Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to L9(LG1152) Chassis applied LED
TV all models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 °C of temperature and 65±10% of relative humidity if
there is no specific designation.
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15 °C
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
[Caution]
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
3.3. Automatic Adjustment
3.3.1. Overview
ADC adjustment is needed to find the optimum black level and
gain in Analog-to-Digital device and to compensate RGB
deviation
3.3.2. Equipment & Condition
1) Jig (RS-232C protocol)
2) Inner Pattern
- Resolution : 1080p (Inner Pattern)
- Resolution : 1024*768 RGB (Inner Pattern)
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level : 0.7±0.1 Vp-p
3.3.3 Adjustment
3.3.3.1. Adjustment method
▪ Using RS-232, adjust items listed in 3.1 in the other shown in
“4.1.3.3”
3.3.3.2. Adj. protocol
ProtocolCommandSet ACK
Enter adj. modeaa 00 00a 00 OK00x
Source changexb 00 40
xb 00 60
Begin adj.ad 00 10
Return adj. resultOKx (Case of Success)
Read adj. data(main)
ad 00 20
b 00 OK40x (Adjust 480i Comp1 )
b 00 OK60x (Adjust 1024*768 RGB)
4.1. MAC Address, ESN Key and Widevine
Key download
4.1.1. Equipment & Condition
1) Play file: keydownload.exe
4.1.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.1.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process
- U S, Canad a m ode ls : DET EC T -> M AC _WR IT E ->
WIDEVINE_WRITE
- Korea, Me xico models: DE TECT -> MA C_WRITE ->
WIDEVINE_WRITE
4) Play : START
5) Check of result: Ready, Test, OK or NG
6) Printer out (MAC Address Label)
4.1.4. Communication Port connection
1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
Port
4.2. PING Test
* LAN card can be verified by using PING test
4.2.1 Adjustment Method(Board)
(1) Connect LAN to the board and power on.
(Default IP can be set to automatic setting. When power
ON, IP can be automatically be achieved from the router)
(2) Press ADJ key in the adjustment remote control.
(3) Check Network status by pressing 13. ACAP PING TEST in
EZ ADJUST. If it operates properly, it will show “Network is
operating properly.” If it does not, it will show “Network is
not working properly.”
4.2.2 Adjustment Method(Manufacturer)
(4) Connect the PC with PING Test program installed and the
LAN port of the SET via Cross LAN Cable. (The IP setting
of the PC has to be 12.12.2.3)
(5) After the PING Test program has been executed, check the
program setting. (IP of the set will be 12.12.2.2. Double
check the setting. Do not check the Modem because it will
not be used.)
(6) Press the Power Only Key in Adjustment remote control.
(IP of the set will be set)
(7) Upon pressing “RUN” in the program, it will show “OK” or
“NG” according to the test result.
● After all the adjustments, to disable the IP setting, press
INSTOP key.
4.1.5. Download
1) US, Canada models (12Y LCD TV + MAC + Widevine +
ESN + Google CA Key)
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Vi deo Signal Generator MSPG-925F 720p/204- Gray
(Model: 217, Pattern: 49)
※ Color Analyzer Matrix should be calibrated using CS-1000
4.4.3. Equipment connection
4.4.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMDDATAID
Wb0000Begin White Balance adj.
Wb00ffEnd White Balance adj.
(internal pattern disappears )
(2) Adjustment Map
Adj. item Command
(lower caseASCII)
CMD1CMD2MINMAX
CoolR Gainjg00C0
G Gainjh00C0
B Gainji00C0
MediumR Gainja00C0
G Gainjb00C0
B Gainjc00C0
WarmR Gainjd00C0
G Gainje00C0
B Gainjf00C0
Explanation
Data Range
(Hex.)
4.4.5. Adj. method
4.4.5.1. Auto adj. method
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
4.4.5.2. Manual adj. method
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C -> 9. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 216 Gray internal pa ttern will be
displayed.
(4) Adjust Cool modes
(i) Fix the one of R/G/B gain to 192 (default data) and
decrease the others. ( If G gain is adjusted over 172 and
R and B gain less than 192 , Adjust is O.K.)
(ii). If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain
and G gain same amount of increasing G gain.
(iii) If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255
or B gain is 255
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B
gain to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner (ON). By selecting OFF, you can
adjust using RF signal in 206 Gray pattern.
▪ Adj. condition and cautionary items
(1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to isolate
adj. area into dark surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface (80°~
100°)
(3) Aging time
- After Agi ng Sta rt, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
※ CASE Cool
First adjust the coordinate far away from the target value(x, y).
(1) x, y >target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
How to adjust
(1) If G gain is adjusted over 172 and R gain and B gain less
than 192 , Adjust is O.K.
(2) If G gain is less than 172 , increase G gain by up to 172,
and then increase R gain and B gain same amount of
increasing G gain.
(3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
4.4.6. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 204 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode
Cool0.2710.27013,000K0.0000
Medium0.2850.2939,300K0.0000
Warm0.3130.3296,500K+0.0030
▪ S ta ndard col or coo rd ina te and tempe ratur e using
CA-210(CH 14)
Mode
Cool0.269±0.0020.273±0.00213,000K0.0000
Medium0.285±0.0020.293±0.0029,300K0.0000
Warm0.313±0.0020.329±0.0026,500K0.0000
Coordinate
XY
Coordinate
XY
Temp△uv
Temp△uv
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y>target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
▪ Adj. condition and cautionary items
(1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to isolate
adj. area into dark surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface (80°~
100°)
(3) Aging time
- After Agi ng Sta rt, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
▪ S ta ndard col or coo rd ina te and tempe ratur e using
(1) Make the TV’s status to DC off
(2) Make the download file’s name to “lg_ota.zip “ and save it
on USB root.
(3) Put the USB Stick to the USB No.1
(4) Press “B-tooth” key during 3~4 second.
(5) Updating Completed, The TV will restart automatically
Only for training and service purposes
- 18 -
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
- Resolution : 1 080 p RGB ( MSP G-9 2 5FA: m o del -22 5,
pattern-65)
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level : 0.7±0.1 Vp-p
12.1.2. Adjust method
12.1.2.1 ADC 480i/1080p Comp1, RGB
(1) Check connected condition of Comp1/RGB cable to the
equipment
(2) Give a 480i Mode, Horizontal 100% Color Bar Pattern to
Comp1. (MSPG-925FA -> Model: 209, Pattern: 65)
(3) Change input mode as Component1 and picture mode as
“Standard”
(4) Press the In-start Key on the ADJ remote after at least 1
min of signal reception. Then, select 7.External ADC. And
Press OK or Right Button for going to sub menu.
(5) Press OK in Comp 480i menu
(6) Give a 1080p Mode, Horizontal 100% Color Bar Pattern to
Comp1. (MSPG-925FA -> Model: 225, Pattern: 65)
(7) Press OK in Comp 1080p menu
(8) Perform (6) and (7) in RGB-PC
(9) If ADC Comp is successful, “ADC Component Success” is
displayed. If ADC calibration is failure, “ADC Component
Fail” is displayed.
(10) If ADC calibration is failure, after rechecking ADC pattern
or condition, retry calibration
(11) If ADC RG B cali br ation is succe ssful, “ ADC RGB
Success” is displayed. If ADC calibration is failure, “ADC
RGB Fail” is displayed.
(12) If ADC calibration is failure, after recheck ADC pattern or
condition, retry calibration
12.2. Manual White balance Adjustment
12.2.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
▪ After Aging Start, Ke ep the Po wer ON status during 5
Minutes.
▪ In case of LCD, Back-light on should be checked using no
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Vi deo Sig nal Generator MSP G-925F 720p/216 -Gray
(Model: 217, Pattern: 78)
12.2.3. Adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►).
When KEY(►) is pressed 216 Gray internal pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
NVRAM
Clock for LG1152
MAIN Clock(24Mhz)
C100
8pF
50V
X-TAL_1
GND_1
1
2
X101
24MHz
4
3
C101
8pF
50V
GND_2
X-TAL_2
PLL SET[1:0] ==> Internal Pull-UP. N.C is high
00 : CPU clock(1056Mhz), Main0,1/2 DDR (792/792 Mhz)
01 : CPU clock(792Mhz), Main0,1/2 DDR (672/792 Mhz)
10 : CPU clock(1152Mhz), Main0,1/2 DDR (792/672 Mhz)
11 : CPU clock(984Mhz), Main0,1/2 DDR (792/792 Mhz)
BOOT MODE
"11" or "01" : NOR
"10" : eMMC
"00" : NAND
OPT
R102 22
R103 22
OPT
PLLSET1
PLLSET0
R112
XIN_MAIN
1M
XO_MAIN
JTAG I/F FOR MAIN
+3.3V_NORMAL
+3.3V_NORMAL
4.7K
R187
BOOT_MODE1
4.7K
R185
OPT
BOOT_MODE1
+3.3V_NORMAL
4.7K
R188
OPT
4.7K
R186
BOOT_MODE0
TRST_N0
TDI0
TDO0
TMS0
TCK0
SOC_RESET
OPT
OPT
R13210K
R13110K
OPT
OPT
R13310K
R13410K
BOOT_MODE0
+3.3V_NORMAL
NO_FRC
Zoran FRC
(For UD)
MODEL OPTION 8 is just for CP Box
It should not be appiled at MP
HW_OPT_0
HW_OPT_1
HW_OPT_2
HW_OPT_3
HW_OPT_4
HW_OPT_5
HW_OPT_6
HW_OPT_7
HW_OPT_8
HW_OPT_9
HW_OPT_10
HP_AMP_MUTE
BackEnd 1
BackEnd 2
Pannel Resol
OPTIC I/F
3D Depth IC
DDR Size
CP BOX
FrontEnd 1
FrontEnd 2
OPT
22
R117
10K
URSA5
R110
FRC_EXTERNAL
R100 10K
10K
FRC3
FRC_INTERNAL
R107 10K
R111
T240
T120
OPT
OPTIC
R138 10K
R124 10K
3D_DEPTH
R140 10K
CP_BOX
R145 10K
R152 10K
R147 10K
DVB_T2_TUNER
DVB_S_TUNER
R156 10K
R154 10K
DVB_C2_TUNER
ZORAN_FRC
R121 10K
MODEL_OPT_0
MODEL_OPT_1
MODEL_OPT_2
MODEL_OPT_3
MODEL_OPT_4
MODEL_OPT_5
MODEL_OPT_6
MODEL_OPT_7
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
1GByte
NON_OPTIC
R139 10K
R125 10K
R141 10K
R146 10K
NON_3D DEPTH
NON_CP_BOX
R153 10K
R148 10K
NON_DVB_T2_TUNER
R158 10K
R155 10K
NON_DVB_S_TUNER
NON_DVB_C2_TUNER
NOT_ZORAN_FRC
R126 10K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TU_CVBS
680pF
C506
OPT
L503
SC_CVBS_IN
AV1_CVBS_IN
SC_B
SC_G
SC_R
COMP1_Pb
COMP1_Y
COMP1_Pr
SC_FB
SC_ID
D503
5.5V
D504
5.5V
NON SCART
R525-*1
0
D506
D505
5.5V
5.5V
C528
OPT
10pF
EU
R525
75
C580
C546
10pF
R522
OPT
10pF
C579
C508
150pF
50V
EU
50V
150pF
C511
R521100
10K
NON SCART
R524-*1
0
OPT
10pF
C524
10pF
10pF
C578
EU
EU
L504
1uH
C509
R614
150pF
75
EU
C514
150pF
50V
75
1%
R606
75
1%
R605
75
1%
R604
1%
R615
75
1%
DTV/MNT_V_OUT
SC_SOG_IN
SC_SOG_IN
1uH
EU
R524
2.7K
75
75
75
R595
R600
R594
Main clock for LG1152A
SCART_Lout
SCART_Rout
SC_L_IN
SC_R_IN
AV1_L_IN
AV1_R_IN
EU
R602
470K
R603
470K
+12V
100K
100K
R552
R554
C574
560pF
50V
OPT
EU
EU
100K
100K
C572
330pF
50V
OPT
L508
R538
2.2uF
10V
R549
Near Place Scart AMP
EU
EU
C525
EU
2.2uF
L507
EU
SCART_Lout_SOC
EU
SCART_Rout_SOC
C522
10V
C576
330pF
50V
EU
C577
100pF
50V
R609
470K
Place JACK Side
470K
EU
R608
C6006
EU
1uF 25V
C6001
EU
EU
SCART_AMP_R_FB
10K
1uF25V
R60 06
EU
SCART_AMP_L_FB
10K
R6005
C502
2.2uF
C503
C504
C505
EU
EU
2.2uF
2.2uF
2.2uF
C586
560pF
50V
OPT
C582
330pF
50V
OPT
L511
EU
L510
EU
C588
330pF
50V
C589
100pF
50V
Place SOC Side
C513
C512
R510
EU
R511
EU
R51222K
R51322K
8pF
8pF
22K
22K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.5V_ST
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
R2305
RL_ON
10K
+3.5V_ST
+12V
C2306
0.1uF
L/DIM0_MOSI
BLM18SG121TN1D
C2307
0.1uF
16V
50V
eMMC POWER
+3.3V_NORMAL
3.3V_EMMC
L2319
BLM18PG121SN1D
C2371
0.1uF
16V
10K
R2306
L2303
CIS21J121
+1.8V_NORMAL
C2372
0.1uF
16V
L2302
2
1
Q2301 MMBT3906(NXP)
3
G3S
R2367
33
L2306
BLM18PG121SN1D
PWR ON
3.5V
3.5V
L/DIM0_MOSI
EMMC_VCCQ
POWER_18P
1
1
3
3
5
5
GND
7
7
24V
9
9
GND
11
11
12V
13
13
12V
15
15
GND
17
17
GND
19
GND
21
23
POWER_24P
SMAW200-H18S1
C2376
22uF
10V
SAMSUNG_eMMC
P2301
SMAW200-H24S2
INV ON
2
2
PDIM#1
4
4
PDIM#2
6
6
GND
8
8
24V
10
10
GND
12
12
12V
14
14
24V
16
16
GND
18
18
GND
20
L/DIMO_VS
22
19
L/DIM0_SCLK
24
25
P2300
+3.3V_TU
G3S
R2368
33
G3S
R2369
33
PWM_DIM
PWM_DIM2
L/DIM0_VS
L/DIM0_SCLK
L2314
BLM18PG121SN1D
R2312
100
L2305
CIS21J121
C2317
0.1uF
50V
+3.3V_NORMAL
R2330
1K
+24V
+3.3V_TU_IN
@netLa
INV_CTL
+12V
L2311
CIS21J121
1
+12V
L2310
BLM18PG121SN1D
C2322
10uF
16V
Switching freq: 700K
PANEL_POWER
PANEL_CTL
+5V_Normal
R2301
10KPOWER_ON/OFF1
POWER_ON/OFF2_1
R1
C2334
100pF
50V
R2
1%
R2308
R2311
OPT
R2348
10K
56K
10K
1%
C2326
0.01uF
50V
R2341
10K
C2336
1uF
10V
C2328
0.1uF
VREG5
C2342
2200pF
50V
VFB
50V
R2343
33K
R2344
5.6K
C
Q2304
B
MMBT3904(NXP)
E
IC2304
TPS54327DDAR
EN
1
2
3
SS
4
3A
C2332
10uF
9
THERMAL
16V
8
7
6
5
C2335
0.1uF
50V
[EP]GND
VIN
VBST
SW
GND
AO3407A
OPT
Q2305
Vout=0.765*(1+R1/R2)
S
G
MAX 1A
C2345
0.1uF
16V
D
L2313
6.8uH
NR8040T4R7N
1uF
C2339
OPT
Power_DET
TYP 1450mA
PANEL_VCC
25V
+5V_NORMAL
C2346
0.1uF
50V
+12V
4
+12V
C2343
22uF
10V
L2307
BLM18PG121SN1D
Placed on SMD-TOP
C2305
C2303
10uF
10uF
16V
16V
C2318
0.1uF
16V
OPT
BD86106EFJ
PGND
VIN
AGND
FB
PD_+12V
R2362
2.7K
1%
PD_+12V
R2363
1.2K
1%
IC2306
1
2
3
4
6A
THERMAL
+24V
+3.5V_ST
PD_24V
R2364
8.2K
1%
PD_24V
R2365
1.5K
1%
PD_+3.5V
R2366
0
5%
C2359
0.1uF
16V
C2360
0.1uF
16V
VCC
VCC
PD_24V
R2373
100K
IC2307
NCP803SN293
3
1
GND
PD_24V
R2372
100K
PD_24V
IC2308
NCP803SN293
3
1
GND
+3.5V_ST
R2376
10K
RESET
2
RESET
2
OPT
POWER_DET
C2365
0.1uF
16V
not to RESET at 8kV ESD
24V-->3.48V
12V-->3.58V
ST_3.5V-->3.5V
+1.0V_VDD
LG1152 Max: 1728 mA
LG1132 Max: 2000 mA
C2356
47pF
50V
OPT
+1.0V_VDD
R2313
2.7K
R2318
7.5K
1/16W
5%
1%
R1
R2
L2309
C2321
0.0068uF
50V
R2310
10K
2uH
POWER_ON/OFF2_3
C2352
10uF
10V
C2353
10uF
10V
C2354
10uF
10V
C2355
10uF
10V
[EP]
SW_2
8
SW_1
9
7
EN
6
R2309
6.8K
COMP
5
C2319
0.1uF
16V
1
+3.5V_ST
L2301
BLM18PG121SN1D
C2301
4.7uF
10V
R2300
10K
POWER_ON/OFF1
Vout=0.8*(1+R1/R2)
2
+3.3V_NORMAL
+12V
L2300
BLM18PG121SN1D
Placed on SMD-TOP
C2304
C2300
10uF
10uF
16V
16V
C2309
0.1uF
16V
OPT
BD86106EFJ
PGND
VIN
AGND
FB
+1.8V
THERMAL
IC2300
[EP]
IN
1
PG
2
VCC
3
EN
4
9
THERMAL
OUT
8
FB
7
SS
6
GND
5
1.5A
L2304
C2311
0.0068uF
50V
R2303
10K
2uH
POWER_ON/OFF2_1
[EP]
SW_2
8
SW_1
9
7
EN
6
R2302
6.8K
COMP
5
C2310
0.1uF
16V
AP7173-SPG-13 HF(DIODES)
IC2301
1
2
3
4
6A
Vout=0.8*(1+R1/R2)
C2308
2200pF
50V
C2312
10uF
10V
R2314
3K
1%
R2315
100
1%
C2314
10uF
10V
1/16W
3.9K
R2321
R2
3. soft start
293 mA
+1.8V_NORMAL
+3.3V_NORMAL
1%
R1
C2313
10uF
10V
C2315
0.1uF
16V
POWER_ON/OFF2_2
4
+5V_NORMAL
R2334
10K
DDR MAIN 1.5V
MAX 4.7 A
+3.3V_NORMAL
+3.5V_ST
L2308
C2316
10uF
10V
C2323
10uF
10V
C2351
47pF
50V
OPT
R2304
R2316
30K
R2317
10K
1%
2K
1/16W
1%
C2320
R1
1%
10uF
10V
R2
+2.5V
IN
PG
VCC
EN
EP[GND]
1
THERMAL
2
3
TPS54319TRE
4
5
AGND
10K
R2339
17
IC2302
3A
3A
1
2
3
1.5A
4
C2325
6
COMP
VSENSE
IC2303
THERMAL
0.1uF
16V
BOOT14PWRGD15EN16VIN_3
13
7
8
RT/CLK
9
12
11
10
9
R2340
15K
1/16W 5%
$ 0.145
AP7173-SPG-13 HF(DIODES)
C2324
10uF
10V
Vout=0.8*(1+R1/R2)
VIN_1
VIN_2
GND_1
GND_2
PH_3
PH_2
PH_1
SS/TR
8
7
6
5
C2327
0.1uF
16V
[EP]
OUT
FB
SS
GND
0.01uF
R2342
330K1/16W5%
C2329
50V
4700pF
C2330
50V
C2331
2200pF
50V
POWER_ON/OFF2_3
L2312
3.6uH
NR8040T3R6N
C2333
22uF
10V
C2337
22uF
10V
R2347
4.3K
1%
R2346
2K
1%
R1
R2
R2
R1
R2350
56K
1/16W
1%
700 mA
1074 mA
R2349
47K 1%
+1.5V_DDR
C2338
100pF
50V
+2.5V_NORMAL
C2340
10uF
10V
C2341
0.1uF
16V
C2344
0.1uF
16V
4
C2375
180pF
50V
R2378-*1
8.2K
1/16W
R2379-*1
15K
+12V
L2315
+0.9V_VDD
C2347
10uF
16V
R1
R2378
6.8K
1/16W
1%
FRC3
R2
R2379
12K
1/16W
1%
FRC3
URSA5
1%
URSA5
1/16W
1%
Vout=0.6*(1+R1/R2)
Vout=0.8*(1+R1/R2)
IC2305
EAN62348501
R2377
RT/CLK
100K
1/16W
5%
C2302
4.7uF
16V
GND_1
GND_2
PVIN_1
PVIN_2
VSENSE
1
15
2
THERMAL
3
4
5
VIN
6
7
[EP]GND
PWRGD
14
C2349
BOOT
13
0.1uF
16V
PH_2
12
PH_1
11
EN
10
SS/TR
9
COMP
8
1.3K
R2307
C2348
4700pF 50V
47pF 50V
22000pF 50V
C2373
R2381 0
Max 5926 mA
L2317
1uH
R2357 1K
C2374
1/16W
5%
Switching freq: 400 ~ 580 Khz
+0.9V_VDD
C2363
C2350
22uF
22uF
10V
10V
POWER_ON/OFF2_3
OPT
C2370
10uF
10V
Vout=0.827*(1+R1/R2)=1.521V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LG1152
POWER
Renesas MICOM
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Eye Sensor Option
MODEL_OPT_4
MODEL_OPT_2
0
1
0
N/A
CM3231_CAPELLA
(GP3 Soft touch)(GP4 Soft touch)
1
MC8101_ABOV
(TACT_KEY)
CM3231_CAPELLA
POWER_DET
POWER_ON/OFF1
WOL/WOW_POWER_ON
LED_R
WOL_CTL
INV_CTL
SOC_RESET
SOC_TX
SOC_RX
AMP_MUTE
CEC_REMOTE
MICOM
D3000
BAT54_SUZHO
D
For CEC
R3028
27K
G
Q3001-*1
SI1012CR-T1-GE3
S
HDMI_CEC_FET_VISHAY
+3.5V_ST
G
D
Q3001
RUE003N02
HDMI_CEC_FET_ROHM
R3029
120K
S
HDMI_CEC
2011.12.12
30
BODY_SHIELD
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4
2011.10.19
HDMI32
CVBS 1 PHONE JACK
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
JK3800
KJA-PH-1-0177-1
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
D3800
5.6V
OPT
D3801
5.6V
+3.3V_NORMAL
D3806
C3805
5.6V
18pF
OPT
R3810
10K
OPT
50V
ESD_MTK
AV1_CVBS_DET
AV1_CVBS_IN
AV1_L_IN
COMPONENT 1 PHONE JACK
JK3801
KJA-PH-1-0177-2
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
D3803
5.6V
OPT
+3.3V_NORMAL
Close to the jack
C3804
D3807
18pF
5.6V
R3806
10K
50V
OPT
ESD_MTK
COMP1_DET
COMP1_Y
COMP1_Pb
HP_LOUT
HP_ROUT
HEADPHONE
HP_DET
+3.3V_NORMAL
R3700
10K
HP_OUT
OPT
VA3700
5.6V
JK3700
KJA-PH-0-0177
5GND
4L
3DETECT
1R
EAG61030001
HP_JK
SOC_RX
SOC_TX
RS232C
D3802
5.6V
AV1_R_IN
OPT
COMP1_Pr
SPDIF OUT
+3.5V_ST
P3800
12507WS-04L
1
2
3
4
5
SPDIF_OUT
D3613-*1
5.5V
ADUC 5S 02 0R5L
ESD_MTK
R3620
2.7K
R3615
33
D3613
5.5V
ADUC 5S 02 0R5L
OPT
OPT
+3.3V_NORMAL
C3615
0.1uF
16V
JK3602
2F11TC1-EM52-4F
VIN
A
VCC
B
GND
C
Fiber Optic
4
SHIELD
ESD For MTKESD For LG1152
D3803-*1
5.6V
ESD_MTK
D3800-*1
5.6V
ESD_MTK
D3801-*1
5.6V
ESD_MTK
D3802-*1
5.6V
ESD_MTK
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D3803-*2
5.6V
ESD_LG1152
D3800-*2
ESD_LG1152
D3801-*2
5.6V
ESD_LG1152
D3802-*2
5.6V
ESD_LG1152
5.6V
VA3700-*1
5.6V
ESD_MTK_HP_OUT
ESD for LG1152ESD for MTK
VA3700-*2
5.6V
ESD_LG1152_HP_OUT
JACK_COMMON
2011.11.21
38
ESD for MTK
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
ESD for LG1152
IR & KEY & LOGO
KEY1
KEY2
Place Near Micom
LOGO_LIGHT
+3.5V_ST
R4117
10K
5%
R4113
100
R4114
100
+3.5V_ST
R4105
10K
LOGO_LIGHT
R4118
10K
5%
10K
OPT
R4104
LOGO_LIGHT
C4103
0.1uF
16V
+3.5V_ST
C4100
0.1uF
0.1uF
L4100
BLM18PG121SN1D
LOGO_LIGHT
Q4102
1K
R4106
MMBT3904(NXP)
LOGO_LIGHT
EYE_SCL
EYE_SDA
D4100
5.6V
OPT
B
EYE_Q_10P
R4101
100
EYE_Q_10P
R4109
100
AMOTECH CO., LTD.
C4104
1000pF
50V
C4102
AMOTECH CO., LTD.
D4101
5.6V
OPT
LOGO_LIGHT
R410733
LOGO_LIGHT
R410833
C
E
OPT
OPT
LED_R
IR
VA4001
ADMC 5M 02 200L
VA4000
ADMC 5M 02 200L
R4103
R4100
10K
+3.5V_ST
10K
LED_R
C4107
100pF
50V
D4104
5.6V
OPT
AMOTECH CO., LTD.
NON_EYE_Q_8P
P4102
12507WR-08L
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
11
EYE_Q_10P
P4101
12507WR-10L
D4105-*1
ADUC 20S 02 010L
20V
ESD_MTK
D4106-*1
ADUC 20S 02 010L
20V
ESD_MTK
D4100-*1
5.6V
ADMC 5M 02 200L
ESD_MTK
ESD_MTK
ESD_MTK
10pF
10pF
200pF
D4101-*1
5.6V
200pF
ADMC 5M 02 200L
D4104-*1
200pF
5.6V
ADMC 5M 02 200L
ESD_LG1152
ESD_LG1152
ESD_LG1152
D4100-*2
200pF
5.6V
ADMC 5M 02 200L
D4101-*2
5.6V
200pF
ADMC 5M 02 200L
D4104-*2
200pF
5.6V
ADMC 5M 02 200L
+3.5V_WOL
WIFI_DM
WIFI_DP
WOL/WOW_POWER_ON
L4101
BLM18PG121SN1D
120-ohm
C4101
10uF
+3.3V_NORMAL
L4102
P4100
C4105
10uF
10V
10V
MAX 0.4A
+3.5V_WOL
USB_DM
USB_DP
SMAW200-H12S2
1
3
5
GND
WOL
GND
7
9
11
10
12
2
4
6
8
3.3V
RTS
RX
TX
RESET
CTS
13
120-ohm
AR4100
100
1/16W
C4106
0.1uF
R4102
100
M_REMOTE_RTS
M_REMOTE_RX
M_REMOTE_TX
M_RFModule_RESET
M_REMOTE_CTS
M_REMOTE_RTS
M_REMOTE_CTS
.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
IR / KEY
2011.11.21
41
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