Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental sh orts of the cir cui try that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 M
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Ω and 5.2 MΩ.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
1) Connect LAN to PCBA& Power On.(Default IP can be set to
automatic setting. When power ON, IP can be Automatically
be achieved from the router)
2) Push ADJ key on Adjust remote-controller.
3) Enter “13. ACAP PING TEST” & check Network
4.2.2. Check Set
1) Co nnect TV-Set & PC with Cross LAN cab le.(PC IP :
12.12.2.3)
2) Execute “P INT Test program”, Check setting data of
program. (TV-Set IP : 12.12.2.2)
3) Push Power Only key on Adjust remote-controlle.
4) Click “RUN”, Check “OK” or “NG”
4.3. Main S/W program download
4.3.1. Using the Memory Stick
** USB DOWNLOAD : Service Mode
1) Insert the USB memory Stick to the USB port
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”
4) After Finished the Download, Automatically DC Off -> On
5) If the TV IS Turn On, Check the updated SW Version and
Tool Option.
4.4. Input tool option.
Adjust tool option refer to the BOM.
▪ Tool Option Input : PCBA Check Process
▪ Area Option Input : Set Assembly Process
*** Tool Option table
MODEL
47LA86003298153964303934114147514135947243
47LA860T3298153964303934631747514135947243
55LA960T3299954220303974631747514135948267
55EA880T327755473258174631739062135947243
55EA980T327915473258214631739062135947243
55LA965T3338353964303814631747254135948267
55LA970T3320754220303824631747258135948267
65LA965T3440353964303814631747254135948267
65LA970T3422754220303824631747258135948267
55LA79003296753964303934114147510135947243
55LA86003298353964303934114147514135947243
60LA86003298453964303934114147258135948267
60LA860T3298453964303934631747258135948267
70LA860T391295396458174631747254135947243
84LA980T3337153964303974631747254135948267
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
Must be changed the option value because being different with
some setting value depend on module maker, inch and market
4.4.2. Equipment
Adjustment remote control
4.4.3. Adjustment method
The input methods are same as other chassis.(Use ADJ Key
on the Adjust Remocon.)
(If not changed the option, the input menu can differ the model
spec.)
Re fer to Job Expre ss ion of each ma in chassis as s’ y
(EBTxxxxxxxx) for Option value
Caution : Don’t Press “IN-STOP” key after completing the
function inspection.
4.5. EDID D/L method
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information
Sharing without any necessity of user input. It is a realization
of “Plug and Play”
4.5.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Options.
Automatically downloaded when pushing the enter key after
adjusting the tool option5.
It takes about 2seconds
4.5.2. 2nd Method
● Caution : Must be checked that the tool option is right or not.
If tool option is wrong, hdmi edid data could not be
downloaded well.
1) Press the ADJ key
2) Move to the 10. EDID D/L and Press the right direction
key(►)
3) Press the right direction key(►) at Start.
4) After about a few seconds, appear “Waiting..” => “OK”, then
compele.
4.6.2.2.1.ADC 480i/1080p Comp
(1) Check co nnected c on di tion of Comp cable to th e
equipment
(2) Give a 480i Mode, Horizontal 100% Color Bar Pattern to
Comp1. (MSPG-925FA → Model: 209, Pattern: 65)
(3) Change input mode as Component1 and picture mode as
“Standard”
(4) Press the In-start Key on the ADJ remote after at least 1
min of signal reception. Then, select 7.External ADC. And
Press OK or Right Button for going to sub menu.
(5) Press OK in Comp 480i menu
(6) Give a 1080p Mode, Horizontal 100% Color Bar Pattern to
Comp1. (MSPG-925FA → Model: 225, Pattern: 65)
(7) Press OK in Comp 1080p menu
(8) If ADC Comp is successful, “ADC Component Success” is
displayed.
(9) If ADC calibration is failure, “ADC Component Fail” is
displayed.
(10) If ADC calibration is failure, after rechecking ADC pattern
or condition, retry calibration
(11) If ADC calibration is failure, after recheck ADC pattern or
condition, retry calibration
4.7. Check SW Version
4.7.1. Method
1) Push In-star key on Adjust remote-controller.
2) SW Version check(ex. 47LW9500-DA)
4.8. MHL Test
Step 1) Turn on TV
Step 2) Select HDMI4 mode using input Menu.
Step 3) Set MHL Zig(M1S0D3617) using MHL input, output
and power cord.
Step 4) Connect HDMI cable between MHL Zig and HDMI4
port.
Step 5) Check LED light of Zig and Module of Set
Result) If, The LED light is green and The Module shows
normal stream -> OK
Else -> NG
4.9. Camera Port Inspection
(1) Objective : To check PCBA’s CAMERA Port.
(2) How-it-works
i) Connect the PCBA like below Picture.
ii) Send specific RS-232C Command for displaying Camera
Preview.
* CAMERA need to be status of Slide up.
Only for training and service purposes
(3) RS-232C Command
RS-232C COMMAND
CMDDATAID
Ai0023Camera Function Start.
Ai0024Camera Function End.
Explanation
5. SET assembly adjustment method
5.1. Input Area-Option
(1) Prole : Must be changed the Area option value because
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Vi deo Sig nal Genera tor MSP G-925F 720p/216-Gray
(Model: 217, Pattern: 78)
5.2.2.3. Adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key → EZ adjust using adj. R/C → 6. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 216 Gray inte rnal pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one
of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
※ Luminance min value is 150cd in the Cool/Medium/Warm
5.2.3.1.Cool Mode
(1) Purpose : Especially G -g ai n f ix ad ju st leads to the
lu mi nance enhancem en t. Adj us t t he co lo r
tempe rat ure to reduc e the deviation of the
module color temperature.
(2) Principle : To ad ju st t he w hite b al an ce w it hout t he
saturation, Adjust the G gain more than 172 ( If
R gain or G gain is more than 255 , G gain can
adjust less than 172 ) and change the others
(R/B Gain ).
(3) Adjustment mode : mode – Cool
**For 55/65LA97 Models
* R-fix adjustment
Adjust modes (Cool), Fix the R gain to 210 (default data) and
change the others (G/B Gain ).
- Adjust the R gain more than 210 ( If G gain or B gain is less
than 0 , R gain can adjust more than 210 )
and change the others ( G/B Gain ).
Adjust two modes(Medium / Warm), Fix the one of R/G/B gain
to 192 (default data) and decrease the
others.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 7.White Balance, you can select one of
5.2.4.2. Medium Mode
(1) Purpose : Adjust the color temperatur e to reduc e the
deviation of the module color temperature.
(2) Principle : To ad ju st t he w hite b al an ce w it hout t he
saturation, Fix the B gain to 192 (default data)
and decrease the others.
(3) Adjustment mode : mode – Medium
5.2.4.3. Warm Mode
(1) Purpose : Adjust the color temperatur e to reduc e the
deviation of the module color temperature.
(2) Principle : To ad ju st t he w hite b al an ce w it hout t he
saturation, Fix the W gain to 192 (default data)
and decrease the others.
(3) Adjustment mode : mode – Warm
● Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
ModeColor coordinateTemp△uv
XY
Cool0.271±0.0020.270±0.00213000K0.0000
Medium0.285±0.0020.293±0.0029,300 K0.000
Warm0.313±0.0020.329±0.0026,500K0.003
2 Test-pattern: ON, OFF. Default is inner(ON). By selecting
OFF, you can adjust using RF signal in 216
Gray pattern.
5.2.3.2. Medium / Warm Mode
(1) Purpose : Adju st the col or tempe rature to reduce the
deviation of the module color temperature.
(2) Principle : To ad ju st t he w hite b al an ce w it hout t he
saturation, Fix the one of R/G/B gain to 192
(default data) and decrease the others.
(3) Adjustment mode : Two modes – Medium / Warm
5.2.4. OLED White balance table
5.2.4.1.Cool Mode
(1) Purpose : Especially B -g ai n f ix adjust l eads t o t he
lu mi nance enhancem en t. Adj us t t he co lo r
tempe rat ure to reduc e the deviation of the
module color temperature
(2) Principle : To ad ju st t he w hite b al an ce w it hout t he
saturation, Adjust the B gain more than 192 ( If R
gain or G gain is more than 255 , G gain can
adjust less than 192 ) and change the others (
R/G Gain ).
(3) Adjustment mode : mode – Cool
▪ Change reason : When vivid mode, more detail than other
company set.
● In case of Edge LED module, the color coordinates is
changing by aging, so you have to use the below table.
The Time Table of color coordinates by SET Aging Time
1) Edge LED Models(LA7xxx, LA8XXX, 55LA9600)_nomarl
2) Edge LED Models(LA7xxx, LA8XXX, 55LA9600)_aging
chamber
GP3Aging
time
(Min)
10-5280 285 294308319340
26-10276 280 290 303 315 335
311-20272 275 286 298 311 330
421-30269 272 283 295 308 327
531-40267 268 281 291 306 323
641-50266 265 280 288 305 320
751-80265 263 279 286 304 318
881-119264 261 278 284 303 316
9Over 120264 260 278 283 303 315
CoolMediumWarm
xyxyxy
270271285293313329
3) ALEF (55LA970T/65LA970T-DA)_nomal line
GP3Aging
time
(Min)
10-2281287295310320342
23-5280285294308319340
36-9278284292307317339
410-19276281290304315336
520-35275277289300314332
636-49274274288297313329
750-79273272287295312327
880-119272271286294311326
9Over 120271270285293310325
CoolMediumWarm
xyxyxy
271270285293313329
4) ALEF (55LA970T/65LA970T-DA)_aging chamber
GP3Aging
time
(Min)
120280283295302320327
221-25276278291297316322
326-30271272286291311316
431-35267268282287307312
536-40265263280282305307
641-50262260277279302304
751-80260258275277300302
881-119259256274275299300
9Over 120259255274274299299
CoolMediumWarm
xyxyxy
271270285293313329
■ In the SET applied LED module (LM9600), cause of the
physical characteristics of LED Module, sets are taken a
120 minutes by aging time to stabilize a color coordinates.
So White Balance Control equipments have to get the SET
Aging Time from the SET and then going to control the W/B
by revise color coordinates at each time
- To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : select Vivid and change
Dynamic Contrast : Off ,
Dynamic Colour : Off,
Clear White : Off
->Picture Mode change : Vidid -> Vivid(User)
(If you miss the upper condition, the coordinates of W/B can be
lower than the spec.)
5.3. Intelligent Sensor Inspection Guide
Step 1. Turn on the TV set.
Step 2. Press “EYE” button on the Adjustment remote controller.
Step 3. Block the Intelligent Sensor module on the front C/A
about 6 seconds.
When the “Sensor Data” is lower than 20, you can see the
“OK” message -> If it doesn’t show “OK” message, the Sensor
Module is defected one.
You have to replace that with a good one.
Step 4. After check the “OK” message come out, take out your
hand from the Sensor module.
-> Check “Sensor Data” value change from “0” to “300” or not.
If it doesn’t change the value, the sensor is also defected
5) If automatic setting is nished, you conrm IP and MAC
Address
5.5. WIDEVINE Key Inspection
1) Conrm Key input Data at the “IN START” MENU Mode
5.6. Model name & Serial number D/L
5.6.1. Notice
1) Serial number D/L is using of scan equipment.
2) Setting of scan equipment operated by Manufacturing
Technology Group.
3) Serial number D/L must be conformed when it is produced in
production line, because serial number D/L is mandatory by
D-book 4.0
4) Check the model name In-start menu -> Factory name
displayed (ex 42LV5500-DD)
5) Check the Diagnostics (DTV country only) -> Buyer model
displayed (ex 42LV5500-DD)
5.7. Wi-Fi MAC ADDRESS CHECK
5.7.1. Notice
1) Using RS232
CommandSet ACK
Transmission [A][l][][Set ID][][20][Cr][O][K][x] or [N][G]
2) Check the menu on in-start
5.8. Local Dimming Inspection (Optional)
5.8.1. Edge LED models with local dimming
1) Press ‘TILT” key of the Adj. R/C and check moving patterns. The black bar patterns moves from left to right. If local
dimming function does not work, a whole screen shows full
white.
5.6.2. Method : Auto
1) Press “Power on” key of service remocon.(Baud rate : 115200
bps)
2) Connect RS232 Signal Cable to RS-232 Jack
3) Write Serial number by use RS-232.
4) Must check the serial number at Instart menu
5.6.3. Method : Manual
* If the TV set is downloaded By OTA or Service man, Sometimes
model name or serial number is initialized.
( Not always) It is impossible to download by bar code scan, so
It need Manual download.
1) Press the ‘instart’ key of ADJ remote controller.
2) Go to the menu ‘6.Model Number D/L’ like below photo.
3) Input the Factory model name or Serial number like photo.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these sp ecial safet y parts shoul d be replac ed with the same compon ents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-NC4_H001-HD
2012-11-14
H13 D CHIP
LG1154A
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
BSD-NC4_H002-HD
2012-12-24
MAIN POWER
Place JACK Side
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
AV1_CVBS_IN
SC_CVBS_IN
SC_CVBS_IN_SOY
COMP1_Pb
COMP1_Pr
SCART_Lout
SCART_Rout
HP_LOUT_MAIN
HP_ROUT_MAIN
TU_CVBS
SC_FB
SC_ID
NON_EU
R422-*1
COMP1_Y
5.5V
D404
0
SCART_FB_DIRECT
SC_B
SC_G
SC_R
D403
D401
5.5V
5.5V
Near Place Scart AMP
C6006
1uF 25V
C6001
SC_L_IN
SC_R_IN
COMP1/AV1/DVI_L_IN
COMP1/AV1/DVI_R_IN
+12V
R430
R445
L408
C405
150pF
50V
C408
150pF
50V
EU
C402
150pF
50V
OPT
SCART_FB_DIRECT
R423100
10K
EU
R435
R422
75
10pF
10pF
C473
C472
50V
50V
OPT
D406
5.5V
EU
EU
10K
1uF25V
R60 06
EU
EU
10K
R6005
EU
EU
R408
100K
R403
100K
EU
C403
2.2uF
10V
EU
EU
R404
100K
R409
100K
R6450
100
C400
0.01uF
22K
R6451
C401
0.01uF
22K
L409
OPT
C430
EU
C474
2.2uF
100
10pF
50V
10V
1uH
C410
150pF
1uH
C462
150pF
EU
EU
R436
2.7K
10pF
EU
50V
OPT
10pF
C431
C470
50V
SCART_AMP_R_FB
SCART_AMP_L_FB
EU
C406
+3.3V_NORMAL
R4641K1/16W
1%
R465
390
1/16W
1%
DAC_START_PULLDOWN
R466821/16W
R410
75
1%
R411
75
EU
1%
NON_EU
R436-*1
0
75
75
EU
75
1%
1%
1%
R416
R414
R412
10pF
50V
SCART_Lout_SOC
SCART_Rout_SOC
AUDA_OUTL
AUDA_OUTR
C404
0.01uF
50V
EU
75
1%
R413
75
1%
R415
1%
75
1%
R417
CLK_54M_VTT
FOR EMI
R41827K
R41927K
R42027K
R42127K
MAIN Clock(24Mhz)
C426
C427
Place SOC Side
R434
C424 0.047uF
100
R433
C425 0.047uF
100
SC_CVBS_IN_SOY
R432
C423 0.047uF
100
R424
C417 0.047uF
33
R425
C418 0.047uF
33
C428 1000pF
R427
R428
R429
C419
33
C420 0.047uF
33
C421 0.047uF
33
C429 1000pF
C422 0.047uF
33
R431
0.047uF
AUDIO IN
1%
1%
1%
1%
SCART_FB_BUFFER
SC_FB
C4324.7uF
R43710K 1%
C4334.7uF
R43810K 1%
C4344.7uF
R43910K 1%
C4354.7uF
R44010K 1%
R401
470
1/16W
5%
R4061K
SCART_FB_BUFFER
SCART_FB_BUFFER
B
1/16W
1%
Clock for H13A
10pF
10pF
+3.3V_NORMAL
R446
4.7K
C
E
X-TAL_1
GND_1
1
2
4
3
GND_2
X-TAL_2
AV1_CVBS_IN_SOC
SC_CVBS_IN_SOC
TU_CVBS_SOC
SC_FB_SOC
SC_ID_SOC
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_Y_IN_SOC_SOY
COMP1_PR_IN_SOC
COMP2_PB_IN_SOC
COMP2_Y_IN_SOC
COMP2_Y_IN_SOC_SOY
COMP2_PR_IN_SOC
SC_FB_BUF
MMBT3904(NXP)
Q400
SCART_FB_BUFFER
R441
X400
24MHz
AUAD_L_CH3_IN
AUAD_R_CH3_IN
AUAD_L_CH2_IN
AUAD_R_CH2_IN
Tuner IF Filter
1M
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_Y_IN_SOC_SOY
COMP1_PR_IN_SOC
COMP2_PB_IN_SOC
COMP2_Y_IN_SOC
COMP2_Y_IN_SOC_SOY
COMP2_PR_IN_SOC
ADC_I_INN
ADC_I_INP
BLM18PG121SN1D
HP_LOUT_AMP
XIN_SUB
XOUT_SUB
XIN_SUB
XOUT_SUB
XTAL_SEL[0]
XTAL_SEL[1]
SOC_RESET
OPM[0]
OPM[1]
H13A_SCL
H13A_SDA
AV1_CVBS_IN_SOC
SC_CVBS_IN_SOC
TU_CVBS_SOC
DTV/MNT_V_OUT_SOC
Placed as close as possible to SOC
REFT
REFB
R44768
R44868
R44968
SC_ID_SOC
SC_FB_SOC
+3.3V_NORMAL
DTV/MNT_V_OUT
To ADC
HP_OUT
L400
HP_OUT
C407
0.22uF
10V
R450
C439
OPT
100pF
50V
C440 0.047uF
C441 0.047uF
C442 0.047uF
MM1756DURE
VCC
6
PS
5
OUT
4
NON_TU_BR/TW
R443
51
NON_TU_W_BR/TW
NON_TU_BR/TW
R444
51
HP_LOUT
C443 0.047uF
68
IC400
Place at JACK SIDE
OP MODE Setting
& Select XTAL Input
OP MODE[0:1] : SW[2:1]
00 => Normal Operaiton Mode
/T32 Debug Mode
01 => Internal Test Purpose
10 => Internal Test Purpose
11 => Internal Test Purpose
XTAL SEL[1:0] : SW[4:3]
00 => Xtal Input
01 => CLK 24M from H13D
10 => XTAL Bypass from H13D
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-NC4_H004-HD
2012-11-13
MAIN AUDIO/VIDEO
IC100
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
DDR3 1.5V bypass Cap - Place these caps near Memory
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-NC4_H005-HD
2012-09-14
MAIN DDR
PCM_RESET
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
CI
CI_TS_DATA[3]
CI_TS_DATA[2]
CI_TS_DATA[1]
CI_TS_DATA[0]
AR700
100
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TPI_DATA[3]
TPI_DATA[2]
TPI_DATA[1]
TPI_DATA[0]
BSD-NC4_H007-HD
2012-10-20
PCMCIA
+3.5V_ST
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-NC4_H039-HD
NC4_H13
POWER_BLOCK(OLED)23
2013.03.05
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