LG 50PG6300 Schematic

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Internal Use Only

PLASMA TV

SERVICE MANUAL

CHASSIS : PD85A

MODEL : 50PG6300 50PG6300-ZA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ..........................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ................................................................15

TROUBLE SHOOTING .............................................................................17

BLOCK DIAGRAM....................................................................................35

EXPLODED VIEW ....................................................................................36

PRINTED CIRCUIT DIAGRAM .................................................................39

Only for training and service purposes

- 2 -

LGE Internal Use Only

- 3 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

AC Volt-meter

Good Earth Ground such as WATER PIPE,

To Instrument's exposed METALLIC PARTS

0.15uF

CONDUIT etc.

1.5 Kohm/10W

LGE Internal Use Only

- 4 -

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

LGE Internal Use Only

- 5 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. Application Range.

This spec sheet is applied to the 42"/50" PDP TV used PG6300 chassis.

2. Specification

Each part is tested as below without special appointment

2.1 Temperature : 25±5°C(77±9°F), CST : 40±5°C

2.2 Relative Humidity : 65±10%

2.3 Power Voltage : Standard input voltage (100~240V@ 50/60Hz)

• Standard Voltage of each products is marked by models.

2.4 Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM.

2.5 The receiver must be operated for about 5 minutes prior to the adjustment.

3. Test method

3.1 Performance : LGE TV test method followed.

3.2 Demanded other specification Safety : CE, IEC specification / EMC : CE, IEC

4. General Specification

No. Item Specification Remark

1. Video input applicable system PAL -B/G

1) PAL- B/G

2. Receivable Broadcasting System

3. RF Input Channel

4. Input Voltage AC 100 ~ 240 V / 50Hz, 60Hz

5. Market EU ( Finland )

6. Picture Size

7. Tuning System

8. Operating Environment

9. Storage Environment

10. Display PDP Module LGE ( 42”, 50” )

2) DVB-T

3) DVB-C VHF : E2 ~ E12 UHF : E21 ~ E69 CATV : S1 ~ S20 HYPER : S21~ S41

42 inch 50 inch Analog : FVS 99 program DVB-T : 200 ( TV/Radio Channel ) DVB-C : 200 ( TV/Radio Channel )

1) Temp : 5 ~ 35 deg

2) Humidity : 10 ~ 90 %

3) Temp : -20 ~ 50 deg

4) Humidity : 10 ~ 90 %

EU(Finland Market)

Analog TV Receiving Range

42PG6300 50PG6300

5. MODEL General Specification

No Item Specification Remark

1. Market EU ( Finland Only )

2. Broadcasting system PAL BG, DVB-T, DVB-C Analog : Upper Heterodyne

3. Receiving system

4. Scart Jack (2EA) PAL, Full SCART: 1, Half SCART: 1

5. Video Input RCA(1EA) PAL,

6. S-Video Input (1EA) PAL,

7. Component Input(1EA) Y/Cb/Cr, Y/ Pb/Pr

8. RGB PC Input(1EA) RGB-PC Analog (D-SUB 15PIN)

9. HDMI Input(3EA)

10. Audio Input(3EA) RGB/DVI Audio, Component, AV L/R Input

11. SPDIF out(1EA) SPDIF out

12. RS-232(1EA) D-SUB 9 Pin Service Only

DVB-T : COFDM DVB-C : QAM

HDMI1(DTV)/DVI, HDMI2(DTV), HDMI3(DTV)

PC (HDMI version 1.2), Support HDCP

6. PDP Module General Specification

6.1 42" PDP Module

NO. Item Specification Unit Remark

1. Display Screen Device

2. Aspect Ratio 16:9

3. PDP Module 1.PDP42G110235, RGB Closed Type, Film Filter

4. Operating Environment

5. Storage Environment

NO. Item Specification Unit Remark

1. Display Screen Device

2. Aspect Ratio 16:9

3. PDP Module PDP501G110223, RGB Closed Type, Film Filter

4. Operating Environment

5. Storage Environment

Input Voltage

6.2 50" PDP Module

Input Voltage

42 inch wide Color Display Module

1) Temp. : 0 ~ 60 deg

2) Humidity : 20 ~ 80%

1) Temp. : -20 ~ 60 deg

2) Humidity : 10 ~ 90% AC100 ~ 240V, 50/60Hz Maker LG

50 inch wide Color Display Module

1) Temp. : 0 ~ 55 deg

2) Humidity : 20 ~ 80%

1) Temp. : -20 ~ 60 deg

2) Humidity : 10 ~ 90% AC100 ~ 240V, 50/60Hz Maker LG

42PG6300

50PG6300

LGE Spec.

7. Optical Feature

7.1 42" PDP Module

- 42G1A Module, SET With 38% Glass Filter, 60Hz (This data at 50Hz is about 80% level of 60Hz data) for more details, refer to the module spec.

No.

White Peak Brightness

White average brightness 50 60 - cd/m²

Brightness uniformity -10 0 +10 %

Color

4. Coordinate

Color Coordinate

Uniformity

Contrast ratio

at dark room

Color

Temperature

Item Min. Typ. Max. Unit Remark

(*) Peak Brightness Mode

-1/100 white Window pattern (Typically 1% Window size)

360 460

cd/m

- Picture: Vivid (Medium)

-100IRE (255Gray)

- Input: HDMI-PC (1920*1080 60Hz)

*Peak Brightness Condition may

Slightly different between sets.

164 205

cd/m225/100 white Window pattern

- 100% Window White Pattern

- 100IRE(255Gray)

- Picture: Vivid(Medium )

- 85IRE(216Gray) 100% Window White Pattern

- Picture: Vivid(Medium)

White

Red

Green

Blue

0.270 0.285 0.300

0.278 0.293 0.308

0.650 0.660 0.670

0.318 0.328 0.338

0.242 0.257 0.272

0.657 0.672 0.687

0.138 0.148 0.158

0.060 0.070 0.080

-0.01 Average +0.01

- White : 85IRE(216Gray) 100% Window White Pattern

- R/G/B : 100IRE(255Gray) 100% Window White Pattern

- Picture: Vivid(Medium )

- 100% Window

- 85IRE 100% Window White Pattern

- Picture: Vivid(Medium)

-1/100 white window pattern (Peak mode)

15,000:1 30,000:1

-100IRE(255Gray)

-Picture: Vivid(Medium)

-Input: HDMI-PC (1920*1080 60Hz)

Normal 8300 9300 10300

Warm 5500 6500 7500

Cool 10000 11000 12000

- 85IRE 100% Window White Pattern

- APC : Vivid(Medium)

* Above optical characteristics are should be measured by following condition. Measured Mode

Picture Mode Vivid

Freshtone Off

7.2 50" PDP Module

- 50G1A Module, SET With 38% Glass Filter, 60Hz (This data at 50Hz is about 80% level of 60Hz data) for more details, refer to the module spec.

No.

Item Min. Typ. Max. Unit Remark

(*) Peak Brightness Mode

-1/100 white Window pattern (Typically 1% Window size)

White Peak Brightness

364 456

cd/m

- Picture: Vivid (Medium)

- Input: HDMI-PC

-100IRE (255Gray)

(1920*1080 60Hz)

*Peak Brightness Condition may

Slightly different between sets.

164 205

cd/m225/100 white Window pattern

- 100% Window White Pattern

White average brightness 50 60 - cd/m²

- 100IRE(255Gray)

- Picture: Vivid(Medium )

- 85IRE(216Gray) 100% Window

Brightness uniformity -10 0 +10 %

White Pattern

- Picture: Vivid(Medium)

- White : 85IRE(216Gray) 100% Window White Pattern

- R/G/B : 100IRE(255Gray) 100% Window White Pattern

- Picture: Vivid(Medium )

- 100% Window

- 85IRE 100% Window White Pattern

- Picture: Vivid(Medium)

Color

4. Coordinate

Color Coordinate

5. Uniformity

White

Red

Green

Blue

0.270 0.285 0.300

0.278 0.293 0.308

0.650 0.660 0.670

0.318 0.328 0.338

0.242 0.257 0.272

0.657 0.672 0.687

0.138 0.148 0.158

0.060 0.070 0.080

-0.01 Average +0.01

-1/100 white window pattern

Contrast ratio

6. at dark room

15,000:1 30,000:1

(Peak mode)

-100IRE(255Gray)

-Picture: Vivid(Medium)

-Input: HDMI-PC (1920*1080 60Hz)

Normal 8300 9300 10300 - 85IRE 100% Window White Pattern

Color

7. Temperature

Warm 5500 6500 7500

Cool 10000 11000 12000

- APC : Vivid(Medium)

* Above optical characteristics are should be measured by following condition. Measured Mode

Picture Mode Vivid

Freshtone Off

7.3 Peak & average Brightness & Contrast measure standard specification

7.3.1 White Peak brightness measure specification

1) In non-impressed condition, measu re pe ak brightness displayable as much as possible PDP module.

2) Measuring instrument: CS -1000, CA-210, CA-100+ or a sort of Color Analyzer.

(Please adjust CA-210, CA-100+ by CS-1000 before measuring.)

3) Pattern Generator : VG-828 or a sort of digital pattern generator.

(displayable Full White & 1/100 White Window pattern)

4) Measure condition

a. Test pattern : in center, 1/10(H) * 1/10(V) of Window Pattern.

(white pattern in non-impressed condition) b. SET condition: Contrast Level => 100%, Brightness Level => Suitable Level (About 35~45). c. Environment condition : Dark room in the non outside light

5) Measurement a. Do heat-run PDP module at 30minutes in normal temperature (25℃) by using full white pattern

of 15% signal level (38 gray level). b. Impress test pattern signal in 1/10(H) * 1/10(V) White Window of 100% (255Gray Level). c. Measure 3 times brightness of central white window, and mark peak brightness in max

brightness degree.

d. Measure the same condition in video signal /RGB signal.

7.3.2 Average Brightness measure specification

1) Impress 100%(255Gray Level) full white pattern at the same peak brightness measurement.

2) Measure average brightness in 9 points.

⑦ ④ ①

⑧ ⑤ ②

⑨ ⑥ ③

7.3.3 Contrast ratio measure specification

1) Test display signal : 30*30 dots White Window signal & all Black Raster signal

2) Dark room measure condition : Usin g touch type Color analyzer CA-100+(or CS-1000, CA-210) Dark room in the non outside light.

3) Bright room measure condition : In bright room of 150Lx illumination in the panel surface, locate a source of light on the above 45˚of the panel surface.

4) Measure method (from 42G1 CAS)

a. The brightness of the white peak(Lw) position is measured while the 1%-window pattern is “ON”

state. And then, it should be checked in 10 seconds after 1%-window is “ON”state. The brightness of the black(Lb) is measured any point(Min.data) of panel.

b. The brightness of dark room is less than 1 lux.

Contrast ratio = Lw / Lb If it does not use Prior measurement, use generally simple test measurement. The Correct measure specification is followed by IEC61988-2/CD, JAPAN EIAJ-2710

8. Supported Input timing

8.1 Component Video Input (Y/Pb/Pr)

No. Resolution H-freq(kHz) V-freq(Hz)

1. 720×480 15.73 59.94 SDTV, DVD 480i

2. 720×480 15.75 60 SDTV, DVD 480i

3. 720×480 31.47 59.94 SDTV 480p

4. 720X480 31.5 60 SDTV 480p

5. 720x576 15.625 50 SDTV, DVD 576i

6. 720×576 31.25 50 SDTV 576p

7. 1280×720 44.96 59.94

8. 1280×720 45 60

9. 1280×720 37.5 50

10. 1920×1080 33.75 60

11. 1920×1080 33.72 59.94

12. 1920×1080 28.125 50

Remark

HDTV 720p HDTV 720p HDTV 720p HDTV 1080i HDTV 1080i HDTV 1080i

Proposed

HDCP HDCP HDCP HDCP HDCP HDCP

8.2 PC Input (R/G/B/H/V)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

1. 720×400 31.468 70.08 28.321

2. 640×480 31.469 59.94 25.17 VESA

3. 800×600 37.879 60.31 40.00 VESA

4. 1024×768 48.363 60.00 65.00 VESA(XGA) 5 1280×768 47.776 59.87 79.5 VESA(WXGA)

6. 1360×768 47.712 60.015 85.5 VESA(WXGA)

7. 1920×1080 66.647 59.988 138.625 Reduced Blanking

8.3 HDMI Input (DTV)

No. Resolution H-freq.(kHz) V-freq.(Hz) Pixel clock(MHz) Remark Proposed

31.50

59.94 25.175 SDTV 480p 60Hz 60 25.20 SDTV 480p 60Hz

60 27.027 SDTV 480 p 60Hz

27.000

SDTV 576p 50Hz

1. 640×480

2. 640×480

3. 720×480 31.47 59.94 27.00 SDTV 480p 60Hz

4. 720×480

5. 720×576 31.25 50.00

6. 1280×720 37.50 50.00 74.176 HDTV 720p 50Hz HDCP

7. 1280×720 44.96 59.94 74.176 HDTV 720p 60Hz HDCP

8. 1280×720 45.00 60 74.250 HDTV 720p 60Hz HDCP

9. 1920×1080 28.125 50.00 74.250 HDTV 1080i 50Hz HDCP

10. 1920×1080 33.72 59.94 74.176 HDTV 1080i 60Hz HDCP

11. 1920×1080 33.75 60 74.250 HDTV 1080i 60Hz HDCP

12. 1920*1080 27.000 24.00 74.250 HDTV 1080P 24Hz HDCP

13. 1920×1080 56.25 50.00 148.500 HDTV 1080P 50Hz HDCP

14. 1920×1080 67.433 59.94 148.352 HDTV 1080P 60Hz HDCP

15. 1920×1080 67.50 60 148.500 HDTV 1080P 60Hz HDCP

31.469

8.4 HDMI Input (PC)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark Propose

1. 720×400 31.468 70.08 28.321 1.

2. 640×480 31.469 59.94 25.17 VESA 2.

3. 800×600 37.879 60.317 40.00 VESA 3.

4. 1024×768 48.363 60.00 65.00 VESA(XGA) 4. 5 1280×768 47.776 59.87 79.5 VESA(WXGA) 5

6. 1360×768 47.712 60.015 85.5 VESA(WXGA) 6.

7. 1920×1080 66.647 59.988 138.625 7.

9. Mechanical Specification

9.1 42PG6300

No. Item Content Unit Remark

Product

Dimension

Before Packing 1044.4 308.0 735.4 mm With Stand

After Packing

Product

Weight

Container

Quantity

Only SET

With BOX

Individual or

Palletizing

Type Swivel

Size (W x D x H)

Stand

Assy

Tilt Degree No Tilt

Tilt force No Tilt

Swivel Degree

Swivel Force

5. Appearance General Refer to Standard of LG(56)G4-9002

Width (W) Length (D) Height (H) mm

1104.0 370.0 775.0 28

33.8

Kg With Stand Kg

40ft(Normal) 40ft(H-CUBIC)

Indi. Wooden Indi. Wooden

128Set 192Set

697.0 308 166.4

Swivel(+/- 20degree)

Force : 1.5(+1.0kgf -0.5 kgf)

9.2 50PG6300

No. Item Content Unit Remark

Product

Dimension

Before Packing

After Packing

Product

Weight

Container

Quantity

Only SET 43.65 Kg With Stand

With BOX 50.0 Kg

Individual or

Palletizing

Type Swivel

Size (W x D x H)

Stand

Assy

Tilt Degree No Tilt

Tilt force No Tilt

Swivel Degree

Swivel Force

5. Appearance General

Width (W) Depth (D) Height (H) mm

1235.6 364.1 849.3

1314.0 444.0

987.0

mm With Stand mm

40ft(Normal) 40ft(H-CUBIC)

Indi. Wooden Indi. Wooden

90Set

764.3 364.0 170.4

Degree : +/- 20degree

Force : 2.0kgf(+1.0kgf -0.5 kgf)

Refer to Standard of LG(56)G4-9002

10. Adjustment Instruction

10.1 ATV/DTV SW Upgrade

1) Preparations for SW Upgrade : PC (for SW Upgrade through RS-232C) / RS-232C Cable

2) Unzip and install the files.

WDN 4OAK+.z i p

3) Switch to DTV mode.

4) Enter Standby mode.

5) Double-click the “WDN4OAK+” file“.

6) Click the yellow folder button to select HDF file for downloading.

7) Click “DownLoad” button to start downloading.

8) Push the Standby button to make the unit operating.

9) Check for S/W version by going to the Factory Mode, press “Menu”, “1”, “2”, “4”, 7” and “5” keys on a remote.

10.2 White Balance Calibration

1) Make sure the unit has sufficient warm-up time which is about 5 minutes.

Æ Be sure that the unit is switched to Analog TV Mode.

(PWM Dimming: Max, Analog Dimming: 1.65V)

2) Adjustment: PC Mode, 1024x768@60Hz, 75% ~ 80% Full White Pattern

3) Press “MENU, ”1” , ”2” , “4”, “7” , and “5” keys on a remote

4) Select the factory, and then press the OK bottom on remote

5) Select Color Temp, and then press the OK bottom on remote

6) Adjust the Color Temp for each mode The full dynamic range of the module when the RGB gain on the OSD is “512” In order to adjust the white balance with no saturation of the full dynamic range and the data,Fix on of the RGB gains to 512 and decrease the remaining two gains to adjust.

7) Calibration Spec

-. Cool : X(0.276±0.002), Y(0.283±0.002)Æ11,000ºK±500ºK

-. Medium : X(0.285±0.002), Y(0.293±0.002Æ9,300ºK±500ºK

-. Warm : X(0.313±0.002), Y(0.329±0.002Æ6,500ºK±500ºK

10.3 SMPS Voltage Adjustment

1) Preparations for voltage adjustment : D.M.M (Digital Multi Meter)/Adjustment Driver

2) Va adjustment. (42”,50”) Connect + terminal of D. M.M. to Va pin of P811, connect - terminal to GND pin of P811.

After turning VR901,voltage of D.M.M adjustment as same as Va voltage which on label of panel

right/top (deviation; ±0.5V)

3) Vs adjustment. (42”,50”) Connect + terminal of D. M..M. to Vs pin of P811, connect – terminal to GND pin of P811. After turning VR951, voltage of D.M.M adjustment as same as Vs voltage which on label of panel right/top ( deviation ; ±0.5V)

TROUBLE SHOOTING GUIDE

1. No Power

- Check the condition of the SMPS input and power cable connection.

- Check the system clock (16MHZ) and the reset terminal of CPU.

No Power

(LED indicator off)

Check 5VSTB of L570

Pass

Check the signal(Stby_en) of Q569

Pass

Check the signal(LED_B,R) of JP566

Pass

Check IR & LED B/D Assy Change IR & LED B/D Assy

Pass

Fail

Change SMPS B/D

Re-soldering or Change the

defect part(U1, Y1,Q569)

Re-soldering or Change the

defect part(U1, Y1)

Check PANEL_ERROR

Pass

Check JP566, JP567 Connection

Fail

Check Panel B/D or SMPS

2. No Display

- Check the system clock (27MHZ, Y171) and the Voltage of VCTP_P(U81)

Repeat A Process

Pass

Check +5V of U566

Pass

Check +3.3V, +2.5V,+1.5V

Pass

Check +1.25V,VDD_CORE,VDD_H

Pass

Check the input/Output of U81

Fail

Change U566

Re-soldering or Change the

defect part(U37,U33,U31)

Re-soldering or Change the

defect part(U35,U34,U36)

Re-soldering or Change the defect

part(U81,Y171)

Pass

Check Panel Votage (Vs & Va )

Pass

Check LVDS Cable or PDP Module

Pass

Check input source cable or jack

Fail

Adjust Panel Votage (Vs & Va )

Change LVDS Cable or PDP

Module

3. No Display – Component Input

- Check the condition of the Component cable connection.

- Check the system clock (27MHZ,Y171) and the Voltage of VCTP_P(U81)

Repeat A, B Process

Pass

Check the signal(Y,Pb,Pr)

input/output of U351

Pass

Check the signal input/output of U81

Pass

Check input source cable or jack(JP351)

Fail

Re-soldering or Change the defect

part(U351)

Re-soldering or Change the

defect part(U81)

4. No Display – PC Input

- Check the condition of the PC cable connection.

- Check the system clock (27MHZ,Y171) and the Voltage of VCTP_P(U81)

Repeat A, B Process

Pass

Check the signal(R,G,B)

input/output of U351

Pass

Check the signal(H/Vsync)

input/output of U376

Pass

Check the signal input/output of U81

Pass

Check input source cable or jack(JP376)

Fail

Re-soldering or Change the

defect part(U351)

Re-soldering or Change the

defect part(U376)

Re-soldering or Change the

defect part(U81)

5. No Display – HDMI 1/2/3 Input

- Check the condition of the HDMI cable connection.

- Check the system clock (27MHZ,Y171) and the Voltage of VCTP_P(U81)

- Check the EDID data of EEPROM(U311,U326,U327)

Repeat A, B Process

Pass

Check the signal

input/output of U281

Pass

Check the signal input/output of U81

Pass

Check input source cable or

jack(JP311,JP326,JP327)

Fail

Re-soldering or Change the

defect part(U281)

Re-soldering or Change the

defect part(U81)

6. No Display – AV3(CVBS/S-VIDEO) Input

- Check the condition of the RCA/S-VIDEO cable conn ection.

- Check the system clock (27MHZ,Y171) and the Voltage of VCTP_P(U81)

Repeat A, B Process

Pass

Check the signal input/output of U81

Pass

Check input source cable or jack(JP496,497)

Fail

Re-soldering or Change the

defect part(U81)

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LG 50PG6300 Schematic

Specifications and Main Features

Frequently Asked Questions

User Manual