LG 60LB5800 Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LJ46B

MODEL : 60LB5800 60LB5800-SB

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL68027505 (1401-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 4

ADJUSTMENT INSTRUCTION .............................................................. 12

BLOCK DIAGRAM .................................................................................. 19

EXPLODED VIEW .................................................................................. 20

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This spec sheet is applied all of the 32”,39”,42”,47”,60” LED TV with LJ46B chassis.

2. Test condition

Each part is tested as below without special notice.

1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF), CST : 40 ºC±5 ºC

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage Standard input voltage (100~240V@ 50/60Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.

5) The receiver must be operated for about 20 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC: CE, IEC

.

Only for training and service purposes

- 6 -

4. General Specification

No Item Specication Remark

1. Display Screen Device 32” wide Color Display Module Resolution: 1366*768

32” wide Color Display Module Resolution: 1920*1080

39” wide Color Display Module Resolution: 1920*1080

42” wide Color Display Module Resolution: 1920*1080

47” wide Color Display Module Resolution: 1920*1080

50” wide Color Display Module Resolution: 1920*1080

55” wide Color Display Module Resolution: 1920*1080

60” wide Color Display Module Resolution: 1920*1080

2. Aspect Ratio 16:9 All

3. LCD Module 32" TFT WUXGA LCD LC320DUE-FGA4 [32LB5800-SB]

32" TFT WXGA LCD LC320DXE-FGA4 [32LB580B-SA/SB]

39" TFT WUXGA LCD NC390DUN-VXBP1 [39LB5800-SB]

42" TFT WUXGA LCD

47” TFT WUXGA LCD LC470DUE-FGA4 [47LB5800-SB]

50” TFT WUXGA LCD

55” TFT WUXGA LCD

60” TFT WUXGA LCD

4. Operating Environment TFT 1) Temp. : 0 ~ 40 deg

2) Humidity : 0 ~ 85%

5. Storage Environment TFT 1) Temp. : -20 ~ 60 deg

2) Humidity : 10 ~ 90%

6. Input Voltage AC100 ~ 240V, 50/60Hz

7. Power Consumption(Max) = LCD(Module) + Backlight(LED)HDT120Hz

D-LED

FHD T120Hz D-LED

FHD M120Hz D-LED

32 66.4 W

39 38 W NC390DUN-VXBP1 [39LB5800-SB]

47 43.8 W LC470DUE-FGA3 [47LB5800-SA]

60 W

LGE SPEC

LC320DXE-FGA3 [32LB580B-SA/SB]

Only for training and service purposes

- 7 -

8. LCD Module Size Maker Inch (H) × (V) × (D)

32” 725.2 x 424.4 x 35.0

725.8 x 425 x 37.4

39” 853.92 × 480.33 ×38.5

881.12 x 512.1 x 46.7

42” 947.7 x 546.65 x 9.7

958 x 559.1 x 9.9

956.4 x 555.0 x 37.4

958.2 x 555.8 x 35.0

47” 1059.5 x 609.5 x 9.7

1070.6 x 622.0 x 9.9

1068.0 x 617.8 x 38.8

1059.5 x 609.5 x 9.7

1067.6 x 617.4 x 36.5

60” 1333.0 x 758.94 x 1.42

1346.8 x 774.4 x 29.9

Pixel Pitch Maker Inch (H) × (V) × (D)

32” 170.25 x 510.75

363.75 x 363.75

510.75 x510.75

39” 176.75*530.25 NC390DUN-VXBP1 [39LB5800-SB]

444.75 x 444.75

42” 483.3 x 483.3

483.3 x 483.3

47” 541.5 x 541.5

541.5 x 541.5

60” 687 x 687

687 x 687

LC320DXE-FGA3 / LC320DUE-FGA3

NC390DUN-VXBP1 [39LB5800-SB]

Only for training and service purposes

- 8 -

5. External Input Support Format

5.1. Component input(Y, PB, PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I

2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I

3. 720*480 31.50 60 27.027 SDTV 480P

4. 720*480 31.47 59.94 27.00 SDTV 480P

5. 720*576 15.625 50* 13.5 SDTV 576I

6. 720*576 31.25 50* 13.5 SDTV 576P

7. 1280*720 37.5 50* 74.25 HDTV 720P

8. 1280*720 45.00 60.00 74.25 HDTV 720P

9. 1280*720 44.96 59.94 74.176 HDTV 720P

10. 1929*1080 28.125 50* 74.25 HDTV 1080I

11. 1920*1080 33.75 60.00 74.25 HDTV 1080I

12. 1920*1080 33.72 59.94 74.176 HDTV 1080I

13. 1920*1080 56.25 50* 148.5 HDTV 1080P

14. 1920*1080 67.50 60 148.50 HDTV 1080P

15. 1920*1080 67.432 59.94 148.352 HDTV 1080P

16. 1920*1080 27.00 24.00 74.25 HDTV 1080P

17. 1920*1080 26.97 23.976 74.176 HDTV 1080P

18. 1920*1080 33.75 30.00 74.25 HDTV 1080P

19. 1920*1080 33.71 29.97 74.176 HDTV 1080P

Only for training and service purposes

- 9 -

5.2. HDMI : EDID DATA : Refer to adjust specification

5.2.1. DTV mode

No Resolution H-freq(kHz) V-freq.(Hz)

1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out but display

2 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4 720*480 31.47 59.94 27 SDTV 480P

5 31.5 60.00 27.027 SDTV 480P

6 720*576 31.25 50.00 27 SDTV 576P

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 45 60.00 74.25 HDTV 720P

9 37.5 50.00 74.25 HDTV 720P

10 1920*1080 28.125 50.00 74.25 HDTV 1080I

11 33.72 59.94 74.176 HDTV 1080I

12 33.75 60.00 74.25 HDTV 1080I

13 26.97 23.976 63.296 HDTV 1080P

14 27.00 24.000 63.36 HDTV 1080P

15 33.71 29.97 79.120 HDTV 1080P

16 33.75 30.00 79.20 HDTV 1080P

17 56.25 50.00 148.5 HDTV 1080P

18 67.432 59.94 148.350 HDTV 1080P

19 67.5 60.00 148.5 HDTV 1080P

Pixel

clock(MHz)

Proposed Remark

5.2.2. PC mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed Remarks

1 640*350 31.468 70.09 25.17 EGA

2 720*400 31.469 70.09 28.32 DOS

3 640*480 31.469 59.94 25.17 VESA(VGA)

4 800*600 37.879 60.31 40 VESA(SVGA)

5 1024*768 48.363 60.00 65 VESA(XGA)

6 1152*864 54.348 60.053 80.002 VESA(VGA)

7 1360*768 47.712 60.015 84.75 VESA(WXGA)

8 1280*1024 63.981 60.020 109.00 SXGA

9 1920*1080 67.5 60 158.40 WUXGA (Reduced Blanking) Only FHD Model

Only FHD Model (Support to HDMI-PC)

Only for training and service purposes

- 10 -

5.3. 3D mode

5.3.1. RF Input (3D supported mode manually)

No Resolution Proposed 3D input proposed mode

1 HD 1080I

720P

2 SD 576P

576I

5.3.2. RF Input (3D supported mode automatically)

No Signal 3D input proposed mode

1 Frame Compatible Side by Side(Half), Top & Bottom

5.3.3. HDMI Input 1.3 - DTV(3D supported mode manually)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1 1280*720 45.00 60.00 74.25 HDTV 720P 2D to 3D

2 1280*720 37.500 50 74.25 HDTV 720P 2D to 3D

3 1920*1080 33.75 60.00 74.25 HDTV 1080I 2D to 3D

4 1920*1080 28.125 50.00 74.25 HDTV 1080I 2D to 3D

5 1920*1080 27.00 24.00 74.25 HDTV 1080P 2D to 3D

6 1920*1080 28.12 25 74.25 HDTV 1080P 2D to 3D

7 1920*1080 33.75 30.00 74.25 HDTV 1080P 2D to 3D

8 1920*1080 56.25 50 148.5 HDTV 1080P 2D to 3D

9 1920*1080 67.50 60.00 148.5 HDTV 1080P 2D to 3D

2D to 3D Side by Side(Half) Top & Bottom

2D to 3D

Side by Side(half), Top & Bottom, Single Frame Sequential

Side by Side(half), Top & Bottom

Side by Side(half), Top & Bottom, Checkerboard

Side by Side(half), Top & Bottom, Checkerboard, Single Frame Sequential, Row Interleaving, Column Interleaving

Only for training and service purposes

- 11 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied all of the LJ46B LED TV models, which produced in manufacture department or similar LG TV factory

2. Notice

(1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation transformer will help protect test instrument.

(2) Adjustment must be done in the correct order. But it is

flexible when its factory local problem occurs.

(3) The adjustment must be performed in the circumstance of

25 ±5ºC of temperature and 65±10% of relative humidity if there is no specific designation.

(4) The input voltage of the receiver must keep 100~220V,

50/60Hz.

(5) Before adjustment, execute Heat-Run for 5 minutes.

▪ After Receive 100% Full white pattern (06CH) then process

Heat-run

(or “8. Test pattern” condition of Ez-Adjust status)

▪ How to make set white pattern

1) Press Power ON button of Service Remocon

2) Pr ess ADJ button of Service remocon. Select “8. Test pattern” and, after select “White” using navigation button, and then you can see 100% Full White pattern.

* In this status you can maintain Heat-Run useless any pattern

generator

* Notice : if you mai nt ain one pictu re ov er 20 minutes

(Especially sharp distinction black with white pattern

-13Ch, or Cross hatch pattern – 09Ch) then it can appear image stick near black level.

4. PCB Assembly Adjustment

4.1. MAC Address, ESN Key and Widevine Key download

4.1.1. Equipment & Condition

1) Play file: keydownload.exe

4.1.2. Communication Port connection

1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)

2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)

4.1.3. Download process

1) Select the download items.

2) Mode check: Online Only

3) Check the test process

- DETECT -> MAC_WRITE -> ESN_WRITE -> WIDEVINE_ WRITE -> HDCP14_WRITE -> HDCP20_WRITE

4) Play : START

5) Check of result: Ready, Test, OK or NG

4.1.4. Communication Port connection

1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C

Port

3. Adjustment items

3.1. PCB Assembly Adjustment

▪ MAC Address / ESN / Widevine Download ▪ EDID (The Extended Display Identific ation Data)/D DC

(Display Data Channel) download * If it is necessary, it can adjustment at Manufacture Line You can see set adjustment status at “1. ADJUST CHECK”

of the “In-start menu”

3.2. Set Assembly Adjustment

▪ Color Temperature (White Balance) Adjustment ▪ Using RS-232C ▪ PING Test ▪ Selection Factory output option

Only for training and service purposes

4.1.5. Download

1) 14Y LED TV+MAC+Widevine+ESN Key+ HDCP1.4 and HDCP2.0

4.1.6. Inspection

- In INSTART menu, check these keys.

- 12 -

4.2. LAN PORT INSPECTION(PING TEST)

4.2.1. Equipment setting

1) Play the LAN Port Test PROGRAM.

2) Input IP set up for an inspection to Test Program.

*IP Number : 12.12.2.2.

4.2.2. LAN PORT inspection (PING TEST)

1) Play the LAN Port Test Program.

2) connect each other LAN Port Jack.

3) Play Test (F9) button and confirm OK Message.

4) remove LAN CABLE

4.3. ADC Adjust => No need at Assembly line because of OPT type

* OTP mode Automatic ADC Calibration. (Internal ADC Calibration) On the manufacture line, OTP is used for ADC Calibration automatically.

* External mode Manual ADC Calibration. When OTP mode is failed, ADC calibration should be “OK” by using External mode.

- If you want re-adjust for ADC.

■ Enter Service Mode by pushing “ADJ” key, ■ Enter Internal ADC mode by pushing “►” key at “6. ADC

Calibration”

■

Adjustment protocol

Order Command Set response

(1) Inter the Adjustment mode aa 00 00 a 00 OK00x

(2) Change the Source xb 00 40

xb 00 60

(3) Start Adjustment ad 00 10

(4) Return the Response OKx ( Success condition )

(5) Read Adjustment data ( main)

ad 00 20 ( main ) ad 00 30

(6) Conrm Adjustment ad 00 99 NG 03 00x (Failed condition)

(7) End of Adjustment ad 00 90 d 00 OK90x

b 00 OK40x (Adjust 480i Comp1 ) (Adjust 1080p Comp1) b 00 OK60x (Adjust 1080p RGB)

NGx ( Failed condition )

(main : component1 480i, RGB 1080p) 000000000000000000000000007c007b006dx (main : component1 1080p) 000000070000000000000000007c0083 0077x

NG 03 01x (Failed condition) NG 03 02x (Failed condition) OK 03 03x (Success condition)

Only for training and service purposes

- 13 -

5. Factory Adjustment

5.1. EDID (The Extended Display Identification Data)/DDC (Display Data Channel) Download

● Summary

▪ It is established in VESA, for communication between PC

and Monitor without order from user for building user condition. It helps to make easily use realize “Plug and Play” function. For EDID data write, we use DDC2B protocol.

● Auto Download (No need Writing EDID data in Assembly line)

▪ After Set Tool Option, then TV turn off and on finish auto

download

* EDID data for 3DTV (FHD) – 39/42/47/60LB5800-SA (Model

name = LG TV ) .

* Rev. xxx to confirm that, Rev. up subject to change(DV

version)

- HDMI EDID table

- HDMI-1 EDID table (0xE7, 0X1B)

5.2. Adjustment White balance

● W/B Equipment condition

CA210 : CH 9, Test signal : Inner pattern (80IRE) – LAMP

Module

CH14 , Test signal : Inner pattern (80IRE) – LED

Module

CH18 , Test signal : Inner pattern (80IRE) – ALEF

Module

● Above 5 minutes H/run in the inner pattern. (“power on” key of

adjust remote control)

※ The spec of color temperature and coordinate.

All

Cool

(C50)

Medium

Warm

(W50)

(0)

13,000k K

9,300k K

6,500k K

※ LB58xx Series (Normal Line)

- Except Winter Season ( Jan. , Feb. ) and Global table (LGD, CMI Module)

H/R Time(Min)

271 270 285 293 313 329

1 0-2 281 287 295 310 320 342

2 3-5 280 285 294 308 319 340

3 6-9 278 284 292 307 317 339

4 10-19 276 281 290 304 315 336

5 20-35 275 277 289 300 314 332

6 36-49 274 274 288 297 313 329

7 50-79 273 272 287 295 312 327

8 80-119 272 271 286 294 311 326

9 Over 120 271 270 285 293 310 325

X=0.269 (±0.002) Y=0.273 (±0.002)

X=0.285 (±0.002) Y=0.293 (±0.002)

X=0.313 (±0.002) Y=0.329 (±0.002)

Cool Medium Warm

x y x x y x

- Inner pattern for W/B adjust

- External white

pattern (80IRE, 204gray)

A. If the LVDS supports 8bit (not support Deep color) , CEA

Block 0x23 :80, 0x24 : 1E)

1) HDMI 1 Check sum : 0xE7, 0X1B (CEA Block 0x21 :10)

2) HDMI 2 Check sum : 0xE7, 0X0B (CEA Block 0x21 :20)

3) HDMI 3 Check sum : 0xE7, 0XFB (CEA Block 0x21 :30)

B. If the LVDS supports 10bit (support Deep color) , CEA Block

0x23 :B8, 0x24 : 2D)

1) HDMI 1 Check sum : 0xE7, 0X1B (CEA Block 0x21 :10)

2) HDMI 2 Check sum : 0xE7, 0X0B (CEA Block 0x21 :20)

3) HDMI 3 Check sum : 0xE7, 0XFB (CEA Block 0x21 :30

Only for training and service purposes

※ LB58xx Series (Normal Line) - Only Winter Season in Korea

( Jan. , Feb.) (LGD, CMI Module)

Cool Medium Warm

H/R Time(Min)

1 0-2 283 292 297 315 322 347

2 3-5 282 290 296 313 321 345

3 6-9 280 288 294 311 319 343

4 10-19 277 284 291 307 316 339

5 20-35 275 279 289 302 314 334

6 36-49 274 275 288 298 313 330

7 50-79 273 272 287 295 312 327

8 80-119 272 271 286 294 311 326

9 Over 120 271 270 285 293 310 325

- 14 -

x y x x y x

271 270 285 293 313 329

※ LB58xx Series (Aging Chamber) – LGD, CMI Module

Cool Medium Warm

H/R Time(Min)

1 0-5 280 285 294 308 319 340

2 6-10 276 280 290 303 315 335

3 11-20 272 275 286 298 311 330

4 21-30 269 272 283 295 308 327

5 31-40 267 268 281 291 306 323

6 41-50 266 265 280 288 305 320

7 51-80 265 263 279 286 304 318

8 81-119 264 261 278 284 303 316

9 Over 120 264 260 278 283 303 315

x y x x y x

271 270 285 293 313 329

※ Connecting picture of the measuring instrument (On Automatic

control)

Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER-ON -> Enter the mode of White-Balance, the pattern will come out

● Auto adjustment Map(RS-232C)

RS-232C COMMAND [ CMD ID DATA ] Wb 00 00 White Balance Start Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm 00 Cool Mid Warm

R Gain Jg ja jd 00 172 192 192 192

G Gain Jh jb je 00 172 192 192 192

B Gain Ji jc jf 192 192 172 192

R Gain 64 64 64 128

G Gain 64 64 64 128

B Gain 64 64 64 128

MIN CENTER

(DEFAULT)

● Manual W/B process using adjusts Remote control.(TBD)

- Co lor analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000

- Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting

- After enter Service Mode by pushing “ADJ” key,

MAX

● Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (Illumination is less than 10ux).

(2) Adhere closely the Color Analyzer ( CA210 ) to the module

less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°).

(3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others, check the

back light on.

Only for training and service purposes

- 15 -

- Enter White Balance by pushing “►” key at “8. White

Balance”

● For manual adjustment, it is also possible by the following

sequence

(1) Set TV in Adj. mode using “P-ONLY” key on remote controller

and then operate heat run longer than 15 minutes.

(I f not executed this step, the condition for W/B may be

different.) (2) Push “Exit” key. (3) Enter White Balance mode by pushing the ADJ key and select

“8. White Balance”. When KEY (►) is pressed, 206 Gray

internal pattern will be displayed.

(4) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface

(5) Select each items (Red/Green/Blue Gain) using ▲/▼(CH +/-)

key on R/C..

(6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.

(7) Adjust three modes all (Cool / Medium / Warm) -Fix the one of

R/G/B gain and change the others

(8) When adjustment is completed, exit adjustment mode using

EXIT key on R/C.

※ CASE Cool

- First adjust the coordinate far away from the target value(x, y). (1) x, y > target (i) Decrease the R, G. (2) x, y < target (i) First decrease the B gain, (ii) Decrease the one of the others. (3) x > target , y < target (i) First decrease B, so make y a little more than the target. (ii) Adjust x value by decreasing the R (4) x < target , y > target (i) First decrease B, so make x a little more than the target. (ii) Adjust x value by decreasing the G

※ After You finish all adjustments, Press “In-start” button and

compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.

If it is not same, then correct it same with BOM and unplug AC

cable. For correct it to the model’s module from factory JIG model.

● RS-232C Command (Commonly apply)

RS-232C COMMAND

CMD DATA ID

wb 00 00 White Balance adjustment start

Wb 00 10

wb 00 1f End of gain adjust

wb 00 20

wb 00 2f End of offset adjust

wb 00 ff End of White Balance adjust

Start of adjust gain (Inner white pattern)

Start of offset adjust(Inner white pattern)

(Inner pattern disappeared)

Explanation

▪ “wb 00 00”: Start Auto-adjustment of white balance. ▪ “wb 00 10”: Start Gain Adjustment (Inner pattern) ▪ “jb 00 c0” : ▪ … ▪ “wb 00 1f”: End of Adjustment

* If it needs, offset adjustment (wb 00 20-start, wb 00 2f-end)

▪ “wb 00 ff”: End of white balance adjustment (inner pattern

disappear)

※ Notice) Adjustment Mapping information

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm 00 Cool Mid Warm

R Gain Jg ja jd 00 172 192 192 192

G Gain Jh jb je 00 172 192 192 192

B Gain Ji jc jf 192 192 172 192

R Gain 64 64 64 128

G Gain 64 64 64 128

B Gain 64 64 64 128

MIN CENTER

(DEFAULT)

MAX

※ Push The “I N STOP KEY” after completing the functi on

inspection.

Only for training and service purposes

- 16 -

5.3. HDMI ARC Function Inspection

5.3.1. Test equipment

- Optic Receiver Speaker

- MSHG-600 (SW: 1220 ↑)

- HDMI Cable (for 1.4 version)

5.3.2. Test method

(1) Insert the HDMI Cable to the HDMI ARC port from the

master equipment (HDMI1)

(2) Check the sound from the TV Set

(3) Check the Sound from the Speaker or using AV & Optic

TEST program (It’s connected to MSHG-600)

5.5. MHL Test

Step 1) Turn on TV Step 2) Select HDMI4 mode using input Menu. Step 3) Set MHL Zig(M1S0D3617) using MHL input, output

and power code.

Step 4) Connect HDMI cable between MHL Zig and HDMI4

port.

Step 5) Check LED light of Zig and Module of Set

Result) If, The LED light is green and The Module shows normal stream -> OK Else -> NG

* Remark: Inspect in Power Only Mode and check SW version

in a master equipment

5.4. Selection of Country option

Selection of country option is allowed only North American model (Not allowed Korean model). It is selection of Country about Rating and Time Zone.

▪ Models: All models which use LJ22E Chassis (See the first

page.)

▪ Press “In-Start” button of Service Remocon, then enter the

“Option” Menu with “PIP CH-“ Button

▪ Select one of these three (USA, CANADA, MEXICO) defends

on its market using “Vol. +/-“button.

※ Caution : Don’t push The INSTOP KEY after completing the

function inspection.

Only for training and service purposes

- 17 -

6. GND and HI-POT Testing

6.1. GND & HI-POT auto-check preparation

Check the connection between set and power cord

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

6.2. GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX) (5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process

automatically

6.3. Check Point

(1) Test voltage 3 Poles : GND: 1.5KV/min at 100mA / SIGNAL: 3KV/min at

100mA (2) TEST time: 1 second (3) TEST POINT 3 Poles : GND Test = POWER CORD GND and SIGN AL

CABLE GND. Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms

7. USB DOWNLOAD (*.epk file download)

(1) Put the USB Stick to the USB socket (2) Press Menu key, and move OPTION (3)

(4) Press “FAV” Press 7 times.

(5) Select download file (epk file)

Only for training and service purposes

- 18 -

(6) After download is finished, remove the USB stick. (7) Press “IN-START” key of ADJ remote control, check the

S/W version

BLOCK DIAGRAM

IC 105

MTK – A2

X-TAL

27MHz

IF_P/N

SIF

TU_CVBS

TUNER

IR/ eyeQ/

LED/

Logo Lighting/

Control Key

DDR3

Micron

2 Gb*1

DDR3

Micron

4 Gb*2

DDR3 Data

Wake

On

LAN

MICOM

Audio AMP.

NTP7513

eMMC

SAMSUNG

4GB

USB 1/2/3

HDMI 1/2/3

AV

Component

H/P Out

SPDIF

Ethernet

LVDS

Speaker R/L

EAR PHONE AMP.

TPA6138

HDCP EEPROM

I2C 1

I2C 3

NVRAM

I2C 5

I2C 6

I2C 0

I2C 1

DM/DP

Y/Pb/Pr

CVBS

X-TAL

32.768MHz

MHL

SIL1292

I2C 2

MODULE

AUDIO IN

Only for training and service purposes

- 19 -

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

400

IMPORTANT SAFETY NOTICE

900

521

410

540

350

LV1

120

530

AT1

200

A10

Set + Stand

A2

Only for training and service purposes

- 20 -

WOL_CTL

LGE Internal Use Only

VDD3V3

+3.5V_ST

R500 10K

B

C500

4.7uF 10V

OPT

R502

R501

+3.5V_ST_WAKE

10K

1.8K

C

Q500 MMBT3904(NXP)

E

+3.3V_NORMAL

OPT

L503

BLM18PG121SN1D

OPT

L502

BLM18PG121SN1D

Q501

PMV48XP

S

G

C501

4.7uF 10V

L501

BLM18PG121SN1D

C503 10uF

OPT

C504

0.1uF

D

C502

0.1uF 16V

OPT

VDD3V3

C505 10uF

AVDD_33SB

C506

0.1uF

+3.5V_ST_WAKE

5V

ZD500

IC105

+1.2V_MTK_CORE

3.3V_EMMC

L505

BLM18PG121SN1D

+1.2V_MTK_CORE

OPT

C513 10uF

POWER_ON/OFF1

C531

0.1uF 16V

OPT

C527

0.1uF

TP500

OPT

C535

0.1uF

LAN_JACK_POWER

TP501

VDD3V3

C510

0.1uF 16V

+1.2V_MTK_CORE

IC500

AP2121N-3.3TRE1

VIN

3

1

60mA

C507

C508

0.1uF

2.2uF

+3.5V_ST_WAKE

OPT

C514 10uF

L504

BLM18PG121SN1D

VOUT

2

GND

C517 10uF

5600mA

C523

0.1uF

C518 10uF

AVDD_33SB

C512 1uF 10V

C532

C520

0.1uF

+1.2V_MTK_AVDD

+3.3V_NORMAL

DECAP FOR SOC (HIDDEN - UCC) DECAP FOR SOC Rework (BOTTOM)

+1.5V_DDR

C509

0.1uF

C511

0.1uF

+1.2V_MTK_CORE

+1.5V_DDR

OPT

C539

0.1uF

TP502

VDD3V3

OPT

C541

0.1uF 16V

TP503

LGE2122[A2_M13]

L11

VCCK_1

N12

VCCK_2

P12

VCCK_3

AG5

VCCK_4

AH5

VCCK_5

AJ5

VCCK_6

AK5

VCCK_7

AL5

VCCK_8

AM5

VCCK_9

AN5

VCCK_10

AK6

VCCK_11

AL6

VCCK_12

AM6

VCCK_13

AN6

VCCK_14

M11

VCCK_15

N11

VCCK_16

P11

VCCK_17

R11

VCCK_18

M12

VCCK_19

R12

VCCK_20

L13

VCCK_21

L14

VCCK_22

L15

VCCK_23

L17

VCCK_24

L18

VCCK_25

L19

VCCK_26

T11

VCCK_27

U11

VCCK_28

V11

VCCK_29

W11

VCCK_30

Y11

VCCK_31

AA11

VCCK_32

AB11

VCCK_33

AC11

VCCK_34

R23

VCCK_35

L12

VCCK_36

W12

VCCK_37

V23

VCCK_38

Y12

VCCK_39

AF6

VCCK_40

AG6

VCCK_41

AH6

VCCK_42

AJ6

VCCK_43

AE7

VCCK_44

AF7

VCCK_45

AG7

VCCK_46

AD8

VCCK_47

AE8

VCCK_48

AF8

VCCK_49

AE9

VCCK_50

AC10

VCCK_51

AD10

VCCK_52

AD11

VCCK_53

AE10

VCCK_54

AF9

VCCK_55

AG8

VCCK_56

AH7

VCCK_57

AJ7

VCCK_58

AK7

VCCK_59

AL7

VCCK_60

AM7

VCCK_61

AN7

VCCK_62

L16

VCCK_63

V12

VCCK_64

U12

VCCK_65

T12

VCCK_66

AD13

VCCK_67

AD17

VCCK_68

AD14

VCCK_69

AB12

VCCK_70

AA12

VCCK_71

AC12

VCCK_72

T9

VCC3IO_C

Y10

VCC3IO_B_1

AA10

VCC3IO_B_2

D22

VCC3IO_A_1

E22

VCC3IO_A_2

AC18

DVSS_1

AB21

DVSS_2

AB14

DVSS_3

N13

DVSS_4

P13

DVSS_5

R13

DVSS_6

T13

DVSS_7

U13

DVSS_8

V13

DVSS_9

W13

DVSS_10

Y13

DVSS_11

P18

DVSS_12

N14

DVSS_13

P14

DVSS_14

R14

DVSS_15

T14

DVSS_16

U14

DVSS_17

V14

DVSS_18

W14

DVSS_19

Y14

DVSS_20

R18

DVSS_21

N15

DVSS_22

P15

DVSS_23

DVSS_24 DVSS_25 DVSS_26 DVSS_27 DVSS_28 DVSS_29 DVSS_30 DVSS_31 DVSS_32 DVSS_33 DVSS_34 DVSS_35 DVSS_36 DVSS_37 DVSS_38 DVSS_39 DVSS_40 DVSS_41 DVSS_42 DVSS_43 DVSS_44 DVSS_45 DVSS_46 DVSS_47 DVSS_48 DVSS_49 DVSS_50 DVSS_51 DVSS_52 DVSS_53 DVSS_54 DVSS_55 DVSS_56 DVSS_57 DVSS_58 DVSS_59 DVSS_60 DVSS_61 DVSS_62 DVSS_63 DVSS_64 DVSS_65 DVSS_66 DVSS_67 DVSS_68 DVSS_69 DVSS_70 DVSS_71 DVSS_72 DVSS_73 DVSS_74 DVSS_75 DVSS_76 DVSS_77 DVSS_78 DVSS_79 DVSS_80 DVSS_81 DVSS_82 DVSS_83 DVSS_84 DVSS_85 DVSS_86 DVSS_87 DVSS_88 DVSS_89 DVSS_90 DVSS_91 DVSS_92 DVSS_93 DVSS_94 DVSS_95 DVSS_96 DVSS_97 DVSS_98

DVSS_99 DVSS_100 DVSS_101 DVSS_102 DVSS_103 DVSS_104 DVSS_105 DVSS_106 DVSS_107 DVSS_108 DVSS_109 DVSS_110 DVSS_111 DVSS_112 DVSS_113 DVSS_114 DVSS_115 DVSS_116 DVSS_117 DVSS_118 DVSS_119 DVSS_120 DVSS_121 DVSS_122 DVSS_123 DVSS_124 DVSS_125 DVSS_126 DVSS_127

R15 T15 U15 V15 W15 Y15 AA15 AB15 T18 R16 T16 U16 V16 W16 Y16 AA16 AB16 R17 T17 U17 V17 Y17 N16 V18 Y18 P16 V19 Y19 W17 AA17 AB17 N19 AC14 C13 K24 K25 L24 M17 M18 M19 P17 P19 N18 U20 V20 W20 Y20 AA20 R19 T19 M20 N20 U21 V21 W21 Y21 AA21 P20 R20 T20 U22 V22 W22 Y22 AA22 N21 P21 R21 T21 M22 N22 P22 R22 T22 M21 AC17 AA19 M13 M14 M15 AA13 AB13 AA14 AB19 D6 W19 U19 N17 L3 AB18 AA18 W18 U18 D16 AC13 M16 AC20 AC22 AD20 Y23 AA23 AB23 V24 W23

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

MID_MAIN_3

2011.12.09

10

A_RVREF1

LGE Internal Use Only

A_RVREF4

+1.5V_DDR

R706 1K 1%

R707 1K 1%

R708 1K 1%

R709 1K1%C716

C713

0.1uF

C714

0.1uF

C715

0.1uF

R710

A_RVREF4

A_RVREF1

+1.5V_DDR

M8

H1

1% 240

L8

B2 D9 G7 K2 K8 N1 N9 R1 R9

A1 A8 C1 C9 D2 E9 F1 H2 H9

J1 J9 L1 L9

A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9

B1 B9 D1 D8 E2 E8 F9 G1 G9

DDR_512MB_SS

IC701

K4B4G1646B-HCK0

VREFCA

VREFDQ

ZQ

VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9

VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9

NC_1 NC_2 NC_3 NC_4

VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8 VSS_9 VSS_10 VSS_11 VSS_12

VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9

A10/AP

A12/BC

RESET

DDR_512MB_SS

IC703

ARA[0-14]

ARA[0]

N3

A0

ARA[1]

P7

A1

ARA[2]

P3

A2

ARA[3]

N2

A3

ARA[4]

P8

A4

ARA[5]

P2

A5

ARA[6]

R8

A6

ARA[7]

R2

A7

ARA[8]

T8

A8

ARA[9]

R3

A9

ARA[10]

L7

ARA[11]

R7

A11

ARA[12]

N7

ARA[13]

T3

A13

ARA[14]

T7

A14

M7

A15

M2

BA0 BA1 BA2

CK CK

CKE

CS ODT RAS CAS

WE

DQSL DQSL

DQSU DQSU

DML DMU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

ARBA0

N8

ARBA1

M3

ARBA2

J7 K7 K9

ARCKE

L2

/ARCS

K1

ARODT

J3

/ARRAS

K3

/ARCAS

L3

/ARWE

T2

ARREST

F3

ARDQS0

G3

/ARDQS0

C7

ARDQS1

B7

/ARDQS1

E7

ARDQM0

D3

ARDQM1

ARDQ[0]

E3

ARDQ[1]

F7

ARDQ[2]

F2

ARDQ[3]

F8

ARDQ[4]

H3

ARDQ[5]

H8

ARDQ[6]

G2

ARDQ[7]

H7

ARDQ[8]

D7

ARDQ[9]

C3

ARDQ[10]

C8

ARDQ[11]

C2

ARDQ[12]

A7

ARDQ[13]

A2

ARDQ[14]

B8

ARDQ[15]

A3

ARCLK0

R712 100 5%

/ARCLK0

ARDQ[0-7]

ARDQ[8-15]

ARCLK1

/ARCLK1

ARDQ[16-23]

ARDQ[24-31]

ARA[0-14]

R714 100 5%

ARDQ[16] ARDQ[17] ARDQ[18] ARDQ[19] ARDQ[20] ARDQ[21] ARDQ[22] ARDQ[23]

ARDQ[24] ARDQ[25] ARDQ[26] ARDQ[27] ARDQ[28] ARDQ[29] ARDQ[30] ARDQ[31]

ARBA0 ARBA1 ARBA2

ARCKE

/ARCSX

ARODT /ARRAS /ARCAS

/ARWE

ARREST

ARDQS2

/ARDQS2

ARDQS3

/ARDQS3

ARDQM2 ARDQM3

ARA[0] ARA[1] ARA[2] ARA[3] ARA[4] ARA[5] ARA[6] ARA[7] ARA[8] ARA[9] ARA[10] ARA[11]

ARA[12] ARA[13] ARA[14]

K4B4G1646B-HCK0

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

T7

A14

M7

A15

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

+1.5V_DDR

C718

0.1uF

C720

0.1uF

C722

0.1uF

C726

0.1uF

C728

0.1uF

C703

10uF

1uF

10V

C701

+1.5V_DDR

C708

C717

0.1uF

C719

0.1uF

C750

0.1uF

C723

0.1uF

C725

0.1uF

C727

0.1uF

C706

10uF

1uF

10V

VREFCA

VREFDQ

VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9

VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9

VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8

VSS_9 VSS_10 VSS_11 VSS_12

VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9

A_RVREF2

M8

A_RVREF3

H1

1%

240

R716

L8

ZQ

+1.5V_DDR

B2 D9 G7 K2 K8 N1 N9 R1 R9

A1 A8 C1 C9 D2 E9 F1 H2 H9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9

B1 B9 D1 D8 E2 E8 F9 G1 G9

A_RVREF2

A_RVREF3

+1.5V_DDR

C735

R720

0.1uF 1K 1%

R721

C736

1K 1%

0.1uF

+1.5V_DDR

C707

C705

10uF

1uF

10V

+1.5V_DDR

C733

R718

0.1uF 1K 1%

R719

C734

1K 1%

0.1uF

H5TQ4G63AFR-PBC

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

T7

A14

M7

A15

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

IC701-*1

H5TQ4G63AFR-PBC

DDR_512MB_Hynix

M8

N3

VREFCA

A0

P7

A1

P3

A2

H1

N2

VREFDQ

A3

P8

A4

P2

A5

L8

R8

ZQ

A6

R2

A7

T8

A8

B2

R3

VDD_1

A9

D9

L7

VDD_2

A10/AP

G7

R7

VDD_3

A11

K2

N7

VDD_4

A12/BC

K8

T3

VDD_5

A13

N1

T7

VDD_6

A14

N9

M7

VDD_7

A15

R1

VDD_8

R9

M2

VDD_9

BA0

N8

BA1

M3

BA2

A1

VDDQ_1

A8

J7

VDDQ_2

CK

C1

K7

VDDQ_3

CK

C9

K9

VDDQ_4

CKE

D2

VDDQ_5

E9

L2

VDDQ_6

CS

F1

K1

VDDQ_7

ODT

H2

J3

VDDQ_8

RAS

H9

K3

VDDQ_9

CAS

L3

WE

J1

NC_1

J9

T2

NC_2

RESET

L1

NC_3

L9

NC_4

F3

DQSL

G3

DQSL

A9

C7

VSS_1

DQSU

B3

B7

VSS_2

DQSU

E1

VSS_3

G8

E7

VSS_4

DML

J2

D3

VSS_5

DMU

J8

VSS_6

M1

E3

VSS_7

DQL0

M9

F7

VSS_8

DQL1

P1

F2

VSS_9

DQL2

P9

F8

VSS_10

DQL3

T1

H3

VSS_11

DQL4

T9

H8

VSS_12

DQL5

G2

DQL6

H7

DQL7

B1

VSSQ_1

B9

D7

VSSQ_2

DQU0

D1

C3

VSSQ_3

DQU1

D8

C8

VSSQ_4

DQU2

E2

C2

VSSQ_5

DQU3

E8

A7

VSSQ_6

DQU4

F9

A2

VSSQ_7

DQU5

G1

B8

VSSQ_8

DQU6

G9

A3

VSSQ_9

DQU7

IC701-*2

IC703-*1

MT41K256M16HA-125:E

DDR_512MB_Hynix

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

MT41K256M16HA-125:E

DDR_512MB_MICRON

M8

N3

VREFCA

A0

P7

A1

P3

A2

N2

H1

N2

A3

VREFDQ

A3

P8

A4

P2

A5

R8

L8

A6

ZQ

R2

A7

T8

A8

R3

B2

A9

VDD_1

L7

D9

A10/AP

VDD_2

R7

G7

A11

VDD_3

N7

K2

N7

A12/BC

VDD_4

T3

K8

T3

A13

VDD_5

A13

N1

VDD_6

N9

M7

VDD_7

NC_5

R1

VDD_8

R9

M2

VDD_9

BA0

N8

BA1

M3

BA2

A1

VDDQ_1

A8

J7

VDDQ_2

CK

C1

K7

VDDQ_3

CK

C9

K9

VDDQ_4

CKE

D2

VDDQ_5

E9

L2

VDDQ_6

CS

F1

K1

VDDQ_7

ODT

H2

J3

VDDQ_8

RAS

H9

K3

VDDQ_9

CAS

L3

WE

J1

NC_1

J9

T2

NC_2

RESET

L1

NC_3

L9

NC_4

T7

F3

A14

DQSL

G3

DQSL

A9

C7

VSS_1

DQSU

B3

B7

VSS_2

DQSU

E1

VSS_3

G8

E7

VSS_4

DML

J2

D3

VSS_5

DMU

J8

VSS_6

M1

E3

VSS_7

DQ0

M9

F7

VSS_8

DQ1

P1

F2

VSS_9

DQ2

P9

F8

VSS_10

DQ3

T1

H3

VSS_11

DQ4

T9

H8

VSS_12

DQ5

G2

DQ6

H7

DQ7

B1

VSSQ_1

B9

D7

VSSQ_2

DQ8

D1

C3

VSSQ_3

DQ9

D8

C8

VSSQ_4

DQ10

E2

C2

VSSQ_5

DQ11

E8

A7

VSSQ_6

DQ12

F9

A2

VSSQ_7

DQ13

G1

B8

VSSQ_8

DQ14

G9

A3

VSSQ_9

DQ15

IC703-*2

DDR_512MB_MICRON

IC701-*3

MT41K128M16JT-125:K

DDR_256MB_MICRON

M8

N3

VREFCA

A0

P7

A1

P3

A2

N2

H1

A3

VREFDQ

P8

A4

P2

A5

R8

L8

A6

ZQ

R2

A7

T8

A8

R3

B2

A9

VDD_1

L7

D9

A10/AP

VDD_2

R7

G7

A11

VDD_3

N7

K2

A12/BC

VDD_4

T3

K8

A13

VDD_5

N1

VDD_6

N9

M7

VDD_7

NC_5

R1

VDD_8

R9

M2

VDD_9

BA0

N8

BA1

M3

BA2

A1

VDDQ_1

A8

J7

VDDQ_2

CK

C1

K7

VDDQ_3

CK

C9

K9

VDDQ_4

CKE

D2

VDDQ_5

E9

L2

VDDQ_6

CS

F1

K1

VDDQ_7

ODT

H2

J3

VDDQ_8

RAS

H9

K3

VDDQ_9

CAS

L3

WE

J1

NC_1

J9

T2

NC_2

RESET

L1

NC_3

L9

NC_4

T7

F3

A14

DQSL

G3

DQSL

A9

C7

VSS_1

DQSU

B3

B7

VSS_2

DQSU

E1

VSS_3

G8

E7

VSS_4

DML

J2

D3

VSS_5

DMU

J8

VSS_6

M1

E3

VSS_7

DQ0

M9

F7

VSS_8

DQ1

P1

F2

VSS_9

DQ2

P9

F8

VSS_10

DQ3

T1

H3

VSS_11

DQ4

T9

H8

VSS_12

DQ5

G2

DQ6

H7

DQ7

B1

VSSQ_1

B9

D7

VSSQ_2

DQ8

D1

C3

VSSQ_3

DQ9

D8

C8

VSSQ_4

DQ10

E2

C2

VSSQ_5

DQ11

E8

A7

VSSQ_6

DQ12

F9

A2

VSSQ_7

DQ13

G1

B8

VSSQ_8

DQ14

G9

A3

VSSQ_9

DQ15

IC703-*3

MT41K128M16JT-125:K

DDR_256MB_MICRON

M8

N3

VREFCA

A0

M8

P7

VREFCA

A1

P3

A2

H1

N2

VREFDQ

A3

H1

P8

VREFDQ

A4

P2

A5

R8

L8

A6

ZQ

L8

R2

ZQ

A7

T8

A8

R3

B2

A9

VDD_1

B2

L7 VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9

VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9

NC_1 NC_2 NC_3 NC_4 NC_6

VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8 VSS_9 VSS_10 VSS_11 VSS_12

VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9

D9

A10/AP

VDD_2

D9

R7

G7

A11

VDD_3

G7

N7

K2

A12/BC

VDD_4

K2

T3

K8

A13

VDD_5

K8

N1

VDD_6

N1

N9

M7

VDD_7

NC_5

N9

R1

VDD_8

R1

R9

M2

VDD_9

BA0

R9

N8

BA1

M3

BA2

A1

VDDQ_1

A1

A8

J7

VDDQ_2

CK

A8

C1

K7

VDDQ_3

CK

C1

C9

K9

VDDQ_4

CKE

C9

D2

VDDQ_5

D2

E9

L2

VDDQ_6

CS

E9

F1

K1

VDDQ_7

ODT

F1

H2

J3

VDDQ_8

RAS

H2

H9

K3

VDDQ_9

CAS

H9

L3

WE

J1

NC_1

J1

J9

T2

NC_2

RESET

J9

L1

NC_3

L1

L9

NC_4

L9

T7

F3

NC_6

DQSL

T7

G3

DQSL

A9

C7

VSS_1

DQSU

A9

B3

B7

VSS_2

DQSU

B3

E1

VSS_3

E1

G8

E7

VSS_4

DML

G8

J2

D3

VSS_5

DMU

J2

J8

VSS_6

J8

M1

E3

VSS_7

DQ0

M1

M9

F7

VSS_8

DQ1

M9

P1

F2

VSS_9

DQ2

P1

P9

F8

VSS_10

DQ3

P9

T1

H3

VSS_11

DQ4

T1

T9

H8

VSS_12

DQ5

T9

G2

DQ6

H7

DQ7

B1

VSSQ_1

B1

B9

D7

VSSQ_2

DQ8

B9

D1

C3

VSSQ_3

DQ9

D1

D8

C8

VSSQ_4

DQ10

D8

E2

C2

VSSQ_5

DQ11

E2

E8

A7

VSSQ_6

DQ12

E8

F9

A2

VSSQ_7

DQ13

F9

G1

B8

VSSQ_8

DQ14

G1

G9

A3

VSSQ_9

DQ15

G9

C745

0.1uF

RVREF_A

C751

0.1uF

+1.5V_DDR

C753

0.1uF

R730 1K 1%

R731 1K 1%

C746

0.1uF

C747

0.1uF

RVREF_A

C755

0.1uF

C754

0.1uF

ARCKE

ARCLK1

/ARCLK1

ARCLK0

/ARCLK0

ARODT /ARRAS /ARCAS

/ARCS

/ARWE

ARREST

ARBA0

ARBA1

ARBA2

/ARCSX

ARA[0-14]

C702 1uF

+1.5V_DDR

TP700 TP701

ARA[14] ARA[13] ARA[12] ARA[11] ARA[10] ARA[9] ARA[8] ARA[7] ARA[6] ARA[5] ARA[4] ARA[3] ARA[2] ARA[1] ARA[0]

C704 10uF 10V

LGE2122[A2_M13]

R1

DDRV_1

R2

DDRV_2

R3

DDRV_3

R4

DDRV_4

R5

DDRV_5

K3

DDRV_6

R6

DDRV_7

L8

DDRV_8

M8

DDRV_9

D17

DDRV_10

A19

DDRV_11

J22

MEMTP

K22

MEMTN

D18

RVREF_A

G8

ARCKE

B5

ARCLK1

A5

ARCLK1

B14

ARCLK0

A14

ARCLK0

F13

ARODT

E13

ARRAS

G13

ARCAS

G15

ARCS

H18

ARWE

G16

ARRESET

D15

ARBA0

F9

ARBA1

G18

ARBA2

F15

ARCSX

D11

ARA14

F16

ARA13

D8

ARA12

E11

ARA11

G9

ARA10

E16

ARA9

F11

ARA8

G17

ARA

F10

ARA6

E17

ARA5

E10

ARA4

E15

ARA3

F17

ARA2

G10

ARA1

F18

ARA0

IC105

ARDQM0 ARDQS0 ARDQS0

ARDQ0 ARDQ1 ARDQ2 ARDQ3 ARDQ4 ARDQ5 ARDQ6 ARDQ7

ARDQM1 ARDQS1 ARDQS1

ARDQ8

ARDQ9 ARDQ10 ARDQ11 ARDQ12 ARDQ13 ARDQ14 ARDQ15

ARDQM2 ARDQS2 ARDQS2 ARDQ16 ARDQ17 ARDQ18 ARDQ19 ARDQ20 ARDQ21 ARDQ22 ARDQ23

ARDQM3 ARDQS3 ARDQS3 ARDQ24 ARDQ25 ARDQ26 ARDQ27 ARDQ28 ARDQ29 ARDQ30 ARDQ31

AVDD33_MEMPLL AVSS33_MEMPLL

D12

ARDQM0

D14

ARDQS0

C14

/ARDQS0

0.1uF

ARDQM1 ARDQS1 /ARDQS1

ARDQM2 ARDQS2 /ARDQS2

ARDQM3 ARDQS3 /ARDQS3

C700

ARDQ[0] ARDQ[1] ARDQ[2] ARDQ[3] ARDQ[4] ARDQ[5] ARDQ[6] ARDQ[7]

ARDQ[8]

ARDQ[9] ARDQ[10] ARDQ[11] ARDQ[12] ARDQ[13] ARDQ[14] ARDQ[15]

ARDQ[16]

ARDQ[17]

ARDQ[18]

ARDQ[19]

ARDQ[20]

ARDQ[21]

ARDQ[22]

ARDQ[23]

ARDQ[24]

ARDQ[25]

ARDQ[26]

ARDQ[27]

ARDQ[28]

ARDQ[29]

ARDQ[30]

ARDQ[31]

VDD3V3

B17 D10 C17 C10 C18 B9 E18 D9

C15 A13 B13 B11 B16 A11 A17 C12 A16 C11 C16

A3 D5 C5 E7 B2 C8 B1 A9 C1 C9 C3

C6 A4 B4 A1 B7 C4 C7 B3 A7 A2 D7

A20 H9

ARDQ[0-7]

ARDQ[8-15]

ARDQ[16-23]

ARDQ[24-31]

B_RVREF5

B_RVREF6

+1.5V_DDR

IC702

+1.5V_DDR

BRA[14]

1% 240

MT41K128M16JT-125:K

DDR_256MB_MICRON

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

A10/AP

A12/BC

RESET

IC702-*1

BRA[0-14]

BRA[0]

N3

A0

BRA[1]

P7

A1

BRA[2]

P3

A2

BRA[3]

N2

A3

BRA[4]

P8

A4

BRA[5]

P2

A5

BRA[6]

R8

A6

BRA[7]

R2

A7

BRA[8]

T8

A8

BRA[9]

R3

A9

BRA[10]

L7

BRA[11]

R7

A11

BRA[12]

N7

BRA[13]

T3

A13

M7

NC_5

BA0 BA1 BA2

CK CK

CKE

CS ODT RAS CAS

WE

DQSL DQSL

DQSU DQSU

DML DMU

DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7

DQ8 DQ9

DQ10 DQ11 DQ12 DQ13 DQ14 DQ15

BRA[15]

M2

BRBA0

N8

BRBA1

M3

BRBA2

J7 K7 K9

BRCKE

L2

/BRCS

K1

BRODT

J3

/BRRAS

K3

/BRCAS

L3

/BRWE

T2

BRREST

F3

BRDQS0

G3

/BRDQS0

C7

BRDQS1

B7

/BRDQS1

E7

BRDQM0

D3

BRDQM1

E3

BRDQ[0]

F7

BRDQ[1]

F2

BRDQ[2]

F8

BRDQ[3]

H3

BRDQ[4]

H8

BRDQ[5]

G2

BRDQ[6]

H7

BRDQ[7]

BRDQ[8]

D7

BRDQ[9]

C3

BRDQ[10]

C8

BRDQ[11]

C2

BRDQ[12]

A7

BRDQ[13]

A2

BRDQ[14]

B8

BRDQ[15]

A3

R713 100 5%

BRDQ[0-7]

BRDQ[8-15]

BRCLK0

/BRCLK0

K4B2G1646E-BCK0

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

M7

NC_5

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

DDR_256MB_SS

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

IC702-*2

H5TQ2G63DFR-PBC

DDR_256MB_HYNIX_NC4.0

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

M7

NC_5

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

H5TQ2G63FFR-PBC

DDR_256MB_HYNIX_NC4.5

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

M7

NC_5

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

IC702-*3

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

RVREF_C

+1.5V_DDR

C741

R726

0.1uF 1K 1%

R727

C742

1K 1%

0.1uF

BRA[0-15]

RVREF_C

BRCLK0

/BRCLK0

BRCKE

BRODT /BRRAS /BRCAS

/BRCS

BRBA0

BRBA1

BRBA2

/BRWE BRA[15] BRA[14] BRA[13] BRA[12] BRA[11] BRA[10] BRA[9] BRA[8] BRA[7] BRA[6] BRA[5] BRA[4] BRA[3] BRA[2] BRA[1] BRA[0]

+1.5V_DDR

C709

B_RVREF6

R702

0.1uF

C710

0.1uF

C711

0.1uF

C712

0.1uF

B_RVREF5

R711

1K 1%

R703 1K 1%

R704 1K 1%

R705 1K 1%

LGE2122[A2_M13]

C2

RVREF_C

J2

BRCLK0

J1

BRCLK0

L6

BRCKE

E3

BRODT

L4

BRRAS

D3

BRCAS

D4

BRCS

J4

BRBA0

M6

BRBA1

E4

BRBA2

K4

BRWE

J3

BRA15

P4

BRA14

G5

BRA13

P6

BRA12

P5

BRA11

L5

BRA10

F4

BRA9

P3

BRA8

H4

BRA7

P2

BRA6

K6

BRA5

M5

BRA4

K5

BRA3

G6

BRA2

N5

BRA1

E5

BRA0

B19

DDRV_12

C19

DDRV_13

D19

DDRV_14

E19

DDRV_15

F19

DDRV_16

G19

DDRV_17

F5

DDRV_18

H5

DDRV_19

N8

DDRV_20

P8

DDRV_21

D13

DDRV_22

E8

DDRV_23

G11

DDRV_24

D20

DDRV_25

E20

DDRV_26

F20

DDRV_27

G20

DDRV_28

R7

DDRV_29

R8

DDRV_30

T5

DDRV_31

T6

DDRV_32

T7

DDRV_33

T8

DDRV_34

IC105

BRDQM0 BRDQS0 BRDQS0

BRDQ0 BRDQ1 BRDQ2 BRDQ3 BRDQ4 BRDQ5 BRDQ6 BRDQ7

BRDQM1 BRDQS1 BRDQS1

BRDQ8

BRDQ9 BRDQ10 BRDQ11 BRDQ12 BRDQ13 BRDQ14 BRDQ15

BRRESET

L1

BRDQM0

H2

BRDQS0

H1

/BRDQS0

BRREST

BRDQ[0] BRDQ[1] BRDQ[2] BRDQ[3] BRDQ[4] BRDQ[5] BRDQ[6] BRDQ[7]

BRDQM1 BRDQS1 /BRDQS1

BRDQ[8]

BRDQ[9] BRDQ[10] BRDQ[11] BRDQ[12] BRDQ[13] BRDQ[14] BRDQ[15]

E2 N3 E1 N1 D1 P1 D2 N2

H3 K1 K2 N4 F2 M3 F1 L2 F3 M4 G3

G4

BRDQ[0-7]

BRDQ[8-15]

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

2011.12.09

DDR ONE SIDE 12

SPDIF

LGE Internal Use Only

SPDIF OUT

SPDIF_OUT

R3610

+3.3V_NORMAL

R3611

2.7K OPT

33

C3602

0.1uF 16V

VINPUT

GND

Fiber Optic

1

VCC

2

JK3602

JST1223-001

3

4

FIX_POLE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

JACK HIGH / MID

2011.11.21

36

KEY1

LGE Internal Use Only

KEY2

Place Near Micom

R4117

10K

5%

R4113 100

R4114 100

+3.5V_ST

R4118

10K 5%

LOGO_LIGHT

+3.5V_ST

R4132

LOGO_LIGHT

0.1uF

10K

C4100

10K

R4133

LOGO_LIGHT

L4100

BLM18PG121SN1D

OPT

C4120

0.1uF 16V

C4102

0.1uF D4100

5.6V

AMOTECH CO., LTD.

OPT

LOGO_LIGHT

D4101

5.6V

AMOTECH CO., LTD.

OPT

C4104

LED_R

1000pF 50V

LOGO_LIGHT

Q4100

1K

R4134

MMBT3904(NXP)

+3.5V_ST

R4107

10K

IR

B

R4125 10K

LOGO_LIGHT

C

E

C4107 100pF

50V

LED_R

R4131

22

D4104

5.6V

EYE_SCL

EYE_Q_10P

EYE_SDA

EYE_Q_10P

OPT

AMOTECH CO., LTD.

R4137 100

D4105 ADMC 5M 02 200L OPT

R4138 100

D4106 ADMC 5M 02 200L OPT

KEY1

KEY2

+3.5V_ST

LOGO/LED_R

12507WR-08L

12507WR-10L

GND

IR

GND

NON_EYE_Q_8P

P4101

P4102

1

2

3

4

5

6

7

8

9

10

EYE_Q_10P

11

P4100

12507WR-06L

WIFI

7

L4111

MAX 0.4A

C4113

C4112

10uF

10V

WIFI

1

2

3

4

5

6

ZD4100

ADLC 5S 02 015

WIFI_ESD

22 R4130

OPT

22 R4136

WIFI

BLM18PG121SN1D

C4111

0.1uF 16V

WIFI

For EMI

WIFI_DM

WIFI_DP

ZD4101 ADLC 5S 02 015 WIFI_ESD

WOL/ETH_POWER_ON

WOL/WIFI_POWER_ON

WIFI

+3.5V_ST_WAKE

TP4100

TP4101

TP4102

TP4103

TP4104

RTS

M_REMOTE_RX

M_REMOTE_TX

M_RFModule_RESET

CTS

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

IR / KEY

2011.11.21

41