Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec sheet is applied all of the LED TV with LJ55H
chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan whic al Unit: Product Specification Standard.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run).
Temperature : at 25 ºC±5
Relative humidity : 65 ± 10%
Input voltage : 100~220V, 50/60Hz
(6) Adjustment equipments : Color Analyzer (CA-210 or
CA-110), SVC remote controller
(7) Push The “IN STOP KEY” – For memory initialization.
Case1 : Software version up
1) After downloading S/W by USB , TV set will reboot
automatically
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In this case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool
Option again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push "OK" button.
(3) Punch in the number. (Each model has their number.)
(4) Completed selecting Tool option.
Tool
Tool
Tool
Tool
Tool
ModelModule
43LF5400-SA/
SB
49LF5400-SA/
SB
32LF550B-SDLGD32807116040323638413826273
49LF5500-SDLGD32814116040323638413826273
32LF565B-SELGD 32775320840323638413826273
32LF5650-SELGD32775320840323638413826273
39LF5600-SAINX3277732084032361613826273
50LF5650-SELGD32783320840323638413826273
50LF5650-SELGD32783320840323638413826273
55LF5600-SA
55LF5650-SE
60LB5650-SESharp11281320840323638412802273
40LF5700-SALGD34186320840323638412802273
43LF5700-SALGD33164320839043638413826273
32LF620B-SDLGD32871320881285276813826353
42LF6200-SDLGD32875320881285276813826353
49LF6200-SDLGD32878320881285276813826353
55LF6200-SDLGD32880320881285276813826353
43UF6750-SJLGD41388244036686363878706353
49UF6750-SJLGD41390244036686363878706353
55UF6700-SA
55UF6750-SJ
option1
option2
option3
option4
option5
LGD46011933904363849218273
LGD46211933904363849218273
CSOT39975116040323638412806273
BOE38951116040323638412806273
Sharp35879116040323638412806273
CSOT39943320840323638412806273
BOE38919320840323638412806273
Sharp35847320840323638412086273
BOE38919320840323638412802273
LGD32784
CSOT39952
LGD41392244036686363878706353
CSOT48560244036686363878722353
320840323638413826273
* RS-232C Connection Method
Connection : PCBA (USB Port) -> USB to Serial Adapter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
▪ Product name of USB to Serial Adapter is UC-232A.
※ Caution: LJ55H chassis support only UC-232A driver. (only
CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of
LED back light
■ Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
► The spec of color temperature and coordinate
ModelModeColor TempColor coordinateRemark
Cool (C50)13,000k
Medium (0)9,300k
All
Warm (W50)6,500k
► CA210 : CH 14, Test signal : Inner pattern (80IRE)
- Standard color coordinate and temperature using CA-1000 (by
H/R time)
▪ L15 LGD, INX Module
March to December & Global
Normal line (LF55/56/57/62, UF67)
H/R Time(Min)
271270286289313329
10-2282 289 297308324348
23-5281 287 296306323346
36-9279 284 294303321343
410-19277 280 292299319339
520-35275 277 290296317336
636-49274 274 289293316333
750-79273 272 288291315331
880-119272 271 287290314330
9Over 120271 270 286289313329
x = 0.271 (±0.002)
y = 0.270 (±0.002)
x = 0.286 (±0.002)
y = 0.289 (±0.002)
x = 0.313 (±0.002)
y = 0.329 (±0.002)
CoolMediumWarm
xyxxyx
※ Test signal
- Inner pattern for W/B adjust
- External white pattern
(80IRE, 204gray)
▪ Gumi Winter table(
January to February - Gumi production of prospective models all
models except Cinema Screen
Normal line (LF55/56/57/62, UF67)
CoolMediumWarm
H/R Time(Min)
10-2286 295 301314328354
23-5284 290 299309326349
36-9282 287 297306324346
410-19279 283 294302321342
520-35276 278 291297318337
636-49274 275 289294316334
750-79273 272 288291315331
880-119272 271 287290314330
9Over 120271 270 286289313329
▪
INX, AUO, Sharp, CSOT (13000K Cool the SPEC)
spec271270286289313329
target278280293299320339
xyxxyx
271270286289313329
coolmedwarm
xyxyxy
※ Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER-ON -> Enter
the mode of White-Balance, the pattern will come out.
▪ Aging chamber line (LF55/56/57/62, UF67)
CoolMediumWarm
H/R Time(Min)
10-5280 285 294308319340
26-10276 280 290 303 315 335
311-20272 275 286 298 311 330
421-30269 272 283 295 308 327
531-40267 268 281 291 306 323
641-50266 265 280 288 305 320
751-80265 263 279 286 304 318
881-119264 261 278 284 303 316
9Over 120264 260 278 283 303 315
Only for training and service purposes
xyxxyx
271270285293313329
● Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
CoolMidWarmCoolMidWarm
R GainjgJajd00172192192192
G GainjhJbje00172192192192
B GainjiJcjf00192192172192
R Cut646464128
G Cut646464128
B Cut646464128
MIN
CENTER
(DEFAULT)
MAX
*Manual W/B process using adjusts Remote control.(TBD)
■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■Enter White Balance by pushing “►” key at “8. White Balance”.
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu
8. White Balance, you can select one of 2 Test-pattern: ON,
OFF. Default is inner (ON). By selecting OFF, you can adjust
using RF signal in 206 Gray pattern.
※ CASE Cool
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
How to adjust
(1) If G gain is adjusted over 172 and R gain and B gain less
than 192 , Adjust is O.K.
(2) If G gain is less than 172 , increase G gain by up to 172,
and then increase R gain and B gain same amount of
increasing G gain.
(3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
■ For manual adjustment, it is also possible by the following
sequence.
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface
(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 206 Gray internal pattern will be
displayed.
(4) Adjust Cool modes
(i). Fix the one of R/G/B gain to 192 (default data) and
decrease the others
(If G gain is adjusted over 172 and R and B gain less than
192, increase G gain to 192 and increase R gain and B gain
same amount of increasing G gain.)
(ii). If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain.
(iii). If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255 or
B gain is 255
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
▪ After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is
correctly same then unplug the AC cable. If it is not same, then
correct it same with BOM and unplug AC cable. For correct it to
the model’s module from factory JIG model.
▪ Push the “IN STOP KEY” after completing the function
1) Please input 3D test pattern like below (HDMI mode NO.
872 , pattern No.83)
2) When 3D OSD appear automatically , then select OK
button.
3) Don’t wear a 3D Glasses, Check the picture like below
5. Local Dimming Function Check
(Only UF67)
Step1) Turn on TV.
Step2) Press “P-only” key, enter to power only mode and
escape the “P-only” Mode by pressing “Exit” key
Step3) Press “Tilt” key, entrance to Local Dimming mode.
Step4) At the Local Dimming mode, module Edge Backlight
moving Top to bottom Back light of module moving
Step5) confirm the Local Dimming mode
Step6) Press “Exit” key
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TP for CI slot
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORDPCM_A[11]
/PCM_IOWRCI_TS_DATA[1]
/PCM_CE
/PCM_IRQA
/PCM_CD
/PCM_WAIT
PCM_RST
PCM_5V_CTL
/CI_DET
TP for S2
PCM_D[0]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[12]
PCM_A[13]
PCM_A[14]
TP for FE_TS_DATA
CI_TS_CLK
CI_TS_VAL
CI_TS_SYNC
CI_TS_DATA[0]
CI_TS_DATA[2]
CI_TS_DATA[3]
CI_TS_DATA[4]
CI_TS_DATA[5]
CI_TS_DATA[6]
CI_TS_DATA[7]
TP for SCART
SCART1_MUTE
SC1_IDPCM_D[1]
SC1_FB
DTV/MNT_VOUT
SCART1_Lout
SCART1_Rout
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for Headphone
HP_LOUT
HP_ROUT
SIDE_HP_MUTE
HP_DET
TP for L15
/VBUS_EN
RGB_DDC_SCL
RGB_DDC_SDA
TU_GND_A
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1A
TP_NON_EU3
140702
Contents of Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes