LG 43LF540T, 43LF540Y-TB Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LB55T

MODEL : 43LF540T 43LF540T-TB

43LF540Y 43LF540Y-TB

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL68625530 (1501-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS

SERVICING PRECAUTIONS

SPECIFICATION

...................................................................................... 6

ADJUSTMENT INSTRUCTION

BLOCK DIAGRAM

EXPLODED VIEW

................................................................................. 14

.................................................................................. 17

........................................................................ 3

................................................................... 4

............................................................... 9

SCHEMATIC CIRCUIT DIAGRAM

TROUBLE SHOOTING GUIDE

................................................ APPENDIX

........................................... APPENDIX

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used LB55T chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

5) The receiver must be operated for about5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

No. Item Specication Remarks

1 Market

2 Broadcasting system

3 Channel Storage

4 Receiving system

5 Video(Composite) Input PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60

6 Component Input Y/Cb/Cr, Y/Pb/Pr

7 HDMI Input

8 SPDIF out SPDIF out Depend on model

9 USB Input

10 Headphone

Asia, Oceania, Africa, Middle East (PAL/DVB Market)

1) PAL B/G/D/K/I, SECAM B/G/D/K

2) NTSC-M

3) DVB-T

4) DVB-T//T2

5) DVB-T/T2/S2

1) DVB-T & Analog TV : 1500EA

2) DVB-T/T2 & Analog TV : 1500EA

3) DVB-T/T2/S2 & Analog TV : 6000EA

Analog : VHF,UHF,CATV Digital : DVB

HDMI1-DTV/PC HDMI2-DTV/MHL

For My Media(Movie/Photo/Music List) and SVC

1): Support all model

2): Support all model

3): depend on model

4): depend on model

5): depend on model Satellite Digital TV : VHF, UHF, C-Band, Ku-Band

Digital TV : VHF, UHF Analogue TV : VHF, UHF, CATV

► DVB-T

- Guard Interval (Bitrate_Mbit/s) :1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

► DVB-T2

- Guard Interval (Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,

- Modulation : Code Rate QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

► DVB-S

- symbol rate DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s DVB-S (QPSK) : 2 ~ 45Msymbol/s

- viterbi DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8 DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10

Support HDCP 1.4 LF54 can’t support MHL

Only for training and service purposes

- 6 -

5. Component Video Input (Y, Cb/Pb, Cr/Pr)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark

1 720*576 15.625 50.00 13.5 SDTV ,DVD 576I

2 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I

3 720*480 15.73 59.94 13.50 SDTV ,DVD 480I

4 720*576 31.25 50.00 27.00 SDTV 576P

5 720*480 31.50 60.00 27.027 SDTV 480P

6 720*480 31.47 59.94 27.00 SDTV 480P

7 1280*720 37.50 50.00 74.25 HDTV 720P

8 1280*720 45.00 60.00 74.25 HDTV 720P

9 1280*720 44.96 59.94 74.176 HDTV 720P

10 1920*1080 28.125 50.00 74.25 HDTV 1080I Except HD Model

11 1920*1080 33.75 60.00 74.25 HDTV 1080I Except HD Model

12 1920*1080 33.72 59.94 74.176 HDTV 1080I Except HD Model

13 1920*1080 56.25 50.00 148.50 HDTV 1080P Except HD Model

14 1920*1080 67.50 60.00 148.50 HDTV 1080P Except HD Model

15 1920*1080 67.432 59.94 148.352 HDTV 1080P Except HD Model

16 1920*1080 27.00 24.00 74.25 HDTV 1080P Except HD Model

17 1920*1080 26.97 23.94 74.176 HDTV 1080P Except HD Model

18 1920*1080 33.75 30.00 74.25 HDTV 1080P Except HD Model

19 1920*1080 33.71 29.97 74.176 HDTV 1080P Except HD Model

Only for training and service purposes

- 7 -

6. HDMI Input : Refer to adjust specification about EDID data.

6.1. DTV mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark

PC(DVI) DDC

1 640*350 31.468 70.09 25.17 EGA X

2 720*400 31.469 70.08 28.32 DOS O

3 640*480 31.469 59.94 25.17 VESA(VGA) O

4 800*600 37.879 60.31 40.00 VESA(SVGA) O

5 1024*768 48.363 60.00 65.00 VESA(XGA) O

6 1152*864 54.348 60.053 80.00 VESA O

7 1360*768 47.712 60.015 85.50 VESA (WXGA) O

8 1280*1024 63.981 60.020 108.0 VESA (SXGA) O Except HD Model

9 1920*1080 67.50 60.00 148.5 HDTV 1080P O Except HD Model

10 3840*2160 54 24.00 297.00 UDTV 2160P O Only UD Model

11 3840*2160 56.25 25.00 297.00 UDTV 2160P O Only UD Model

12 3840*2160 67.5 30.00 297.00 UDTV 2160P O Only UD Model

13 4096*2160 53.95 23.97 296.703 UDTV 2160P O Only UD Model

14 4096*2160 54 24 297 UDTV 2160P O Only UD Model

DTV

1 640*480 31.469 59.94 27.00

2 640*480 31.5 60.00 27.027

3 720*480 31.469 59.94 27.00

4 720*480 31.50 60.00 27.027

5 720*576 31.250 50.00 27.00

6 1280*720 37.50 50.00 74.25

7 1280*720 45.00 60.00 74.25

8 1280*720 44.96 59.94 74.176

9 1920*1080 28.125 50.00 74.25

10 1920*1080 33.75 60.00 74.25

11 1920*1080 33.72 59.94 74.176

12 1920*1080 56.250 50.00 148.50

13 1920*1080 67.50 60.00 148.50

14 1920*1080 67.432 59.94 148.35

15 1920*1080 27.00 24.00 74.25

16 1920*1080 26.973 23.976 74.175

17 1920*1080 33.75 30.00 74.25

18 1920*1080 33.716 29.97 74.175

19 3840*2160 53.95 23.98 297.00 UHD only

20 3840*2160 54.00 24.00 297.00 UHD only

21 3840*2160 56.25 25.00 297.00 UHD only

22 3840*2160 61.43 29.97 297.00 UHD only

23 3840*2160 67.50 30.00 297.00 UHD only

24 3840*2160 112.50 50.00 594.00 UHD only

25 3840*2160 135.00 59.94 593.41 UHD only

26 3840*2160 135.00 60.00 594.00 UHD only

27 4096*2160 53.95 23.98 297.00 UHD only

28 4096*2160 54.00 24.00 297.00 UHD only

29 4096*2160 56.25 25.00 297.00 UHD only

30 4096*2160 61.43 29.97 297.00 UHD only

31 4096*2160 67.50 30.00 297.00 UHD only

32 4096*2160 112.50 50.00 594.00 UHD only

33 4096*2160 135.00 59.94 593.41 UHD only

34 4096*2160 135.00 60.00 594.00 UHD only

Only for training and service purposes

- 8 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with LB55T chassis.

2. Designation

(1) The adjustment is according to the order which is

designated and which must be followed, according to the

plan which can be changed only on agreeing. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25 °C ± 5 °C Relative humidity : 65 ± 10 % Input voltage : 100-220 V~, 50/60 Hz

(6) Adjustment equipments

: Color Analyzer(CA-210 or CA-110), Service remote control.

(7) Push the “IN STOP" key - For memory initialization.

Case1 : Software version up

1. After downloading S/W by USB , TV set will reboot automatically.

2. Push “In-stop” key.

3. Push “Power on” key.

4. Function inspection

5. After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push

“In-stop” key at rst.

2. Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

3. After function inspection, Push “In-stop” key.

(4) Click "Connect" tab. If "Can't" is displayed, check connection

between computer, jig and set.

(2)

(3)

Please Check the Speed : To use speed between from 200KHz to 400KHz

(5) Click "Auto" tab and set as below. (6) Click "Run". (7) After downloading, check "OK" message.

(4)

filexxx.bin

(5)

(7)...........OK

(6)

3. Main PCB check process

▪ APC - After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program "Mstar ISP Utility" and then click

"Config" tab.

(2) Set as below, and then click "Auto Detect" and check "OK"

message. If "Error" is displayed, check connection between computer, jig, and set.

(3) Click "Read" tab, and then load download file(XXXX.bin)

by clicking "Read"

(1)

filexxx.bin

* USB DOWNLOAD(*.epk file download)

(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.

- If version of update file in USB Stick is lower, it will not work. But version of update file is higher, USB data will be detected automatically.

Only for training and service purposes

- 9 -

(3) Show the message "Copying files from memory".

(4) Updating is starting.

(5) Updating Completed, the TV will restart automatically. (6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If updated version is newer than what TV has, the TV can

lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ATV test on production line.

4. ADC Process

4.1. ADC

- Enter Service Mode by pushing "ADJ" key,

- Enter Internal ADC mode by pushing "►" key at "8. ADC

Calibration".

<Caution> Using "P-ONLY" key of the Adjustment remote

* ADC Calibration Protocol (RS232)

No. Item CMD 1 CMD 2 Data 0

Enter Adjust MODE

ADC adjust

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration ►

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L

13. Sub B/C

14. Ext. Input Adjust

15. SPK Lipsync Adjust

16. SPDIF Lipsync Adjust

control, power on TV.

Adjust ‘Mode In’

ADC Adjust

A A 0 0

A D 1 0

ADC Calibration

ADC Comp 480i

ADC Comp 1080p

ADC Type ◄ ►

Start

NG

OTP

Reset

When transfer the ‘Mode In’, Carry the command.

Automatically adjustment (The use of a internal pattern)

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number) (4) Completed selecting Tool option.

*

RS-232C Connection Method.

Connection : PCBA (USB Port) → USB to Serial Adapter (UC-232A) → RS-232C cable → PC(RS-232C port)

● Product name of USB to Serial Adapter is UC-232A.

Adjust Sequence

▪ aa 00 00 [Enter Adjust Mode] ▪ xb 00 40 [Component1 Input (480i)] ▪ ad 00 10 [Adjust 480i Comp1] ▪ aa 00 90 End Adjust mode

* Required equipment : Adjustment remote control.

4.2. Function Check

4.2.1. Check display and sound

■ Check Input and Signal items.

(1) TV (2) AV (CVBS) (3) COMPONENT (480i) (4) HDMI * Display and Sound check is executed by Remote control.

<Caution> Not to push the "INSTOP" key after completion if

the function inspection.

Only for training and service purposes

- 10 -

5. Total Assembly line process

5.1. Adjustment Preparation

▪ W/B Equipment condition

CA210: CH14, Test signal: Inner pattern(80IRE)-LED Module

▪ Above 5 minutes H/run in the inner pattern. ("power on" key

of Adjustment remote control)

* Connecting picture of the measuring instrument

(On Automatic control) Inside Pattern is used when W/B is controlled. Connect to auto controller or push Adjustment Remote control POWER

ON → Enter the mode of White-Balance, the pattern will

come out.

* The spec of color temperature and coordinate.

Mode Color Temp Color coordinate Remark

Cool (C50) 13,000 K

Medium (0) 9,300 K

Warm (W50) 6,500 K

X=0.271 (± 0.002) Y=0.270 (± 0.002)

X=0.286 (± 0.002) Y=0.289 (± 0.002)

X=0.313 (± 0.002) Y=0.329 (± 0.002)

- Inner pattern for W/B adjust

- External white pattern

(80IRE, 204gray)

* W/B Table in process of aging time

- LGD Module

(normal line) March ~ December

Aging time(Min) Cool Medium Warm color coordinate x y x y x y

Target 271 270 286 289 313 329 1 0-2 282 289 297 308 324 348 2 3-5 281 287 296 306 323 346 3 6-9 279 284 294 303 321 343 4 10-19 277 280 292 299 319 339 5 20-35 275 277 290 296 317 336 6 36-49 274 274 289 293 316 333 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329

(normal line) January ~ Feburary

Aging time Cool Medium Warm

color coordinate x y x y x y

Target 271 270 286 289 313 329 1 0-2 286 295 301 314 328 354 2 3-5 284 290 299 309 326 349 3 6-9 282 287 297 306 324 346 4 10-19 279 283 294 302 321 342 5 20-35 276 278 291 297 318 337 6 36-49 274 275 289 294 316 334 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329

- AUO/INX/COST/SHARP/BOE Module which cool spec is 13000 K

Cool Medium Warm

x y x y x y

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

Full White Pattern

RS-232C Communication

CA-210

COLOR ANALYZER TYPE : CA-210

* Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (Illumination is less than 10 lux).

(2) Adhere closely the Color analyzer(CA210) to the module

less than 10 cm distance, keep it with the surface of the Module and Color analyzer's prove vertically.(80° ~ 100°).

(3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.

▪ Auto adjustment Map(RS-232C)

RS-232C COMMAND

[CMD ID DATA]

Wb 00 00 White Balance Start Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

MIN

Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0.(When R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)

CENTER

(DEFAULT)

MAX

Only for training and service purposes

- 11 -

* Manual W/B process using adjust Remote control.

■ Color analyzer(CA100+, CA210) should be used in the

calibrated ch by CS-1000.

■ Operate the zero-calibration of the CA100+ or CA-210,

then stick sensor to the module when adjusting.

■ After enter Service Mode by pushing “ADJ” key,

■ Enter White Balance by pushing “►” key at “9. White

Balance”.

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance ►

10. 10 Point WB

11. Test Pattern

12 EDID D/L

13. Sub B/C

14. Ext. Input Adjust

15. SPK Lipsync Adjust

16. SPDIF Lipsync Adjust

■ For manual adjustment, it is also possible by the following

sequence.

(1) Set TV in Adj. mode using “P-ONLY” key on remote

controller and then operate heat run longer than 15 minutes.(If not executed this step, the condition for W/B

may be different.) (2) Push “Exit” key. (3) Enter White Balance mode by pushing the ADJ key and

select “9. White Balance”. When KEY (►) is pressed,

206 Gray internal pattern will be displayed. (4) Zero Calibrate the probe of Color Analyzer, then place it

on the center of LCD module within 10 cm of the surface

(5) Select each items (Red/Green/Blue Gain) using ▲/▼

(CH +/-) key on Remote control.

(6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.

(7) Adjust three modes all (Cool / Medium / Warm)

- For All model w/o LS345 Fix the one of R/G/B gain and change the others

- For G-FIX model Cool Mode

1) Fix the one of R/G/B gain to 192 (default data) and

decrease the others. (If G gain is adjusted over 172 and R and B gain less than 192 , Adjust is O.K.)

2) If G gain is less than 172, Increase G gain by up to

172, and then increase R gain and G gain same amount of increasing G gain.

3) If R gain or B gain is over 255, readjust G gain less

than 172, Conform to R gain is 255 or B gain is 255

Medium / Warm Mode - Fix the one of R/G/B gain to 192 (default data) and decrease the others.

(8) When adjustment is completed, exit adjustment mode

using EXIT key on Remote control.

Whit Balance

Color Temp. ◄ ►

R-Gain

G-Gain

B-Gain

R-Cut

G-Cut

B-Cut

Test-Pattern

Backlight

Reset To Set

Cool

172

192

100

64

ON

* CASE Cool

First adjust the coordinate far away from the target value(x, y).

1) x, y > target i) Decrease the R, G.

2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others.

3) x > target, y < target i) First decrease B, so make y a little more than the

target.

ii) Adjust x value by decreasing the R.

4) x < target, y > target i) First decrease B, so make x a little more than the

target.

ii) Adjust x value by decreasing the G.

* After You finish all adjustments, Press “In-start” button

and compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.

If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.

* Push the “IN STOP" key after completing the function

inspection.

5.2. DDC EDID Write (HDMI 256Byte)

■ Connect HDMI Signal Cable to HDMI Jack.

■ Write EDID DATA to EEPROM(24C02) by using DDC2B

protocol.

■ Check whether written EDID data is correct or not.

* For SVC main Assembly, EDID have to be downloaded to

Insert Process in advance.

5.3. EDID DATA

1) All Data : HEXA Value

2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***: Year : Controlled ****: Check sum

- Auto Download

■ After enter Service Mode by pushing “ADJ” key,

■ Enter EDID D/L mode.

■ Enter “START” by pushing “OK” key.

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L ►

13. Sub B/C

14. Ext. Input Adjust

15. SPK Lipsync Adjust

16. SPDIF Lipsync Adjust

EDID D/L

HDMI1 NG

HDMI2 NG

Reset

Start

EDID D/L

HDMI1 OK

HDMI2 OK

Reset

Start

Only for training and service purposes

- 12 -

[Caution]

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

5.4. Outgoing condition Configuration

■ When pressing IN-STOP key by Service remote control,

Red LED are blinked alternatively. And then automatically turn off. (Must not AC power OFF during blinking)

* Edid data and Model option download (RS232)

NO Item CMD 1 CMD 2 Data 0

Enter download Mode

EDID data and Model option download

(1) FHD 8BIT 2D HDMI EDID DATA

0 00 FF FF FF FF FF FF 00 1E 6D A B 10 C 01 03 80 A0 5a 78 0A EE 91 A3 54 4C 99 26 20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80 30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 45 00 A0 5A 00 00 00 1E 66 21 50 B0 51 00 1B 30 50 40 70 36 00 A0 5A 00 00 00 1E 00 00 00 FD 00 3A 60 3E 1E 53 10 00 0A 20 20 20 20 20 20 D 70 D 01 E 80 02 03 22 F1 4E 10 9F 04 13 05 14 03 02 12 20 21 90 22 15 01 26 15 07 50 09 57 07 f A0 80 1E 01 1d 80 18 71 1c 16 20 58 2c 25 00 20 C2 B0 31 00 0 9e 01 1d 00 72 51 d0 1e 20 6e 28 55 00 C0 20 C2 31 00 00 1e 02 3a 80 18 71 38 2d 40 58 2c D0 45 00 A0 5a 00 00 00 1e 01 1d 00 Bc 52 d0 1e 20 E0 B8 28 55 40 C4 8e 21 00 00 1e 00 00 00 00 00 00 F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 E

(2) Detail EDID Options are below

Model Name HEX EDID Table DDC Function

HD/FHD Model 0001 01 00 Analog/Digital

MODEL NAME MODEL NAME(HEX)

LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)

Download ‘Mode In’

Download A E 00 10

A A 0 0

When transfer the ‘Mode In’, Carry the command.

Automatically adjustment (The use of a internal pattern)

No. Item Condition Hex Data

1 Manufacturer ID GSM 1E6D

2 Version Digital : 1 01

3 Revision Digital : 3 03

0 1 2 3 4 5 6 7 8 9 A B C D E F

a. Product ID

b. Serial No: Controlled on production line. c. Month, Year: Controlled on production line:

ex) Week : '01' -> '01'

Year : '2014' -> '18' fix d. Model Name(Hex): Refer to the ASCII Code Table. Cf) model name in EDID data is below.

5.5. GND and HI-POT Test

5.5.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition.

(2) You can’t use Tuner Ground & Tuner signal line at all

models (applied Isolator inner tuner)

5.5.2. GND & HI-POT auto-check

(1) Pallet moves in the station.(POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process(Hi-pot test). (Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process automatically.

5.5.3. Checkpoint

(1) Test voltage

1) 3 Poles

- GND: 1.5 KV/min at 100 mA

- SIGNAL: 3 KV/min at 100 mA

2) 2 Poles

- SIGNAL: 3 KV/min at 100 mA (2) TEST time: 1 second (3) TEST POINT

1) 3 Poles

- GND Test = POWER CORD GND and SIGNAL

CABLE GND.

- Hi-pot Test = POWER CORD GND and LIVE &

NEUTRAL.

2) 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5 mArms

e. Checksum: Changeable by total EDID data.

EDID C/S data 2D FHD 8BIT

Check Sum

(Hex)

Block 0 40

Block 1

25 (HDMI1) 15 (HDMI2)

Only for training and service purposes

- 13 -

1. MAIN

BLOCK DIAGRAM

IC1300

Serial Flash

SPI_SCK/SDI/SDO/CS

SPK_L

IC104

(8Mbit)

(256Kbit)

System EEPROM

24M

X-tal

I2C_SCL/SDA

AUD_LRCH,

AUD_MASTER _CLK,

SPK_R

30P HD LVDS wafer

(P1801)

51P FHD LVDS wafer

(P1800)

(P4600)

(IC3401)

STA380BW

AMP_SC L/SDA

AUD_LRCK, AUD_SCK

Connector

KEY1/2, LED_R, IR

RXA0+/-~RXA4+/ -, RXACK+/-

RXB0+/-~RXB4+/ -, RXBCK+/-

(IC101)

Main SOC

M1A -256MB built-in

USB1_OCP/CTL

AVDD5V_MHL,MHL_OCP

TPS65282

SIDE_USB_D M/DP

+5V_USB

5V_HDMI_4

USB

(JK700)

SIDE

Only for training and service purposes

CK+/-, D0+/-, D1+/-, D2+/-,_HDMI4, DDC_SCL/SDA_4, HDMI_C EC

(JK801)

HDMI2(MHL)

IC102 (1Gbit)

NAND FLAS H

MHL_CD_SENSE

H27U1G8F 2CTR-BC

HP_L/ROUT, SIDE_HP_MUTE

IF_N/P

IF_AGC

TU_SCL / SDA

DEMOD_SC L/SDA

F/NIM

SPDIF_OUT

DDC_SCL/SDA_2, HDMI_C EC

CK+/-, D0+/ -, D1+/ -, D2+/-_HDMI2

COMP2_L/R_IN

COMP2_Y+/AV_CVB S_IN, COMP2_Pb+/Pr+

AV2_L/R_I N

AV2_CVB S_IN

AV2

(JK3000)

Headphone

HDMI1

(JK800)

(JK1001)

SPDIF(Optic)

(JK2802)

COMPONENT

REAR

- 14 -

2. I2C

TUNER

AMP

DEMOD

LNB

EEPROM

URSA

VCOM

Digital_Eye

HW_I2C

I2C_SC(D)KM1/GPIO80(81)

Only for training and service purposes

SW_I2C

GPIO159(160)

- 15 -

SW_I2C

HW_I2C

SDAM2/GPIO55(56)

SCK(D)M0/GPIO58(59)

HW I2C 4ea + SW I2C 1ea

I2C_SC(D)KM3/I2C_DDCR_CK/GPIO76/(77)

3. POWER

Tuner 3.3V

+13.2V_AMP

+5V_Normal

+1.10V_VDDC

PANNEL Vcc

L410 3.3V_Normal

13.2V → 3.5V

IC405 (DCDC)

AVDD_NODIE

L206

AVDD_DMPLL

L207

AVDD_AU33

L205

IC404 (LDO)

3.3V → 1.5V DDR

13.2V → 3.5V

IC400 (DCDC)

L412

+13.2V

Only for training and service purposes

L404

- 16 -

3.3V_Normal L408

L5600

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

900

501

500

901

400

401

410

LV1

521

A10

Set + Stand

A2

540

200

Only for training and service purposes

- 17 -

120

530

POWER

LGE Internal Use Only

FROM POWER B/D 13.2V

+3.5V_ST

TR_NXP

MMBT3906(NXP)

R406

10K

R404

4.7K

TR_NXP

Q400 MMBT3904(NXP)

R419

100

TR_NXP Q402 MMBT3904(NXP)

1

TVS_SEMTECH

RL_ON

INV_CTL

+3.5V_ST

OPT

R400

10K

R401

10K

+3.5V_ST

R426 10K

TR_KEC Q400-*1 2N3904S

B

R402

10K

+3.3V_Normal

R425

10K

TR_KEC

Q402-*1 2N3904S

B

R420

C

E

C

E

C

E

1K

C

E

+13.2V to +3.5V_STANDBY

+13.2V

L412

BLM18PG121SN1D

C438

C439

10uF

0.1uF

25V

R1

R46 9

R468

68K

6.8K 1/1 6W

1/16W

1%

C440

100pF

50V

R2

R471

22K

1/16W

1%

C441 1uF 10V

C442

2200pF

Vout=0.765*(1+R1/R2)

Q401

2

ZD404

TVS_KEC ZD404-*1

R470 10K

50V

2N3906S-RTK

3

5V

EN

FB

VREG

SS

TR_KEC Q401-*1

EBC

OPT

R412

33K

P401

SMAW200-H12S5K(BK)(LTR)

PWR_ON

1

GND

3

D13.2V

5

A13.2V

7

GND

9

DRV_ON

11

13

IC405

BD9D321EFJ

1

2

3

4

3A

9

THERMAL

8

7

6

5

[EP]

VIN

BOOT

SW

GND

+13.2V POWER_DET

+13.2V

R430

14K

1%

R431

C415

5.6K

0.1uF 1%

25V

OPT R467

1K

PDIM#2

2

D13.2V

4

D13.2V

6

A13.2V

8

GND

10

PDIM#1

12

R424

3.9K

PWM1

L403

MLB-201209-0120P-N2

C40 2

OPT

0.1 uF

L414

25V

L415

MLB-201209-0120P-N2

PWM_DIM

OPT C43 3

4.7 uF 50V

C44 6

0.1 uF 25V

+13.2V

A13.2V

R435 100K

RESET_IC_KEC

IC401

KIC7529M2

VCC

3

1

IC401-*1

RESET_IC_DIODES

APX803E29

VCC

3

1

OUT

2

GND

RESET

2

GND

R454

100

+3.5V_ST

C422

0.1uF 16V

OPT R438

4.7K

POWER_DET

POWER_DET_RESET

+13.2V to PANEL_VCC +3.5V_ST to +3.3V_Normal

PANEL_VCC

D

R451

R452

5.6K

G

C

TR_KEC Q403-*1 2N3904S

E

POWER_ON/OFF_1

+3.5V_ST

R443

10K

R444 10K

B

R447 22K

R448

2.2K

C428

2.2uF 10V

C

TR_NXP Q404 MMBT3904(NXP)

E

UBW2012-121F

PANEL_CTL

L408

120OHM

OPT

C425

0.1uF 25V

R441

+13.2V

10K

R442

10K

B

R445

R446 120K

33K

C

TR_NXP Q403 MMBT3904(NXP)

E

SSM3J332R

C427

0.22uF 25V

FET_TOSHIBA

Q405

S

B

FET_AOS Q406-*1

AO3435

S

G

FET_TOSHIBA

Q406 SSM3J332R

S

B

G

C

E

D

C429

0.1uF 16V

TR_KEC

Q404-*1 2N3904S

L410

BLM18PG121SN1D

C430 22uF 10V

+3.3V_Normal

ZD402

5V

TVS_SEMTECH

TVS_KEC ZD402-*1

+3.5V_Normal to +1.5V_DDR

C443

0.1uF 16V

L413

2uH

C444 22uF

+3.5V_ST

TVS_SEMTECH

ZD405

5V

TVS_KEC ZD405-*1

C445 22uF

10V

+3.3V_Normal

L409

BLM18PG121SN1D

C426

10uF

10V

IC404

AZ1117EH-ADJTRG1

OUTIN

ADJ/GND

1.3A

R449 1K 1/16W 1%

R450 200 1/16W 1%

Vout=1.25*(1+R2/R1)+Iadj*R2

R1

R2

L411

CB2012PK501T

R453

0

C431 10uF

10V

+1.5V_DDR

ZD403

2.5V

OPT ZD406

5.1v

+5V_Normal & +1.10V_VDDC

+13.2V

L404

CB2012PK501T

C405

C406

10uF

25V

OPT

+3.3V_Normal

R403

10K

OPT

C403

4700pF

Check the pull down when AC Power On with HDD

4700pF

50V

USB1_CTL

USB1_CTL_Pull_Down

USB1_OCD

+3.3V_Normal

R405

10K

OPT

C404

+3.3V_Normal

50V

R472

3.3K

OPT

R407

4.7K

R408 100K

+5V_Normal

C408

2200pF

50V

OPT

C409

2200pF

50V

R409

91K

ROSC/SYNC

NFAULT

+5V_USB

C407 1uF

10V

SW_EN

Vout=0.6(R1/R2)+0.6

C413 22uF

10V

C424 22uF 16V

+1.10V_VDDC

C414 22uF

10V

L405

4.7uH

R1

OPT

C411

R411

R41 8

L406

4.7uH

4.7K 1%

R2

R413

5.1K 1%

C419

22pF 50V

C420

3300pF

50V

20K

25V

0.047uF

C410

BST120LX121PGND1

VIN123V7V24SS1

[EP]

19

1

2

3

4

5

6

THERMAL

25

7

SW_OUT

22

IC400

SNXXXXX

9

8

VIN2

SW_IN

PGND2

SS2

EN1

EN2

COMP1

18

FB1

17

AGND

16

15

14

13

10

11

12

LX2

BST2

RSET

FB2

COMP2

C421

0.047uF 25V

R422 15K

R41 4

ZD407

82pF

5.1v

50V

C416

22pF

50V

C417

3300pF

10K

50V

R415

0 5%

R416

5.1K 1%

R417

39K

1%

R1

+5V_Normal

ZD401

2.5V

R2

OPT C412 10uF

6.3V

C418

47pF 50V

+5V_Normal

C423 22uF 16V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

C432

1uF 16V

L14_CA

POWER

Vout=0.6(R1/R2)+0.6

140813

4

USB (SIDE)

LGE Internal Use Only

USB_HDD_CAP1_10uF

C700-*1

USB_HDD_CAP1_22uF

OPT

JK700

1234

USB DOWN STRE AM

3AU 04S-3 05-ZC -(LG )

5

ZD700

SD05

5V

C701

OPT

C702

5pF

50V

10uF

10V

USB_HDD_CAP2_10uF

USB_HDD_CAP2_22uF C700 22uF 10V

C703-*1

10uF

10V

C703 22uF 10V

R700

2.2

R701

2.2

OPT D700 RCLAMP0502BA

+5V_USB

OPT

C704 22uF 10V

SIDE_USB1_DM

SIDE_USB1_DP

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

USB_S1

2014/05/20

7

HDMI (REAR 1 / SIDE 1 MHL)

LGE Internal Use Only

HDMI_1

5V_HDMI_2

R802

1.8K

VA800

R803

1K

SHIELDGND

20

HP_DET

19

5V

18

GND

17

DDC_DATA

ESD_HDMI1_VARISTOR

16

DDC_CLK

15

NC

14

CE_REMOTE

13

CK-

12

CK_GND

11

CK+

10

EAG59023302

JK800

This GND Pattern should be very narrow HDMI jack burnt problem improvement

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

5V_DET_HDMI_2

R805

3.3K

ESD_HDMI1_VARISTOR VA801

ESD_HDMI1_CAP

VA800-*1 1uF 10V

ESD_HDMI1_CAP VA801-*1 1uF 10V

AR801

5.1

AR802

5.1

MMBT3904(NXP)

ESD_HDMI1 VA802

TR_NXP

Q800

C

E

TR_KEC Q800-*1 2N3904S

B

C

B

E

ESD_HDMI1

VA803

ESD_HDMI1_TMDS

IP4294CZ10-TBR

ESD_HDMI1_TMDS

IP4294CZ10-TBR

HDMI_2 MHL

5V_HDMI_4

R808

10K

R809

10K

R810 100

R811 100

ESD_HDMI1 VA804

D803

1 2 3 4 5

D804

10 9 8 7 6

HPD2

DDC_SDA_2

DDC_SCL_2

HDMI_ARC HDMI_CEC

CK-_HDMI2

CK+_HDMI2

D0-_HDMI2

D0+_HDMI2

D1-_HDMI2

D1+_HDMI2

D2-_HDMI2

D2+_HDMI2

BODY_SHIELD

20

JK801-*1 DAADR019A

HDMI-2_EMI_FOOSUNG

GND

20

HP_DET

19

5V

18

GND

17

DDC_DATA

16

DDC_CLK

15

NC

14

CE_REMOTE

13

CK-

12

CK_GND

11

CK+

10

EAG62611204

HDMI-2

JK801

19

HOT_PLUG_DETECT

18

VDD[+5V]

17

DDC/CEC_GND

16

SDA

This GND Pattern should be very narrow

15

SCL

HDMI jack burnt problem improvement

14

RESERVED

13

CEC

12

TMDS_CLK-

11

TMDS_CLK_SHIELD

10

TMDS_CLK+

9

TMDS_DATA0-

8

TMDS_DATA0_SHIELD

7

TMDS_DATA0+

6

TMDS_DATA1-

5

TMDS_DATA1_SHIELD

4

TMDS_DATA1+

3

TMDS_DATA2-

2

TMDS_DATA2_SHIELD

1

TMDS_DATA2+

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

HDMI-2

R812

1.8K

5V_DET_HDMI_4

ESD_HDMI2 VA805

HDMI-2

R813

3.3K

ESD_HDMI2 VA806

OPT

VA807

5.6V

AR804

AR803

HDMI-2_MHL_Non

R819

0





5.1

ESD_HDMI2

HDMI-2_MHL

R818

0

ESD_HDMI2

VA809

ESD_HDMI2

VA808

VA811

ESD_HDMI2 VA810

HDMI-2_MHL

HDMI-2

R814

33

HDMI-2

R815 100

R816 100

HDMI-2

D805

1 2 3 4 5

ESD_HDMI2_TMDS

IP4294CZ10-TBR

D806

1 2 3 4 5

ESD_HDMI2_TMDS

IP4294CZ10-TBR

HDMI-2_MHL

C800

R817

0.047uF 300K

25V

MHL Spec

HDMI-2_MHL_Non

R817-*1

3.3K

10 9 8 7 6

HPD4

DDC_SDA_4

DDC_SCL_4

HDMI_CEC

CK-_HDMI4

CK+_HDMI4

D0-_HDMI4

D0+_HDMI4

D1-_HDMI4

D1+_HDMI4

D2-_HDMI4

D2+_HDMI4

MHL_CD_SENSE

CEC

HDMI_CEC

HDMI_DIODE_SUZHOU

D800-*1

MMBD6100

A1

C

5V_HDMI_2

R800

2.7K

+5V_Normal

R801

2.7K

R804 100

A2

HDMI_DIODE_KEC

A2CA1 KDS184 D800

DDC_SDA_2

DDC_SCL_2

CEC_REMOTE_S7

HDMI_DIODE_SUZHOU

D801-*1

MMBD6100

A1

C

R806

2.7K

+5V_Normal

R807

2.7K

5V_HDMI_4

HDMI_DIODE_SUZHOU

A2

HDMI_DIODE_KEC

A2CA1

KDS184 D801

D802-*1

MMBD6100

DDC_SDA_4

DDC_SCL_4

A2

A1

C

+3.5V_ST

A2CA1

HDMI_DIODE_KEC

KDS184 D802

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L15_M1A

HDMI_R1S1 8

140813

SPDIF

LGE Internal Use Only

SPDIF_OUT

+3.3V_Normal

OPT

C1001

1uF 10V

ESD Ready

SPDIF_OPTIC C1002 18pF 50V

GND

VCC

VINPUT

SPDIF_OPTIC

JK1001

JST1223-001

1

2

3

Fiber Optic

4

FIX_POLE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

SPDIF

2014/06/02

10

DDR_EXT

LGE Internal Use Only

R1201

DDR_EXT

R1202

1K 1%

DDR_EXT

C1201

1K

0.1uF

1%

CLose to DDR3

DDR_EXT

C1202

1000pF

A-MVREFDQ

+1.5V_DDR+1.5V_DDR

DDR_EXT

R1204

DDR_EXT

R1205

1K 1%

CLose to MAIN IC

DDR_EXT

C1213

C1214

0.1uF

1000pF

A-MVREFCA

+1.5V_DDR

Option : Ripple Check !!!

OPT

C1217

0.1uF

C1218

0.1uF

OPT

C1216

10uF

10V

OPT

C1219

+1.5V_DDR

OPT

C1221

OPT

C1222

1uF

C1220

1uF

C1223

OPT

C1224

0.1uF

1uF

DDR_1600_1G_NAN

IC1201-*1

NT5CB64M16FP-DH

EAN61859502

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12

T3

NC_6

M7

NC_5

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

DDR_1600_1G_SS

IC1201

K4B1G1646G-BCK0

EAN61836301

DDR_EXT

R1203

240 1%

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

+1.5V_DDR

A-MVREFCA

A-MVREFDQ

C1203 10uF 10V C1204 0.1uF C1205 0.1uF C1206 0.1uF C1207 0.1uF C1208 0.1uF C1209 0.1uF C1210 0.1uF C1211 0.1uF C1212 0.1uF

A-MA14

DDR_1600_2G_SS

IC1201-*2

K4B2G1646Q-BCK0

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_7

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

N3 P7 P3 N2 P8 P2 R8 R2 T8 R3 L7 R7 N7 T3

M7

M2 N8 M3

J7 K7 K9

L2 K1 J3 K3 L3

T2

F3 G3

C7 B7

E7 D3

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

EAN61848803

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12/BC A13

NC_5

BA0 BA1 BA2

CK CK CKE

CS ODT RAS CAS WE

RESET

DQSL DQSL

DQSU DQSU

DML DMU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

DDR_1600_2G_SK

IC1201-*3

H5TQ2G63FFR-PBC

EAN61829204

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

M7

NC_5

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT

A10/AP

A12/BC

NC_5

RESET

DQSL DQSL

DQSU DQSU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7 R7

A11

N7 T3

A13

M7

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

F3 G3

C7 B7

E7

DML

D3

DMU

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

A-MA0 A-MA1 A-MA2 A-MA3 A-MA4 A-MA5 A-MA6 A-MA7 A-MA8 A-MA9 A-MA10 A-MA11 A-MA12 A-MA13

A-MBA0 A-MBA1 A-MBA2

A-MCKE

A/B_DDR3_CS A-MODT A-MRASB A-MCASB A-MWEB

A-MRESETB

A-MDQSL A-MDQSLB

A-MDQSU A-MDQSUB

A-MDML A-MDMU

A-MDQL0 A-MDQL1 A-MDQL2 A-MDQL3 A-MDQL4 A-MDQL5 A-MDQL6 A-MDQL7

A-MDQU0 A-MDQU1 A-MDQU2 A-MDQU3 A-MDQU4 A-MDQU5 A-MDQU6 A-MDQU7

DDR_EXT

R1207

DDR_EXT

R1208

56 1%

DDR_EXT

R1206

10K

DDR_EXT

C1215

0.01uF 50V

+1.5V_DDR

A-MCK

A-MCKB

A-MA0 A-MA1 A-MA2 A-MA3 A-MA4 A-MA5 A-MA6 A-MA7 A-MA8

A-MA9 A-MA10 A-MA11 A-MA12 A-MA13 A-MA14

A-MBA0 A-MBA1 A-MBA2

A-MCK A-MCKB A-MCKE

A-MODT

A-MRASB A-MCASB

A-MWEB

A-MRESETB

A/B_DDR3_CS

A-MDQSL A-MDQSU

A-MDML A-MDMU

A-MDQSLB A-MDQSUB

A-MDQL0 A-MDQL1 A-MDQL2 A-MDQL3 A-MDQL4 A-MDQL5 A-MDQL6 A-MDQL7 A-MDQU0 A-MDQU1 A-MDQU2 A-MDQU3 A-MDQU4 A-MDQU5 A-MDQU6 A-MDQU7

R1209

240

1%

M1A_256M_UO4

LGE2134(256M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

IC101

LGE2133(128M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

M1A_128M_UO4

IC101-*1

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

DDR

2014/06/13

12

Serial Flash for SPI boot

LGE Internal Use Only

/FLASH_WP

OPT

R1300 10K

+3.5V_ST

/SPI_CS

SPI_SDO

R1301

4.7K

OPT

WP#/SIO2

SPI_FLASH_MACRONIX

IC1300

MX25L8035EM2I-10G

CS#

1

SO/SIO1

2

3

GND

4

SPI_FLASH_WINBOND

IC1300-*1

W25Q80DVSSIG

CS

1

DO[IO1]

2

WP[IO2]

3

GND

4

8

7

6

5

8

7

6

5

VCC

NC/SIO3

SCLK

SI/SIO0

VCC

HOLD[IO3]

CLK

DI[IO0]

R1302

33

+3.5V_ST+3.5V_ST

C1300

0.1uF 16V

SPI_SCK

SPI_SDI

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

S_FLASH

140721

13

LVDS

LGE Internal Use Only

[51Pin LVDS Connector] (For FHD 60Hz)

MO_FHD

P1800

SP14-11592-01-51Pin

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

PANEL_VCC

C1800

0.1uF 25V

VCOM_SDA

VCOM_SCL

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

MO_FHD_non_55CSOT

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2-

RXB1+

RXB1-

RXB0+

MO_FHD_non_55CSOT

RXB0-

MO_FHD_non_55CSOT

LVDS_SEL

+3.3V_Normal

Cell_CSOT_55inch R1806

1K

OPT

R1807

10K

R1801

0

R1812

Cell_INX_FHD

R1802

0

R1803

0

FOR FHD REVERSE(10bit) Change in S7LR

MIRROR

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2- RXBCK-

RXB1+

RXB1-

RXB0+

RXB0-

Pol-change

RXA0+

RXA0-

RXA1+

RXA1-

RXA2+

RXA2-

RXACK+

RXACK-

RXA3+

RXA3-

RXA4+

RXA4-

RXB0+

RXB0-

RXB1+

RXB1-

RXB2+

RXB2-

RXBCK+

RXB3+

RXB3-

RXB4+

RXB4-

FOR FHD REVERSE(8bit) Change in S7LR

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2-

RXB1+

RXB1-

RXB0+

RXB0-

MIRROR

Pol-change

RXA4+

RXA4-

RXA0+

RXA0-

RXA1+

RXA1-

RXA2+

RXA2-

RXACK+

RXACK-

RXA3+

RXA3-

RXB4+

RXB4-

RXB0+

RXB0-

RXB1+

RXB1-

RXB2+

RXB2-

RXBCK+

RXBCK-

RXB3+

RXB3-

RXA0-

RXA0+

RXA1-

RXA1+

RXA2-

RXA2+

RXACK-

RXACK+

RXA3-

RXA3+

RXA4-

RXA4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXB4-

RXB4+

Shift

RXA4-

RXA4+

RXA0-

RXA0+

RXA1-

RXA1+

RXA2- RXACK-

RXA2+

RXACK-

RXACK+

RXA3-

RXA3+

RXB4-

RXB4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXA0-

RXA0+

RXA1-

RXA1+

RXA2-

RXA2+

RXACK+

RXA3-

RXA3+

RXA4-

RXA4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXB4-

RXB4+

[30Pin LVDS Connector] (For HD 60Hz_Normal)

MO_HD P1801

10031HR-30

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

VCOM_SDA

VCOM_SCL

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

PANEL_VCC

LVDS_SEL

+3.3V_Normal

OPT

R1808

3.3K

OPT

R1809

10K

EU pin assign is different from NON EU. Because of position of HD wafer.

V-COM I2C

URSA/VCOM_SCL

URSA/VCOM_SDA

VCOM_SCL

VCOM_SDA

+3.3V_Normal

VCOM_I2C_PULL_UP

R1810

VCOM_I2C

R1804

0

VCOM_I2C

R1805

0

VCOM_I2C_PULL_UP

2K

R1811 2K

URSA/VCOM_SCL

URSA/VCOM_SDA

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

LVDS

140613

18