LG 49LJ510M, 49LJ5100 Schematic

LED TV
SERVICE MANUAL
CHASSIS : LA77H
MODEL : 49LJ5100/510M
MODEL : 49LJ5100-UC/49LJ510M-UB
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
P/NO : MFL70080101 (1705-REV01)
Any reproduction, duplication, distribution (including by way of email, facsimile or other electronic means), publication, modification, copying or transmission of this Service Manual is STRICTLY PROHIBITED unless you have obtained the prior written consent of the LG Electronics entity from which you received this Service Manual. The material covered by this prohibition includes, without limitation, any text, graphics or logos in this Service Manual.
Copyright © 2017 LG Electronics Inc. All rights reserved. Only training and service purposes.
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ....................................................................................... 6
SOFTWARE UPDATE .............................................................................. 8
BLOCK DIAGRAM ................................................................................... 9
EXPLODED VIEW .................................................................................. 10
DISASSEMBLY GUIDE .......................................................................... 11
TROUBLE SHOOTING GUIDE ................................................ APPENDIX
- 2 -
Copyright © LG Electronics Inc. All rights reserved. Only for training and service purposes.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
- 3 -
Copyright © LG Electronics Inc. All rights reserved. Only for training and service purposes.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent poten­tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electri­cally shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
- 4 -
Copyright © LG Electronics Inc. All rights reserved. Only for training and service purposes.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
- 5 -
Copyright © LG Electronics Inc. All rights reserved. Only for training and service purposes.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LED TV used LA77A chassis.
2. Test condition
Each part is tested as below without special appointment. (1) Temperature: 25 °C ± 5 °C, CST: 40 °C ± 2 °C (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in accordance with BOM.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
(1) Performance: LGE TV test method followed (2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. General Specification
No Item Specication Remark
1 Market North America
2 Receiving system ATSC / NTSC-M, 64 & 256 QAM
3 Available Channel VHF : 02~13
UHF : 14~69
DTV : 02-69
CATV : 01~135
CADTV : 01~135
4 Input Voltage AC 110V, 60HZ Mark : 110V, 60Hz (N.America)
5 Aspect Ratio 16:9
6 Tuning System FS Rear gender(1EA)
7 Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
8 Storage Environment 1) Temp. : -20 ~ 60 deg
2) Humidity : ~ 85%
- 6 -
Copyright © LG Electronics Inc. All rights reserved. Only for training and service purposes.
5. External Input Support Format
5.1. Component 2D input(Y, CB/PB)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1 720*480 15.73 59.94 13.50 SDTV ,DVD 480I
2 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I
3 720*480 31.47 59.94 27.00 SDTV 480P
4 720*480 31.50 60.00 27.027 SDTV 480P
5 1280*720 44.96 59.94 74.176 HDTV 720P
6 1280*720 45.00 60.00 74.25 HDTV 720P
7 1920*1080 33.72 59.94 74.176 HDTV 1080I
8 1920*1080 33.75 60.00 74.25 HDTV 1080I
9 1920*1080 26.97 23.976 74.176 HDTV 1080P
10 1920*1080 27.00 24.00 74.25 HDTV 1080P
11 1920*1080 33.71 29.97 74.176 HDTV 1080P
12 1920*1080 33.75 30.00 74.25 HDTV 1080P
13 1920*1080 67.432 59.94 148.352 HDTV 1080P
14 1920*1080 67.50 60.00 148.50 HDTV 1080P
5.2. HDMI Input (PC/DTV)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark
HDMI-PC DDC
1 640*350 @70Hz 31.46 70.09 25.17 EGA X
2 720*400 @70Hz 31.46 70.08 28.32 DOS O
3 640*480 @60Hz 31.46 59.94 25.17 VESA(VGA) O
4 800*600 @60Hz 37.87 60.31 40.00 VESA(SVGA) O
5 1024*768 @60Hz 48.36 60.00 65.00 VESA(XGA) O
6 1152*864 @60Hz 54.34 60.05 80.002 VESA O
7 1280*1024 @60Hz 63.98 60.02 108.0 VESA (SXGA) O FHD only
8 1360*768 @60Hz 47.71 60.01 85.50 VESA (WXGA) O
9 1920*1080 @60Hz 67.5 60.00 148.5 WUXGA(CEA 861D) O FHD only
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
DTV
1 640*480 31.46 59.94 25.125 SDTV 480P
2 640*480 31.5 60.00 25.125 SDTV 480P
5 720*480 15.73 59.94 13.500 SDTV 480I
6 720*480 15.75 60.00 13.514 SDTV 480I
7 720*480 31.47 59.94 27.00 SDTV 480P
8 720*480 31.5 60.00 27.027 SDTV 480P
9 1280*720 44.96 59.94 74.176 HDTV 720P
10 1280*720 45 60.00 74.25 HDTV 720P
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 26.97 23.97 74.176 HDTV 1080P
14 1920*1080 27.00 24.00 74.25 HDTV 1080P
15 1920*1080 33.71 29.97 74.176 HDTV 1080P
16 1920*1080 33.75 30.00 74.25 HDTV 1080P
- 7 -
Copyright © LG Electronics Inc. All rights reserved. Only for training and service purposes.
SOFTWARE UPDATE
1. USB
(1) Insert the USB memory Stick to the USB port (2) Automatically detect the SW Version and show the below
message
(3) Click [YES]: initiate the download and install of the update.
2. NSU
(This Function is needed to connect to the internet)
(1) Menu -> All Settings -> General -> About This TV
(2) Click [CHEK FOR UPDATES] : system check newest
version
(4) Click [Check Now]: move to “About This TV” page for
update
(5) TV is updating
(6) After finished the update, below Pop-up appear
(7) Click [Yes] : TV will be DC OFF -> ON (8) After TV turned on, Check the updated SW Version and
Tool Option
(3) Click [DOWNLOAD AND INSTALL] (4) TV is updating
(5) After finished the update, below Pop-up appear
(6) Turn OFF the TV and On. Check the updated SW Version
and Tool Option
- 8 -
Copyright © LG Electronics Inc. All rights reserved. Only for training and service purposes.
BLOCK DIAGRAM
Sound AMP
NTP7515x
IC5600
(
(
(
(
Module
JK401
Y,Pb,Pr In
LGE6312
9
4
2
3
10
11
Tuner SDA
Tuner SCL
IF_AGC
B+
IR/KEY
42
24Mhz
38
39
IC101
Serial Flash
64MB
IC100
EEPROM
24C512
IC102
LPF
P5600
P300/301
65,66,69 ~ 72,74~79
43
95 94
80 81
Audio_SCL
Audio_SDA
Panel_12V
INV_on
PWM
N_3.3V
VDDC_1.15V
I2S_WS
I2S_SCK
I2S_SDO
85
86
LED
88 84
48
49
EEP SDA
EEP SCL
93 92 91 90
SPI_DI
SPI_CLK
SPI_DO
SPI_CZ
S-AMP_19V
LPF
JK403
P303
IR
KEY1,2
ST_3.3V
P_19V
Q204
SSM3J332R
IC204
TJ1117
DDR_1.8V
N_3.3V
Q202
SSM3J332R
Panel_Vcc
IC205
MP2315GJ
USB_5V
USB_DN
USB_DP
IF_N
JK404
Comp. R/L In
AV1 In
24,29,30 19,21,23,29,30
3
18
28
27
46
47
45
108
107
123~128,1,2,113,114
37
IF_P
57~64
USB_DN
USB_DP
51
50
USB_5V
40 41 44
53
54
55
56
3~11,118,119
HDMI2
HDMI1
Debug
SI2151-A10
Tx, Rx
AVDD_ST_3.3V
IC501
JK402/P401/P402
IC203
MP2315GJ
122
73 103
110
104
106
IR
KEY2
LED
1105
JK201
P601
LED Driver
IC601
MP3378E
JK400
JK501
15 17
IC202
TJ4320
+12V
(With DDR3 Max CLK 667MHz)
I2C_Sensor
- 9 -
Copyright © LG Electronics Inc. All rights reserved. Only for training and service purposes.
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
400
IMPORTANT SAFETY NOTICE
901
LV1
200
800
540
902
720
700
120
A10
500
AR1
- 10 -
Copyright © LG Electronics Inc. All rights reserved. Only for training and service purposes.
1. Disassembly of Back cover
w
t
W < 4.0mm
t< 3.0mm
Tool spec
- Long nose pliers
- Needle nose pliers
: M3*5.5 1EA
: M4*10 4EA(Taptite)
: M3*10 5EA(Taptite)
*SCREW TORQUE :
SCREW : 4 ~ 6Kgf.cm
SCREW : 5 ~ 7Kgf.cm
SCREW : 5 ~ 7Kgf.cm
(1) Remove screw in the set
DISASSEMBLY
(5) Open B/C with push/pulling long nose to upper and lower
sides.
(2) Check both right/left hole
(3) Attach tape to ‘Long nose pliers’
(6) Disassemble Back cover
* Disassemble it from left to right for top side hook on Back
cover
(4) Put ‘long nose’ into the hole
- 11 -
Copyright © LG Electronics Inc. All rights reserved. Only for training and service purposes.
TROUBLE SHOOTING GUIDE
Copyright © 2017 LG Electronics Inc. All rights reserved. Only for training and service purposes.
No. Error symptom (High category) Error symptom (Mid category) Page Remarks
1
A. Video error
No video/Normal audio 1
2 No video/No audio 2
3 Tuning fail, Picture broken/ Freezing 3, 4
4 Color error 5
5
Vertical/Horizontal bar, residual image, light spot, external device color error
6
6
B. Power error
No power 7
7 Off when on, off while viewing, power auto on/off 8 8
C. Audio error
No audio/Normal video 9
9 Wrecked audio/discontinuation/noise 10
10
D. Function error
Remote control & Local switch checking 11 11 External device recognition error 12 12 E. Noise Circuit noise, mechanical noise 13 13 F. Exterior error Exterior defect 14
* First of all, Check whether there is SVC Bulletin in GSCS System for these model.
Contents of Standard Repair Process
Copyright © 2017 LG Electronics Inc. All rights reserved. Only for training and service purposes.
Y
N
Move to
No video/No audio
No video
Normal audio
Check Back Light
On with naked eye
Check LVDS 12 V
of Main B/D
Replace T-con B/D
or Module
Replace Main
B/D or Repair parts
Check Main B/D to LED Back light Voltage
Change Module
Replace Main
B/D or Repair parts
Always check & record S/W Version and White Balance value before replacing the Main Board
Replace Main Board Re-enter White Balance value
Precaution
A4 A1
A2
A3 & A6
First of all, Check whether all of cables between board is inserted properly or not.
(Main B/D ↔ Adaptor, LVDS Cable, Speaker Cable, IR B/D Cable…)
Normal
Audio
On
Y
N
Normal
Voltage
Normal
Voltage
Y
N
Y
N
Error Symptom
A. Video Error
Established date
1/14
Content
No video / Normal audio
Revised date
Standard Repair Process
Copyright © 2017 LG Electronics Inc. All rights reserved. Only for training and service purposes.
Check voltage 19V
of Adaptor
No video /
No audio
Replace Main
B/D or Repair parts
Replace Adaptor
Normal Voltage
Y
N
Error Symptom
A. Video Error
Established date
2/14
Content
No video / No audio
Revised date
Standard Repair Process
A13
Copyright © 2017 LG Electronics Inc. All rights reserved. Only for training and service purposes.
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