LG 43LH5500 Schematic

Internal Use Only

LED TV

SERVICE MANUAL

CHASSIS : LA66K

MODEL : 43LH5500

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL69442201 (1601-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

BLOCK DIAGRAM ...................................................................................17

EXPLODED VIEW .................................................................................. 18

PRODUCT DISASSEMBLY PROCESS .................................................. 19

SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX

TROUBLESHOOTING .............................................................. APPENDIX

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This spec sheet is applied to the LED TV used LA66K chassis

2. Test condition

Each part is tested as below without special notice.

(1) Temperature : 25 ºC±5 ºC (77 ºC±9ºC), CST : 40 ºC±5 ºC (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage

Standard input voltage (100~240V@ 50/60Hz)

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

(1) Performance: LGE TV test method followed (2) Demanded other specification

- Safety : UL, CSA, IEC specification

- EMC: FCC, ICES, IEC specification

4. General Specification

No Item Specication Result Remark

1. Receiving System ATSC / NTSC-M / 64 & 256 QAM

2. Available Channel VHF : 02~13 UHF : 14~69 DTV : 02-69 CATV : 01~135 CADTV : 01~135

3. Input Voltage AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz

4. Market NORTH AMERICA

5. Screen Size 32", 43”, 49", 55”

6. Aspect Ratio 16:9

7. Tuning System FS

8. Module LC550DUE-FJA1 LGD FHD

NC550DUE-VCCP3 CSOT FHD

NC490DUE-SADP3 LGD FHD

NC490DUE-ABEX1 BOE FHD

HC430DUN-SLVX1 LGD FHD

HC430DUN-ABVX1 BOE FHD

HC320DXN-ABVS1 BOE HD

HC320DXN-SLVS5 LGD HD

HC320DXN-VHVS1 SHARP HD

9. Operating Environment Temp : 0 ~ 40 deg Humidity : ~ 80 %

10. Storage Environment Temp : -20 ~ 60 deg Humidity : ~ 85 %

Only for training and service purposes

- 6 -

5. Supported video resolutions

5.1. Component 2D input(Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

1 720*480 15.730 60.000 13.513 SDTV ,DVD 480I

2 720*480 15.730 59.940 13.500 SDTV ,DVD 480I

3 720*480 31.500 60.000 27.027 SDTV 480P

4 720*480 31.470 59.940 27.000 SDTV 480P

5 1280*720 45.000 60.000 74.250 HDTV 720P

6 1280*720 44.960 59.940 74.176 HDTV 720P

7 1920*1080 33.750 60.000 74.250 HDTV 1080I

8 1920*1080 33.720 59.940 74.176 HDTV 1080I

9 1920*1080 67.500 60.000 148.500 HDTV 1080P

10 1920*1080 67.432 59.940 148.352 HDTV 1080P

11 1920*1080 27.000 24.000 74.250 HDTV 1080P

12 1920*1080 26.970 23.976 74.176 HDTV 1080P

13 1920*1080 33.750 30.000 74.250 HDTV 1080P

14 1920*1080 33.710 29.970 74.176 HDTV 1080P

Only for training and service purposes

- 7 -

5.2. HDMI Input (PC/DTV)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

1 640*350 31.46 70.09 25.17 EGA

2. 720*400 31.46 70.08 28.32 DOS

3. 640*480 31.46 59.94 25.17 VESA(VGA)

4 800*600 37.87 60.31 40.00 VESA(SVGA)

5 1024*768 48.36 60.00 65.00 VESA(XGA)

6 1152*864 54.34 60.05 80.00 VESA

7 1280*1024 63.98 60.02 108.00 VESA (SXGA) FHD only

8 1360*768 47.71 60.01 85.50 VESA (WXGA)

9 1920*1080 67.5 60.00 148.5 WUXGA

(Reduced Blanking)

DTV

1 640 * 480 31.46 59.94 25.125 SDTV 480P

2 640 * 480 31.5 60.00 25.125 SDTV 480P

3 720 * 480 15.73 59.94 13.500 SDTV 480I Spec. out but display

4 720 * 480 15.75 60.00 13.514 SDTV 480I Spec. out but display

5 720 * 480 31.47 59.94 27.00 SDTV 480P

6 720 * 480 31.5 60 27.027 SDTV 480P

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 1280*720 45 60.00 74.25 HDTV 720P

9 1920*1080 33.72 59.94 74.176 HDTV 1080I

10 1920*1080 33.75 60.00 74.25 HDTV 1080I

11 1920*1080 26.97 23.97 63.296 HDTV 1080P

12 1920*1080 27.00 24.00 63.36 HDTV 1080P

13 1920*1080 33.71 29.97 79.120 HDTV 1080P

14 1920*1080 33.75 30.00 79.20 HDTV 1080P

15 1920*1080 67.43 59.94 148.350 HDTV 1080P

16 1920*1080 67.5 60.00 148.50 HDTV 1080P

FHD only

Only for training and service purposes

- 8 -

ADJUSTMENT INSTRUCTION

1. Application

This spec. sheet applies to LA66K Chassis applied LED TV all models manufactured in TV factory

2. Specification

(1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation

transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of

25 ±5 ºC of temperature and 65±10% of relative humidity if

there is no specific designation (4) The input voltage of the receiver must keep 100~240V,

50/60Hz (5) The receiver must be operated for about 5 minutes prior to

the adjustment when module is in the circumstance of over

ºC

In case of keeping module is in the circumstance of 0°C, it

should be placed in the circumstance of above 15°C for 2

hours In case of keeping module is in the circumstance of below

-20°C, it should be placed in the circumstance of above

15°C for 3 hours.

※ Caution When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area

3. Adjustment items

3.1. Main PCBA Adjustments

(1) ADC adjustment(OTP) : Component (2) EDID downloads for HDMI

3.2. Final assembly adjustment

(1) White Balance adjustment (2) RS-232C functionality check (3) Factory Option setting per destination (4) Shipment mode setting (In-Stop) (5) GND and HI-POT test

4. MAIN PCBA Adjustments

4.1. ADC Calibration

- An ADC calibration is not necessary because MAIN SoC (LGExxxx) is already calibrated from IC Maker

- If it needs to adjust manually, refer to appendix.

4.2. MAC Address, ESN Key and Widevine Key download

4.2.1. Equipment & Condition

(1) Play file: keydownload.exe

4.2.2. Communication Port connection

(1) Key Write: Com 1,2,3,4 and 115200 (Baudrate) (2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)

4.2.3. Download process

(1) Select the download items. (2) Mode check: Online Only (3) Check the test process

- US, Canada models: DETECT -> MAC_WRITE ->

WIDEVINE_WRITE

- Korea, Mexico models: DETECT -> MAC_WRITE ->

WIDEVINE_WRITE (4) Play : START (5) Check of result: Ready, Test, OK or NG

4.2.4. Communication Port connection

(1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C

Port

4.2.5. Download

(1) All models (16Y LCD TV + MAC + Widevine + ESN Key

and HDCP2.2)

3.3. Appendix

(1) Tool option menu, USB Download (S/W Update, Option and

Service only) (2) Manual adjustment for ADC calibration and White balance. (3) Shipment conditions, Channel pre-set

Only for training and service purposes

4.2.6. Inspection

- In INSTART menu, check these keys.

- 9 -

4.3. LAN port Inspection (Ping Test)

4.3.1. Equipment setting

(1) Play the LAN Port Test PROGRAM. (2) Input IP set up for an inspection to Test Program.

* IP Number : 12.12.2.2.

4.3.2. LAN PORT inspection (PING TEST)

(1) Play the LAN Port Test Program. (2) connect each other LAN Port Jack. (3) Play Test (F9) button and confirm OK Message. (4) remove LAN CABLE

4.4.3. EDID DATA

4.4.3.1. HD PCM (2D 8bit xvYCC : off) : 32LH570B-UC (1) HDMI1 (6D , 08)

(2) HDMI2 (6D , F8)

Step 1) Step 3) Check ‘OK’ Signal

4.4. EDID Download

4.4.1 Overview

▪ It is a VESA regulation. A PC or a MNT will display an

optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.

4.4.2 Equipment

▪ Since embedded EDID data is used, EDID download JIG,

HDMI cable and D-sub cable are not need.

▪ Adjust remocon

4.4.3.2. HD AC3 (2D 8bit xvYCC : off) : 32LH570B-UC (1) HDMI1 (6D , 96)

Only for training and service purposes

- 10 -

(2) HDMI2 (6D , 86)

4.4.3.3. HD DTS (2D 8bit xvYCC : off) : 32LH570B-UC (1) HDMI1 (6D , 8D)

4.4.3.4. FHD PCM (2D 8bit xvYCC : off) : 43/49/55LH5700-UD (1) HDMI1 (E5 , CC)

(2) HDMI2 (E5 , BC)

(2) HDMI2 (6D , 7D)

Only for training and service purposes

4.4.3.5. FHD AC3 (2D 8bit xvYCC : off) : 43/49/55LH5700-UD (1) HDMI1 (E5 , 5A)

- 11 -

(2) HDMI2 (E5 , 4A)

* If TV internal pattern is used, not needed

4.4.3.6. FHD DTS (2D 8bit xvYCC : off) : 43/49/55LH5700-UD (1) HDMI1 (E5 , 51)

5. Final Assembly Adjustment

5.1. White Balance Adjustment

5.1.1. Overview

5.1.1.1. W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel’s W/B deviation (2) How-it-works: When R/G/B gain in the OSD is at 192, it

means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.

(3) Adj. condition: normal temperature

- Surrounding Temperature: 25±5 °C

- Warm-up time: About 5 Min

- Surrounding Humidity: 20% ~ 80%

- Before White balance adjustment, Keep power on status, don’t power off

5.1.1.2. Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark surrounding.

(2) Probe location: Color Analyzer (CA-210) probe should be

within 10cm and perpendicular of the module surface (80°~ 100°) (3) Aging time

- After Aging Start, Keep the Power ON status during 5 Minutes.

- In case of LCD, Back-light on should be checked using no signal or Full-white pattern.

(2) HDMI2 (E5 , 41)

5.1.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)

(2) Adj. Computer (During auto adj., RS-232C protocol is

needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/204-Gray

(Model: 217, Pattern: 49) ※ Color Analyzer Matrix should be calibrated using CS-1000

5.1.3. Equipment connection

Color Analyzer

Probe

RS-232C

Pattern Generator

Signal Source

RS-232C

Computer

RS-232C

Only for training and service purposes

- 12 -

5.1.4. Adjustment Command (Protocol)

(1) RS-232C Command used during auto-adj.

RS-232C COMMAND

CMD DATA ID

Explanation

Wb 00 00 Begin White Balance adj.

Wb 00 ff End White Balance adj.

(internal pattern disappears )

(2) Adjustment Map

Adj. item

Cool R Gain j g 00 C0 TBD

G Gain j h 00 C0 TBD

B Gain j i 00 C0 TBD

R Cut TBD

G Cut TBD

B Cut TBD

Medium R Gain j a 00 C0 TBD

G Gain j b 00 C0 TBD

B Gain j c 00 C0 TBD

R Cut TBD

G Cut TBD

B Cut TBD

Warm R Gain j d 00 C0 TBD

G Gain j e 00 C0 TBD

B Gain j f 00 C0 TBD

R Cut TBD

G Cut TBD

Command (lower caseASCII)

CMD1 CMD2 MIN MAX

Data Range (Hex.)

Default (Decimal)

5.1.5. Adjustment method

5.1.5.1. Auto WB calibration (1) Set TV in ADJ mode using P-ONLY key (or POWER ON

key)

(2) Place optical probe on the center of the display

- It need to check probe condition of zero calibration before

adjustment. (3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message,

check adjustment status of pre-set mode (Cool, Medium,

Warm) (6) Remove probe and RS-232C cable.

▪ W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need

5.1.5.2. Manual adjustment (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface..

(3) Press ADJ key -> EZ adjust using adj. R/C à 9. White-

Balance then press the cursor to the right (KEY►). When KEY(►) is pressed 206 Gray internal pattern will be

displayed. (4) Adjust Cool modes (i) Fix the one of R/G/B gain to 192 (default data) and

decrease the others.

( If G gain is adjusted over 172 and R and B gain less than

192 , Adjust is O.K.) (ii) If G gain is less than 172, Increase G gain by up to 172, and then increase R gain and

G gain same amount of increasing G gain. (iii) If R gain or B gain is over 255, Readjust G gain less than 172, Conform to R gain is 255 or

B gain is 255 (5) Adjust two modes (Medium / Warm) Fix the one of R/G/B

gain to 192 (default data) and decrease the others.

(6) Adj. is completed, Exit adjust mode using “EXIT” key on

Remote controller.

5.1.6. Reference (White Balance Adj. coordinate and color temperature)

(1) Luminance: 204 Gray, 80IRE (2) Standard color coordinate and temperature using CS-1000

(over 26 inch)

5.1.7. Reference (White Balance Adj. coordinate and color temperature)

▪ Luminance: 204 Gray ▪ Standard color coordinate and temperature using CS-1000

(over 26 inch)

Mode

Cool 0.271 0.270 13,000K 0.0000

Medium 0.286 0.289 9,300K 0.0000

Warm 0.313 0.329 6,500K 0.0000

Coordinate

X Y

Temp △uv

Only for training and service purposes

- 13 -

▪ Standard color coordinate and temperature using

CA-210(CH-14) – by aging time

(1) Normal line in Korea (From January to February)

Aging time

(Min)

1 0-2 286 295 301 314 328 354

2 3-5 284 290 299 309 326 349

3 6-9 282 287 297 306 324 346

4 10-19 279 283 294 302 321 342

5 20-35 276 278 291 297 318 337

6 36-49 274 275 289 294 316 334

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

▪ Standard color coordinate and temperature using

CA-210(CH-14) – by aging time

(2) Normal line in Korea (From March to December) : LGD

Normal line in Mexico : LGD

Aging time

(Min)

1 0-2 282 289 297 308 324 348

2 3-5 281 287 296 306 323 346

3 6-9 279 284 294 303 321 343

4 10-19 277 280 292 299 319 339

5 20-35 275 277 290 296 317 336

6 36-49 274 274 289 293 316 333

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

Cool Medium Warm

X Y X Y X Y

271 270 286 289 313 329

Cool Medium Warm

X Y X Y X Y

271 270 286 289 313 329

5.2. Option selection per country

5.2.1. Overview

(1) Tool option selection is only done for models in Non-USA

North America due to rating

(2) Applied model: LA42B Chassis applied to CANADA and

MEXICO

5.2.2. Country Group selection

(1) Press ADJ key on the Adj. R/C, and then select Country

Group Menu

(2) Depending on destination, select US, then on the lower

Country option, select US, CA, MX.

Selection is done using +, - KEY

5.2.3. Tool Option inspection

▪ Press Adj. key on the Adj. R/C, then select Tool option

* Tool option can be reconstructed by Software

5.2.3. Country Group Code

Country Area Option

US 02

5.3. Wi-Fi MAC Address Check

5.3.1. Using RS232 Command

Command Set ACK

Transmission [A][l][][Set ID][][20][Cr] [O][K][x] or [N][G]

5.3.2. Check the menu on in-start

(3) O/S Module(AUO, INX, Sharp, CSOT, BOE)

cool med warm

x y x y x y

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

Only for training and service purposes

- 14 -

5.6. HDMI ARC Function Inspection

5.6.1. Test equipment

- Optic Receiver Speaker

- MSHG-600 (SW: 1220 ↑)

- HDMI Cable (for 1.4 version)

6. AUDIO output check

6.1. Audio input condition

(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation (2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)

5.6.2. Test method

(1) Insert the HDMI Cable to the HDMI ARC port from the

master equipment (HDMI1)

(2) Check the sound from the TV Set

(3) Check the Sound from the Speaker or using AV & Optic

TEST program (It’s connected to MSHG-600)

* Remark: Inspect in Power Only Mode and check SW version

in a master equipment

6.2. Specification

No Item Min Typ Max Unit Remark

1 Audio

practical max Output, L/R (Distortion=10% max Output)

2 2.7

4.5

6.0

4.03

5.0

6.32

3.0

4.24

6.0

6.93WVrms

3.6

4.64WVrms

(1) Measurement condition

- EQ/AVL/Clear Voice: Off

(2) Speaker (6Ω

Impedance) (3) 49/43LH57

(1) Measurement condition

- EQ/AVL/Clear Voice: Off

(2) Speaker (6Ω

Impedance) (3) 32LH57

7. GND and HI-POT Test

7.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

7.2. GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process automatica

5.7. Ship-out mode check (In-stop)

▪ After final inspection, press In-Stop key of the Adj. R/C and

check that the unit goes to Stand-by mode.

Only for training and service purposes

- 15 -

7.3. Checkpoint

(1) Test voltage

Products/Model TV

2Poles Other 3000V(AC)/

3Poles Other 1500V(AC)/

Cut off current 100mA(AC)/100mA(DC)

Earth Continutiy test

(3Poles only)

(2) TEST time: 1 second (3) TEST POINT

- GND Test = POWER CORD GND and SIGNAL CABLE GND.

- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms

4242V(DC)

2121V(DC)

≤0.1Ὼ at 25A/1 sec

9. USB S/W Download (optional, Service only)

(1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick

- If your downloaded program version in USB Stick is lower than that of TV set, it didn’t work. Otherwise USB data is automatically detected.

(3) Show the message “Copying files from memory”

(4) Updating is staring.

10. Optional adjustments

10.1. Manual White balance Adjustment

10.1.1. Adj. condition and cautionary items

(1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark surrounding.

(2) Probe location: Color Analyzer (CA-210) probe should be

within 10cm and perpendicular of the module surface (80°~ 100°) (3) Aging time

- After Aging Start, Keep the Power ON status during 5

Minutes.

- In case of LCD, Back-light on should be checked using no

signal or Full-white pattern

10.1.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14) (2) Adj. Computer (During auto adj., RS-232C protocol is

needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/216-Gray

(Model: 217, Pattern: 78)

10.1.3. Adjustment

(1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface.

(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-

Balance then press the cursor to the right (KEY►).

When KEY(►) is pressed 216 Gray internal pattern will be

displayed. (4) One of R Gain / G Gain / B Gain should be fixed at 192,

and the rest will be lowered to meet the desired value.

(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of

color temperature.

▪ If internal pattern is not available, use RF input. In EZ Adj.

menu 6.White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner(ON). By selecting OFF, you can adjust using RF signal in 216 Gray pattern.

(5) Updating Completed, The TV will restart automatically (6) If your TV is turned on, check your updated version and

Tool option.

* If downloading version is more high than your TV have, TV

can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ ATV test on production line.

* After downloading, TOOL OPTION setting is needed again. (1) Push "IN-START" key in service remote controller. (2) Select "Tool Option 1" and Push “OK” button. (3) Punch in the number. (Each model has their number.)

Only for training and service purposes

- 16 -

BLOCK DIAGRAM

SUB

ASSY

KEY

I2C

WIFI

eMMC 5.0 (4GB)

DDR3 1866 2Gb x16

X_TAL

24MHz

EEPROM (256Kb)

I2C

* HD Model : 30P

51P

LVDS

Audio AM P

I2S

I2C

USB_WIFI

IR / KEY

Sub Micom

(R5F100GEAFB)

I2C

(NON MCP)

HDMI

MUX

Digital Demod

Analog Demod

USB

CVBS/YPbPr

ETHERNET

SPDIF OUT

RS-232

Only for training and service purposes

IF (+/-)

Tuner

REAR

1.5A

OCP

USB1

SIDE

HDMI1

- 17 -

(ARC)

HDMI2

AV/COMP

REAR

LAN

OPTIC

* RS-232 US Only

RS-232

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these spec ial safety parts s hould be replaced with the same compone nts as recommended in this manual to prevent, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

530

IMPORTANT SAFETY NOTICE

200

900

700

400

120

522

500

600

521

570

540

Only for training and service purposes

- 18 -

Product Disassembly Process

List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1.OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting the locations of items contained within the product which require selective treatment

(with descriptions and arrows identifying locations) can be inserted below:

Only for training and service purposes

- 19 -

[Fig.1]

AAA

[Fig.2]

Only for training and service purposes

- 20 -

[Fig.3]

[Fig.4]

Only for training and service purposes

- 21 -

[Fig.5]

Only for training and service purposes

- 22 -

I2C

LGE Internal Use Only

NVRAM

IC100

AT24C256C-SSHL-T

GND

NVRAM_ATMEL

+3.3V_NORMAL

VCC

0.1uF

SCL

SDA

C112

Write Protection

- Low : Normal Operation

- High : Write Protection

AR101

X-TAL

3225

SUNNY ELECTRONICS CORPORATION

X100

8pF

8pF C101-*1

C100-*1

8pF

50V

0CZZB00024A

10pF Option

I2C_1 : AMP, L/D, NVM, TCON I2C_2 : TUNER I2C_3 : MICOM I2C_4 : S/Demod,T2/Demod, LNB ==> only for LNB - Satellite Model

+3.3V_SB

AR102

OPT

3.3K

+3.3V_NORMAL

R141

R140

C100 10pF 50V

10pF

X-TAL_1

R115

1.8K

GND_1

+3.3V_TUNER

R116

1.8K

24MHz

GND_2

X-TAL_2

+3.3V_NORMAL

C101 10pF 50V

10pF

AR103

3.3K

R137 1M

XTAL_IN

XTAL_OUT

I2C_SCL1

I2C_SDA1

I2C_SCL2 I2C_SDA2 I2C_SCL3 I2C_SDA3

NVRAM_ROHM

IC100-*1

BR24G256FJ-3

GND

I2C_SCL1 I2C_SDA1

INSTANT_BOOT

VCC

SCL

SDA

PCM_5V_CTL

PWM_DIM2

PWM_DIM

+3.3V_SB

R105 10K

OPT

R106 10K

OPT

+3.3V_NORMAL

R138

10K

NON_EU

PWM_DIM2

100

RETENTION_DISABLE

R136

R135

MIU1_STR_PD

MIU0_STR_PD

MIU1_STR_PD

MIU0_STR_PD

AMP_RESET_N

TP1030

TP1031

R152 33

AGP

WOL_WAKE_UP_SOC

DDCA_CK DDCA_DA

DDTS_TX DDTS_RX

BIT7

5V_DET_HDMI_2

AV_CVBS_DET

SOC_TX

COMP2_DET /USB_OCD1 /USB_OCD2

SOC_RX

USB_CTL1

/TU_RESET1

M_RFModule_RESET

5V_DET_HDMI_1 5V_DET_HDMI_3

USB_CTL2

I2C_SCL1 I2C_SDA1

I2C_SCL2

I2C_SDA2

I2C_SCL3

I2C_SDA3

P/NO MCP : EAN64207701 (MSD93F2GW) NON MCP : EAN64207702 (MSD93F2G)

LGE6322(MSD93F2G, w/oT2S2 : M2)

A25

PWM0

B26

PWM1

B25

PWM2

C24

PWM3

PWM_PM

SAR0

SAR1

SAR2

SAR3

SAR4

PM_SPI_CK

PM_SPI_DI

PM_SPI_DO

NC_13

GPIO_PM[6]/(SPI-CZ1N)

GPIO_PM[10]/(SPI-CZ2N)

PM_SPI_HOLDN(GPIO)

PM_SPI_WPN/(GPIO)

DDCA_CK

DDCA_DA

J21

DDCR_CK

H21

DDCR_DA

H22

UART_TX2

H23

UART_RX2

E22

GPIO7/TX1

F21

GPIO8/RX1

E20

GPIO11/TX3

F20

GPIO12/RX3

AB6

PCM2_WAIT_N/TX4

M23

PCM2_IRQA_N

M22

PCM2_CE_N

AC6

NC_14

GPIO_PM[0]

GPIO_PM[1](PM_UART)

GPIO_PM[2]

GPIO_PM[3]

GPIO_PM[4]

GPIO_PM[5](PM_UART)

GPIO_PM[7]

GPIO_PM[8]

GPIO_PM[9]

GPIO_PM[11]/(PM_UART)

GPIO_PM[12](PM_UART)

GPIO_PM[15]

K21

GPIO17/SCKM0

L22

GPIO18/SDAM0

K22

GPIO15/SCKM2

L21

GPIO14/SDAM2

J22

TCON5/SCKM4

K23

TCON4/SDAM4

NON-MCP

EAN64207702

IC101

R_ODD[7]/LVB0N R_ODD[6]/LVB0P R_ODD[5]/LVB1N R_ODD[4]/LVB1P R_ODD[3]/LVB2N

R_ODD[2]/LVB2P R_ODD[1]/LVBCLKN R_ODD[0]/LVBCLKP

G_ODD[7]/LVB3N

G_ODD[6]/LVB3P

G_ODD[5]/LVB4N

G_ODD[4]/LVB4P

G_ODD[3]/LVA0N

G_ODD[2]/LVA0P

G_ODD[1]/LVA1N

G_ODD[0]/LVA1P

B_ODD[7]/LVA2N

B_ODD[6]/LVA2P B_ODD[5]/LVACLKN B_ODD[4]/LVACLKP

B_ODD[3]/LVA3N

B_ODD[2]/LVA3P

B_ODD[1]/LVA4N

B_ODD[0]/LVA4P

VSYNC_LIKE

TS2_D[1] TS2_D[3]

TS2_D[2] LINEIN_L3 LINEIN_R3

TS2_D[4]

TS2_D[5]

TS2_D[6]

TS2_D[7]

XTAL_OUT

SPI1_DI SPI1_CK

GPIO6 GPIO9

GPIO10

NC_15 NC_16

IRIN

VID0 VID1

XTAL_IN

GND_1 GND_2 NC_17 RESET

G25 G24 H25 H24 J25 J26 J24 K26 K25 K24 L25 L24 M25 M26 M24 N26 N25 N24 P25 P24 R25 R26 R24 T26

F25 F26 L23 N23 N22 F24 AA23 Y23 AA22 Y2 Y4

Y22 W23 W22 W21

AD2 AD1

F7 E7

AE1 AF2

M11 M7 J7 D8

BIT4 BIT5 BIT6

FE_DEMOD1_TS_DATA[1] FE_DEMOD1_TS_DATA[3] FE_DEMOD1_TS_DATA[2]

FE_DEMOD1_TS_DATA[4] FE_DEMOD1_TS_DATA[5] FE_DEMOD1_TS_DATA[6] FE_DEMOD1_TS_DATA[7]

R153 33

XTAL_IN XTAL_OUT

TXB3P TXB3N TXBCLKP TXBCLKN TXB2P TXB2N TXB1P TXB1N TXB0P TXB0N

TXA3P TXA3N TXACLKP TXACLKN TXA2P TXA2N TXA1P TXA1N TXA0P TXA0N

CI_CD#

MCP_SCL MCP_SDA

R150 0

SOC_RESET

OPT

VID_CTRL

VDD33

EB_DATA[0] EB_DATA[1] EB_DATA[2] EB_DATA[3] EB_DATA[4] EB_DATA[5] EB_DATA[6] EB_DATA[7]

EB_ADDR[0] EB_ADDR[1] EB_ADDR[2] EB_ADDR[3] EB_ADDR[4] EB_ADDR[5] EB_ADDR[6] EB_ADDR[7] EB_ADDR[8] EB_ADDR[9] EB_ADDR[10] EB_ADDR[11] EB_ADDR[12] EB_ADDR[13] EB_ADDR[14]

+3.3V_NORMAL

R154

10K

OPT

EMMC_DATA[0] EMMC_DATA[1] EMMC_DATA[2] EMMC_DATA[3] EMMC_DATA[4] EMMC_DATA[5] EMMC_DATA[6] EMMC_DATA[7]

CI_IREQ#

CI_OE#

CI_IORD#

CI_CE1#

CI_WE#

CI_RESET

CI_REG# CI_IOWR# CI_WAIT#

EMMC_STRB

EMMC_CLK EMMC_CMD EMMC_RST

NON-MCP

LGE6322(MSD93F2G, w/oT2S2 : M2)

T25

PCM_D[0]

AB26

PCM_D[1]

Y24

PCM_D[2]

P21

PCM_D[3]

R22

PCM_D[4]

AA24

PCM_D[5]

T21

PCM_D[6]

V21

PCM_D[7]

V26

PCM_A[0]

V23

PCM_A[1]

N21

PCM_A[2]

U23

PCM_A[3]

W26

PCM_A[4]

AA25

PCM_A[5]

U22

PCM_A[6]

V25

PCM_A[7]

V22

PCM_A[8]

V24

PCM_A[9]

P22

PCM_A[10]

U21

PCM_A[11]

W25

PCM_A[12]

Y25

PCM_A[13]

AB24

PCM_A[14]

T23

PCM_IRQA_N

R21

PCM_OE_N

T22

PCM_IORD_N

AB25

PCM_CE_N

AA26

PCM_WE_N

U25

PCM_CD_N

T24

PCM_RESET

P23

PCM_REG_N

U24

PCM_IOWR_N

W24

PCM_WAIT_N

AD26

EMMC_IO[8](EMMC_DS)(NAND_ALE)

AC25

EMMC_IO[10](EMMC_CLK)(NAND_RBZ)

AC24

EMMC_IO[9](EMMC_CMD)

AD25

EMMC_IO[11](EMMC_RSTN)

AF24

EMMC_IO[0](EMMC_D0)(NAND_CEZ)

AE24

EMMC_IO[1](EMMC_D1)(NAND_WPZ)

AF25

EMMC_IO[2](EMMC_D2)(NAND_CLE)

AD23

EMMC_IO[3]/(EMMC_D3)(NAND_DQS)

AF23

EMMC_IO[4](EMMC_D4)(NAND_REZ)

AE23

EMMC_IO[5](EMMC_D5)(NAND_CE1Z)

AE26

EMMC_IO[6](EMMC_D6)(NAND_WEZ)

AE25

EMMC_IO[7](EMMC_D7)

IC101

TS1_D[0] TS1_D[1] TS1_D[2] TS1_D[3] TS1_D[4] TS1_D[5] TS1_D[6] TS1_D[7]

TS1_SYNC

TS0_D[0] TS0_D[1] TS0_D[2] TS0_D[3] TS0_D[4] TS0_D[5] TS0_D[6] TS0_D[7]

TS0_SYNC

TS2_SYNC

TS2_D[0]

TGPIO2/SCKM1 TGPIO3/SDAM1

TS1_CLK TS1_VLD

TS0_CLK TS0_VLD

TS2_CLK TS2_VLD

NC_1 NC_2 NC_3 NC_4 NC_5

NC_6

VIFP VIFM SIFP SIFM

IFAGC

TGPIO0 TGPIO1

NC_7 NC_8

NC_9 NC_10 NC_11 NC_12

AA21 W20 AB20 AB19 W19 AB21 AA19 AA20 Y20 Y21 Y19

AF20 AC21 AE21 AF21 AC19 AD20 AE20 AE19 AD19 AE22 AD21

AB22 AC22 AC23 AB23

AC3 AB2 AB3 AA1 AC2

AC4

AF4 AE4 AF5 AE5

AD4

AB4 AD5 AE3 AD3

P10 N10 N11 P11 R10 R11

I_P_SoC I_N_SoC Q_P_SoC Q_N_SoC IF_AGC_S_SOC

LNB_TX

TP343 TP344 TP345 TP346 TP347

TPO_DATA[0] TPO_DATA[1] TPO_DATA[2] TPO_DATA[3] TPO_DATA[4] TPO_DATA[5] TPO_DATA[6] TPO_DATA[7]

TPI_DATA[0] TPI_DATA[1] TPI_DATA[2] TPI_DATA[3] TPI_DATA[4] TPI_DATA[5] TPI_DATA[6] TPI_DATA[7]

I2C_SCL4 I2C_SDA4

TPO_CLK TPO_VAL TPO_SYNC

TPI_CLK TPI_VAL TPI_SYNC

FE_DEMOD1_TS_SYNC FE_DEMOD1_TS_CLK FE_DEMOD1_TS_VAL FE_DEMOD1_TS_DATA[0]

SATELLITE

+3.3V_NORMAL

R101

10K

T2/S2

R104 10K

OPT

TPO_DATA[0-7]

TPI_DATA[0-7]

TUNER_IF_100ohm

R145-*1 100

TUNER_IF_100ohm

R146-*1 100

Close to MSTAR

R145 0

TUNER_IF_0ohm

R146

TUNER_IF_0ohm

TU_SIF

C102 0.1uF C103 0.1uF

TU_SIF

R102 R103 47

C119

0.1uF

IF_FILTER

C120

0.1uF

IF_FILTER

TU_SIF

IF_FILTER_CAP

+3.3V_NORMAL

IF_FILTER

L102 BLM15PX121SN1

R144

IF_FILTER C118

0.1uF

10K

IF_FILTER

R147 0

IF_FILTER

C124

0.022uF 16V

IF_FILTER

MCP for T2/S2

C122 33pF

OPT C121

100pF

C123 33pF

IF_FILTER_CAP

C110 1000pF

OPT

IF_AGC

OPT

R117

300 1%

IF_P

IF_N

TU_SIF

MCP Debug

MCP DEBUG

JK102

12507WS-04L

+3.3V_NORMAL

AR104

3.3K

MCP DEBUG

MCP_SCL

MCP_SDA

Mstart Debug

DEBUG JK100

12507WS-04L

DDCA_CK

DDCA_DA

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

DDTS_Debug

DEBUG JK101

12507WS-04L

+3.3V_SB

MCP

EAN64207701

IC101-*1

LGE6321(MSD93F2GW, w/ T2S2 : M2)

A25

PWM0

B26

PWM1

B25

PWM2

C24

PWM3

PWM_PM

SAR0

SAR1

SAR2

SAR3

SAR4

SATELLITE

TP139 TP140

PCM_5V_CTL

TPO_DATA[0-7] TPI_DATA[0-7]

EB_ADDR[0] EB_ADDR[1] EB_ADDR[2] EB_ADDR[3] EB_ADDR[4] EB_ADDR[5] EB_ADDR[6] EB_ADDR[7] EB_ADDR[8]

OPT

R148 10K

DDTS_RX

OPT

R149 10K

DDTS_TX

EB_ADDR[9] EB_ADDR[10] EB_ADDR[11] EB_ADDR[12] EB_ADDR[13] EB_ADDR[14]

TPO_CLK TPO_VAL

TPO_SYNC

HP_LOUT_SOC

HP_ROUT_SOC

HP_DET

M_RFModule_RESET

EYE_SDA EYE_SCL

FOR LH57 EU MODEL

TP148

TP199 TP198 TP115

TP116 TP117 TP118 TP119 TP120 TP121 TP109 TP110 TP111 TP112 TP113 TP114 TP106 TP108 TP147 TP145 TP146

TP1012

TP1013

TP1014

TP1015 TP1016 TP1017

TP141 TP142 TP143 TP144 TP137 TP138 TP126 TP127 TP128 TP129 TP130 TP131 TP132

TP133 TP134 TP135

TP123

TP125 TP136

TP1011

TP1001 TP1002 TP1003 TP1004 TP1005 TP1006 TP1007 TP1008 TP1009 TP1010

FOR LH57 HD MODEL

EB_DATA[0] EB_DATA[1] EB_DATA[2] EB_DATA[3] EB_DATA[4] EB_DATA[5] EB_DATA[6] EB_DATA[7] CI_REG# CI_CE1# TPI_SYNC CI_WE# CI_OE# CI_RESET TPI_VAL

TPI_CLK CI_IREQ# CI_WAIT#

CI_CD#

CI_IORD# CI_IOWR#

PWM_DIM2

TXB3P TXB3N TXBCLKP TXBCLKN TXB2P TXB2N TXB1P TXB1N TXB0P TXB0N

TP149 TP150 TP160 TP161 TP162 TP163

TP164 TP165

SATELLITE - LNB only

TP166 TP167 TP168

FOR BRAZIL Energy Regulation need to ADD SILK "LJ6 CHASSIS"

I_P_SoC I_N_SoC Q_P_SoC Q_N_SoC IF_AGC_S_SOC

LNB_TX

I2C_SCL4 I2C_SDA4

5V_DET_HDMI_2 /USB_OCD2

USB_CTL2

PM_SPI_CK

PM_SPI_DI

PM_SPI_DO

NC_13

GPIO_PM[6]/(SPI-CZ1N)

GPIO_PM[10]/(SPI-CZ2N)

PM_SPI_HOLDN(GPIO)

PM_SPI_WPN/(GPIO)

DDCA_CK

DDCA_DA

J21

DDCR_CK

H21

DDCR_DA

H22

UART_TX2

H23

UART_RX2

E22

GPIO7/TX1

F21

GPIO8/RX1

E20

GPIO11/TX3

F20

GPIO12/RX3

AB6

PCM2_WAIT_N/TX4

M23

PCM2_IRQA_N

M22

PCM2_CE_N

AC6

NC_14

GPIO_PM[0]

GPIO_PM[1](PM_UART)

GPIO_PM[2]

GPIO_PM[3]

GPIO_PM[4]

GPIO_PM[5](PM_UART)

GPIO_PM[7]

GPIO_PM[8]

GPIO_PM[9]

GPIO_PM[11]/(PM_UART)

GPIO_PM[12](PM_UART)

GPIO_PM[15]

K21

GPIO17/SCKM0

L22

GPIO18/SDAM0

K22

GPIO15/SCKM2

L21

GPIO14/SDAM2

J22

TCON5/SCKM4

K23

TCON4/SDAM4

R_ODD[7]/LVB0N R_ODD[6]/LVB0P R_ODD[5]/LVB1N R_ODD[4]/LVB1P R_ODD[3]/LVB2N

R_ODD[2]/LVB2P R_ODD[1]/LVBCLKN R_ODD[0]/LVBCLKP

G_ODD[7]/LVB3N

G_ODD[6]/LVB3P

G_ODD[5]/LVB4N

G_ODD[4]/LVB4P

G_ODD[3]/LVA0N

G_ODD[2]/LVA0P

G_ODD[1]/LVA1N

G_ODD[0]/LVA1P

B_ODD[7]/LVA2N

B_ODD[6]/LVA2P B_ODD[5]/LVACLKN B_ODD[4]/LVACLKP

B_ODD[3]/LVA3N

B_ODD[2]/LVA3P

B_ODD[1]/LVA4N

B_ODD[0]/LVA4P

VSYNC_LIKE

TS2_D[1] TS2_D[3]

TS2_D[2] LINEIN_L3 LINEIN_R3

TS2_D[4]

TS2_D[5]

TS2_D[6]

TS2_D[7]

XTAL_OUT

SPI1_DI SPI1_CK

XTAL_IN

GPIO6 GPIO9

GPIO10

NC_15 NC_16

IRIN

VID0 VID1

GND_1 GND_2 NC_17 RESET

G25 G24 H25 H24 J25 J26 J24 K26 K25 K24 L25 L24 M25 M26 M24 N26 N25 N24 P25 P24 R25 R26 R24 T26

F25 F26 L23 N23 N22 F24 AA23 Y23 AA22 Y2 Y4

Y22 W23 W22 W21

AD2 AD1

F7 E7

AE1 AF2

M11 M7 J7 D8

LGE6321(MSD93F2GW, w/ T2S2 : M2)

T25

AB26

Y24 P21 R22

AA24

T21 V21

V26 V23 N21 U23 W26

AA25

U22 V25 V22 V24 P22 U21 W25 Y25

AB24

T23 R21

T22 AB25 AA26

U25

T24

P23

U24

W24

AD26 AC25 AC24 AD25 AF24 AE24 AF25 AD23 AF23 AE23 AE26 AE25

16Y_M2

MAIN1

MCP

IC101-*1

PCM_D[0] PCM_D[1] PCM_D[2] PCM_D[3] PCM_D[4] PCM_D[5] PCM_D[6] PCM_D[7]

PCM_A[0] PCM_A[1] PCM_A[2] PCM_A[3] PCM_A[4] PCM_A[5] PCM_A[6] PCM_A[7] PCM_A[8] PCM_A[9] PCM_A[10] PCM_A[11] PCM_A[12] PCM_A[13] PCM_A[14]

PCM_IRQA_N PCM_OE_N PCM_IORD_N PCM_CE_N PCM_WE_N PCM_CD_N PCM_RESET PCM_REG_N PCM_IOWR_N PCM_WAIT_N

EMMC_IO[8](EMMC_DS)(NAND_ALE) EMMC_IO[10](EMMC_CLK)(NAND_RBZ) EMMC_IO[9](EMMC_CMD) EMMC_IO[11](EMMC_RSTN) EMMC_IO[0](EMMC_D0)(NAND_CEZ) EMMC_IO[1](EMMC_D1)(NAND_WPZ) EMMC_IO[2](EMMC_D2)(NAND_CLE) EMMC_IO[3]/(EMMC_D3)(NAND_DQS) EMMC_IO[4](EMMC_D4)(NAND_REZ) EMMC_IO[5](EMMC_D5)(NAND_CE1Z) EMMC_IO[6](EMMC_D6)(NAND_WEZ) EMMC_IO[7](EMMC_D7)

AA21

TS1_D[0]

W20

TS1_D[1]

AB20

TS1_D[2]

AB19

TS1_D[3]

W19

TS1_D[4]

AB21

TS1_D[5]

AA19

TS1_D[6]

AA20

TS1_D[7]

Y20

TS1_CLK

Y21

TS1_VLD

Y19

TS1_SYNC

AF20

TS0_D[0]

AC21

TS0_D[1]

AE21

TS0_D[2]

AF21

TS0_D[3]

AC19

TS0_D[4]

AD20

TS0_D[5]

AE20

TS0_D[6]

AE19

TS0_D[7]

AD19

TS0_CLK

AE22

TS0_VLD

AD21

TS0_SYNC

AB22

TS2_SYNC

AC22

TS2_CLK

AC23

TS2_VLD

AB23

TS2_D[0]

AC3

NC_1

AB2

NC_2

AB3

NC_3

AA1

NC_4

AC2

NC_5

AC4

NC_6

AF4

VIFP

AE4

VIFM

AF5

SIFP

AE5

SIFM

AD4

IFAGC

AB4

TGPIO0

AD5

TGPIO1

AE3

TGPIO2/SCKM1

AD3

TGPIO3/SDAM1

P10

NC_7

N10

NC_8

N11

NC_9

P11

NC_10

R10

NC_11

R11

NC_12

2015.10.02

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