LG 49LF5100-UA Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LA57A

MODEL : 49LF5100 49LF5100-UA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL69155702 (1507-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 8

BLOCK DIAGRAM ................................................................................. 14

EXPLODED VIEW .................................................................................. 15

SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX

TROUBLE SHOOTING GUIDE ................................................. APPENDIX

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

Always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. Carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used LA57A chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

No. Item Specication Remarks

1 Receiving System ATSC / NTSC-M / 64 QAM / 256 QAM North America

1) VHF : 02~13

2) UHF : 14~69

2 Available Channel

3 Input Voltage North America Mark : 110V, 60Hz (N.America)

4 Market North America

5 Screen Size

6 Aspect Ratio 16:9

7 Tuning System FS

8 Module

9 Operating Environment

10 Storage Environment

3) DTV : 02-69

4) CATV : 01~135

5) CADTV : 01~135

43 inch Wide (1920 × 1080) FHD / 60Hz LGD

49 inch Wide (1920 × 1080) FHD / 60Hz LGD

HC430DUN-SLNL1 43LF5100-UA

NC490DUE-SADP1 49LF5100-UA

1) Temp : 0 ~ 40 deg

2) Humidity : ~ 80 %

1) Temp. : -20 ~ 60 deg

2) Humidity : ~ 85%

Only for training and service purposes

- 6 -

5. Video resolutions

5.1. Component input(Y, CB/PB, CR/PR)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1 720*480 15.73 59.94 13.50 SDTV ,DVD 480I

2 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I

3 720*480 31.47 59.94 27.00 SDTV 480P

4 720*480 31.50 60.00 27.027 SDTV 480P

5 1280*720 44.96 59.94 74.176 HDTV 720P

6 1280*720 45.00 60.00 74.25 HDTV 720P

7 1920*1080 33.72 59.94 74.176 HDTV 1080I

8 1920*1080 33.75 60.00 74.25 HDTV 1080I

9 1920*1080 26.97 23.976 74.176 HDTV 1080P

10 1920*1080 27.00 24.00 74.25 HDTV 1080P

11 1920*1080 33.71 29.97 74.176 HDTV 1080P

12 1920*1080 33.75 30.00 74.25 HDTV 1080P

13 1920*1080 67.432 59.94 148.352 HDTV 1080P

14 1920*1080 67.50 60.00 148.50 HDTV 1080P

5.2. HDMI Input(PC/DTV)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

PC DDC

1 640*350 @70Hz 31.46 70.09 EGA X

2 720*400 @70Hz 31.46 70.08 DOS O

3 640*480 @60Hz 31.46 59.94 VESA(VGA) O

4 800*600 @60Hz 37.87 60.31 VESA(SVGA) O

5 1024*768 @60Hz 48.36 60.00 VESA(XGA) O

6 1152*864 @60Hz 54.34 60.05 VESA O

7 1280*1024 @60Hz 63.98 60.02 VESA (SXGA) O FHD only

8 1360*768 @60Hz 47.71 60.01 VESA (WXGA) O

9 1920*1080 @60Hz 67.5 60.00 WUXGA(CEA 861D) O FHD only

DTV

1 640*480 31.46 59.94 25.125 SDTV 480P

2 640*480 31.5 60.00 25.125 SDTV 480P

3 720*480 15.73 59.94 13.500 SDTV 480I

4 720*480 15.75 60.00 13.514 SDTV 480I

5 720*480 31.47 59.94 27.00 SDTV 480P

6 720*480 31.5 60.00 27.027 SDTV 480P

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 1280*720 45 60.00 74.25 HDTV 720P

9 1920*1080 33.72 59.94 74.176 HDTV 1080I

10 1920*1080 33.75 60.00 74.25 HDTV 1080I

11 1920*1080 26.97 23.97 74.176 HDTV 1080P

12 1920*1080 27.00 24.00 74.25 HDTV 1080P

13 1920*1080 33.71 29.97 74.176 HDTV 1080P

14 1920*1080 33.75 30.00 74.25 HDTV 1080P

15 1920*1080 67.43 59.94 148.352 HDTV 1080P

16 1920*1080 67.5 60.00 148.50 HDTV 1080P

Spec-Out.

(Just Display)

Spec-Out.

(Just Display)

Only for training and service purposes

- 7 -

ADJUSTMENT INSTRUCTION

(1)

(2)

(4)

(5)

1. Application Range

This specification sheet is applied to all of the LED TV with LA57A chassis.

2. Specification

(1) Because this is not a hot chassis, it is not necessary to

use an isolation transformer. However, the use of isolation

transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of

25 ±5 ºC of temperature and 65±10% of relative humidity if

there is no specific designation (4) The input voltage of the receiver must keep 100~240V,

50/60Hz (5) At first Worker must turn on the SET by using Power Only

key. (6) The receiver must be operated for about 5 minutes prior to

the adjustment when module is in the circumstance of over

15

ºC

In case of keeping module is in the circumstance of 0°C, it

should be placed in the circumstance of above 15°C for 2

hours In case of keeping module is in the circumstance of below

-20°C, it should be placed in the circumstance of above

15°C for 3 hours.

※ Caution When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area

4. MAIN PCBA Adjustments

* Download

(1) Execute ISP program “Mstar ISP Utility” and then click

“Config” tab.

(2) Set as below, and then click “Auto Detect” and check “OK”

message

If display “Error”, Check connect computer, jig, and set.

(3) Click “Connect” tab. If display “Can’t ”, Check connect

computer, jig, and set.

)

(3

OK

(4) Click “Read” tab, and then load download file(XXXX.bin)

by clicking “Read”

Please Check the Speed :

To use speed between from 200KHz to 400KHz

3. Adjustment items

(5) Click “Auto” tab and set as below (6) Click “Run”. (7) After downloading, check “OK” message.

3.1. Main PCBA Adjustments

(1) ADC adjustment : ADC adjustment is OTP (Auto ADC) (2) EDID download : HDMI

■ Above adjustment items can be also performed in Final

Assembly if needed. Both Board-level and Final assembly adjustment items can be check using In-Start Menu (1.Adjust Check).

(7) ……….OK

(6)

3.2. Final assembly adjustment

(1) White Balance adjustment (2) RS-232C functionality check (3) Factory Option setting per destination (4) Shipment mode setting (In-Stop) (5) GND and HI-POT test (6) AUDIO output check (7) EYE-Q function check

3.3. Appendix

(1) Shipment conditions (2) Tool option menu (3) USB Download (S/W Update, Option and Service only) (4) Preset CH Information

Only for training and service purposes

- 8 -

4.1. ADC Adjustment

HDMI2 : OK

10

01

19

01

03

80

A0

5A

78

0A

EE

91

A3

54

4C

99

26

20

40

45

00

40

84

63

00

1E

66

21

50

B0

51

00

1B

30

50

70

20

40

58

2C

04

05

40

84

63

00

1E

01

1D

80

18

71

70

00

08

00

20

0F

50

54

A1

08

00

31

40

45

40

61

40

71

40

81

80

30

01

02

3A

80

18

71

38

2D

40

58

2C

50

70

00

4C

47

20

54

56

0A

20

01

E6

60

4.1.1. ADC

▪ ADC adjustment is needed to find the optimum black level

and gain in Analog-to-Digital device and to compensate RGB deviation.

▪ ADC adjustment is OTP (Auto ADC)

4.2. EDID Download

4.2.1. Overview

- It is a VESA regulation. A PC or a MNT will display an optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.

4.2.2. Equipment

(1) Since EDID data is embedded, EDID download JIG, HDMI

cable is not need.

(2) Adjust by using remote controller.

4.2.6. EDID DATA

- 8BIT / FHD / PCM

EDID Block 0, Bytes 0-127 [00H-7FH]

 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F

00

00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01

0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80

30

01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C

40 70 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A

60

3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00 FC

00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 E6

EDID Block 1, Bytes 128-255 [80H-FFH]

 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F

00

02 03 19 F1 48 90 22 20 05 04 03 02 01 23

10

07 67 03 0C 00 10 00 80 1E 02 3A 80 18 71 38 2D

30

1C 16 20 58 2C 25 00 40 84 63 00 00 9E 01 1D 00

40

72 51 D0 1E 20 6E 28 55 00 40 84 63 00 00 1E 8C

50

0A D0 8A 20 E0 2D 10 10 3E 96 00 40 84 63 00 00

60

18

00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

09 57

4.2.3. Download method(using DFT)

* PC(for communication through RS-232C), UART baud rate:

115200 bps Command : aa 00 00 (Start Factory mode) Command : ae 00 10 (Download All EDID) Command : aa 00 90 (End of Factory mode)

4.2.4. Download method (using Service Remocon)

(1) Press Adj. key on the Adj. R/C. (2) Select EDID D/L menu. (3) By pressing Enter key, EDID download will begin (4) If Download is successful, OK is display, but If Download is

failure, NG is displayed. (5) If Download is failure, Re-try downloads. * Caution: When EDID Download, must remove HDMI Cable. (6) EDID Write confirmation

EDID D/L (PCM)

HDMI1 : OK

4.2.5. Models for EDID Data

Region

North America (PCM)

FHD / 8bit HDMI 2ea

43LF5100-UA 49LF5100-UA

- 8BIT / FHD / AC3

EDID Block 0, Bytes 0-127 [00H-7FH]

 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F

00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01

10

01 19 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26

40

45 00 40 84 63 00 00 1E 66 21 50 B0 51 00 1B 30

40 70 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A

60

3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00 FC

EDID Block 1, Bytes 128-255 [80H-FFH]

 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F

00

02 03 1C F1 48 90 22 20 05 04 03 02 01 26

10

50 09 57 07 67 03 0C 00 10 00 80 1E 02 3A 80 18

20

71 38 2D 40 58 2C 04 05 40 84 63 00 00 1E 01 1D

30

80 18 71 1C 16 20 58 2C 25 00 40 84 63 00 00 9E

40

01 1D 00 72 51 D0 1E 20 6E 28 55 00 40 84 63 00

50

00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 40 84

63 00 00 18 00 00 00 00 00 00 00 00 00 00 00 00

70

00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 96

15 07

- Checksum

PCM

not Deep Color, PCM

8Bit_FHD HDMI1 E6 08 HDMI2 E6 F8

AC3

not Deep Color, AC3 + PCM

8Bit_FHD HDMI1 E6 96 HDMI2 E6 86

Only for training and service purposes

4.3. Tool Option Input

- Input Model Tool Option according to BOM

- 9 -

5. Final Assembly Adjustment

* If TV internal pattern is used, not needed

5.1. White Balance Adjustment

5.1.1. Overview

5.1.1.1. W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel’s W/B deviation (2) How-it-works:

When R/G/B gain in the OSD is at 192, it means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.

(3) Adj. condition: normal temperature

- Surrounding Temperature: 25±5 ºC

- Warm-up time: About 5 Min

- Surrounding Humidity: 20% ~ 80%

- Before White balance adjustment, Keep power on status, don’t power off

5.1.4. Adjustment Command (Protocol)

(1) RS-232C Command used during auto-adj

RS-232C

COMMAND

CMD ID DATA

Wb 00 00 Begin White Balance adj.

Wb 00 ff End White Balance adj. (internal pattern disappears )

Ex) wb 00 00 -> Begin white balance auto-adj. wb 00 10 -> Gain adj. ja 00 ff -> Adj. data jb 00 c0 ... ... wb 00 1f -> Gain adj. complete *(wb 00 20(start), wb 00 2f(end)) -> Off-set adj. wb 00 ff ->End white balance auto adj.

Explanation

5.1.1.2. Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark surrounding.

(2) Probe location: Color Analyzer (CA-210) probe should be

within 10cm and perpendicular of the module surface (80°~ 100°)

(3) Aging time

- After Aging Start, Keep the Power ON status during 5 Minutes.

- In case of LCD, Back-light on should be checked using no signal or Full-white pattern.

5.1.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)

(2) Adj. Computer(During auto adj., RS-232C protocol is

needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/204-Gray

(Model:217, Pattern:49)

→ Only when internal pattern is not available

※ Color Analyzer Matrix should be calibrated using

CS-1000

5.1.3. Equipment connection

Color Analyzer

Probe

RS- 232C

Pattern Generator

Signal Source

RS-232C

Computer

RS-232C

(2) Adjustment Map

Cool

Medium

Warm

Adj. item

R Gain j g 00 C0 172 G Gain j h 00 C0 172 B Gain j i 00 C0 192 R Cut 128 G Cut 128 B Cut 128 R Gain j a 00 C0 192 G Gain j b 00 C0 192 B Gain j c 00 C0 192 R Cut 128 G Cut 128 B Cut 128 R Gain j d 00 C0 192 G Gain j e 00 C0 192 B Gain j f 00 C0 172

R Cut 128

G Cut 128

B Cut 128

Command

(lower caseASCII)

CMD1 CMD2 MIN MAX

Data Range

(Hex.)

Default

(Decimal)

5.1.5. Adjustment method

5.1.5.1. Auto WB calibration (1) Set TV in ADJ mode using P-ONLY key (or POWER ON

key)

(2) Place optical probe on the center of the display

- It need to check probe condition of zero calibration before

adjustment. (3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message,

check adjustment status of pre-set mode (Cool, Medium,

Warm) (6) Remove probe and RS-232C cable. * W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need.

When you connect the RS232 to set Phone jack, please use 3pin phone jack cable.

Only for training and service purposes

- 10 -

5.1.5.2. Manual adj. method (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface.

(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-

Balance then press the cursor to the right (KEY►).

(When KEY(►) is pressed 204 Gray(80IRE) internal

pattern will be displayed)

(4) One of R Gain / G Gain / B Gain should be fixed at 192,

and the rest will be lowered to meet the desired value.

(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of

color temperature.

* CASE First adjust the coordinate far away from the target value(x, y).

1. x, y > target

1) Decrease the R, G.

2. x, y < target

1) First decrease the B gain,

2) Decrease the one of the others.

3. x > target , y < target

1) First decrease B, so make y a little more than the target.

2) Adjust x value by decreasing the R

4. x < target, y > target

1) First decrease B, so make x a little more than the target.

2) Adjust x value by decreasing the G

► How to adjust

1.Fix G gain at least 172

Adjust R, B Gain ( In Case of Mostly Blue Gain Saturation)

2. When R or B Gain > 255, Release Fixed G Gain and

Readjust

* CASE Medium / Warm First adjust the coordinate far away from the target value(x, y).

1. x, y > target

1) Decrease the R, G.

2. x, y < target

1) First decrease the B gain,

2) Decrease the one of the others.

3. x > target, y < target

1) First decrease B, so make y a little more than the target.

2) Adjust x value by decreasing the R

4. x < target, y > target

1) First decrease B, so make x a little more than the target.

2) Adjust x value by decreasing the G

5.1.6. Reference (White Balance Adj. coordinate and color

temperature)

▪ Luminance: 204 Gray, 80IRE

** (normal line) Model : For LGD, March ~ December for

Gumi, Global

▪ Standard color coordinate and temperature using CA-210(CH

14) – by aging time

NC

Aging time

5.0

(Min)

1 0-2 282 289 297 308 324 348

2 3-5 281 287 296 306 323 346

3 6-9 279 284 294 303 321 343

4 10-19 277 280 292 299 319 339

5 20-35 275 277 290 296 317 336

6 36-49 274 274 289 293 316 333

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

**Model : For LGD, January ~ February for Gumi, Apply not

Cinema Screen

▪ Standard color coordinate and temperature using

CA-210(CH-14) – by aging time

NC

Aging time

5.0

(Min)

1 0-2 286 295 301 314 328 354

2 3-5 284 290 299 309 326 349

3 6-9 282 287 297 306 324 346

4 10-19 279 283 294 302 321 342

5 20-35 276 278 291 297 318 337

6 36-49 274 275 289 294 316 334

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

Cool Medium Warm

x y x y x y

271 270 286 289 313 329

Cool Medium Warm

x y x y x y

271 270 286 289 313 329

Only for training and service purposes

- 11 -

** For INX,AUO,SHARP,CSOT,BOE Module.( In the case of ,

the color temperature spec of cool mode is 13000K)

Cool med warm

x y x y x y

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

5.2. Tool Option setting & Inspection per

countries

5.2.1. Overview

(1) Tool option selection is only done for models in Non-USA

North America due to rating

(2) Applied model: LA57A Chassis applied to CANADA and

MEXICO

5.2.2. Country Group selection

(1) Press ADJ key on the Adj. R/C, and then select Country

Group Menu

(2) Depending on destination, select US, then on the lower

Country option, select US, CA, MX.

Selection is done using +, - KEY

(3) Using DFT(Auto)

* PC (for communication through RS-232C) -> UART Baud

rate : 115200 bps

- Command : ah 00 00 DATA(Area Number(hexadecimal))

ITEM

AREA OPTION1

DATA(Area Number) AREA 0 USA 1 CANADA 2 MEXICO

5.2.3. Tool Option Inspection

- Method : Press Adj. key on the Adj. R/C, then select Tool

option.

Model 43LF5100-UA 49LF5100-UA

2,3th Sufx US US

4th Sufx Y Y

Module LGD LGD

Tool 1 01808 02320 Tool 2 21506 21506 Tool 3 41100 41100 Tool 4 16384 16384

5.3. Ship-out mode check (In-stop)

▪ After final inspection, press In-Stop key of the Adj. R/C and

check that the unit goes to Stand-by mode.

6. GND and HI-POT Test

6.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition.

6.2. GND & HI-POT auto-check

(1) Pallet moves in the station.(POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process(Hi-pot test). (Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process automatically.

6.3. Checkpoint

(1) Test voltage

1) 3 Poles

- GND: 1.5 KV/min at 100 mA

- SIGNAL: 3 KV/min at 100 mA

2) 2 Poles

- SIGNAL: 3 KV/min at 100 mA (2) TEST time: 1 second (3) TEST POINT

1) 3 Poles

- GND Test = POWER CORD GND and SIGNAL

CABLE GND.

- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.

2) 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5 mArms

7. Audio

7.1. Audio input condition

(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation (2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)

Only for training and service purposes

7.2. Specification

Item Min Typ Max Unit Remark

Audio practical max

Output, L/R

(Distortion=10% max

Output)

- 12 -

4.5

6.0

5.0

6.3

6.0

6.9WVrms

(1) Measurement condition

EQ Off / AVL Off / Clear Voice Off

(2) Speaker (6Ω Impedance)

8. USB S/W Download(Service only)

(1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick

- If your downloaded program version in USB Stick is Lower, it didn’t work. But your downloaded version is Higher, USB data is automatically detecting (Download Version High & Power only mode, Set is automatically Download)

(3) Show the message “Copying files from memory”

(4) Updating is starting.

(5) Updating Completed, the TV will restart automatically. (6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If downloading version is more high than your TV have,

TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number)

Only for training and service purposes

- 13 -

BLOCK DIAGRAM

Only for training and service purposes

- 14 -

900

200

400

800

540

500

700

120

LV1

A2

701

A10

Set + Stand

901

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

Only for training and service purposes

- 15 -

<SOC_RESET>

LGE Internal Use Only

+3.3V_ST

C101

4.7uF 10V

C103

R104

0.1uF

470K

16V

<HW_OPTION>

+3.3V_NORMAL

R102

FHD

4.7K

OPT

HD

R101

4.7K

SUB_NVRAM_ROHM

IC100-*1

BR24G512FJ-3

A0

1

A1

2

A2

3

GND

4

EEPROM(512KB)

NVRAM_ATMEL

AT24C512C-SSHD-T

A0

1

A1

2

A2

3

GND

4

IC100

VCC

8

WP

7

SCL

6

SDA

5

VCC

8

WP

7

SCL

6

SDA

5

SERIAL FLASH(64MB)

R100 10K

/SPI_CS

/FLASH_WP

SPI_SDO

SOC_RESET

MODEL_OPT

C105

0.1uF 16V

OPT

OPT C104

C102

8pF

OPT

R105

4.7K

DO[IO1]

WP[IO2]

AR100 33 1/16W

W25Q64FVSSIG

CS

1

2

3

GND

4

R106

2.2K

IC101

+3.3V_ST

R107

2.2K

8

7

6

5

I2C_SCL I2C_SDA

+3.3V_ST

VCC

%HOLD[IO3]

CLK

DI[IO0]

/FLASH_WP

SOC_RESET

USB_DM

USB_DP

+3.3V_ST

LED_RED

+1.15V_VDDC

+1.8V_DDR

MODEL_OPT

PANEL_CTL

COMP_DET

AV_DET

DDC_SDA2 DDC_SCL2

5V_DET_HDMI1

POWER_ON/OFF

5V_DET_HDMI2

DDC_SDA1 DDC_SCL1

HPD1

+1.15V_VDDC

CK-_HDMI1

CK+_HDMI1

D0-_HDMI1

D0+_HDMI1

D1-_HDMI1

D1+_HDMI1

C106

0.1uF 16V

CEC/GPIO71

R103

IR

INT/GPIO64/I2S_OUT_MCK

100

AVDD_MOD_3

KEY1

KEY2

SAR0/GPIO75 SAR1/GPIO74 SAR2/GPIO73

VDDIO_DATA

R123 10K

R108 1K

AR102

33 1/16W

R126 10K

R127 10K

AR101 33 1/16W

SPI_SCK

SPI_SDI

IRIN

RESET DM_P0 DP_P0

VDDC_4

GPIO54 GPIO55 GPIO84

GPIO83 DDCDA_DAT DDCDA_CLK

GPIO67

GPIO70

GPIO86 DDCDB_DAT DDCDB_CLK HOTPLUG_B

EFUSE VDDC_5 RXCN_B RXCP_B RX0N_B RX0P_B RX1N_B RX1P_B

[EP]

AR103

4.7K 1/16W

97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128

+3.3V_ST

PM_TXD

PM_RXD

AR104 33 1/16W

DDCA_DA

DDCA_CK

TESTPIN

94

95

96

129

THERMAL

1

3

RX2N_B2RX2P_B

AVDD_MOD_1

D2-_HDMI1

D2+_HDMI1

+3.3V_ST

PWM_DIM

BLU_CURRENT_CTL

OPT

/SPI_CS

SPI_SCK

SPI_SDI

SPI_CZ

SPI_CK

92

93

C107

2.2uF

OPT

R111

10K

R110

1K

SPI_SDO

AR105 33

1/16W

PWM0/GPIO15

SPI_DO

SPI_DI

90

91

R119

1K

R124

4.7K

HPD2

I2C_SCL

GPIO0

HOTPLUG_A

PWM1/GPIO14

86

87

88

89

INV_CTL

I2C_SDA

GPIO2

GPIO1

84

85

[M1L] 128 PIN

IC102

MSD8222LUM

4

RXCN_A5RXCP_A6RX0N_A7RX0P_A8RX1N_A9RX1P_A10RX2N_A11RX2P_A12HSYNC0

CK-_HDMI2

CK+_HDMI2

D0+_HDMI2

D1-_HDMI2

D0-_HDMI2

D1+_HDMI2

D2-_HDMI2

13

BIN0P14GIN0P15GIN0M16RIN0P

D2+_HDMI2

R128

100

GPIO5

GPIO4

82

83

AMP_RESET

AR108

33

1/16W

GPIO6

81

AMP_SCL

RXB3+

RXB3-

AMP_SDA

LVB1M

LVB0P

LVB0M

GPIO7

78

79

80

17

18

19

BIN1P

VSYNC0

SOGIN1

AVDD3P3_ADC

25V

C110 0.047uF

R112 33

+3.3V_ST

COMP_Pb+

RXBCK+

RXBCK-

RXB2-

RXB2+

LVB2P

LVB2M

LVB1P

74

75

76

77

20

21

GIN1P22GIN1M23RIN1P24CVBS0

50V

25V

C111 1000pF

C113 0.047uF

C114 0.047uF

C112 0.047uF

R113 68

AR109 33

COMP_Y+

R114 33

COMP_Pr+

+3.3V_ST

RXB1-

RXB1+

LVB3M

LVBCLKP

LVBCLKM

AVDD_LPLL

71

72

73

25

26

VCOM

VDDC_1

CVBS_OUT1

25V

TP101

C117 0.047uF

R116 180

R115 150 C115 0.047uF

COMP_Y+

RXB0+

RXB0-

GPIO28

LVB3P

68

69

70

27

28

29

AVDD_AU33

LINEIN_R0

C1232.2uF

+3.3V_ST

+1.15V_VDDC

COMP_R_IN

RXA3-

RXA3+

LVA0P

LVA0M

GPIO29

65

66

67

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33

30

31

32

LINEIN_L0

LINEIN_R1

LINEIN_L1

C124

2.2uF

10V

COMP_L_IN

LVA1M LVA1P LVA2M LVA2P LVACLKM LVACLKP LVA3M LVA3P GPIO53/I2S_OUT_SD GPIO52/I2S_OUT_BCK GPIO51/I2S_OUT_MCK GPIO50/I2S_OUT_WS GPIO49/SPDIF_OUT GPIO47

TP102

RXACK-

RXACK+

RXA2-

RXA2+

RXA1-

RXA1+

RXA0-

RXA0+

AUD_LRCH

AUD_SCK

AUD_MASTER_CLK

AUD_LRCK

AR110 1/16W 100

GPIO46 GPIO45/I2C_SCLM/UART_RX1 GPIO44/I2C_SDAM/UART_TX1 VDDC_3 VDDC_2 VDDIO_CMD AVDD_MOD_2 XTAL_OUT

+1.15V_VDDC

+1.8V_DDR

+3.3V_ST

XTAL_IN AVDD3P3_DMPLL AVDD3P3_DADC VIFM VIFP IFAGC LINEOUT_R3

R117

R118

0

+3.3V_ST

C134

0.1uF 16V

C142 0.1uF 16V

C153 33pF

LINEOUT_L3 VRM_ADC VAG

C149

0.1uF

C128

0.1uF 16V

C133 10uF

6.3V L103

PZ1608U121-2R0TF

16V

R120 10K

+3.3V_ST

+1.8V_DDR

USB_CTL USB_OCD

TU_SCL

TU_SDA

C154

33pF

Closed to SoC

+3.3V_NORMAL

L109 PZ1608U121-2R0TF

R121 100

C150

0.047uF 25V

Close to MSTAR

+1.15V_VDDC

C120

10uF

6.3V

C118

10uF

6.3V

IF_N_MSTAR

IF_P_MSTAR

C121 10uF

6.3V

AVDD_MOD

C132

C131

0.1uF

C127

1uF 10V

C126

1uF 10V

DDR_CMD DDR_DATA

C119

OPT

0.1uF C125

16V

0.1uF 16V

R122 1M

Closed to SoC

IF_AGC_MAIN

16V

C130

0.1uF 16V

C129

0.1uF 16V

X101

24MHz

X-TAL_1

1

4

GND_13X-TAL_2

2

C139

C137

0.1uF 16V

GND_2

0.1uF 16V

C135

10uF

6.3V

C151

8pF

C152

C138

0.1uF 16V

8pF

C140

0.1uF 16V

C136

0.1uF 16V

C141

0.1uF 16V

+3.3V_ST

AVDD_DADC

C147

0.1uF 16V

AVDD_AU33

AVDD_DMPLL

AVDD_VIDEO

AVDD_LPLL

Closed to Main SoC Each Pin

C146

0.1uF 16V

C145

0.1uF 16V

C144

0.1uF 16V

C108

0.1uF 16V

C155

0.1uF 16V

C156

0.1uF 16V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

MAIN

141215L15.5_M1L128P

1

6

L15.5 NA POWER BLOCK

LGE Internal Use Only

JK201

KJA-DC-1-0032

4

2

1

4

2

1

+19V

Surge protection

D605

20V

+3.3V_STANBY

+19V to +3.3V_STANDBY

R202

AAM

47K

IN

C203 68uF 35V

C204 10uF 25V

C205

0.1uF 25V

SW

GND

IC203

MP2315GJ

1

2

NEW

3

3A

4

8

7

6

5

FB

VCC

EN/SYNC

BST

0.1uF

R205

C209

20130528 cJ.LIM

68

50V

R207 100K

R208

+3.3V_ST to +3.3V_NORMAL

+3.3V_ST

R225 10K

ADJ/GND

R232 22K

R233

2.2K

C

TR_NXP Q203

B

MMBT3904(NXP)

E

OUT

R236

330

R1

1%

R237 150

R2

1%

R224

4.7K

R213 56K

DEV_COIL

L202

4.7uH

C238

C224

C218

C215

10uF

10V

C212

0.1uF

20K

25V

10V

X5R => X7R

To improve CST Issue

2013.12.21 by GH.Song

22uF 10V

0.1uF 25V

R21 6

R21 4

R21 5

1.2 K

+3.3V_ST

2013.08.07

ZD202

2K

1%

1K 1%

5.6B->5V

5V

OPT->APPLY

+12V to PANEL_VCC

+12V

L203

UBW2012-121F

120OHM

PANEL_CTL

OPT

C241

0.1uF 25V

R217

10K

R218

10K

B

R219

R220 120K

33K

C

TR_NXP Q201 MMBT3904(NXP)

E

C242

0.22uF 25V

Q202

SSM3J332R

S

B

PANEL_VCC

D

R221

R222

5.6K

G

C

TR_KEC Q201-*1 2N3904S

E

POWER_ON/OFF

+3.3V_NORMAL

+1.8V_DDR

IC204

AZ1117EH-ADJTRG1

IN

C243 10uF

6.3V

C244

2.2uF 10V

FET_TOSHIBA

Q204 SSM3J332R

S

BOOST_EN

C245 10uF

6.3V

FET_AOS Q204-*1

B

AO3435

S

G

D

C246

G

0.1uF

+1.8V_DDR

ZD205

2.5V

D

L204

BLM18PG121SN1D

16V

C

TR_KEC

Q203-*1 2N3904S

E

C247 22uF 10V

C248 10uF 10V

+3.3V_NORMAL

OPT C249

10uF 10V

TVS_SEMTECH

ZD206

5V

TVS_KEC ZD206-*1

Vout=1.25*(1+R2/R1)+I(ADJ)XR2

+19V

19V TO PANEL VCC(12V) DCDC CONVERTER

R201

AAM

100K

IN

C201 10uF

25V

C202

0.1uF 25V

SW

GND

IC201

MP2315GJ

1

2

NEW

3

3A

4

8

7

6

5

FB

VCC

EN/SYNC

BST

+12V

20130528 cJ.LIM

R203 68

C206

0.1uF 50V

C207

0.47uF

OPT

R204

47K

+5V_Normal & +1.15V_VDDC

R206

C208

0.1uF 25V

10K

OPT

16V

DEV_COIL

L201

10uH

C210 10uF

16V

POWER_ON/OFF

C213

C211

10uF

16V

C214

0.1uF 25V

R209

56K

R21 0

R21 1

3.3 K

R21 2

1%

+12V

** 3.3V_ST -> 1.15V VDDC

+3.3V_ST

AP7173-SPG-13 HF(DIODES)

R239

R240

1

11K

1%

1K

15V

C223

0.1uF 16V

OPT

ZD201

1/4W

C226 10uF

1

1/4W

10V

R226

10K

IN

1

PG

2

VCC

3

EN

4

V0 = 0.8*(1+(R2/R1))

IC202

[EP]

OUT

8

FB

9

7

THERMAL

560pF

SS

6

GND

5

C222

50V

R234

3K

1%

R230

6.8K

1%

+1.15V_VDDC

R2

C228 10uF 10V

R1

C216 10uF 10V

OPT

C217 10uF 10V

OPT ZD203

2.5V

Add for improving main IC burnt issue

** 3.3V_M -> 1.8V_M

+19V

C219

2.2uF 25V

C221

0.1uF 50V

R227 47K

AAM

GND

IN

SW

IC205

MP2315GJ

1

2

MPS

3

3A

4

8

7

6

5

FB

VCC

EN/SYNC

BST

R231

C225

0.1uF 50V

68

+3.3V_NORMAL

R223

10K

R235

10K

C220

0.1uF 16V

C227

0.1uF

R238

56K

L206

4.7uH

C232 10uF

C233

0.1uF

10V

C230 10uF

16V

10V

+5V_NORMAL

R24 2

820

16V

R24 3

4.7 K

R24 4

1%

1K 1%

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L15.5_M1L128P

POWER

141215 2 6

AUDIO AMP(TI)/LVDS/IR

LGE Internal Use Only

IR

+3.3V_ST

[51Pin LVDS Connector] (For FHD 60Hz)

FHD P300

SP14-11592-01-51Pin

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

R300 0

R320 0

OPT

OPT AR300

0

C300 10uF

16V

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

RXA0+

RXA0-

RXA1+

RXA1-

RXA2+

RXA2-

RXACK+

RXACK-

RXA3+

RXA3-

RXB0+

RXB0-

RXB1+

RXB1-

RXB2+

RXB2-

RXBCK+

RXBCK-

RXB3+

RXB3-

PANEL_VCC

L300

UBW2012-121F

HD_PANEL_VCC

C301

0.1uF 16V

[30Pin LVDS Connector] (For HD 60Hz_Normal)

OPT

P301

10031HR-30

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Separate DGND AND AVSS

R303

0

1/16W

AMP_SDA

AMP_SCL

RXA0+

RXA0-

RXA1+

RXA1-

RXA2+

RXA2-

RXACK+

RXACK-

RXA3+

RXA3-

HD_PANEL_VCC

+3.3V_NORMAL

R305

4.7K

C302

1000pF

50V

AUD_MASTER_CLK

+3.3V_NORMAL

AR301

4.7K 1/16W

+19V

OPT

C345

0.1uF 50V

AUD_LRCK

AUD_SCK

AUD_LRCH

AMP_RESET

L301

120OHM

+19V_AMP

C307

0.1uF 50V

+3.3V_NORMAL

C305

0.1uF 16V

This parts are Located on AVSS area.

C313

4700pF

C311

4700pF

C310

R310

0.047uF

470

AVDD

R309 2.2K

R308 18K 1%

C309

0.1uF 16V

C308

0.1uF 16V

A_SEL_FAULT

MCLK

OSC_RES

DVSSO

VR_DIG

LRCLK

SCLK SDIN

13 14 15 16 17 18

PDN

19 20 21 22

SDA

23

SCL

24

+3.3V_NORMAL

OPT

ZD300

5V

R311

470

C314

0.047uF

VR_ANA

11

12

25

RESET26STEST

C315

2200pF

PLL_FLTM

PLL_FLTP

10

IC300

TAS5733

27

DVDD28DVSS

C316

0.1uF

C312

0.1uF 16V

16V

50V

29

GND

NC_28PBTL9AVSS

7

30

AGND31VREG

C318

0.033uF 50V

BST_A5NC_16SSTIMER

4

32

33

BST_D

GVDD_OUT

C317

1uF 16V

C320

0.1uF 50V

PVDD_AB_1

PVDD_AB_2

OUT_A

1

2

3

48

THE RMAL

47 46

49

45 44 43 42 41 40 39 38 37

34

36

OUT_D

PVDD_CD_135PVDD_CD_2

C319

0.033uF 50V

+19V_AMP

[EP] PGND_AB_2 PGND_AB_1 OUT_B NC_6 NC_5 BST_B BST_C NC_4 NC_3 OUT_C PGND_CD_2 PGND_CD_1

+19V_AMP

C321

0.1uF 50V

AUDIO AMP(TI)

R312

1/16W

18

1%

C326 330pF

C322 10uF 25V

C323 10uF 25V

50V

C327 330pF 50V

R313181/16W

1%

C324

0.033uF 50V

C325

0.033uF 50V

R314

1/16W

18

1%

C328 330pF 50V

C329 330pF 50V

R315181/16W

1%

DEV_COIL

L304 10uH

DEV_COIL

L306 10uH

DEV_COIL

L303 10uH

DEV_COIL

L305 10uH

KEY1 KEY2

PZ1608U121-2R0TF

LED_RED

C330

0.33uF 50V

C331

0.33uF 50V

AR502 10K 1/16W

C337

0.1uF

L307

C335

0.1uF

VR300

C332

0.1uF 50V

C333

0.1uF 50V

C334

0.1uF 50V

C340

0.1uF 50V

OPT

16V

OPT

+3.3V_ST

C336

1000pF

R325 100

50V

OPT

VR301

IR

+3.3V_ST

OPT

R322

3.3K

C339

OPT

100pF

VR303

50V

Close to Speaker

OPT C341 2200pF 50V

OPT C342 2200pF 50V

OPT C343 2200pF 50V

OPT C344 2200pF 50V

SPK_L+

SPEAKER_L

SPK_L-

SPK_R+

SPEAKER_R

SPK_R-

SPK_L+

SPK_L-

SPK_R+

SPK_R-

P303

12507WR-06L

1

2

3

4

5

6

7

250A1-WR-H04M

4

3

2

1

SPK Wafer Box Type

P304

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L15.5_M1L128P

LVDS/S_AMP/IR

141215

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