• There are some special components used in LCD
zmonitor that are important for safety. These parts are
marked
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer' s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly or
electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
on th e schematic diagram and the
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverte r ci rcuit, must disconne ct the AC ada pter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
• Make certain that treatment person' s body are grounded
through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
Leakage Current Hot Check Circuit
• Replaceable batteries
* CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS.
REPLACE ONLY WITH THE SAME OR EQUIVALENT
TYPE.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unl ess specified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
This specification is applied all of the Digital Signage Product
with LW01A chassis.
2. Designation
(1) Th e ad justm ent is accord ing to the order whic h is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 220V, 60Hz
(6) Adjustment equipments : Color Analyz er (CA-210 or
CA-110), DDC Adjustment Jig equipment, SVC remote
controller.
(7) Push The “IN STOP KEY” – For memory initialization.
Case1 : Software version up
1. After downloading S/W by USB , Multi-vision set will reboot
automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push “Instop” ke y at rst.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover channel
information by itself.
3. After function inspection, Push “In-stop” key.
(4) Click “Connect” tab. If “Can’t ” is displayed, Check
connection between computer, jig, and set.
(5) Click “Auto” tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work.
- Bu t your downloaded version is High, USB data is
automatically detecting
(3) Show the message “Copying files from memory”
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot file Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message
If “Error” is displayed, Check connection between computer,
jig, and set.
(3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
Only for training and service purposes
(4) Updating is staring.
(5) Updating C om pl et ed , T he Multi-vi si on will r es ta rt
automatically.
(6) If your Multi-vision is turned on, check your updated
version and Tool option. (explain the Tool option, next
stage)
* Connecting picture of the measuring instrument (On Auto-
matic control)
- Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWERON -> Enter the mode of White-Balance, the pattern will
come out.
* Auto-control interface and directions
1) Adjust in the place where the inux of light like oodlight
around is blocked. (Illumination is less than 100Lux).
2) Adhere closely the Color Analyzer ( CA210 ) to the
module less than 10cm distance, keep it with the surface
of the Module and Color Analyzer’s Prove vertically.
(80~100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
* After You nish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it
is correctly same then unplug the AC cable.
If it is not same, then correct it same with BOM and unplug
AC cable.
For correct it to the model’s module from factory JIG model.
* Push The “IN STOP KEY” after completing the function
inspection. And Mechanical Power Switch must be set “ON”.
4.2. MAC Address Download
■ Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C
COMMAND
[CMD ID DATA]
Cool Mid WarmCool Mid Warm
R GainjgJajd00172192192192
G GainjhJbje00172192192192
B GainjiJcjf00192192172192
R Cut646464128
G Cut646464128
B Cut646464128
*Caution
- Color Temperature : COOL, Medium, Warm.
- One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
( when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)
* Manual W/B process using adjusts Remote control.
■ After enter Service Mode by pushing “ADJ” key,
■ Enter White Balance by pushing “►” key at “6. White
Balance”.
M
I
N
CENTER
(DEFAULT)
M
A
X
■ Com 1,2,3,4 and 115200(Baudrate)
■ Port connection button click(1)
■ Load button click(2) for MAC Address write.
■ Start MAC Address write button(3)
■ Check the OK Or NG
4.3. LAN (Automatic IP)
4.3.1. Equipment & Condition
■ Each other connection to LAN Port of IP Hub and Jig
4.3.2. LAN inspection solution
■LAN Port connection with PCB
■ Network setting at MENU Mode of Menu
- “menu” key input -> Network -> Network Setting ->
Press “Enter” -> IP Auto Setting -> OK
■ setting automatic IP
■ Setting state conrmation
- If automatic setting is nished, you conrm IP and
MAC Address.
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart,
0, Phase
Data write : Model Name and Serial Number write in EEPROM,.
5) Checksum: Changeable by total EDID data.
EDID C/S dataHDMIDVIRGB
check sum
(Hex)
6) Vendor Specic
Block 0565647
Block 19494-
INPUTMODEL NAME(HEX)
HDMI3437575633300A
RGB3437575633300A
DVI3437575633300A
4.9. Outgoing condition Conguration
■ When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.10. Internal pressure
- Conrm whether is normal or not when between power
board's ac block and GND is impacted on 1.5kV(dc) or
2.2kV(dc) for one second
5.
Model name & Serial number Download
5.1. Model name & Serial number D/L
■ Press “Power on” key of service remocon.(Baud rate :
115200 bps)
■ Connect RS232 Signal Cable to RS-232 Jack.
■ Write Serial number by use RS-232.
5.4. Method & notice
(1) Serial number D/L is using of scan equipment.
(2) Setting of scan equipment operated by Manufacturing
Technology Group.
(3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
* Manual Download (Model Name and Serial Number)
If the TV set is downloaded By OTA or Service man,
Sometimes model name or serial number is initialized.( Not
always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the ‘instart’ key of ADJ remote controller.
2) Go to the menu ‘5.Model Number D/L’ like below photo.
3) Input the Factory model name(ex 42LD450-ZA) or Serial
number like photo.
4) Check the model name Instart menu -> Factory name
displayed (ex 42LD450-ZA)
5.2. Signal TABLE
CMD LENGTH ADH ADLDATA_1 ... Data_n
CMD: A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 + … + Data_n
Delay : 20ms
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C1422
22uF
BLM18PG121SN1D
1
R1401
L1407
LAN_1.2V
C1424
10uF
10V
/WOL_ON
+3.5V_ST_1
470KR1417
AO3407A
R1418
100K
Q1401
+3.5V_ST_LAN
S
D
G
EAX64050803
USB TO ETHERNET
11/05/11
14 14
Page 25
[51Pin LVDS Connector]
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
(For FHD 60/120Hz)
P1300
TF05-51S
WAFER_FHD
PANEL_VCC
[41Pin LVDS Connector]
L1300
120-ohm
WAFER_FHD
C1301
C1300
10uF
16V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
R1300
41
NON_SCAN
42
43
44
45
46
47
48
49
50
51
52
OPT
RXACK-
RXACK+
RXA2-
RXA2+
RXA1-
RXA1+
RXA0-
RXA0+
RXB4-
RXB4+
RXB3-
RXB3+
RXBCK-
RXBCK+
RXB2-
RXB2+
RXB1-
RXB1+
RXB0-
RXB0+
0
R1304
240Hz
R1302
33
240Hz/3D
R1303
33
240Hz/3D
1000pF
50V
WAFER_FHD
RXA4-
RXA4+
RXA3-
RXA3+
BIT_SEL
33
FRC_RESET
I2C_SCL
I2C_SDA
C1302
0.1uF
16V
WAFER_FHD
R1305
10K
BIT_SEL_LOW
LVDS_SEL
+3.3V
R1306
3.3K
FHD_LVDS_SEL_HIGH
R1307
10K
FHD_LVDS_SEL_LOW
(For FHD 120Hz)
P1301
TF05-41S
WAFER_FHD_120HZ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
RXD4-
RXD4+
RXD3-
RXD3+
RXDCK-
RXDCK+
RXD2-
RXD2+
RXD1-
RXD1+
RXD0-
RXD0+
RXC4-
RXC4+
RXC3-
RXC3+
RXCCK-
RXCCK+
RXC2-
RXC2+
RXC1-
RXC1+
RXC0-
RXC0+
C1303
10uF
16V
OPT
C1304
1000pF
50V
3D
C1305
0.1uF
16V
3D
L1301
120-ohm
3D
PANEL_VCC
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
P1302
FF10001-30
WAFER_HD
1
R1309
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
R1308
21
22
23
24
25
26
27
28
29
30
31
WAFER_HD
0
RXA3-
RXA3+
RXACK-
RXACK+
RXA2-
RXA2+
RXA1-
RXA1+
RXA0-
RXA0+
0
PANEL_VCC
L1302
120-ohm
WAFER_HD
LOCAL_DIM_SEL
+3.3V
LOCAL_DIM_HIGH
OPT
LVDS_SEL
+3.3V
LVDS_SEL_HIGH
LVDS_SEL_LOW
R1312
3.3K
R1313
0
R1314
3.3K
R1315
10K
LOCAL_DIM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64050803
LVDS
11/05/11
13 14
Page 26
VCC_1.5V_DDR
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64050803
DDR
11/05/11
12 14
Page 27
PC Audio/Wired IR
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
COMPONENT
COMP Audio
PC_RIN
R1001
12K
R1000
10K
R1002
470K
470pFC1000
OPT
330pF
C1001
5.6VD1000
R-CONTACTU2R-SHUNTU3T-CONTACTU4GND-CONTACT
T-SHUNT
U1
U5
JK1000
R1003
10K
PC_LIN
R1005
R1004
C1002
C1003
12K
470K
470pF
330pF
1K
R1015
R1016
D1005
COMP1_DET
10K
OPT
30V
+3.3V_AVDD
COMP1_LIN
R1018
R1017
12K
10K
470KR1019
470pFC1011
5.6VD1006
JK1003
4 E-LUG
COMP1_RIN
10K
R1020
6 C-LUG_2
R1021
12K
470KR1022
470pFC1012
5.6VD1007
5 C-LUG_1
S-436P-12
L1000
0
R1012
330pF
75
COMP1_Y+
C1010
330pF
OPT
D5 D5
OPT
R1013
0
R1014
75
30VD1003
2 2
30VD1004
3 3
KCN-BT-0-0012
COMP1_Pr+
C1004
0
R1006
READY
OPT
5.6VD1001
R1913
0
T-CON4R-CON
GND
SW18SW39SW47SW2C1COM1C2COM2
1
5
KJA-PH-3-0064
C1005
22uF
0.47uF
25V
25V
C1006
330pF
PREAMP_IR
IR
ZD1001
5.6V
5
5.6V
ZD1000
6
10
SHIELD
KCN-BT-1-0012
JK1001
R1009
1
0
R1010
OPT
75
30VD1002
U5 U5
JK1002
COMP1_Pb+
C1008
R1011
1 1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64050803
JACK
11/05/11
10 14
Page 28
SUB Board I/F
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
KEY1
KEY2
PREAMP_IR
C903
0.01uF
C904
0.1uF
T2OUT
R2IN
C900
0.1uF
IR
DOUT2
C902
0.1uF
RIN2
R908
10K
1%
R905
100
R906
100
IC900
MAX3232CDR
C1+
1
V+
2
C1-
3
C2+
4
C2-
5
V-
6
7
8
47KR909
Q900
KTC3552T-RTK
+3.5V_ST
R902
22
B
R911
10K
1%
BLM18PG121SN1D
BLM18PG121SN1D
R903
0
16
15
14
13
12
11
10
9
R914
10K
C
E
L900
L901
C901
0.1uF
+3.5V_ST
BLM18PG121SN1D
+3.5V_ST
R928
3.3K
OPT
+3.5V_ST+3.3V
L905
C912
22uF
16V
R919
OPT
T1OUT
R1IN
20K
MLB-201209-0120P-N2
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
0R917
C905
0.1uF
D900
5.6V
AMOTECH
L902
C906
0.1uF
16V
L906
MLB-201209-0120P-N2
E
Q902
OPT
C
D904
OPT
R924
1K
D903
MMBD301LT1G
30V
D902
MMBD301LT1G
30V
47K
R916
Q901
KTC3552T-RTK
B
+3.3V
R927
R926
4.7K
D905
MMBD301LT1G
30V
B
AMOTECH
C907
1000pF
50V
BLM18PG121SN1D
OPT
R930
4.7K
+3.5V_ST
R918
10K
C
E
D901
5.6V
LED_WHITE
L903
0.1uF
OPTR929
C908
R931
EYEQ/TOUCH_KEY
R935
S7_RXD
NEC_RXD
S7_TXD
NEC_TXD
100
EYEQ/TOUCH_KEY
100
R945
R934
100
C910
100pF
50V
LED_RED
C911
1000pF
50V
OPT
C913
1000pF
50V
OPT
1.5KR946
R947
C914
0.1uF
ZD902
5.6V
1.5K
P902
5.6V
ZD900
5.6V
ZD901
JP905
JP906
OPT
16V
JP907
OPT
R948
10K
12507WR-12L
1
2
3
DSUB_G-
R951
22
DSUB_VSYNC
R949
22
DSUB_G
DSUB_B-
+5V_Normal
DSUB_HSYNC
C921
100pF
OPT
DSUB_B
100R952
L910
MLB-201209-0120P-N2
C915
0.1uF 50V
R910
1K
IC902
1
1Y42Y
1A
*
OPT
R956
RGB_DDC_SDA
100R954
74HC14D
32A2
1K
R959
RGB_DDC_SCL
3A
DSUB_DET
DDC5V_DSUB
D918
C923
C924
4A105Y115A126Y136A14VCC
63Y5
OPT
D919
100pF
100pF
84Y9
7
GND
V_SYNC_OUT
0.1uF
C925
30V
30VD916
30VD917
30V
H_SYNC_OUT
16V
D921
KDS226
C927
470uF 16V
9V_OP
C930
C
A
C926
470uF
16V
9V_OP
C928
470uF
9V_OP
A
C
R961
AC
75
100uF
D920
KDS226
AC
100uF
25V
C
AC
A
16V
C931
100uF
25V
Closed to Jack
C939
0.1uF
50V
25VC929
R962
D922
KDS226
9V_OP
R964
1%
0
R965
20K
R971
22
R966
6.2K
9V_OP
R974
0
1%
75
R967
R972
20K
22
R968
6.2K
9V_OP
R975
R963
1%
0
75
R969
R973
20K
22
R970
6.2K
D924
30V
D923
C940
0.1uF
50V
R978
1%
330
EL5167
OUT
1
VS-
2
IC903
IN+
3
R979
1%
330
EL5167
OUT
1
VS-
2
IC904
IN+
3
R980
330
1%
EL5167
OUT
1
VS-
2
IC905
IN+
3
0R977
0R976
30V
V_SYNC_OUT
H_SYNC_OUT
+3.5V_ST
10K
R907
47R904
D912
9V_OP
VS+
5
IN-
4
R981
5
4
5
4
VS+
IN-
VS+
IN-
R983
R982
C932
0.1uF
330
50V
1%
9V_OP
C933
0.1uF
330
50V
1%
9V_OP
DDC5V_DSUB
+5V_ST
C934
0.1uF
330
50V
1%
A2CA1
D913
KDS184
IC901
AT24C02BN-SH-T
C937
R1900
0
R1901
0
0.1uF
RGB_DDC_SCL
RGB_DDC_SDA
1
8
2
7
3
6
4
5
DPM_DET
30V
C935
18pF
R991
18K
EDID_WP
C936
18pF
50V
50V
R994
4.7K
R996
4.7K
4
5
6
7
JP908
JP909
C916
* OPT
30VD907
8
9
10
11
12
13
DSUB_R
10K
R944
+3.3V_AVDD
D911
L907
L908
L909
DSUB_R-
AC
C
A
4.7KR936
30VD906
R938
2.7
R939
4.7KR937
R940
2.7
2.7
KDS226
D908
75 1%R941
75 1%R942
75 1%R943
D909
AC
AC
C
C
A
A
+3.5V_ST
SII9489_SCL
SII9489_SDA
C909
1000pF
RS232C_EN
0
0R932
0R900
0R933
0R901
50V
+3.5V_ST
IR
16V
0R1914
0 R1912
T1OUT
R2IN
T2OUT
KCN-DS-0-0119
M5
P900
R913
R915
100
M8
M9
M3
M4
R921
100
22
JP911
M6
M7
M1
M2
N9
N5
N4
RS-232C IN/OUT
R1IN
R922
R925
100
100
JP915
OPT
0
R923
N8
N7
N6
N3
N2
N1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
B11
B12
B13
B14
B15
B9
B4
G1
B10
BOTTOM
B5
P901
KCN-DS-2-0091
A11
A12
A13
A14
A15
B6
B7
A6
A7
A8
TOP
A1
A9
A10
A2
A3
A4
A5
B8
B1
B2
B3
RGB IN/OUT
G1
EAX64050803
11/05/11
9 14RS232//RGB/Sub_BD
Page 29
JK801
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64050804
HDMI/DVI/USB
11/07/06
8 14
Page 30
+3.3V
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64050803
AUDIO AMP
11/05/11
7 14
Page 31
P904
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12507WS-03L
4
FAN Block
RTC BLOCK
Q600
7.5K
IRF7342TRPBF
D1_2
D1_1
D2_2
D2_1
8
7
6
5
FAN_ALARM
S1
1
G1
2
S2
3
G2
4
C601
0.1uF
L600
R604
10K
OPT
D601
KDS184
R605
2K
MLB-201209-0120P-N2
C600
100uF
25V
R601
1
2
3
R1435
R602
10K
0
A2CA1
C602
68uF
35V
9V_FANL602
MLB-201209-0120P-N2
10KR606
C
10KR607
E
C
C603
0.1uF
B
Q602
KTC3552T-RTK
E
9V_FAN
Q604
KTC3552T-RTK
B
9V_FAN_ON
+3.5V_ST
12
M600
BATTERY
NC_1
1
IC600
NF_1
M41T83RMY6F
2
NF_2
3
NC_2
4
RST
5
DU
6
SQW
7
1KR610
VBAT
8
VSS
9
18
17
16
15
14
13
12
11
10
NC_4
NV_4
NF_3
VCC
IRQ2
NC_3
IRQ1/FT/OUT
SCL
SDA
R612
33
C605
0.1uF
33R613
+3.5V_ST
C606
22uF
16V
NEC_EEPROM_SCL
NEC_EEPROM_SDA
TMDS_DEMUX_SDA
TMDS_DEMUX_SCL
Digital Thermal Sensor
IC601
R614
33
R615
33
SDA
SCL
OS
GND
MM3286CFBE
1
2
3
4
+5V_Normal
0.1uF
50V
C607
R616
VDD
8
A0
7
A1
6
A2
5
R618
10K
OPT
0R617
OPT
R620
10K
10K
0R621
0
OPT
R619
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64050803
FAN/RTC/SENSOR
11/05/11
6 14
Page 32
POWER B/D
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C
B
E
L502
MLB-201209-0120P-N2
C504
0.1uF
16V
510R535
L501
C501
100uF
25V
+12V/+15V
C500
100uF
25V
RL_ON
+3.5V_ST
R500
10K
LD501
LS Q976-PR-1
MLB-201209-0120P-N2
C503
0.1uF
16V
+3.5V_ST
Q500
2SC3052
C506
0.1uF
16V
R504
4.7K
C507
0.1uF
16V
1
PDTA114ET
Q502
2
0
R507
POWER Wafer 24P
3
POWER_23_GND
NORMAL_EXPEPT_32
P501
FW20020-24S
PWR ON
GND
GND
3.5V
3.5V
GND
GND
GND/P.DIM2
24V
12V
12V
12V
1
1
1
3
3
3
5
5
5
7
7
7
9
9
9
11
11
11
13
13
13
15
15
15
17
17
17
19
19
19
2122
2122
21
2324
2324
23
25
25
SLIM_32~52
P500
SMAW200-H24S2
NORMAL_32
FM20020-24
2
2
2
4
4
4
6
6
6
8
8
8
10
10
10
12
12
12
14
14
14
16
16
16
18
18
18
20
20
20
22
24
P502
24V
24V
GND
GND
3.5V
3.5V
GND
GND/V-sync
INV ON
A.DIM
P.DIM1
Err OUT
R539
0
L504
MLB-201209-0120P-N2
C514
0.1uF
50V
0
POWER_18_INV_CTL
R511
POWER_16_GND
POWER_22_PWM_DIM
R512
100
R514
R513
+3.5V_ST
R515
6.8K
OPT
0
OPT
OPT
L511
9V_FAN
L510
New item
D
C537
1uF
25V
OPT
PANEL_POWER
C539
0.1uF
16V
FOR DISCHARGE OF AUO MODULE
9V_FAN
9V_OP
R541
2.2K
OPT
R541, R542
PANEL_VCC
R542
2.2K
OPT
+12V/+15V
L507
+24V
OPT
R523
L506
R522
47K
10K
B
C517
68uF
35V
B
Q503
2SC3052
R517
0
R518
10K
+3.5V_ST
R521
10K
INV_CTL
R520
10K
OPT
PWM_DIM
+3.3V
OPT
C516
1uF
25V
OPT
4.7K
R519
ERROR_OUT
R516
1K
C
E
C513
0.1uF
16V
100
PANEL_CTL
001:U11
+12V/+15V
C525
0.01uF
25V
R525
22K
C
Q504
2SC3052
E
L508
MLB-201209-0120P-N2
C520
0.1uF
50V
C522
0.1uF
R529
22K
AC
KDS226
C
A
B
D500
C528
100uF
25V
C530
0.1uF
16V
R531
R530
I
33K
5.6K
C
E
IC503
KA7809ERTM
1
Q505
2SC3052
2
G
C533
10uF
16V
OPT
Q506
AO3407A
C532
4.7uF
16V
O
3
S
G
MLB-201209-0120P-N2
MLB-201209-0120P-N2
C535
C536
1uF
100uF
25V
ST_3.5V--> 3.375V
20V-->3.51V
24V-->3.64V
12V-->3.58V
18.5V-->3.5V
POWER_+24V
POWER_+24V
R544
R543
+24V
+12V/+15V
+24V
OPT
30K
1%
R545
12K
1%
R547
PD_+12V
1/16W
5.1K
5%
R546
PD_+12V
+3.5V_ST
50V
24K
R544-*1
POWER_+20V
5.1K
R543-*1
POWER_+20V
1%
5%
CE
FB
VDD
1%
22K
1%
5.6K
L516
C523
0.1uF
1%
24K
R544-*2
POWER_+18.5V
1%
5.6K
R543-*2
POWER_+18.5V
Only for 32/37LED MODEL
STAND-BY 5V
L519
10uH
IC508
NCP1406SNT1G
1
2
3
EAN61013901
LX
5
GND
4
+3.5V_ST
1K
R550
27K
R546-*1
VCC
1%
PD_+3.5V
1%
PD_+3.5V
R552
100K
IC506
NCP803SN293
3
GND
D501
MMSD4148T1G
100V
+3.5V_ST -> 3.375V
R553
100K
IC507
NCP803SN293
VCC
3
1
GND
OPT
RESET
2
1
PD_+12V
C529
C524
100pF
0.1uF
50V
50V
+3.5V_ST
OPT
10K
R563
R562
100
RESET
2
PD_+12V
R561
100
Power_DET
BLM18SG121TN1D
R536
20K
1/10W
C552
1%
10uF
10V
R537
12K
1/10W
1%
R538
10K
1/10W
1%
L520
C555
0.1uF
POWER_DET
+5V_ST
+1.5V_DDR_IN
POWER_ON/OFF2_1
+3.5V_ST
C502
10uF
10V
L500
S7 DDR 1.5V
VIN_3
EP[GND]
VIN_1
1
THERMAL
VIN_2
C509
0.1uF
16V
GND_1
GND_2
2
3
SN1007054RTER
4
5
AGND
Vout=0.8*(1+R1/R2)=1.537
Q501
AO3438
FRC
D
S
G
10K
R505
FRC
FRC
0
R502
R501
120K
OPT
C505
4.7uF
10V
OPT
+1.5V_DDR_FRC
POWER_ON/OFF1
10K
R503
C510
0.1uF
C511
17
IC500
VSENSE
16V
0.1uF
16V
BOOT14PWRGD
13
15EN16
6
7
COMP
12
11
10
9
8
RT/CLK
1/10W
4A
PH_3
PH_2
PH_1
SS
R508
1/10W 330K 5%
R506
7.5K
5%
$ 0.165
C512
0.01uF
50V
C515
3300pF
50V
L503
3.6uH
NR8040T3R6N
C518
22uF
10V
C526
22uF
10V
R1
R2
R510
51K
1/8W
1%
R509
+1.5V_DDR_IN
C534
0.1uF
16V
C531
100pF
50V
47K 1%
+3.3V_AVDD
C519
0.1uF
16V
AZ2940D-2.5TRE1
VIN
1
Vd=550mV
IC501
VOUT
3
2
GND
R527
1
+2.5V_AVDD
+2.5V_AVDD
C521
C527
10uF
0.1uF
10V
16V
+12V/+15V
C545
10uF
25V
L513
C546
10uF
25V
+3.3V
IC504
AOZ1073AIL
PGND
1
VIN
2
AGND
3A
3
FB
4
Vout=(1+R1/R2)*0.8
LX_2
8
LX_1
7
EN
6
COMP
5
L514
3.6uH
NR8040T3R6N
POWER_ON/OFF2_2
R549
10K
9.1K
2200pF
R548
C548
R557
27K1%R556
4.7K
10K1%R555
C550
100pF
+3.3V
C559
47uF
50V
C557
0.1uF
16V
+3.3V_AVDD
L517
CIC21J501NE
C554
C551
R1
1%
OPT
50V
22uF
10V
0.1uF
16V
R2
S7 core 1.26V volt
C542
0.1uF
16V
PH_3
PH_2
PH_1
C543
SS
0.01uF
50V
R528
1/10W 330K 5%
R526
7.5K
5%
$ 0.165
POWER_ON/OFF2_1
NR8040T3R6N
C565
3300pF
50V
L509
3.6uH
+1.26V_VDDC
+12V/+15V
L512
50V
100pF
C568
C569
0.1uF
16V
C547
C544
10uF
10uF
25V
25V
Vout=0.8*(1+R1/R2)
C567
C566
22uF
22uF
10V
10V
R532
24K 1%
1%
R1
22K
R533
R2
R534
75K
1/8W
1%
+5V_Normal
IC505
AOZ1072AI
PGND
AGND
1
VIN
2
3
FB
4
2A
8
7
6
5
LX_2
LX_1
EN
COMP
R551
R554
12K
10K
L515
3.6uH
NR8040T3R6N
POWER_ON/OFF2_2
2200pF
C549
R559
51K5%R560
1.5K
10K1%R558
C553
100pF
+5V_Normal
C556
R1
22uF
1%
10V
OPT
50V
C558
0.1uF
16V
R2
C508
4.7uF
10K
R524
C541
EP[GND]
1
THERMAL
2
3
SN1007054RTER
4
5
AGND
17
IC502
6
VSENSE
4A
0.1uF
16V
7
COMP
BOOT14PWRGD15EN16VIN_3
13
8
RT/CLK
12
11
10
9
1/10W
+3.5V_ST_1
+1.5V_FRC_DDR
OPT
+3.5V_ST
L518
CIC21J501NE
C538
10uF
10V
L505
+3.5V_ST_1
C540
0.1uF
16V
VIN_1
VIN_2
GND_1
GND_2
Vout=0.8*(1+R1/R2)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64050803
POWER
11/05/11
5 14
Page 33
+1.5V_DDR_IN
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64050803
Main IC Power
11/05/11
3 14
Page 34
IC101
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64050803
S7/FLASH/EEPROM/GPIO
NEC
11/05/11
1 14
Page 36
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