LG 43UK6200PUA, 43UK6090PUA Schematic

CONFIDENTIAL

LED TV

SERVICE MANUAL

CHASSIS : UA83P

MODEL : 43UK6200PUA

MODEL : 43UK6090PUA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL70427821 (1807-REV01)

Any reproduction, duplication, distribution (including by way of email, facsimile or other electronic means), publication, modification, copying or transmission of this Service Manual is STRICTLY PROHIBITED unless you have obtained the prior written consent of the LG Electronics entity from which you received this Service Manual. The material covered by this prohibition includes, without limitation, any text, graphics or logos in this Service Manual.

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ....................................................................................... 6

SOFTWARE UPDATE ............................................................................. 9

BLOCK DIAGRAM ................................................................................. 10

EXPLODED VIEW .................................................................................. 22

ASSEMBLY / DISASSEMBLY ................................................................ 23

TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used UA83P chassis.

2. Test condition

Each part is tested as below without special appointment. (1) Temperature: 25 °C ± 5 °C, CST: 40 °C ± 2 °C (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage

: Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

(1) Performance: LGE TV test method followed (2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. General Specification

No Item Specication Remark

1 Market North America

2 Broadcasting system ATSC / NTSC-M, 64 & 256 QAM

3 Available Channel VHF : 02~13

UHF : 14~69

DTV : 02-69

CATV : 01~135

CADTV : 01~135

4 Receiving system Digital : ATSC, 64 & 256 QAM

Analog : NTSC-M

5 Video Input NTSC-M Rear (1EA)

6 Component Input Y/Cb/Cr, Y/ Pb/Pr Rear (1EA)

7 HDMI Input HDMI 1 PC / DTV format Side, Support 6Gbps

HDMI 2 PC / DTV format Side, Support 6Gbps, Support ARC

HDMI 3 PC / DTV format Rear, Support 6Gbps

HDMI 4 PC / DTV format Rear, Support 6Gbps

8 Audio Input Component / AV Audio / DVI Audio L/R Input ; Rear

Component and AV and DVI use same jack ;

9 SPDIF out(1EA) Optical Audio out Rear (1EA),

10 USB Input(3EA) EMF, DivX HD, For SVC (download) JPEG, MP3, DivX HD

Side(1EA), Rear(1EA)

- 6 -

5. External Input Support Format

5.1. Component (Y, PB, PR)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

1 720*480i 15.73 59.94 13.50 SDTV, DVD 480I(525I)

2 720*480i 15.75 60.00 13.51 SDTV, DVD 480I(525I)

3 720*480p 31.47 59.94 27.00 SDTV 480P

4 720*480p 31.50 60.00 27.02 SDTV 480P

5 1280*720p 44.96 59.94 74.17 HDTV 720P

6 1280*720p 45.00 60.00 74.25 HDTV 720P

7 1920*1080i 33.72 59.94 74.17 HDTV 1080I

8 1920*1080i 33.75 60.00 74.25 HDTV 1080I

9 1920*1080p 67.43 59.94 148.5 HDTV 1080P

10 1920*1080p 67.50 60.00 148.5 HDTV 1080P

5.2. HDMI Input (PC/DTV)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

HDMI-PC

1 640*350 31.46 70.09 25.17 EGA

2 720*400 31.46 70.08 28.32 DOS

3 640*480 31.46 59.94 25.17 VESA(VGA)

4 800*600 37.87 60.31 40 VESA(SVGA)

5 1024*768 48.36 60.00 65 VESA(XGA)

6 1360*768 47.71 60.01 84.75 VESA(WXGA)

7 1152*864 54.34 60.05 80 VESA

8 1280*1024 63.98 60.02 109.00 SXGA Support to HDMI-PC

9 1920*1080 67.5 60 158.40 WUXGA

(Reduced Blanking)

10 1920*1080 135 120 297 UDTV 1080P

11 3840*2160 54 24.00 297.00 UDTV 2160P

12 3840*2160 56.25 25.00 297.00 UDTV 2160P

13 3840*2160 67.5 30.00 297.00 UDTV 2160P

14 4096*2160 53.95 23.97 296.70 UDTV 2160P

15 4096*2160 54 24 297 UDTV 2160P

- 7 -

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

DTV

1 640*480 31.46 59.94 25.12 SDTV 480P

2 640*480 31.5 60.00 25.12 SDTV 480P

3 720*480 15.73 59.94 13.50 SDTV, DVD

480I(525I)

4 720*480 15.75 60.00 13.51 SDTV, DVD

480I(525I)

5 720*576 15.62 50.00 13.50 SDTV, DVD

576I(625I) 50Hz

6 720*480 31.47 59.94 27 SDTV 480P

7 720*480 31.5 60.00 27.02 SDTV 480P

8 720*576 31.25 50.00 27 SDTV 576P

9 1280*720 44.96 59.94 74.17 HDTV 720P

10 1280*720 45 60.00 74.25 HDTV 720P

11 1280*720 37.5 50.00 74.25 HDTV 720P

12 1920*1080i 28.12 50.00 74.25 HDTV 1080I

13 1920*1080i 33.72 59.94 74.17 HDTV 1080I

14 1920*1080i 33.75 60.00 74.25 HDTV 1080I

15 1920*1080p 26.97 23.97 63.29 HDTV 1080P

16 1920*1080p 27.00 24.00 63.36 HDTV 1080P

17 1920*1080p 33.71 29.97 79.120 HDTV 1080P

18 1920*1080p 33.75 30.00 79.20 HDTV 1080P

19 1920*1080p 56.25 50.00 148.5 HDTV 1080P

20 1920*1080p 67.43 59.94 148.35 HDTV 1080P

21 1920*1080p 67.5 60.00 148.50 HDTV 1080P

22 1920*1080p 112.5 100 297.00 UDTV 1080P

23 1920*1080p 134.86 119.88 296.70 UDTV 1080P

24 1920*1080p 135.00 120 297 UDTV 1080P

25 3840*2160p 53.95 23.98 296.70 UDTV 2160P

26 3840*2160p 54 24.00 297.00 UDTV 2160P

27 3840*2160p 56.25 25.00 297.00 UDTV 2160P

28 3840*2160p 61.43 29.97 296.70 UDTV 2160P

29 3840*2160p 67.5 30.00 297.00 UDTV 2160P

30 3840*2160p 112.5 50.00 594 UDTV 2160P

31 3840*2160p 134.86 59.94 593.40 UDTV 2160P

32 3840*2160p 135 60.00 594 UDTV 2160P

33 4096*2160p 53.95 23.98 296.70 UDTV 2160P

34 4096*2160p 54 24.00 297 UDTV 2160P

35 4096*2160 56.25 25.00 297 UDTV 2160P

36 4096*2160 61.43 29.97 296.70 UDTV 2160P

37 4096*2160 67.5 30.00 297 UDTV 2160P

38 4096*2160 112.5 50.00 594 UDTV 2160P

39 4096*2160 134.86 59.94 593.40 UDTV 2160P

40 4096*2160 135 60.00 594 UDTV 2160P

Spec. out but display

- 8 -

SOFTWARE UPDATE

1. USB

(1) Insert the USB memory Stick to the USB port (2) Automatically detect the SW Version and show the below

message

(3) Click [YES]: initiate the download and install of the update.

2. NSU

(This Function is needed to connect to the internet)

(1) Menu -> All Settings -> General -> About This TV

(2) Click [CHEK FOR UPDATES] : system check newest

version

(4) Click [Check Now]: move to “About This TV” page for

update

(5) TV is updating

(6) After finished the update, below Pop-up appear

(7) Click [Yes] : TV will be DC OFF -> ON (8) After TV turned on, Check the updated SW Version and

Tool Option

(3) Click [DOWNLOAD AND INSTALL] (4) TV is updating

(5) After finished the update, below Pop-up appear

(6) Turn OFF the TV and On. Check the updated SW Version

and Tool Option

- 9 -

1. Main IC

Main IC

eMMC (4GB)

CI Slot

USB1 (2.0)

OCP

USB2 (2.0)

HDMI3

HDMI2(ARC)

HDMI1

Air/

Cable

TUNER

(T2/C/A)

TUNER

(S,S2)

DVB-S

LNB

T2/C/S/S2 H-NIM tuner

IF (+/-)

P_TS_OUT

P_TS_IN

Sub MICOM

X_TAL

32.768KHz

I2C 1

IR / KEY

LOGO LIGHT(Ready)

WIFI/BT Combo

USB_WIFI

X_TAL

24MHz

Sub Assy

LAN

ETHERNET

SPDIF

AV/COMP

CVBS/YPbPr

SPDIF OUT

H/P

AMP

RS-232

MAX323

MAIN Audio AMP

I2S Out

I2C 4

Vx1 51P (8 lane)

Vx1 / EPI/ CEDS

FCIC SPI/ I2C 6

EPI

PMIC

Level

shifter

M0

M1

IF_S

IF

GST/MCLK/GCLK/EO/I2C 6

NVRAM (256Kb)

I2C 4

I2C 2

EPI block

IQ (+/-), IP(+/-)

HDMI4

TS

DDR3 2133 X 32

(256MB X 2EA)

DDR3 2133 X 32

(512MB X 2EA)

EPI 60P (65”:8 lane, 55”↓:6lane), CEDS 68P

Area OPT

BLOCK DIAGRAM

- 10 -

2. EPI / CEDS

CEDS 6lane 68Pin / EPI 6Lane 60Pin

BOE Panel

3

840x2160@60p

1

.5Gbps

[ PAD_MOD_TX_P02/N02 ~ P09/ N09 ]

CEDS 6lane 68Pin / EPI 6Lane 60Pin

LGD Panel

3

840x2160@60p

3

Gbps(55” ↓ )

/ 2Gbps(65” )

PMIC

&

L

evel Shif ter

R

T6950( LGD)

S

W50212(BOE)

CLK(x10)

V

GL1

V

ST

G

IP_RST LS_VGL

V

GH_EVEN

V

GH_ODD

H

VDD

EPI 3Lane 60P ( 55” ↓ )

E

PI 4Lane 60P ( 65” )

EPI 3Lane 60P ( 55” ↓ )

E

PI 4Lane 60P ( 65” )

GMA

(

1, 5, 9, 10, 13, 24,18)

[

PAD_MOD_TX_P12(LVA3- )]

PMIC_RESET

LOCKOUT12

GST, E/O, MCLK, GLCK

[ PAD_I2S_IN_WS(TCON1)(GPIO)]

[

PAD_I2S_IN_SD(TCON2)(GPIO)]

[

PAD_SPDIF_IN(TCON3)(GPIO)]

[

PAD_GPIO16(TCON4)(GPIO)]

Sub PMIC

(

RT5093)

VDD

V

COM1

V

COMLFB

V

COMRFB

V

COM2

[ PAD_MOD_TX_P02/ N02 ~ P09/ N09]

GAMMA

(RT6508)

B

OE Only

GMA

(2, 3, 4, 7, 8,

1

1, 12, 15, 16, 17)

[ PAD_GPIO30SCK4]

[

PAD_GPIO31SDA4]

68p in

60p in

68p in

60p in

LDO

(

TJ4320)

VTERM

[ PAD_GPIO17_PM(PM_SPI_CK2]

[

PAD_GPIO18_PM(PM_SPI_DI2)]

[

PAD_GPIO19_PM(PM_SPI_DO2)]

[

PAD_GPIO10_PM(PM_SPI_CZ2)]

Main IC

- 11 -

3. Vx1

I2C_ A6

Vx1 8Lane 51P

A

H n

Panel

3840x2160@60p

LOCKAn

A

DATA_FORMAT_0/ 1

[ PAD_GPIO23]

[ PAD_MOD_TX_P00~ 07]

[

PAD_GPIO31SDA4]

[

PAD_GPIO24]

AGP_CTL

A

VX1_MSE

BIT [2:3] DISPLAY TYPE TYPE Data lane RGB/M+ COMMENT

[Level 0 : Level 0] LCD_UHD VBY1 N/A RGB/M+ V16_V17_V18

[Level 0 : Level 1]

[Level 0 : Level 2]

[Level 0 : Level 3]

[Level 1 : Level 0] LCD_UHD LGD_EPI_3G V18 6lane RGB

[Level 1 : Level 1] LCD_UHD LGD_EPI_3G V18 6lane M+

[Level 1 : Level 2] LCD_UHD LGD_EPI_3G V17 6lane M+

[Level 1 : Level 3]

[Level 2 : Level 0] LCD_UHD

BOE_CEDS_1.5

G

V18 12lane RGB

[Level 2 : Level 1] LCD_UHD

BOE_CEDS_1.5

G

17Y_18Y 12lane RGBW

[Level 2 : Level 2]

[Level 2 : Level 3]

[Level 3 : Level 0] LCD_UHD LGD_EPI_3G V18 8lane RGB

V18 8lane :

LGD 65UK75

65UK63

[Level 3 : Level 1] LCD_UHD LGD_EPI_3G V18 8lane M+

[Level 3 : Level 2] LCD_UHD

LGD_EPI_3G

Q- SAC

V18 6lane RGB

Q- SAC :

LGD 49inch

Only

[Level 3 : Level 3] LCD_UHD

LGD_EPI_3G

Q- SAC

V18 6lane M+

[ PAD_MOD_TX_P12(LVA3- )]

[

PAD_MOD_TX_N12 (LVA3+)]

[

PAD_GPIO30SCK4]

[

PAD_GPIO19]

[

PAD_GPIO20]

Main IC

IC

Main IC

- 12 -

4. Tuner

18Y Tuner

Main

[ B1_+3.3V_RF] 3

[ +3.3V_DEMOD_TU] 11

[

B3_+1.2V_DEMOD] 13

[

IF[ P] ] 8

[

IF[ N] ] 7

[

IF_AGC] 5

[

TU_SIF] 6

[

CVBS] 4

[

ERROR] 14

[

MCLK] 15

[

SYNC] 1 6

[

VALID] 17

AC5 [ PAD_TS2_CLK]

A

D4 [ PAD_TS2_SYNC] AC4 [ PAD_TS2_VLD]

E

WBS_TU

F

E_DEMOD1_TS_CLK FE_DEMOD1_TS_SYNC FE_DEMOD1_TS_VAL

D[ 0- 7] 18- 25

F

E_DEMOD1_TS_DATA [ 0- 7]

[

GPIO_27~ 34_TP0_D0~ D7]

[ RESET1_DEMOD] 10

/ TU_RESET1_TU

A

H4 [ PAD_GPIO13]

[

LNB_TX1] 12

[

LNB] 26

I2C_SCL_2

I

2C_SDA_2

+

3.3V_NORMAL

IF_P_TU

I

F_N_TU

T

U_SIF_TU

T

U_CVBS_TU

I

F_AGC_TU

A

L11 [ PAD_IP_T] AM10 [ PAD_IM_T] AM11 [ PAD_IFAGC_T] AL12 / AM12 [ SIF_P/ N]

Y

2 [ PADA_CVBS0]

+ D_Demod_Core

LNB1

I

C7001

LNB1_OUT

1.2 K Ω

5 [ SCL]

6

[ SDA] 8 [ TONECTRL]

2

[ LNB]

33 Ω

AG10 [ PAD_TGPIO2SCK1]

A

H10 [ PAD_TGPIO3SDA1]

AM8 [ PAD_IP_S]

A

L8 [ PAD_IM_S] AK10 [ PAD_QP_S] AL9 [ PAD_QM_S] AK8 [ PAD_IFAGC_S] AH9 [ PAD_GPIO26 (DISEQC_OUT)]

IF_S_IP_MAIN

I

F_S_IN_MAIN IF_S_QP_MAIN IF_S_QN_MAIN

[

I[ P] ] 59

[

I[ N] ] 60

[

Q[ P] ] 62

[

Q[ N] ] 61

[

SAT_AGC] 58

EXT_Demo d

O

ptio n

IF_S_AGC_MIAN

[

SCL_RF] 1

[

SDA_RF] 2

0 Ω

Main Ball No : 27*27 _pac kage

+3. 3V_NORMAL

3

.5V_ST

LNB1_TX

(Phillippine only)

Ready- Not user

IC

- 13 -

5. Video / Audio IN/OUT

HDMI_ARC

ST_GPIO_23_H0_ARC[AD8]

[AL12] PAD_SIFP

I2C_SDA_0_AMP1 / I2C_SCL_0_AMP1

AUD_SCK

AMP_RESET_N

AUDA_OUTR

AUDA_OUTL

H/P Jack

SIDE_HP_MUTE

[M3]PAD_EARPHONE_OUTR

[M2]PAD_EARPHONE_OUTL

TU_SIF_TU

H/P AMP

(IC6300)

LPF

[E10]PAD_GPIO7_PM

SPDIF_OUT

HP_LOUT_JACK

HP_ROUT_JACK

LPF

Main

IC

Tuner

AUD_LRCH

AUD_LRCK

AMP_MUTE

SPK_R+ / R-

SPK_L+ / L-

MAIN AMP

(IC5800)

MICOM

SPK L

SPK R

22

26

[38] CLK_I

[8] WCK

[7] SDATA

[10,11]

[36]

[12]

[30, 33]

[18, 21]

AV/COMP

HDMI2

SPDIF

HP_DET

[AL15]PAD_GPIO21

[

Y3]PADA_CVBS_OUT1

SIF_P

SIF_N

[AM12] PAD_SIFM

DTV/MNT_V_OUT

COMP1_Y/CVBS

[V2]PADA_GIN1P / [Y1] PADA_CVBS1

AV1_CVBS_DET

[

D3]PAD_I2S_OUT_SD2(GPIO

)

COMP1_Pb / COMP1_Pr / COMP1_DET

[W2]PADA_RIN1P / [v3]PADA_BIN1P / [C1] PAD_I2S_OUT_SD1

COMP1/AV1/DVI_L_IN

COMP1/AV1/DVI_R_IN

[

L2]PAD_LINEIN_L0 [L1]PAD_LINEIN_R0

[

E5]PAD_SPDIF_OUT

[E2]PAD_I2S_OUT_WS

[D1]PAD_I2S_OUT_SD

[D2]PAD_I2S_OUT_BCK

[F2]PAD_DDCR_DA / [F3]PAD_DDCR_CK

5

- 14 -

Main I

C

HDMI2.0_1_HPD

TMDS1 - D0/D1/D2/CLK

DDC_SCL1 / DDC_SDA1

MICOM

(IC3000)

HDMI2.0_1_5V_DET

HDMI2.0_2_HPD

TMDS2 - D0/D1/D2/CLK

DDC_SCL2 / DDC_SDA2

HDMI2.0_2_5V_DET

HDMI2.0_3_HPD

TMDS3 - D0/D1/D2/CLK

DDC_SCL3 / DDC_SDA3

HDMI2.0_3_5V_DET

HDMI2.0_4_HPD

TMDS4 - D0/D1/D2/CLK

DDC_SCL4 / DDC_SDA4

HDMI2.0_4_5V_DET

HDMI2 with ARC

H

DMI1

H

DMI3

H

DMI4

HDMI_CEC

HDMI_ARC

HDMI_CEC

6. HDMI2.0

- 15 -

RS232C

(IC7200)

WIFI_DM / DP

SOC_RX / TX

USB2.0_2_DM / DP

USB3

DEBUG_RX / TX

Main

USB2

USB2.0_3_DM / DP

MICOM

(IC3000)

Wafer

(P200)

Wafer

(P4000)

DEBUG UART

Wafer

(P201)

5

7 9 10 15 16 19 20

SOC_RX / TX

DCDC OCP

(IC4501)

+5V_USB3

WOL/WIFI_POWER_ON

COMBO_RESET

BT_WAKEUP_DEVICE

BT_WAKEUP_HOST

IR

LED_R

KEY2

KEY1

DCDC OCP

(IC4700)

DOUT1

RIN1

PHONE JACK

US Only

IC

7. USB / WIFI / M-REMOTE / UART(Debug)

- 16 -

I2C_SDA6

EPI PMIC

P7100

Vx1 51P

I2C_SCL6

1.8k Ω

I2C_SDA_1

I2C_SCL_1

Main IC

1.8k Ω

+3.3V_NOR

1.8k Ω

+3.3V_ST

MICOM

I2C_SDA4

I2C_SCL4

NVRAM

AMP

I2C_SDA2

I2C_SCL2

LNB

Tuner

1.8 k Ω

+3.3V_NOR

1.8k Ω

+3.3V_NOR

33 Ω

TCON_I2C_EN

33 Ω

100Ω

33 Ω

EPI / CEDS only

Vx1 only

8. I2C Map

- 17 -

WOL/ETH_POWER_ON

USB_CTL2

Main IC

MICOM

USB1 OCP USB1

INSTANT_BOOT

/USB_ODC2

USB_CTL3

USB2 OCP USB2

/USB_ODC3

SOC_RESET

BIT0~6

HW option

ADC 1~5

PCM_RESET

PCMCIA

OCP

PCM_5V_CTL

DATA_FORMAT_1

Panel

DATA_FORMAT_0

VX1_MSE

AGP_CTRL

HTPDAn/MCKL_A

LOCKAn

PMIC

PWM_DIM2

POWER

PWM_DIM

L/D_CLK

L/D_DO

L/D_VSYNC

TCON_I2C_EN/GCLK_A

VID_CPU

CPU DCDC

VID_CPU2

VID_CORE

CORE DCDC

/TU_RESET1

Tuner

AMP_RESET_N

Audio AMP1

COMP1_DET

Component/AV Jack

HP_DET

H/P Jack

AV1_CVBS_DET

9. GPIO

- 18 -

IC100

RS232C

Debug port

P200

SOC_RX/TX

MICOM DEBUG 4P

P3000

MICOM_DEBUG

AMP

IC5800

AMP_MUTE

MODEL1_OPT_0/1/2/ 3

GND

+13V TO PANEL_VCC

PANEL_CTL

HDMI 1 / 2 / 3 /4

JK3101/JK3102/JK3103/JK3104

HDMI_CEC

RESET IC

IC1300

POWER_DET

POWER WAFER

P1001

INV_CTL

MODE_SELECT_PWM1

RL_ON

I2C_SCL_1_MICOM / I2C_SDA_1_MICOM

WOL/ETH_POWER_ON

SOC_RESET

INSTANT_BOOT

OPT0 NON LOGO LCD/LOGO LCD

NON LOGO OLED/LOGO OLED

OPT1 TV-NON EPI/BOX/TV EPI/BOX

OTP2 RESERVED

OPT3 M16/RTK/H15

MICOM_RESET

MICOM X- TAL

X3001

32.768KHz 51P VX1 Wafer

AM_MODE_DET_OLED

IR / KEY/WIFI/BT

P4000

EDID_WP

3D&L_DIM_EN

3.5V_ST- 1.5V DCDC

IC2303

POWER_ON/OFF2_3

13V- 3.3V NORMAL

IC2300

13V- 1V DCDC

IC2302

POWER_ON/OFF2_4

POWER_ON/OFF1

13V- 5V NORMAL DCDC

IC2500

WIFI_EN

T_CON_SYS_POWER_OFF_OLED

IR

EYE_SCL / EYE_SDA

WOL/WIFI_POWER_ON

BT_WAKEUP_DEVICE

COMBO_RESET

BT_WAKEUP_HOST

KEY1 / KEY2

LED_R

GND

+3.5V WIFI

RETENTION_DISABLE

GND

10k Ω

SYSTEM_DEBUG

Main IC

10. GPIO(MICOM – ABOV)

- 19 -

LDO DCDC

D

13.2V

3.5V ST

4

A

I

C2305

MICOM

IR Ass’y

RS-232

WiFi Module

FET

FET(Q4101)

+AVDD_NODIE

L302

1.5V DDR

3

A

I

C2302

SoC(DDR)

CPU_1V0

3

A

I

C2309

SoC(VDDC_CPU)

FET(Q1101)

Panel_VCC L7601/2 L1100

+AVDD33_AU33

L322

+AVDD_DMPLL

L333

CORE_1V0

1

2A

I

C2310

SoC(VDDC)

LNB L7100

11. Power

- 20 -

D

13.2V

3.3V NORM

3

A

I

C2302

HP Amp

NVRAM

SPDIF OUT

Pull up

GAMMA IC

SoC(

VDDP_3318_C

)

SoC(+VDDP33)

L319

1.8V

1

A

I

C2307

L330

SoC(EMMC1V8)

EMMC VCCQ

EMMC VCC

L2300

Audio Amp

L5801

+3.3V_DEMOD

L6503

+3.3V_TU

L6505

LNB

L7001

5V NORM

4

A

I

C2500

USB1 OCP

USB2 OCP

CI OCP

A13.2V

Audio Amp

EPI_FCIC Flash

L2301

L331

+1.2V_DEMOD

L6900

12. Power 2

- 21 -

400

800

540

521

120

820

LV1

121

500

570

571

LV2

AR1

700

A10

ARC1

530

HP1

HW1

HS1

200

900

EXPLODED VIEW (SET)

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

- 22 -

DISASSEMBLY GUIDE (SET)

1

3

Latch 8 EA

Screw 5EA(M3*5.5)

1

Hook 11 EA

Screw 2EA(P3*10)

Screw 1EA(P4*10)

Hook Latch

1. After Screw Disassemble, please remove B/C from Module

- 23 -

Detach tape

2. Detach Tape

3. Remove all sort of cable

- 24 -

WIFI/BT IR Sub Assy

Disassemble screw(1ea) and

Remove cable from holder

Detach Hook

4. IR assy, Wi-Fi PCB assy disassembly

- 25 -

“A” “B”

1

Screw 9EA(M3*5.5)

1

5. Screw disassembly

- 26 -

6. Speaker disassembly

Detach hook

Screw 4EA(M3*5.5)

1

7. Screw disassembly

- 27 -

TROUBLE SHOOTING GUIDE

Contents of Standard Repair Process

No. Error symptom (High category) Error symptom (Mid category) Page Remarks

1

2 No video/No audio 2

3 Picture broken/ Freezing 3

4 Color error 4

5

6

7

8

9 Wrecked audio/discontinuation/noise 10

10

11

12

A. Video error

B. Power error

C. Audio error

D. Function error

No video/Normal audio 1

Vertical/Horizontal bar, residual image, light spot, external device color error

No power 6

Off when on, off while viewing, power auto on/off

No audio/Normal video 9

Remote control & Local switch checking

MR remote operating checking 12

Wifi operating checking 13

7,8

11

5

14 External device recognition error 14

15 E. Noise Circuit noise, mechanical noise 15

16 F. Exterior error Exterior defect 16

First of all, Check whether there is SVC Bulletin in GSCS System for these model.

Standard Repair Process

Error

symptom

A. Video error

No video/ Normal audio

Established

date

Revised date

First of all, Check whether all of cables between board is inserted properly or not.

(Main B/D↔ Power B/D, LVDS or EPI Cable, Speaker Cable, IR B/D Cable,,,)

☞A18 ☞A1

No video Normal audio

Normal

audio

N

Move to No video/No audio

Y

Check Back Light On with naked eye

☞A18

Check Power Board 13.2V output

On

Normal voltage

N

Repair Power Board or parts

Y N Check Power

Board

13.2V etc.

Y

Replace Inverter

or module

Normal

voltage

N

Repair Power Board or parts

End

Replace T-con/Main

Y

Board or module

1/16

※Precaution

Always check & record S/W Version and White Balance value before replacing the Main Board

☞A4 & A2

Replace Main Board

1

Re-enter White Balance value