LG 49LB6200-SD-SJ Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LJ43B

MODEL : 49LB6200 49LB6200-SD/SJ

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL67981610 (1401-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 4

ADJUSTMENT INSTRUCTION .............................................................. 10

BLOCK DIAGRAM .................................................................................. 17

EXPLODED VIEW .................................................................................. 18

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This spec sheet is applied all of the 32”, 39”, 42”, 47”, 50”, 55”, 60" LED TV with LJ43B chassis

2. Test condition

Each part is tested as below without special notice.

1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage Standard input voltage (100~240V@ 50/60Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.

5) The receiver must be operated for about 20 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC: CE, IEC

4. General Specification

No Item Specication Measurement Result Remark

1. Receiving System 1) SBTVD / NTSC / PAL-M / PAL-N

2. Available Channel 1) VHF : 02~13

2) UHF : 14~69

3) CATV : 01~135

3. Input Voltage 1) AC 100 ~ 240V 50/60Hz

4. Market Central and South AMERICA

5. Screen Size 32 inch Wide (1366 × 768) 32LB550B-SD 32LB561B-SC 32LB560B-SA 32LB620B-SD 32LB560B-SE

32 inch Wide (1920 × 1080) 32LB5600-SB

39 inch Wide (1920 × 1080) 39LB5610-SC

39LB5600-SB 39LB5610-SC

42 inch Wide (1920 × 1080) 42LB5500-SD

42LB5600-SB 42LB5610-SC 42LB6200-SD/SJ 42LB6200-SE

47 inch Wide (1920 × 1080) 47LB5600-SB

47LB5610-SC

49 inch Wide (1920 × 1080) 49LB5500-SD

49LB6200-SD/SJ 49LB6200-SE

50 inch Wide (1920 × 1080) 50LB5600-SB

50LB5610-SC

55 inch Wide (1920 × 1080) 55LB5600-SB

55LB5610-SC 55LB6200-SD/SJ 55LB6200-SE

60 inch Wide (1920 × 1080) 60LB5610-SC

Only for training and service purposes

- 6 -

No Item Specication Measurement Result Remark

6. Aspect Ratio 16:9

7. Tuning System FS

8. Module LC320DXE-FGA6 HD, 60Hz LGD 32LB550B-SF

LC420DUE-FGA6 FHD, 60Hz LGD 42LB5500-SF

LC490DUE-FGA6 FHD, 60Hz LGD 49LB5500-SF

HC320DXN-ABHS1 HD, 60Hz BOE 32LB561B-SC

LC320DXE-FGA3 LGD

NC320DXN-VSBP1 SHARP

LC320DXE-FGA4 HD, 60Hz LGD 32LB560B-SA

LC320DUE-FGA4 FHD, 60Hz LGD 32LB5600-SB

NC390DUN-VXBP1 FHD, 60Hz INX 39LB5600-SB

39LB5610-SC

LC420DUE-FGA4 FHD, 60Hz LGD 42LB5600-SB

LC420DUE-FGA3 FHD, 60Hz LGD 42LB5610-SC

T420HVF07.0 FHD, 60Hz AUO 42LB5610-SC

LC470DUE-FGA4 FHD, 60Hz LGD 47LB5600-SB

LC470DUE-FGA3 FHD, 60Hz LGD 47LB5610-SC

NC500DUN-SXBP1 FHD, 60Hz INX

LC500DUE-FGA4 FHD, 60Hz LGD

LC550DUE-FGA4 FHD, 60Hz LGD 55LB5600-SB

LC550DUE-FGA3 FHD, 60Hz LGD 55LB5610-SC

T550HVF04.1 FHD, 60Hz AUO 55LB5610-SC

HC600DUF-VHHS1 FHD, 60Hz 60LB5610-SC

LC320DXE-FGP2 FHD, 60Hz LGD 32LB620B-SD

LC420DUE-FGP2 FHD, 60Hz LGD 42LB6200-SD/SJ

LC490DUE-FGP2 FHD, 60Hz LGD 49LB6200-SD/SJ

9. Operating Environment 1) Temp : 0 ~ 40 deg

2) Humidity : ~ 80 %

10. Storage Environment 1) Temp : -20 ~ 60 deg

2) Humidity : ~ 85 %

50LB5600-SB 50LB5610-SC

32LB620B-SF

42LB6200-SE

49LB6200-SF

Only for training and service purposes

- 7 -

5. External Input Support Format

5.1. Component input(Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

1. 720*576 15.625 50.000 13.5 SDTV 576I

2. 720*480 15.73 60 13.5135 SDTV ,DVD 480I

3. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I

4. 720*480 31.50 60 27.027 SDTV 480P

5. 720*480 31.47 59.94 27.0 SDTV 480P

6. 720*576 31.250 50.000 27.000 SDTV 576P

7. 1280*720 37.500 50.000 74.25 HDTV 720P

8. 1280*720 45.00 60.00 74.25 HDTV 720P

9. 1280*720 44.96 59.94 74.176 HDTV 720P

10. 1920*1080 28.125 50.00 74.250 HDTV 1080I

11. 1920*1080 33.75 60.00 74.25 HDTV 1080I

12. 1920*1080 33.72 59.94 74.176 HDTV 1080I

13. 1920*1080 56.250 50.00 148.50 HDTV 1080P

14. 1920*1080 67.500 60.00 148.50 HDTV 1080P

15. 1920*1080 67.432 59.939 148.352 HDTV 1080P

16. 1920*1080 27.000 24.000 74.25 HDTV 1080P

17. 1920*1080 26.97 23.976 74.176 HDTV 1080P

18. 1920*1080 33.75 30.000 74.25 HDTV 1080P

19. 1920*1080 33.71 29.97 74.176 HDTV 1080P

Only for training and service purposes

- 8 -

5.2. HDMI Input (PC/DTV)

*HDMI PC support only Rear HDMI Input *If use DVI to HDMI cable for PC, you have to use external SPK for PC audio sound.

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

PC DDC

1. 640*350 31.468 70.09 25.17 EGA X

2. 720*400 31.469 70.08 28.32 DOS O

3. 640*480 31.469 59.94 25.17 VESA(VGA) O

4. 800*600 37.879 60.31 40.00 VESA(SVGA) O

5. 1024*768 48.363 60.00 65.00 VESA(XGA) O

6. 1152*864 54.348 60.053 80.00 VESA O

7. 1360*768 47.712 60.015 85.50 VESA (WXGA) O

8. 1280*1024(FHD Only) 63.981 60.02 108.00 VESA (SXGA) O

9. 1920*1080(FHD Only) 67.5 60 148.5 HDTV 1080P O

DTV

1. 720*480 31.469 59.940 27.000 SDTV 480P

2. 720*480 31.500 60.000 27.027 SDTV 480P

3. 720*576 31.250 50.000 27.000 SDTV 576P

4. 1280*720 37.500 50.000 74.25 HDTV 720P

5. 1280*720 45.00 60.00 74.25 HDTV 720P

6. 1280*720 44.96 59.94 74.176 HDTV 720P

7. 1920*1080 28.125 50.000 74.25 HDTV 1080I

8. 1920*1080 33.75 60.00 74.25 HDTV 1080I

9. 1920*1080 33.72 59.94 74.176 HDTV 1080I

10. 1920*1080 56.250 50.000 148.50 HDTV 1080P

11. 1920*1080 67.500 60.00 148.50 HDTV 1080P

12. 1920*1080 67.432 59.94 148.352 HDTV 1080P

13. 1920*1080 27.000 24.000 74.25 HDTV 1080P

14. 1920*1080 26.97 23.976 74.176 HDTV 1080P

15. 1920*1080 33.75 30.00 74.25 HDTV 1080P

16. 1920*1080 33.71 29.97 74.176 HDTV 1080P

※ HDMI Monitor Range Limits Min Vertical Freq - 58 Hz Max Vertical Freq - 62 Hz Min Horiz. Freq - 30 kHz Max Horiz. Freq - 83 kHz Pixel Clock - 160 MHz

Only for training and service purposes

- 9 -

ADJUSTMENT INSTRUCTION

1. Application

This spec sheet is applied all of the LED TV with LJ43B, chassis.

2. Designation

(1) Th e adju stment is ac cordi ng to the order which is

designated and which must be followed, according to the

plan whic al Unit: Product Specification Standard. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation: Above 5 Minutes (Heat Run). Temperature : at 25 ºC±5 Relative humidity : 65 ± 10% Input voltage : 100~220V, 50/60Hz (6) Adjustment equipments : Color Analyzer (CA-210 or

CA-110), SVC remote controller (7) Push The “IN STOP KEY” – For memory initialization.

Case1 : Software version up

1) After downloading S/W by USB , TV set will reboot automatically

2) Push “In-stop” key

3) Push “Power on” key

4) Function inspection

5) After function inspection, Push “In-stop” key.

ºC

3. Main PCB check process

* APC – After Manual-Insert, executing APC * Boot file Download

(1) Execute ISP program “Mstar ISP Utility” and then click

“Config” tab.

(2) Set as below, and then click “Auto Detect” and check “OK”

message.

If “Error ” i s d is pl ayed, Check co nn ection betwe en

computer, jig, and set.

(3) Click “Read” tab, and then load download file (XXXX.bin)

by clicking “Read”

(1)

filexxx.bin

(4) Click “Connect” tab. If “Can’t ” is displaye d, Check

connection between computer, jig, and set.

(2)

(3)

Case2 : Function check at the assembly line

1) When TV set is entering on the assembly line, Push

“In-stop” key at first.

2) Push “Power on” key for turning it on.

=> If you push “Power on” key, TV set will recover channel

information by itself.

3).After function inspection, Push “In-stop” key.

Please Check the Speed

To use speed between

from 200KHz to 400KHz

(5) Click “Auto” tab and set as below. (6) Click “Run”. (7) After downloading, check “OK” message.

(4)

filexxx.bin

(5)

(7)...........OK

(6)

Only for training and service purposes

- 10 -

* USB DOWNLOAD(*.epk file download)

(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.

- If your downloaded program version in USB Stick is Low, it didn't work. But your downloaded version is High, USB data is automatically detecting

(3) Show the message "Copying files from memory"

(4) Updating is staring.

* After downloading, have to adjust Tool

Option again.

(1) Push "IN-START" key in service remote controller. (2) Select "Tool Option 1" and Push "OK" button. (3) Punch in the number. (Each model has their number.) (4) Completed selecting Tool option.

Tool

Model Module

32LB550B-SF LGD /

42LB5500-SF LGD 23 2440 16129 14184 55298 273

49LB5500-SF LGD 2440 16129 14184 55298 273

32LB560B-SA 32LB561B-SC

32LB5600-SA LGD 4 2440 16129 14184 55298 273

39LB5600-

SA/SB

39LB5610-SC

42LB5600-SB 42LB5610-SC

47LB5600-SB 47LB5610-SC

50LB5600-SB 50LB5610-SC

55LB5600-SB 55LB5610-SC

32LB620B-SD LGD

32LB620B-SF

42LB6200-SD 42LB6200-SE

49LB6200-SD 49LB6200-SF

SHARP

CSOT /

option1

option2

option3

option4

option5

20 /

2440 16129 14184

6164

LGD /

Sharp

INX 2054 2440 16129 14184 51210 273

LGD /

AUO

LGD 8 2440 16129 14184 55298 273

INX / LGD

LGD /

AUO

LGD 23 2440 32513 46952 55298 273

LGD

4 /

14340 /

6148

7 /

4103

2057 /

9

10 /

4106

2440 16129 14184

55298 /

51202

55298 / 51202 /

51202

55298 /

51202

51210 /

55298

55298 /

51202

Tool

option6

273

(5) After updating is complete, The TV will restart automatically. (6) If TV turns on, check your updated version and Tool option.

(refer to the next page about tool option)

* If downloading version is higher than your TV have, TV

can lost all channel data. In thi s case, you have to channel recover. If all channel data is cleared, you didn't have a DTV/ATV test on production line.

Only for training and service purposes

* RS-232C Connection Method Connection : PCBA (USB Port) -> USB to Se ri al Ada pter

(UC-232A) -> RS-232C cable -> PC(RS-232C port)

▪ Product name of USB to Serial Adapter is UC-232A.

※ Caution: LJ43* chassis support only UC-232A driver. (only use

this one. )

- 11 -

4. Total Assembly line process

4.1. Adjustment Preparation

■ W/B Equipment condition

CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of

LED back light

■ Above 5 minutes H/run in the inner pattern. (“power on” key of

adjust remote control)

► The spec of color temperature and coordinate

Model Mode Color Temp Color coordinate Remark

Cool (C50) 13,000k

Medium (0) 9,300k

All

Warm (W50) 6,500k

► CA210 : CH 14, Test signal : Inner pattern (80IRE)

- Standard color coordinate and temperature using CA-1000 (by H/R time)

▪ L14 LGD, INX Module

March to December & Global Normal line (LB5500, LB5600)

H/R Time(Min)

271 270 285 293 313 329

1 0-2 281 285 295 308 323 344

2 3-5 280 284 294 307 322 343

3 6-9 279 282 293 305 321 341

4 10-19 277 279 291 302 319 338

5 20-35 275 275 289 298 317 334

6 36-49 273 273 287 296 315 332

7 50-79 272 272 286 295 314 331

8 80-119 271 270 285 293 313 329

9 Over 120 271 270 285 293 313 329

▪ Aging chamber line (LB5500, LB5600)

H/R Time(Min)

271 270 285 293 313 329

1 0-5 280 285 294 308 319 340

2 6-10 276 280 290 303 315 335

3 11-20 272 275 286 298 311 330

4 21-30 269 272 283 295 308 327

5 31-40 267 268 281 291 306 323

6 41-50 266 265 280 288 305 320

7 51-80 265 263 279 286 304 318

8 81-119 264 261 278 284 303 316

9 Over 120 264 260 278 283 303 315

x = 0.271 (±0.002) y = 0.270 (±0.002)

x = 0.286 (±0.002) y = 0.289 (±0.002)

x = 0.313 (±0.002) y = 0.329 (±0.002)

Cool Medium Warm

x y x x y x

Cool Medium Warm

x y x x y x

※ Test signal

- Inner pattern for W/B adjust

- External white pattern (80IRE, 204gray)

※ Connecting picture of the measuring instrument (On Automatic control)

Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER-ON -> Enter the mode of White-Balance, the pattern will come out.

● Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (Illumination is less than 10ux).

(2) Adhere closely the Color Analyzer ( CA210 ) to the module

less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°).

(3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.

● Auto adjustment Map(RS-232C)

RS-232C COMMAND [ CMD ID DATA ] Wb 00 00 White Balance Start Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

MIN

CENTER

(DEFAULT)

MAX

Only for training and service purposes

- 12 -

*Manual W/B process using adjusts Remote control.(TBD)

■ Color analy zer(C A100+, CA210 ) sh ould be use d in the

calibrated ch by CS-1000

■ Operate the zero-calibration of the CA100+ or CA-210, then

stick sensor to the module when adjusting.

■ After enter Service Mode by pushing “ADJ” key,

■Enter White Balance by pushing “►” key at “8. White Balance”.

■ For manual adjustment, it is also possible by the following

sequence. (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface

(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-

Balance then press the cursor to the right (KEY►). When KEY(►) is pressed 206 Gray internal pattern will be displayed.

(4) Adjust Cool modes (i). Fix the one of R/G/B gain to 192 (default data) and decrease

the others

(If G gain is adjusted over 172 and R and B gain less than

192, increase G gain to 192 and increase R gain and B gain

same amount of increasing G gain.) (ii). If G gain is less than 172, Increase G gain by up to 172, and then increase R gain and

G gain same amount of increasing G gain. (iii). If R gain or B gain is over 255, Readjust G gain less than 172, Conform to R gain is 255 or B

gain is 255 (5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain

to 192 (default data) and decrease the others.

(6) Adj. is completed, Exit adjust mode using “EXIT” key on

Remote controller.

※ CASE Cool First adjust the coordinate far away from the target value(x, y). (1) x, y > target i) Decrease the R, G. (2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. (3) x > target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G

How to adjust (1) If G gain is adjusted over 172 and R gain and B gain less

than 192 , Adjust is O.K.

(2) If G gain is less than 172 , increase G gain by up to 172,

and then increase R gain and B gain same amount of increasing G gain.

(3) If R gain or B gain is over 255 , Readjust G gain less than

172, Conform to R gain is 255 or B gain is 255

※ CASE Medium / Warm First adjust the coordinate far away from the target value(x, y). (1) x, y > target i) Decrease the R, G. (2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. (3) x > target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G

▪ After You finish all adjustments, Press “In-start” button and

compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.

▪ Push the “IN STO P KE Y” after completing the func tion

inspection.

▪ If internal pattern is not available, use RF input. In EZ Adj. menu

8. White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner (ON). By selecting OFF, you can adjust using RF signal in 206 Gray pattern.

Only for training and service purposes

- 13 -

4.2. DPM operation confirmation (Only Apply for MNT Model)

Check if Power LED Color and Power Consumption operate as standard.

■ Set Input to RGB and connect D-sub cable to set

■ Measurement Condition: (100~240V@ 50/60Hz)

■ Confirm DPM operation at the state of screen without Signal

4.3. DDC EDID Write (HDMI 256Byte)

■ Connect HDMI Signal Cable to HDMI Jack.

■ Write EDID DATA to EEPROM(24C02) by using DDC2B

protocol.

■ Check whether written EDID data is correct or not.

* For SVC Ass’y, EDID have to be downloaded.

4.4. EDID DATA

1) All Data : HEXA Value

2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***:Year : Controlled ****:Check sum

- Auto Download

■ After enter Service Mode by pushing “ADJ” key,

■ Enter EDID D/L mode.

■ Enter “START” by pushing “OK” key.

※ Caution

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

=> Caution

- Never connect HDMI & D-sub Cable at the same time.

- Use the proper cables below for EDID Writing.

- Download HDMI1, HDMI2 separately because HDMI1 is different from HDMI2.

For Analog EDID For HDMI EDID

D-sub to D-sub DVI-D to HDMI or HDMI to HDMI

No. Item Condition Hex Data

1 Manufacturer ID GSM 1E6D

2 Version Digital : 1 01

3 Revision Digital : 3 03

● EDID DATA

(1) HD 2D EDID Data (32LB550B/560B) => TBD

Before S/W version 3.03.02

CheckSum(0xFF) Physical Address (0x1E)

HDMI 1 10

HDMI 2 20

※ Edid data and Model option download (RS232C)

NO Item CMD 1 CMD 2 Data 0

Enter download MODE

Edid data and Model option download

Download ‘Mode In’

Download A E 00 10

A A 0 0

HDMI1 (128/256)

When transfer the ‘Mode In’, Carry the command

Automatically download (The use of a internal Data)

Only for training and service purposes

- 14 -

HDMI1 (128(same)/256)

(2) FHD 2D EDID Data (S/W 1.01.20) (LB5500, LB5600 except

32LB550B/LB560B)

CheckSum(0xFF) Physical Address (0x1E)

HDMI 1 41 / 25 10

HDMI 2 41 / 15 20

HDMI1 (128/256)

HDMI1 (128(same)/256)

4.5. Outgoing condition Configuration

■ When pressing IN-STOP key by SVC remocon, Red LED

are blinked alternatively. And then automatically turn off.

(Must not AC power OFF during blinking)

4.6. GND & Hi-pot test

4.6.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

4.6.2. GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test).

(Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next

process automatically.

4.6.3. Checkpoint

(1) Test voltage ① 3 Poles

- GND: 1.5KV/min at 100mA

- SIGNAL: 3KV/min at 100mA ② 2 Poles

- SIGNAL: 3KV/min at 100mA (2) TEST time: 1 second (3) TEST POINT ① 3 Poles

- GND Test = POWER CORD GND and SIGNAL CABLE

GND.

- Hi- po t Test = POWER COR D GND a nd L IV E &

NEUTRAL.

② 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms

5. Local Dimming Function Check

(Not require)

Step1) Turn on TV. Step2) Press “P-only” key, enter to power only mode and

escape the “P-only” Mode by pressing “Exit” key Step3) Press “Tilt” key, entrance to Local Dimming mode. Step4) At the Local Dimming mode, module Edge Backlight

moving Top to bottom Back light of module moving Step5) confirm the Local Dimming mode Step6) Press “Exit” key

Only for training and service purposes

- 15 -

6. 3D Function Test (Only LB620)

(Pattern Genera tor MSHG-600, MSPG-6100 [SUPPORT HDMI1.4]) * HDMI mode NO. 872 , pattern No.83

1) Please input 3D test pattern like below (HDMI mode NO. 872 , pattern No.83)

2) When 3D OSD appear automatically , then select OK button.

3) Don’t wear a 3D Glasses, Check the picture like below

Only for training and service purposes

- 16 -

BLOCK DIAGRAM

(P1101)

30P HD LVDS wafer

51P FHD LVDS wafer

(P1100)

SIDE

USB

(JK700)

HDM I2(MHL)

(JK801)

SIDE_U SB_DM/D P

USB1_OC D/CTL

OCP IC : T PS65282

(IC400)

+5V_USB

COMP2_L /R_IN

COMP2_Y+/ AV_CVB S_IN, COM P2_Pb+/Pr+

AV2_L/R_I N

AV2_CVBS_IN

CK+/ -, D0+/-, D1+/-, D2+/-_H DMI2

DDC _SCL/SDA_2, HD MI_CEC

Serial Flash

(8Mbit)

IC1300

SPI_SCK /SDI/SD O/CS

System EEPROM

(256Kbit)

IC104

I2C_SC L/SDA

NAND FLASH

(1Gbit)

IC102

PCM_A[0-7],…

DDR3 SDRAM

(2Gbit)

IC1201

A-MDQL[0-7], A-MDQU[0-7], …

RXA0+/-~RXA4+/-, RXACK+/-

RXB0+/ -~RXB4+/-, RXB CK+/-

SPK_R

SPK_L

AMP_SCL/ SDA

AUD_MASTER _CLK,

AUD_LR CH,

AUD_LR CK, AUD_SCK

TAS5733

(IC5600)

Main SOC

M1A(LGE2131)

(IC101)

With internal 128M DDR

Connector

(P4600)

Joystick & IR

REAR

HDM I1

(JK800)

TU_SC L / SDA

IF

TDJK -T101F

HALF NI M

AV2

Comp 1 & AV1

(JK1701)

SPDIF _OUT

SPDIF (Optic)

(JK1001)

MHL _OCP_DET

AVDD5V_MH L

MHL _CD_SENSE

Only for training and service purposes

- 17 -

400

410

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

900

LV1

820

200

530

540

521

500

121

502

501

AG1

A10

Set + Stand

Only for training and service purposes

- 18 -

120

A2

TP for NON-EU models(except EU and China)

LGE Internal Use Only

TP for CI slot

/PCM_REG

/PCM_OE

/PCM_WE

/PCM_IORD PCM_A[11]

/PCM_IOWR CI_TS_DATA[1]

/PCM_CE

/PCM_IRQA

/PCM_CD

/PCM_WAIT

PCM_RST

PCM_5V_CTL

/CI_DET

TP for S2

PCM_D[0]

PCM_D[2]

PCM_D[3]

PCM_D[4]

PCM_D[5]

PCM_D[6]

PCM_D[7]

PCM_A[8]

PCM_A[9]

PCM_A[10]

PCM_A[12]

PCM_A[13]

PCM_A[14]

TP for FE_TS_DATA

CI_TS_CLK

CI_TS_VAL

CI_TS_SYNC

CI_TS_DATA[0]

CI_TS_DATA[2]

CI_TS_DATA[3]

CI_TS_DATA[4]

CI_TS_DATA[5]

CI_TS_DATA[6]

CI_TS_DATA[7]

TP for SCART

SCART1_MUTE

SC1_IDPCM_D[1]

SC1_FB

DTV/MNT_VOUT

SCART1_Lout

SCART1_Rout

SC1_R+/COMP1_Pr+

SC1_G+/COMP1_Y+

SC1_B+/COMP1_Pb+

SC1/COMP1_DET

SC1/COMP1_L_IN

SC1/COMP1_R_IN

TP for Headphone

HP_LOUT

HP_ROUT

SIDE_HP_MUTE

HP_DET

FE_TS_DATA[1]

FE_TS_DATA[2]

FE_TS_DATA[3]

FE_TS_DATA[4]

FE_TS_DATA[5]

FE_TS_DATA[6]

FE_TS_DATA[7]

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC5_L14

TP_NON_EN

2013.05.09 3

L14 POWER BLOCK (POWER DETECT 2)

LGE Internal Use Only

FROM LIPS or POWER B/D

+3.5V_ST

OPT

R400

10K

R402

R401

10K

C407 10uF

2012

10V

10K

+3.5V_POWER_DET

L400

CB2012PK501T

C400

+24V_CAP

C432

4.7uF

3216

+12V_CAP

C433

4.7uF

3216

RL_ON

+3.5V_ST

+24V

+12V

1005

16V

1uF 10V

OPT

50V

B

+3.5V_ST

R406 10K

R404

4.7K

C

Q400 MMBT3904(NXP)

E

R456

ZD400

5V

MLB-201209-0120P-N2

C401

0.1uF 50V

MLB-201209-0120P-N2

C402

0.1uF 16V

MMBT3906(NXP)

1

OPT

0

L401

CB2012PK501T

L402

L403

Q401

2

R455

3

0

ZD404

+1.5V_DDR

+3.3V_Normal

L409

BLM18PG121SN1D

C426

10uF

AZ1117EH-ADJTRG1

10V

1.3A

OPT

R412

33K

+3.3V_Normal

R420

1K

5V

PWR ON

3.5V

3.5V GND 24V GND 12V 12V GND

P401

SMAW200-H18S5

1 3 5 7

10

9 11

12

13

14

15

16

17

18

19

.

DRV ON

2

PDIM#1

4

3.5V

6

PDMI#2

8

24V GND 12V NC GND

R419 100

PWM_DIM_PULL_DOWN

Vout=1.25*(1+R2/R1)+Iadj*R2

+1.5V_DDR

IC404

ADJ/GND

OUTIN

R449 1K 1/16W 1%

R450 200 1/16W 1%

R1

R2

L411

CB2012PK501T

R453

0

C431 10uF

10V

ZD403

2.5V

C

B

E

Q402

MMBT3904(NXP)

R424

3.9K

+3.5V_ST

R426

10K

R425 10K

PWM2_2CH_POWER

R423

100

OPT R467 1K

INV_CTL

PWM_DIM

PWM1

C415

0.1uF

C413

0.1uF

OPT

R457

8.2K

16V

OPT

16V

+24V

1%

R427

R428

5.1K

R430

2.7K

R431

1.2K

OPT

27K

1%

OPT

+12V

1%

+24V

1%

+3.5V_POWER_DET

OPT

R432

0

5%

+3.5V_POWER_DET

OPT

R458

0

5%

Ready - Dual Power Det

* Notice

- Applying all inch models for LCD L14

- Dual Power Det is used for detecting two kinds of voltage

+1.10V_VDDC

ZD401

2.5V

+3.5V_ST

OPT

C424

0.1uF 16V

C437

0.1uF

CB2012PK501T

OPT C436 10uF

10V

16V

C420

C421

22uF

10V

VCC

APX803D29

3

APX803D29

3

L406

C423

50V

270pF

GND

R435 100K

IC401

OPT

R436

100K

OPT

IC402

C414 10uF

10V

2

1

2

1

0.1uF

R43 9

20K

1%

R44 0

47K

1%

PD_+3.5V

R454-*1 300

5%

PD_+12V

R454

RESET

100 5%

POWER_DET_RESET

OPT

R437

100 5%

Detect Valtage

Power Detect +3.5V

Power Detect +12V

Power Detect +24V

C435

16V

C417

L407

0.1uF

3.6uH 16V

R1

R2

+3.5V_ST

OPT

R438

4.7K

C422

0.1uF

Power_DET

POWER_DET

Power Detect activity

Now is

Use Circuit Designator

R432, R454-*1, R438

O R430, R431, R454

R457, R454

IC403

TPS5432DDAR

BOOT

VIN

PH

GND

1

2

3

4

3A

9

THERMAL

8

7

6

5

[EP]GND

SS

EN

COMP

VSENSE

C418

0.01uF

R433

2.7K

C419

0.039uF 50V

1%

Vout=0.808*(1+R1/R2)

C434

390pF

50V

+3.3V_Normal

R429

10K

C416

0.33uF 16V

PANEL_VCC

PANEL_CTL

+3.3V_Normal

POWER_ON/OFF_1

L408

UBW2012-121F

120OHM

OPT

C425

0.1uF 25V

R441

10K

+3.5V_ST

R443

10K

R444 10K

+12V

B

R447 22K

R448

2.2K

R442

10K

C

Q404 MMBT3904(NXP)

E

C428

2.2uF 10V

R445

R446 12K

B

33K

C427 10uF

16V

C

Q403 MMBT3904(NXP)

E

FET_2.5V_DIODE

Q406-*1 DMP2130L

S

FET_2.5V_AOS

Q406

AO3435

S

PANEL_VCC

Q405

DMP2130L

D

S

R451

R452

5.6K

L410

C430 22uF 10V

5.6K

+3.3V_Normal

ZD402

5V

G

D

G

BLM18PG121SN1D

D

C429

G

0.1uF 16V

+5V_Normal & +5V_USB with OCP

C403

100pF

R408

OPT R405

4.7K

/VBUS_EN

(Active Low)

MHL_OCP_EN

(Active High)

+3.3V_Normal

MHL_SW_TR

R461 10K

MHL_SW_TR

R462 10K

Q407

R463

2.7K

B

C

MHL_SW_TR

E

MHL_SW_TR

Q409

MHL_SW_TR R464 10K

MHL_SW_TR

Q408

E

B

R465

10K

B

+3.3V_Normal

OPT R403

4.7K

MHL_5V_EN

USB1_CTL

C

MHL_5V_EN

R466 20K

C

E

R410

OPT

100K

50V

C404

4700pF

50V

OPT

R459

0

+3.3V_Normal

R407

10K

R409

10K

COMP

ROSC

EN_SW2

EN_SW1

[EP]GND

V7V

EN

1

2

SS

3

4

TPS65282REGR

5

6

FAULT2

+12V

C405 10uF

PGOOD

23

24

THERMAL

25

IC400

4A

7

8

FAULT1

SW_OUT2

USB1_OCD

/MHL_OCP_DET

VIN_122VIN_2

9

RLIM11AGND

C406 10uF 16V

21

10

R415 15K

5%

OPT R416 100K

PGND_1

PGND_2

19

20

12

SW_OUT1

MBR230LSFT1G

C411 82pF 50V

+5V_Normal

C412 22uF 16V

C409

L405

0.047uF

4.7uH

25V

BST

18

LX_2

17

LX_1

16

FB

15

SW_IN_2

14

SW_IN_1

13

+5V_USB

5V_HDMI_4

D401 30V

C408 10uF

10V

C410 10uF

10V

AVDD5V_MHL

R418

10

R422

3.3K

R421

18K

R1 R2

1%

Vout=0.8*(1+R1/R2)

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_M1A

Power_PD2

2013.10.28 4

USB (SIDE)

LGE Internal Use Only

JK700

1234

USB DOWN STR EAM

3AU 04S-3 05-Z C-(LG )

5

OPT C701

5pF 50V

OPT C702

5pF 50V

ZD700

SD05

5V

OPT

+5V_USB

C700 22uF 10V

OPT D700 RCLAMP0502BA

C703 22uF 10V

USB_HDD_CAP

SIDE_USB1_DM

SIDE_USB1_DP

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_M1A

USB_S1

13/04/30

7

HDMI (REAR 1 / SIDE 1 MHL)

LGE Internal Use Only

HDMI_1

SHIELD

20

19

18

17

16

15

14

13

12

11

CK+

10

EAG59023302

JK800

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

5V_HDMI_2

R803

1K

R802

1.8K

VA800

ESD_HDMI1_VARISTOR

5V_DET_HDMI_2

ESD_HDMI1

R805

3.3K

VA801

ESD_HDMI1_VARISTOR

VA800-*1 1uF 10V

ESD_HDMI1_CAP

VA801-*1 1uF 10V

ESD_HDMI1_CAP

VA802

MMBT3904(NXP)

Q800

C

E

VA803

ESD_HDMI1

R808

10K

B

R809

10K

R810 100

R811 100

VA804

ESD_HDMI1

D803

1 2 3 4 5

ESD_HDMI1_IP4294

IP4294CZ10-TBR

D804

1 2 3 4 5

ESD_HDMI1_IP4294

IP4294CZ10-TBR

10 9 8 7 6

HPD2

DDC_SDA_2

DDC_SCL_2

HDMI_ARC HDMI_CEC

CK-_HDMI2

CK+_HDMI2

D0-_HDMI2

D0+_HDMI2

D1-_HDMI2

D1+_HDMI2

D2-_HDMI2

D2+_HDMI2

HDMI_2 MHL

VA805

ESD_HDMI2

GND

20

HP_DET

19

5V

18

GND

17

DDC_DATA

16

DDC_CLK

15

NC

14

CE_REMOTE

13

CK-

12

CK_GND

11

CK+

10

BODY_SHIELD

20

19

HOT_PLUG_DETECT

18

VDD[+5V]

17

DDC/CEC_GND

16

SDA

15

SCL

14

RESERVED

13

CEC

12

TMDS_CLK-

11

TMDS_CLK_SHIELD

10

TMDS_CLK+

9

TMDS_DATA0-

8

TMDS_DATA0_SHIELD

7

TMDS_DATA0+

6

TMDS_DATA1-

5

TMDS_DATA1_SHIELD

4

TMDS_DATA1+

3

TMDS_DATA2-

2

TMDS_DATA2_SHIELD

1

TMDS_DATA2+

JK801-*1 DAADR019A

HDMI-2_EMI_FOOSUNG

EAG62611204

JK801

HDMI-2

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

5V_HDMI_4

R812

1.8K

HDMI-2

5V_DET_HDMI_4

ESD_HDMI2

VA806

R813

3.3K HDMI-2

VA807

5.6V OPT

ESD_HDMI2 VA808

ESD_HDMI2

VA809

HDMI-2

R814

33

HDMI-2

R815 100

R816 100

HDMI-2

VA810

ESD_HDMI2

VA811

ESD_HDMI2

1 2 3 4 5

ESD_HDMI2_IP4294

IP4294CZ10-TBR

1 2 3 4 5

ESD_HDMI2_IP4294

IP4294CZ10-TBR

C800

0.047uF 25V

HDMI-2

D805

D806

10 9 8 7 6

R817 300K

MHL Spec

HDMI-2

HPD4

DDC_SDA_4

DDC_SCL_4

HDMI_CEC

CK-_HDMI4

CK+_HDMI4

D0-_HDMI4

D0+_HDMI4

D1-_HDMI4

D1+_HDMI4

D2-_HDMI4

D2+_HDMI4

MHL_CD_SENSE

CEC

R804

A2CA1

MMBD6100 D800

100

DDC_SDA_2

DDC_SCL_2

CEC_REMOTE_S7

5V_HDMI_4

R806

2.7K

+5V_Normal

A2CA1

MMBD6100 D801

R807

2.7K

+3.5V_ST

DDC_SDA_4

DDC_SCL_4

A2CA1

MMBD6100 D802

HDMI_CEC

5V_HDMI_2

R800

2.7K

+5V_Normal

R801

2.7K

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

D803-*1

TMDS_CH1-

1

2

GND_1

3

4

5

D803-*2

1 2 3 4 5

10

9

8

7

6

10 9 8 7 6

TMDS_CH1+

TMDS_CH2-

TMDS_CH2+

ESD_HDMI1_IP4283

IP4283CZ10-TBA

ESD_HDMI1_SEMTECH

RCLAMP0524PA

NC_4

NC_3

GND_2

NC_2

NC_1

D804-*1

TMDS_CH1-

1

2

GND_1

3

4

5

D804-*2

1 2 3 4 5

10

10 9 8 7 6

TMDS_CH1+

TMDS_CH2-

TMDS_CH2+

ESD_HDMI1_IP4283

IP4283CZ10-TBA

ESD_HDMI1_SEMTECH

RCLAMP0524PA

D805-*1

NC_4

NC_3

9

GND_2

8

NC_2

7

NC_1

6

TMDS_CH1-

1

2

GND_1

3

4

5

D805-*2

1 2 3 4 5

10

10 9 8 7 6

TMDS_CH1+

TMDS_CH2-

TMDS_CH2+

ESD_HDMI2_IP4283

IP4283CZ10-TBA

ESD_HDMI2_SEMTECH

RCLAMP0524PA

NC_4

NC_3

9

GND_2

8

NC_2

7

NC_1

6

D806-*1

TMDS_CH1-

1

TMDS_CH1+

2

GND_1

3

TMDS_CH2-

4

TMDS_CH2+

5

ESD_HDMI2_IP4283

IP4283CZ10-TBA

D806-*2

1 2 3 4 5

ESD_HDMI2_SEMTECH

RCLAMP0524PA

L14_M1A

NC_4

10

NC_3

9

GND_2

8

NC_2

7

NC_1

6

10 9 8 7 6

2013/08/15

HDMI_R1_S1 8