LG 43LF540, 43LF540*-DB Schematic

Internal Use Only
LED TV
SERVICE MANUAL
CHASSIS : LT55H
MODEL : 43LF540* 43LF540*-DB
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL68606409 (1501-REV01)
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION .............................................................. 10
BLOCK DIAGRAM ...................................................................................17
EXPLODED VIEW .................................................................................. 19
SCHEMATIC CIRCUIT DIAGRAM ............................................APPENDIX
TROUBLESHOOTING ...............................................................APPENDIX
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent poten­tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electri­cally shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This spec sheet is applied all of the 32”, 39”, 42”, 47”, 50”, 55” LED TV with LT55H chassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage Standard input voltage (100~240V@ 50/60Hz) * Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC: CE, IEC
4. General Specification
No Item Specication Measurement Result Remark
1. Receiving System NTSC-M, PAL-M/N, DVB-T, DVB-T2 Colombia
NTSC-M, PAL-M/N DVB-T Taiwan / Panama
2. Available Channel LF55/56/62B, 55/56/57/62 (NTSC-M, PAL-M/N, DVB-T)
LF55/56/57/62D/T NTSC-M, PAL-M/N, DVB-T, DVB-T2 Colombia only)
3. Input Voltage 1) AC 100 ~ 240V 50/60Hz
4. Market Colombia / Panama / Taiwan
5. Screen Size 32 inch Wide (1366 × 768) 32LF550D/B-DA/DD
32 inch Wide (1920 × 1080) 32LF5600/565T-DE
39 inch Wide (1920 × 1080) 39LF5600/565T-DE
40 inch Wide (1920 × 1080) 40LF5700/570T-DA
42 inch Wide (1920 × 1080) 42LF6200/620T-DD
43 inch Wide (1920 × 1080) 43LF5700/570T-DA
49inch Wide (1920 × 1080) 49LF5500/550T-DD
50 inch Wide (1920 × 1080) 50LF5600/565T-DE
55 inch Wide (1920 × 1080) 55LF5600/565T-DE
60 inch Wide (1920*1080) 60LF5600/565T-DE
1) VHF : 2~13
2) UHF : 14~69
3) CATV : 1~125
4) DTV : 2~69
1) VHF : 2~13
2) UHF : 14~69
3) CATV : 1~125
4) DTV : 2~69
(LF55/56/57/LF62 D/T)
(LF55/56/620B, LF55/56/57/6200
Paname / Taiwan
Colombia
32LF560D/B-DE 32LF620D/B-DD
43LF5400/540T-DA
49LF6200/620T-DD 49LF5400/540T-DA
55LF6200/620T-DD
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
No Item Specication Measurement Result Remark
6. Aspect Ratio 16:9
7. Tuning System FS
8. Module LC320DXE-MGA6 HD, 60Hz LGD 32LF550D/B-DA/DD
LC490DUE-MGA6 FHD, 60Hz LGD 49LF550T/5500-DD
LC320DXE-MGA4 HD, 60Hz LGD 32LF560D/B-DE
LC320DUE-MGA4 FHD, 60Hz LGD 32LF560T/5650-DE
LC550DUE-MGA4 FHD, 60Hz LGD 55LF560T/5650-DE
NC550DUE-VCCP2 CSOT
HC600DUF-VHHS4 FHD, 120Hz SHARP 60LF5600/565T-DE
HC400DUN-VCKN1 FHD, 60Hz INIX 40LF570T/5700-DA
LC430EUE-FHM1 FHD, 60Hz LGD 43LF570T/5700-DA
LC320DXE-MGP2 FHD, 120Hz LGD 32LF620D/B-DD
LC420DUE-MGP2 FHD, 60Hz LGD 42LF620T/6200-DD
LC490DUE-MGP2 FHD, 60Hz LGD 49LF620T/6200-DD
LC550DUE-MGP2 FHD, 60Hz LGD 55LF620T/6200-DD
NC430EUN-AACR1 FHD, 60Hz LGD 43LF540T/5400-DB
NC490EUN-AACR1 FHD, 60Hz LGD 49LF540T/5400-DB
LC500DUE-MGA4 FHD, 60Hz LGD 50LF5650-DE
9. Operating Environment 1) Temp : 0 ~ 40 deg
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 80 %
2) Humidity : ~ 85 %
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. External Input Support Format
5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
2. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
3. 720*480 31.47 59.94 27.0 SDTV 480P
4. 720*480 31.50 60 27.027 SDTV 480P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 28.125 50.00 74.250 HDTV 1080I
8. 1920*1080 33.75 60.00 74.25 HDTV 1080I
9. 1920*1080 33.72 59.94 74.176 HDTV 1080I
10. 1920*1080 56.250 50.00 148.50 HDTV 1080P
11. 1920*1080 67.500 60.00 148.50 HDTV 1080P
12. 1920*1080 67.432 59.939 148.352 HDTV 1080P
13. 1920*1080 27.000 24.000 74.25 HDTV 1080P
14. 1920*1080 26.97 23.976 74.176 HDTV 1080P
15. 1920*1080 33.75 30.000 74.25 HDTV 1080P
16. 1920*1080 33.71 29.97 74.176 HDTV 1080P
5.2. HDMI Input (PC/DTV)
*HDMI PC support only Rear HDMI Input *If use DVI to HDMI cable for PC, you have to use external SPK for PC audio sound.
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC DDC
1
640*350 31.468 70.09 25.17 EGA X
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5
1024*768 48.363 60.00 65.00 VESA(XGA) O
6
1152*864 54.348 60.053 80.00 VESA O
7
1360*768 47.712 60.015 85.50 VESA (WXGA) O
8
1280*1024(FHD Only) 63.981 60.02 108.00 VESA (SXGA) O
9
1920*1080(FHD Only) 67.5 60 148.5 HDTV 1080P O
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
DTV
1
640 x 480 31.46 59.94 SDTV 480P
2
640 x 480 31.5 60.00 SDTV 480P
3
720*480 31.47 59.94 27.000 SDTV 480P
4
720*480 31.50 60.00 27.027 SDTV 480P
5
1280*720 37.50 50.00 74.25 HDTV 720P
6
1280*720 45.00 60.00 74.25 HDTV 720P
7
1280*720 44.96 59.94 74.176 HDTV 720P
8
1920*1080 28.12 50.00 74.25 HDTV 1080I
9
1920*1080 33.75 60.00 74.25 HDTV 1080I
10
1920*1080 33.72 59.94 74.176 HDTV 1080I
11
1920*1080 56.25 50.00 148.50 HDTV 1080P
12
1920*1080 67.5 60.00 148.50 HDTV 1080P
13
1920*1080 67.43 59.94 148.352 HDTV 1080P
14
1920*1080 27.00 24.00 74.25 HDTV 1080P
15
1920*1080 26.97 23.97 74.176 HDTV 1080P
16
1920*1080 33.75 30.00 74.25 HDTV 1080P
17
1920*1080 33.71 29.97 74.176 HDTV 1080P
HDMI Monitor Range Limits Min Vertical Freq - 58 Hz Max Vertical Freq - 62 Hz Min Horiz. Freq - 30 kHz Max Horiz. Freq - 83 kHz Pixel Clock - 160 MHz
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application
This spec sheet is applied all of the LED TV with LT55H chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan whic al Unit: Product Specification Standard. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation: Above 5 Minutes (Heat Run). Temperature : at 25 ºC±5 Relative humidity : 65 ± 10% Input voltage : 100~220V, 50/60Hz (6) Adjustment equipments : Color Analyzer (CA-210 or
CA-110), SVC remote controller (7) Push The “IN STOP KEY” – For memory initialization.
Case1 : Software version up
1) After downloading S/W by USB , TV set will reboot automatically
2) Push “In-stop” key
3) Push “Power on” key
4) Function inspection
5) After function inspection, Push “In-stop” key.
ºC
3. Main PCB check process
* APC – After Manual-Insert, executing APC * Boot file Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message.
If “Error” is displayed, Check connection between
computer, jig, and set.
(3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
(1)
filexxx.bin
(4) Click “Connect” tab. If “Can’t ” is displayed, Check
connection between computer, jig, and set.
(2)
(3)
Case2 : Function check at the assembly line
1) When TV set is entering on the assembly line, Push
“In-stop” key at first.
2) Push “Power on” key for turning it on.
=> If you push “Power on” key, TV set will recover channel
information by itself.
3).After function inspection, Push “In-stop” key.
Please Check the Speed
To use speed between
from 200KHz to 400KHz
(5) Click “Auto” tab and set as below. (6) Click “Run”. (7) After downloading, check “OK” message.
(4)
filexxx.bin
(5)
(7)...........OK
(6)
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low, it didn't work. But your downloaded version is High, USB data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
* After downloading, have to adjust Tool
Option again.
(1) Push "IN-START" key in service remote controller. (2) Select "Tool Option 1" and Push "OK" button. (3) Punch in the number. (Each model has their number.) (4) Completed selecting Tool option.
Tool
Tool
Tool
Tool
Tool
Model Module
43LF540T-DB LGD 462 1223 3904 36448 9218 273
49LF540T-DB LGD 460 1223 3904 36448 9218 273
32LF550D-DD LGD 32807 1126 4032 36448 13826 273
32LF565D-DE LGD 32775 3174 4032 36448 13826 273
55LF565T-DE LGD 32784
60LF565T-DE Sharp 11281 3174 4032 36448 12802 273
40LF570T-DA INX 34186 3174 4032 36448 12802 273
42LF620T-DD LGD 32875 3174 8128 52832 13826 353
49LF620T-DD LGD 32878 3174 8128 52832 13826 353
55LF620T-DD LGD 32880 3174 8128 52832 13826 353
43LF5400-DA LGD 460 1223 3904 36384 9218 273
49LF5400-DA LGD 462 1223 3904 36384 9218 273
32LF565B-DE LGD 32775 3174 4032 36384 13826 273
50LF5650-DE LGD 32783 3174 4032 36384 13826 273
55LF5650-DE LGD 32784
60LF5650-DE Sharp 11281 3174 4032 36384 12802 273
40LF5700-DA INX 34186 3174 4032 36384 12802 273
43LF5700-DA LGD 33164 3174 3904 36384 13826 273
option1
CSOT 39952
CSOT 39952
option2
option3
option4
option5
3174 4032 36448 13826 273
3174 4032 36384 13826 273
Tool
option6
(5) After updating is complete, The TV will restart automatically. (6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn't have a DTV/ATV test on production line.
* RS-232C Connection Method Connection : PCBA (USB Port) -> USB to Serial Adapter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
▪ Product name of USB to Serial Adapter is UC-232A.
Caution: LT55H chassis support only UC-232A driver. (only
use this one. )
Only for training and service purposes
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4. Total Assembly line process
4.1. Adjustment Preparation
■ W/B Equipment condition
CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of
LED back light
■ Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
► The spec of color temperature and coordinate
Model Mode Color Temp Color coordinate Remark
Cool (C50) 13,000k
Medium (0) 9,300k
All
Warm (W50) 6,500k
x = 0.271 (±0.002) y = 0.270 (±0.002)
x = 0.286 (±0.002) y = 0.289 (±0.002)
x = 0.313 (±0.002) y = 0.329 (±0.002)
► CA210 : CH 14, Test signal : Inner pattern (80IRE)
- Standard color coordinate and temperature using CA-1000 (by H/R time)
▪ L15 LGD, INX Module
March to December & Global Normal line (LF55/56/57/62)
Cool Medium Warm
H/R Time(Min)
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
x y x x y x
271 270 286 289 313 329
Test signal
- Inner pattern for W/B adjust
- External white pattern (80IRE, 204gray) W/B luminance Spec
Min 60↑
(Only 43/49LF54XX-XX)
▪ Gumi Winter table(
January to February - Gumi production of prospective models all
models except Cinema Screen
Normal line (LF55/56/57/62)
Cool Medium Warm
H/R Time(Min)
1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346
4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
INX, AUO, Sharp, CSOT (13000K Cool the SPEC)
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
x y x x y x
271 270 286 289 313 329
cool med warm
x y x y x y
Connecting picture of the measuring instrument (On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER-ON -> Enter the mode of White-Balance, the pattern will come out.
▪ Aging chamber line (LF55/56/57/62)
Cool Medium Warm
H/R Time(Min)
1 0-5 280 285 294 308 319 340
2 6-10 276 280 290 303 315 335
3 11-20 272 275 286 298 311 330
4 21-30 269 272 283 295 308 327
5 31-40 267 268 281 291 306 323
6 41-50 266 265 280 288 305 320
7 51-80 265 263 279 286 304 318
8 81-119 264 261 278 284 303 316
9 Over 120 264 260 278 283 303 315
Only for training and service purposes
x y x x y x
271 270 285 293 313 329
Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°).
(3) Aging time
- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
● Auto adjustment Map(RS-232C)
RS-232C COMMAND [ CMD ID DATA ] Wb 00 00 White Balance Start Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
MIN
CENTER
(DEFAULT)
MAX
*Manual W/B process using adjusts Remote control.(TBD)
■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key, ■Enter White Balance by pushing “►” key at “8. White Balance”.
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu
8. White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner (ON). By selecting OFF, you can adjust using RF signal in 206 Gray pattern.
CASE Cool First adjust the coordinate far away from the target value(x, y). (1) x, y > target i) Decrease the R, G. (2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. (3) x > target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
How to adjust (1) If G gain is adjusted over 172 and R gain and B gain less
than 192 , Adjust is O.K.
(2) If G gain is less than 172 , increase G gain by up to 172,
and then increase R gain and B gain same amount of increasing G gain.
(3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
■ For manual adjustment, it is also possible by the following
sequence. (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface
(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-
Balance then press the cursor to the right (KEY►). When KEY(►) is pressed 206 Gray internal pattern will be
displayed. (4) Adjust Cool modes (i). Fix the one of R/G/B gain to 192 (default data) and
decrease the others
(If G gain is adjusted over 172 and R and B gain less than
192, increase G gain to 192 and increase R gain and B gain
same amount of increasing G gain.) (ii). If G gain is less than 172, Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain. (iii). If R gain or B gain is over 255, Readjust G gain less than 172, Conform to R gain is 255 or
B gain is 255
CASE Medium / Warm First adjust the coordinate far away from the target value(x, y). (1) x, y > target i) Decrease the R, G. (2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. (3) x > target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
▪ After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.
▪ Push the “IN STOP KEY” after completing the function
inspection.
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.2. EDID DATA
1) All Data : HEXA Value
2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***:Year : Controlled ****:Check sum
- Auto Download
■ After enter Service Mode by pushing “ADJ” key, ■ Enter EDID D/L mode. ■ Enter “START” by pushing “OK” key.
- HDMI1/2 (128)
- HDMI1 (256)
- HDMI2 (256)
Edid data and Model option download (RS232C)
NO Item CMD 1 CMD 2 Data 0
Enter download MODE
Edid data and Model option download
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
Download ‘Mode In’
Download A E 00 10
A A 0 0
When transfer the ‘Mode In’, Carry the com­mand
Automatically download (The use of a internal Data)
EDID DATA
(1) HD 2D EDID Data (LF54, LF550D/B, LF560D/B)
Before S/W version
CheckSum(0xFF) Physical Address (0x1E)
HDMI 1 74 / 5B 10
HDMI 2 74 / 4B 20
(2) FHD 2D EDID Data (LF55, LF56, LF57)
CheckSum(0xFF) Physical Address (0x1E)
HDMI 1 40 / 25 10
HDMI 2 40 / 15 20
- HDMI1/2 (128)
- HDMI1 (256)
Only for training and service purposes
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
- HDMI2 (256)
(3) HD 3D DTS EDID Data (32LF62)
- Before S/W version 3.03.02
CheckSum(0xFF) Physical Address (0x1E)
HDMI 1 74 / 50 10
HDMI 2 74 / 40 20
- HDMI1/2 (128)
- HDMI1 (256)
- HDMI1 (256)
- HDMI2 (256)
(5) FHD 2D 10Bit EDID Data (Only 60LF56)
CheckSum(0xFF) Physical Address (0x1E)
HDMI 1 40 / DE 10
HDMI 2 40 / CE 20
- HDMI1/2 (128)
- HDMI2 (256)
(4) FHD 3D DTS EDID Data (42/49LF62)
CheckSum(0xFF) Physical Address (0x1E)
HDMI 1 40 / 1A 10
HDMI 2 40 / 0A 20
- HDMI1/2 (128)
Only for training and service purposes
- 15 -
- HDMI1 (256)
- HDMI2 (256)
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.5. Outgoing condition Configuration
■ When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.6. GND & Hi-pot test
4.6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
4.6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
4.6.3. Checkpoint
(1) Test voltage 3 Poles
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA 2 Poles
- SIGNAL: 3KV/min at 100mA (2) TEST time: 1 second (3) TEST POINT 3 Poles
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE &
NEUTRAL.
2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms
5. 3D Function Test (Only LF62)
(Pattern Generator MSHG-600, MSPG-6100 [SUPPORT HDMI1.4]) * HDMI mode NO. 872 , pattern No.83
1) Please input 3D test pattern like below (HDMI mode NO. 872 , pattern No.83)
2) When 3D OSD appear automatically , then select OK button.
3) Don’t wear a 3D Glasses, Check the picture like below
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
BLOCK DIAGRAM
(P1801 or P1101)
30P HD LVDS wafer
51P F HD LVDS wafer
(P1800 or P1100)
Serial Flash
(8Mbit)
IC1300
SPI_SCK/SDI/SDO/CS
Syste m EEPROM
(256Kbit )
IC104
I2C_SCL/SDA
RX A0+/-~R XA4+/-, RXACK+/-
RXB0+/-~RXB 4+/-, RXBCK+/-
SPK_R
SPK_L
AMP_SCL/SDA
AUD_MASTER_CLK,
AUD_LRCH,
AUD_LRCK, AUD_SCK
TAS5733
(IC5600)
Connector
(P4600)
KEY1/2, LED_R, IR
AVDD5V_MHL,MHL_OCP
X-tal
24M
COMP2_L/R_IN
COMP2_Y+/AV_CVBS_IN, COMP2_Pb+/Pr+
CK+/-, D0+/-, D1+/-, D2+/-_HDMI2
DDC_SCL/SDA_2, HDMI_CEC
REAR
HDMI1
(JK800)
F-SCART
(JK2801)
OR
AV2
SPDIF_OUT
SPDIF (Optic)
(JK1001)
SIDE
USB
(JK700)
HDMI2(MHL)
(JK801)
CK+/-, D0+/-, D1+/-, D2+/-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC
SIDE_USB_DM/DP
USB1_OCP/CTL
TPS65282
+5V_USB
MHL_CD_SENSE
HP_L/ROUT, SIDE_HP_MUTE
Headphone
(JK3000)
CI Slot( P1900)
NAND FLASH
IC102 (1Gb it)
H27U1G8F 2CTR-BC
PCM_A[0:7]
TC74LCX244FT
Buffer
TS_DATA[0:7]
PCM_DATA[0:7]
EPHY
LAN
(JK2100)
COMPON ENT
(JK2802)
5V_HDMI_4
PCM_A[8:14]
SC1/AV2_CVBS_IN,
DTV/MNT_OUT, DTV/MNT_L/R_OUT
SC1_R+/G+/B+, COM1_Y+/Pb+/Pr+
TU_SCL / SDA
F/NIM
DEMOD_SCL/SDA
IF_N/P
IF_AGC
FE_TS_D ATA[0:7]
LNB_TX
LNB_OUT, DEMOD_RESET
Main SOC
M1A -256MB
(IC101)
AV2_L/R_IN
AV2_CVBS_IN
DDR3 SDRAM
(1Gbit)
IC1201
B-MDQL[0-7], B-MDQU[0-7],…
Only for M1A-128MB
1. Lownd 60Hz Block Diagram(M1A, 10W@6Ω)
Only for training and service purposes
- 17 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
2. Lowend 120Hz Block Diagram(M1A+URSA8, 10W@6Ω)
(P1101)
30P HD LVDS wafer
51P F HD LVDS wafer
(P1100)
Serial Flash
(8Mbit)
IC1300
SPI_SCK/SDI/SDO/CS
Syste m EEPROM
(256Kbit )
IC104
I2C_SCL/SDA
RX A0+/-~R XA4+/-, RXACK+/-
RXB0+/-~RXB 4+/-, RXBCK+/-
SPK_R
SPK_L
AMP_SCL/SDA
AUD_MASTER_CLK,
AUD_LRCH,
AUD_LRCK, AUD_SCK
TAS5733
(IC5600)
Connector
(P4600)
KEY1/2, LED_R, IR
DDR3 SDRAM
(1Gbit)
IC1201
B-MDQL[0-7], B-MDQU[0-7],…
Main SOC
M1A -256MB
(IC101)
LGE7438
(IC6101)
URSA8
COMP2_L/R_IN
COMP2_Y+/AV_CVBS_IN, COMP2_Pb+/Pr+
CK+/-, D0+/-, D1+/-, D2+/-_HDMI2
DDC_SCL/SDA_2, HDMI_CEC
REAR
HDMI1
(JK800)
F-SCART
(JK2801)
OR
AV2
SPDIF_OUT
SPDIF (Optic)
(JK1001)
SIDE
USB
(JK700)
HDMI2(MHL)
(JK801)
CK+/-, D0+/-, D1+/-, D2+/-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC
SIDE_USB_DM/DP
USB1_OCP/CTL
TPS65282
+5V_USB
MHL_CD_SENSE
HP_L/ROUT, SIDE_HP_MUTE
Headphone
(JK3000)
CI Slot( P1900)
NAND FLASH
IC102 (1Gb it)
H27U1G8F 2CTR-BC
PCM_A[0:7]
TC74LCX244FT
Buffer
TS_DATA[0:7]
PCM_DATA[0:7]
EPHY
LAN
(JK2100)
COMPON ENT
(JK2802)
5V_HDMI_4
PCM_A[8:14]
SC1/AV2_CVBS_IN,
DTV/MNT_OUT, DTV/MNT_L/R_OUT
SC1_R+/G+/B+, COM1_Y+/Pb+/Pr+
TU_SCL / SDA
F/NIM
DEMOD_SCL/SDA
IF_N/P
IF_AGC
FE_TS_D ATA[0:7]
LNB_TX
LNB_OUT, DEMOD_RESET
X-tal
24M
AV2_L/R_IN
AV2_CVBS_IN
Only for M1A-128MB
120Hz : URSA8
Only for training and service purposes
- 18 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
900
410
901
400
LV1
401
521
540
200
120
A10
530
A2
Set + Stand
Only for training and service purposes
- 19 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
TP for NON-EU models(except EU and China)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
TP for CI slot
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORD PCM_A[11]
/PCM_IOWR CI_TS_DATA[1]
/PCM_CE
/PCM_IRQA
/PCM_CD
/PCM_WAIT
PCM_RST
PCM_5V_CTL
/CI_DET
TP for S2
PCM_D[0]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[12]
PCM_A[13]
PCM_A[14]
TP for FE_TS_DATA
CI_TS_CLK
CI_TS_VAL
CI_TS_SYNC
CI_TS_DATA[0]
CI_TS_DATA[2]
CI_TS_DATA[3]
CI_TS_DATA[4]
CI_TS_DATA[5]
CI_TS_DATA[6]
CI_TS_DATA[7]
TP for SCART
SCART1_MUTE
SC1_IDPCM_D[1]
SC1_FB
DTV/MNT_VOUT
SCART1_Lout
SCART1_Rout
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for Headphone
HP_LOUT
HP_ROUT
SIDE_HP_MUTE
HP_DET
TP for L15
/VBUS_EN
RGB_DDC_SCL
RGB_DDC_SDA
TU_GND_A
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1A
TP_NON_EU 3
140702
POWER
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
FROM POWER B/D 13.2V
+3.5V_ST
MMBT3906(NXP)
R406
10K
R404
4.7K
TR_NXP
Q400 MMBT3904(NXP)
R419
100
TR_NXP
Q402 MMBT3904(NXP)
1
TVS_SEMTECH
RL_ON
INV_CTL
+3.5V_ST
OPT
R400
10K
R401
10K
+3.5V_ST
R426 10K
TR_KEC Q400-*1 2N3904S
B
R402
10K
+3.3V_Normal
R425
10K
TR_KEC Q402-*1 2N3904S
B
B
B
R420
C
E
C
E
C
E
1K
C
E
+13.2V to +3.5V_STANDBY
+13.2V
L412
BLM18PG121SN1D
C438
C439
10uF
0.1uF
25V
25V
R1
R46 9
R468
68K
6.8K 1/1 6W
1/16W
1%
1%
C440
100pF
50V
R2
R471
C441
22K
1/16W
1%
2200pF
1uF 10V
Vout=0.765*(1+R1/R2)
TR_NXP
Q401
ZD404
TVS_KEC ZD404-*1
R470 10K
C442
50V
3
2
5V
TR_KEC Q401-*1
2N3906S-RTK
EBC
OPT
R412
33K
SMAW200-H12S5K(BK)(LTR)
PWR_ON
D13.2V A13.2V
DRV_ON
IC405
BD9D321EFJ
EN
1
FB
2
VREG
3
SS
4
3A
GND
GND
THERMAL
+13.2V POWER_DET
+13.2V
R430
14K
1%
R431
C415
5.6K
0.1uF 1%
25V
P401
1
2 4
3 5
6
7
8
10
9 11
12
13
PDIM#2 D13.2V D13.2V A13.2V GND PDIM#1
OPT R467
R424
3.9K
1K
PWM1
L403
MLB-201209-0120P-N2
C40 2
OPT
0.1 uF
L414
25V
L415
MLB-201209-0120P-N2
PWM_DIM
OPT C43 3
4.7 uF 50V
C44 6
0.1 uF 25V
+13.2V
A13.2V
R435 100K
RESET_IC_KEC
IC401
KIC7529M2
VCC
3
1
IC401-*1
RESET_IC_DIODES
APX803E29
VCC
3
1
OUT
2
GND
RESET
2
GND
R454
100
+3.5V_ST
C422
0.1uF 16V
OPT R438
4.7K
POWER_DET
POWER_DET_RESET
+13.2V to PANEL_VCC +3.5V_ST to +3.3V_Normal
PANEL_VCC
D
R451
R452
5.6K
5.6K
G
C
TR_KEC Q403-*1 2N3904S
E
POWER_ON/OFF_1
+3.5V_ST
R443
10K
R444 10K
B
R447 22K
R448
2.2K
C428
2.2uF 10V
C
TR_NXP Q404 MMBT3904(NXP)
E
UBW2012-121F
PANEL_CTL
L408
120OHM
OPT
C425
0.1uF 25V
R441
+13.2V
10K
R442
10K
B
R445
R446 120K
33K
NON_60_SHARP
C
TR_NXP Q403 MMBT3904(NXP)
E
SSM3J332R
C427
0.22uF 25V
Q405
S
60_SHARP
C427-*1
0.1uF 50V
B
FET_AOS Q406-*1
AO3435
S
G
FET_TOSHIBA
Q406 SSM3J332R
S
B
G
C
E
D
D
C429
0.1uF 16V
TR_KEC
Q404-*1 2N3904S
L410
BLM18PG121SN1D
C430 22uF 10V
+3.3V_Normal
ZD402
5V
TVS_SEMTECH
TVS_KEC ZD402-*1
+3.5V_Normal to +1.5V_DDR
+3.5V_ST
TVS_SEMTECH
[EP]
VIN
8
9
7
6
5
BOOT
SW
GND
C443
0.1uF 16V
L413
2uH
C444 22uF
10V
C445 22uF
ZD405
5V
TVS_KEC
ZD405-*1
10V
+3.3V_Normal
L409
BLM18PG121SN1D
C426 10uF
10V
IC404
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
1.3A
R449 1K 1/16W 1%
R450 200 1/16W 1%
Vout=1.25*(1+R2/R1)+Iadj*R2
R1
R2
L411
CB2012PK501T
R453
0
C431 10uF
10V
+1.5V_DDR
ZD403
2.5V
OPT ZD406
5.1v
+5V_Normal & +1.10V_VDDC
+13.2V
L404
CB2012PK501T
C405
C406
10uF
10uF
25V
25V
+3.3V_Normal
R403 10K
OPT
C403
4700pF
50V
USB1_CTL
Check the pull down when AC Power On with HDD
USB1_CTL_Pull_Down
USB1_OCD
+3.3V_Normal
OPT R473
C404
30K
4700pF
R405
10K
OPT
OPT
R474
+3.3V_Normal
30K
50V
R472
3.3K
OPT
R407
4.7K
R408 100K
+5V_Normal
C408
2200pF
2200pF
OPT
50V
OPT
C409
50V
R409
91K
C407 1uF
10V
SS2
EN1
EN2
ROSC/SYNC
SW_EN
NFAULT
+5V_USB
[EP]
1
2
3
4
5
6
THERMAL
25
7
SW_OUT
VIN123V7V24SS1
22
IC400
SNXXXXX
9
8
VIN2
SW_IN
10
PGND2
LX2
25V
0.047uF
C410
BST120LX121PGND1
19
COMP1
18
FB1
17
AGND
16
RSET
15
FB2
14
COMP2
13
11
12
BST2
+5V_Normal
Vout=0.6(R1/R2)+0.6
L405
4.7uH
R1
OPT C411
R411
82pF
4.7K 50V
1%
R2
R413
5.1K 1%
C416
22pF
50V
C417
R41 4
3300pF
10K
50V
R422 15K
C419
22pF 50V
C420
3300pF
R41 8
50V
20K
L406
C421
0.047uF
4.7uH
25V
OPT
ZD407
5.1v
R1
R415
R416
5.1K
R417
+1.10V_VDDC
OPT
C412
C413
ZD401
10uF
2.5V
6.3V
0 5%
R2
1%
39K
1%
C418
47pF 50V
+5V_Normal
C423 22uF 16V
22uF
C414 22uF
10V
10V
C424 22uF 16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C432
1uF 16V
L14_CA
POWER
Vout=0.6(R1/R2)+0.6
140826
4
HDMI (REAR 1 / SIDE 1 MHL)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
HDMI_1
5V_HDMI_2
R802
1.8K
VA800
R803
1K
SHIELDGND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
ESD_HDMI1_VARISTOR
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG59023302
JK800
This GND Pattern should be very narrow HDMI jack burnt problem improvement
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_DET_HDMI_2
R805
3.3K
ESD_HDMI1_VARISTOR VA801
ESD_HDMI1_CAP
VA800-*1 1uF 10V
ESD_HDMI1_CAP VA801-*1 1uF 10V
AR801
5.1
AR802
5.1
MMBT3904(NXP)
ESD_HDMI1 VA802
TR_NXP
Q800
C
E
TR_KEC Q800-*1 2N3904S
B
C
B
E
ESD_HDMI1
VA803
ESD_HDMI1_TMDS
IP4294CZ10-TBR
ESD_HDMI1_TMDS
IP4294CZ10-TBR
HDMI_2 MHL
5V_HDMI_4
R808
10K
R809
10K
R810 100
R811 100
ESD_HDMI1 VA804
D803
1 2 3 4 5
1 2 3 4 5
D804
10 9 8 7 6
10 9 8 7 6
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
BODY_SHIELD
20
JK801-*1 DAADR019A
HDMI-2_EMI_FOOSUNG
GND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG62611204
HDMI-2
JK801
19
HOT_PLUG_DETECT
18
VDD[+5V]
17
DDC/CEC_GND
16
SDA
This GND Pattern should be very narrow
15
SCL
HDMI jack burnt problem improvement
14
RESERVED
13
CEC
12
TMDS_CLK-
11
TMDS_CLK_SHIELD
10
TMDS_CLK+
9
TMDS_DATA0-
8
TMDS_DATA0_SHIELD
7
TMDS_DATA0+
6
TMDS_DATA1-
5
TMDS_DATA1_SHIELD
4
TMDS_DATA1+
3
TMDS_DATA2-
2
TMDS_DATA2_SHIELD
1
TMDS_DATA2+
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
HDMI-2
R812
1.8K
5V_DET_HDMI_4
ESD_HDMI2 VA805
HDMI-2
R813
3.3K
ESD_HDMI2 VA806
OPT
VA807
5.6V
HDMI-2_MHL
R818
0
HDMI-2_MHL_Non
R819
0

ESD_HDMI2
VA808
ESD_HDMI2
VA809
ESD_HDMI2
VA811
D805
1 2 3 4 5
ESD_HDMI2_TMDS
IP4294CZ10-TBR
1 2 3 4 5
ESD_HDMI2_TMDS
IP4294CZ10-TBR
D806
10 9 8 7 6
10 9 8 7 6
ESD_HDMI2 VA810
HDMI-2_MHL
HDMI-2
R814
33
HDMI-2
R815 100
R816 100
HDMI-2
AR804
5.1
AR803
5.1
C800
0.047uF 25V
HDMI-2_MHL R817 300K
MHL Spec
HDMI-2_MHL_Non R817-*1
3.3K
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
MHL_CD_SENSE
CEC
HDMI_CEC
HDMI_DIODE_SUZHOU
D800-*1
MMBD6100
A1
C
5V_HDMI_2
R800
2.7K
+5V_Normal
R801
2.7K
R804 100
A2
HDMI_DIODE_KEC
A2CA1
KDS184 D800
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE_S7
HDMI_DIODE_SUZHOU
D801-*1
MMBD6100
A1
C
R806
2.7K
+5V_Normal
R807
2.7K
5V_HDMI_4
HDMI_DIODE_SUZHOU
A2
HDMI_DIODE_KEC
A2CA1
KDS184 D801
D802-*1
MMBD6100
DDC_SDA_4
DDC_SCL_4
A2
A1
C
+3.5V_ST
A2CA1
HDMI_DIODE_KEC
KDS184 D802
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1A
HDMI_R1S1 8
140813
SPDIF
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
SPDIF_OUT
+3.3V_Normal
OPT
C1001
1uF 10V
ESD Ready
SPDIF_OPTIC C1002 18pF 50V
VINPUT
SPDIF_OPTIC
JK1001
JST1223-001
1
GND
2
VCC
3
Fiber Optic
4
FIX_POLE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
SPDIF
2014/06/02
10
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