Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This specification sheet is applied all of the LT51H LED TV
models, which produced in manufacture department or similar
LG TV factory
2. Notice
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order. But it is
flexible when its factory local problem occurs.
(3) The adjustment must be performed in the circumstance of
25 ±5ºC of temperature and 65±10% of relative humidity if
there is no specific designation.
(4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
(5) Before adjustment, execute Heat-Run for 5 minutes.
▪ After Receive 100% Full white pattern (06CH) then process
Heat-run
(or “8. Test pattern” condition of Ez-Adjust status)
▪ How to make set white pattern
1) Press Power ON button of Service Remocon
2) Press ADJ button of Service remocon. Select “8. Test
pattern” and, after select “White” using navigation button,
and then you can see 100% Full White pattern.
* In this status you can maintain Heat-Run useless any pattern
generator
* Notice : if you maintain one picture over 20 minutes
(Especially sharp distinction black with white pattern
-13Ch, or Cross hatch pattern – 09Ch) then it can
appear image stick near black level.
4. PCB Assembly Adjustment
4.1. MAC Address, ESN Key and Widevine
Key download
5.1. EDID (The Extended Display Identification
Data)/DDC (Display Data Channel) Download
● Summary
▪ It is established in VESA, for communication between PC
and Monitor without order from user for building user
condition. It helps to make easily use realize “Plug and Play”
function. For EDID data write, we use DDC2B protocol.
● Auto Download (No need Writing EDID data in Assembly line)
▪ After Set Tool Option, then TV turn off and on finish auto
download
* EDID data for FHD, 2D, DTS-HD, 8Bit (40/43/49/55LF63
▪ R-Gain adjustment Value (default 128)
▪ G-Gain adjustment Value (default 128)
▪ B-Gain adjustment Value (default 128)
▪ R-Offset adjustment Value (default 128)
▪ G-Offset adjustment Value (default 128)
▪ B-Offset adjustment Value (default 128)
7.2. White balance. Value
CENTER (DEFAULT)
C500W50
R Gain192192192
G Gain192192192
B Gain192192192
R Cut64 6464
G Cut646464
B Cut646464
8. USB DOWNLOAD (*.epk file download)
(1) Put the USB Stick to the USB socket
(2) Press Menu key, and move General
*before 10.2 Step. Set USB Expert Mode : Enabled
IN START > System 3 > USB Expert Mode
(3) Press “number key 7” Press 7 times.
Only for training and service purposes
- 21 -
(4) Select download file (epk file)
(5) After download is finished, remove the USB stick. ( it will be
auto-reboot )
(6) Press “IN-START” key of ADJ remote control, check the
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-Peripheral
MID_LG1311
M14 Symbol A
2013.04.04
1
31
Page 35
PAGE 2
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
M14-Display In/Out
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TP202
TP203
TP204
TP205
TP206
TP207
TP208
TP209
TP210
TP211
TP212
TP213
TP214
TP215
TP221
TP218
TP219
TP220
DEBUG
+3.3V_NORMAL
SW201
JTP-1127WEM
12
43
DEBUG
For ISP
R223
3.3K
MID_LG1311
M14+ Symbol B
2014.05.28
2
31
Page 36
PLACE AT JACK SIDE
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
M14+ DDR3-M0
2014.05.28
4
31
Page 38
PAGE 5
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
M14+ DDR3-M1
2014.05.28
5
31
Page 39
PAGE 6
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
MID_LG1311
VCC & GND
2014.05.28
6
31
Page 40
+3.5V_ST
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
PANEL_POWER
PAGE 8
RL_ON
+13V_A
UBW2012-121F
C2306
0.1uF
50V
+3.3V_NORMAL
INV_CTL
R2300
10K
VA23001-*1
ICVS0505201FR
Multi_Innochips
L2304
ADUC 20S 02 010L
OPT
R2306
1K
R2307
100
R2301
10K
MMBT3906(NXP)
Default_Amotech
VA23001
5.6V
AMOTECH CO., LTD.
20V
L/DIM0_VS
ZD2303
Q2300
2
R2330
1K
1
L2303
3
POWER_WAFER_12PIN
P2300
SMAW200-H12S5K(BK)(LTR)
PWR ON
GND
D13V
A13V
GND
DRV-ON
GND
GND
VSYNC
OPT
SMAW200-H18S5
POWER_WAFER_18PIN
PDIM2
1
2
2
1
D13V
3
4
4
3
D13V
5
6
6
5
A13V
7
8
8
7
GND
10
9
9
10
PDIM1
11
12
12
11
GND
13
14
SCLK
15
16
13
SIN
17
18
P2301
.
UBW2012-121F
ADUC 20S 02 010L
20V
ZD2301
OPT
L/DIM0_MOSI
C2307
0.1uF
50V
L/DIM0_SCLK
+13V
R2354
4.7K
OPT
R2355
4.7K
OPT
PWM_DIM2
PWM_DIM
+3.3V - eMMC 4.41/4.51
+3.3V_NORMAL
L2302
BLM18PG121SN1D
C2305
0.1uF
16V
C2300
22uF
10V
3.3V_EMMC
+1.8V - eMMC 4.51
+3.3V_NORMAL
IC2306
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
+13V
L2300
BLM18PG121SN1D
C2302
10uF
25V
POWER_ON/OFF1
C2303
0.1uF
25V
OPT
C2360
0.1uF
16V
R2302
5.1K
1/16W
1%
C2304
100pF
+3.3V_NORMAL
R2304
10K
R23 03
R1
68K
1/1 6W
1%
50V
R2
R23 05
22K
1/1 6W
1%
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DVDD18_EMMC
R2347
1
75
1%
1/16W
R2357
C2301
10uF
33
C2310
1uF
10V
1%
C2312
2200pF
50V
1/16W
VREG
R2358
BD9D320EFJ
EN
1
FB
2
3
SS
4
IC2300
THERMAL
3A
10V
[EP]FIN
VIN
8
BOOT
9
7
SW
6
GND
5
Vout=0.765*(1+R1/R2)
C2308
10uF
10V
0.1uF
C2313
OPT
16V
2.5V
D2302
NR8040T2R0N
L2301
2uH
C2314
22uF
10V
+3.3V_NORMAL
C2315
22uF
10V
5V
ZD2300
+13V
PANEL_CTL
+3.3V_NORMAL
+5V_NORMAL
POWER_ON/OFF2_3
OPT
C2366
0.1uF
16V
R2308
18K
1/16W
R2309
22K
1/16W
+3.5V_ST
+13V
L2305
BLM18PG121SN1D
Q2302 Change: Diodes --> NXP, 131118
Default_NXP
Q2302
C2333
0.1uF
50V
PMV48XP
S
G
D
L2313
UBW2012-121F
OPT
ADUC 20S 02 010L
R2314
10K
10K
R2361
VA23002
C2359
4.7uF
10V
OPT
C2331
0.1uF
50V
R2317
R2318
150K
B
36K
C
Q2301
MMBT3904(NXP)
E
+2.5V
IC2302
POWER_ON/OFF2_1
C2321
10uF
10V
R2315
10K
POK
BIAS
EN
IN
TJ2132GDP
1
2
3
4
2A
9
THERMAL
8
7
6
5
[EP]GND
GND
FB
OUT
SS
C2328
0.01uF
50V
C2332
2700pF
50V
1%
1%
Vout=0.6*(1+R2/R1)
R2316
R2310
1K
1%
1%
C2316
1uF
10V
100
1/16W
1%
IC2301
MP8762HGLE-Z
EN
1
FREQ
R2311
100K
1/16W
1%
AGND
R2313
4.7
1/16W
5%
2
FB
3
SS
4
5
PG
6
VCC
7
BST
8
R1
R2
C2318
0.033uF
50V
C2319
0.1uF
16V
16
15
14
13
12
11
10
9
SW_2
SW_1
IN_2
PGND_4
PGND_3
PGND_2
PGND_1
IN_1
1%
1/16W
R2320
560K
1/10W
5%
430K
R2319
LPBN8050T-1R0N
L2307
1.0uH
C2325
10uF
25V
C2327
+1.1V_CORE
330pF
50V
C2337
22uF
OPT
2.5V
10V
ZD2304
C2326
10uF
25V
Vout=0.611*(1+R1/R2)
+3.5V_ST
IC2305
TPS563200
GND
1
SW
2
3A
VIN
3
Vout=0.765*(1+R1/R2)
C2317
10uF
25V
C2320
0.1uF
25V
R2312
VLS5045EXT-2R2N
L2306
2.2uH
C2323
C2322
22uF
10V
10K
22uF
10V
Multi_AOS
Q2302-*1
AO3435
S
8.2 K
1/1 6W
26. 1K
1/1 6W
C2346
22uF
10V
L2312
6
5
4
R2346
3.3K
LVDS_DISCHARGE
D
G
R1
R23 21
R2
R23 22
VBST
EN
VFB
1/1 6W
1%
PANEL_VCC
C2363
10uF
25V
+2.5V_NORMAL
C2354
C2357
10uF
0.1uF
16V
10V
+1.1V_VDD
C2356
22uF
10V
+13V
0.1uF
16V
C2353
1%
1/1 6W
R2
24. 9K
R23 27
R23 23
10K
50V
C2347
10uF
25V
1%
1/1 6W
11K
R23 28
10pF
OPT
C2358
OPT
5V
ZD2305
R1
Power_DET
+13V
R2325
14K
1%
R2326
5.1K
1%
RESET IC_DIODES_APX803D29
IC2307-*1
APX803D29
VCC
3
2
1
GND
RESET_IC_DIODES_NEW_APX803E29
RESET
DDR MAIN 1.5V
10K
R2324
+3.5V_ST
L2308
C2339
10uF
10V
C2340
0.1uF
16V
PVIN_1
PVIN_2
PGND_1
PGND_2
[EP]FIN
1
THERMAL
2
17
IC2303
3
BD9A300MUV
4
3A
5
6
FB
AGND8MODE
3A
Vout=0.8*(1+R1/R2)
+5.0V normal & USB
C2334
2200pF
R23 4115 0K 1%
R23 40 1 6K 1%
RSET228AGND
27
IC2304
6A
9EN10
SW_OUT211SW_OUT1
+5V_USB_2
POWER_ON/OFF2_4
50V
R2342
10K
COMP25RLIM26RSET1
12
SW_EN213SW_EN1
4.7K
R2359
+5V_USB_3
USB_CTL2
MID_LG1311
+13V
L2310
120-ohm
C2309
10uF
25V
OPT
C2311
10uF
25V
R23 35 1 6K 1%
[EP]
VIN_1
1
THERMAL
VIN_2
2
VIN_3
C2329
0.1uF
50V
PGND_1
PGND_2
PGND_3
1uF
25V
C23 24
C2330
0.0068uF
50V
29
3
4
SN1302001(TPS65286RHDR)
5
6
V7V
7
8
MODE/SYNC
10K
R2339
RESET IC_ROHM
VDD
C2355
0.1uF
25V
IC2307-*2
APX803E29
VCC
3
1
OPT
C2361
0.1uF
16V
BOOT14PGD15EN16AVIN
13
SW_3
12
SW_2
11
SW_1
10
SS
9
7
ITH
R2329
8.2K
OPT
C2335
100pF
50V
22SS23FB24
LX_3
21
LX_2
20
LX_1
19
BST
18
SW_IN2
17
SW_IN1
16
NFAULT1
15
14
NFAULT2
4.7K
R2360
OPT
OPT
USB_CTL3
POWER
R2337
100K
IC2307
BD48K28G
3
2
GND
C2341
0.1uF
16V
R2331
330K1/16W5%
1/16W1%
C2336
0.047uF
25V
/USB_OCD2
1
GND
RESET
C2342
0.01uF
50V
C2343
5%
C2344
82pF
50V
L2311
4.7uH
100K
VOUT
2
POWER_ON/OFF2_2
VLS5045EXT-2R2N
L2309
2.2uH
2700pF50V
R2
1%
R1
1%
C2338
0.047uF
25V
R2344
1/16W
R2353
/USB_OCD3
R2350
100
C2345
C2349
22uF
22uF
10V
10V
6.8K
R2345
1/16W
C2348
22uF
10V
51K
R2352
1/16W
L2311 Change, 131120
for Currnet UP
5%
100K
1/16W
C2350
1uF
10V
+3.5V_ST
R1
R2
Vout=0.6*(1+R1/R2)
5.1V:R1-51K, R2-6.8K
R2338
10K
OPT
C2365
0.1uF
16V
not to RESET at 8kV ESD
+1.5V_DDR
1%
16K
R23 32
1/1 6W
1%
18K
R23 33
1/1 6W
C2351
C2352
22uF
10uF
10V
10V
2014.05.28
POWER_DET
12V-->3.58V
ST_3.5V-->3.5V
2.5V
ZD2302
OPT
+5V_NORMAL
8
31
Page 41
Renesas MICOM
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
POWER_DET
POWER_ON/OFF1
WOL/ETH_POWER_ON
LED_R
LED_R
WOL_CTL
INV_CTL
SOC_RESET
SOC_TX
SOC_RX
EDID_WP
AMP_MUTE
CEC_REMOTE
MID_LG1311
MICOM
D3000
BAT54_SUZHO
For CEC
R3033
27K
+3.5V_ST
G
D
S
Q3001
RUE003N02
R3034
120K
HDMI_CEC
2014.05.28
9
31
Page 42
BODY_SHIELD
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
20
19
18
17
16
15
14
13
12
11
10
EAG63530101
JK3202
DAADR019A
HDMI_JACK_FOOSUNG
BODY_SHIELD
20
19
18
17
16
15
14
13
12
11
10
9
8
EAG63530101
7
6
5
4
3
2
1
JK3200
DAADR019A
HDMI_JACK_FOOSUNG
HP_DET
5V
GND
DDC_DATA
DDC_CLK
ARC
CE_REMOTE
CK-
CK_GND
CK+
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
VA3206
ESD_HDMI
5V_HDMI_2
VA3208
100K
ESD_HDMI
Default_Amotech
VA3213
CEC_REMOTE
HDMI_EXT_EDID
1K
R3268
VA3205
100K
ESD_HDMI
Default_Amotech
VA3209
CEC_REMOTE
33
R3250
R3265
AR3200
33
1/16W
ESD_HDMI
VA3207
HDMI_HPD_1
DDC_SCL_1
DDC_SDA_1
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI_TMDS
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI_TMDS
HDMI1 With ARC
Q3206
MMBT3904(NXP)
E
C
B
1K
R3251
33
HDMI_INT_EDID
R3266
R3269
VA3203
ESD_HDMI
ESD_HDMI_TMDS
R3248
1K
OPT
C3202
R3249
3.9K
OPT
D3210
10
9
8
7
6
D3211
10
9
8
7
6
HDMI_EXT_EDID
HDMI_EXT_EDID
HDMI_EXT_EDID
R3270
4.7K
D3212
IP4294CZ10-TBR
1
10
2
9
8
3
7
4
6
5
ESD_HDMI_TMDS
D3213
IP4294CZ10-TBR
1
10
2
9
8
3
7
4
6
5
HDMI2
5V_HDMI_1
Default_Amotech
VA3215
1uF
10V
HDMI_HPD_2
AR3201
33
1/16W
VA3204
ESD_HDMI
ARC
SPDIF_OUT_ARC
OPT
C3226
0.1uF
16V
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
DDC_SCL_2
DDC_SDA_2
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
Multi_Innochips
VA3215-*1
ICVS0505201FR
Multi_Innochips
VA3213-*1
ICVS0505201FR
Multi_Innochips
VA3209-*1
ICVS0505201FR
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
5501-56219
JK3202-*1
HDMI_JACK_CNPLUS
+5V_NORMAL
D3200
AR3204
5V_HDMI_1
A2CA1
47K
1/16W
A0
A1
A2
GND
HDMI_EXT_EDID_ATMEL
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
5501-56219
JK3203-*1
HDMI_JACK_CNPLUS
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
5501-56219
JK3200-*1
HDMI_JACK_CNPLUS
DDC_SDA_1
DDC_SCL_1
HDMI_EXT_EDID
MMBT3904(NXP)
IC3203
AT24C02C-SSHM-T
1
2
3
4
Q3203
8
7
6
5
VCC
WP
SCL
SDA
E
C
HDMI_EXT_EDID
HDMI_EXT_EDID
BODY_SHIELD
GND
20
EAG63530101
DAADR019A
JK3203
HDMI_JACK_FOOSUNG
5V_HDMI_2
EDID_WP
B
HDMI_EXT_EDID
R3271
4.7K
R3258
33
R3259
33
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
AR3206
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
+5V_NORMAL
D3203
47K
1/16W
AR3205
47K
1/16W
+5V_NORMAL
A1
A2
MMBD6100
D3216
C
ICVS0505201FR
5V_HDMI_4
Default_Amotech
CEC_REMOTE
5V_HDMI_4
A2CA1
Multi_Innochips
VA3216-*1
VA3216
ESD_HDMI
VA3210
ESD_HDMI
+3.5V_ST
D3205
DDC_SDA_4
DDC_SCL_4
DDC_SCL_2
DDC_SDA_2
100K
NON_MHL
R3267
AR3202
33
VA3212
1/16W
D3215
IP4294CZ10-TBR
1
10
2
9
8
3
7
4
6
5
ESD_HDMI_TMDS
D3214
IP4294CZ10-TBR
1
10
2
9
8
3
7
4
6
5
ESD_HDMI_TMDS
A2CA1
A0
A1
A2
GND
HDMI_EXT_EDID_ROHM
MHL
VA3211
ESD_HDMI
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
5%
1/16W
NON_MHL
IC3203-*1
BR24G02FJ-3GTE2
1
2
3
4
HDMI_HPD_4
R3261
0
DDC_SCL_4
DDC_SDA_4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
0
R3277
8
7
6
5
VCC
WP
SCL
SDA
NON_MHL
R3261-*1
33
+3.3V_NORMAL
MHL
R32741K1/16W
ICVS0505201FR
+5V_NORMAL
R3275
10K
MHL
MHL
C
5%
B
Q3208
MMBT3904(NXP)
E
Default_Amotech
VA3217
5.6V
Multi_Innochips
VA3217-*1
PAGE 10
+5V_NORMAL
MHL_DET
+3.5V_ST
R3246
10K
C
E
OPT
C3201
0.1uF
MHL
A1
C
A2
MHL
D3201
B
MHL
E
MMBT3906(NXP)
Q3201
C
MHL
R3247
10K
HDMI3 With MHL
VDD3V3_HDMI
C3227
0.1uF
16V
MHL
R3201
10K
MHL
D
Q3207
G
SI1012CR-T1-GE3
S
MHL
1K
R3273
MHL
MHL
R3243
1K
1/16W
MHL
C3223
5%
0.047uF
25V
HDMI LEAKAGE Workaround in MTK A2(A0) (Default= with HDMI_LEAKAGE)
+3.3V_NORMAL
Q3200
MMBT3904(NXP)
R3255
0
1/16W
5%
PANEL_VCC
R3254
10K
G
S
NTR4501NT1G
Q3202
MHL
B
D
MHL
R3202
330K
MHL_DET
Multi_Suzhou
D3202-*1
MHL
IC3201
BD2242G
VIN
1
GND
2
EN
3
SS2040LL-LG
40V
Default_Onsemi
D3202
MBR230LSFT1G
VOUT
6
5
4
ILIM
OC
30V
R3276
14K
MHL
MHL
R3204
100K
MHL
C3203
10uF
10V
5V_HDMI_4
C3228
22uF
10V
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
HDMI
2013.03.22
32
Page 43
SPDIF OUT
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.3V_NORMAL
SPDIF_OUT
C3402
47pF
50V
C3400
0.1uF
16V
Default_Solteam
JK3401
JST1223-001
GND
VCC
VINPUT
1
2
3
4
FIX_POLE
Multi_Foxconn
2F01TC1-CLM97-4F
GND
Fiber Optic
VCC
VIN
JK3401-*1
1
2
3
Fiber Op tic
4
SHIELD
DOUT1
HP_ROUT
HP_LOUT
HP_DET
TP3400
TP3401
RIN1RIN1
DOUT1
HP_OUT
HP_OUT
HP_OUT
HP OUT
R3825
150
R3826
150
R3409
100
VA3405-*1
ICVS0505201FR
+3.3V_NORMAL
Multi_Innochips
R3406
10K
HP_OUT
Default_Amotech
VA3405
5.6V
E_SPRING
R_SPRING
T_SPRING
B_TERMINAL2
T_TERMINAL2
JK3403
PEJ034-01
3
4
5
7B
6B
DDTS TEST ONLY
M_REMOTE_RX
M_REMOTE_TX
+3.5V_ST
OPT
R3827
10K
OPT
P3401
12507WS-04L
1
2
3
4
5
R3401
10K
SOC_RX
SOC_TX
UART for Debug
+3.5V_ST
P3400
12507WS-04L
1
2
3
4
5
AV/COMPONENT REAR
PPJ245N2-01
JK3802
[GN/YL]E-LUG
6A
5A
[GN/YL]O-SPRING
4A
[GN/YL]CONTACT
5B
[BL]O-SPRING
7C
[RD1]E-LUG-S
5C
[RD1]O-SPRING
4C
[RD1]CONTACT
5D
[WH]O-SPRING
4E
[RD2]CONTACT
5E
[RD2]O-SPRING
6E
[RD2]E-LUG
VA3804
5.5V
VA3805
5.5V
Default_Amotech
VA3801
5.6V
+3.3V_NORMAL
VA3806
5.5V
COMP1_Pb
COMP1_Pr
COMP1/AV1/DVI_L_IN
Multi_Innochips
VA3801-*1
ICVS0505201FR
Default_Amotech
VA3802
5.6V
Multi_Innochips
VA3802-*1
ICVS0505201FR
Place JACK Side
R3806
10K
R3801
1K
Default_Amotech
VA3803
5.6V
Multi_Innochips
VA3803-*1
ICVS0505201FR
COMP1/AV1/DVI_R_IN
AV1_CVBS_DET
+3.3V_NORMAL
Default_Amotech
VA3800
5.6V
R3810
10K
VA3800-*1
ICVS0505201FR
C310
150pF
OPT
R3802
1K
Multi_Innochips
3216
R314
75
COMP1_DET
Place SOC Side
R327100
R33433
C325 0.047uF
C3230.047uF
C3281000pF
AV1_CVBS_IN_SOC
COMP2_Y_IN_SOC
COMP2_Y_IN_SOC_SOY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
AV JACK
2014.05.28
11
31
Page 44
BT_RESET
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
WOL/WIFI_POWER_ON
EYE_SDA
EYE_SCL
LED_R
PAGE 12
P4000
SMAW200-H18S5
GND
NC
WOL
SDA
SCL
GND
IR
1
3
5
7
9
11
13
15
17
19
R4001
100
2K
R4020
R4002
100C4015
R4005
10K
5%
C4004
0.1uF
+3.5V_ST
C4007
100pF
50V
AR4001
100
IR
R4015
1.8K
OPT
C4009
0.1uF
16V
BT_RESET
LED_R
2
4
6
8
10
12
14
16
18
GND
+3.5V_WIFI
USB_DM
USB_DP
GND
GND
KEY1
KEY2
+3.5V_ST
GND
D4000
RCLAMP0502BA
L4000 Delete for voltage drop, 131120
OPT
WIFI_DMDP_5pF
C4005
0.1uF
Place Near Wafer
C4016
5pF
50V
C4008
1000pF
50V
OPT
WIFI_DMDP_5pF
+3.5V_ST
5pF
50V
C4006
22uF
R4018
10
R4019
10
OPT
10V
WIFI_DM
WIFI_DP
R4008
10K
C4001
C4002
0.1uF
0.1uF
+3.5V_ST
5%
OPT
R4009
10K
5%
+3.5V_WIFI
AR4002
100
KEY1
KEY2
WIFI POWER ENABLE CONTROL
+3.5V_ST
IN
WIFI_EN
C4017
0.1uF
R4021 33
R4022
10K
OPT
C4003
0.1uF
16V
5
EN
4
IC4001
AP2191WG-7
+3.5V_WIFI
OUT
1
GND
2
FLG
3
30K
OPT
R4023
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
IR / KEY
2014.05.28
12
31
Page 45
PAGE 13
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
USB_DM2
USB_DP2
+5V_USB_2
5V
D4301
USB_ESD_SD05
+5V_USB_3
C4322
10uF
10V
C4323
22uF
10V
Multi_Toshiba
D4302-*2
DF3D6.8MS
USB2
MAX 1.5A
3AU04S-3 05- ZC-(LG)
D4302
RCLAMP0582B
USB_ESD_0582B
USB_ESD_0502BA
D4302-*1
RCLAMP0502BA
USB3
JK4302
1234
USB DOWN ST REAM
5
USB_DM3
USB_DP3
5V
D4303
USB_ESD_SD05
C4310
10uF
10V
C4311
22uF
10V
Multi_Toshiba
D4300-*2
DF3D6.8MS
MAX 1.5A
D4300
RCLAMP0582B
USB_ESD_0582B
USB_ESD_0502BA
D4300-*1
RCLAMP0502BA
3AU04S-3 05- ZC-(LG)
JK4300
1234
USB DOWN STREAM
5
EAX6536390* : Use RClamp0582B, SD05
EAX6538400* : Use RClamp0502BA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
USB 2 & 3
2014.05.28
1
Page 46
+5V_USB_1
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
PAGE 14
value change
10K(2.63V) --> 4.7K(2.97V)
/USB_OCD1
USB_CTL1
R4500
10K
+3.3V_NORMAL
R4501
4.7K
+5V_NORMAL
0.1uF
16V
OCP USB1
VIN
1
GND
2
EN
3
IC4500
BD2242G
USB1 (2.0)
MAX 1.5A
OPT
C4501
C4502
10uF
22uF
10V
+5V_USB_1
VOUT
6
ILIM
5
1%
OC
4
14K
R4502
USB_DM1
USB_DP1C4500
Multi_Toshiba
D4500-*2
DF3D6.8MS
10V
D4500
RCLAMP0582B
USB_ESD_0582B
USB_ESD_0502BA
D4500-*1
RCLAMP0502BA
5V
D4501
USB_ESD_SD05
3AU04S-3 05- ZC-(LG)
JK4500
1234
USB DOWN ST REAM
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX6536390* : Use RClamp0582B, SD05
EAX6538400* : Use RClamp0502BA
MID_LG1311
USB 1(DVR)
2014.05.28
1
Page 47
Ethernet Block
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
PAGE 16
JK5000
RJ45VT-01SN002
1
2
3
4
5
6
7
8
9
9
0.1uF
C5001
0.01uF
50V
D5001
5.5V
LAN_ESD
D5002
5.5V
LAN_ESD
D5003
5.5V
LAN_ESD
EPHY_TDP
EPHY_TDN
EPHY_RDP
EPHY_RDN
C5000
16V
1
2
3
4
5
6
7
8
D5000
5.5V
LAN_ESD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Page 48
Ethernet Block
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
PAGE 17
+3.5V_WOL
3.3K
WOL POWER ENABLE CONTROL
+3.5V_WOL
LAN_JACK_POWER
C5203
C5201
C5200
4.7uF
10V
Place 0.1uF close to each power pins
0.1uF
0.1uF
16V
16V
EPHY_RDP
EPHY_RDN
EPHY_TDP
EPHY_TDN
ETHERNET INTERFACE
- CROSS CONNECTION
(PATTERN ISSUE)
ET_COL/SNI
Place this cap. near IC
C5205
Place this Res. near IC
0.1uF
16V
Route Single 50 Ohm, Differential 100 Ohm
+3.5V_WOL
R5203
3.3K
C5206
5pF
50V
R5204
2.49K 1%
1
IN/ OUT_ 12FLO AT_1
4
3
FLO AT_2
IN/ OUT_ 2
C5207
8pF
50V
AVDD10OUT
AVDD33_1
+3.5V_WOL
R5200
X52 00
RSET
MDI+[0]
MDI-[0]
MDI+[1]
MDI-[1]
RXDV
3.3K
R52021M
OPT
[EP]
CKXTAL2
1
THERMAL
2
3
4
5
6
7
8
RXD[0]10RXD[1]
Place this cap. near IC
C5208
0.1uF
16V
ET_RXER
+3.5V_WOL
R5218
0
DVDD10OUT
AVDD33_2
CKXTAL1
29
30
31
32
33
IC5200
RTL8201F-VB-CG
9
11
12
13
RXC
RXD[2]/INTB
RXD[3]/CLK_CTL
C5209
33pF
3.3K
R5208
EPHY_RXD0
EPHY_RXD1
EPHY_CRS_DV
ET_COL/SNI
CRS/CRS_DV
COL28RXER/FXEN
26
27
14
15
TXC
DVDD33
R5209
C5202
Place near IC
5pF
EPHY_ACTIVITY
R521033
LED1/PHYAD[1]
25
LED0/PHYAD[0]/PMEB
24
MDIO
23
MDC
22
PHYRSTB
21
TXEN
20
TXD[3]
19
TXD[2]
18
TXD[1]
17
16
TXD[0]
51
EPHY_TXD0
C5211
0.1uF
16V
+3.5V_WOL
R5215
3.3K
R5217
EPHY_EN
EPHY_TXD1
R5205
3.3K
+3.5V_WOL
R5212
1.5K
EPHY_ACTIVITY
ET_RXER
1/16W
1%
R5219
10K
1/16W
5%
WOL/ETH_POWER_ON
EPHY_MDIO
EPHY_MDC
/RST_PHY
(from SOC)
+3.5V_ST
WOL_CTL
C5204
0.1uF
R5223 33
R5222
10K
OPT
IN
EN
OPT
C52001
0.1uF
16V
AP2191WG-7
5
4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
IC5201
+3.5V_WOL
OUT
1
GND
2
FLG
3
EPHY_REFCLK
BSD-NC4_H052-HD
2012-09-12
ETHERNET
Page 49
AUDIO AMP(NTP7515)
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
WOOFER_MUTE
LG1311
AUDIO[NTP7515]
SPK_L+
SPK_L-
SPK_R+
SPK_R-
4
3
2
1
P5600
Black : Box_Type
2014.05.28
58
Page 50
EARPHONE AMP
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
PAGE 20
IC6100
TPA6138A2
HP_OUT
R6100
10K
C6104
18pF
R6103
HP_OUT
+3.3V_NORMAL
1%
43K
4.7K
R6105
HP_OUT
HP_OUT
R6106
43K
1%
HP_OUT
HP_OUT
HP_OUT
C6100
1uF
10V
HP_ROUT_MAINHP_LOUT_MAIN
HP_OUT
HP_ROUT_AMP
SIDE_HP_MUTE
C6108
10pF
50V
C6102
1uF
10V
+INR
-INR
OUTR
GND_1
MUTE
VSS
1
HP_OUT
2
3
4
5
6
CN
7
HP_OUT
C6103
1uF
10V
+INL
14
-INL
13
OUTL
12
UVP
11
GND_2
10
VDD
9
CP
8
HP_OUT
C6106
10pF
50V
HP_OUT
HP_OUT
R6104
43K
1%
HP_OUT
C6109
18pF
1%
R6102
43K
HP_OUT
+3.3V_NORMAL
HP_OUT
C6105
1uF
16V
10V
C6107
0.1uF
HP_OUT
R6101
10K
C6101
1uF
10V
HP_OUT
HP_LOUT_AMP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HEADPHONE AMP
2011.09.29
61
Page 51
TU_H_AJ/EU
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
A1A1B1
47
SHIELD
TU6401-*1
TDJH-G301D
+3.3V
1
NC_1
2
IF_AGC
3
SCL_RF
4
SDA_RF
5
IF[P]
6
IF[N]
7
SIF
8
CVBS
9
B1
TU_H_KR/US
SHIELD
TU6402-*1
TDJM-B301F
+3.3V
1
NC_1
2
NC_2
3
SCL_RF
4
SDA_RF
5
NC_3
6
NC_4
7
SIF
8
CVBS
9
NC_5
10
+3.3V_RF
11
ERROR
12
GND_1
13
MCLK
14
SYNC
15
VAILD
16
D0
17
D1
18
D2
19
D3
20
D4
21
D5
22
D6
23
D7
24
RESET_DEMOD
25
+3.3V_DEMOD
26
SCL_DEMOD
27
+1.2V_DEMOD
28
NC_6
29
SDA_DEMOD
30
B1B1A1
TU_M_CO
A1
47
SHIELD
TU6402-*2
TDJM-K301F
+3.3V
1
NC_1
2
NC_2
3
SCL_RF
4
SDA_RF
5
NC_3
6
NC_4
7
SIF
8
CVBS
9
NC_5
10
+3.3V_RF
11
ERROR
12
GND_1
13
MCLK
14
SYNC
15
VAILD
16
D0
17
D1
18
D2
19
D3
20
D4
21
D5
22
D6
23
D7
24
RESET_DEMOD
25
+3.3V_DEMOD
26
SCL_DEMOD
27
+1.2V_DEMOD
28
NC_6
29
SDA_DEMOD
30
B1B1A1
TU_M_AJ
TU6402-*3
TDJM-G305D
A1
47
SHIELD
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
B1B1A1
1
2
3
4
5
6
7
8
9
+3.3V
NC_1
NC_2
SCL_RF
SDA_RF
NC_3
NC_4
SIF
CVBS
NC_5
+3.3V_RF
ERROR
GND_1
MCLK
SYNC
VAILD
D0
D1
D2
D3
D4
D5
D6
D7
RESET_DEMOD
+3.3V_DEMOD
SCL_DEMOD
+1.2V_DEMOD
NC_6
SDA_DEMOD
TU_CHINA
TU6402-*4
TDJM-C401D
+3.3V
1
NC_1
2
NC_2
3
SCL_RF
4
SDA_RF
5
NC_3
6
NC_4
7
SIF
8
CVBS
9
NC_5
10
+3.3V_RF
11
ERROR
12
GND_1
13
MCLK
14
SYNC
15
VAILD
16
D0
17
D1
18
D2
19
D3
20
D4
21
D5
22
D6
23
D7
24
RESET_DEMOD
25
+3.3V_DEMOD
26
SCL_DEMOD
27
+1.2V_DEMOD
28
NC_6
29
SDA_DEMOD
30
A1
B1B1A1
47
SHIELD
A1
A1
TU6401
TDJH-H301F
+3.3V
1
NC_1
2
DIF_AGC
3
SCL_RF
4
SDA_RF
5
DIF[P]
6
DIF[N]
7
SIF
8
CVBS
9
B1
B1
TU_M_BR
A1
47
47
SHIELD
TU_GND_A
TU_GND_B
TU_GND_A
TU_K_TW
TU6403
TDJK-T301F
+3.3V
1
NC
2
DIF_AGC
3
SCL_RF
4
SDA_RF
5
DIF[P]
6
DIF[N]
7
SIF
8
CVBS
9
A1
A1
47
SHIELD
B1
B1
TU_GND_B
DEV_M_PIP
TU6402
TDJM-H301F
+3.3V
1
NC_1
2
DIF_AGC
3
SCL_RF
4
SDA_RF
5
DIF[P]
6
DIF[N]
7
SIF
8
CVBS
9
NC_2
10
+3.3V_RF
11
ERROR
12
GND_1
13
MCLK
14
SYNC
15
VALID
16
DATA
17
NC_3
18
NC_4
19
NC_5
20
NC_6
21
NC_7
22
NC_8
23
NC_9
24
RESET_DEMOD
25
+3.3V_DEMOD
26
SCL_DEMOD
27
+1.2V_DEMOD
28
NC_10
29
SDA_DEMOD
30
+3.3V_LNA_TU
RF_SWITCH_CTL_TU
IF_AGC_TU
I2C_SCL6_TU
I2C_SDA6_TU
IF_P_TU
IF_N_TU
TU_SIF_TU
TU_CVBS_TU
+3.3V_TU
FE_DEMOD1_TS_ERROR
FE_DEMOD1_TS_CLK
FE_DEMOD1_TS_SYNC
FE_DEMOD1_TS_VAL
FE_DEMOD1_TS_DATA[0]
FE_DEMOD1_TS_DATA[1]
FE_DEMOD1_TS_DATA[2]
FE_DEMOD1_TS_DATA[3]
FE_DEMOD1_TS_DATA[4]
FE_DEMOD1_TS_DATA[5]
FE_DEMOD1_TS_DATA[6]
FE_DEMOD1_TS_DATA[7]
/TU_RESET1_TU
+3.3V_DEMOD_TU
I2C_SCL4_TU
D_Demod_Core
LNB_TX
I2C_SDA4_TU
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
TU_H/M_BR/CO/TW/CN
C6401
1000pF
R6403
0
TU_H/M_KR/US/AJ
TU_GND_A
630V
R6401
22
TU_H/M_BR/CO/TW
R6401-*1
0
TU_CN
TU_GND_B
TU_H/M_KR/US/BR/TW/CO/CN
C6402
1000pF
630V
C6409
1000pF
630V
R6402
22
TU_H/M_AJ
TU_H/M_KR/US/BR/CO/TW
R6402-*1
0
TU_CN
C6410
1000pF
630V
TU_H/M_KR/US/AJ
+3.5V_ST
L6401
BLM18PG121SN1D
TU_M/W
TU_M/W
C6403
0.1uF
POWER_ON/OFF2_1
TU_M/W
10K
R6404
TU_M/W
C6404
10uF
+5V_NORMAL
10V
TU_M/W
C6405
1uF
10V
TU_M/W
IC6400
POK
BIAS
EN
IN
TJ2132GDP
1
2
3
4
2A
9
THERMAL
8
7
6
5
[EP]GND
GND
FB
OUT
SS
Vout=0.6*(1+R2/R1)
C6406
2700pF
50V
C6407
0.01uF
50V
A1
A1
B1
B1
47
SHIELD
D_Demod_Core
R6406-*1
TU_M/W
C6408
10uF
10V
10.5K
R6405-*1
9.1K
TU_M/W_1.1V
TU_M/W_1.1V
TU_M/W_1.2V
R1
10K
R64 06
R2
R64 05
10. 5K
TU_M/W_1.2V
TU_GND_A
TU_GND_B
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER
2012.03.08
65
Page 52
Global F/E Option Name
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. TU
2. Tuner Name = TDJ’H’,TDj’M’...
3. Country Name = KR,US,BR,EU ...
Example of Option name
TU_ALL_IntDemod = All Tuner type for Internal demod
TU_M/W = apply TDSM&TDSW Type Tuner
14’ Tuner Type for Global
TDJ’H’-G101D : Half NIM for EU,AJJA
TDJ’H’-H101F : Half NIM for US, KR
TDJ’K’-T101F : Half NIM for TW
TDJ’M’-C301D,F : FULL NIM for China
TDJ’M’-B101F : Brazil NIM with Isolater Type
TDJ’M’-K101F : colombia NIM
TDJ’M’-G101D,G105D,G151D : EU Combo&Full NIM
TDJ’M’-H101F,H151F : Korea PIP tuner
TDJ’W’-A151D : AJJA T2 PIP
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
RF_SWITCH_CTL
IF_AGC
TU_M/W
AR6501
33
I2C_SCL4
I2C_SDA4
Ground Width >= 24mils
TU_ALL_2178B
C6521
TU_SIF_TU
0.1uF
16V
+3.3V_NORMAL
TU_ALL_2178B
R6516
200
B
L6506
TU_ALL_2178B
TU_ALL_2178B
E
TU_ALL_2178B
Q6502
MMBT3906(NXP)
C
1608 perallel
because of derating
R6517
200
FE_DEMOD1_TS_ERROR
TU_CVBS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER
2012.07.10
65
Page 53
LVDS
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
LVDS INTERFACE
BSD-NC4_H072-HD
2013.04.03
Page 54
CLK6
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
eMMC
11.09.29
81
Page 56
RS-232C Control INTERFACE
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
RS232C
R6820
100
RS232C
R6821
100
PAGE 32
DOUT1
RIN1
RS232C
RS232C
RS232C
RS232C
C6808
0.1uF
C6809
0.1uF
C6810
0.1uF
C6811
0.1uF
C1+
C1-
C2+
C2-
DOUT2
RIN2
V+
V-
RS232C
IC6801
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
OPT
ZD6802
ADUC 20S 02 010L
RS232C
C6813
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
SOC_RX
SOC_TX
20V
OPT
ZD6803
ADUC 20S 02 010L
20V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Page 57
Page 58
2015 LED TV
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Always check & record S/W Version and White
Balance value before replacing the Main Board
☞A4
Replace Main Board
Re-enter White Balance value
Page 61
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
No Video/No audio
A. Video error
No video/ No audio
☞A5
Check voltages of
Power Board
( D13V,A13V)
Normal
voltage?
N
Replace Power
Board and repair
parts
Y
Check and
replace
MAIN B/D
Established
date
Revised date
2/13
End
Page 62
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
☞ A6
Check RF Signal level
Normal
Signal?
N
Check RF Cable
Connection
1. Reconnection
2. Install Booster
Normal
Picture?
Y
Y
N
A. Video error
Picture Problem, Picture broken/ Freezing
. By using Digital signal level meter
. By using Diagnostics menu on OSD
( Menu→ Quick→ Channels → Signal Test )
- Signal strength (Normal:over 50%)
- Signal Quality (Normal:over 50%)
Check whether other equipments have problem or not.
(By connecting RF Cable at other equipment)
ex) DVD Player ,Set-Top-Box, Different maker TV etc`
☞ A7
Normal
Picture?
N
Contact with signal distributor
or broadcaster (Cable or Air)
Y
Check
S/W Version
SVC
Bulletin?
Y
S/W Upgrade
Normal
Picture?
Established
date
Revised date
N
N
Check
Tuner soldering
Normal
Picture?
N
Replace
Main B/D
3/13
Y
Close
Close
Y
Close
Page 63
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
☞A8
Check color by input
-External Input
-COMPONENT
-HDMI
☞A12
Check Test pattern
Color
error?
N
Check error color
input mode
A. Video error
※ Check and
replace Link
Y
Cable
(LVDS/EPI)
and contact
condition
External Input/
Component
error
Color error
Color
error?
N
Check
external
device and
cable
Y
Replace Main B/D
Established
date
Revised date
External device
/Cable
normal
N
Y
Color
error?
End
4/13
Y
Replace module
N
Replace Main B/D
HDMI
error
Check external
device and
cable
Request repair
for external
device/cable
N
External device
/Cable
normal
Y
Replace Main B/D
Page 64
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
Vertical / Horizontal bar, residual image,
A. Video error
light spot, external device color error
Vertical/Horizontal bar, residual image, light spot
☞A8
Check color condition by input
-External Input
-Component
-HDMI
☞A12
Check Test pattern
Screen
normal?
N
Replace
module
Check external
Y
device
connection
condition
Normal?
Request repair
for external
device
External device screen error-Color error
Check screen
Check S/W Version
Check
version
Y
S/W Upgrade
Normal
screen?
Y
End
N
N
condition by input
-External Input
-Component
-HDMI
N
Check and
Y
replace Link
Cable
External
Input
error
Component
error
HDMI
Established
date
Revised date
Screen
normal?
End
N
Replace Main B/D
Y
Connect other external
device and cable
(Check normal operation of
External Input, Component
and HDMI by connecting Jig,
pattern Generator ,Set-top
Box etc.
Connect other external
device and cable
(Check normal operation of
External Input, Component
and HDMI by connecting Jig,
pattern Generator ,Set-top
Box etc.
Screen
normal?
Request repair for
external device
Screen
normal?
N
Y
Y
N
5/13
Replace
Module
N
Screen
normal?
Y
End
Replace
Main B/D
Replace
Main B/D
Page 65
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
☞A17
Check
Power LED
. Stand-By: Red or No color
Check Power cord
was inserted properly
Power LED
On?
N
Normal?
Y
Close
Y
N
※
Check ST-BY Voltage
(D13V)
B. Power error
No power
DC Power on
by pressing Power Key
On Remote control
Normal
voltage?
Y
Y
Established
date
Revised date
☞A18
Y
N
Check Power
On “High”
Normal
operation?
☞A5
Measure voltage of each output of Power B/D
N
Y
Replace Main B/D
Normal
voltage?
OK?
Replace Main B/D
Y
6/13
Replace
Power
B/D
☞A18
Replace Power B/D
N
Replace Power
B/D
Page 66
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
Check outlet
Check A/C cord
Check for all 3- phase
power out
Off when on, off while viewing, power auto on/off
Error?
Y
Fix A/C cord & Outlet
and check each 3
phase out
N
B. Power error
☞A22
Check Power Off
Mode
☞A5
(If Power Off mode is
not displayed)
Check Power B/D
voltage
※ Caution
Check and fix exterior
of Power B/D Part
Established
date
Revised date
CPU
Abnormal
Abnormal
1
Normal
voltage?
N
Replace Power B/D
Replace Main B/D
Y
Replace Main B/D
Normal?
Replace Power B/D
Y
N
7/13
End
* Please refer to the all cases which
can be displayed on power off mode.
Status Power off List Explanation
"POWEROFF_REMOTEKEY" Power off by REMOTE CONTROL
"POWEROFF_OFFTIMER" Power off by OFF TIMER
"POWEROFF_SLEEPTIMER" Power off by SLEEP TIMER
"POWEROFF_INSTOP" Power off by INSTOP KEY
"POWEROFF_AUTOOFF" Power off by AUTO OFF
Normal
Abnormal
"POWEROFF_ONTIMER" Power off by ON TIMER
"POWEROFF_RS232C" Power off by RS232C
"POWEROFF_RESREC" Power off by Reservated Record
"POWEROFF_RECEND" Power off by End of Recording
"POWEROFF_SWDOWN" Power off by S/W Download
"POWEROFF_UNKNOWN" Power off by unknown status except listed case
"POWEROFF_ABNORMAL1" Power off by abnormal status except CPU trouble
"POWEROFF_CPUABNORMAL" Power off by CPU Abnormal
Page 67
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
No audio
Screen normal
☞A24
Check user
menu >
Speaker off
C. Audio error
No audio/ Normal video
☞A25
N
Off
Y
Cancel OFF
Check A13V of Power
Board
Established
date
Revised date
Normal
voltage
Replace Power Board and repair parts
Y
N
8/13
Check Speaker
disconnection
Disconnection
N
Y
Connect Speaker to Main cable
Replace MAIN Board
End
Page 68
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input
signal
-RF
-External Input
signal
Error
symptom
C. Audio error
Wrecked audio/ discontinuation/noise
Established
date
Revised date
→ Abnormal audio/discontinuation/noise is same after “Check input signal” compared to No audio
☞A25
Check A13V Voltage
Normal
voltage?
N
Replace Main B/D
N
Signal
normal?
N
Y
(When RF signal is not
received)
Request repair to external
cable/ANT provider
(In case of External
Input signal error)
Check and fix
external device
Wrecked audio/
Discontinuation/
Noise for
all audio
Wrecked audio/
Discontinuation/
Noise only
for D-TV
Wrecked audio/
Discontinuation/
Noise only
for Analog
Wrecked audio/
Discontinuation/
Noise only
for External Input
Check and replace
speaker and
connector
Replace Main B/D
Connect and check
other external device
Replace Power B/D
Normal
audio?
Y
9/13
Y
End
Check and fix external device
Page 69
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
Normal/Motion Remote Controller operating error
D. Function error
1. Normal Remote control(R/C) operating error
☞A27
Check R/C itself
Operation
Check R/C Operating
When turn off light
in room
If R/C operate,
Explain the customer
cause is interference
from light in room.
Normal
operating?
N
Check & Replace
Baterry of R/C
Y
Check & Repair
Cable connection
Connector solder
Normal
operating?
N
Replace R/C
2. Motion Remote control operating error
☞A29
Check Motion R/C
itself Operation
Check R/C Operating
When turn off light
in room
If R/C operate,
Explain the customer
cause is interference
from light in room.
Normal
operating?
N
Check & Replace
Baterry of R/C
Y
Check & Repair
Cable connection
Connector solder
Normal
operating?
N
Replace R/C
Normal
operating?
Y
Close
Normal
operating?
Y
Close
Y
Y
☞A27
N
☞A29
N
Check 13V
On Main B/D
☞A5
(Power B/D don’t have problem)
Check
3.5V_WIFI
On Main B/D
☞A5
(Power B/D don’t have problem)
Established
date
Revised date
Normal
Voltage?
Check 13V on Power B/D
Replace Power B/D or
Replace Main B/D
Normal
Voltage?
Check 13V on Power B/D
Replace Power B/D or
Replace Main B/D
Y
N
Y
N
☞A27
Check IR
Output signal
☞A29
Check B/T
Version
10/13
Replace
Main B/D
Normal
Signal?
N
Repair/Replace
IR B/D
Replace
Main B/D
Version
Value OK?
N
Repair/Replace
Wi-Fi B/T combo B/D
Y
Y
Page 70
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
Check
input
signal
Y
Signal
input?
N
Check and fix
external device/cable
D. Function error
External device recognition error
Check technical
information
- Fix information
- S/W Version
Technical
information?
accordance
with technical
information
Y
Fix in
External Input and
N
Component
Recognition error
Recognition error
Established
Revised date
HDMI/
Optical
date
11/13
Replace Main B/D
Replace Main B/D
Page 71
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
Zoom part with
exterior damage
Module
damage
Cabinet
damage
Remote
controller
damage
F. Exterior defect
Exterior defect
Replace module
Replace cabinet
Replace remote controller
Established
date
Revised date
13/13
Stand
dent
Replace stand
Page 72
Standard Repair Process
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Error
symptom
Identify
noise type
E. Noise
Circuit noise, mechanical noise
Circuit
noise
Mechanical
noise
※ Mechanical noise is a natural
phenomenon, and apply the 1st level
description. When the customer does not
agree, apply the process by stage.
※ Describe the basis of the description in
“Part related to noise” in the Owners Manual.
Check location
of noise
Check location of
noise
OR
Replace PSU(with LED driver)
Replace LED driver
※ When the noise is severe, replace the module
OR
(For models with fix information, upgrade the S/W or
provide the description)
OR
※If there is a “Tak Tak” noise from the cabinet,
refer to the KMS fix information and then proceed
as shown in the solution manual
(For models without any fix information, provide
the description)
Established
date
Revised date
12/13
Page 73
Contents of Standard Repair Process Detail Technical Manual
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
No. Error symptom Content Page Remarks
1
2 LED driver B+ 24V measuring method
A. Video error_ No video/Normal audio
3 Check White Balance value A4
4 Power Board voltage measuring method A5
6
A. Video error_ No video/Video lag/stop
7 TV Version checking method A7
9
10 Tuner Checking Part A9
A. Video error_Color error
11
12 Adjustment Test pattern - ADJ Key A12
13
14
15 Adjustment Test pattern - ADJ Key A12
A. Video error_Vertical/Horizontal bar,
residual image, light spot
Check LCD back light with naked eye A1
TUNER input signal strength checking method A6
TV connection diagram A8
Check Link Cable (LVDS/EPI) reconnection
condition
TV connection diagram A8
Check Link Cable (LVDS/EPI) reconnection
condition
16
17 Exchange T-Con Board (2) A-2/5
<Appendix>
18 Exchange LED driver Board (PSU) A-3/5
19 Exchange Module itself (1) A-4/5
20 Exchange Module itself (2) A-5/5
Defected Type caused by T-Con/ Inverter/
Module
Exchange T-Con Board (1) A-1/5
Continue to the next page
Page 74
Contents of Standard Repair Process Detail Technical Manual
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Continued from previous page
No. Error symptom Content Page Remarks
21
22 Check power input Voltage & ST-BY Voltage A18
23 Checking method when power is ON A18
24 POWER BOARD voltage measuring method A5
25
26
27
28
29
30
31
B. Power error_No power
B. Power error_Off when on, off while
viewing
B. Power error_Off when on, off while
viewing
C. Audio error_No audio/Normal video
C. Audio error_Wrecked
audio/discontinuation
D. Function error_ No response in remote
controller
Check front display LED A17
POWER OFF MODE checking method A22
POWER BOARD PIN voltage checking method A18
Checking method in menu when there is no
audio
Voltage and speaker checking method when
there is no audio
Voltage and speaker checking method in case of
audio error
Normal Remote controller operation checking