LG 43LF513A, 49LF513A-TA Schematic

		Internal Use Only
North/Latin America	http://aic.lgservice.com
Europe/Africa	http://eic.lgservice.com
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LED TV

SERVICE MANUAL

CHASSIS : LB56A

MODEL : 43/49LF513A 43/49LF513A-TA

CAUTION

BEFORE SERVICING THE CHASSIS,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL68743606 (1507-REV00)	Printed in Korea

CONTENTS

CONTENTS ..............................................................................................	2
SAFETY PRECAUTIONS .........................................................................	3
SERVICING PRECAUTIONS....................................................................	4
SPECIFICATION........................................................................................	6
ADJUSTMENT INSTRUCTION.................................................................	9
DISASSEMBLY .......................................................................................	13
BLOCK DIAGRAM..................................................................................	14
EXPLODED VIEW ..................................................................................	15
SCHEMATIC CIRCUIT DIAGRAM ...........................................	APPENDIX
TROUBLE SHOOTING GUIDE ................................................	APPENDIX

Copyright ©	LG Electronics. Inc. All rights reserved.	- 2 -	LGE Internal Use Only
Only for training and service purposes

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc.

If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ.

When the exposed metal has no return path to the chassis the reading must be infinite.

An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts.

Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA.

In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Copyright ©	LG Electronics. Inc. All rights reserved.	- 3 -	LGE Internal Use Only
Only for training and service purposes

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1.Always unplug the receiver AC power cord from the AC power source before;

a.Removing or reinstalling any component, circuit board module or any other receiver assembly.

b.Disconnecting or reconnecting any receiver electrical plug or other electrical connection.

c.Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2.Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3.Do not spray chemicals on or near this receiver or any of its assemblies.

4.Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

5.Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6.Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7.Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

8.Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static type solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1.Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2.Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3.Keep the soldering iron tip clean and well tinned.

4.Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5.Use the following unsoldering technique

a.Allow the soldering iron tip to reach normal temperature. (500 °F to 600 °F)

b.Heat the component lead until the solder melts.

c.Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6.Use the following soldering technique.

a.Allow the soldering iron tip to reach a normal temperature (500 °F to 600 °F)

b.First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.

c.Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d.Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

Copyright ©	LG Electronics. Inc. All rights reserved.	- 4 -	LGE Internal Use Only
Only for training and service purposes

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1.Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2.Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1.Carefully insert the replacement IC in the circuit board.

2.Carefully bend each IC lead against the circuit foil pad and solder it.

3.Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1.Remove the defective transistor by clipping its leads as close as possible to the component body.

2.Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3.Bend into a "U" shape the replacement transistor leads.

4.Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1.Heat and remove all solder from around the transistor leads.

2.Remove the heat sink mounting screw (if so equipped).

3.Carefully remove the transistor from the heat sink of the circuit board.

4.Insert new transistor in the circuit board.

5.Solder each transistor lead, and clip off excess lead.

6.Replace heat sink.

Diode Removal/Replacement

1.Remove defective diode by clipping its leads as close as possible to diode body.

2.Bend the two remaining leads perpendicular y to the circuit board.

3.Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4.Securely crimp each connection and solder it.

5.Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1.Clip each fuse or resistor lead at top of the circuit board hollow stake.

2.Securely crimp the leads of replacement component around notch at stake top.

3.Solder the connections.

CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1.Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2.carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3.Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4.Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1.Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2.Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3.Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Copyright ©	LG Electronics. Inc. All rights reserved.	- 5 -	LGE Internal Use Only
Only for training and service purposes

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

This specification is applied to the LB56A chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

(1)Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

(2)Relative Humidity: 65 % ± 10 %

(3)Power Voltage

:Standard input voltage (AC 100-240 V~, 50/60 Hz)

*Standard Voltage of each products is marked by models.

(4)Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM.

(5)The receiver must be operated for about 5 minutes prior to the adjustment.

4.Model General Specification

* HDMI 1.4 with Deep Color is only apply for FHD Model

3.Test method

(1)Performance: LGE TV test method followed

(2)Demanded other specification

-Safety : CE, IEC specification

-EMC : CE, IEC

No.	Item			Specification		Remarks
1.	Market		NON EU
2.	Broadcasting system		PAL/SECAM B/G/D/K,
			PAL I, NTSC-M PALB/B
		BAND	PAL(BG,I,BB)	NTSC(M)	China(DK)
3.	Channel Storage	VHF/UHF	01-C69	2-78	C1-C69
		Cable	S1-S47	1-71	S1-S47
4.	Receiving system		Upper Heterodyne
5.	Video Input		PAL, SECAM, NTSC			2EA
6.	Component Input		Y/Cb/Cr, Y/ Pb/Pr			Rear (1EA), Except RGB PC Models
7.	USB Input		MP3, JPEG,Movie			Side (1EA)
8.	AV Audio Output		RCA-RF/AV/HDMI Audio Output			Rear (1EA)
9.	D-SUB		Service Only			Rear (1EA)
10.	HDMI Input		HDMI-DTV, Only PCM MODE			AV input 2EA
11.	Audio Input		AV&Component &PC			2EA

Copyright ©	LG Electronics. Inc. All rights reserved.	- 6 -	LGE Internal Use Only
Only for training and service purposes

5. Component Video Input(Y, PB, PR)

No	Resolution	H-freq. (kHz)	V-freq. (Hz)	Pixel clock (MHz)	Proposed
1	720*480	15.73	59.94	13.500	SDTV, DVD 480I(525I)
2	720*480	15.75	60.00	13.514	SDTV, DVD 480I(525I)
3	720*576	15.625	50.00	13.500	SDTV, DVD 576I(625I) 50Hz
4	720*480	31.47	59.94	27.000	SDTV 480P
5	720*480	31.50	60.00	27.027	SDTV 480P
6	720*576	31.25	50.00	27.000	SDTV 576P 50Hz
7	1280*720	44.96	59.94	74.176	HDTV 720P
8	1280*720	45.00	60.00	74.250	HDTV 720P
9	1280*720	37.50	50.00	74.25	HDTV 720P 50Hz
10	1920*1080	28.125	50.00	74.250	HDTV 1080I 50Hz,
11	1920*1080	33.72	59.94	74.176	HDTV 1080I
12	1920*1080	33.75	60.00	74.25	HDTV 1080I
13	1920*1080	56.25	50	148.5	HDTV 1080P
14	1920*1080	67.432	59.94	148.350	HDTV 1080P
15	1920*1080	67.5	60.00	148.5	HDTV 1080P

6. HDMI input

(PC-Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)

No	Resolution	H-freq. (kHz)	V-freq. (Hz)	Pixel clock (MHz)	Proposed
1	640×480	31.469	59.94	25.17	VESA(VGA)
2	800×600	37.879	60.317	40.00	VESA(SVGA)
3	1024×768	48.363	60.004	65.00	VESA(XGA)
4	1280×768	47.776	59.87	79.5	VESA(WXGA)
5	1360×768	47.72	59.799	84.62	VESA(WXGA)
6	1366×768	47.7	60.00	84.62	WXGA
7	1280×1024	63.595	60.00	108.875	SXGA
8	1920×1080	66.647	59.988	138.625	WUXGA

Copyright ©	LG Electronics. Inc. All rights reserved.	- 7 -	LGE Internal Use Only
Only for training and service purposes

7. HDMI input (DTV)

No.	Resolution	H-freq. (kHz)	V-freq. (Hz)	Pixel clock(MHz)	Proposed	Remarks
1	720*480	15.73	59.94	13.500	SDTV, DVD 480I(525I)
2	720*480	15.75	60.00	13.514	SDTV, DVD 480I(525I)	Spec. out but display.
3	720*576	15.625	50.00	13.500	SDTV, DVD 576I(625I) 50Hz
4	720*480	31.469	59.94	27	SDTV 480P
5	720*480	31.5	60.00	27.027	SDTV 480P
6	720*576	31.25	50.00	27	SDTV 576P
7	1280*720	44.96	59.94	74.176	HDTV 720P
8	1280*720	45	60.00	74.25	HDTV 720P
9	1280*720	37.5	50.00	74.25	HDTV 720P
10	1920*1080	28.125	50.00	74.25	HDTV 1080I
11	1920*1080	33.72	59.94	74.176	HDTV 1080I
12	1920*1080	33.75	60.00	74.25	HDTV 1080I
13	1920*1080	56.25	50.00	148.5	HDTV 1080P
14	1920*1080	67.43	59.94	148.350	HDTV 1080P
15	1920*1080	67.5	60.00	148.5	HDTV 1080P
16	1920*1080	27	24.00	74.25	HDTV 1080P
17	1920*1080	33.75	30.00	74.25	HDTV 1080P
18	1920*1080	26.97	23.97	74.25	HDTV 1080P
19	1920*1080	33.716	29.976	74.25	HDTV 1080P

Copyright ©	LG Electronics. Inc. All rights reserved.	- 8 -	LGE Internal Use Only
Only for training and service purposes

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with LB56A chassis.

2.Designation

(1)Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.

(2)Adjustment must be done in the correct order.

(3)The adjustment must be performed in the circumstance of 25 °C ± 5 °C of temperature and 65 % ± 10 % of relative humidity if there is no specific designation.

(4)The input voltage of the receiver must keep 100-220 V, 50/60Hz.

(5)The receiver must be operated for over 5 minutes prior to the adjustment when module is in the circumstance of above 15 °C.

In case of keeping module is in the circumstance of 0 °C, it should be placed in the circumstance of above 15 °C for 2 hours.

In case of keeping module is in the circumstance of below -20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.

*Caution

When a still image is displayed for 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area.

3.ADC Calibration

-An ADC calibration is automatically adjusted from DFT-Jig

-If it needs to adjust manually, refer to appendix.

* ADC Calibration Protocol (RS232)

NO	Item	CMD 1	CMD 2	Data 0
Enter Adjust	Adjust	A	A	0	0	When transfer the ‘Mode In’,
MODE	‘Mode In’					Carry the command.
ADC adjust	ADC	A	D	1	0	Automatically adjustment
	Adjust					(The use of a internal pattern)

Adjust Sequence

▪aa 00 00 [Enter Adjust Mode]

▪xb 00 40 [Component1 Input (480i)] ▪ad 00 10 [Adjust 480i Comp1]

▪aa 00 90 End Adjust mode

4. EDID Download

4.1. Overview

-It is a VESA regulation. A PC or a MNT will display an optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.

4.2. Equipment

-Since EDID data is embedded, EDID download JIG, HDMI cable are not need.

4.3. Download method

- The EDID data is automatically saved.

EZ ADJUST				EDID D/L
0. Tool Option1			HDMI1			NG
1. Tool Option2			HDMI2			NG
2. Area Option				Start		Reset
3. ADC Calibration
9. W/V ADJUST
5. EDID D/L(AC3)	►			EDID D/L
			HDMI1			OK
			HDMI2			OK
				Start		Reset

■ 8bit FHD large inch

** HDMI 1 : 256Bytes

	0	1	2	3	4	5	6	7	8	9	A	B	C	D	E	F
0	00	FF	FF	FF	FF	FF	FF	00	1E	6D	01	00	01	01	01	01
10	01	19	01	03	80	A0	5A	78	0A	D9	B0	A3	57	49	9C	25
20	11	49	4B	21	08	00	01	01	45	40	61	40	01	01	81	80
30	01	01	D1	C0	01	01	02	3A	80	18	71	38	2D	40	58	2C
40	45	00	08	44	21	00	00	1E	1B	21	50	A0	51	00	1E	30
50	48	88	35	00	BC	88	21	00	00	1C	00	00	00	FC	00	4C
60	47	20	54	56	0A	20	20	20	20	20	20	20	00	00	00	FD
70	00	3A	3F	1C	44	0F	00	0A	20	20	20	20	20	20	01
80	02	03	28	F1	4F	90	07	01	16	02	03	11	12	13	04	14
90	05	20	22	1F	26	11	07	50	09	7F	07	83	01	00	00	68
A0	03	0C	00	10	00	80	1E	00	01	1D	00	80	51	D0	1C	20
B0	40	80	35	00	BC	88	21	00	00	1E	8C	0A	D0	8A	20	E0
C0	2D	10	10	3E	96	00	13	8E	21	00	00	18	8C	0A	A0	14
D0	51	F0	16	00	26	7C	43	00	C4	8E	21	00	00	98	01	1D
E0	80	18	71	1C	16	20	58	2C	25	00	C4	8E	21	00	00	9E
F0	00	00	00	00	00	00	00	00	00	00	00	00	00	00	00

Checksum: Changeable b y total EDID data. <Large FHD Model>

	EDID C/S data		FHD(8 bit)
			HDMI
		Block 0	BF
	check sum (Hex)	Block 1	44(HDMI1)
			34(HDMI2)

Copyright ©	LG Electronics. Inc. All rights reserved.	- 9 -	LGE Internal Use Only
Only for training and service purposes

5. White Balance Adjustment

5.1. Overview

5.1.1. W/B adj. Objective & How-it-works

(1)Objective: To reduce each Panel’s W/B deviation

(2)How-it-works: When R/G/B gain in the OSD is at 192, it means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.

(3)Adj. condition: normal temperature

1)Surrounding Temperature: 25 °C ± 5 °C

2)Warm-up time: About 5 Min◦

3)Surrounding Humidity: 20% ~ 80%

4)Before White balance adjustment, Keep power on status, don’t power off.

5.1.2. Adj. condition and cautionary items

(1)Lighting condition in surrounding area surrounding lighting should be lower 10 lux.

Try to isolate adj. area into dark surrounding.

(2)Probe location: Color Analyzer(CA-210) probe should be within 10 cm and perpendicular of the module surface. (80°~ 100°)

(3)Aging time

1)After Aging Start, Keep the Power ON status during 5 Minutes.

2)In case of LCD, Back-light on should be checked using no signal or Full-white pattern.

5.2.Equipment

(1)Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED: CH14)

(2)Adj. Computer(During auto adj., RS-232C protocol is needed)

(3)Adjust Remote control

(4)Video Signal Generator MSPG-925F 720p/204-Gray (Model: 217, Pattern: 49)

* Color Analyzer Matrix should be calibrated using CS-1000.

5.3. Equipment connection

		Color Analyzer
Probe		RS-232C
		Computer
	RS -232C	RS-232C

Pattern Generator

Signal Source

*If TV internal pattern is used, not needed

**RS-232C Connection Method.

LB56G/LB56H → RGB cable or 3P H/P cable → UART Jig

→RS232C cable and USB AM-BM cable → PC

5.4. Adjustment Command (Protocol)

(1) RS-232C Command used during auto-adj.

	RS-232C COMMAND			Explanation
	CMD	DATA	ID
	wb	00	00	Begin White Balance adjustment
	wb	00	ff	End White Balance adjustment
				(internal pattern disappears)

(2) Adjustment Map

	Adj. item	Command		Data Range		Default
		(lower caseASCII)		(Hex.)		(Decimal)
		CMD1	CMD2	MIN	MAX
	R Gain	j	g	00	C0	172
	G Gain	j	h	00	C0	192
Cool	B Gain	j	i	00	C0	192
	R Cut					64
	G Cut					64
	B Cut					64
	R Gain	j	a	00	C0	192
	G Gain	j	b	00	C0	192
Medium	B Gain	j	c	00	C0	192
	R Cut					64
	G Cut					64
	B Cut					64
	R Gain	j	d	00	C0	192
	G Gain	j	e	00	C0	192
Warm	B Gain	j	f	00	C0	192
	R Cut					64
	G Cut					64
	B Cut					64

5.5. Adjustment method

5.5.1. Auto WB calibration

(1)Set TV in ADJ mode using P-Only key(or POWER ON key).

(2)Place optical probe on the center of the display.

-It need to check probe condition of zero calibration before adjustment.

(3)Connect RS-232C Cable

(4)Select mode in ADJ Program and begin a adjustment.

(5)When WB adjustment is completed with OK message, check adjustment status of pre-set mode.(Cool, Medium, Warm)

(6)Remove probe and RS-232C cable.

▪W/B Adj. must begin as start command “wb 00 00” , and finish as end command “wb 00 ff”, and Adj. offset if need.

5.5.2. LED White balance table

- If Model is Polaris Model, G-gain fix is applied.

(1)Cool Mode

1)Purpose : Especially G-gain fix adjust leads to the luminance enhancement. Adjust the color temperature to reduce the deviation of the module color temperature.

2)Principle: To adjust the white balance without the saturation,

-Adjust the G gain more than 172 (If R gain or G gain is more than 255, G gain can adjust less than 172) and change the others(R/B Gain).(20LB45X model)

-Fix the G gain to 172(default data) and change the others(R/B Gain).(over 22inch model)

3)Adjustment mode : mode - Cool

Copyright ©	LG Electronics. Inc. All rights reserved.	- 10 -	LGE Internal Use Only
Only for training and service purposes

(2)Medium / Warm Mode

1)Purpose : Adjust the color temperature to reduce the deviation of the module color temperature.

2)Principle: To adjust the white balance without the saturation,

-In Medium mode, Fix to G gain to 192 and change the others(R/B Gain)(20LB45X model)

-Fix the one of R/G/B gain to 192(default data) and decrease the others.

3)Adjustment mode : Two modes - Medium / Warm

6.Tool Option setting & Inspection per countries

(1)Press 'IN START' key at Factory Service remote control.

(2)Select 'Tool Option 1'.

(3)Punch in the number and press 'OK'. (Each of models has their number)

(4)Correct 'Tool Option2' ~ 'Tool Option5'.

(5)Completed adjusting Tool option.

5.6.Reference(White Balance Adjustment coordinate and color temperature)

(1)Luminance: 204 Gray, 80IRE

(2)Standard color coordinate and temperature using CS-1000 (over 26 inch)

■ The spec of color temperatre and coordinate for Auto W/B.

	Model	Mode	Color Temp.	Color coordinate	Remark
		Cool	13,000 K	x = 0.278 (± 0.002)
		(C50)		y = 0.280 (± 0.002)	* Test signal
	32LF5XXA	Medium	9,300 K	x = 0.293 (± 0.002)	- Inner pattern
	(BOE/CSOT)	(0)		y = 0.299 (± 0.002)	for W/B adjust
		Warm	6,500 K	x = 0.320 (± 0.002)	- External white
		(W50)		y = 0.339 (± 0.002)	pattern (85IRE,
					204gray)
	32~49LF5XXA	Refer to below W/B table in process of
	(LGD)		aging time.

* Note : x,y coordinates are drifted about 0.007 after 30 mins heat-run. So checking color coordinate within 5-min at total assembly line, consider x,y coordinates might be up to 0.007 than x,y target of each color temperature.

●W/B Table in process of aging time

-32”~49” LGD Module(except 32/43LF51 LGD)

(normal line)

	Aging time		Cool		Medium		Warm
color coordinate			x	y	x	y	x	y
		Target	271	270	286	289	313	329
1		0-2	282	289	297	308	324	348
2		3-5	281	287	296	306	323	346
3		6-9	279	284	294	303	321	343
4		10-19	277	280	292	299	319	339
5		20-35	275	277	290	296	317	336
6		36-49	274	274	289	293	316	333
7		50-79	273	272	288	291	315	331
8		80-119	272	271	287	290	314	330
9		Over 120	271	270	286	289	313	329

- AUO /INX/ COST / SHARP / BOE / 32/43LF51 LGD Module which cool spec is 13000K

	cool				med		Warm
	x		y	x		y	x	Y
spec	271		270	286		289	313	329
target	278		280	293		299	320	339

7.Ship-out mode check (In-stop)

▪After final inspection, press In-Stop key of the Adjustemnt

Remote Control and check that the unit goes to Stand-by mode.

8.AUDIO output check

8.1.Audio input condition

(1)RF input: Mono, 1 KHz sine wave signal, 100% Modulation

(2)CVBS, Component: 1 KHz sine wave signal (0.4 Vrms)

8.2.Specification

Item	Min	Typ	Max	Unit		Remark
Audio practical max				W	(1)	Measurement condition
Output, L/R (Distortion	4.5	5.0	6.0			- EQ/AVL/Clear Voice: Off
				Vrms
=10% max Output)					(2)	Speaker (8 Ω Impedance)

9. GND and HI-POT Test

9.1.GND & HI-POT auto-check preparation

(1)Check the POWER CABLE and SIGNAL CABE insertion condition

9.2.GND & HI-POT auto-check

(1)Pallet moves in the station. (POWER CORD / AV CORD is tightly inserted)

(2)Connect the AV JACK Tester.

(3)Controller (GWS103-4) on.

(4)GND Test (Auto)

-If Test is failed, Buzzer operates.

-If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX)

(5)HI-POT test (Auto)

-If Test is failed, Buzzer operates.

-If Test is passed, GOOD Lamp on and move to next process automatically.

9.3.Checkpoint

(1)Test voltage

-GND: 1.5 KV / min at 100 mA

-SIGNAL: 3 KV / min at 100 mA

(2)TEST time: 1 second

(3)TEST POINT

-GND Test = POWER CORD GND and SIGNAL CABLE GND.

-Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.

(4)LEAKAGE CURRENT: At 0.5 mArms

Copyright ©	LG Electronics. Inc. All rights reserved.	- 11 -	LGE Internal Use Only
Only for training and service purposes

10. USB S/W Download

(optional, Service only)

* Warning : Do not Download on Power only mode

(1)Put the USB Stick to the USB socket.

(2)Automatically detecting update file in USB Stick.

-If your downloaded program version in USB Stick is older than that of TV set, it didn’t work.

Otherwise USB data is automatically detected.

(3)Show the message “Copying files from memory”.

(4) Updating is starting.

(5)Updating Completed, the TV will restart automatically.

(6)If your TV is turned on, check your updated version and Tool option.

*If downloading version is more new than your TV have, TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn't have a DTV/ATV test on production line.

*After downloading, have to adjust TOOL OPTION again.

1)Push "IN-START" key in service remote control.

2)Select "Tool Option 1" and push "OK" key.

3)Punch in the number. (Each model has their number.)

11. Optional adjustments

11.1. Manual ADC Calibration

■Enter ‘EZ ADJUST’ mode by pressing ‘ADJ’ key.

■Enter Internal ADC calibration mode by pressing ‘OK’ key at

‘3. ADC CALIBRATION’

* Caution: Using ‘P-ONLY’ button of the Factory Service remote control when turns TV on.

●If you can’t success ADJUST ADC, please confirm ‘Support Int. ADC’ at TOOL OPTION2.

11.2. Manual White balance Adjustment

11.2.1. Adj. condition and cautionary items

(1)Lighting condition in surrounding area surrounding lighting should be lower 10 lux. Try to isolate adj. area into dark surrounding.

(2)Probe location: Color Analyzer (CA-210) probe should be within 10cm and perpendicular of the module surface. (80°~ 100°)

(3)Aging time

1)After Aging Start, Keep the Power ON status during 5 Minutes.

2)In case of LCD, Back-light on should be checked using no signal or Full-white pattern.

11.2.2. Equipment

(1)Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED: CH14)

(2)Adj. Computer(During auto adj., RS-232C protocol is needed)

(3)Adjust Remot control

(4)Video Signal Generator MSPG-925F 720p/216-Gray (Model: 217, Pattern: 78)

11.2.3. Adjustment

(1)Set TV in Adj. mode using POWER ON.

(2)Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10cm of the surface.

(3)Press ADJ key → EZ adjust using adj. R/C → 6. WhiteBalance then press the cursor to the right (Key►). When Key(►) is pressed 216 Gray internal pattern will be displayed.

(4)One of R Gain / G Gain / B Gain should be fixed at 192, and the rest will be lowered to meet the desired value.

(5)Adj. is performed in COOL, MEDIUM, WARM 3 modes of color temperature.

■ If internal pattern is not available, use RF input. In EZ Adj. menu 6.White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner(ON). By selecting OFF, you can adjust using RF signal in 216 Gray pattern.

Copyright ©	LG Electronics. Inc. All rights reserved.	- 12 -	LGE Internal Use Only
Only for training and service purposes

DISASSEMBLY

■Disassembly of Back cover

(1)Unscrew bolts in the set.

(4) Put ‘long nose’ into the hole.

(2) Check both right and left hole.

(5)Open B/C with push/pulling long nose to upper and lower sides.

(3) Attach tape to ‘Long nose pliers’.

(6) Disassemble Back cover.

* Scratch can be caused without tape.

*Disassemble it from left to right for top side hook on Back cover

Copyright ©	LG Electronics. Inc. All rights reserved.	- 13 -	LGE Internal Use Only
Only for training and service purposes

- 14 - .reserved rights All .Inc .Electronics LG © Copyright

purposes service and training for Only

Only Use Internal LGE

7,8 4,5,6

2V.D13

2V.A13

( (

( (

POWER BOARD

	P700				11 12		1
			Panel_Vcc
	Q704				Inv.ON	PDim	RLOn
	DMP2130L
					102	105	101
			IC502	94	SPI_CLK
3.3V_ST			Serial Flash	95	SPI_DI
				97
			8Mbytes		SPI_CZ
				96
					SPI_DO
			IC503	85	EEP SDA
			EEPROM	84	EEP SCL

IC701				+5V_USB
								To USB
BD9D321EFJ
				1.2V_VDDC
IC702												77	62	54	42
BD9D321EFJ
				3.3V_ST							3.3V_M	41	30	18	100
IC700								Q705				9	116 107
BD9D321EFJ								DMP2130L
									Main_1.8V			48
							IC703
3.3V_M						1.8V REG						115
												50
												51	113		112
				40	35						I2S_MCLK
			32	19					7		I2S_WS				HDMI
									8		I2S_SCK
			31	20 Sound AMP											SCL/SDA
									9		I2S_SDO
			33		NTP7514				38
	LPF
			30		IC30010						Audio_SDA
			21						11		Audio_SCL
	LPF
			18

P301

Module

IR Board

P600/601

P450

LVDS

IR KEY1 KEY2

LedPWR

3.3V_ST

Output

XXX

117 111 110

108

IR/KEY

MST6841XP

IC500

XXX	22,20,24,33,34		26,33,34	27,35,36
	Y,Pb,Pr In	Comp. R/L In	AV1 In	AV2 In

JK203

98

USB_DN

USB_DP

99

44

43

USB_5V

JK204

		39			IF P	IF N
			24Mhz
		40			6	7
		45	3		IF_AGC
L-Out	R-Out	53	5	Tuner SDA
		52	4	Tuner SCL
Audio	Audio		TUNER
37	38
					B+ 5
						7
OP-AMP Panel_Vcc
IC301
x4 Gain			Audio
			Out		TU_3.3V

JK101 3.3V_M

DIAGRAM BLOCK

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

400

800

540

LV1

200

900

901

120

121	701
	700

500	A10	Set + Stand
	A2

Copyright ©	LG Electronics. Inc. All rights reserved.	- 15 -	LGE Internal Use Only
Only for training and service purposes

EAX66783401

LB56H/LT56H

COMPONENT / AV IN / AV AUDIO OUT

JK101

PPJ239-26

6H

[RD4]E-LUG

5H

[RD4]O-SPRING

R115

AV2RIN

AV2_RIN

VA109

R108

10K

R119

C107

20V

220K

12K

[RD4]CONTACT

470pF

4H

50V

5G

[WH3]OAV2LIN-SPRING

R114

AV2_LIN

VA108

R107

10K

R118

C106

20V

220K

12K

[YL]CONTACT

470pF

4F

50V

5F

[YL]O-SPRING

AV2_VIN

AV2_VIN

COMP_AV2_Zener_KEC

ZD107

5.6V

VA107

R113

[YL]E-LUG-S

ZD107-*1

7F

READY

3216

COMP_AV2_Zener_ROHMSD05

75

ZD106

1/4W

ZD106-*1

COMP_AV2_Zener_ROHM

1%

Size

check!!

5.6V

5E

[RD3]O-SPRING

COMP_AV2_Zener_KEC

R105

C105

MNTROUT

MNT_ROUT

C101

1K

Q103

10uF

VA100

5600pF

C B

C B

16V

MUTE_AOUT

[RD3]E-LUG-S

50V

MMBT3904(NXP)

7E

20V

E

E

POP NOISE

READY

Q101

MMBT3904(NXP)

5D

[WH2]O-SPRING

R112

C104

MNTLOUT

MNT_LOUT

C100

1K

10uF

VA101

5600pF

C

Q102

16V

[WH2]E-LUG

50V

C B

B

MUTE_AOUT

6D

20V

MMBT3904(NXP)

E

E

READY

POP

NOISE

Q100

MMBT3904(NXP)

6N

[RD2]E-LUG

5N

[RD2]OCOMMONRIN-SPRING

R111

COMMON_RIN

VA106

R104

10K

R117

C103

20V

220K

12K

470pF

4N

[RD2]CONTACT

50V

COMMONLIN5M

[WH1]O-SPRING

R110

COMMON_LIN

VA105

R103

10K

R116

C102

20V

220K

12K

[RD1]O-SPRING

470pF

5L

50V

COMP_PR

COMP_AV2_Zener_KEC

COMP_PR

[RD1]E-LUG-S

5.6V

7L

ZD105-*1

ZD105

VA104

R102

COMP_AV2_Zener_ROHM

SD05

75

ZD104-*1

ZD104

READY

[BL]O-SPRING

5.6V

COMP_AV2_Zener_ROHM

5K

COMP_AV2_Zener_KEC

COMP_PB

7K

[BL]E-LUG-S

COMP_PB

COMP_AV2_Zener_KEC

5.6V

ZD103

ZD103-*1

R101

COMP_AV2_Zener_ROHMVA103

[YL/GN]CONTACT

SD05

75

4J

ZD102-*1

ZD102

READY

COMP_AV2_Zener_ROHM

5.6V

COMP_AV2_Zener_KEC

5J

[YL/GN]O-SPRING

COMMON_VIN

COMMON_VIN

COMP_AV2_Zener_KEC

5.6V

ZD101

R109

[YL/GN]E-LUG

ZD101-*1

COMP_AV2_Zener_ROHM

75

6J

VA102

ZD100

SD05

3216

ZD100-*1

COMP_AV2_Zener_ROHM

1/4W

Size check!!

V-OUT

Buffer(DEBUG)

1%

5.6V

COMP_AV2_Zener_KEC

+12V

OPT

MMBT3904(NXP)

C

Q104

R123

B

MNT_VOUT

AV2_VIN

JP110

E

33

OPT

OPT

OPT

R120

R121

0

75

OPT

R122

220

THE

SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

L15.5_ECI_M8RR

2015/03/03

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE

CRITICAL COMPONENTS IN THE

SYMBOL MARK OF THE SCHEMETIC.

COMP/AV

1

8

INPUT1

Copyright © 2015 LG Electronics. Inc. All rights reserved.	LGE Internal Use Only
Only for training and service purposes

EAX66783401

LB56H/LT56H

			HDMI(REAR)			R208			ESD_HDMI_IP4294 ESD_HDMI_IP4294
										IP4294CZ10-TBR		IP4294CZ10-TBR
										D204-*1		D205-*1
						1K			1	10		1	10
				R206		C			2	9		2	9
												3	8
			HDMI1_HPD	10K	B	Q201			3	8
						MMBT3904(NXP)			4	7		4	7
						E			5	6		5	6
I2C Control
										+5V_USB
			SHIELD			READY
						VA202
			20						VA203
									READY
				HPD
JK201			19
PEJ034-01			18	+5V_POWER						R215	R216
3	E_SPRING		17	DDC/CEC_GND						4.7K	4.7K
						R219
													HDMI1_SDA
			16	SDA		100
			15	SCL				D205					HDMI1_SCL
				NC		R220	IP4283CZ10-TBA			VA206		VA207
			14			100	ESD_HDMI2_IP4283			READY		READY
4	R_SPRING		13	CEC	AR204	TMDS_CH1-	1	10	NC_4
	T_SPRING			CLK-	5.1								HDMI1_CK-
5			12		1/16W	TMDS_CH1+	2	9	NC_3
7B	B_TERMINAL2		11	CLK_SHIELD
				CLK+		GND_1	3	8	GND_2				HDMI1_CK+
			10
6B	T_TERMINAL2		9	DATA0-		TMDS_CH2-	4	7	NC_2				HDMI1_D0-
			8	DATA0_SHIELD		TMDS_CH2+			NC_1
							5	6
	AR201			DATA0+									HDMI1_D0+
	100		7
	1/16W		6	DATA1-			IP4283CZ10-TBA						HDMI1_D1-
								D204
			5	DATA1_SHIELD
					AR203		ESD_HDMI2_IP4283
				DATA1+									HDMI1_D1+
			4		5.1	TMDS_CH1-			NC_4
				DATA2-	1/16W		1	10
		P201	3			TMDS_CH1+			NC_3				HDMI1_D2-
	+3.3V_ST			DATA2_SHIELD			2	9
		12507WS-04L	2
			1	DATA2+		GND_1	3	8	GND_2				HDMI1_D2+
	R862	1
	33					TMDS_CH2-	4	7	NC_2
		1
		2	JK203			TMDS_CH2+	5	6	NC_1
	DSUB_SCL	2

	3		This	GND	Pattern	should	be very narrow
		3	HDMI	Jack	burnt	problem	improvement

	4
DSUB_SDA	4

5

5

USB(REAR)				+5V_USB
		Close to SIDE_USB		L200
JK204		OPT	C201	120OHM
		C200
US-04A-VSD		10uF	22uF
		10V	10V
1
2		USB_DN
3		USB_DP
	READY	READY
	D200	D201
4	30V	30V

5

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

INPUT2

L155_ECI_M8RR	2015/03/03
INPUT	2 8

Copyright © 2015 LG Electronics. Inc. All rights reserved.	LGE Internal Use Only
Only for training and service purposes