB3
DVI Audio Component/AV2 AV1
► DVB-T
- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2 (Model : T2 only Model)
- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
PC(HDMI Ver. 1.4) Support HDCP
L/R Input.
Only for training and service purposes
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Component Video Input (Y, Pb, Pr)
No.
1. 720×480 15.73 60.00 SDTV, DVD 480i
2. 720×480 15.63 59.94 SDTV, DVD 480i
3. 720×480 31.47 59.94 480p
4. 720×480 31.50 60.00 480p
5. 720×576 15.625 50.00 SDTV, DVD 625 Line
6. 720×576 31.25 50.00 HDTV 576p
7. 1280×720 45.00 50.00 HDTV 720p
8. 1280×720 44.96 59.94 HDTV 720p
9. 1280×720 45.00 60.00 HDTV 720p
10. 1920×1080 31.25 50.00 HDTV 1080i
11. 1920×1080 33.75 60.00 HDTV 1080i
12. 1920×1080 33.72 59.94 HDTV 1080i
13. 1920×1080 56.250 50 HDTV 1080p
14. 1920×1080 67.5 60 HDTV 1080p
Resolution H-freq(kHz) V-freq(Hz) Pixel clock
Specication
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
6. HDMI Input
6.1. DTV mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
1. 640*480 31.469 / 31.5 59.94/60 SDTV 480P
2. 720*480 31.469 / 31.5 59.94 / 60 SDTV 480P
3. 720*576 31.25 50 SDTV 576P
4. 720*576 15.625 50 SDTV 576I
5. 1280*720 37.500 50 HDTV 720P
6. 1280*720 44.96 / 45 59.94 / 60 HDTV 720P
7. 1920*1080 33.72 / 33.75 59.94 / 60 HDTV 1080I
8. 1920*1080 28.125 50.00 HDTV 1080I
9. 1920*1080 26.97 / 27 23.97 / 24 HDTV 1080P
10. 1920*1080 28.125 25 HDTV 1080P
11. 1920*1080 33.716 / 33.75 29.976 / 30.00 HDTV 1080P
12. 1920*1080 56.250 50 HDTV 1080P
13. 1920*1080 67.43 / 67.5 59.94 / 60 HDTV 1080P
6.2. PC mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
1 640 x 350 @70Hz 31.468 70.09 EGA
2 720 x 400 @70Hz 31.469 70.08 DOS
3 640 x 480 @60Hz 31.469 59.94 VESA(VGA)
4 800 x 600 @60Hz 37.879 60.31 VESA(SVGA)
5 1024 x 768 @60Hz 48.363 60.00 VESA(XGA)
6 1152 x 864 @60Hz 54.348 60.053 VESA
7 1280 x 1024 @60Hz 63.981 60.020 VESA(SXGA)
8 1360 x 768 @60Hz 47.712 60.015 VESA(WXGA)
9 1920 x 1080 @60Hz 67.5 60.00 WUXGA(Reduced Blanking)
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
7. 3D Mode
7.1. HDMI 1.4b (3D supported mode automatically)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) VIC 3D input proposed mode Proposed
1
640*480
2 62.938/63 59.94/ 60 50.35/50.4 1
3 31.469 / 31.5 59.94/ 60 50.35/50.4 1 Side-by-side(Full) (SDTV 480P)
4
720*480
5 62.938/63 59.94 / 60 54/54.06 2,3
6 31.469 / 31.5 59.94 / 60 54/54.06 2,3 Side-by-side(Full) (SDTV 480P)
7
720*576
8 62.5 50 54 17,18
9 31.25 50 54 17,18 Side-by-side(Full) (SDTV 576P)
10
11 75 50 148.5 19
12 37.500 50 148.5 19 Side-by-side(Full) (HDTV 720P)
1280*720
13 44.96 / 45 59.94 / 60 74.18/74.25 4
14 89.91/90 59.94 / 60 148.35/148.5 4
15 44.96 / 45 59.94 / 60 148.35/148.5 4 Side-by-side(Full) (HDTV 720P)
16
17 67.432 / 67.50 59.94 / 60 148.35/148.5 5
18 33.72 / 33.75 59.94 / 60 148.35/148.5 5 Side-by-side(Full) (HDTV 1080I)
19 28.125 50.00 74.25 20
20 56.25 50.00 148.5 20
21 28.125 50.00 148.5 20 Side-by-side(Full) (HDTV 1080I)
22 26.97 / 27 23.97 / 24 74.18/74.25 32
23 43.94/54 23.97 / 24 148.35/148.5 32
1920*1080
24 26.97 / 27 23.97 / 24 148.35/148.5 32 Side-by-side(Full) (HDTV 1080P)
25 28.125 25 74.25 33
26 56.24 25 148.5 33
27 28.12 25 148.5 33 Side-by-side(Full) (HDTV 1080P)
28 33.716 / 33.75 29.976 / 30.00 74.18/74.25 34
29 67.432 / 67.5 29.976 / 30.00 148.35/148.5 34
30 33.716 / 33.75 29.976 / 30.00 148.35/148.5 34 Side-by-side(Full) (HDTV 1080P)
31 56.250 50 148.5 31
32 67.43 / 67.5 59.94 / 60 148.35/148.50 16
31.469 / 31.5 59.94/ 60 25.125 1
31.469 / 31.5 59.94 / 60 27.00/27.03 2,3
31.25 50 27 17,18
37.5 50 74.25 19
33.72 / 33.75 59.94 / 60 74.18/74.25 5
Top-and-Bottom Side-by-side(half)
Frame packing Line alternative
Top-and-Bottom Side-by-side(half)
Frame packing Line alternative
Top-and-Bottom Side-by-side(half)
Frame packing Line alternative
Top-and-Bottom Side-by-side(half)
Frame packing Line alternative
Top-and-Bottom Side-by-side(half)
Frame packing Line alternative
Top-and-Bottom Side-by-side(half)
Frame packing Field alternative
Top-and-Bottom Side-by-side(half)
Frame packing Field alternative
Top-and-Bottom Side-by-side(half)
Frame packing Line alternative
Top-and-Bottom Side-by-side(half)
Frame packing Line alternative
Top-and-Bottom Side-by-side(half)
Frame packing Line alternative
Top-and-Bottom Side-by-side(half)
Top-and-Bottom Side-by-side(half)
Secondary(SDTV 480P) Secondary(SDTV 480P)
Secondary(SDTV 480P) (SDTV 480P)
Secondary(SDTV 480P) Secondary(SDTV 480P)
Secondary(SDTV 480P) (SDTV 480P)
Secondary(SDTV 576P) Secondary(SDTV 576P)
Secondary(SDTV 576P) (SDTV 576P)
Primary(HDTV 720P) Primary(HDTV 720P)
Primary(HDTV 720P) (HDTV 720P)
Primary(HDTV 720P) Primary(HDTV 720P)
Primary(HDTV 720P) (HDTV 720P)
Secondary(HDTV 1080I) Primary(HDTV 1080I)
Primary(HDTV 1080I) (HDTV 1080I)
Secondary(HDTV 1080I) Primary(HDTV 1080I)
Primary(HDTV 1080I) (HDTV 1080I)
Primary(HDTV 1080P) Primary(HDTV 1080P)
Primary(HDTV 1080P) (HDTV 1080P)
Secondary(HDTV 1080P) Secondary(HDTV 1080P)
Secondary(HDTV 1080P) (HDTV 1080P)
Primary(HDTV 1080P) Secondary(HDTV 1080P)
Primary(HDTV 1080P) (HDTV 1080P)
Primary(HDTV 1080P) Secondary(HDTV 1080P)
Primary(HDTV 1080P) Secondary(HDTV 1080P)
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
7.2. HDMI Input(1.3)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed 3D input proposed mode
1 720*480 31.5 60 27.03 SDTV 480P
2 720*576 31.25 50 27 SDTV 576P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 37.500 50 74.25 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I
6 1920*1080 28.125 50.00 74.25 HDTV 1080I
7 1920*1080 27.00 24.00 74.25 HDTV 1080P
8 1920*1080 28.12 25 74.25 HDTV 1080P
9 1920*1080 33.75 30.00 74.25 HDTV 1080P
10 1920*1080 67.50 60.00 148.5 HDTV 1080P
11 1920*1080 56.250 50 148.5 HDTV 1080P
2D to 3D, Side by Side(Half), Top & Bot­tom, Checker Board, Frame Sequential, Row Interleaving, Column Interleaving
2D to 3D, Side by Side(Half), Top & Bot­tom
2D to 3D, Side by Side(Half), Top & Bot­tom, Checker Board, Row Interleaving, Column Interleaving
2D to 3D, Side by Side(Half), Top & Bottom, Checker Board, Single Frame Sequential, Row Interleaving, Column Interleaving
7.3. RF Input(3D supported mode manually)
No. Resolution Proposed 3D input proposed mode
1 HD
2 SD
3 SD (ATV : CVBS / SCART) -
1080I
720P
576P
576I
2D to 3D Side by Side(Half) Top & Bottom
7.4. RF Input (3D supported mode automatically)
No. Signal 3D input proposed mode
1 Frame Compatible Side by Side(Half), Top & Bottom
7.5. USB, DLNA (Movie) Input (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 Under 704x480 - - - 2D to 3D
Over 704x480
2
interlaced
Over 704x480
3
progressive
Over 704x480
4
progressive
- - - 2D to 3D, Side by Side(Half), Top & Bottom
- 50 / 60 -
- others -
2D to 3D, Side by Side(Half), Top & Bottom, Checker Board, Row Interleaving, Column Interleaving, Frame Sequential
2D to 3D, Side by Side(Half), Top & Bottom, Checker Board, Row Interleaving, Column Interleaving
7.6. USB, DLNA (Photo) Input (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 Under 320x240 - - - 2D to 3D
2 Over 320x240 - - - 2D to 3D, Side by Side(Half), Top & Bottom
Only for training and service purposes
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* USB, DNLA Input (3D supported mode automatically)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 1080P 33.75 30 -
Side by Side(Half), Top & Bottom, Checker Board, MPO(Photo), JPS(Photo)
7.7. HDMI-PC Input (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1024*768 48.36 60 65
2 1360*768 47.71 60 85.5
3 1920*1080 67.500 60 148.50
4 Others - - -
2D to 3D, Side by Side(half) Top & Bottom
2D to 3D, Side by Side(half), Top & Bottom, Checker Board, Single Frame Sequential, Row Interleaving, Column Interleaving
2D to 3D, Side by Side(half) Top & Bottom
HDTV 768P
HDTV 1080P
640*350 720*400 640*480 800*600 1152*864
7.8. Component Input(3D) (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock Proposed 3D input proposed mode
1 1280*720 45.00 60.00 74.25 HDTV 720P
2 1280*720 37.500 50 74.25 HDTV 720P
3 1920*1080 33.75 60.00 74.25 HDTV 1080I
4 1920*1080 28.125 50.00 74.25 HDTV 1080I
5 1920*1080 27.00 24.00 74.25 HDTV 1080P
6 1920*1080 28.12 25 74.25 HDTV 1080P
7 1920*1080 33.75 30.00 74.25 HDTV 1080P
8 1920*1080 67.50 60.00 148.5 HDTV 1080P
9 1920*1080 56.250 50 148.5 HDTV 1080P
10 Others - - - SDTV
2D to 3D, Side by Side(Half), Top & Bottom
7.9. Miracast, Widi (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 1024X768p - 30 / 60 -
2D to 3D, Side by Side(Half), Top & Bottom2. 1280x720p - 30 / 60 -
3 1920X1080p 30 / 60
4 Others - 2D to 3D
7.10. 3D Input mode
No. Side by Side Top & Bottom Checker board
1
ii.
Only for training and service purposes
iii.
iv.
- 11 -
Single Frame
Sequential
Frame
Packing
v.
vi.
2D to 3D
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with LB42B chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation. (4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz. (5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it should be placed in the circumstance of above 15 °C for 2 hours.
In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.
[Caution] When still image is displayed for a period of 20 minutes or longer (Especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area.
3.2. LAN Inspection
3.2.1. Equipment & Condition
▪ Each other connection to LAN Port of IP Hub and Jig
3.2.2. LAN inspection solution
▪ LAN Port connection with PCB ▪ Setting automatic IP
▪ If you want manual connection, enter Network connection at
MENU Mode of TV. Press Start connection key, then Network will be connected.
3. Automatic Adjustment
3.1. MAC address D/L, CI+ key D/L, Widevine key D/L, ESN D/L, HDCP14/20 D/L
Connect: USB port Communication Prot connection
▪ Com 1,2,3,4 and 115200(Baudrate)
Mode check: Online Only
▪ Check the test process: DETECT → MAC → CI → Widevine
→ ESN → HDCP14 → HDCP20 ▪ Play: Press Enter key ▪ Result: Ready, Test, OK or NG ▪ Printer Out (MAC Address Label)
3.2.3. WIDEVINE key Inspection
- Confirm key input data at the "IN START" MENU Mode.
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
3.3. LAN PORT INSPECTION(PING TEST)
Connect SET → LAN port == PC → LAN Port
SET PC
3.3.1. Equipment setting
(1) Play the LAN Port Test PROGRAM. (2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
3.3.2. LAN PORT inspection(PING TEST)
(1) Play the LAN Port Test Program. (2) Connect each other LAN Port Jack. (3) Play Test (F9) button and confirm OK Message. (4) Remove LAN cable.
3.4. Model name & Serial number Download
3.4.1. Model name & Serial number D/L
Press "P-ONLY" key of service remote control.
(Baud rate : 115200 bps)
Connect RS-232C Signal to USB Cable to USB. Write Serial number by use USB port. Must check the serial number at Instart menu.
3.4.2. Method & notice
(1) Serial number D/L is using of scan equipment. (2) Setting of scan equipment operated by Manufacturing
Technology Group.
(3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory by D-book 4.0.
* Manual Download (Model Name and Serial Number)
If the TV set is downloaded by OTA or service man, sometimes
model name or serial number is initialized.(Not always)
It is impossible to download by bar code scan, so It need
Manual download.
1) Press the "Instart" key of Adjustment remote control.
2) Go to the menu "7.Model Number D/L" like below photo.
3) Input the Factory model name(ex 47LB650V-ZA) or Serial number like photo.
3.5. CI+ Key checking method
- Check the Section 3.1 Check whether the key was downloaded or not at ‘In Start’ menu. (Refer to below).
=> Check the Download to CI+ Key value in LGset.
3.5.1. Check the method of CI+ Key value
(1) Check the method on Instart menu (2) Check the method of RS232C Command
1) Into the main ass’y mode(RS232: aa 00 00)
CMD 1 CMD 2 Data 0
A A 0 0
2) Check the key download for transmitted command (RS232: ci 00 10)
CMD 1 CMD 2 Data 0
C I 1 0
3) Result value
- Normally status for download : OKx
- Abnormally status for download : NGx
3.5.2. Check the method of CI+ key value(RS232)
1) Into the main ass’y mode(RS232: aa 00 00)
CMD 1 CMD 2 Data 0
A A 0 0
2) Check the mothed of CI+ key by command (RS232: ci 00 20)
CMD 1 CMD 2 Data 0
C I 2 0
3) Result value i 01 OK 1d1852d21c1ed5dcx
CI+ Key Value
3.6. WIFI MAC ADDRESS CHECK
(1) Using RS232 Command
H-freq(kHz) V-freq.(Hz)
Transmission [A][I][][Set ID][][20][Cr] [O][K][X] or [NG]
(2) Check the menu on in-start
4) Check the model name Instart menu. → Factory name
displayed. (ex 47LB650V-ZA)
5) Check the Diagnostics.(DTV country only) → Buyer
model displayed. (ex 47LB650V-ZA)
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4. Manual Adjustment
* ADC adjustment is not needed because of OTP(Auto ADC
adjustment)
4.1. EDID DATA
4.1.1. 3D EDID
▪ Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by S/W or Input mode.
Product ID
HEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
Serial No: Controlled on production line. Month, Year: Controlled on production line:
ex) Monthly : ‘01’ → ‘01’
Year : ‘2014’ → ‘18’
Model Name(Hex): LGTV
Chassis MODEL NAME(HEX)
LB42B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Checksum(LG TV): Changeable by total EDID data.
2 2
1
HDMI1 E7 85 CC X
HDMI2 E7 75 BC X
HDMI3 E7 65 AC X
10bit
/none XvYcc
8bit
/none XvYcc
Vendor Specific(HDMI)
1) Deep color (module 10bit)
INPUT MODEL NAME(HEX)
HDMI1 78 03 0C 00 10 00 B8 2D 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
HDMI2 78 03 0C 00 20 00 B8 2D 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
HDMI3 78 03 0C 00 30 00 B8 2D 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
3
4.1.2. 2D EDID
▪ Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by S/W or Input mode.
Product ID
HEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
Serial No: Controlled on production line. Month, Year: Controlled on production line:
ex) Monthly : ‘01’ → ‘01’
Year : ‘2014’ → ‘18'
Model Name(Hex): LGTV
Chassis MODEL NAME(HEX)
LB42B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Checksum(LG TV): Changeable by total EDID data.
1 2 3
HDMI1 42 1B X
HDMI2 42 0B X
HDMI3 42 FB X
Vendor Specific(HDMI)
INPUT MODEL NAME(HEX)
HDMI1 67 03 0C 00 10 00 80 1E
HDMI2 67 03 0C 00 20 00 80 1E
HDMI3 67 03 0C 00 30 00 80 1E
2) None deep color (module 8bit)
INPUT MODEL NAME(HEX)
HDMI1 78 03 0C 00 10 00 80 1E 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
HDMI2 78 03 0C 00 20 00 80 1E 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
HDMI3 78 03 0C 00 30 00 80 1E 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
Colorimetry Data Block(HDMI)
1) The Model not supporting XvYcc
INPUT MODEL NAME(HEX)
HDMI1 E3 05 00 00
HDMI2 E3 05 00 00
HDMI3 E3 05 00 00
Only for training and service purposes
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.2. White Balance Adjustment
4.2.1. Overview
▪ W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel's W/B deviation (2) How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.
(3) Adjustment condition : normal temperature
1) Surrounding Temperature : 25 °C ± 5 °C
2) Surrounding Humidity : 20 % ~ 80 %
4.2.2. Equipment
(1) Color Analyzer: CA-210 (LED Module : CH 14) (2) Adjustment Computer(During auto adj., RS-232C protocol
is needed) (3) Adjustment Remote control (4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
→ Only when internal pattern is not available
▪ Color Analyzer Matrix should be calibrated using CS-1000.
4.2.3. Equipment connection MAP
Col or Analy zer
Pro be
USB t o RS-23 2C
Sig nal Sou rce
* If TV internal pattern is used, not needed
4.2.4. Adj. Command (Protocol)
<Command Format>
START 6E A 50 A LEN A 03 A CMD A 00 A VAL A CS STOP
- LEN: Number of Data Byte to be sent
- CMD: Command
- VAL: FOS Data value
- CS: Checksum of sent data
- A: Acknowledge Ex) [Send: JA_00_DD] / [Ack: A_00_okDDX]
▪ RS-232C Command used during auto-adjustment.
RS-232C COMMAND
[CMD ID DATA]
wb 00 00 Begin White Balance adjustment
wb 00 10 Gain adjustment(internal white pattern)
wb 00 1f Gain adjustment completed
wb 00 20 Offset adjustment(internal white pattern)
wb 00 2f Offset adjustment completed
wb 00 ff
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj. ja 00 ff -> Adj. data
jb 00 c0 ... ...
wb 00 1f → Gain adj. completed *(wb 00 20(Start), wb 00 2f(end)) → Off-set adj. wb 00 ff → End white balance auto-adj.
End White Balance adjustment (internal pattern disappears )
RS- 232C
Com puter
RS- 232C
* Pat tern Ge nerat or
Explanation
▪ Adj. Map
Applied Model : LB42B Chassis ALL MODELS
Cool
Medium
Warm
Adj. item
R Gain j g 00 C0 G Gain j h 00 C0 B Gain j i 00 C0 R Cut G Cut B Cut R Gain j a 00 C0 G Gain j b 00 C0 B Gain j c 00 C0 R Cut G Cut B Cut R Gain j d 00 C0 G Gain j e 00 C0 B Gain j f 00 C0 R Cut
G Cut
Command
(lower caseASCII) CMD1 CMD2 MIN MAX
Data Range
(Hex.)
4.2.5. Adj. method
(1) Auto adj. method
1) Set TV in adj. mode using P-Only key.
2) Zero calibrate probe then place it on the center of the Display.
3) Connect Cable.(RS-232C to USB)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sign), check adj. status pre mode. (Cool, Medium, Warm)
6) Remove probe and RS-232C cable to complete adj.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
(2) Manual adjustment. method
1) Set TV in Adj. mode using P-Only key.
2) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10 cm of the surface.
3) Press ADJ key → EZ adjust using adj. R/C → 7. White­Balance then press the cursor to the right(key ►).
(When right key(►) is pressed 204 Gray internal pattern
will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at 192, and the rest will be lowered to meet the desired value.
5) Adjustment is performed in COOL, MEDIUM, WARM 3
modes of color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 7.White Balance, you can select one of 2 Test­pattern: ON, OFF. Default is inner(ON). By selecting OFF, you can adjust using RF signal in 204 Gray pattern.
▪ Adjustment condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to isolate adj. area into dark surrounding.
2) Probe location
: Color Analyzer(CA-210) probe should be within 10 cm
and perpendicular of the module surface (80° ~ 100°)
Default
(Decimal)
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.2.6. Reference (White balance Adj. coordinate and color temperature)
▪ Luminance : 204 Gray ▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode
Coordinate
x y
Temp ∆uv
Cool 0.271 0.270 13000 K 0.0000
Medium 0.286 0.289 9300 K 0.0000
Warm 0.313 0.329 6500 K 0.0000
▪ Standard color coordinate and temperature using CA-210(CH 14)
Mode
Coordinate
x y
Temp ∆uv
Cool 0.271 ± 0.002 0.270 ± 0.002 13000 K 0.0000
Medium 0.286 ± 0.002 0.289 ± 0.002 9300 K 0.0000
Warm 0.313 ± 0.002 0.329 ± 0.002 6500K 0.0000
4.2.7. LED White balance table
- EDGE LED module change color coordinate because of aging time.
- Apply under the color coordinate table, for compensated aging time.
Only march to December & Global Model: (normal line)LGD (LB5xxx, LB6xxx, LB7xxx, LB8xxx)
NC4.0
Aging
time
(Min)
1 0-2 282 289 297 308 324 348 2 3-5 281 287 296 306 323 346 3 6-9 279 284 294 303 321 333 4 10-19 277 280 292 299 319 339 5 20-35 275 277 290 296 317 336 6 36-49 274 274 289 293 316 333 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329
Only January to Febuary & Global Model: (normal line)LGD (LB5xxx, LB6xxx, LB7xxx, LB8xxx)
NC4.0
Aging
time
(Min)
1 0-5 286 295 301 314 328 354 2 6-10 284 290 299 309 326 349 3 11-20 282 287 297 306 324 346 4 21-30 279 283 294 302 321 342 5 31-40 276 278 291 297 318 337 6 41-50 274 275 289 294 316 334 7 51-80 273 272 288 291 315 331 8 81-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329
Cool Medium Warm
x y x y x y
271 270 286 289 313 329
Cool Medium Warm
x y x y x y
271 270 286 289 313 329
AUO, INX, Sharp, CSOT, BOE (Cool : 13000 K)
NC4.0
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
Cool Medium Warm
x y x y x y
4.3. Local Dimming Function Check
(1) Normal Edge LED Model
Step 1) Turn on TV. Step 2) Press “TILT” key on the Adj. Remote control. Step 3) A t the Local D im mi ng mo de , module Edge
Backlight moving right to left Back light of IOP
module moving. Step 4) Confirm the Local Dimming mode. Step 5) Press "exit" key.
(2) Only 50inch AUO Local dimming Model(50LA66)
- Test method
Insert the USB memo ry included vide o fi le below inspection pattern in Poweronly mode. Play repeat first, second pattern once per second
(3) Only LA71 Series LGD Local Dimming Model (47/55LA71,
16 block) Step 1) Turn on TV Step 2) Press “TILT” key on the Adj. R/C. Step 3) A t the Local D im mi ng mo de , module Edge
Backlight moving left to right, bottom to Up, Back
light of ALEF module moving. (No1->2->3->….->14
->15->16)
Step 4) Confirm the Local Dimming mode Step 5) Press “exit” Key
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.4. Magic Motion Remote control test
- Results are automatically marked in Instart OSD after through the AP/Magic Remocon Equipment on the line
4.5. 3D function test(Except Non-3D product)
(Pattern Generator MSHG-600, MSPG-6100[Support HDMI1.4]) * HDMI mode NO. 872 , pattern No.83 (1) Please input 3D test pattern like below.
4.6. Wi-Fi Test
Step 1) Turn on TV Step 2) Select Wi-Fi Connection option in Network Menu.
Step 3) Click Off Button to On in Wi-Fi Connection.
Step 4) The system finds any AP like blow PIC.
(2) When 3D OSD appear automatically, then select OK key.
(3) Don't wear a 3D Glasses, check the picture like below.
Only for training and service purposes
- 17 -
Step 5) Select the AP you want to connect.
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.7. LNB voltage and 22KHz tone check
(only for DVB-S/S2 model)
▪ Test method
(1) Set TV in Adj. mode using POWER ON. (2) Connect cable between satellite ANT and test JIG. (3) Press Yellow key(ETC+SWAP) in Adj Remote control to
make LNB on. (4) Check LED light ‘ON’ at 18 V menu. (5) Check LED light ‘ON’ at 22 KHz tone menu. (6) Press Blue key(ETC+PIP INPUT) in Adj Remote control
to make LNB off. (7) Check LED light ‘OFF’ at 18 V menu. (8) Check LED light ‘OFF’ at 22 KHz tone menu.
▪ Test result
(1) After press LNB On key, ‘18 V LED’ and ‘22 KHz tone
LED’ should be ON.
(2) After press LNB OFF key, ‘18 V LED’ and ‘22 KHz tone
LED’ should be OFF.
7. GND and Internal Pressure check
7.1. Method
(1) GND & Internal Pressure auto-check preparation
- Check that Power cord is fully inserted to the SET. (If loose, re-insert)
(2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically. (Remove CORD, A/V form AV JACK BOX.)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the pallet to move on to next process.
4.8. Option selection per country
4.8.1. Overview
- Option selection is only done for models in Non-EU
4.8.2. Method
(1) Press ADJ key on the Adj. R/C, then select Country Group
Meun.
(2) Select Country Group Code 04 or Country Group EU.
5. Tool Option selection
▪ Method : Press "ADJ" key on the Adjustment remote control,
then select Tool option.
6. Ship-out mode check(In-stop)
▪ After final inspection, press "IN-STOP" key of the Adjustment
remote control and check that the unit goes to Stand-by mode.
7.2. Checkpoint
▪ TEST voltage
(1) DQA Test
- GND: 1.5 KV / min at 100 mA
- SIGNAL: 3 KV / min at 100 mA
(2) Mass Production Line Test
- GND: AC 1.5 KV / sec, Cut off current not exceed 100 mA
▪ TEST time: DQA 1 min, Mass Production Line 1 sec ▪ TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &
NEUTRAL
▪ LEAKAGE CURRENT: At 0.5 mArms
8. Audio
Measurement condition:
No. Item Min Typ Max Unit Remark
Audio practical max Output, L/R
1.
(Distortion=10%
max Output)
Speaker (8Ω
2. Impedance)
(1) RF input: Mono, 1 KHz sine wave signal, 100 % Modulation (2) CVBS, Component: 1 KHz sine wave signal 0.5 Vrms (3) RGB PC: 1 KHz sine wave signal 0.7 Vrms
9 10 12 W
8.10 10.8 Vrms
9 10 12 W
EQ Off AVL Off Clear Voice Off
Only for training and service purposes
- 18 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
9. USB S/W Download(Service only)
(1) Put the USB Stick to the USB socket. (2) Go to General menu then enter to About This TV.
(3) Enter the USB EXPERT MODE.
(4) Updating is starting. (5) Updating completed, the TV will restart automatically (6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number)
Only for training and service purposes
- 19 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
BLOCK DIAGRAM
IR
KEY
I2C(EYE)
eMMC
(4/8GB)
(256Kb)
(512MB X 2EA)
DDR3 1600 X 16
(512MB X 2EA)
DDR3 1600 X 16
X_TAL
24MHz
SYSTEM EEPROM
PM
50P
41P
51P
I2C 5
A B
P_TS P_TS
Analog Demod
Digital Demod(T/C)
P_TS
IF (+/-)
EPI
LVDS
USB 2.0
OCP
1.5A
NTP
Audio AMP
LOCAL DIMMING
IC
50P
I2C 2
I2C 1
I2C 2
I2S Out
M14
IC101
HDMI / MHL Rx.
HDMI Rx.
1A
OCP
WIFI
BLUTOOTH
USB_WIFI
UART_BT
TI
AMP
IR / KEY/EYE
CVBS/YPbPr
CVBS/RGB
SPDIF OUT
Sub Micom
PWM
LOGO LIGHT
I2C 3
ETHERNET
PHY
LAN
X_TAL
X_TAL
(RENESAS
25MHz
32.768KHz
R5F1000G)
IF
Si2158B
DVB T/C TUNER
ATV /
DVB-T/C
Only for training and service purposes
USB1(2.0)
Tuner : I2C 6
D-Demod : I2C 4
AIF
SID
TS_ [0:7]
USB2(2.0)
E
HDMI1
USB3(2.0)
SID
AIF
DIF
SI2169B
(MHL)
HDMI2
(ARC)
HDMI3
H/P (Line Out)
E
SCART
AV/COMP
(IR Bla Ready)
REA
TS_ [0:7]
DIF
SI2169B
LAN
OPTIC
R
IQ
DVB T2/C TUNER
Si2158B
ATV /
DVB-T/C
REA
DVB T2/C/S2 TUNER
R
(H)
- 20 -
RDA
5815M
Si2158B
ATV /
DVB-S
DVB-T/C
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
400
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these sp ecial safet y parts shoul d be replac ed with the same compon ents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
410
900
500
570
310
120
800
521
LV2
540
LV1
530
122
820
300
AT1
AG1
A10
A22
Set + Stand
200
Only for training and service purposes
- 21 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
System Configuration
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
Clock for M14-A0
MAIN Clock(24Mhz)
LOADCAP_ATSC_PCB
10pF
C101
C102 LOADCAP_ATSC_PCB
System Clock for Analog block(24Mhz)
PLL SET[1:0] : internal pull up "00" : CPU(1200Mhz),M0 / M1 DDR(792,792 Mhz) "01" : CPU(1056Mhz),M0 / M1 DDR(672,672 Mhz) "10" : CPU(1056Mhz),M0 / M1 DDR(792,792 Mhz) "11" : CPU( 960Mhz),M0 / M1 DDR(792,792 Mhz)
OP MODE[1:0] "00" : Normal Mode "01/10/11" : Internal Test mode
+3.3V_NORMAL
R101 3.3K
R102 3.3K
Extenal test only
+3.3V_NORMAL
+3.3V_TUNER
R148
3.3K
R146
3.3K
KR_PIP_NOT
KR_PIP_NOT
1.5K
1.5K
KR_PIP
R146-*1
KR_PIP
R148-*1
10pF
Extenal test only
OPT
OPT
R149
2
3
OPT
R103 3.3K
R104 3.3K
OPT
3.3K
X-TAL_1
GND_1
1
4
X-TAL_2
GND_2
OPM1
OPM0
24MHz
X101
R118
PLLSET1
PLLSET0
+3.3V_TUNER
R150
3.3K
R155
1.2K
KR_PIP_NOT
KR_PIP_NOT
3.3K
KR_PIP
KR_PIP
R155-*1
1M
R180 560
LOADCAP_DVB_PCB
C101-*1
6.8pF 50V
+3.3V_NORMAL
INSTANT boot MODE "1 : Instant boot "0 : normal
3.3K
R121
(internal pull down)
OPT
INSTANT_MODE0
+3.3V_NORMAL
R158
R157
R156
3.3K
R156-*1
3.3K
1.2K
XTAL_IN
XTAL_OUT
LOADCAP_DVB_PCB
C102-*1
6.8pF 50V
INSTANT_BOOT
I2C PULL UP
R159
3.3K
3.3K
R160
3.3K
R161
+3.3V_NORMAL
3.3K
R127
OPT
3.3K
R128
BOOT_MODE0
I2C
I2C_1 : AMP I2C_2 : T-CON,L/DIMING I2C_3 : MICOM I2C_4 : S/Demod,T2/Demod, LNB I2C_5 : NVRAM I2C_6 : TUNER_MOPLL(T/C,ATV)
R162
3.3K
3.3K
IC103
AT24C256C-SSHL-T
A0
1
A1
2
A2
3
GND
4
NVRAM_ATMEL
BOOT MODE "0 : EMMC "1 : TEST MODE
BOOT_MODE
I2C_SDA1 I2C_SCL1 I2C_SDA_MICOM_SOC I2C_SCL_MICOM_SOC I2C_SDA2 I2C_SCL2
I2C_SDA4 I2C_SCL4
I2C_SDA5 I2C_SCL5
I2C_SDA6 I2C_SCL6
NVRAM
VCC
8
WP
7
SCL
6
SDA
5
+3.3V_NORMAL
C107
0.1uF 16V
Write Protection
- Low : Normal Operation
- High : Write Protection
R143 33
R144 33
IC103-*1
M24256-BRMN6TP
E0
VCC
1
8
WC
E1
7
2
SCL
E2
6
3
SDA
VSS
5
4
NVRAM_ST
I2C_SCL5
I2C_SDA5
I2C_SCL_MICOM_SOC I2C_SDA_MICOM_SOC
LOCAL DIMMING I2C CONTROL
+3.3V_NORMAL
OPT
OPT
R105
3.3K
R106
3.3K
LED_SCL LED_SDA
SOC_RESET
FORCED_JTAG_0
P102
12507WS-04L
1
2
3
4
5
+3.3V_NORMAL
R163 10K
OPT
C104
0.1uF 16V
L/DIM0_VS
L/DIM0_SCLK
L/DIM0_MOSI
IRB_SPI_MOSI/TDO1 IRB_SPI_MISO/TDI1
M_REMOTE_RX M_REMOTE_TX
1/16W
33
AR100
I2C_SCL4 I2C_SDA4
I2C_SCL6 I2C_SDA6
PWM_DIM2
PWM_DIM
EMMC_CLK EMMC_CMD EMMC_RST
EMMC_DATA[0-7]
OPT
XTAL_IN
XTAL_OUT
BOOT_MODE
PLLSET0 PLLSET1
TCK0 TDI0
TRST_N1 IRB_SPI_SS/TMS1 IRB_SPI_CK/TCK1
I2C_SCL1 I2C_SDA1
I2C_SCL2 I2C_SDA2
I2C_SCL5 I2C_SDA5
33
R107
33
R108
OPM0 OPM1
R178 33
OPT
R182 10K
R183 10K R184 10K
R185 10K
SOC_RX
SOC_TX
EMMC_DATA[7] EMMC_DATA[6] EMMC_DATA[5] EMMC_DATA[4] EMMC_DATA[3] EMMC_DATA[2] EMMC_DATA[1] EMMC_DATA[0]
12505WS-10A00
JTAG_CPU
B23 A23
R169
AG21
33
AJ18
AB8 AC8
AD8 AE8
AR101
AG30 AG28 AG29 AH29 AJ27 AH27 AG26 AH26
AJ12 AJ13 AH12 AG12
AH23 AG22
AH11 AG11
AG10
AH22 AJ22 AH10 AJ10 AG23 AH24
Y7 Y6 W7 W6 W5
AH7 AJ7
AG8 AH8
AH9 AG9
AJ9
AC6 AC7 AD7 AB7
G32 G33 G31 D31 F33 F32 E32 F31 D33 D32 E31
33
R179 10K
1/16W 5%
Jtag-0 I/F
+3.3V_NORMAL
P103
1
2
3
4
5
6
7
8
9
10
11
IC101
LG1311
XIN_MAIN XO_MAIN
PORES_N
BOOT_MODE
PLLSET0 PLLSET1
OPM0 OPM1
L_VSOUT_LD/TRST0_N DIM0_SCLK/TMS0 DIM1_SCLK/TCK0 DIM1_MOSI/TDI0 DIM0_MOSI/TDO0
SPI_CS0 SPI_SCLK0 SPI_DO0 SPI_DI0/TRST1_N SPI_CS1/TMS1 SPI_SCLK1/TCK1 SPI_DO1/TDO1 SPI_DI1/TDI1
EXT_INTR0 EXT_INTR1 EXT_INTR2 EXT_INTR3
UART0_RXD UART0_TXD UART1_RXD UART1_TXD
UART1_RTS_N UART1_CTS_N
SCL0 SDA0 SCL1 SDA1 SCL2 SDA2 SCL3 SDA3 SCL4 SDA4 SCL5 SDA5
PWM0 PWM1 PWM2 PWM_IN
EMMC_CLK EMMC_CMD EMMC_RESETN EMMC_DATA7 EMMC_DATA6 EMMC_DATA5 EMMC_DATA4 EMMC_DATA3 EMMC_DATA2 EMMC_DATA1 EMMC_DATA0
USB2_0_DP0 USB2_0_DM0
USB2_0_TXRTUNE
USB2_1_DP0 USB2_1_DM0
USB2_1_TXRTUNE
USB3_DP0
USB3_DM0 USB3_TXP0 USB3_TXM0 USB3_RXP0 USB3_RXM0
USB3_RESREF0
USB3_DP1
USB3_DM1 USB3_TXP1 USB3_TXM1 USB3_RXP1 USB3_RXM1
USB3_RESREF1
HUB_PORT_OVER0 HUB_VBUS_CTRL0
EB_CS3 EB_CS2 EB_CS1 EB_CS0
EB_WE_N EB_OE_N
EB_WAIT EB_BE_N1 EB_BE_N0
CAM_CD1_N CAM_CD2_N CAM_CE1_N CAM_CE2_N
CAM_IREQ_N
CAM_RESET
CAM_INPACK_N
CAM_VCCEN_N
CAM_WAIT_N
CAM_REG_N
EB_ADDR0 EB_ADDR1 EB_ADDR2 EB_ADDR3 EB_ADDR4 EB_ADDR5 EB_ADDR6 EB_ADDR7 EB_ADDR8 EB_ADDR9
EB_ADDR10 EB_ADDR11 EB_ADDR12 EB_ADDR13 EB_ADDR14 EB_ADDR15
EB_DATA0 EB_DATA1 EB_DATA2 EB_DATA3 EB_DATA4 EB_DATA5 EB_DATA6 EB_DATA7
L/DIM0_VS
TDI0
L/DIM0_MOSI
L/DIM0_SCLK
TCK0
SOC_RESET
FORCED_JTAG_0
AN9 AM9 AN8
H32 J31 H33
N31 N32 P33 P32 M32 M33 P31
K33 K32 L32 L31 K31 J32 M31
W28 W29
H28 J30 J28 J29
G30 F30 H29 G29 G28
P28 P27 U28 R29 V27 T28 T29 R28 U27 N29
K30 E30 M30 N28 M28 M29 L29 K29 K28 L28 D30
EB_ADDR[10]
F29
EB_ADDR[11]
C32
EB_ADDR[12]
C33
EB_ADDR[13]
C31
EB_ADDR[14]
B33
B32 A32 B31 A31 A30 B30 C30 C29
(TRST0_N)
(TDO0)
(TMS0)
R1712001%
R1722001%
R1732001%
R1742001%
/USB_OCD1
/USB_OCD2 /USB_OCD3
EB_BE_N1 EB_BE_N0
CAM_CD1_N CAM_CD2_N
CAM_IREQ_N CAM_INPACK_N CAM_WAIT_N
EB_ADDR[0] EB_ADDR[1] EB_ADDR[2] EB_ADDR[3] EB_ADDR[4] EB_ADDR[5] EB_ADDR[6] EB_ADDR[7] EB_ADDR[8] EB_ADDR[9]
EB_DATA[0] EB_DATA[1] EB_DATA[2] EB_DATA[3] EB_DATA[4] EB_DATA[5] EB_DATA[6] EB_DATA[7]
12505WS-10A00
WIFI_DP WIFI_DM
USB_DP3 USB_DM3
USB_DP1 USB_DM1
USB_DP2 USB_DM2
USB_CTL1
USB_CTL2 USB_CTL3 EB_WE_N
EB_OE_N
/PCM_CE1 /PCM_CE2
PCM_RESET PCM_5V_CTL CAM_REG_N
Jtag-1 I/F
+3.3V_NORMAL
P104
OPT
1
2
3
4
5
6
7
8
9
10
11
EB_ADDR[0-14]
TP102
EB_DATA[0-7]
TP103
PAGE 1
TP104 TP105
TP106 TP107
TP108 TP109
TP110 TP111 TP112 TP113 TP114 TP115 TP116 TP117
EB_ADDR[0-14]
EB_DATA[0-7]
EB_WE_N EB_OE_N
EB_BE_N1 EB_BE_N0
CAM_CD1_N CAM_CD2_N
/PCM_CE1 /PCM_CE2 CAM_IREQ_N PCM_RESET CAM_INPACK_N PCM_5V_CTL CAM_WAIT_N CAM_REG_N
TRST_N1
IRB_SPI_MISO/TDI1
IRB_SPI_MOSI/TDO1
IRB_SPI_SS/TMS1
IRB_SPI_CK/TCK1
SOC_RESET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-Peripheral
MID_LG1311
M14 Symbol A
2013.04.04 1
31
PAGE 2
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
FE_DEMOD1_TS_DATA[0-7]
TPI_ERR
AMP_RESET_N
TP226 TP227
TP228
FE_DEMOD3_TS_CLK
FE_DEMOD3_TS_SYNC
FE_DEMOD3_TS_VAL
FE_DEMOD3_TS_DATA
TPI_DATA[0-7]
Near AMP
C200
1000pF
50V
R231
4.7K
CAM_SLIDE_DET
CAM_TRIGGER_DET
/RST_HUB
SC_DET
R226
100
1/16W
5%
LED_SDA
INSTANT_BOOT
LED_SCL
FE_DEMOD1_TS_CLK
FE_DEMOD1_TS_SYNC
FE_DEMOD1_TS_VAL
FE_DEMOD1_TS_ERROR
FE_DEMOD1_TS_DATA[7] FE_DEMOD1_TS_DATA[6] FE_DEMOD1_TS_DATA[5] FE_DEMOD1_TS_DATA[4] FE_DEMOD1_TS_DATA[3] FE_DEMOD1_TS_DATA[2] FE_DEMOD1_TS_DATA[1] FE_DEMOD1_TS_DATA[0]
FE_DEMOD2_TS_CLK
FE_DEMOD2_TS_SYNC
FE_DEMOD2_TS_VAL
FE_DEMOD2_TS_ERROR
FE_DEMOD2_TS_DATA
TPI_DATA[0] TPI_DATA[1] TPI_DATA[2] TPI_DATA[3] TPI_DATA[4] TPI_DATA[5] TPI_DATA[6] TPI_DATA[7]
MODEL_OPT_11
TP225
/RST_PHY
2D/3D_CTL
RF_SWITCH_CTL
/TU_RESET1 /TU_RESET2
BT_RESET
R224
OPT
33
CAM_SLIDE_DET
CAM_TRIGGER_DET
MODEL_OPT_12
/RST_HUB
COMP1_DET
AV1_CVBS_DET
IR_B_RESET
MODEL_OPT_8 MODEL_OPT_9
MODEL_OPT_10 EPI_LOCK8/6
SC_DET
HP_DET OPC_EN
DEBUG
BIT0
BIT1 BIT2 BIT3 BIT4 BIT5 BIT6 BIT7
TPI_CLK TPI_SOP TPI_VAL TPI_ERR
IC101
LG1311
AH30
TP_DVB_CLK
AH32
TP_DVB_SOP
AH31
TP_DVB_VAL
AH33
TP_DVB_ERR
AM33
TP_DVB_DATA7
AL32
TP_DVB_DATA6
AL33
TP_DVB_DATA5
AK32
TP_DVB_DATA4
AK33
TP_DVB_DATA3
AK31
TP_DVB_DATA2
AJ30
TP_DVB_DATA1
AJ31
TP_DVB_DATA0
AL31
STPI0_CLK
AN32
STPI0_SOP
AM32
STPI0_VAL
AN31
STPI0_ERR
AM31
STPI0_DATA
AH28
STPI1_CLK
AJ28
STPI1_SOP
AK30
STPI1_VAL
AJ29
STPI1_ERR
AG27
STPI1_DATA
A28
TPI_CLK
B28
TPI_SOP
B29
TPI_VAL
C28
TPI_ERR
A27
TPI_DATA0
B27
TPI_DATA1
C27
TPI_DATA2
B26
TPI_DATA3
C26
TPI_DATA4
B25
TPI_DATA5
A25
TPI_DATA6
C25
TPI_DATA7
AG13
GPIO31
AJ19
GPIO30
AG14
GPIO29
AG15
GPIO28
AJ15
GPIO27
AH19
GPIO26
AH18
GPIO25
AG19
GPIO24
AH5
GPIO23
AJ5
GPIO22
AJ6
GPIO21
AH6
GPIO20
AG6
AG24 AH16
AJ21 AH21
AG16 AJ24 AH17 AG17 AH13 AH15 AG18 AH14 AJ16 AH20
GPIO19
AG5
GPIO18
AF7
GPIO17
AG7
GPIO16 GPIO15 GPIO14
V29
GPIO13 GPIO12 GPIO11
V28
GPIO10 GPIO9 GPIO8 GPIO7 GPIO6 GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0
R225
OPT
33
TPIO_CLK TPIO_SOP TPIO_VAL
TPIO_ERR TPIO_DATA0 TPIO_DATA1 TPIO_DATA2 TPIO_DATA3 TPIO_DATA4 TPIO_DATA5 TPIO_DATA6 TPIO_DATA7
EPI_SOE EPI_MCLK EPI_GCLK
EPI_EO
EPI_VST
TX_0N TX_0P TX_1N TX_1P TX_2N TX_2P TX_3N TX_3P TX_4N TX_4P TX_5N TX_5P TX_6N TX_6P TX_7N TX_7P TX_8N TX_8P TX_9N
TX_9P TX_10N TX_10P TX_11N TX_11P TX_12N TX_12P TX_13N TX_13P TX_14N TX_14P TX_15N TX_15P TX_16N TX_16P TX_17N TX_17P TX_18N TX_18P TX_19N TX_19P TX_20N TX_20P TX_21N TX_21P TX_22N TX_22P TX_23N TX_23P
TX_LOCKN
D28 E29 E28 F28 D27 E27 F27 E26 F26 E25 D25 F25
AA5 AB5 AA7 AA6 AB6
AK8 AL8 AK7 AL7 AM6 AN6 AK6 AL6 AK5 AL5 AN4 AN3 AM2 AM1 AM4 AM3 AL4 AL3 AK2 AK1 AK4 AK3 AJ4 AJ3 AH2 AH1 AH4 AH3 AG4 AG3 AF2 AF1 AF4 AF3 AE4 AE3 AD2 AD1 AD4 AD3 AC4 AC3 AB2 AB1 AB4 AB3 AA4 AA3
AM8
TPO_CLK TPO_SOP TPO_VAL TPO_ERR
TPO_DATA[0] TPO_DATA[1] TPO_DATA[2] TPO_DATA[3] TPO_DATA[4] TPO_DATA[5] TPO_DATA[6] TPO_DATA[7]
EPI_SOE MCLK_SOC GCLK_SOC EO_SOC GST_SOC
TXB4N/TX0N TXB4P/TX0P TXB3N/TX1NFE_DEMOD3_TS_ERROR TXB3P/TX1P TXBCLKN/TX2N TXBCLKP/TX2P TXB2N/TX3N TXB2P/TX3P TXB1N/TX4N TXB1P/TX4P TXB0N/TX5N TXB0P/TX5P
TXD4N/TX12N TXD4P/TX12P TXD3N/TX13N TXD3P/TX13P TXDCLKN/TX14N TXDCLKP/TX14P TXD2N/TX15N TXD2P/TX15P TXD1N/TX16N TXD1P/TX16P TXD0N/TX17N TXD0P/TX17P
TPO_DATA[0-7]
TXA4N/TX6N TXA4P/TX6P TXA3N/TX7N TXA3P/TX7P TXACLKN/TX8N TXACLKP/TX8P TXA2N/TX9N TXA2P/TX9P TXA1N/TX10N TXA1P/TX10P TXA0N/TX11N TXA0P/TX11P
TXC4N/TX18N TXC4P/TX18P TXC3N/TX19N TXC3P/TX19P TXCCLKN/TX20N TXCCLKP/TX20P TXC2N/TX21N TXC2P/TX21P TXC1N/TX22N TXC1P/TX22P TXC0N/TX23N TXC0P/TX23P
TPO_ERR
EPI_SOE
+3.3V_NORMAL
BIT0_1
R201 10K
BIT0_0
R202 10K
BIT [0/1]
0 / 0 0 / 1 1 / 0 1 / 1
TAIWAN/COLOM
CHINA/HONGKONG
ASIA/AFRICA
EU/CIS
BIT1_1
R203 10K
BIT1_0
R204 10K
ATSC
N/AMERICA
KOREA
S/AMERCIA
Model Option
BIT3_1
BIT2_1
R205 10K
R207 10K
BIT0 BIT1
BIT3_0
BIT2_0
R206 10K
R208 10K
JP
JAPAN
BIT4_1
R209 10K
BIT4_0
R210 10K
BIT5_1
R211 10K
BIT5_0
R212 10K
BIT2 BIT3 BIT4 BIT5
BACK-END OPTIONAREA OPTION
BIT[2/3/4/5]DVB 0 / 0 / 0 / 0 0 / 0 / 0 / 1 0 / 0 / 1 / 0 0 / 0 / 1 / 1 0 / 1 / 0 / 0 0 / 1 / 0 / 1 0 / 1 / 1 / 0 0 / 1 / 1 / 1 1 / 0 / 0 / 0 1 / 0 / 0 / 1 1 / 0 / 1 / 0 1 / 0 / 1 / 1 1 / 1 / 0 / 0 1 / 1 / 0 / 1 1 / 1 / 1 / 0 1 / 1 / 1 / 1
BIT6_1
R213 10K
BIT [6/7]
BIT7_1
R215 10K
0 / 0 0 / 1 1 / 0 1 / 1
EU/CIS
T/C
T2/C/S2/ATV_EXT
T2/C
T2/C/S2/ATV_SOC
BIT6 BIT7
BIT6_0
BIT7_0
R214 10K
R216 10K
TYPE
EPI FHD, 120Hz, V14 (8 lane) EPI FHD, 120Hz, v14_32inch (6 lane) EPI FHD, 120Hz, V13 (6 lane) EPI FHD, 120Hz, V12 (6 lane)
EPI FHD, 60Hz, V14_32 inch (6lane)
LVDS FHD, 120Hz LVDS FHD, 60Hz
LVDS HD, 60Hz
LVDS FHD, 60Hz, CP BOX LVDS HD, 60Hz SMALL SMART
Vby1 FHD, 120Hz LVDS FHD, 120Hz OLED
FRC
FHD
PANEL TYPE
OLED
AJJA
T/C T2/C/ATV_EXT T2/C/ATV_SOC
T2/C/S2
DDR3_DDP
R219 10K
R217 10K
DDR3_1.5GB
DDR3_2GB
R220 10K
R218 10K
DDR3_NON_DDP
TAIWAN/COL
T/C
T2/C PIP
T2/C
DDR_3G
R221 10K
R222 10K
NON_DDR_3G
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
MODEL_OPT_11
MODEL_OPT_12
BRAZILKOREA
ISDB PIP
ISDB
ATV_SOC ATV_EXT
OPT
R227 10K
NORTH AMERICA
ATSC PIP
ATV_SOC ATV_EXT
OPT
R229 10K
CHINA/HONG
Default Default
ATSC PIP
MODEL_OPT_8 MODEL_OPT_9 MODEL_OPT_10
OPT
OPT
R230 10K
R228 10K
DDR3
DDR3
FOR UD
LOW
NON_DDP
NON_DDR3 3G
HIGH
DDP
1.5GB
2GB
DDR3 3G
JAPAN
MODEL_OPT_11
MODEL_OPT_12
FE_DEMOD2_TS_CLK
FE_DEMOD2_TS_SYNC
FE_DEMOD2_TS_VAL
FE_DEMOD2_TS_ERROR
FE_DEMOD2_TS_DATA
FE_DEMOD3_TS_CLK
FE_DEMOD3_TS_SYNC
FE_DEMOD3_TS_VAL
FE_DEMOD3_TS_ERROR
FE_DEMOD3_TS_DATA
TPI_DATA[0-7]
TPO_DATA[0-7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
M14-Display In/Out
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TPI_CLK TPI_SOP TPI_VAL
TPO_CLK TPO_SOP TPO_VAL
TP202 TP203 TP204 TP205 TP206
TP207 TP208 TP209 TP210 TP211
TP212
TP213 TP214 TP215
TP221
TP218 TP219 TP220
DEBUG
+3.3V_NORMAL
SW201
JTP-1127WEM
12
3
4
For ISP
R223
3.3K
MID_LG1311
M14 Symbol B
2013.04.04 2
31
PLACE AT JACK SIDE
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
Place JACK Side
AV1_CVBS/COMP1_Y Circuit was moved to 34Page
COMP1_Pb
COMP1_Pr
TU_CVBS
COMP1/AV1/DVI_L_IN
COMP1/AV1/DVI_R_IN
C303 150pF 50V
OPT
1005
75
1%
R318
1005
1%
75
R326
Place SOC Side
33
R333
R335 33
TU_ALL_2178B
R329 100
AUDIO IN
R309 27K
R310 27K
C316 4.7uF
1%
C317 4.7uF
1%
C322 0.047uF
C324 0.047uF
C318 0.047uF
R322 10K
1%
R323 10K
1%
TU_ALL_2178B
COMP2_PB_IN_SOC
COMP2_PR_IN_SOC
TU_CVBS_SOC
AUAD_L_CH3_IN
AUAD_R_CH3_IN
COMP
TP308 TP310
TP311
TP312 TP313 TP314 TP315
TP316 TP317
TP302 TP303 TP304 TP305 TP306 TP307
SC_CVBS_IN_SOC SC_FB_SOC
SC_ID_SOC COMP1_PB_IN_SOC
COMP1_Y_IN_SOC COMP1_Y_IN_SOC_SOY COMP1_PR_IN_SOC
AUAD_L_CH2_IN AUAD_R_CH2_IN
SMARTCARD_DATA/SD_EMMC_CLK SMARTCARD_VCC/SD_EMMC_CMD SMARTCARD_DET/SD_EMMC_DATA[3] SMARTCARD_RST/SD_EMMC_DATA[2] SMARTCARD_PWR_SEL/SD_EMMC_DATA[1] SMARTCARD_CLK/SD_EMMC_DATA[0]
TP318 TP319
TP320
Placed as close as possible to LG1311
Tuner IF Filter
ADC_I_INN
ADC_I_INP
TU_ALL_IntDemod
To ADC
TU_ALL_IntDemod
R344
51
R345
51
TU_ALL_IntDemod
C332
0.01uF
C331 22pF
TU_ALL_IntDemod
0.01uF TU_ALL_IntDemod
C333
Placed as close as possible to IC101
R37 4
51K
AUAD_L_REF
1%
R37 8
47K 1%
C313
4.7uF 10V
AUAD_R_REF
DDR3 VENDOR OPTION
+3.3V_NORMAL
R38 0
51K
1%
R38 1
47K 1%
SCART_LOUT_SOC
SCART_ROUT_SOC
DTV/MNT_V_OUT_SOC
IF_N
L303
OPT
IF_P
AVDD25
L307
120-ohm
C354 10uF 10V
C353
4.7uF 10V
SOC_CVBS_OUT
SCART_LOUT_SOC SCART_ROUT_SOC
TUNER_SIF
IF_AGC
AUD_MASTER_CLK
AUD_LRCH
AUD_SCK
AUD_LRCK
MAIN I2S_I/F
OPT
INT_ADEMOD
R11022 390
INT_ADEMOD
DTV/MNT_V_OUT_SOC
AVDD25
EU
C334
0.01uF 50V
C335 22pF OPT
TU_ALL_2178B
C312 0.1uF
C309 1000pF 50V
C338
0.1uF OPT
Close to IC101
INT_ADEMOD
R11023 390
INT_ADEMOD
C11009 68pF 50V
OPT
EU C336
0.01uF
EU
50V
R351 22K
SPDIF_OUT
C337 33pF
OPT
TU_ALL_IntDemod
R350
470
SOC_CVBS_OUT
C11010 68pF 50V
R356
R353 0
C339 100pF 50V
COMP1_Y_IN_SOC_SOY
COMP2_Y_IN_SOC_SOY
R357 68 R358 68 R359 68
BLM15BD121SN1
R354 0 R355 0
EU
AUAD_L_CH2_IN AUAD_R_CH2_IN
R352 22K
AUAD_L_CH3_IN AUAD_R_CH3_IN
C340 22pF OPT
I2S_AMP
ADC_I_INP ADC_I_INN
C11011
TU_CVBS_SOC
SC_CVBS_IN_SOC
AV1_CVBS_IN_SOC
C343 0.047uF
68
EU
SC_ID_SOC SC_FB_SOC
COMP1_Y_IN_SOC COMP1_PB_IN_SOC COMP1_PR_IN_SOC
COMP2_Y_IN_SOC COMP2_PB_IN_SOC COMP2_PR_IN_SOC
L304
BLM15BD121SN1
EU EU
AUDA_OUTL AUDA_OUTR
AUAD_R_REF AUAD_L_REF
R360 33
R365 100
R366 100 C342 22pF OPT
R368 100 R369
GOOGLE
R367 0
INT_ADEMOD
0.1uF
16V
0.047uF
C344 C345 0.047uF C346 0.047uF
C349
0.1uF
L305
16V
10uF 10VC347
C348 2.2uF
10V
100
GOOGLE
R371 0
C351 0.1uF
C352 0.1uF
GOOGLE
R370 0
AL27 AK26 AM27
AL26
AN27
AL25 AM25
AN23 AL22 AK21 AK22
AL24 AK23 AL23 AK24
AL21 AM23 AN25
AM21 AN21
AK16 AL16
AL19 AK19 AN19 AM19 AN17 AM17 AL17 AK17
AK20 AL20
AK18 AL18
AN15
AM15
AN11 AK11 AK10 AL10 AL11 AM11
AK29 AL29 AM29
AK27 AL30
AK28 AL28 AN29
AD5 AE5 AE7 AE6
AD6
IC101
LG1311
CVBS_IN1 CVBS_IN2 CVBS_IN3
CVBS_VCM
BUF_OUT1
SC1_SID SC1_FB
SOY1_IN Y1_IN PB1_IN PR1_IN
SOY2_IN Y2_IN PB2_IN PR2_IN
ADC1_COM ADC2_COM ADC3_COM
AVSS25_COMP_REF AVDD25_COMP_REF
AUDA_SCART_OUTL AUDA_SCART_OUTR
AUAD_L_CH1_IN AUAD_R_CH1_IN AUAD_L_CH2_IN AUAD_R_CH2_IN AUAD_L_CH3_IN AUAD_R_CH3_IN AUAD_L_CH4_IN AUAD_R_CH4_IN
AUDA_OUTL AUDA_OUTR
AUAD_L_REF AUAD_R_REF
AUD_VBG_EXT
IEC958OUT
AUDCLK_OUT DAC_LRCH DAC_SLRCH DAC_CLFCH DAC_SCK DAC_LRCK
PCMI3LRCH PCMI3LRCK PCMI3SCK AUDCLK_IN
FRC_LRSYNC
AAD_ADC_SIF AAD_ADC_SIFM IFAGC
DMD_DAC_OUT DMD_SIF_OUT
DMD_ADC_INP DMD_ADC_INN DMD_ADC_INCOM
SD_CLK
SD_CMD SD_CD_N SD_WP_N
SD_DATA3 SD_DATA2 SD_DATA1 SD_DATA0
RMII_REF_CLK
RMII_CRS_DV
RMII_MDIO
RMII_MDC RMII_TXEN RMII_TXD1 RMII_TXD0 RMII_RXD1 RMII_RXD0
HDMI_1_SCL HDMI_1_SDA HDMI_1_HPD
HDMI_1_5V_DET
HDMI_1_ARC
HDMI_1_RX_0
HDMI_1_RX_0B
HDMI_1_RX_1
HDMI_1_RX_1B
HDMI_1_RX_2
HDMI_1_RX_2B
HDMI_1_RX_C
HDMI_1_RX_CB
HDMI_2_SCL HDMI_2_SDA HDMI_2_HPD
HDMI_2_5V_DET
HDMI_2_RX_0
HDMI_2_RX_0B
HDMI_2_RX_1
HDMI_2_RX_1B
HDMI_2_RX_2
HDMI_2_RX_2B
HDMI_2_RX_C
HDMI_2_RX_CB
HDMI_3_SCL HDMI_3_SDA HDMI_3_HPD
HDMI_3_5V_DET
HDMI_3_RX_0
HDMI_3_RX_0B
HDMI_3_RX_1
HDMI_3_RX_1B
HDMI_3_RX_2
HDMI_3_RX_2B
HDMI_3_RX_C
HDMI_3_RX_CB
HDMI_4_SCL
HDMI_4_SDA HDMI_4_CBUS_HPD HDMI_4_CD_SENSE
HDMI_4_5V_DET
HDMI_4_RX_0
HDMI_4_RX_0B
HDMI_4_RX_1
HDMI_4_RX_1B
HDMI_4_RX_2
HDMI_4_RX_2B
HDMI_4_RX_C
HDMI_4_RX_CB
E22 D22 F22 F24 D24 E24 F23 E23
AK14 AK12 AL12 AK13 AL13 AM13 AN13 AL14 AK15
AE27 AF28 AE29 AF27 AE28
AF33 AF32 AE31 AE30 AD31 AD30 AF31 AF30
AD28 AD29 AC27 AD27
AC31 AC30 AB33 AB32 AA31 AA30 AD32 AD33
AB28 AB27 AB29 AC28
Y32 Y33 W31 W30 V33 V32 Y31 Y30
Y27 AA28 Y28 AA29 AA27
T31 T30 T32 T33 R31 R30 U31 U30
PAGE 3
SMARTCARD_CLK/SD_EMMC_DATA[0] SMARTCARD_RST/SD_EMMC_DATA[2] SMARTCARD_VCC/SD_EMMC_CMD SMARTCARD_PWR_SEL/SD_EMMC_DATA[1] DDR3_OPT1 DDR3_OPT2 SMARTCARD_DET/SD_EMMC_DATA[3] SMARTCARD_DATA/SD_EMMC_CLK
EPHY_REFCLK EPHY_CRS_DV EPHY_MDIO EPHY_MDC EPHY_EN EPHY_TXD1 EPHY_TXD0
R520733
EPHY_RXD1
R520633
EPHY_RXD0
DDC_SCL_1 DDC_SDA_1 HDMI_HPD_1
SPDIF_OUT_ARC
D0+_HDMI1 D0-_HDMI1
D1+_HDMI1 D1-_HDMI1 D2+_HDMI1 D2-_HDMI1 CK+_HDMI1 CK-_HDMI1
DDC_SCL_2
DDC_SDA_2
HDMI_HPD_2
D0+_HDMI2 D0-_HDMI2 D1+_HDMI2 D1-_HDMI2 D2+_HDMI2 D2-_HDMI2 CK+_HDMI2 CK-_HDMI2
DDC_SCL_3
DDC_SDA_3
HDMI_HPD_3
5V_HDMI_3_SOC
D0+_HDMI3 D0-_HDMI3 D1+_HDMI3 D1-_HDMI3 D2+_HDMI3 D2-_HDMI3 CK+_HDMI3 CK-_HDMI3
DDC_SCL_4
DDC_SDA_4
HDMI_HPD_4
MHL_DET
D0+_HDMI4 D0-_HDMI4 D1+_HDMI4 D1-_HDMI4 D2+_HDMI4 D2-_HDMI4 CK+_HDMI4 CK-_HDMI4
5V_HDMI_1
R372 10
C356 1uF 10V
5V_HDMI_2
R373 10
C357 1uF
10V
5V_HDMI_4
R375 10
C359 1uF 10V
R376
5.1K
R377
5.1K
R379
5.1K
HP_OUT L308
BLM18PG121SN1D
HP_LOUT_AMP
BLM18PG121SN1D
HP_ROUT_AMP
HP_OUT L309
HP_OUT
C365
0.22uF 10V
HP_OUT C366
0.22uF 10V
HP_LOUT
HP_ROUT
Place at JACK SIDE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-AV In/Out
HP_LOUT_MAIN
HP_ROUT_MAIN
4.7K
4.7K
R384
R382
OPT
OPT
R383 4.7K
R385 4.7K
AUDIO OUT
R303
22K
R304
22K
R311 0
C305
0.01uF 50V
R312 0
C306
0.01uF 50V
DDR3_OPT1 DDR3_OPT2
AUDA_OUTL
AUDA_OUTR
DDC_SCL_3 DDC_SDA_3
HDMI_HPD_3
5V_HDMI_3_SOC
D0+_HDMI3 D0-_HDMI3 D1+_HDMI3 D1-_HDMI3 D2+_HDMI3 D2-_HDMI3 CK+_HDMI3 CK-_HDMI3
MID_LG1311
M14 Symbol C
TP321 TP322 TP323 TP324
TP325 TP326 TP327 TP328 TP329 TP330 TP331 TP332
2013.04.04 3
31
PAGE 4
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
IC101
LG1311
M0_DDR_VREF1 M0_DDR_VREF2
M0_DDR_U_CLKP M0_DDR_U_CLKN M0_DDR_D_CLKP M0_DDR_D_CLKN
M0_DDR_RESET_N
M0_DDR_DQS_P0 M0_DDR_DQS_N0 M0_DDR_DQS_P1 M0_DDR_DQS_N1 M0_DDR_DQS_P2 M0_DDR_DQS_N2 M0_DDR_DQS_P3 M0_DDR_DQS_N3
M0_DDR_ZQCAL
M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8
M0_DDR_A9 M0_DDR_A10 M0_DDR_A11 M0_DDR_A12 M0_DDR_A13 M0_DDR_A14 M0_DDR_A15
M0_DDR_BA0 M0_DDR_BA1 M0_DDR_BA2
M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN M0_DDR_CASN
M0_DDR_WEN
M0_DDR_DM0 M0_DDR_DM1 M0_DDR_DM2 M0_DDR_DM3
M0_DDR_DQ0 M0_DDR_DQ1 M0_DDR_DQ2 M0_DDR_DQ3 M0_DDR_DQ4 M0_DDR_DQ5 M0_DDR_DQ6 M0_DDR_DQ7 M0_DDR_DQ8 M0_DDR_DQ9
M0_DDR_DQ10 M0_DDR_DQ11 M0_DDR_DQ12 M0_DDR_DQ13 M0_DDR_DQ14 M0_DDR_DQ15 M0_DDR_DQ16 M0_DDR_DQ17 M0_DDR_DQ18 M0_DDR_DQ19 M0_DDR_DQ20 M0_DDR_DQ21 M0_DDR_DQ22 M0_DDR_DQ23 M0_DDR_DQ24 M0_DDR_DQ25 M0_DDR_DQ26 M0_DDR_DQ27 M0_DDR_DQ28 M0_DDR_DQ29 M0_DDR_DQ30 M0_DDR_DQ31
VREF_M0_0
A22 A3
E13 E11 E15 E17 D8 D16 D9 E16 E9 E14 D7 D10 D11 D14 E10 E12
D17 E8 D13
C8 B8 C17 B17 D12
E19 D19 D18 E18
D15
B18 C18 B16 A16 B9 C9 B7 A7
A15 A18 A6 A9
B20 B13 C21 C14 A21 A13 B21 C13 B14 B19 C15 C20 C16 A19 B15 C19 B11 C5 C12 B4 A12 A4 B12 C4 B5 B10 C6 C11 C7 A10 B6 C10
E7
VREF_M0_1
R401 240
M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8 M0_DDR_A9 M0_DDR_A10 M0_DDR_A11 M0_DDR_A12 M0_DDR_A13 M0_DDR_A14 M0_DDR_A15
M0_DDR_BA0 M0_DDR_BA1
M0_DDR_BA2
M0_U_CLK M0_U_CLKN M0_D_CLK
M0_DDR_CKE
M0_DDR_ODT M0_DDR_RASN M0_DDR_CASN M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS0 M0_DDR_DQS_N0 M0_DDR_DQS1 M0_DDR_DQS_N1 M0_DDR_DQS2 M0_DDR_DQS_N2 M0_DDR_DQS3 M0_DDR_DQS_N3
M0_DDR_DM0 M0_DDR_DM1 M0_DDR_DM2 M0_DDR_DM3
M0_DDR_DQ0 M0_DDR_DQ1
M0_DDR_DQ2 M0_DDR_DQ3 M0_DDR_DQ4
M0_DDR_DQ5
M0_DDR_DQ6 M0_DDR_DQ7 M0_DDR_DQ8 M0_DDR_DQ9
M0_DDR_DQ10 M0_DDR_DQ11 M0_DDR_DQ12 M0_DDR_DQ13 M0_DDR_DQ14
M0_DDR_DQ15
M0_DDR_DQ16
M0_DDR_DQ17
M0_DDR_DQ18
M0_DDR_DQ19 M0_DDR_DQ20 M0_DDR_DQ21
M0_DDR_DQ22
M0_DDR_DQ23 M0_DDR_DQ24
M0_DDR_DQ25 M0_DDR_DQ26 M0_DDR_DQ27
M0_DDR_DQ28 M0_DDR_DQ29
M0_DDR_DQ30
M0_DDR_DQ31
1%
+1.5V_DDR
R402
R403
+1.5V_DDR
OPT
+1.5V_DDR
R406
R407
+1.5V_DDR
R408
R409
VREF_M0_0
1K 1%
1K 1%
C401
R404 10K
100
R40 5
M0_DDR_VREFCA
1K 1%
1K 1%
M0_DDR_VREFDQ
1K 1%
0.1uF
1K 1%
C403
0.1uF
M0_DDR_RESET_N
M0_D_CLK
M0_D_CLKN
C402
0.1uF
M0_DDR_CKE
+1.5V_DDR
+1.5V_DDR
R411
R412
+1.5V_DDR
R413
R414
VREF_M0_1
R415
1K 1%
R416
1K 1%
R417 10K
M0_U_CLK
100
R41 0
M0_U_CLKN
M0_1_DDR_VREFCA
1K 1%
C406
0.1uF
1K 1%
M0_1_DDR_VREFDQ
1K 1%
0.1uF
1K 1%
C407
C408
0.1uF
M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8 M0_DDR_A9
M0_DDR_A10
M0_DDR_A11 M0_DDR_A12
M0_DDR_A13
M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0
M0_DDR_BA1
M0_DDR_BA2
M0_D_CLK
M0_D_CLKN
M0_DDR_CKE
M0_DDR_ODT M0_DDR_RASN M0_DDR_CASN
M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS0
M0_DDR_DQS_N0
M0_DDR_DQS1
M0_DDR_DQS_N1
M0_DDR_DM0 M0_DDR_DM1
M0_DDR_DQ0
M0_DDR_DQ1 M0_DDR_DQ2 M0_DDR_DQ3 M0_DDR_DQ4 M0_DDR_DQ5 M0_DDR_DQ6 M0_DDR_DQ7
M0_DDR_DQ8 M0_DDR_DQ9
M0_DDR_DQ10 M0_DDR_DQ11 M0_DDR_DQ12 M0_DDR_DQ13 M0_DDR_DQ14 M0_DDR_DQ15
IC401
H5TQ4G63AFR-PBC
DDR3
N3 P7 P3 N2 P8 P2 R8 R2 T8 R3 L7 R7 N7 T3 T7 M7
M2 N8 M3
J7 K7 K9
L2 K1 J3 K3 L3
T2
F3 G3
C7 B7
E7 D3
E3 F7 F2 F8 H3 H8 G2 H7
D7 C3 C8 C2 A7 A2 B8 A3
4Gbit
A0
(x16)
A1
DDR_512MB_HYNIX_1600_29n
A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12/BC A13 A14 A15
BA0 BA1 BA2
CK CK CKE
CS ODT RAS CAS WE
RESET
DQSL DQSL
DQSU DQSU
DML DMU
DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7
DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7
VREFCA
VREFDQ
VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9
VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9
NC_1 NC_2 NC_3 NC_4
VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8
VSS_9 VSS_10 VSS_11 VSS_12
VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9
ZQ
M0_DDR_VREFCA
M0_DDR_VREFDQ
M8
H1
R418
L8
240
1%
B2 D9 G7 K2 K8 N1 N9 R1 R9
A1 A8 C1 C9 D2 E9 F1 H2 H9
J1 J9 L1 L9
A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9
B1 B9 D1 D8 E2 E8 F9 G1 G9
+1.5V_DDR
IC401-*1
MT41K256M16HA-125:E
DDR_512MB_MICRON
N3
A0
VREFCA
P7
A1
P3
A2
N2
A3
VREFDQ
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
VDD_1
A9
L7
VDD_2
A10/AP
R7
VDD_3
A11
N7
VDD_4
A12/BC
T3
A13
VDD_5 VDD_6
M7
NC_5
VDD_7 VDD_8
M2
BA0
VDD_9
N8
BA1
M3
BA2
VDDQ_1
J7
CK
VDDQ_2
K7
CK
VDDQ_3
K9
CKE
VDDQ_4 VDDQ_5
L2
CS
VDDQ_6
K1
ODT
VDDQ_7
J3
RAS
VDDQ_8
K3
CAS
VDDQ_9
L3
WE
NC_1
T2
RESET
NC_2 NC_3 NC_4
F3
DQSL
G3
DQSL
C7
DQSU
VSS_1
B7
DQSU
VSS_2 VSS_3
E7
DML
VSS_4
D3
DMU
VSS_5 VSS_6
E3
DQ0
VSS_7
F7
DQ1
VSS_8
F2
DQ2
VSS_9
F8
DQ3
VSS_10
H3
DQ4
VSS_11
H8
DQ5
VSS_12
G2
DQ6
H7
DQ7
VSSQ_1
D7
DQ8
VSSQ_2
C3
DQ9
VSSQ_3
C8
DQ10
VSSQ_4
C2
DQ11
VSSQ_5
A7
DQ12
VSSQ_6
A2
DQ13
VSSQ_7
B8
DQ14
VSSQ_8
A3
DQ15
VSSQ_9
C413 1uF C414 1uF
M8
H1
L8
ZQ
B2 D9 G7 K2 K8 N1 N9 R1 R9
A1 A8 C1 C9 D2 E9 F1 H2 H9
J1 J9 L1 L9 T7
A14
A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9
B1 B9 D1 D8 E2 E8 F9 G1 G9
M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8
M0_DDR_A9 M0_DDR_A10 M0_DDR_A11 M0_DDR_A12 M0_DDR_A13 M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0M0_D_CLKN M0_DDR_BA1 M0_DDR_BA2
M0_U_CLK
M0_U_CLKN M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN M0_DDR_CASN
M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS2
M0_DDR_DQS_N2
M0_DDR_DQS3
M0_DDR_DQS_N3
M0_DDR_DM2 M0_DDR_DM3
M0_DDR_DQ16
M0_DDR_DQ17 M0_DDR_DQ18 M0_DDR_DQ19 M0_DDR_DQ20 M0_DDR_DQ21 M0_DDR_DQ22 M0_DDR_DQ23
M0_DDR_DQ24 M0_DDR_DQ25 M0_DDR_DQ26 M0_DDR_DQ27 M0_DDR_DQ28 M0_DDR_DQ29 M0_DDR_DQ30 M0_DDR_DQ31
MT41K256M16HA-125:E
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQ0
F7
DQ1
F2
DQ2
F8
DQ3
H3
DQ4
H8
DQ5
G2
DQ6
H7
DQ7
D7
DQ8
C3
DQ9
C8
DQ10
C2
DQ11
A7
DQ12
A2
DQ13
B8
DQ14
A3
DQ15
IC402-*1
DDR_512MB_MICRON
IC402
H5TQ4G63AFR-PBC
DDR3
N3
4Gbit
A0
P7
(x16)
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
A14
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
M0_1_DDR_VREFCA
VREFCA
VREFDQ
ZQ
VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9
VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9
NC_1 NC_2 NC_3 NC_4
VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8
VSS_9 VSS_10 VSS_11 VSS_12
VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9
M8
H1
L8
B2 D9 G7 K2 K8 N1 N9 R1 R9
A1 A8 C1 C9 D2 E9 F1 H2 H9
J1 J9 L1 L9
A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9
B1 B9 D1 D8 E2 E8 F9 G1 G9
M0_1_DDR_VREFDQ
+1.5V_DDR
R419
240
1%
C429 C430
1uF 1uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
M14 DDR3-M0
2013.04.04 4
31
PAGE 5
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
IC101
LG1311
M1_DDR_VREF1 M1_DDR_VREF2
M1_DDR_U_CLKP M1_DDR_U_CLKN M1_DDR_D_CLKP M1_DDR_D_CLKN
M1_DDR_RESET_N
M1_DDR_DQS_P0 M1_DDR_DQS_N0 M1_DDR_DQS_P1 M1_DDR_DQS_N1 M1_DDR_DQS_P2 M1_DDR_DQS_N2 M1_DDR_DQS_P3 M1_DDR_DQS_N3
M1_DDR_ZQCAL
M1_DDR_A0 M1_DDR_A1 M1_DDR_A2 M1_DDR_A3 M1_DDR_A4 M1_DDR_A5 M1_DDR_A6 M1_DDR_A7 M1_DDR_A8
M1_DDR_A9 M1_DDR_A10 M1_DDR_A11 M1_DDR_A12 M1_DDR_A13 M1_DDR_A14 M1_DDR_A15
M1_DDR_BA0 M1_DDR_BA1 M1_DDR_BA2
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN M1_DDR_CASN
M1_DDR_WEN
M1_DDR_DM0 M1_DDR_DM1 M1_DDR_DM2 M1_DDR_DM3
M1_DDR_DQ0 M1_DDR_DQ1 M1_DDR_DQ2 M1_DDR_DQ3 M1_DDR_DQ4 M1_DDR_DQ5 M1_DDR_DQ6 M1_DDR_DQ7 M1_DDR_DQ8 M1_DDR_DQ9
M1_DDR_DQ10 M1_DDR_DQ11 M1_DDR_DQ12 M1_DDR_DQ13 M1_DDR_DQ14 M1_DDR_DQ15 M1_DDR_DQ16 M1_DDR_DQ17 M1_DDR_DQ18 M1_DDR_DQ19 M1_DDR_DQ20 M1_DDR_DQ21 M1_DDR_DQ22 M1_DDR_DQ23 M1_DDR_DQ24 M1_DDR_DQ25 M1_DDR_DQ26 M1_DDR_DQ27 M1_DDR_DQ28 M1_DDR_DQ29 M1_DDR_DQ30 M1_DDR_DQ31
VREF_M1_0
A2 Y1
M5 N5 K5 H5 T4 H4 R4 J5 T5 L5 U4 P4 P5 K4 R5 N4
G4 U5 L4
R3 R2 F3 F2 M4
F5 E4 F4 G5
J4
E2 E3 G2 G1 P2 P3 T2 T1
H1 E1 U1 P1
C2 K2 B3 J3 B1 K1 B2 K3 J2 D2 H3 C3 G3 D1 H2 D3 M2 V3 L3 W2 L1 W1 L2 W3 V2 N2 U3 M3 T3 N1 U2 N3
E5
R501
VREF_M1_1
M1_DDR_A0 M1_DDR_A1 M1_DDR_A2 M1_DDR_A3 M1_DDR_A4 M1_DDR_A5 M1_DDR_A6 M1_DDR_A7 M1_DDR_A8 M1_DDR_A9 M1_DDR_A10 M1_DDR_A11 M1_DDR_A12 M1_DDR_A13 M1_DDR_A14 M1_DDR_A15
M1_DDR_BA0 M1_DDR_BA1 M1_DDR_BA2
M1_U_CLK M1_U_CLKN M1_D_CLK M1_D_CLKN M1_DDR_CKE
M1_DDR_ODT M1_DDR_RASN M1_DDR_CASN M1_DDR_WEN
M1_DDR_RESET_N
M1_DDR_DQS_N0 M1_DDR_DQS1
M1_DDR_DQS_N1
M1_DDR_DQS2
M1_DDR_DQS_N2
M1_DDR_DQS3 M1_DDR_DQS_N3
M1_DDR_DM0
M1_DDR_DM2
M1_DDR_DM3
M1_DDR_DQ0 M1_DDR_DQ1
M1_DDR_DQ2
M1_DDR_DQ3
M1_DDR_DQ4
M1_DDR_DQ5
M1_DDR_DQ6
M1_DDR_DQ7 M1_DDR_DQ8 M1_DDR_DQ9 M1_DDR_DQ10 M1_DDR_DQ11
M1_DDR_DQ12 M1_DDR_DQ13
M1_DDR_DQ14
M1_DDR_DQ15
M1_DDR_DQ16 M1_DDR_DQ17 M1_DDR_DQ18
M1_DDR_DQ19
M1_DDR_DQ20 M1_DDR_DQ21
M1_DDR_DQ22
M1_DDR_DQ23
M1_DDR_DQ24
M1_DDR_DQ25 M1_DDR_DQ26 M1_DDR_DQ27
M1_DDR_DQ28 M1_DDR_DQ29
M1_DDR_DQ30
M1_DDR_DQ31
240 1%
+1.5V_DDR
R508
R509
+1.5V_DDR
OPT
+1.5V_DDR
R504
R505
+1.5V_DDR
R506
R507
VREF_M1_0
1K 1%
C501
1K 1%
R502 10K
100
R50 3
M1_DDR_VREFCA
1K 1%
C502
0.1uF
1K 1%
M1_DDR_VREFDQ
1K 1%
0.1uF
1K 1%
C503
0.1uF
M1_DDR_RESET_N
M1_D_CLK
M1_D_CLKN
+1.5V_DDR
M1_DDR_CKE
+1.5V_DDR
+1.5V_DDR
VREF_M1_1
R515
1K 1%
R516
1K 1%
100
R51 0
M1_1_DDR_VREFCA
R511
1K 1%
R512
1K 1%
M1_1_DDR_VREFDQ
R513
1K 1%
0.1uF
R514
1K 1%
C508
C506
R517 10K
M1_U_CLK
M1_U_CLKN
C507
0.1uF
0.1uF
M1_DDR_RASNM1_DDR_DQS0 M1_DDR_CASN
M1_DDR_RESET_N
M1_DDR_DQS0
M1_DDR_DQS_N0
M1_DDR_DQS1M1_DDR_DM1
M1_DDR_DQS_N1
M1_DDR_DM0 M1_DDR_DM1
M1_DDR_DQ10 M1_DDR_DQ11 M1_DDR_DQ12 M1_DDR_DQ13 M1_DDR_DQ14 M1_DDR_DQ15
M1_DDR_A0 M1_DDR_A1 M1_DDR_A2 M1_DDR_A3 M1_DDR_A4 M1_DDR_A5 M1_DDR_A6 M1_DDR_A7 M1_DDR_A8
M1_DDR_A9 M1_DDR_A10 M1_DDR_A11 M1_DDR_A12 M1_DDR_A13 M1_DDR_A14 M1_DDR_A15
M1_DDR_BA0 M1_DDR_BA1 M1_DDR_BA2
M1_D_CLK
M1_D_CLKN M1_DDR_CKE
M1_DDR_ODT
M1_DDR_WEN
M1_DDR_DQ0 M1_DDR_DQ1 M1_DDR_DQ2 M1_DDR_DQ3 M1_DDR_DQ4 M1_DDR_DQ5 M1_DDR_DQ6 M1_DDR_DQ7
M1_DDR_DQ8 M1_DDR_DQ9
IC501
H5TQ4G63AFR-PBC
N3
DDR3
A0
P7
4Gbit
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
IC501-*1
MT41K256M16HA-125:E
DDR_512MB_MICRON
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQ0
F7
DQ1
F2
DQ2
F8
DQ3
H3
DQ4
H8
DQ5
G2
DQ6
H7
DQ7
D7
DQ8
C3
DQ9
C8
DQ10
C2
DQ11
A7
DQ12
A2
DQ13
B8
DQ14
A3
DQ15
VREFCA
VREFDQ
ZQ
VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9
VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9
NC_1 NC_2 NC_3 NC_4
VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8
VSS_9 VSS_10 VSS_11 VSS_12
VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9
IC502-*3
MT41K128M16JT-125:K
DDR_256MB_MICRON
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQ0
F7
DQ1
F2
DQ2
F8
DQ3
H3
DQ4
H8
DQ5
G2
DQ6
H7
DQ7
D7
DQ8
C3
DQ9
C8
DQ10
C2
DQ11
A7
DQ12
A2
DQ13
B8
DQ14
A3
DQ15
+1.5V_DDR
M8
H1
L8
B2 D9 G7 K2 K8 N1 N9 R1 R9
A1 A8 C1 C9 D2 E9 F1 H2 H9
J1 J9 L1 L9
A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9
B1 B9 D1 D8 E2 E8 F9 G1 G9
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
M1_1_DDR_VREFCA
R519
+1.5V_DDR
C540
C541 1uF
M1_1_DDR_VREFDQ
240
1uF
DDR3 1.5V bypass Cap
: Place these caps near Memory
+1.5V_DDR
M1_DDR_VREFCA
R518
1uF
M1_DDR_VREFDQ
240
DDR3 1.5V bypass Cap
: Place these caps near Memory
H5TQ2G63FFR-PBC
DDR_256MB_HYNIX_1600_29n
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
IC501-*2
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7 K2 K8 N1 N9 R1 R9
A1 A8 C1 C9 D2 E9 F1 H2 H9
J1 J9 L1 L9
A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9
B1 B9 D1 D8 E2 E8 F9 G1 G9
IC502-*1
MT41K256M16HA-125:E
DDR_512MB_MICRON
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQ0
F7
DQ1
F2
DQ2
F8
DQ3
H3
DQ4
H8
DQ5
G2
DQ6
H7
DQ7
D7
DQ8
C3
DQ9
C8
DQ10
C2
DQ11
A7
DQ12
A2
DQ13
B8
DQ14
A3
DQ15
VREFCA
VREFDQ
VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9
VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9
NC_1 NC_2 NC_3 NC_4
A14
VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8
VSS_9 VSS_10 VSS_11 VSS_12
VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9
+1.5V_DDR
M8
H1
L8
ZQ
B2 D9 G7 K2 K8 N1 N9 R1 R9
A1 A8 C1 C9 D2 E9 F1 H2 H9
J1 J9 L1 L9 T7
A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9
B1 B9 D1 D8 E2 E8 F9 G1 G9
C524
C525 1uF
VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9
VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9
NC_1 NC_2 NC_3 NC_4
VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8
VSS_9 VSS_10 VSS_11 VSS_12
VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
A14
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
1_2Gbit : T7(NC_6)
4Gbit : T7(A14)
M1_DDR_A0 M1_DDR_A1 M1_DDR_A2 M1_DDR_A3 M1_DDR_A4 M1_DDR_A5 M1_DDR_A6 M1_DDR_A7 M1_DDR_A8
M1_DDR_A9 M1_DDR_A10 M1_DDR_A11 M1_DDR_A12 M1_DDR_A13 M1_DDR_A14 M1_DDR_A15
M1_DDR_BA0 M1_DDR_BA1 M1_DDR_BA2
M1_U_CLK
M1_U_CLKN M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN M1_DDR_CASN
M1_DDR_WEN
M1_DDR_RESET_N
M1_DDR_DQS2
M1_DDR_DQS_N2
M1_DDR_DQS3
M1_DDR_DQS_N3
M1_DDR_DM2 M1_DDR_DM3
M1_DDR_DQ16 M1_DDR_DQ17 M1_DDR_DQ18 M1_DDR_DQ19 M1_DDR_DQ20
M1_DDR_DQ21 M1_DDR_DQ22 M1_DDR_DQ23
M1_DDR_DQ24 M1_DDR_DQ25 M1_DDR_DQ26
M1_DDR_DQ27 M1_DDR_DQ28
M1_DDR_DQ29 M1_DDR_DQ30 M1_DDR_DQ31
IC502-*2
H5TQ2G63FFR-PBC
DDR_256MB_HYNIX_1600_29n
N3
M8
A0
VREFCA
P7
A1
P3
A2
N2
H1
A3
VREFDQ
P8
A4
P2
A5
R8
L8
A6
ZQ
R2
A7
T8
A8
B2
R3
VDD_1
A9
D9
L7
VDD_2
A10/AP
G7
R7
VDD_3
A11
N7
K2
VDD_4
A12/BC
T3
K8
A13
VDD_5
N1
VDD_6
M7
N9
NC_5
VDD_7
R1
VDD_8
M2
R9
BA0
VDD_9
N8
BA1
M3
BA2
A1
VDDQ_1
J7
A8
CK
VDDQ_2
K7
C1
CK
VDDQ_3
K9
C9
CKE
VDDQ_4
D2
VDDQ_5
L2
E9
CS
VDDQ_6
K1
F1
ODT
VDDQ_7
J3
H2
RAS
VDDQ_8
K3
H9
CAS
VDDQ_9
L3
WE
J1
NC_1
T2
J9
RESET
NC_2
L1
NC_3
L9
NC_4
F3
T7
DQSL
NC_6
G3
DQSL
C7
A9
DQSU
VSS_1
B7
B3
DQSU
VSS_2
E1
VSS_3
E7
G8
DML
VSS_4
D3
J2
DMU
VSS_5
J8
VSS_6
E3
M1
DQL0
VSS_7
F7
M9
DQL1
VSS_8
F2
P1
DQL2
VSS_9
F8
P9
DQL3
VSS_10
H3
T1
DQL4
VSS_11
H8
T9
DQL5
VSS_12
G2
DQL6
H7
DQL7
B1
VSSQ_1
D7
B9
DQU0
VSSQ_2
C3
D1
DQU1
VSSQ_3
C8
D8
DQU2
VSSQ_4
C2
E2
DQU3
VSSQ_5
A7
E8
DQU4
VSSQ_6
A2
F9
DQU5
VSSQ_7
B8
G1
DQU6
VSSQ_8
A3
G9
DQU7
VSSQ_9
IC502
H5TQ4G63AFR-PBC
N3
DDR3
A0
P7
4Gbit
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
IC501-*3
MT41K128M16JT-125:K
DDR_256MB_MICRON
N3
M8
A0
VREFCA
P7
A1
P3
A2
N2
H1
A3
VREFDQ
P8
A4
P2
A5
R8
L8
A6
ZQ
R2
A7
T8
A8
B2
R3
VDD_1
A9
D9
L7
VDD_2
A10/AP
G7
R7
VDD_3
A11
N7
K2
VDD_4
A12/BC
T3
K8
A13
VDD_5
N1
VDD_6
M7
N9
NC_5
VDD_7
R1
VDD_8
M2
R9
BA0
VDD_9
N8
BA1
M3
BA2
A1
VDDQ_1
J7
A8
CK
VDDQ_2
K7
C1
CK
VDDQ_3
K9
C9
CKE
VDDQ_4
D2
VDDQ_5
L2
E9
CS
VDDQ_6
K1
F1
ODT
VDDQ_7
J3
H2
RAS
VDDQ_8
K3
H9
CAS
VDDQ_9
L3
WE
J1
NC_1
T2
J9
RESET
NC_2
L1
NC_3
L9
NC_4
F3
T7
DQSL
NC_6
G3
DQSL
C7
A9
DQSU
VSS_1
B7
B3
DQSU
VSS_2
E1
VSS_3
E7
G8
DML
VSS_4
D3
J2
DMU
VSS_5
J8
VSS_6
E3
M1
DQ0
VSS_7
F7
M9
DQ1
VSS_8
F2
P1
DQ2
VSS_9
F8
P9
DQ3
VSS_10
H3
T1
DQ4
VSS_11
H8
T9
DQ5
VSS_12
G2
DQ6
H7
DQ7
B1
VSSQ_1
D7
B9
DQ8
VSSQ_2
C3
D1
DQ9
VSSQ_3
C8
D8
DQ10
VSSQ_4
C2
E2
DQ11
VSSQ_5
A7
E8
DQ12
VSSQ_6
A2
F9
DQ13
VSSQ_7
B8
G1
DQ14
VSSQ_8
A3
G9
DQ15
VSSQ_9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
M14 DDR3-M1
2013.04.04 5
31
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