LG 555LB63Y-TD, 55LB563Y, 55LB5630, 55LB561Y, 32LB561D/B Service Manual

Printed in KoreaP/NO : MFL67982501 (1312-REV00)

CHASSIS : LB43B

MODEL: 55LB5610/561Y/5630/563Y

55LB5610/561Y-TC 55LB5630/563Y-TD

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

LED TV

SERVICE MANUAL

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

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Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 8

EXPLODED VIEW .................................................................................. 14

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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Only for training and service purposes

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

SAFETY PRECAUTIONS

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Only for training and service purposes

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this service manual. CAUTION: Do not connect the test xture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some eld-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

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Only for training and service purposes

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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Only for training and service purposes

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used LB43B chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.

5) The receiver must be operated for about5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

No. Item Specication Remarks

1. Market

Asia, Oceania, Africa, Middle East (PAL/DVB Market)

2. Broadcasting system

1) PAL/SECAM-B/G/D/K/I

2) NTSC-M

3) DVB-T/T2

► DTV LB43B/LB43M support DVB-T LB43T support DVB-T//T2

3. Channel Storage ATV - 135EA, DTV - 1000EA

4. Receiving system

Analog : Upper Heterodyne Digital : COFDM(DVB-T)

► DVB-T

- Guard Interval (Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

► DVB-T2

- Guard Interval (Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,

- Modulation : Code Rate QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

5. Video(Composite Input) PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60

6. Component Input Y/Cb/Cr, Y/Pb/Pr

7. HDMI Input

HDMI1-DTV/DVI HDMI2-DTV/MHL

Support HDCP

8. SPDIF out SPDIF out Except 32”HD model

9. USB Input For My Media(Movie/Photo/Music List) and SVC

10. Headphone

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Only for training and service purposes

5. Component Video Input (Y,

Cb/Pb, Cr/Pr)

No. Resolution H-freq(kHz) V-freq(Hz) Porposed

1 720×480 15.73 60.00 SDTV, DVD 480i

2 720×480 15.63 59.94 SDTV, DVD 480i

3 720×480 31.47 59.94 480p

4 720×480 31.50 60.00 480p

5 720×576 15.625 50.00 SDTV, DVD 625 Line

6 720×576 31.25 50.00 HDTV 576p

7 1280×720 45.00 50.00 HDTV 720p

8 1280×720 44.96 59.94 HDTV 720p

9 1280×720 45.00 60.00 HDTV 720p

10 1920×1080 31.25 50.00 HDTV 1080i

11 1920×1080 33.75 60.00 HDTV 1080i

12 1920×1080 33.72 59.94 HDTV 1080i

13 1920×1080 56.250 50 HDTV 1080p

14 1920×1080 67.5 60 HDTV 1080p

6. HDMI Input : Refer to adjust specification about EDID data.

6.1. DTV mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

1. 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P

2. 720*576 31.25 50 54 SDTV 576P

3. 1280*720 37.500 50 74.25 HDTV 720P

4. 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P

5. 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I

6. 1920*1080 28.125 50.00 74.25 HDTV 1080I

7. 1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 HDTV 1080P

8. 1920*1080 33.716/33.75 29.976/30.00 74.25 HDTV 1080P

9. 1920*1080 56.250 50 148.5 HDTV 1080P

10. 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P

6.2. PC mode

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 640*350 @70Hz 31.468 70.09 25.17 EGA

2. 720*400 @70Hz 31.469 70.08 28.321 DOS

3. 640*480 @60Hz 31.469 59.940 25.175 VESA(VGA)

4. 800*600 @60Hz 37.879 60.31 40.000 VESA(SVGA)

5. 1024*768 @60Hz 48.363 60.00 65.000 VESA(XGA)

6 1152*864 @60Hz 54.348 60.053 80.002 VESA

7. 1280*1024 @60Hz 63.981 60.020 108 VESA(SXGA) FHD only(Support to HDMI-PC)

8. 1360*768 @60Hz 47.712 60.015 85.5 VESA(WXGA)

9. 1920*1080 @60Hz 67.5 60.0 148.5

WUXGA (Reduced blanking)

FHD only(Support to HDMI-PC)

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Only for training and service purposes

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with LB43B chassis.

2. Designation

(1) Th e ad justm ent is accord ing to the order whic h is

designated and which must be followed, according to the

plan which can be changed only on agreeing. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25 °C ± 5 °C Relative humidity : 65 ± 10 % Input voltage : 100-220 V~, 50/60 Hz

(6) Adjustment equipments

: Color Analyzer(CA-210 or CA-110), Service remote control.

(7) Push the “IN STOP" key - For memory initialization.

3. Main PCB check process

▪ APC - After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program "Mstar ISP Utility" and then click

"Config" tab. (2) Set as below, and then click "Auto Detect" and check "OK"

message.

If "Error" is displayed, check connection between computer, jig, and set.

(3) Click "Read" tab, and then load download file(XXXX.bin)

by clicking "Read"

(4) Click "Connect" tab. If "Can't" is displayed, check connection

between computer, jig and set.

(5) Click "Auto" tab and set as below. (6) Click "Run". (7) After downloading, check "OK" message.

* USB DOWNLOAD(*.epk file download)

(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.

- If version of update file in USB Stick is lower, it will not work. But version of update file is higher, USB data will be detected automatically.

Case1 : Software version up

1. After downloading S/W by USB , TV set will reboot automatically.

2. Push “In-stop” key.

3. Push “Power on” key.

4. Function inspection

5. After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push “In-stop” key at rst.

2. Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

3. After function inspection, Push “In-stop” key.

(1)

filexxx.bin

(4)

(5)

(6)

(7)...........OK

filexxx.bin

(2)

(3)

Please Check the Speed : To use speed between from 200KHz to 400KHz

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Only for training and service purposes

(3) Show the message "Copying files from memory".

(4) Updating is starting.

(5) Updating Completed, The TV will restart automatically. (6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If updated version is higher than what TV has, the TV can

lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ATV test on production line.

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number) (4) Completed selecting Tool option.

*

RS-232C Connection Method.

Connection : PCBA (USB Port) → USB to Serial Adapter (UC-232A) → RS-232C cable → PC(RS-232C port)

● Product name of USB to Serial Adapter is UC-232A.

4. ADC Process

4.1. ADC

- Enter Service Mode by pushing "ADJ" key,

- Enter Internal ADC mode by pushing "►" key at "8. ADC Calibration".

<Caution> Using "P-ONLY" key of the Adjustment remote

control, power on TV.

* ADC Calibration Protocol (RS232)

Adjust Sequence ▪ aa 00 00 [Enter Adjust Mode] ▪ xb 00 40 [Component1 Input (480i)] ▪ ad 00 10 [Adjust 480i Comp1] ▪ aa 00 90 End Adjust mode * Required equipment : Adjustment remote control.

4.2. Function Check

4.2.1. Check display and sound

■ Check Input and Signal items.

(1) TV (2) AV (CVBS) (3) COMPONENT (480i) (4) HDMI * Display and Sound check is executed by Remote control.

<Caution> Not to push the "INSTOP" key after completion if

the function inspection.

NO Item CMD 1 CMD 2 Data 0

Enter Adjust MODE

Adjust ‘Mode In’

A A 0 0

When transfer the ‘Mode In’, Carry the command.

ADC adjust ADC Adjust A D 1 0

Automatically adjustment (The use of a internal pattern)

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration ►

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L

13. Sub B/C

14. Ext. Input Adjust

ADC Calibration

ADC Comp 480i

ADC Comp 1080p

ADC Type ◄ ►

Start

NG

OPT

Reset

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Only for training and service purposes

5. Total Assembly line process

5.1. Adjustment Preparation

▪ W/B Equipment condition

CA210: CH14, Test signal: Inner pattern(80IRE)-LED Module

▪ Above 5 minutes H/run in the inner pattern. ("power on" key

of Adjustment remote control)

* The spec of color temperature and coordinate.

* W/B Table in process of aging time

- LGD Module

- AUO/COST/SHARP/BOE Module which cool spec is 13000 K

* Connecting picture of the measuring instrument

(On Automatic control) Inside Pattern is used when W/B is controlled. Connect to auto controller or push Adjustment Remote control POWER ON → Enter the mode of White-Balance, the pattern will come out.

* Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (Illumination is less than 10 lux).

(2) Adhere closely the Color analyzer(CA210) to the module

less than 10 cm distance, keep it with the surface of the Module and Color analyzer's prove vertically.(80° ~ 100°).

(3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.

▪ Auto adjustment Map(RS-232C)

RS-232C COMMAND [CMD ID DATA] Wb 00 00 White Balance Start Wb 00 ff White Balance End

Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0.(When R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)

Full White Pattern

CA-210

COLOR ANALYZER TYPE : CA-210

RS-232C Communication

Mode Color Temp Color coordinate Remark

Cool (C50) 13,000 K

X=0.271 (±0.002) Y=0.270 (±0.002)

- Inner pattern for W/B adjust

- External white pattern

(80IRE, 204gray)

Medium(0) 9,300 K

X=0.286 (±0.002) Y=0.289 (±0.002)

Warm(W50) 6,500 K

X=0.313 (±0.002) Y=0.329 (±0.002)

(normal line) March ~ December

Aging time(Min) Cool Medium Warm

color coordinate X y x y x y

Target 271 270 286 289 313 329 1 0-2 282 289 297 308 324 348 2 3-5 281 287 296 306 323 346 3 6-9 279 284 294 303 321 343 4 10-19 277 280 292 299 319 339 5 20-35 275 277 290 296 317 336 6 36-49 274 274 289 293 316 333 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329

(normal line) January ~ Feburary

Aging time Cool Medium Warm

color coordinate x y x y x y

Target 271 270 286 289 313 329 1 0-2 286 295 301 314 328 354 2 3-5 284 290 299 309 326 349 3 6-9 282 287 297 306 324 346 4 10-19 279 283 294 302 321 342 5 20-35 276 278 291 297 318 337 6 36-49 274 275 289 294 316 334 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329

Cool Medium Warm

x y x y x y

spec 271 270 285 293 313 329

target 276 277 290 300 318 336

RS-232C COMMAND

[CMD ID DATA]

MIN

CENTER

(DEFAULT)

MAX

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

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Only for training and service purposes

* Manual W/B process using adjust Remote control.

■ Color analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000.

■ Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting.

■ After enter Service Mode by pushing “ADJ” key,

■ Enter White Balance by pushing “►” key at “9. White Balance”.

■ For manual adjustment, it is also possible by the following sequence.

(1) Set TV in Adj. mode using “P-ONLY” key on remote

controller and then operate heat run longer than 15 minutes.(If not executed this step, the condition for W/B

may be different.) (2) Push “Exit” key. (3) Enter White Balance mode by pushing the ADJ key and

select “9. White Balance”. When KEY (►) is pressed,

206 Gray internal pattern will be displayed. (4) Zero Calibrate the probe of Color Analyzer, then place it

on the center of LCD module within 10cm of the surface (5) Sele ct eac h it ems (R ed/Gr een/Blu e Ga in) us ing

▲/▼(CH +/-) key on Remote control. (6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C. (7) Adjust three modes all (Cool / Medium / Warm)

- For All model w/o LS345 Fix the one of R/G/B gain and change the others

- For G-FIX model Cool Mode

1) Fix the one of R/G/B gain to 192 (default data) and

decrease the others. (If G gain is adjusted over 172 and R and B gain less than 192 , Adjust is O.K.)

2) If G gain is less than 172, Increase G gain by up to

172, and then increase R gain and G gain same amount of increasing G gain.

3) If R gain or B gain is over 255, readjust G gain less

than 172, Conform to R gain is 255 or B gain is 255

Medium / Warm Mode - Fix the one of R/G/B gain to 192 (default data) and decrease the others.

(8) When adjustment is completed, exit adjustment mode

using EXIT key on Remote control.

* CASE Cool

First adjust the coordinate far away from the target value(x, y).

1) x, y > target i) Decrease the R, G.

2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others.

3) x > target, y < target i) First decrease B, so make y a little more than the

target.

ii) Adjust x value by decreasing the R.

4) x < target, y > target i) First decrease B, so make x a little more than the

target.

ii) Adjust x value by decreasing the G.

* After You finish all adjustments, Press “In-start” button

and compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.

If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.

* Push the “IN STOP" key after completing the function

inspection.

5.2. DDC EDID Write (HDMI 256Byte)

■ Connect HDMI Signal Cable to HDMI Jack.

■ Write EDID DATA to EEPROM(24C02) by using DDC2B protocol.

■ Check whether written EDID data is correct or not.

* For SVC main Assembly, EDID have to be downloaded to

Insert Process in advance.

5.3. EDID DATA

1) All Data : HEXA Value

2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***: Year : Controlled ****: Check sum

- Auto Download

■ After enter Service Mode by pushing “ADJ” key,

■ Enter EDID D/L mode.

■ Enter “START” by pushing “OK” key.

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 10 Point WB

11. Test Pattern

12 EDID D/L

13. Sub B/C

14. Ext. Input Adjust

Whit Balance

Color Temp. ◄ ►

R-Gain

G-Gain

B-Gain

R-Cut

G-Cut

B-Cut

Test-Pattern

Backlight

Reset To Set

Cool

172

192

64

ON

100

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L ►

13. Sub B/C

14. Ext. Input Adjust

EDID D/L

HDMI1 NG

HDMI2 NG

Start

Reset

EDID D/L

HDMI1 OK

HDMI2 OK

Start

Reset

- 12 -

Only for training and service purposes

[Caution]

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

* Edid data and Model option download (RS232)

(1) FHD 8BIT 2D HDMI EDID DATA

(2) Detail EDID Options are below

a. Product ID

b. Serial No: Controlled on production line. c. Month, Year: Controlled on production line:

ex) Week : '01' -> '01'

Year : '2012' -> '16' fix

d. Model Name(Hex):

cf) TV set’s model name in EDID data is below.

e. Checksum: Changeable by total EDID data.

f. Vendor Specific

- FHD 8bit Model

5.4. Outgoing condition Configuration

■ When pressing IN-STOP key by Service remote control, Red LED are blinked alternatively. And then automatically turn off. (Must not AC power OFF during blinking)

5.5. GND and HI-POT Test

5.5.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition.

(2) You can’t use Tuner Ground & Tuner signal line at all

models (applied Isolator inner tuner)

5.5.2. GND & HI-POT auto-check

(1) Pallet moves in the station.(POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process(Hi-pot test). (Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process automatically.

5.5.3. Checkpoint

(1) Test voltage

1) 3 Poles

- GND: 1.5KV/min at 100 mA

- SIGNAL: 3KV/min at 100 mA

2) 2 Poles

- SIGNAL: 3 KV/min at 100 mA (2) TEST time: 1 second (3) TEST POINT

1) 3 Poles

- GND Test = POWER CORD GND and SIGNAL

CABLE GND.

- Hi-pot Test = POWER CORD GND and LIVE &

NEUTRAL.

2) 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms

NO Item CMD 1 CMD 2 Data 0

Enter download Mode

Download ‘Mode In’

A A 0 0

When transfer the ‘Mode In’, Carry the command.

EDID data and Model option download

ADC Adjust A E 00 10

Automatically adjustment (The use of a internal pattern)

No. Item Condition Hex Data

1 Manufacturer ID GSM 1E6D

2 Version Digital : 1 01

3 Revision Digital : 3 03

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D A B 10 C 01 03 80 A0 5a 78 0A EE 91 A3 54 4C 99 26 20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 8 0 30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 45 00 A0 5A 00 00 00 1E 66 21 50 B0 51 00 1B 30 50 40 70 36 00 A0 5A 00 00 0 0 1E 00 0 0 0 0 FD 00 3A 60 3E 1E 53 10 00 0A 20 20 20 20 20 20 D 70 D 01 E 80 02 03 22 F1 4E 10 9F 04 13 05 14 03 02 12 20 21 90 22 15 01 26 15 07 50 09 57 07 f A0 80 1E 01 1d 80 18 71 1c 16 20 58 2c 25 00 20 C2 B0 31 00 0 9e 01 1d 00 72 51 d0 1e 20 6e 28 55 00 C0 20 C2 31 00 00 1e 02 3a 80 18 71 38 2d 40 58 2c D0 45 00 A0 5a 00 00 00 1e 01 1d 00 Bc 52 d0 1e 20 E0 B8 28 55 40 C4 8e 21 00 00 1e 00 00 00 00 00 00 F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 E

Model Name HEX EDID Table DDC Function

HD/FHD Model 0001 01 00 Analog/Digital

MODEL NAME MODEL NAME(HEX)

LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)

EDID C/S data

FHD-8BIT

HDMI

Check Sum

(Hex)

Block 0 41

Block 1

25 (HDMI1) 15 (HDMI2)

Input Model name(HEX) HDMI1 67030C001000 HDMI2 67030C002000

- 13 -

Only for training and service purposes

6. 3D function test

(Pattern Generator MSHG-600, MSPG-6100[Support HDMI1.4]) * HDMI mode No. 872 , pattern No.83 (1) Please input 3D test pattern like below.

(2) When 3D OSD appear automatically, then select OK button.

(3) Don't wear a 3D Glasses, check the picture like below.

- 14 -

Only for training and service purposes

900

200

400

410

540

521

530

820

501

500

120

310

121

LV1

A2

A10

Set + Stand

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

CI_TS_DATA[0]

PCM_D[6]

PCM_5V_CTL

/PCM_CE

SC1_FB

CI_TS_CLK

PCM_A[10]

PCM_A[9]

HP_LOUT

CI_TS_DATA[2]

CI_TS_SYNC

PCM_A[13]

SC1_IDPCM_D[1]

HP_DET

SCART1_MUTE

PCM_D[5]

/PCM_WE

/PCM_IRQA

PCM_D[3]

PCM_D[0]

/PCM_CD

CI_TS_DATA[5]

PCM_D[2]

PCM_A[14]

CI_TS_DATA[4]

SCART1_Lout

/PCM_REG

HP_ROUT

/PCM_IOWR CI_TS_DATA[1]

PCM_RST

PCM_A[12]

CI_TS_VAL

CI_TS_DATA[3]

/PCM_WAIT

SCART1_Rout

CI_TS_DATA[6]

PCM_D[4]

PCM_A[8]

DTV/MNT_VOUT

PCM_D[7]

/PCM_OE

SIDE_HP_MUTE

CI_TS_DATA[7]

/PCM_IORD PCM_A[11]

SC1_B+/COMP1_Pb+

SC1_G+/COMP1_Y+

SC1_R+/COMP1_Pr+

SC1/COMP1_L_IN

SC1/COMP1_DET

SC1/COMP1_R_IN

FE_TS_DATA[1]

FE_TS_DATA[2]

FE_TS_DATA[3]

FE_TS_DATA[4]

FE_TS_DATA[5]

FE_TS_DATA[6]

FE_TS_DATA[7]

/CI_DET

2013.05.09

TP_NON_EN

3

NC5_L14

TP for Headphone

TP for S2

TP for CI slot

TP for NON-EU models(except EU and China)

TP for SCART

TP for FE_TS_DATA

LGE Internal Use Only

THERMAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

Power_PD2

2013.10.28 4

L14_M1A

Q403 MMBT3904(NXP)

E

B

C

+12V

R426

10K

+3.5V_ST

Q406

AO3435

FET_2.5V_AOS

G

D

S

PANEL_VCC

PWM_DIM

Q400 MMBT3904(NXP)

E

B

C

R420

1K

R424

3.9K

PWM_DIM_PULL_DOWN

R401

10K

R442 10K

+24V

Q404 MMBT3904(NXP)

E

B

C

R441 10K

+3.5V_ST

R445

33K

R448

2.2K

C413

0.1uF 16V

OPT

C416

0.33uF 16V

R444 10K

+12V

INV_CTL

R430

2.7K 1%

+3.5V_ST

R400

10K

OPT

+3.5V_ST

R425 10K

R435 100K

Q402

MMBT3904(NXP)

E

B

C

R429

10K

C415

0.1uF 16V

C417

0.1uF 16V

L410

BLM18PG121SN1D

C424

0.1uF 16V

OPT

+3.3V_Normal

Q406-*1 DMP2130L

FET_2.5V_DIODE

G

D

S

R432

0

5%

OPT

R431

1.2K 1%

L403

MLB-201209-0120P-N2

POWER_ON/OFF_1

C401

0.1uF 50V

+1.10V_VDDC

POWER_DET

RL_ON

+3.3V_Normal

+12V

+24V

+3.5V_ST

L402

MLB-201209-0120P-N2

C429

0.1uF 16V

R423

100

PWM2_2CH_POWER

PANEL_CTL

R443 10K

R406 10K

R419 100

+3.5V_ST

POWER_DET_RESET

+3.3V_Normal

C402

0.1uF 16V

C425

0.1uF 25V

OPT

C422

0.1uF

R436

100K

OPT

R451

5.6K

R404

4.7K

R402

10K

R452

5.6K

R412

33K

OPT

Q401

MMBT3906(NXP)

1

2

3

PWM1

L407

3.6uH

R454

100 5%

PD_+12V

C430 22uF 10V

C414 10uF 10V

C428

2.2uF 10V

C420 22uF 10V

C421 22uF 10V

C427 10uF 16V

ZD400

5V

ZD402

5V

L401

CB2012PK501T

L400

CB2012PK501T

L408

UBW2012-121F

120OHM

+3.3V_Normal

C406 10uF 16V

R418

10

R410 100K

L405

4.7uH

R405

4.7K

OPT

R409

10K

C408 10uF 10V

+3.3V_Normal

R416 100K

OPT

AVDD5V_MHL

+5V_Normal

USB1_OCD

C412 22uF 16V

+5V_USB

10uF

C405

R407

10K

R403

4.7K

OPT

5V_HDMI_4

USB1_CTL

+12V

/MHL_OCP_DET

C409

0.047uF 25V

L409

BLM18PG121SN1D

+3.3V_Normal

L411

CB2012PK501T

10uF

C426

10V

+1.5V_DDR

10uF

C431

10V

R455

0

C410 10uF

10V

ZD403

2.5V

ZD401

2.5V

R456

0

OPT

C432

4.7uF 50V

3216

+24V_CAP

C400

1uF 10V

1005

OPT

+24V

R457

8.2K 1%

OPT

R458

0

5%

OPT

R438

4.7K

OPT

C407 10uF

10V

2012

IC401

APX803D29

1

GND

3

VCC2RESET

IC402

APX803D29

OPT

1

GND

3

VCC2RESET

C434

390pF

50V

C419

0.039uF 50V

C423

270pF

50V

C435

0.1uF 16V

C418

0.01uF

ZD404

5V

+3.5V_POWER_DET

+3.3V_Normal

/VBUS_EN

MHL_OCP_EN

R463

2.7K

MHL_SW_TR

R464 10K

MHL_SW_TR

Q408

MHL_SW_TR

E

B

C

R462 10K

MHL_SW_TR

Q407

MHL_SW_TR

E

B

C

Q409

MHL_SW_TR

E

B

C

R465

10K

MHL_SW_TR

R466 20K

R461 10K

MHL_SW_TR

R439

20K

1%

R440

47K

1%

R433

2.7K 1%

R447 22K

C403 100pF

50V

OPT

R415 15K

5%

R459

0

OPT

R408

4.7K

R449 1K 1/16W 1%

R450 200 1/16W 1%

C411 82pF 50V

C404

4700pF

50V

D401 30V

MBR230LSFT1G

L406

CB2012PK501T

+3.5V_ST

C436 10uF 10V

OPT

C437

0.1uF 16V

Q405

DMP2130L

G

D

S

R427

27K

1%

OPT

R428

5.1K 1%

OPT

IC404

AZ1117EH-ADJTRG1

ADJ/GND

OUTIN

R437

100 5%

OPT

R454-*1 300

5%

PD_+3.5V

IC403

TPS5432DDAR

3

PH

2

VIN

4

GND

1

BOOT

5

VSENSE

6

COMP

7

EN

8

SS

9

[EP]GND

TPS65282REGR

IC400

1

EN

3

SS

7

FAULT2

9

SW_OUT2

10

RLIM11AGND

12

SW_OUT1

13

SW_IN_1

14

SW_IN_2

15

FB

16

LX_1

17

LX_2

18

BST

19

PGND_120PGND_221VIN_122VIN_223PGOOD24V7V

5

EN_SW2

8

FAULT1

6

EN_SW1

4

ROSC

2

COMP

25

[EP]GND

C433

4.7uF 16V

+12V_CAP

3216

MHL_5V_EN

R421

18K

1%

R422

3.3K 1%

P401

SMAW200-H18S5

14

12V

9

24V

4

PDIM#1

18

GND

13

12V

8

PDMI#2

3

3.5V

17

GND

12

GND

7

GND

2

DRV ON

16

NC

11

GND

6

3.5V

1

PWR ON

15

12V

10

24V

5

3.5V

19

.

R446 12K

R453

0

R467 1K

OPT

PANEL_VCC

+1.10V_VDDC

R1

+3.3V_Normal

+1.5V_DDR

Vout=0.808*(1+R1/R2)

Power_DET

R2

FROM LIPS or POWER B/D

L14 POWER BLOCK (POWER DETECT 2)

R1 R2

+5V_Normal & +5V_USB with OCP

R2

R1

1.3A

4A

Vout=1.25*(1+R2/R1)+Iadj*R2

Vout=0.8*(1+R1/R2)

3A

(Active High)

(Active Low)

Ready - Dual Power Det

R432, R454-*1, R438

Now is

R457, R454

Detect Valtage

O R430, R431, R454

Use Circuit Designator

Power Detect +3.5V

Power Detect +12V

Power Detect +24V

Power Detect activity

* Notice

- Applying all inch models for LCD L14

- Dual Power Det is used for detecting two kinds of voltage

LGE Internal Use Only

USB D OWN STREA M

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

13/04/30

USB_S1

7

L14_M1A

JK700

3AU04 S-305-ZC- (LG)

1234

5

D700 RCLAMP0502BA

OPT

SIDE_USB1_DM

SIDE_USB1_DP

C700 22uF 10V

ZD700

5V OPT

SD05

C701 5pF 50V

OPT

C702 5pF 50V

OPT

C703 22uF 10V USB_HDD_CAP

+5V_USB

USB (SIDE)

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

2013/08/15

HDMI_R1_S1 8

L14_M1A

VA804

ESD_HDMI1

R803

1K

D802

MMBD6100

A2CA1

HDMI_ARC

VA805

ESD_HDMI2

D1+_HDMI2

CEC_REMOTE_S7

+3.5V_ST

VA800

ESD_HDMI1_VARISTOR

VA808

ESD_HDMI2

R809

10K

D2-_HDMI2

VA802

ESD_HDMI1

R807

2.7K

D801

MMBD6100

A2CA1

CK-_HDMI4

CK-_HDMI2

R804 100

VA801 ESD_HDMI1_VARISTOR

R816 100

HDMI-2

R810 100

DDC_SCL_2

R812

1.8K

HDMI-2

DDC_SCL_2

JK800

EAG59023302

14

13

5

D1_GND

20

SHIELD

12

11

2

D2_GND

19

18

10

CK+

4

D1+

1

D2+

17

9

D0-

8

D0_GND

3

D2-

16

7

D0+

6

D1-

15

D0+_HDMI2

R811 100

VA803

ESD_HDMI1

DDC_SDA_2

5V_HDMI_2

R800

2.7K

HPD4

5V_HDMI_4

CK+_HDMI4

D800

MMBD6100

A2CA1

VA809

ESD_HDMI2

VA800-*1 1uF 10V

ESD_HDMI1_CAP

+5V_Normal

R805

3.3K

DDC_SCL_4

VA801-*1 1uF 10V

ESD_HDMI1_CAP

R814

33

HDMI-2

D1-_HDMI4

DDC_SDA_4

5V_DET_HDMI_4

5V_HDMI_4

D1-_HDMI2

HDMI_CEC

CK+_HDMI2

R806

2.7K

R817 300K

HDMI-2

5V_DET_HDMI_2

DDC_SDA_4

+5V_Normal

DDC_SCL_4

HPD2

HDMI_CEC

Q800

MMBT3904(NXP)

E

B

C

R801

2.7K

D0-_HDMI2

VA811

ESD_HDMI2

D0-_HDMI4

MHL_CD_SENSE

5V_HDMI_2

R813

3.3K HDMI-2

VA810

ESD_HDMI2

D2+_HDMI4

VA807

OPT

5.6V

DDC_SDA_2

D1+_HDMI4

R815 100

HDMI-2

C800

0.047uF 25V

HDMI-2

D2-_HDMI4

R802

1.8K

D2+_HDMI2

R808

10K

HDMI_CEC

D0+_HDMI4

VA806

ESD_HDMI2

JK801

EAG62611204

HDMI-2

14

NC

13

CE_REMOTE

5

D1_GND

20

GND

12

CK-

11

CK_GND

2

D2_GND

19

HP_DET

18

5V

10

CK+

4

D1+

1

D2+

17

GND

9

D0-

8

D0_GND

3

D2-

16

DDC_DATA

7

D0+

6

D1-

15

DDC_CLK

D803-*2

RCLAMP0524PA

ESD_HDMI1_SEMTECH

1

8

2

7

3

645

9

10

D804-*2

RCLAMP0524PA

ESD_HDMI1_SEMTECH

1

8

2

7

3

645

9

10

D806-*2

RCLAMP0524PA

ESD_HDMI2_SEMTECH

1

8

2

7

3

645

9

10

D805-*2

RCLAMP0524PA

ESD_HDMI2_SEMTECH

1

8

2

7

3

645

9

10

JK801-*1

DAADR019A

HDMI-2_EMI_FOOSUNG

14

RESERVED

13

CEC

5

TMDS_DATA1_SHIELD

20

BODY_SHIELD

12

TMDS_CLK-

11

TMDS_CLK_SHIELD

2

TMDS_DATA2_SHIELD

19

HOT_PLUG_DETECT

18

VDD[+5V]

10

TMDS_CLK+

4

TMDS_DATA1+

1

TMDS_DATA2+

17

DDC/CEC_GND

9

TMDS_DATA0-

8

TMDS_DATA0_SHIELD

3

TMDS_DATA2-

16

SDA

7

TMDS_DATA0+

6

TMDS_DATA1-

15

SCL

D803

IP4294CZ10-TBR

ESD_HDMI1_IP4294

1

8

2

7

3

6

4 5

9

10

D803-*1

IP4283CZ10-TBA

ESD_HDMI1_IP4283

3

GND_1

2

TMDS_CH1+

4

TMDS_CH2-

1

TMDS_CH1-

5

TMDS_CH2+6NC_1

7

NC_2

8

GND_2

9

NC_3

10

NC_4

D804-*1

IP4283CZ10-TBA

ESD_HDMI1_IP4283

3

GND_1

2

TMDS_CH1+

4

TMDS_CH2-

1

TMDS_CH1-

5

TMDS_CH2+6NC_1

7

NC_2

8

GND_2

9

NC_3

10

NC_4

D805-*1

IP4283CZ10-TBA

ESD_HDMI2_IP4283

3

GND_1

2

TMDS_CH1+

4

TMDS_CH2-

1

TMDS_CH1-

5

TMDS_CH2+6NC_1

7

NC_2

8

GND_2

9

NC_3

10

NC_4

D806-*1

IP4283CZ10-TBA

ESD_HDMI2_IP4283

3

GND_1

2

TMDS_CH1+

4

TMDS_CH2-

1

TMDS_CH1-

5

TMDS_CH2+6NC_1

7

NC_2

8

GND_2

9

NC_3

10

NC_4

D804

IP4294CZ10-TBR

ESD_HDMI1_IP4294

1

8

2

7

3

6

4 5

9

10

D805

IP4294CZ10-TBR

ESD_HDMI2_IP4294

1

8

2

7

3

6

4 5

9

10

D806

IP4294CZ10-TBR

ESD_HDMI2_IP4294

1

8

2

7

3

6

4 5

9

10

HDMI (REAR 1 / SIDE 1 MHL)

HDMI_2 MHL

HDMI_1

CEC

MHL Spec

LGE Internal Use Only

Fiber Optic

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

SPDIF

2013/10/29

10

NC5_L14

+3.3V_Normal

SPDIF_OUT

JK1001

JST1223-001

SPDIF_OPTIC

1

GND

2

VCC

3

VINPUT

4

FIX_POLE

C1001 1uF 10V

OPT

C1002 47pF 50V

SPDIF_CAP_47pF

C1002-*1 18pF 50V

SPDIF_CAP_18pF

SPDIF OPTIC JACK

5.15 Mstar Circuit Application

SPDIF

ESD Ready

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LVDS_NON_EU

2013/05/22

11

L14_S7LR(M1A)

RXB0-

RXA0+

C1101

0.1uF 16V

MO_HD

C1100

0.1uF 16V

MO_FHD

RXBCK-

RXA1-

RXB4-

+3.3V_Normal

RXB1+

RXBCK+

PANEL_VCC

RXB3+

RXA3-

RXB4+

RXA4-

RXA4+

RXA2+

RXB2-

RXA1+

RXA2-

RXB1-

R1109

3.3K

OPT

RXA3+

RXA0-

PANEL_VCC

RXACK-

RXB2+

R1110 10K

OPT

RXB3-

RXB0+

P1100

FI-RE51S-HF-J-R1500

MO_FHD

1

.

2

.

3

.

4

.

5

.

6

.

7

.

8

.

9

.

10

.

11

.

12

RXA0-

13

RXA0+

14

RXA1-

15

RXA1+

16

RXA2-

17

RXA2+

18

.

19

RXACK-

20

RXACK+

21

.

22

RXA3-

23

RXA3+

24

RXA4-

25

RXA4+

26

.

27

.

28

RXB0-

29

RXB0+

30

RXB1-

31

RXB1+

32

RXB2-

33

RXB2+

34

.

35

RXBCK-

36

RXBCK-

37

.

38

RXB3-

39

RXB3+

40

RXB4-

41

RXB4+

42

.

43

.

44

.

45

.

46

.

47

.

48

.

49

.

50

.

51

.

52

.

RXACK+

R1100 0

MO_FHD

R1101 0

MO_FHD

R1102 0

MO_FHD

R1104 10K

OPT

R1103

3.3K

OPT

+3.3V_Normal

L1101

UBW2012-121F

120OHM

MO_HD

L1100

UBW2012-121F

120OHM

MO_FHD

RXA3+

RXA3-

RXACK+

RXACK-

RXA2-

RXA2+

RXA1-

RXA1+

RXA0-

RXA0+

VCOM_SCL

VCOM_SDA

VCOM_SCL

VCOM_SDA

R1115 2K

VCOM_I2C_PULL_UP

VCOM_SCL

VCOM_SDA

R1114

2K

VCOM_I2C_PULL_UP

R1105

0

VCOM_I2C

URSA/VCOM_SDA

URSA/VCOM_SCL

R1106

0

VCOM_I2C

+3.3V_Normal

URSA/VCOM_SDA

URSA/VCOM_SCL

P1101

10031HR-30

MO_HD

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

RXB1-

RXB0-

RXA4+

RXA1-

Pol-change

RXB4+

RXACK+

RXBCK-

RXA0+

RXA2+

LVDS (NON EU)

RXA2+

RXBCK-

RXB4-

RXA3+

RXA1+

RXB2+

RXB3-

RXA3-

RXBCK-

RXACK-

RXA2+

RXA1-

RXB1-

RXB3-

RXA3+

RXA2-

RXA0+

RXA4+

Shift

RXBCK+

RXB2-

RXA4+

[51Pin LVDS Connector] (For FHD 60Hz)

RXACK+

RXA3-

RXACK-

RXB3+

RXA3+

RXA1-

RXB0-

RXA0-

RXACK+

RXB3+

RXA4-

RXB3+

RXA4+

RXA2-

RXA2+

RXA1+

RXB2-

Pol-change

RXB4+

RXB1-

RXA4-

RXACK+

RXB3-

RXB0+

RXB3+

RXBCK+

RXB4-

RXA0+

RXA2+

RXB0+

RXB1+

RXA3-

RXA2-

RXBCK+

RXB4-

RXA0+

RXA4+

RXA2+

RXB3-

RXA0-

RXB0-

RXA4-

RXACK-

RXB0-

RXA4+

RXB2+

RXA1-

RXB2+

RXACK-

RXA3-

RXA1+

RXA3-

RXA1+

RXB3+

RXB3-

RXA3-

RXB1-

RXB4+

FOR FHD REVERSE(10bit)

RXB0+

RXB3-

RXA3+

RXA0+

RXA2- RXACK-

RXB1-

RXA3+

RXB2- RXBCK-

RXBCK+

RXA1+

RXA0-

RXA3+

RXA0-

RXB2+

RXB0-

RXA0-

RXB2-

RXACK-

MIRROR

RXB4-

RXA0-

RXB2+

RXA4+

RXB4-

RXA1+

RXB3+

RXB0+

RXB1+

RXA1-

RXA0-

RXA4-

RXB2-

Change in S7LR

RXA4-

RXB2+

MIRROR

RXB1-

RXA3+

RXA1-

RXACK+

RXB3+

RXB0+

RXB4-

RXACK+

RXB1+

RXACK-

RXA4-

RXA1-

RXA2-

RXA0+

RXB0-

RXB1+

RXB4+

RXB2+

RXBCK-

RXB0-

FOR FHD REVERSE(8bit)

RXBCK-

RXBCK+

RXB4+

RXB0+

RXB2-

RXA1+

RXBCK-

RXA2-

RXB1+

RXB1-

RXA4-

RXB4+

[30Pin LVDS Connector] (For HD 60Hz_Normal)

Change in S7LR

RXB1+

RXB3-

RXA2+

RXA3-

RXA2-

RXB2-

LVDS_SEL

RXBCK+

RXB4-

RXB0+

RXA0+

RXB4+

RXBCK+

RXACK+

EU pin assign is different from NON EU. Because of position of HD wafer.

LVDS_SEL

V-COM I2C

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

1_DDR

2013/05/20

12

NC5_S7LR(M1A)

A-MWEB

A-MA7

A-MDQL5

A-MBA2

A-MCASB

A-MA8

A-MA12

R1208

56 1%

DDR_EXT

A-MODT

A-MA2

A-MDQU7

A-MDQL0

A-MDQL2

C12010.1uF

DDR_EXT

A-MA14

C1202 1000pF

DDR_EXT

A-MDQSLB

A-MA4

R12011K1%

DDR_EXT

A-MVREFDQ

A-MRESETB

A-MCKB

A-MDQL3

A-MDMU

A-MVREFCA

R1202 1K1%

DDR_EXT

A-MDQL4

A-MBA1

R1205 1K 1%

DDR_EXT

A-MDQU2

R1203

240 1%

DDR_EXT

A-MDQSU

R1206 10K

DDR_EXT

A-MBA0

A-MA5

A-MDQU1

A-MDQSL

A-MA9

R1207

56 1%

DDR_EXT

C1214

1000pF

DDR_EXT

A-MCKE

A-MVREFDQ

A-MDML

A-MA10

A-MDQU0

A-MA13

A-MDQU3

A-MA11

A-MDQU6

A-MDQSUB

C12130.1uF

DDR_EXT

A-MRASB

A-MVREFCA

A-MDQU4 A-MDQU5

A-MDQL7

A-MA0

A-MDQL6

A-MA3

A-MDQL1

A-MA1

A-MA6

A-MCK

R1204 1K 1%

DDR_EXT

+1.5V_DDR

C1217

0.1uF

OPT

C1210 0.1uF

DDR_EXT

C1206 0.1uF

DDR_EXT

C1211 0.1uF

DDR_EXT

C1207 0.1uF

DDR_EXT

C1208 0.1uF

DDR_EXT

C1204 0.1uF

DDR_EXT

C1212 0.1uF

DDR_EXT

C1209 0.1uF

DDR_EXT

C1205 0.1uF

DDR_EXT

C1215

0.01uF 50V

DDR_EXT

C1218

0.1uF

OPT

C1224

0.1uF

OPT

H5TQ2G63DFR-PBC

IC1201-*2

DDR_1600_2G_HYNIX_OLD

EAN61829203

A0

N3

A1

P7

A2

P3

A3

N2

A4

P8

A5

P2

A6

R8

A7

R2

A8

T8

A9

R3

A10/AP

L7

A11

R7

A12/BC

N7

A13

T3

NC_5

M7

BA0

M2

BA1

N8

BA2

M3

CK

J7

CK

K7

CKE

K9

CS

L2

ODT

K1

RAS

J3

CAS

K3

WE

L3

RESET

T2

DQSL

F3

DQSL

G3

DQSU

C7

DQSU

B7

DML

E7

DMU

D3

DQL0

E3

DQL1

F7

DQL2

F2

DQL3

F8

DQL4

H3

DQL5

H8

DQL6

G2

DQL7

H7

DQU0

D7

DQU1

C3

DQU2

C8

DQU3

C2

DQU4

A7

DQU5

A2

DQU6

B8

DQU7

A3

VREFCA

M8

VREFDQ

H1

ZQ

L8

VDD_1

B2

VDD_2

D9

VDD_3

G7

VDD_4

K2

VDD_5

K8

VDD_6

N1

VDD_7

N9

VDD_8

R1

VDD_9

R9

VDDQ_1

A1

VDDQ_2

A8

VDDQ_3

C1

VDDQ_4

C9

VDDQ_5

D2

VDDQ_6

E9

VDDQ_7

F1

VDDQ_8

H2

VDDQ_9

H9

NC_1

J1

NC_2

J9

NC_3

L1

NC_4

L9

NC_6

T7

VSS_1

A9

VSS_2

B3

VSS_3

E1

VSS_4

G8

VSS_5

J2

VSS_6

J8

VSS_7

M1

VSS_8

M9

VSS_9

P1

VSS_10

P9

VSS_11

T1

VSS_12

T9

VSSQ_1

B1

VSSQ_2

B9

VSSQ_3

D1

VSSQ_4

D8

VSSQ_5

E2

VSSQ_6

E8

VSSQ_7

F9

VSSQ_8

G1

VSSQ_9

G9

C1216

10uF10V

OPT

C1203 10uF

10V

DDR_EXT

C1219

1uF

OPT

C1220

1uF

OPT

C1221

1uF

OPT

C1222

1uF

OPT

C1223

1uF

OPT

+1.5V_DDR

+1.5V_DDR+1.5V_DDR

A-MA13

A-MA14

A-MA7

A-MA10

A-MA1

A-MA8

A-MA3

A-MA0

A-MA4

A-MA6

A-MA11

A-MA9

A-MA5

A-MA2

A-MA12

A-MBA0 A-MBA1 A-MBA2

A-MCKE

A-MCK

A-MCKB

A-MCASB

A-MWEB

A-MRASB

A-MODT

A-MRESETB

A-MDMU

A-MDML

A-MDQSU

A-MDQSUB

A-MDQSL

A-MDQSLB

A-MDQL4

A-MDQL0

A-MDQL3

A-MDQL7

A-MDQL5

A-MDQL2

A-MDQL6

A-MDQL1

A-MDQU1

A-MDQU3

A-MDQU0

A-MDQU4 A-MDQU5

A-MDQU2

A-MDQU6 A-MDQU7

R1209

240 1%

A/B_DDR3_CS

H5TQ1G63EFR-PBC

IC1201

DDR_1600_1G_HYNIX

EAN61829003

A0

N3

A1

P7

A2

P3

A3

N2

A4

P8

A5

P2

A6

R8

A7

R2

A8

T8

A9

R3

A10/AP

L7

A11

R7

A12/BC

N7

NC_7

T3

NC_5

M7

BA0

M2

BA1

N8

BA2

M3

CK

J7

CK

K7

CKE

K9

CS

L2

ODT

K1

RAS

J3

CAS

K3

WE

L3

RESET

T2

DQSL

F3

DQSL

G3

DQSU

C7

DQSU

B7

DML

E7

DMU

D3

DQL0

E3

DQL1

F7

DQL2

F2

DQL3

F8

DQL4

H3

DQL5

H8

DQL6

G2

DQL7

H7

DQU0

D7

DQU1

C3

DQU2

C8

DQU3

C2

DQU4

A7

DQU5

A2

DQU6

B8

DQU7

A3

VREFCA

M8

VREFDQ

H1

ZQ

L8

VDD_1

B2

VDD_2

D9

VDD_3

G7

VDD_4

K2

VDD_5

K8

VDD_6

N1

VDD_7

N9

VDD_8

R1

VDD_9

R9

VDDQ_1

A1

VDDQ_2

A8

VDDQ_3

C1

VDDQ_4

C9

VDDQ_5

D2

VDDQ_6

E9

VDDQ_7

F1

VDDQ_8

H2

VDDQ_9

H9

NC_1

J1

NC_2

J9

NC_3

L1

NC_4

L9

NC_6

T7

VSS_1

A9

VSS_2

B3

VSS_3

E1

VSS_4

G8

VSS_5

J2

VSS_6

J8

VSS_7

M1

VSS_8

M9

VSS_9

P1

VSS_10

P9

VSS_11

T1

VSS_12

T9

VSSQ_1

B1

VSSQ_2

B9

VSSQ_3

D1

VSSQ_4

D8

VSSQ_5

E2

VSSQ_6

E8

VSSQ_7

F9

VSSQ_8

G1

VSSQ_9

G9

IC101

LGE2132(M1A_256M)

M1A_256M

B_DDR3_A[0]

E11

B_DDR3_A[1]

F12

B_DDR3_A[2]

D10

B_DDR3_A[3]

B10

B_DDR3_A[4]

E15

B_DDR3_A[5]

B11

B_DDR3_A[6]

F14

B_DDR3_A[7]

C11

B_DDR3_A[8]

D14

B_DDR3_A[9]

A12

B_DDR3_A[10]

F16

B_DDR3_A[11]

D13

B_DDR3_A[12]

D15

B_DDR3_A[13]

C12

B_DDR3_A[14]

E13

B_DDR3_BA[0]

A9

B_DDR3_BA[1]

D16

B_DDR3_BA[2]

A10

B_DDR3_MCLK

C13

B_DDR3_MCLKZ

B13

B_DDR3_MCLKE

E17

B_DDR3_ODT

B8

B_DDR3_RASZ

C8

B_DDR3_CASZ

B9

B_DDR3_WEZ

D11

B_RESET

F10

B_DDR3_CS0

D12

B_DDR3_DQSL

A19

B_DDR3_DQSU

B18

B_DDR3_DQML

C16

B_DDR3_DQMU

D21

B_DDR3_DQSBL

C18

B_DDR3_DQSBU

C17

B_DDR3_DQL[0]

A20

B_DDR3_DQL[1]

A16

B_DDR3_DQL[2]

C19

B_DDR3_DQL[3]

C15

B_DDR3_DQL[4]

C20

B_DDR3_DQL[5]

C14

B_DDR3_DQL[6]

B21

B_DDR3_DQL[7]

B15

B_DDR3_DQU[0]

F18

B_DDR3_DQU[1]

D19

B_DDR3_DQU[2]

D17

B_DDR3_DQU[3]

E21

B_DDR3_DQU[4]

E19

B_DDR3_DQU[5]

D20

B_DDR3_DQU[6]

D18

B_DDR3_DQU[7]

F20

ZQ

E9

IC101-*1

LGE2131(M1A_128M)

M1A_128M

B_DDR3_A[0]

E11

B_DDR3_A[1]

F12

B_DDR3_A[2]

D10

B_DDR3_A[3]

B10

B_DDR3_A[4]

E15

B_DDR3_A[5]

B11

B_DDR3_A[6]

F14

B_DDR3_A[7]

C11

B_DDR3_A[8]

D14

B_DDR3_A[9]

A12

B_DDR3_A[10]

F16

B_DDR3_A[11]

D13

B_DDR3_A[12]

D15

B_DDR3_A[13]

C12

B_DDR3_A[14]

E13

B_DDR3_BA[0]

A9

B_DDR3_BA[1]

D16

B_DDR3_BA[2]

A10

B_DDR3_MCLK

C13

B_DDR3_MCLKZ

B13

B_DDR3_MCLKE

E17

B_DDR3_ODT

B8

B_DDR3_RASZ

C8

B_DDR3_CASZ

B9

B_DDR3_WEZ

D11

B_RESET

F10

B_DDR3_CS0

D12

B_DDR3_DQSL

A19

B_DDR3_DQSU

B18

B_DDR3_DQML

C16

B_DDR3_DQMU

D21

B_DDR3_DQSBL

C18

B_DDR3_DQSBU

C17

B_DDR3_DQL[0]

A20

B_DDR3_DQL[1]

A16

B_DDR3_DQL[2]

C19

B_DDR3_DQL[3]

C15

B_DDR3_DQL[4]

C20

B_DDR3_DQL[5]

C14

B_DDR3_DQL[6]

B21

B_DDR3_DQL[7]

B15

B_DDR3_DQU[0]

F18

B_DDR3_DQU[1]

D19

B_DDR3_DQU[2]

D17

B_DDR3_DQU[3]

E21

B_DDR3_DQU[4]

E19

B_DDR3_DQU[5]

D20

B_DDR3_DQU[6]

D18

B_DDR3_DQU[7]

F20

ZQ

E9

H5TQ2G63FFR-PBC

IC1201-*3

DDR_1600_2G_HYNIX_NEW

EAN61829204

A0

N3

A1

P7

A2

P3

A3

N2

A4

P8

A5

P2

A6

R8

A7

R2

A8

T8

A9

R3

A10/AP

L7

A11

R7

A12/BC

N7

A13

T3

NC_5

M7

BA0

M2

BA1

N8

BA2

M3

CK

J7

CK

K7

CKE

K9

CS

L2

ODT

K1

RAS

J3

CAS

K3

WE

L3

RESET

T2

DQSL

F3

DQSL

G3

DQSU

C7

DQSU

B7

DML

E7

DMU

D3

DQL0

E3

DQL1

F7

DQL2

F2

DQL3

F8

DQL4

H3

DQL5

H8

DQL6

G2

DQL7

H7

DQU0

D7

DQU1

C3

DQU2

C8

DQU3

C2

DQU4

A7

DQU5

A2

DQU6

B8

DQU7

A3

VREFCA

M8

VREFDQ

H1

ZQ

L8

VDD_1

B2

VDD_2

D9

VDD_3

G7

VDD_4

K2

VDD_5

K8

VDD_6

N1

VDD_7

N9

VDD_8

R1

VDD_9

R9

VDDQ_1

A1

VDDQ_2

A8

VDDQ_3

C1

VDDQ_4

C9

VDDQ_5

D2

VDDQ_6

E9

VDDQ_7

F1

VDDQ_8

H2

VDDQ_9

H9

NC_1

J1

NC_2

J9

NC_3

L1

NC_4

L9

NC_6

T7

VSS_1

A9

VSS_2

B3

VSS_3

E1

VSS_4

G8

VSS_5

J2

VSS_6

J8

VSS_7

M1

VSS_8

M9

VSS_9

P1

VSS_10

P9

VSS_11

T1

VSS_12

T9

VSSQ_1

B1

VSSQ_2

B9

VSSQ_3

D1

VSSQ_4

D8

VSSQ_5

E2

VSSQ_6

E8

VSSQ_7

F9

VSSQ_8

G1

VSSQ_9

G9

K4B1G1646G-BCK0

IC1201-*1

DDR_1600_1G_SS

EAN61836301

A0

N3

A1

P7

A2

P3

A3

N2

A4

P8

A5

P2

A6

R8

A7

R2

A8

T8

A9

R3

A10/AP

L7

A11

R7

A12/BC

N7

A13

T3

NC_5

M7

BA0

M2

BA1

N8

BA2

M3

CK

J7

CK

K7

CKE

K9

CS

L2

ODT

K1

RAS

J3

CAS

K3

WE

L3

RESET

T2

DQSL

F3

DQSL

G3

DQSU

C7

DQSU

B7

DML

E7

DMU

D3

DQL0

E3

DQL1

F7

DQL2

F2

DQL3

F8

DQL4

H3

DQL5

H8

DQL6

G2

DQL7

H7

DQU0

D7

DQU1

C3

DQU2

C8

DQU3

C2

DQU4

A7

DQU5

A2

DQU6

B8

DQU7

A3

VREFCA

M8

VREFDQ

H1

ZQ

L8

VDD_1

B2

VDD_2

D9

VDD_3

G7

VDD_4

K2

VDD_5

K8

VDD_6

N1

VDD_7

N9

VDD_8

R1

VDD_9

R9

VDDQ_1

A1

VDDQ_2

A8

VDDQ_3

C1

VDDQ_4

C9

VDDQ_5

D2

VDDQ_6

E9

VDDQ_7

F1

VDDQ_8

H2

VDDQ_9

H9

NC_1

J1

NC_2

J9

NC_3

L1

NC_4

L9

NC_6

T7

VSS_1

A9

VSS_2

B3

VSS_3

E1

VSS_4

G8

VSS_5

J2

VSS_6

J8

VSS_7

M1

VSS_8

M9

VSS_9

P1

VSS_10

P9

VSS_11

T1

VSS_12

T9

VSSQ_1

B1

VSSQ_2

B9

VSSQ_3

D1

VSSQ_4

D8

VSSQ_5

E2

VSSQ_6

E8

VSSQ_7

F9

VSSQ_8

G1

VSSQ_9

G9

K4B2G1646Q-BCK0

IC1201-*4

DDR_1600_2G_SS

EAN61848803

A0

N3

A1

P7

A2

P3

A3

N2

A4

P8

A5

P2

A6

R8

A7

R2

A8

T8

A9

R3

A10/AP

L7

A11

R7

A12/BC

N7

A13

T3

NC_5

M7

BA0

M2

BA1

N8

BA2

M3

CK

J7

CK

K7

CKE

K9

CS

L2

ODT

K1

RAS

J3

CAS

K3

WE

L3

RESET

T2

DQSL

F3

DQSL

G3

DQSU

C7

DQSU

B7

DML

E7

DMU

D3

DQL0

E3

DQL1

F7

DQL2

F2

DQL3

F8

DQL4

H3

DQL5

H8

DQL6

G2

DQL7

H7

DQU0

D7

DQU1

C3

DQU2

C8

DQU3

C2

DQU4

A7

DQU5

A2

DQU6

B8

DQU7

A3

VREFCA

M8

VREFDQ

H1

ZQ

L8

VDD_1

B2

VDD_2

D9

VDD_3

G7

VDD_4

K2

VDD_5

K8

VDD_6

N1

VDD_7

N9

VDD_8

R1

VDD_9

R9

VDDQ_1

A1

VDDQ_2

A8

VDDQ_3

C1

VDDQ_4

C9

VDDQ_5

D2

VDDQ_6

E9

VDDQ_7

F1

VDDQ_8

H2

VDDQ_9

H9

NC_1

J1

NC_2

J9

NC_3

L1

NC_4

L9

NC_6

T7

VSS_1

A9

VSS_2

B3

VSS_3

E1

VSS_4

G8

VSS_5

J2

VSS_6

J8

VSS_7

M1

VSS_8

M9

VSS_9

P1

VSS_10

P9

VSS_11

T1

VSS_12

T9

VSSQ_1

B1

VSSQ_2

B9

VSSQ_3

D1

VSSQ_4

D8

VSSQ_5

E2

VSSQ_6

E8

VSSQ_7

F9

VSSQ_8

G1

VSSQ_9

G9

CLose to Saturn7M IC

CLose to DDR3

Option : Ripple Check !!!

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

S_FLASH

2013/04/29

13

NC5_S7LR(M1A)

SPI_SCK

+3.5V_ST+3.5V_ST

C1300

0.1uF

R1301

4.7K

OPT

/SPI_CS

SPI_SDO

IC1300

MX25L8006EM2I-12G

SPI_FLASH_MACRONIX

3

WP#

2

SO/SIO1

4

GND

1

CS#

5

SI/SIO0

6

SCLK

7

HOLD#

8

VCC

R1302

33

R1300 10K

OPT

SPI_SDI

/FLASH_WP

IC1300-*1

W25Q80BVSSIG

SPI_FLASH_WINBOND

3

%WP[IO2]

2

DO[IO1]

4

GND

1

CS

5

DI[IO0]

6

CLK

7

HOLD[IO3]

8

VCC

+3.5V_ST

Serial Flash for SPI boot

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

+3.3V_TU

C1613 20pF 50V

OPT

C1602 22uF

6.3V

C1616

0.1uF 16V

C1605 22uF

6.3V

IF_N_MSTAR

IF_AGC_SEL

TU_SIF

FE_TS_VAL_ERR

+3.3V_TU

C1610 18pF 50V

C1601

0.1uF 16V OPT

C1615 100pF 50V

R1607 33

C1603

0.1uF 16V

TU_SDA

R1611

1.8K TU_IIC_ATSC_1.8K

R1612 82

OPT

FE_TS_DATA[0]

R1610-*1 1K TU_IIC_NON_ATSC_1K

IF_P_MSTAR

L1600

UBW2012-121F

R1609 100

C1609 18pF 50V

IF_AGC_MAIN

R1606 0

IF_NON_FILTER_KR

C1611

0.1uF 16V

TU_CVBS

R1606-*1 10

IF_FILTER_AJ

R1605-*1 10

IF_FILTER_AJ

TUNER_RESET

+3.3V_TU

R1605 0

IF_NON_FILTER_KR

C1614 20pF 50V

OPT

TU_SCL

TU_GND_A

R1608 33

RF_SWITCH_CTL

C1607

0.1uF 16V

FE_TS_SYNC

R1613 0

OPT

R1611-*1 1K TU_IIC_NON_ATSC_1K

+3.3V_Normal

FE_TS_CLK

R1610

1.8K

TU_IIC_ATSC_1.8K

TDJH-G101D

TU1601-*1

TU_AJ_T/C

47

SHIELD

6

IF[P]

7

IF[N]

8

NC_2

9

NC_3

1

B1[+3.3V]

2

NC_1

3

IF_AGC

4

SCL

5

SDA

A1

B1

TDJH-H101F

TU1601

TU_ATSC

47

SHIELD

6

IF[P]

7

IF[N]

8

NC_2

9

NC_3

1

B1[+3.3V]

2

NC_1

3

IF_AGC

4

SCL

5

SDA

A1

B1

Size change,0929

16

should be guarded by ground

Close to the tuner

FE_AGC_SPEED_CTL

close to the tuner pin, add,09029

CHANGE TO

6.3V 2012 X5R

1. should be guarded by ground

2. No via on both of them

3. Signal Width >= 12mils Signal to Signal Width = 12mils Ground Width >= 24mils

L14_M1A

CHANGE TO

6.3V 2012 X5R

GLOBAL tuner block KR & AJ

GND seperation for ASIS tuner

close to TUNER

TUNER_KR_AJ

2013/06/05

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

COMP2_Pr+

AV2_CVBS_DET

R1714 10K

R1721 12K

R1715 10K

R1719 12K AV2

R1713

1K

R1704

470K

R1700 470K AV2

VA1702

5.6V OPT

R1712

1K

COMP2_Pb+

+3.3V_Normal

COMP2_DET

R1701 470K AV2

R1705 75

R1709 10K

COMP2_R_IN

R1703 470K

VA1703

5.6V OPT

AV2_R_IN

VA1705

5.6V OPT

VA1704

5.6V AV2_LR_ZENER

C1701 1000pF 50V OPT

R1716 10K

AV2

R1710 10K

C1704 1000pF 50V OPT

R1706 75

COMP2_L_IN

R1711 1K

AV2

+3.3V_Normal

VA1700

5.6V COMP_LR_ZENER

VA1706

5.6V AV2_LR_ZENER

R1718 12K AV2

R1708 10K AV2

SC1/AV2_CVBS_IN

C1703 47pF 50V

AV2

COMP2_Y+/AV_CVBS_IN

C1702 1000pF 50V OPT

R1720 12K

AV2_L_IN

R1717 10K

AV2

VA1701

5.6V COMP_LR_ZENER

AV_CVBS_DET

C1705 1000pF 50V OPT

ZD1704 COMP_Y_ZENER_ROHM

ZD1700 COMP_Pr_ZENER_ROHM

ZD1705

COMP_Y_ZENER_ROHM

ZD1707

AV2_CVBS_ZENER_ROHM

ZD1706

AV2_CVBS_ZENER_ROHM

ZD1703

COMP_Pb_ZENER_ROHM

ZD1702 COMP_Pb_ZENER_ROHM

ZD1701

COMP_Pr_ZENER_ROHM

ZD1707-*1

AV2_CVBS_ZENER_KEC

ZD1706-*1

AV2_CVBS_ZENER_KEC

ZD1703-*1

COMP_Pb_ZENER_KEC

ZD1702-*1 COMP_Pb_ZENER_KEC

ZD1701-*1

COMP_Pr_ZENER_KEC

ZD1700-*1 COMP_Pr_ZENER_KEC

ZD1705-*1

COMP_Y_ZENER_KEC

ZD1704-*1 COMP_Y_ZENER_KEC

R1707 75

1%

1608

R1702 75

1%

AV2

1608

DTV/MNT_VOUT

R1723 75

CVBS_OUT_TEST

R1724 0

CVBS_OUT_TEST

JK1702

PPJ245N2-01

COMP_AV1_YG

5A

[GN/YL]O-SPRING

6A

[GN/YL]E-LUG

4A

[GN/YL]CONTACT

5B

[BL]O-SPRING

7C

[RD1]E-LUG-S

5C

[RD1]O-SPRING

4C

[RD1]CONTACT

5D

[WH]O-SPRING

4E

[RD2]CONTACT

5E

[RD2]O-SPRING

6E

[RD2]E-LUG

JK1702-*1

PPJ245-01

COMP_AV1_G

6A

[GN]C-SPRING

7A

[GN]E-LUG

4A

[GN]CONTACT

5B

[BL]C-SPRING

8C

[RD1]E-LUG-S

6C

[RD1]C-SPRING

4C

[RD1]CONTACT

5D

[WH]C-SPRING

4E

[RD2]CONTACT

6E

[RD2]C-SPRING

7E

[RD2]E-LUG

JK1701-*1

PPJ248-01 COMP_AV1/2_G

6D

[GN]C-SPRING

7D

[GN]E-LUG

4D

[GN]CONTACT

5E

[BL]C-SPRING

8F

[RD1]E-LUG-S

6F

[RD1]C-SPRING

4F

[RD1]CONTACT

5G

[WH1]C-SPRING

4H

[RD2]CONTACT

6H

[RD2]C-SPRING

7H

[RD2]E-LUG

7A

[YL]E-LUG

6A

[YL]C-SPRING

4A

[YL]CONTACT

5B

[WH2]C-SPRING

4C

[RD3]CONTACT

6C

[RD3]C-SPRING

7C

[RD3]E-LUG

JK1701

PPJ248-21

COMP_AV1/2_YG

5D

[YL/GN]O-SPRING

6D

[YL/GN]E-LUG

4D

[YL/GN]CONTACT

5E

[BL]O-SPRING

7F

[RD1]E-LUG-S

5F

[RD1]O-SPRING

4F

[RD1]CONTACT

5G

[WH1]O-SPRING

4H

[RD2]CONTACT

5H

[RD2]O-SPRING

6H

[RD2]E-LUG

6A

[YL]E-LUG

5A

[YL]O-SPRING

4A

[YL]CONTACT

5B

[WH2]O-SPRING

4C

[RD3]CONTACT

5C

[RD3]O-SPRING

6C

[RD3]E-LUG

2013.08.15L14_S7LR(M1A)

REAR_JACK_NON_EU

COMPONENT & AV1

17

AV2

COMPONENT & AV1(COMMON), AV2

Size Check !!!

* One Ton Color Jack - Yellow/Green

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

2013.04.29

HEAD_PHONE_EU 30

NC5_M1A

R3001

3.3K

OPT

C3000 10uF 16V

HEAD_PHONE

C3001 10uF 16V

HEAD_PHONE

JK3000

KJA-PH-0-0177

HEAD_PHONE

3DETECT

4L

5GND

1R

+3.3V_Normal

R3005 10K

HEAD_PHONE

C3003 1000pF 50V

OPT

HP_LOUT

R3004

1K

HEAD_PHONE

HP_DET

+3.5V_ST

HP_ROUT

SIDE_HP_MUTE

R3002 1K

HEAD_PHONE

C3002 1000pF 50V

OPT

R3003 1K

HEAD_PHONE

Q3002 MMBT3904(NXP) OPT

E

B

C

Q3003 MMBT3904(NXP) OPT

E

B

C

Q3005 MMBT3904(NXP) OPT

E

B

C

Q3004 MMBT3904(NXP) OPT

E

B

C

Q3001 MMBT3906(NXP)

OPT

E

B

C

Q3000

MMBT3904(NXP)

OPT

E

B

C R3000 1K

OPT

C3004

4.7uF 10V

HEAD_PHONE

L3001

HEAD_PHONE

5.6uH

L3000

HEAD_PHONE

5.6uH

C3005

4.7uF 10V

HEAD_PHONE

Headphone *Option : HEAD_PHONE_EU

Close to the Main IC

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

RS232C_MSTAR_DEBUG_4P

2013/04/30

40

L14_S7LR(M1A)

PM_RXD

+3.5V_ST

R4001 100

R4000 100

P4000

12507WS-04L

RS232C_DEBUG_4P

1

VCC

2

PM_RXD

3

GND

4

RM_TXD

5

GND

PM_TXD

JP_GND3

RGB_DDC_SCL

JP_GND4

RGB_DDC_SDA

JP_GND1

JP_GND2

P4001

12505WS-04A00

MSTAR_DEBUG_4P

1

2

3

4

5

RS-232C 4PIN & MSTAR DEBUG 4PIN

RS-232C 4PIN

MSTAR DEBUG 4PIN

LGE Internal Use Only