LG 49LF6450-SA Schematic

Internal Use Only

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

LED TV

SERVICE MANUAL

CHASSIS : LJ51H

MODEL : 49LF6450 49LF6450-SA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL68760916 (1504-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION .............................................................. 14

BLOCK DIAGRAM ................................................................................. 21

EXPLODED VIEW .................................................................................. 25

SCHEMATIC CIRCUIT DIAGRAM ............................................APPENDIX

TROUBLE SHOOTING ..............................................................APPENDIX

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This spec sheet is applied to the LED TV used LJ51H chassis

2. Test condition

Each part is tested as below without special notice.

1) Temperature : 25 ºC ± 5 ºC(77±9ºF), CST : 40 ºC±5 ºC

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage Standard input voltage (100~240V@ 50/60Hz) * Standard Voltage of each products is marked by models. * Taiwan : 110V 60Hz

4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

5) The receiver must be operated for about 20 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC: CE, IEC

4. Model Specification

No Item Specication Remark

1. Market Central and South AMERICA

2. Broadcasting system Digital : SBTVD /

3. Available Channel BAND NTSC

4. Receiving system Digital : SBTVD /

5. Video Input NTSC-M Rear 1EA (Common AV/Component)

6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear 1EA

7. RGB Input RGB-PC, Spec out

8. HDMI Input PC(HDMI version 1.3) / DTV format, Support

9. Audio Input Component / AV Audio / DVI Audio, Rear 1EA(Common Component / AV / DVI)

10 SPDIF out(1EA) Optical Audio out Rear (1EA)

11 USB Input(3EA) EMF, DivX HD, For SVC (download) Side 3EA

Analog : NTSC / PAL-M / PAL-N

VHF UHF DTV

CATV

Analog : NTSC / PAL-M / PAL-N

HDCP

2 ~ 13

14 ~ 69

2 ~ 69

1 ~ 135

Side 3EA Support ARC only HDMI1 Support MHL only HDMI3

JPEG, MP3, DivX HD

Only for training and service purposes

- 6 -

5. External Input Support Format

5.1. Component (Y, PB, PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I

2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I

3. 720*480 31.50 60 27.027 SDTV 480P

4. 720*480 31.47 59.94 27.00 SDTV 480P

5. 720*576 15.625 50* 13.5 SDTV 576I

6. 720*576 31.25 50* 13.5 SDTV 576P

7. 1280*720 37.5 50* 74.25 HDTV 720P

8. 1280*720 45.00 60.00 74.25 HDTV 720P

9. 1280*720 44.96 59.94 74.176 HDTV 720P

10. 1929*1080 28.125 50* 74.25 HDTV 1080I

11. 1920*1080 33.75 60.00 74.25 HDTV 1080I

12. 1920*1080 33.72 59.94 74.176 HDTV 1080I

13. 1920*1080 56.25 50* 148.5 HDTV 1080P

14. 1920*1080 67.50 60 148.50 HDTV 1080P

15. 1920*1080 67.432 59.94 148.352 HDTV 1080P

16. 1920*1080 27.00 24.00 74.25 HDTV 1080P

17. 1920*1080 26.97 23.976 74.176 HDTV 1080P

18. 1920*1080 33.75 30.00 74.25 HDTV 1080P

19. 1920*1080 33.71 29.97 74.176 HDTV 1080P

Only for training and service purposes

- 7 -

5.2. HDMI : EDID DATA : Refer to adjust specification

5.2.1. DTV mode

No Resolution H-freq(kHz) V-freq.(Hz) Proposed Remark

1 640 x 480 31.46 59.94 SDTV 480P

2 640 x 480 31.5 60.00 SDTV 480P

3 720 x 480 15.73 59.94 SDTV 480I Comment Only Spec. Sheet

4 720 x 480 15.75 60.00 SDTV 480I

5 720 x 576 15.62 50.00 SDTV 576I(DVB)

6 720 x 480 31.47 59.94 SDTV 480P

7 720 x 480 31.5 60.00 SDTV 480P

8 720 x 576 31.25 50.00 SDTV 576P(DVB)

9 1280 x 720 44.96 59.94 HDTV 720P

10 1280 x 720 45 60.00 HDTV 720P

11 1280 x 720 37.5 50.00 HDTV 720P(DVB)

12 1920 x 1080 28.12 50.00 HDTV 1080I(DVB)

13 1920 x 1080 33.72 59.94 HDTV 1080I

14 1920 x 1080 33.75 60.00 HDTV 1080I

15 1920 x 1080 26.97 23.97 HDTV 1080P

16 1920 x 1080 27.00 24.00 HDTV 1080P

17 1920 x 1080 33.71 29.97 HDTV 1080P

18 1920 x 1080 33.75 30.00 HDTV 1080P

19 1920 x 1080 56.25 50.00 HDTV 1080P(DVB)

20 1920 x 1080 67.43 59.94 HDTV 1080P

21 1920 x 1080 67.5 60.00 HDTV 1080P

(Spec Out)

5.2.2. PC mode

No. Resolution H-freq(kHz) V-freq.(kHz) Proposed Remarks

1 640 x 350 @70Hz 31.46 70.09 EGA

2 720 x 400 @70Hz 31.46 70.08 DOS

3 640 x 480 @60Hz 31.46 59.94 VESA(VGA)

4 800 x 600 @60Hz 37.87 60.31 VESA(SVGA)

5 1024 x 768 @60Hz 48.36 60.00 VESA(XGA)

6 1152 x 864 @60Hz 54.34 60.05 VESA

7 1280 x 1024 @60Hz 63.98 60.02 VESA(SXGA) FHD only

8 1360 x 768 @60Hz 47.71 60.01 VESA(WXGA)

9 1920 x 1080 @60Hz 67.5 60.00 WUXGA(CEA 861D) FHD only

Only for training and service purposes

- 8 -

6. 3D Mode

6.1. RF Input (3D supported mode manually)

No Resolution Proposed 3D input proposed mode

1 HD 1080I

720P

2 SD 576P

576I

6.2. RF Input (3D supported mode automatically)

No Signal 3D input proposed mode

1 Frame Compatible Side by Side(Half), Top & Bottom

6.3. HDMI Input 1.3(3D supported mode manually)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1 1280*720 45.00 60.00 74.25 HDTV 720P 2D to 3D

2 1280*720 37.500 50 74.25 HDTV 720P 2D to 3D

3 1920*1080 33.75 60.00 74.25 HDTV 1080I 2D to 3D

4 1920*1080 28.125 50.00 74.25 HDTV 1080I 2D to 3D

5 1920*1080 27.00 24.00 74.25 HDTV 1080P 2D to 3D

6 1920*1080 28.12 25 74.25 HDTV 1080P 2D to 3D

7 1920*1080 33.75 30.00 74.25 HDTV 1080P 2D to 3D

8 1920*1080 56.25 50 148.5 HDTV 1080P 2D to 3D

9 1920*1080 67.50 60.00 148.5 HDTV 1080P 2D to 3D

2D to 3D Side by Side(Half) Top & Bottom

2D to 3D

Side by Side(half), Top & Bottom, Single Frame Sequential

Side by Side(half), Top & Bottom

Side by Side(half), Top & Bottom, Checkerboard

Side by Side(half), Top & Bottom, Checkerboard, Single Frame Sequential, Row Interleaving, Column Interleaving

Only for training and service purposes

- 9 -

6.4. HDMI Input 1.4b (3D supported mode automatically)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock

1 640*480 31.469 / 31.5 59.94/ 60 25.175/25.2 1 Top-and-Bottom

2 62.938 / 63 59.94/ 60 50.35/50.4 1 Frame packing

3 31.469 / 31.5 59.94/ 60 50.35/50.4 1 Side-by-side(Full) (SDTV 480P)

4 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 2,3 Top-and-Bottom

5 62.938 / 63 59.94 / 60 54/54.06 2,3 Frame packing

6 31.469 / 31.5 59.94 / 60 54/54.06 2,3 Side-by-side(Full) (SDTV 480P)

7 720*576

(576p)

8 62.5 50 54 17,18 Frame packing

9 31.25 50 54 17,18 Side-by-side(Full) (SDTV 576P)

10 720 (1440)*576

(576i)

11 31.25 50 54 21 Frame packing

12 15.625 50 54 21 Side-by-side(Full) (SDTV 576I)

13 1280*720 37.5 50 74.25 19 Top-and-Bottom

14 75 50 148.5 19 Frame packing

15 37.5 50 148.5 19 Side-by-side(Full) (HDTV 720P)

16 44.96 / 45 59.94 / 60 74.18/74.25 4 Top-and-Bottom

17 89.91 / 90 59.94 / 60 148.35/148.5 4 Frame packing

18 44.96 / 45 59.94 / 60 148.35/148.5 4 Side-by-side(Full) (HDTV 720P)

31.25 50 27 17,18 Top-and-Bottom

15.625 50 27 21 Top-and-Bottom

(MHz)

VIC 3D input proposed

mode

Side-by-side(half)

Line alternative

Side-by-side(half)

Line alternative

Side-by-side(half)

Line alternative

Side-by-side(half)

Field alternative

Side-by-side(half)

Line alternative

Side-by-side(half)

Line alternative

Proposed

Secondary(SDTV 480P) Secondary(SDTV 480P)

Secondary(SDTV 480P) (SDTV 480P)

Secondary(SDTV 480P) Secondary(SDTV 480P)

Secondary(SDTV 480P) (SDTV 480P)

Secondary(SDTV 576P) Secondary(SDTV 576P)

Secondary(SDTV 576P) (SDTV 576P)

Secondary(SDTV 576I) Secondary(SDTV 576I)

Secondary(SDTV 576I) (SDTV 576I)

Primary(HDTV 720P) Primary(HDTV 720P)

Primary(HDTV 720P) (HDTV 720P)

Primary(HDTV 720P) Primary(HDTV 720P)

Primary(HDTV 720P) (HDTV 720P)

Only for training and service purposes

- 10 -

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock

1920*1080 33.72 / 33.75 59.94 / 60 74.18/74.25 5 Top-and-Bottom

67.432 / 67.5 59.94 / 60 148.35/148.5 5 Frame packing

33.72 / 33.75 59.94 / 60 148.35/148.5 5 Side-by-side(Full) (HDTV 1080I)

28.125 50.00 74.25 20 Top-and-Bottom

56.25 50.00 148.5 20 Frame packing

28.125 50.00 148.5 20 Side-by-side(Full) (HDTV 1080I)

26.97 / 27 23.97 / 24 74.18/74.25 32 Top-and-Bottom

43.94 / 54 23.97 / 24 148.35/148.5 32 Frame packing

26.97 / 27 23.97 / 24 148.35/148.5 32 Side-by-side(Full) (HDTV 1080P)

28.12 25 74.25 33 Top-and-Bottom

56.24 25 148.5 33 Frame packing

28.12 25 148.5 33 Side-by-side(Full) (HDTV 1080P)

33.716 / 33.75 29.976 / 30.00 74.18/74.25 34 Top-and-Bottom

67.432 / 67.5 29.976 / 30.00 148.35/148.5 34 Frame packing

33.716 / 33.75 29.976 / 30.00 148.35/148.5 34 Side-by-side(Full) (HDTV 1080P)

56.25 50 148.5 31 Top-and-Bottom

67.43 / 67.5 59.94 / 60 148.35/148.50 16 Top-and-Bottom

(MHz)

VIC 3D input proposed

mode

Side-by-side(half)

Field alternative

Side-by-side(half)

Field alternative

Side-by-side(half)

Line alternative

Side-by-side(half)

Line alternative

Side-by-side(half)

Line alternative

Side-by-side(half)

Proposed

Secondary(HDTV 1080I) Primary(HDTV 1080I)

Primary(HDTV 1080I) (HDTV 1080I)

Secondary(HDTV 1080I) Primary(HDTV 1080I)

Primary(HDTV 1080I) (HDTV 1080I)

Primary(HDTV 1080P) (HDTV 1080P)

Secondary(HDTV 1080P) (HDTV 1080P)

Secondary(HDTV 1080P) Secondary(HDTV 1080P)

Secondary(HDTV 1080P) (HDTV 1080P)

Primary(HDTV 1080P) Secondary(HDTV 1080P)

Primary(HDTV 1080P) (HDTV 1080P)

Primary(HDTV 1080P) Secondary(HDTV 1080P)

6.5. HDMI-PC 3D Input (3D supported mode manually)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1 1024*768 48.36 60 65 2D to 3D,

Side by Side(half) Top & Bottom

2 1360*768 47.71 60 85.5 2D to 3D,

Side by Side(half) Top & Bottom

3 1920*1080 67.500 60 148.50 2D to 3D,

Side by Side(half) Top & Bottom, Checker Board, Single Frame Sequential Row Interleaving, Column Interleaving

4 Others - - - 2D to 3D 640*350

- 11 -

Only for training and service purposes

HDTV 768P

HDTV 1080P

720*400 640*480 800*600 1152*864

6.6. Component 3D Input (3D supported mode manually)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1 1280*720 37.5 50 74.25 2D to 3D,

Side by Side(half), Top & Bottom

2 1280*720 45.00 60.00 74.25 2D to 3D,

Side by Side(half), Top & Bottom

3 1280*720 44.96 59.94 74.176 2D to 3D,

Side by Side(half) Top & Bottom

4 1920*1080 33.75 60.00 74.25 2D to 3D,

Side by Side(half) Top & Bottom

5 1920*1080 33.72 59.94 74.176 2D to 3D,

Side by Side(half) Top & Bottom

6 1920*1080 28.12 50 74.25 2D to 3D,

Side by Side(half) Top & Bottom

7 1920*1080 67.500 60 148.50 2D to 3D,

Side by Side(half) Top & Bottom

8 1920*1080 67.432 59.94 148.352 2D to 3D,

Side by Side(half) Top & Bottom

9 1920*1080 27.000 24.000 74.25 2D to 3D,

Side by Side(half) Top & Bottom

10 1920*1080 28.12 25 74.25 2D to 3D,

Side by Side(half) Top & Bottom

11 1920*1080 56.25 50 74.25 2D to 3D,

Side by Side(half) Top & Bottom

12 1920*1080 26.97 23.976 74.176 2D to 3D,

Side by Side(half) Top & Bottom

13 1920*1080 33.75 30.000 74.25 2D to 3D,

Side by Side(half) Top & Bottom

14 1920*1080 33.71 29.97 74.176 2D to 3D,

Side by Side(half) Top & Bottom

HDTV 720P

HDTV 1080I

HDTV 1080P

Only for training and service purposes

- 12 -

6.7. USB Input (3D) (3D supported mode manually)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1 1920*1080 33.75 30 74.25 2D to 3D

Side by Side(Half)*, Top & Bottom*, Checkerboard* Row Interleaving, Column Interleaving (Photo : side by Side(half), Top & Bottom)

HDTV 1080P

6.8. DLNA Input (3D)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1 1920*1080 33.75 30 74.25 2D to 3D

Side by Side(Half)*, Top & Bottom*, Checkerboard* Row Interleaving, Column Interleaving (Photo : side by Side(half), Top & Bottom)

HDTV 1080P

(“*” 3D supported mode manually & automatically)

Only for training and service purposes

- 13 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied all of the LJ51H LED TV models, which produced in manufacture department or similar LG TV factory

2. Notice

1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation transformer will help protect test instrument.

2) Adjustment must be done in the correct order. But it is

flexible when its factory local problem occurs.

3) The adjustment must be performed in the circumstance of

25 ±5ºC of temperature and 65±10% of relative humidity if there is no specific designation.

4) The input voltage of the receiver must keep 100~220V,

50/60Hz.

5) Before adjustment, execute Heat-Run for 5 minutes.

▪ After Receive 100% Full white pattern (06CH) then process

Heat-run

(or “8. Test pattern” condition of Ez-Adjust status)

▪ How to make set white pattern

1) Press Power ON button of Service Remocon

2) Press ADJ button of Service remocon. Select “8. Test

pattern” and, after select “White” using navigation button, and then you can see 100% Full White pattern.

* In this status you can maintain Heat-Run useless any pattern

generator

* Notice : if you maintain one picture over 20 minutes

(Especially sharp distinction black with white pattern

-13Ch, or Cross hatch pattern – 09Ch) then it can appear image stick near black level.

4. PCB Assembly Adjustment

4.1. MAC Address, ESN Key and Widevine Key download

4.1.1. Equipment & Condition

1) Play file: keydownload.exe

4.1.2. Communication Port connection

1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)

2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)

4.1.3. Download process

1) Select the download items.

2) Mode check: Online Only

3) Check the test process

- DETECT -> MAC_WRITE -> ESN_WRITE -> WIDEVINE_ WRITE

4) Play : START

5) Check of result: Ready, Test, OK or NG

4.1.4. Communication Port connection

1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C

Port

3. Adjustment items

3.1. PCB Assembly Adjustment

▪ MAC Address / ESN / Widevine / HDCP1.4 / HDCP 2.0

Download

▪ EDID (The Extended Display Identification Data)/DDC

(Display Data Channel) download * If it is necessary, it can adjustment at Manufacture Line You can see set adjustment status at “1. ADJUST CHECK”

of the “In-start menu”

3.2. Set Assembly Adjustment

▪ Color Temperature (White Balance) Adjustment ▪ Using RS-232C ▪ PING Test ▪ Selection Factory output option

Only for training and service purposes

4.1.5. Download

1) 15Y LCD TV+MAC+Widevine+ESN Key+ HDCP1.4 and HDCP2.0

4.1.6. Inspection

- In INSTART menu, check these keys.

- 14 -

4.2. LAN PORT INSPECTION(PING TEST)

4.2.1. Equipment setting

1) Play the LAN Port Test PROGRAM.

2) Input IP set up for an inspection to Test Program.

*IP Number : 12.12.2.2.

4.2.2. LAN PORT inspection (PING TEST)

1) Play the LAN Port Test Program.

2) connect each other LAN Port Jack.

3) Play Test (F9) button and confirm OK Message.

4) remove LAN CABLE

4.3. ADC Adjust => No need at Assembly line because of OPT type

* OTP mode Automatic ADC Calibration. (Internal ADC Calibration) On the manufacture line, OTP is used for ADC Calibration automatically.

* External mode Manual ADC Calibration. When OTP mode is failed, ADC calibration should be “OK” by using External mode.

- If you want re-adjust for ADC.

■ Enter Service Mode by pushing “ADJ” key,

■ Enter Internal ADC mode by pushing “►” key at “ADC

Calibration”

■

Adjustment protocol

Order Command Set response

(1) Inter the Adjustment mode aa 00 00 a 00 OK00x

(2) Change the Source xb 00 40 b 00 OK40x (Adjust 480i Comp1 )

(3) Start Adjustment ad 00 10

(4) Return the Response OKx ( Success condition )

(5) Read Adjustment data ( main)

ad 00 20 ( main ) ad 00 30

(6) Conrm Adjustment ad 00 99 NG 03 00x (Failed condition)

(7) End of Adjustment ad 00 90 d 00 OK90x

(Adjust 1080p Comp1)

NGx ( Failed condition )

(main : component1 480i) 000000000000000000000000007c007b006dx (main : component1 1080p) 000000070000000000000000007c0083 0077x

NG 03 01x (Failed condition) NG 03 02x (Failed condition) OK 03 03x (Success condition)

Only for training and service purposes

- 15 -

5. Factory Adjustment

5.1. EDID (The Extended Display Identification Data)/DDC (Display Data Channel) Download

● Summary

▪ It is established in VESA, for communication between PC

and Monitor without order from user for building user condition. It helps to make easily use realize “Plug and Play” function. For EDID data write, we use DDC2B protocol.

● Auto Download (No need Writing EDID data in Assembly line)

▪ After Set Tool Option, then TV turn off and on finish auto

download

* EDID data for FHD, 2D, DTS-HD, 8Bit (40/43/49/55LF63

Series) (Model name = LG TV ) .

- HDMI - 1 EDID table ( 0x40, 0x1B )

* EDID data for FHD, 3D, DTS, 8Bit (42/47/55 LF65/67/70/72 Seriese, 42/49LF64 Series) (Model name = LG TV )

- HDMI - 1 EDID table ( 0xE6, 0xC8 )

-. LVDS supports 8bit ( CEA Block 0x23 :80, 0x24 : 1E)

1) HDMI 1 Check sum : 0xE6, 0xC8 (CEA Block 0x21 :10)

2) HDMI 2 Check sum : 0xE6, 0xB8 (CEA Block 0x21 :20)

3) HDMI 3 Check sum : 0xE6, 0xA8 (CEA Block 0x21 :30)

* EDID data for FHD, 3D, DTS, 10Bit (60/65/70 LF65/67/70/72 Seriese) (Model name = LG TV )

- HDMI - 1 EDID table ( 0xE6, 0x81 )

-. LVDS supports 8bit ( CEA Block 0x23 :80, 0x24 : 1E)

1) HDMI 1 Check sum : 0x40, 0x1B (CEA Block 0x21 :10)

2) HDMI 2 Check sum : 0x40, 0x0B (CEA Block 0x21 :20)

3) HDMI 3 Check sum : 0x40, 0xFB (CEA Block 0x21 :30)

* EDID data for FHD, 2D, DTS-HD, 10Bit (60/65LF63 Series )

(Model name = LG TV )

- - HDMI - 1 EDID table ( 0x40, 0xD4

-.LVDS supports 10bit (support Deep color) , ( Total Block -. LVDS supports 10bit (support Deep color) , ( CEA Block 0x23 :B8, 0x24 : 2D)

1) HDMI 1 Check sum : 0x40, 0xD4 (CEA Block 0x21 :10)

2) HDMI 2 Check sum : 0x40, 0xC4 (CEA Block 0x21 :20)

3) HDMI 3 Check sum : 0x40, 0xB4 (CEA Block 0x21 :30)

-. LVDS supports 10bit (support Deep color) , (CEA Block 0x23 :B8, 0x24 : 2D)

1) HDMI 1 Check sum : 0xE6, 0x81 (CEA Block 0x21 :10)

2) HDMI 2 Check sum : 0xE6, 0x71 (CEA Block 0x21 :20)

3) HDMI 3 Check sum : 0xE6, 0x61 (CEA Block 0x21 :30)

Only for training and service purposes

- 16 -

5.2. Adjustment Color Temperature

(White balance)

● W/B Equipment condition

CA210 : CH 14, Test signal : Inner pattern (80IRE) – LED

Module

CH18 , Test signal : Inner pattern (80IRE) – ALEF

Module

● Above 5 minutes H/run in the inner pattern. (“power on” key of

adjust remote control)

※ The spec of color temperature and coordinate.

X=0.271

Cool (C50) 13,000k K

All

Medium (0) 9,300k K

Warm (W50) 6,500k K

(1) RS-232C Command used during auto-adj.

RS-232C COMMAND

CMD DATA ID

Wb 00 00 Begin White Balance adj.

Wb 00 ff

End White Balance adj. (internal pattern disappears )

5.2.1. Adjustment method

5.2.2. Auto WB calibration

1) Set TV in ADJ mode using P-ONLY key (or POWER ON key)

2) Place optical probe on the center of the display

- It need to check probe condition of zero calibration before

adjustment.

3) Connect RS-232C Cable

4) Select mode in ADJ Program and begin a adjustment.

5) When WB adjustment is completed with OK message, check adjustment status of pre-set mode (Cool, Medium, Warm)

6) Remove probe and RS-232C cable.

▪ W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need

5.2.3. Manual adjustment

5.2.3.1 Manual adj. method

1) Set TV in Adj. mode using POWER ON

2) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10cm of the surface..

3) Press ADJ key à EZ adjust using adj. R/C -> 11. White-

Balance then press the cursor to the right (KEY►). When KEY(►) is pressed 206 Gray internal pattern will be

displayed.

4) Adjust Cool modes

- Fix the one of R/G/B gain to 192 (default data) and

decrease the others.

(±0.002) Y=0.270 (±0.002)

X=0.286 (±0.002) Y=0.289 (±0.002)

X=0.313 (±0.002) Y=0.329 (±0.002)

Explanation

- Inner pattern for W/B adjust

- External white

pattern

( If G gain is adjusted over 172 and R and B gain less than

192 , Adjust is O.K.)

- If G gain is less than 172, Increase G gain by up to 172, and then increase R gain and G gain same amount of increasing G gain.

- If R gain or B gain is over 255, Readjust G gain less than 172, Conform to R gain is 255 or

B gain is 255

5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain to 192 (default data) and decrease the others.

6) Adj. is completed, Exit adjust mode using “EXIT” key on Remote controller

5.2.4. Reference (White Balance Adj. coordinate and color temperature)

1) Luminance: 204 Gray, 80IRE

2) Standard color coordinate and temperature using CS-1000 (over 26 inch)

5.2.5. Reference (White Balance Adj. coordinate and color temperature)

1) Luminance: 204 Gray

2) Standard color coordinate and temperature using CS-1000 (over 26 inch)

Mode

Cool 0.271 0.270 13,000K 0.0000

Medium 0.286 0.289 9,300K 0.0000

Warm 0.313 0.329 6,500K 0.0000

▪ Standard color coordinate and temperature using

CA-210(CH-14) – by aging time Normal line in Korea (From January to February) : LGD (LF5xxx, LF6xxx, LF7xxx Series models)

webOS

1 0-2 286 295 301 314 328 354

2 3-5 284 290 299 309 326 349

3 6-9 282 287 297 306 324 346

4 10-19 279 283 294 302 321 342

5 20-35 276 278 291 297 318 337

6 36-49 274 275 289 294 316 334

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

- O/S Module(AUO, INX, Sharp, CSOT, BOE)

webOS

Target 278 280 293 299 320 339

Coordinate

X Y

Aging time

(Min)

Cool Medium Warm

x y x y x y

271 270 285 293 313 329

Cool Medium Warm

X Y X Y X Y

271 270 286 289 313 329

Temp △uv

Only for training and service purposes

- 17 -

▪ Standard color coordinate and temperature using

CA-210(CH-14) – by aging time Normal line in Korea (From March to December) : LGD (LF5xxx, LF6xxx, LF7xxx Series models) Normal line in GLOBAL : LGD (LF5xxx, LF6xxx, LF7xxx Series models)

webOS

Aging time

(Min)

1 0-2 282 289 297 308 324 348

2 3-5 281 287 296 306 323 346

3 6-9 279 284 294 303 321 343

4 10-19 277 280 292 299 319 339

5 20-35 275 277 290 296 317 336

6 36-49 274 274 289 293 316 333

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

Cool Medium Warm

X Y X Y X Y

271 270 286 289 313 329

5.3. Magic Motion remote controller Check (Only LF65/LF70/LF72)

5.3.1 Test equipment

- RF-remote controller for check, IR-KEY-CODE remote controller.

- Check AA battery before test. A recommendation is that a tester change battery every lots.

5.5. HDMI ARC Function Inspection

5.5.1. Test equipment

- Optic Receiver Speaker

- MSHG-600 (SW: 1220 ↑)

- HDMI Cable (for 1.4 version)

5.5.2. Test method

1) Insert the HDMI Cable to the HDMI ARC port from the master equipment (HDMI1)

2) Check the sound from the TV Set

5.3.2. Test

1) Make pairing with TV set by pressing “Mute (START) key” on RCU.

2) Check a cursor on screen by pressing ‘ENTER” or “OK” key of RCU

3) Stop paring with TV set by pressing “VOL+ (STOP) key.

5.4. 3D pattern test

5.4.1. Test equipment

1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4 support)

2) Pattern: HDMI mode (model No. 872, pattern No. 83)

5.4.2. Test method

(1) Input 3D test signal as Fig.1.

2) Press ‘OK” key as a 3D input OSD is shown.

3) Check pattern as Fig2 without 3D glasses. (3D mode without 3D glasses)

3) Check the Sound from the Speaker or using AV & Optic TEST program (It’s connected to MSHG-600)

* Remark: Inspect in Power Only Mode and check SW version

in a master equipment

Only for training and service purposes

- 18 -

5.6. Local Dimming Function Check

Green Eye-Check

Sensor Data : 492 BackLight : 100

Step 1) Turn on TV Step 2) Press “TILT” key on the Adj. R/C Step 3) At the Local Dimming mode, module Edge Backlight

moving left to right. Back light of IOP module moving Step 4) confirm the Local Dimming mode. Step 5) Press “exit” key.

5.7. Intelligent Sensor Inspection

Step 1) Turn on the TV set. Step 2) Press “EYE” button on the Adjustment remote

controller.

Step 3) Block the Intelligent Sensor module on the front C/A

about 6 seconds. When the “Sensor Data” is lower

than 20, you can see the “OK” message => If it doesn’t show “OK” message, the Sensor Module is

defected one. You have to replace that with a good one.

6. GND and HI-POT Testing

6.1. GND & HI-POT auto-check preparation Check the connection between set and power cord

1) Check the POWER CABLE and SIGNAL CABE insertion condition

6.2. GND & HI-POT auto-check

1) Pallet moves in the station. (POWER CORD / AV CORD is tightly inserted)

2) Connect the AV JACK Tester

3) Controller (GWS103-4) on.

4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test).

(Remove A/V CORD from A/V JACK BOX)

5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process

automatically

6.3. Check Point

1) Test voltage

3 Poles : GND: 1.5KV/min at 100mA / SIGNAL: 3KV/min at

100mA

2) TEST time: 1 second

3) TEST POINT

3 Poles : GND Test = POWER CORD GND and SIGNAL

CABLE GND. Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms

Step 4) After check the “OK” message come out, take out your

hand from the Sensor module

=> Check “Sensor Data” value change from “0” to “300” or

not. If it doesn’t change the value, the sensor is also defected one. You have to replace it.

※ Caution : Don’t push The INSTOP KEY after completing the

function inspection

Only for training and service purposes

- 19 -

7. Default Service option

7.1. ADC-Set

▪ R-Gain adjustment Value (default 128) ▪ G-Gain adjustment Value (default 128) ▪ B-Gain adjustment Value (default 128) ▪ R-Offset adjustment Value (default 128) ▪ G-Offset adjustment Value (default 128) ▪ B-Offset adjustment Value (default 128)

7.2. White balance. Value

CENTER (DEFAULT)

C50 0 W50

R Gain 192 192 192

G Gain 192 192 192

B Gain 192 192 192

R Cut 64 64 64

G Cut 64 64 64

B Cut 64 64 64

8. USB DOWNLOAD (*.epk file download)

1) Put the USB Stick to the USB socket

2) Press Menu key, and move General *before 10.2 Step. Set USB Expert Mode : Enabled IN START > System 3 > USB Expert Mode

3) Press “number key 7” Press 7 times.

Only for training and service purposes

- 20 -

4) Select download file (epk file)

5) After download is finished, remove the USB stick. ( it will be

auto-reboot )

6) Press “IN-START” key of ADJ remote control, check the

S/W version

BLOCK DIAGRAM

1. M14+ Block Diagram (External)

Only for training and service purposes

- 21 -

2. M14+ Block Diagram (Internal)

Only for training and service purposes

- 22 -

3. M14+ GPIO

Only for training and service purposes

- 23 -

4. M14+ I2C Map

Only for training and service purposes

- 24 -

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

450

400

800

521

LV1

540

120

570

571

900

200

Only for training and service purposes

530

- 25 -

820

121

A10

A22

AG1

Set + Stand

System Configuration

LGE Internal Use Only

Clock for M14+

MAIN Clock(24Mhz)

10pF

C101

10pF

C102

System Clock for Analog block(24Mhz)

PLL SET[1:0] : internal pull up "00" : CPU(1200Mhz),M0 / M1 DDR(792,792 Mhz) "01" : CPU(1056Mhz),M0 / M1 DDR(672,672 Mhz) "10" : CPU(1056Mhz),M0 / M1 DDR(792,792 Mhz) "11" : CPU( 960Mhz),M0 / M1 DDR(792,792 Mhz)

Extenal test only

R103 3.3K

R104 3.3K

OP MODE[1:0] "00" : Normal Mode "01/10/11" : Internal Test mode

+3.3V_NORMAL

OPT

R101 3.3K

R102 3.3K

OPT

Extenal test only

+3.3V_NORMAL

R148

3.3K

R146

3.3K

KR/JP_PIP_NOT

1.5K

R146-*1

R148-*1

KR/JP_PIP

X-T AL_12GND _1

X10 1

24M Hz

GND _2

X-T AL_2

OPT

PLLSET1

PLLSET0

OPM1

OPM0

+3.3V_NORMAL

3.3K

AR104

R155

1.2K

KR/JP_PIP_NOT

3.3K

R155-*1

KR/JP_PIP

R118

R180 560

+3.3V_NORMAL

3.3K

R121

OPT

INSTANT_MODE0

+3.3V_NORMAL

R156

1.2K

KR/JP_PIP_NOT

3.3K

R156-*1

XTAL_IN

XTAL_OUT

INSTANT boot MODE "1 : Instant boot "0 : normal

(internal pull down)

INSTANT_BOOT

I2C PULL UP

3.3K

R159

3.3K

R160

3.3K

AR103

+3.3V_NORMAL

BOOT MODE "0 : EMMC "1 : TEST MODE

3.3K

R127

OPT



BOOT_MODE

3.3K

R128

BOOT_MODE0

I2C

I2C_1 : AMP I2C_2 : T-CON,L/DIMING I2C_3 : MICOM I2C_4 : S/Demod,T2/Demod, LNB I2C_5 : NVRAM I2C_6 : TUNER_MOPLL(T/C,ATV)

3.3K

AR102

I2C_SDA1 I2C_SCL1 I2C_SDA_MICOM_SOC I2C_SCL_MICOM_SOC I2C_SDA2 I2C_SCL2

I2C_SDA4 I2C_SCL4

I2C_SDA5 I2C_SCL5

I2C_SDA6 I2C_SCL6

NVRAM

IC103

AT24C256C-SSHL-T

GND

NVRAM_ATMEL

PAGE 1

+5V_NORMAL

R11034

10K

NON_CI

CAM_CD1_N CAM_CD2_N

TP104 TP105

TP106 TP107

NON_CI

TP108 TP109

TP110 TP111 TP112 TP113 TP114 TP115 TP116 TP117

EB_ADDR[0-14]

EB_WE_N EB_OE_N

EB_BE_N1 EB_BE_N0

CAM_CD1_N CAM_CD2_N

/PCM_CE1 /PCM_CE2 CAM_IREQ_N PCM_RESET CAM_INPACK_N PCM_5V_CTL CAM_WAIT_N CAM_REG_N

VCC

SCL

SDA

VSS

NVRAM_ST

I2C_SCL5 I2C_SDA5

IC103-*1

M24256-BRMN6TP

VCC

SCL

SDA

SOC_RESET

I2C_SCL_MICOM_SOC I2C_SDA_MICOM_SOC

+3.3V_NORMAL

FORCED_JTAG_0

PWM_DIM2

PWM_DIM

R163 10K

OPT

C104

0.1uF 16V

L/DIM0_VS

L/DIM0_SCLK

L/DIM0_MOSI

M_REMOTE_RX M_REMOTE_TX

1/16W

AR100

I2C_SCL4 I2C_SDA4

I2C_SCL6 I2C_SDA6

EMMC_CLK EMMC_CMD EMMC_RST

TCK0 TDI0

XTAL_IN

XTAL_OUT

BOOT_MODE

PLLSET0 PLLSET1

I2C_SCL1 I2C_SDA1

I2C_SCL2 I2C_SDA2

I2C_SCL5 I2C_SDA5

R107 R108

OPM0 OPM1

R182 10K

R183 10K R184 10K

R185 10K

SOC_RX

SOC_TX

33 33

EMMC_DATA[7] EMMC_DATA[6] EMMC_DATA[5] EMMC_DATA[4] EMMC_DATA[3] EMMC_DATA[2] EMMC_DATA[1] EMMC_DATA[0]

R169

AR101

R178 33

OPT

R179 10K

1/16W 5%

AG21

AJ18

AG30 AG28 AG29 AH29 AJ27 AH27 AG26 AH26

AJ12 AJ13 AH12 AG12

AH23 AG22

AH11 AG11

AG10

AH22 AJ22 AH10 AJ10 AG23 AH24

B23 A23

AB8 AC8

AD8 AE8

Y7 Y6 W7 W6 W5

AH7 AJ7

AG8 AH8

AH9 AG9

AJ9

AC6 AC7 AD7 AB7

G32 G33 G31 D31 F33 F32 E32 F31 D33 D32 E31

EMMC_DATA[0-7]

IC101

LG1311-C1

XIN_MAIN XO_MAIN

PORES_N

BOOT_MODE

PLLSET0 PLLSET1

OPM0 OPM1

L_VSOUT_LD/TRST0_N DIM0_SCLK/TMS0 DIM1_SCLK/TCK0 DIM1_MOSI/TDI0 DIM0_MOSI/TDO0

SPI_CS0 SPI_SCLK0 SPI_DO0 SPI_DI0/TRST1_N SPI_CS1/TMS1 SPI_SCLK1/TCK1 SPI_DO1/TDO1 SPI_DI1/TDI1

EXT_INTR0 EXT_INTR1 EXT_INTR2 EXT_INTR3

UART0_RXD UART0_TXD UART1_RXD UART1_TXD

UART1_RTS_N UART1_CTS_N

SCL0 SDA0 SCL1 SDA1 SCL2 SDA2 SCL3 SDA3 SCL4 SDA4 SCL5 SDA5

PWM0 PWM1 PWM2 PWM_IN

EMMC_CLK EMMC_CMD EMMC_RESETN EMMC_DATA7 EMMC_DATA6 EMMC_DATA5 EMMC_DATA4 EMMC_DATA3 EMMC_DATA2 EMMC_DATA1 EMMC_DATA0

USB2_0_DP0 USB2_0_DM0

USB2_0_TXRTUNE

USB2_1_DP0 USB2_1_DM0

USB2_1_TXRTUNE

USB3_DP0

USB3_DM0 USB3_TXP0 USB3_TXM0 USB3_RXP0 USB3_RXM0

USB3_RESREF0

USB3_DP1

USB3_DM1 USB3_TXP1 USB3_TXM1 USB3_RXP1 USB3_RXM1

USB3_RESREF1

HUB_PORT_OVER0 HUB_VBUS_CTRL0

EB_CS3 EB_CS2 EB_CS1 EB_CS0

EB_WE_N EB_OE_N

EB_WAIT EB_BE_N1 EB_BE_N0

CAM_CD1_N CAM_CD2_N CAM_CE1_N CAM_CE2_N

CAM_IREQ_N

CAM_RESET

CAM_INPACK_N

CAM_VCCEN_N

CAM_WAIT_N

CAM_REG_N

EB_ADDR0 EB_ADDR1 EB_ADDR2 EB_ADDR3 EB_ADDR4 EB_ADDR5 EB_ADDR6 EB_ADDR7 EB_ADDR8 EB_ADDR9

EB_ADDR10 EB_ADDR11 EB_ADDR12 EB_ADDR13 EB_ADDR14 EB_ADDR15

EB_DATA0 EB_DATA1 EB_DATA2 EB_DATA3 EB_DATA4 EB_DATA5 EB_DATA6 EB_DATA7

AN9 AM9 AN8

H32 J31 H33

N31 N32 P33 P32 M32 M33 P31

K33 K32 L32 L31 K31 J32 M31

W28 W29

H28 J30 J28 J29

G30 F30 H29 G29 G28

P28 P27 U28 R29 V27 T28 T29 R28 U27 N29

K30 E30 M30 N28 M28 M29 L29 K29 K28 L28 D30 F29 C32 C33 C31 B33

B32 A32 B31 A31 A30 B30 C30 C29

R1712001%

R1722001%

R1732001%

R1742001%

/USB_OCD1

/USB_OCD2 /USB_OCD3

EB_BE_N1 EB_BE_N0

CAM_IREQ_N CAM_INPACK_N CAM_WAIT_N

EB_ADDR[0] EB_ADDR[1] EB_ADDR[2] EB_ADDR[3] EB_ADDR[4] EB_ADDR[5] EB_ADDR[6] EB_ADDR[7] EB_ADDR[8]

EB_ADDR[9] EB_ADDR[10] EB_ADDR[11] EB_ADDR[12] EB_ADDR[13] EB_ADDR[14]

EB_DATA[0]

EB_DATA[1]

EB_DATA[2]

EB_DATA[3]

EB_DATA[4]

EB_DATA[5]

EB_DATA[6]

EB_DATA[7]

WIFI_DP WIFI_DM

USB_DP3 USB_DM3

USB_DP1 USB_DM1

USB_DP2 USB_DM2

USB_CTL1

USB_CTL2 USB_CTL3 EB_WE_N

EB_OE_N

R11033

10K

/PCM_CE1 /PCM_CE2

PCM_RESET PCM_5V_CTL CAM_REG_N

TP102

IC103-*2

BR24G256FJ-3

+3.3V_NORMAL

C107

0.1uF

16V

VCC

SCL

SDA

GND

NVRAM_ROHM

Write Protection

- Low : Normal Operation

- High : Write Protection AR105

EB_DATA[0-7]

TP103

EB_DATA[0-7]

Jtag-0 I/F

LOCAL DIMMING I2C CONTROL

+3.3V_NORMAL

P102

R106

OPT

3.3K

12507WS-04L

LED_SCL LED_SDA

R105

OPT

3.3K

12505WS-10A00

OPT

P103

JTAG_CPU

+3.3V_NORMAL

L/DIM0_VS

(TRST0_N)

TDI0

L/DIM0_MOSI

L/DIM0_SCLK

TCK0

SOC_RESET

FORCED_JTAG_0

(TDO0)

(TMS0)

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

M14-Peripheral

MID_LG1311

M14 Symbol A

2013.04.04 1

+ 59 hidden pages