LG 55SM9000PTA Owner’s Manual

CONFIDENTIAL

LED TV

SERVICE MANUAL

CHASSIS : UB93U

MODEL : 65SM8100PTA

65SM8100PVA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL71443403 (1901-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

SOFTWARE UPDATE ............................................................................ 10

BLOCK DIAGRAM ................................................................................. 11

EXPLODED VIEW .................................................................................. 21

DISASSEMBLY GUIDE .......................................................................... 23

TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 1 MΩ and 5.2 MΩ.

When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor

between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage

measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.

In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within

the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)

b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique

as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used UB93U chassis.

3. Test method

(1) Performance: LGE TV test method followed (2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC specification

2. Requirement for Test

Each part is tested as below without special notice

(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 2 °C (2) Relative Humidity: 60 % ± 10 %

(3) Power Voltage

: Standard input voltage (AC 100-240 V~, 50/60 Hz)

* Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

4. Model General Specification

No. Item Specication Remarks

1 Market Oceania, Asia, Middle East, Africa

2 Broadcasting system

3 Program coverage ATV & DVB-T/T2 : 3,000EA, DVB-S/S2 : 6,000EA Only *V* models supprot DVB-S/S2

4 Receiving system

HDMI 1

5 HDMI Input

6 USB Input My Media(Movie/Photo/Music List) or SVC UB92x : 3EA, UB93x : 2EA

7 Component Input Y/Pb/Pr Except UB92x for Middle East and Africa

8 Video Input PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60

9 Audio Input DVI Audio, Component, AV

10 SPDIF out Optical Audio out

11 Headphone out Antenna, HDMI1, HDMI2, HDMI3, HDMI4, USB1, USB2, USB3 Except UB93x

12 Ethernet Connect

HDMI 2 Support 6Gbps, Support ARC

HDMI 3 Support 6Gbps

HDMI 4 Support 6Gbps, Except UM71, UM73/74 series

(1) Digital TV : DVB-T/T2, DVB-C, DVB-S/S2 (2) Analogue TV : PAL B/B, PAL B/G, PAL D/K, PAL-I, SECAM

B/G, SECAM D/K, NTSC-M

Analog : Upper Heterodyne Digital : COFDM(DVB-T) Only DVB-T Model Digital : COFDM(DVB-T/T2) Only DVB-T2 Model Digital : QAM

PC / DTV Format

Only *V* models supprot DVB-S/S2

► DVB-T

- Guard Interval(Bitrate_Mbit/s): 1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

► DVB-T2

- Guard Interval(Bitrate_Mbit/s)

1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,

- Modulation : Code Rate QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

► DVB-C

- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s

- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM

► DVB-S/S2

- Symbolrate

DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s DVB-S (QPSK) : 2 ~ 45Msymbol/s

- Viterbi

DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8 DVB-S2 mode: 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10

Support 6Gbps

- 6 -

5. External Input Support Format

5.1. Component input(Y, CB/PB, CR/PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1 720*480i 15.73 59.94 13.50 SDTV, DVD 480I(525I)

2 720*480i 15.75 60.00 13.51 SDTV, DVD 480I(525I)

3 720*576i 15.62 50.00 13.50 SDTV, DVD 576I(625I) 50Hz

4 720*480p 31.47 59.94 27.00 SDTV 480P

5 720*480p 31.50 60.00 27.03 SDTV 480P

6 720*576p 31.25 50.00 27.00 SDTV 576P 50Hz

7 1280*720 44.96 59.94 74.18 HDTV 720P

8 1280*720 45.00 60.00 74.25 HDTV 720P

9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10 1920*1080 28.12 50.00 74.25 HDTV 1080I 50Hz

11 1920*1080 33.72 59.94 74.18 HDTV 1080I

12 1920*1080 33.75 60.00 74.25 HDTV 1080I

13 1920*1080 56.25 50.00 148.50 HDTV 1080P

14 1920*1080 67.43 59.94 148.50 HDTV 1080P

15 1920*1080 67.50 60.00 148.50 HDTV 1080P

5.2. HDMI input(DTV)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1 640*480 31.46 59.94 25.12 SDTV 480P

2 640*480 31.5 60 25.12 SDTV 480P

3 720*480 15.73 59.94 13.5 SDTV, DVD 480I(525I)

Spec. out but display4 720*480 15.75 60 13.51 SDTV, DVD 480I(525I)

5 720*576 15.62 50 13.5 SDTV, DVD 576I(625I) 50Hz

6 720*480 31.47 59.94 27 SDTV 480P

7 720*480 31.5 60 27.02 SDTV 480P

8 720*576 31.25 50 27 SDTV 576P

9 1280*720 44.96 59.94 74.17 HDTV 720P

1 0 1280*720 45 60 74.25 HDTV 720P

11 1280*720 37.5 50 74.25 HDTV 720P

12 1920*1080 28.12 50 74.25 HDTV 1080I

13 1920*1080 33.72 59.94 74.17 HDTV 1080I

14 1920*1080 33.75 60 74.25 HDTV 1080I

15 1920*1080 26.97 23.97 63.29 HDTV 1080P

16 1920*1080 27 24 63.36 HDTV 1080P

17 1920*1080 33.71 29.97 79.12 HDTV 1080P

18 1920*1080 33.75 30 79.2 HDTV 1080P

19 1920*1080 56.25 50 148.5 HDTV 1080P

20 1920*1080 67.43 59.94 148.35 HDTV 1080P

21 1920*1080 67.5 60 148.5 HDTV 1080P

22 1920*1080 112.5 100 297 UDTV 2160P

- 7 -

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

23 1920*1080 134.86 119.88 296.7 UDTV 2160P

24 1920*1080 135 120 297 UDTV 2160P

25 3840*2160 53.95 23.98 296.7 UDTV 2160P

26 3840*2160 54 24 297 UDTV 2160P

27 3840*2160 56.25 25 297 UDTV 2160P

28 3840*2160 61.43 29.97 296.7 UDTV 2160P

29 3840*2160 67.5 30 297 UDTV 2160P

30 3840*2160 112.5 50 594 UDTV 2160P

31 3840*2160 134.86 59.94 593.4 UDTV 2160P

32 3840*2160 135 60 594 UDTV 2160P

33 3840*2160 225 100 1188 UDTV 2160P

34 3840*2160 270 119.88 1186.8 UDTV 2160P

35 3840*2160 270 120 1188 UDTV 2160P

36 4096*2160 53.95 23.98 296.7 UDTV 2160P

37 4096*2160 54 24 297 UDTV 2160P

38 4096*2160 56.25 25 297 UDTV 2160P

39 4096*2160 61.43 29.97 296.7 UDTV 2160P

40 4096*2160 67.5 30 297 UDTV 2160P

41 4096*2160 112.5 50 594 UDTV 2160P

42 4096*2160 134.86 59.94 593.4 UDTV 2160P

43 4096*2160 135 60 594 UDTV 2160P

44 4096*2160 225 100 1188 UDTV 2160P

45 4096*2160 270 119.88 1186.8 UDTV 2160P

46 4096*2160 270 120 1188 UDTV 2160P

47 7680*4320 107.89 23.98 1188 8K

48 7680*4320 108 24 1188 8K

49 7680*4320 110 25 1188 8K

50 7680*4320 131.87 29.97 1188 8K

51 7680*4320 132 30 1188 8K

52 7680*4320 220 50 2376 8K

53 7680*4320 263.74 59.94 2376 8K

54 7680*4320 264 60 2376 8K

This will be added in USERGUIDE after MR SW update event.

8K Model Only. This will be added in USERGUIDE after 8K model development.

- 8 -

5.4. HDMI Input (PC)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1 640*350 31.46 70.09 25.17 EGA

2 720*400 31.46 70.08 28.32 DOS

3 640*480 31.46 59.94 25.17 VESA(VGA)

4 800*600 37.87 60.31 40 VESA(SVGA)

5 1024*768 48.36 60 65 VESA(XGA)

6 1360*768 47.71 60.01 84.75 VESA(WXGA)

7 1152*864 54.34 60.05 80 VESA

8 1280*1024 63.98 60.02 109 SXGA Support to HDMI-PC

9 1920*1080 67.5 60 158.4 WUXGA(Reduced Blanking)

10 1920*1080 134.86 119.88 296.7 UDTV 2160P

11 1920*1080 135 120 297 UDTV 2160P

12 3840*2160 53.95 23.98 296.7 UDTV 2160P

13 3840*2160 54 24 297 UDTV 2160P

14 3840*2160 56.25 25 297 UDTV 2160P

15 3840*2160 61.43 29.97 296.7 UDTV 2160P

16 3840*2160 67.5 30 297 UDTV 2160P

17 3840*2160 112.5 50 594 UDTV 2160P

18 3840*2160 134.86 59.94 593.4 UDTV 2160P

19 3840*2160 135 60 594 UDTV 2160P

20 3840*2160 225 100 1188 UDTV 2160P

21 3840*2160 270 119.88 1186.8 UDTV 2160P

22 3840*2160 270 120 1188 UDTV 2160P

23 4096*2160 53.95 23.98 296.7 UDTV 2160P

24 4096*2160 54 24 297 UDTV 2160P

25 4096*2160 56.25 25 297 UDTV 2160P

26 4096*2160 61.43 29.97 296.7 UDTV 2160P

27 4096*2160 67.5 30 297 UDTV 2160P

28 4096*2160 112.5 50 594 UDTV 2160P

29 4096*2160 134.86 59.94 593.4 UDTV 2160P

30 4096*2160 135 60 594 UDTV 2160P

31 4096*2160 225 100 1188 UDTV 2160P

32 4096*2160 270 119.88 1186.8 UDTV 2160P

33 4096*2160 270 120 1188 UDTV 2160P

34 2560*1440 88.78 60 241.5 3K

35 2560*1440 183 120 497.7 3K

36 7680*4320 107.89 23.98 1188 8K

37 7680*4320 108 24 1188 8K

38 7680*4320 110 25 1188 8K

39 7680*4320 131.87 29.97 1188 8K

40 7680*4320 132 30 1188 8K

41 7680*4320 220 50 2376 8K

42 7680*4320 263.74 59.94 2376 8K

43 7680*4320 264 60 2376 8K

This will be added in USERGUIDE after MR SW update event.

Only UHD, 8K 60Hz UHD DeepColor

8K Model Only. This will be added in USERGUIDE after 8K model development.

- 9 -

SOFTWARE UPDATE

1. USB DOWNLOAD

(1) Insert the USB memory Stick to the USB port. (2) Automatically detect the SW Version and show the below

message.

(3) Click [YES]: initiate the download and install of the update.

2. NSU DOWNLOAD

(This Function is needed to connect to the internet.)

(1) Menu → All Settings → General → About This TV

(2) Click [CHEK FOR UPDATES]: system check newest version.

(4) Click [Check Now]: move to “About This TV” page for update.

(5) TV is updating.

(6) After finished the update, below Pop-up appear.

(3) Click [DOWNLOAD AND INSTALL]. (4) TV is updating.

(5) After finished the update, below Pop-up appear.

(7) Click [Yes] : TV will be DC OFF → ON. (8) After TV turned on, Check the updated SW Version and

Tool Option.

- 10 -

(6) Turn OFF the TV and On. Check the updated SW Version

and Tool Option.

1. Main SOC

BLOCK DIAGRAM

13V

T2/C/S/S2 H-NIM tuner

.8V

.3V

1

3

3.5 V_ST

CI Slot

5V

eMMC (4GB)

NVRAM (256Kb)

/ D

rom

ower

B

F

P

IF (+/-)

TUNER

3.3 V

USB2 (2.0)

USB1 (2.0)

HDMI2(ARC)

HDMI1

HDMI4

HDMI3

TUNER

Air/

Cable

(T2/C/A)

DVB- S

(S,S2)

P_TS_IN

P_TS_OUT

X_TAL

27MHz

3.5 V_ST

1.8 V

1V

3.3 V

0.9 5V 1.5 V

5V

Normal

13V

.5V_ST

3.3 V 5V

3.3V

13V

1.5V

3.5 V_ST

0.9 5V 1.5 V

0.95V

3

3.5V

Normal

DDR

Core&CPU

ST_BY

13V

.8V 1

1.8V

3.3 V

V 1

Eth

1.0V

I2C_1

13V(PANEL_VCC)

Main

Sub

13V(PANEL_VCC)

EPI block

5V

OCP

eMMC

CLK/DATA/STRB

Main SoC

MICOM

FCIC SPI/ I2C 6

GST/MCLK/GCLK/EO/I2C 6

PMIC

Vx1 / EPI/ CEDS

EPI 60P (65”:8 lane, 55”↓:6lane), CEDS 68P

I2S Out

3.3 V

13V

Vx1 51P (8 lane)

IQ (+/-), IP(+/-)

IF

TS

IF_S

USB_WIFI

I2C 4

MAIN Audio AMP

Signal Process

3.3 V

LNB

* HDMI4 :except UM71,UM73 model

* H/P for US model

* CI Slot for Europe model

I2C 2

SPDIF OUT

CVBS/YPbPr

ETHERNET

USB_WIFI

MAX323

AMP

3.5 V_ST

RS- 232

H/P

Area OPT

SPDIF

AV/COMP

LAN

ombo C

To WIFI/BT

3.5 V_ST

Sub

Assy

IR / KEY

Power Supp ly

Inp ut/ Ou tput Power

13V

3.5 V_ST

- 11 -

anel

To

P

2. EPI / CDES

60pin

LGD Panel

3840x2160@60p

3Gbps(55” ↓) /2Gbps(65”)

EPI 4Lane 60P ( 65” )

EPI 3Lane 60P ( 55” ↓ )

68pin

VST

VGL1

CLK(x10)

VDD

VCOM1

1.5Gbps

BOE Panel

VCOM2

VCOMLFB

VCOMRFB

3840x2160@60p

GMA

(2, 3, 4, 7, 8,

11, 12, 15, 16, 17)

HVDD

LS_VGL

GIP_RST

VGH_ODD

VGH_EVEN

GMA

(1, 5, 9, 10, 13, 24,18)

VTERM

LDO

PMIC_RESET

&

PMIC

Level Shifter

EPI 4Lane 60P ( 65” )

EPI 3Lane 60P ( 55” ↓ )

68pin

Main SoC

CEDS 6lane 68Pin /EPI 6Lane 60Pin

LOCKOUT12

[PAD_MOD_TX_P12(LVA3-)]

[PAD_MOD_TX_P02/N02 ~ P09/N09]

GAMMA

BOE Only

[PAD_GPIO31SDA4]

[PAD_GPIO30SCK4]

Sub PMIC

- 12 -

CEDS 6lane 68Pin /EPI 6Lane 60Pin

GST, E/O, MCLK, GLCK

[PAD_GPIO16(TCON4)(GPIO)]

[PAD_SPDIF_IN(TCON3)(GPIO)]

[PAD_I2S_IN_SD(TCON2)(GPIO)]

[PAD_I2S_IN_WS(TCON1)(GPIO)]

[ PAD_GPIO17_PM(PM_SPI_CK2]

[PAD_GPIO18_PM(PM_SPI_DI2)]

[PAD_GPIO10_PM(PM_SPI_CZ2)]

[PAD_GPIO19_PM(PM_SPI_DO2)]

[PAD_MOD_TX_P02/N02 ~ P09/N09]

3. Vx1

Main SOC

Panel

3840x2160@60p

[PAD_GPIO19] [PAD_GPIO20]

[PAD_MOD_TX_P00~07]

[PAD_MOD_TX_P12(LVA3-)]

[PAD_MOD_TX_N12(LVA3+)]

[PAD_GPIO30SCK4]

[PAD_GPIO31SDA4]

[PAD_GPIO23]

[PAD_GPIO24]

VX1_MSE

AGP_CTL

Vx1 8Lane 51P

LOCKAn

HTPDAn

I2C_SCL6/SDA6

DATA_FORMAT_0/1

- 13 -

4. TUNER

LNB1

IC7001

DT1805

AG10 [PAD_TGPIO2SCK1]

5 [SCL]

6 [SDA]

8 [TONECTRL]

2 [LNB]

AH10 [PAD_TGPIO3SDA1]

AC5 [PAD_TS2_CLK]

AD4 [PAD_TS2_SYNC]

AC4 [PAD_TS2_VLD]

[GPIO_27~34_TP0_D0~D7]

Main SOC

AM8 [PAD_IP_S]

AL8 [PAD_IM_S]

AK10 [PAD_QP_S]

AL9 [PAD_QM_S]

AK8 [PAD_IFAGC_S]

AH9 [PAD_GPIO26 (DISEQC_OUT) ]

AL11 [PAD_IP_T]

AM10 [PAD_IM_T]

AM11 [PAD_IFAGC_T]

AL12 / AM12 [SIF_P/N]

AH4 [PAD_GPIO13]

Y2 [PADA_CVBS0]

Main Ball No : 27*27 _package

0 Ω

33 Ω

LNB1_TX

1.2K Ω

+3.3V_NORMAL

I2C_SCL_2

I2C_SDA_2

Ready- Not user

EWBS_TU

FE_DEMOD1_TS_CLK

FE_DEMOD1_TS_SYNC

FE_DEMOD1_TS_VAL

IF_S_IP_MAIN

/TU_RESET1_TU

IF_S_QN_MAIN

IF_S_IN_MAIN

IF_S_QP_MAIN

IF_S_AGC_MIAN

IF_P_TU

IF_N_TU

IF_AGC_TU

TU_CVBS_TU

TU_SIF_TU

FE_DEMOD1_TS_DATA [0-7]

LNB1_OUT

Option

EXT_Demod

+ D_Demod_Core

Ready- Not user

33 Ω

3.5V_ST

+3.3V_NORMAL

[LNB] 26

[SCL_RF] 1

[LNB_TX1] 12

[B1_+3.3V_RF] 3

[B3_+1.2V_DEMOD] 13

[+ 3.3V_DEMOD_TU] 11

[SDA_RF] 2

[SYNC] 16

[MCLK] 15

[VALID] 17

[ERROR] 14

D[0-7] 18-25

(Phillippine only)

[ I[P] ] 59

[ I[N] ] 60

[ Q[P] ] 62

[ Q[N] ] 61

[RESET1_DEMOD] 10

[ IF[P] ] 8

[SAT_AGC] 58

[ IF[N] ] 7

[CVBS] 4

[TU_SIF] 6

[IF_AGC] 5

(Phillippine only)

19Y Tuner

- 14 -

5. VIDEO & AUDIO IN/OUT

SPK_L+ / L-

SPDIF

[38] CLK_I [8] WCK [7] SDATA [10,11] [36] [12]

AUD_SCK

SPDIF_OUT

AUD_LRCK

SPK L

LPF

[30, 33]

AUD_LRCH

SPK R

SPK_R+ / R-

LPF

[18, 21]

WA15

(IC5800)

MAIN AMP

AMP_RESET_N

US Only

H/P Jack

LPF

HP_LOUT_JACK

HP_ROUT_JACK

HP_DET

5

(IC6300)

H/P AMP

TPA6138A2

HDMI2

AUDA_OUTR

AUDA_OUTL

I2C_SDA_0_AMP1 / I2C_SCL_0_AMP1

[E2]PAD_I2S_OUT_WS

[D2]PAD_I2S_OUT_BCK

[D1]PAD_I2S_OUT_SD

[ E5]PAD_SPDIF_OUT

[E10]PAD_GPIO7_PM

[M2]PAD_EARPHONE_OUTL

[M3]PAD_EARPHONE_OUTR

HDMI_ARC

[AL15]PAD_GPIO21

ST_GPIO_23_H0_ARC[AD8]

Main SOC

[ L2]PAD_LINEIN_L0

[V2]PADA_GIN1P / [Y1] PADA_CVBS1

COMP1_Y/CVBS

AV/COMP

[ L1]PAD_LINEIN_R0

[W2]PADA_RIN1P / [v3]PADA_BIN1P / [C1] PAD_I2S_OUT_SD1

[ D3]PAD_I2S_OUT_SD2(GPIO)

AV1_CVBS_DET

COMP1/AV1/DVI_L_IN

COMP1/AV1/DVI_R_IN

COMP1_Pb / COMP1_Pr / COMP1_DET

[F2]PAD_DDCR_DA / [F3]PAD_DDCR_CK

[ Y3]PADA_CVBS_OUT1

DTV/MNT_V_OUT

[AL12] PAD_SIFP

[AM12] PAD_SIFM

SIF_P

SIF_N

TU_SIF_TU

Tuner

- 15 -

6. HDMI 2.0

HDMI1

HDMI3

HDMI4

HDMI2 with ARC

*except UM73 / UM71

HDMI_CEC

DDC_SCL1 / DDC_SDA1

HDMI2.0_1_5V_DET

TMDS1 - D0/D1/D2/CLK

HDMI2.0_1_HPD

DDC_SCL2 / DDC_SDA2

HDMI2.0_2_5V_DET

HDMI2.0_2_HPD

HDMI_ARC

HDMI_CEC

DDC_SCL3 / DDC_SDA3

TMDS2 - D0/D1/D2/CLK

HDMI2.0_3_5V_DET

TMDS3 - D0/D1/D2/CLK

HDMI2.0_3_HPD

HDMI_CEC

HDMI2.0_4_5V_DET

HDMI2.0_4_HPD

DDC_SCL4 / DDC_SDA4

TMDS4 -D0/D1/D2/CLK

Main SOC

- 16 -

7. USB / Wi-Fi / M-Remote / UART(Debug)

WOL/WIFI_POWER_ON

COMBO_RESET

BT_WAKEUP_DEVICE

5 7 9

USB2

USB3

Wafer

+5V_USB3

US Only

PHONE JACK

BT_WAKEUP_HOST

IR

LED_R

KEY2

KEY1

10

15

16

19

20

(P4000)

RIN1

DOUT1

Wafer

RS232C

(IC7200)

(P200)

BD2242G

DCDC OCP

(IC4700)

BD2242G

DCDC OCP

(IC4501)

USB2.0_3_DM / DP

USB2.0_2_DM / DP

WIFI_DM / DP

SOC

Main

SOC_RX / TX

- 17 -

DEBUG_RX / TX

Wafer

(P201)

DEBUG UART

8. I2C Map

AMP

NTP7514

100Ω

I2C_SCL4

I2C_SDA4

NVRAM

33 Ω

1.8k Ω

+3.3V_NOR

LNB

A8303SESTR- T

33 Ω

I2C_SDA2

I2C_SCL2

Tuner

33 Ω

1.8 k Ω

+3.3V_NOR

Main SOC

I2C_SDA6

I2C_SCL6

33 Ω

RT6923

EPI PMIC

EPI / CEDS only

1.8k Ω

+3.3V_NOR

TCON_I2C_EN

P7100

Vx1 51P

Vx1 only

- 18 -

9. GPIO(Main SOC)

CPU DCDC

VID_CPU

VID_CPU2

CORE DCDC

VID_CORE

/TU_RESET1

Tuner

Audio AMP1

Component/AV Jack

AMP_RESET_N

COMP1_DET

AV1_CVBS_DET

H/P Jack

USB1 OCP USB1

USB2 OCP USB2

USB_ODC3

USB_CTL2

/USB_ODC2

USB_CTL3

HP_DET

/

Main SOC

BIT0~6

ADC 1~5

HW option

PCM_RESET

PCM_5V_CTL

OCP

PCMCIA

DATA_FORMAT_0

- 19 -

VX1_MSE

DATA_FORMAT_1

AGP_CTRL

LOCKAn

HTPDAn/MCKL_A

TCON_I2C_EN/GCLK_A

Panel

PMIC

L/D_DO

L/D_CLK

PWM_DIM

PWM_DIM2

L/D_VSYNC

POWER

Only training and service purposes.

10 GPIO(MICOM)

IC2302

SN1607023

13V- 1V DCDC

IC2500

TPS564208

13V- 5V NORMAL DCDC

13V- 3.3V NORMAL

IC2303

SYVL83

3.5V_ST- 1.5V DCDC

IC2300

SN1501019

OPT1 TV-NON EPI/BOX/TV EPI/BOX

OTP2 RESERVED

OPT0 NON LOGO LCD/LOGO LCD

OPT3 M16/RTK/H15

NON LOGO OLED/LOGO OLED

51P VX1 Wafer

GND

10k Ω

EDID_WP

POWER_ON/OFF1

POWER_ON/OFF2_3

POWER_ON/OFF2_4

MODEL1_OPT_0/1/2/ 3

AM_MODE_DET_OLED

RETENTION_DISABLE

T_CON_SYS_POWER_OFF_OLED

3D&L_DIM_EN

Main SOC

SOC_RESET

INSTANT_BOOT

WOL/ETH_POWER_ON

I2C_SCL_1_MICOM / I2C_SDA_1_MICOM

IC100

MSTAR-Main SOC

SOC_RX/TX

SYSTEM_DEBUG

P200

RS232C

Debug port

AMP_MUTE

AMP

IC5800

POWER_DET

IC1300

RESET IC

DTA2010M

INV_CTL

HDMI_CEC

MODE_SELECT_PWM1

HDMI 1 / 2 / 3 /4

JK3101/JK3102/JK3103/JK3104

POWER WAFER

- 20 -

IR

RL_ON

COMBO_RESET

BT_WAKEUP_HOST

BT_WAKEUP_DEVICE

EYE_SCL / EYE_SDA

WOL/WIFI_POWER_ON

P1001

P4000

IR / KEY/WIFI/BT

LED_R

KEY1 / KEY2

WIFI_EN

GND

+3.5V WIFI

PANEL_CTL

GND

+13V TO PANEL_VCC

Only training and service purposes.

EXPLODED VIEW (SET)

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

400

910

900

200P

411

521

HW1

570

LV2

540

LV1

800

HS1

500

120

HP1

700

530

A10

200A

A9

- 21 -

AR2

EXPLODED VIEW (MODULE)

Optical Sheet

IMPORTANT NOTICE

MRC use only

* MRC : Module Repair Center

200PPR

200P

200PPF

Rear Side

200SR2

200SL2

200SL1

200PC

200SR1

200PF

POL(Rear)

Ass’y

Panel

- 22 -

POL(Front)

DISASSEMBLY GUIDE / ASSEMBLY GUIDE

1. DISASSEMBLY GUIDE (BACK COVER)

1) Lay the TV Set on a flat pad and Disassemble Stand Screw 4 EA.

2) Disassemble B/C Screw

3) Prepare B/C remove after Checking the Module Holder Position.

Screw : 4ea

65/55”

Screw : 12 point

Holder : 65/55” 8 point, 49” 6 point

49”

- 23 -

4) Left Side : Disassemble B/C Using Opener. Put the opener into the gap of guide panel and back cover and move upward. (We recommend disassembly from the left side)



5) Right Side : Disassemble B/C Using Opener. Put the opener into the gap of guide panel and back cover and move upward.

6) Hold the center of the back cover as shown in the picture and slide it upwards

- 24 -

2. ASSEMBLY GUIDE (BACK COVER)

Holder : 65/55” 8 point, 49” 6 point

1) Place the B/C on the Module Assy and push the Holder Position

2) Check the Upper/Left/Right Side gap to make sure the the holder is assembled correctly. → If the Holder is not assembled, B/C

is opened and easily recognized.

3) Assemble the Screw of B/C.

65/55” 49”

Screw : 12 point

4) Assemble Stand Screw 4 EA.

- 25 -

Screw : 4ea

3. DISASSEMBLY GUIDE (SET)

1) Remove all screw of bottom bracket and IR/Wifi Cable at P4000.

2) Bottom Bracket with IR, Wifi/BT Assy

2

Screw point

3) Remove all sort of cable

- 26 -

4) Screw disassembly

5) Speaker disassembly

Screw point

3

6) Screw disassembly

- 27 -

Disassemble the source PCB from the guide

DISASSEMBLY GUIDE / ASSEMBLY GUIDE (MODULE)

1. Disassemble of Cover Shield

2. Disassemble of Guide panel screw

Disassemble the Screws

- UP/RIGHT/LEFT Total : 18 EA

- 28 -

3. Disassemble of Case Top screw

- Screw 9 EA

Disassemble Hooks.

4. Disassemble of screw 4 EA

5. Disassemble Hooks. (UP 2 EA Left/Right each 1 EA)

About 465mm About 465mm

About 25mm

- 29 -

6. Panel and Guide Panel disassembly (using adsorber)

LED

7. Removal of Sheets

8. Removal of LGP

LED

9. Removal of Reflector

10. Removal of LED Housing Assy

- 30 -