LG 43LM5760PTC Owner’s Manual

CONFIDENTIAL

LED TV

SERVICE MANUAL

CHASSIS : LB94M

MODEL : 43LM5700PTC

43LM5760PTC

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL71448404 (1903-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

SOFTWARE UPDATE ............................................................................ 10

BLOCK DIAGRAM ................................................................................. 12

EXPLODED VIEW .................................................................................. 13

DISASSEMBLY GUIDE .......................................................................... 15

TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used LB94M chassis.

3. Test method

(1) Performance: LGE TV test method followed (2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

2. Requirement for Test

Each part is tested as below without special notice (1) Temperature: 25 °C ± 5 °C(77 °C ± 9 °C), CST: 40 °C ± 2 °C (2) Relative Humidity : 60 % ± 10% (3) Power Voltage

: Standard input voltage (AC 100~240V~, 50/60Hz) Standard Voltage of each product is marked by models

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM .

(5) The receiver must be operated for about 5 minutes prior to

the adjustment

4. Model General Specification

No. Item Specication Remarks

1 Market Asia, Oceania, Africa, Middle East

2 Broadcasting system

3 Program coverage

4 Receiving system

5 Video Input RCA PAL, SECAM, NTSC, PAL60 6 Component Input Y/Cb/Cr, Y/ Pb/Pr

7 HDMI Input

8 Audio Input AV Audio / Component Audio / DVI Audio Rear(1EA, AV and DVI use same jack) 9 SPDIF Out(1 EA) Optical Audio out Rear(1EA)

10 USB Input (2 EA) EMF, DivX HD, For SVC (download)

11 Ethernet Connect(1 EA) Optical Audio out STP cable

12 Head phone out Antenna, HDMI1, HDMI2, HDMI3, USB1, USB2, AV, Component Only OCEANIA/ASIA

(1) Digital TV : DVB-T/T2, DVB-C, DVB-S/S2 (2) Analogue TV : PAL B/B, PAL B/G, PAL D/K, PAL-I, SECAM B/G,

Digital TV (Depending on models)

Analogue TV Analogue TV Maximum number of storable programmes : 3000

Analog : Upper Heterodyne Digital : COFDM(DVB-T) Only DVB-T Model Digital : COFDM(DVB-T/T2) Only DVB-T2 Model Digital : QAM

HDMI 1 PC / DTV Format Side, Support ARC

HDMI 2 PC / DTV Format Rear(EU/CIS/MEA), Side(OCEANIA/ASIA) HDMI 3 PC / DTV Format Rear(Except **LM57**)

SECAM D/K, NTSC-M

DVB-T/T2 : VHF, UHF Maximum number of storable programmes : 3000

DVB-S/S2 : C-Band,Ku-Band Maximum number of storable programmes : 6000

DVB-C Maximum number of storable programmes : 3000

► DVB-T

- Guard Interval(Bitrate_Mbit/s): 1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

► DVB-T2 (Depending on models)

- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,

- Modulation : Code Rate QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

► DVB-C (Depending on models)

- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s

- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM

► DVB-S/S2 (Depending on models)

- symbolrate DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s DVB-S (QPSK) : 2 ~ 45Msymbol/s

- viterbi DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8 DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10

Rear(1EA), AV & Component Common

JPEG, MP3, DivX HD Side(2EA)_**LM63** , Side(1EA)_**LM57**

- 6 -

5. External Input Support Format

5.1. Component (Y, PB, PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1 720*480i 15.73 59.94 13.5 SDTV, DVD 480I(525I)

2 720*480i 15.75 60 13.514 SDTV, DVD 480I(525I)

3 720*576i 15.625 50 13.5 SDTV, DVD 576I(625I) 50Hz

4 720*480p 31.47 59.94 27 SDTV 480P

5 720*480p 31.5 60 27.027 SDTV 480P

6 720*576p 31.25 50 27 SDTV 576P 50Hz

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 1280*720 45 60 74.25 HDTV 720P

9 1280*720 37.5 50 74.25 HDTV 720P 50Hz

10 1920*1080 28.125 50 74.25 HDTV 1080I 50Hz,

11 1920*1080 33.72 59.94 74.176 HDTV 1080I

12 1920*1080 33.75 60 74.25 HDTV 1080I

13 1920*1080 56.25 50 148.5 HDTV 1080P

14 1920*1080 67.43 59.94 148.5 HDTV 1080P

15 1920*1080 67.5 60 148.5 HDTV 1080P

- 7 -

5.2. HDMI input

(1) DTV mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1 640*480 31.46 59.94 25.12 SDTV 480P

2 640*480 31.5 60 25.12 SDTV 480P

3 720*480 15.73 59.94 13.5 SDTV, DVD 480I(525I)

Spec. out but display4 720*480 15.75 60 13.51 SDTV, DVD 480I(525I)

5 720*576 15.62 50 13.5 SDTV, DVD 576I(625I) 50Hz

6 720*480 31.47 59.94 27 SDTV 480P

7 720*480 31.5 60 27.02 SDTV 480P

8 720*576 31.25 50 27 SDTV 576P

9 1280*720 44.96 59.94 74.17 HDTV 720P

10 1280*720 45 60 74.25 HDTV 720P

11 1280*720 37.5 50 74.25 HDTV 720P

12 1920*1080 28.12 50 74.25 HDTV 1080I

13 1920*1080 33.72 59.94 74.17 HDTV 1080I

14 1920*1080 33.75 60 74.25 HDTV 1080I

15 1920*1080 26.97 23.97 63.29 HDTV 1080P

16 1920*1080 27 24 63.36 HDTV 1080P

17 1920*1080 33.71 29.97 79.12 HDTV 1080P

18 1920*1080 33.75 30 79.2 HDTV 1080P

19 1920*1080 56.25 50 148.5 HDTV 1080P

20 1920*1080 67.43 59.94 148.35 HDTV 1080P

21 1920*1080 67.5 60 148.5 HDTV 1080P

22 1920*1080 112.5 100 297 UDTV 2160P

23 1920*1080 134.86 119.88 296.7 UDTV 2160P

24 1920*1080 135 120 297 UDTV 2160P

25 3840*2160 53.95 23.98 296.7 UDTV 2160P

26 3840*2160 54 24 297 UDTV 2160P

27 3840*2160 56.25 25 297 UDTV 2160P

28 3840*2160 61.43 29.97 296.7 UDTV 2160P

29 3840*2160 67.5 30 297 UDTV 2160P

30 3840*2160 112.5 50 594 UDTV 2160P

31 3840*2160 134.86 59.94 593.4 UDTV 2160P

32 3840*2160 135 60 594 UDTV 2160P

33 3840*2160 225 100 1188 UDTV 2160P

34 3840*2160 270 119.88 1186.8 UDTV 2160P

35 3840*2160 270 120 1188 UDTV 2160P

36 4096*2160 53.95 23.98 296.7 UDTV 2160P

37 4096*2160 54 24 297 UDTV 2160P

38 4096*2160 56.25 25 297 UDTV 2160P

39 4096*2160 61.43 29.97 296.7 UDTV 2160P

40 4096*2160 67.5 30 297 UDTV 2160P

41 4096*2160 112.5 50 594 UDTV 2160P

42 4096*2160 134.86 59.94 593.4 UDTV 2160P

43 4096*2160 135 60 594 UDTV 2160P

44 4096*2160 225 100 1188 UDTV 2160P

45 4096*2160 270 119.88 1186.8 UDTV 2160P

46 4096*2160 270 120 1188 UDTV 2160P

47 7680*4320 107.89 23.98 1188 8K

48 7680*4320 108 24 1188 8K

49 7680*4320 110 25 1188 8K

50 7680*4320 131.87 29.97 1188 8K

51 7680*4320 132 30 1188 8K

52 7680*4320 220 50 2376 8K

53 7680*4320 263.74 59.94 2376 8K

54 7680*4320 264 60 2376 8K

This will be added in USERGUIDE after MR SW update event.

8K Model Only. This will be added in USERGUIDE after 8K model development.

- 8 -

(2) PC mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1 640*350 31.46 70.09 25.17 EGA

2 720*400 31.46 70.08 28.32 DOS

3 640*480 31.46 59.94 25.17 VESA(VGA)

4 800*600 37.87 60.31 40 VESA(SVGA)

5 1024*768 48.36 60 65 VESA(XGA)

6 1360*768 47.71 60.01 84.75 VESA(WXGA)

7 1152*864 54.34 60.05 80 VESA

8 1280*1024 63.98 60.02 109 SXGA Support to HDMI-PC

9 1920*1080 67.5 60 158.4

10 1920*1080 134.86 119.88 296.7 UDTV 2160P

11 1920*1080 135 120 297 UDTV 2160P

12 3840*2160 53.95 23.98 296.7 UDTV 2160P

13 3840*2160 54 24 297 UDTV 2160P

14 3840*2160 56.25 25 297 UDTV 2160P

15 3840*2160 61.43 29.97 296.7 UDTV 2160P

16 3840*2160 67.5 30 297 UDTV 2160P

17 3840*2160 112.5 50 594 UDTV 2160P

18 3840*2160 134.86 59.94 593.4 UDTV 2160P

19 3840*2160 135 60 594 UDTV 2160P

20 3840*2160 225 100 1188 UDTV 2160P

21 3840*2160 270 119.88 1186.8 UDTV 2160P

22 3840*2160 270 120 1188 UDTV 2160P

23 4096*2160 53.95 23.98 296.7 UDTV 2160P

24 4096*2160 54 24 297 UDTV 2160P

25 4096*2160 56.25 25 297 UDTV 2160P

26 4096*2160 61.43 29.97 296.7 UDTV 2160P

27 4096*2160 67.5 30 297 UDTV 2160P

28 4096*2160 112.5 50 594 UDTV 2160P

29 4096*2160 134.86 59.94 593.4 UDTV 2160P

30 4096*2160 135 60 594 UDTV 2160P

31 4096*2160 225 100 1188 UDTV 2160P

32 4096*2160 270 119.88 1186.8 UDTV 2160P

33 4096*2160 270 120 1188 UDTV 2160P

34 2560*1440 88.78 59.95 241.5 3K

35 2560*1440 182.99 119.99 497.7 3K

36 7680*4320 107.89 23.98 1188 8K

37 7680*4320 108 24 1188 8K

38 7680*4320 110 25 1188 8K

39 7680*4320 131.87 29.97 1188 8K

40 7680*4320 132 30 1188 8K

41 7680*4320 220 50 2376 8K

42 7680*4320 263.74 59.94 2376 8K

43 7680*4320 264 60 2376 8K

WUXGA(Reduced Blanking)

This will be added in USERGUIDE after MR SW update event.

(UHD, 8K 60Hz Model only), UHD DeepColor On

8K Model Only. This will be added in USERGUIDE after 8K model development.

- 9 -

SOFTWARE UPDATE

1. USB DOWNLOAD

(1) Insert the USB memory Stick to the USB port. (2) Automatically detect the SW Version and show the below

message.

(3) Click [YES]: initiate the download and install of the update.

2. NSU DOWNLOAD

(This Function is needed to connect to the internet.)

Case 1) Allow Automatic Updates Toggle Item

(1) Menu -> All Settings -> General -> About This TV

(2) Silent Update_Pop-up

When the download and install of the update is complete, the TV issues a Toast notification letting the user know that the update is complete and a reboot is required.

(4) Click [Check Now]: move to “About This TV” page for update. (5) TV is updating.

(6) After finished the update, below Pop-up appear.

(3) If you want to see the update progress, go to [Menu → All

Settings → General → About This TV]

(4) If you want to cancel update, click (1.1) CANCEL UPDATE

(7) Click [Yes] : TV will be DC OFF → ON. (8) After TV turned on, Check the updated SW Version and

Tool Option.

- 10 -

(5) [NO] : Keep updating [Yes] : Cancel updating

Case 2) NOT Allow Automatic Updates Toggle Item

(1) Menu -> All Settings -> General -> About This TV

(2) TV will automatically check for updates when every TV boots

When an updated is detected, the TV will issue an Alert letting the user know that an update is available.

(3) [Yes] : Initiate the download and install of the update

[No] : Close the pop-up. The Alert will come back again when TV checks again.

(4) The following pop up window appears.

(5) [CHECK NOW] : Go to the About this TV setting page

[CLOSE] : Close the pop-up

- 11 -

BLOCK DIAGRAM

Y

SUB

ASS

WIFI

X_TAL

24MHz

EEPROM (256Kb)

I2C

eMMC 5.1 (4GB)

30P

LVDS

Audio AM P

I2S

I2C

IR / KEY / Sensor

USB_WIFI

Main Soc

(Embedded)

Digital Demod

Analog Demod

IF (+/-)

Tuner

1.5A

OCP

USB1

USB

1.5A

OCP

USB2

(LM57 OPT)

HDMI

MUX

(ARC)

HDMI1

HDMI2

HDMI3

CVBS/YPbPr

AV/COMP

(LM57 OPT)

SPDIF OUT

H/P OUT

H/P

OPTIC

ETHERNET

LAN

REAR

SIDE

- 12 -

REAR

EXPLODED VIEW (SET)

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

400

521

120

571

540

800

570

HP1

900

500

530

LV1

820

HS1

HW1

121

200T

200A

LED Array Ass’y

700

A10

Set + Stand

200P

- 13 -

ARC1

AR1

EXPLODED VIEW (MODULE)

IMPORTANT NOTICE

MRC use only

* MRC : Module Repair Center

200PPR200P

200PPF

Rear Side

POL(Rear) Optical Sheet

Ass’y

200PC 200SL1 200SR1

- 14 -

POL(Front) Panel

DISASSEMBLY GUIDE

3

1

3

2

3

4

5

1. Unlock screws (“1”: 1EA, ”2”: 2EA, “3”: 5EA) to separate back cover assembly from module.

Detach the Side AV Label(“4”).

2. Detach the Tape(“5”).

- 15 -

3. Separate connectors (“6”) from Main/Power PCB and module.

B

A

6

B

A

6

7

6

Separate Speaker(“7”: 2 EA) from module.

- 16 -

4. Unlock screw (“8”: 18 EA) to separate from module.

8

9

8

10

* 1 pole Stand Supporter (“9”: 2 EA) is applied on 1pole Stand type.

5. Detach the Insulation Sheet(“10”).

- 17 -

6. Separate connectors(“13”) from IR PCB(“12”).

12

11

13

14 14

15

16 17

18

Lift the latch(“14”) to the upside and push the button(“15”) for separation.

7. Separate connectors(“16”) from wifi PCB(“18”).

Separate wifi PCB(“18”) from Wifi Bracket of Latch(“17”).

- 18 -

8. Detach the foot rubber(“20” : 2 EA) from 2pole Stand(“19”).

19

20

- 19 -

DISASSEMBLY GUIDE (MODULE)

1. LCM disassemble/assemble guide

■ Step 1 Disassemble the Main, PSU, SPK and S-PCB cable.

■ Step 2 Disassemble the Case Top Screw.

* * Case top screw (U/L/R/D) : 3/3/3/3 EA – Total 12 EA

■ Step 3 Disassemble the Case Top .

■ Step 4 Remove the EMI Tape on the S-PCB and Separate the S-PCB.

* *EMI Tape : 2 EA

- 20 -

■ Step 5 Disassemble the Panel.

■ Step 6 Disassemble the guide panel.

■ Step 7 Disassemble the Optical Sheet 2ea /Diffuser Plate 1 EA.

■ Step 8 Disassemble the DPS, and the Reflector.

* Rotate the DPS to remove

(2 EA)

* Be careful not to tear the Reflector sheet.

- 21 -

2. LED Array disassemble/assemble guide

■ LED Array disassemble

(1) Disassemble connector. (2) From cover bottom, LED Array remove. (3) rom cover bottom, LED Array double tape remove.

■ LED Array assemble

Step 1. Double tape attach

* Completion of double tape attach (3 EA)

(1) Attach double tape (3 EA) (2) Remove double tape protective film

* LED Array & Double Tape must be matched with the P/No.

Step 2. LED Array attach

(1) Cover Bottom’s guide embo & LED Array arrange and attach. (2) LED array squeeze, along cover bottom's surface. (3) Connect LED Array to connector.

* LED Array Total 3 EA

* Completion of LED Array assemble (3 EA)

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TROUBLE SHOOTING GUIDE

Contents of Standard Repair Process

No. Error symptom (High category) Error symptom (Mid category) Page Remarks

1 2 No video/No audio 2 3 Picture broken/ Freezing 3 4 Color error 4

5

6

7

8 9 Wrecked audio/discontinuation/noise 10

10 11 12

A. Video error

B. Power error

C. Audio error

D. Function error

No video/Normal audio 1

Ver tical /Hori z ontal bar, residual image, light spot, external device color error

No power 6 Off when on, off while viewing, power auto

on/off No audio/Normal video 9

Remote control & Local switc h checking 11

MR18 operating checking 12

Wifi operating checking 13

7,8

5

13 External device recogni tion error 14 14 E. Noise Circuit noise, mechanical noi se 15 15 F. Exterior error Exterior defect 16

First of all, Check whether there is SVC Bulletin i n GSCS System for these model.