LG 43LF5100, 43LF510Y Schematic
Internal Use Only
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
LED TV
SERVICE MANUAL
CHASSIS : LB55A / LB55B
MODEL : 43/49LF5100/510T/510Y
43/49LF5100/510T/510Y-TA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL68625535 (1504-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 9
DISASSEMBLY ...................................................................................... 14
BLOCK DIAGRAM ................................................................................. 15
EXPLODED VIEW .................................................................................. 16
SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX
TROUBLE SHOOTING GUIDE ................................................ APPENDIX
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LED TV used LB55A/B
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
No. Item Specication Remarks
1 Market
2 Broadcasting system
3 Channel Storage
4 Receiving system
5 Video(Composite) Input PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60
6 Component Input Y/Cb/Cr, Y/Pb/Pr
7 HDMI Input HDMI1-DTV/PC Support HDCP 1.4(can’t support MHL)
8 USB Input For My Media(Movie/Photo/Music List) and SVC
9 Headphone
Asia, Oceania, Africa, Middle East
(PAL/DVB Market)
1) PAL B/G/D/K/I, SECAM B/G/D/K
2) NTSC-M
3) DVB-T
4) DVB-T//T2
5) DVB-T/T2/S2
1) DVB-T & Analog TV : 1500EA
2) DVB-T/T2 & Analog TV : 1500EA
3) DVB-T/T2/S2 & Analog TV : 6000EA
Analog : VHF,UHF,CATV
Digital : DVB
1) Support all model
2) Support all model
3) depend on model
4) depend on model
5) depend on model
Satellite Digital TV : VHF, UHF, C-Band, Ku-Band
Digital TV : VHF, UHF
Analogue TV : VHF, UHF, CATV
► DVB-T
- Guard Interval (Bitrate_Mbit/s) :1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2
- Guard Interval (Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-S
- symbol rate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s
- viterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
Only for training and service purposes
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Component Video Input (Y, Cb/Pb, Cr/Pr)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark
1 720*576 15.625 50.00 13.5 SDTV ,DVD 576I
2 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I
3 720*480 15.73 59.94 13.50 SDTV ,DVD 480I
4 720*576 31.25 50.00 27.00 SDTV 576P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*480 31.47 59.94 27.00 SDTV 480P
7 1280*720 37.50 50.00 74.25 HDTV 720P
8 1280*720 45.00 60.00 74.25 HDTV 720P
9 1280*720 44.96 59.94 74.176 HDTV 720P
10 1920*1080 28.125 50.00 74.25 HDTV 1080I
11 1920*1080 33.75 60.00 74.25 HDTV 1080I
12 1920*1080 33.72 59.94 74.176 HDTV 1080I
13 1920*1080 56.25 50.00 148.50 HDTV 1080P
14 1920*1080 67.50 60.00 148.50 HDTV 1080P
15 1920*1080 67.432 59.94 148.352 HDTV 1080P
16 1920*1080 27.00 24.00 74.25 HDTV 1080P
17 1920*1080 26.97 23.94 74.176 HDTV 1080P
18 1920*1080 33.75 30.00 74.25 HDTV 1080P
19 1920*1080 33.71 29.97 74.176 HDTV 1080P
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
6. HDMI Input(PC/DTV)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark
PC(DVI) DDC
1 640*350 31.46 70.09 25.17 EGA X
2 720*400 31.46 70.08 28.32 DOS O
3 640*480 31.46 59.94 25.17 VESA(VGA) O
4 800*600 37.87 60.31 40.00 VESA(SVGA) O
5 1024*768 48.36 60.00 65.00 VESA(XGA) O
6 1152*864 54.34 60.05 80.00 VESA O
7 1360*768 47.71 60.01 85.50 VESA (WXGA) O
8 1280*1024 63.98 60.02 108.0 VESA (SXGA) O Except HD Model
9 1920*1080 67.50 60.00 148.5 HDTV 1080P O Except HD Model
DTV
1 640*480 31.46 59.94 25.125
2 640*480 31.50 60.00 25.125
3 720*480 15.73 59.94 13.500
4 720*480 15.75 60.00 13.514
5 720*576 15.62 50.00 13.500
6 720*480 31.47 59.94 27.00
7 720*480 31.50 60.00 27.027
8 720*576 31.25 50.00 27.00
9 1280*720 37.50 50.00 74.25
10 1280*720 45.00 60.00 74.25
11 1280*720 44.96 59.94 74.176
12 1920*1080 28.12 50.00 74.25
13 1920*1080 33.75 60.00 74.25
14 1920*1080 33.72 59.94 74.176
15 1920*1080 56.25 50.00 148.50
16 1920*1080 67.50 60.00 148.50
17 1920*1080 67.43 59.94 148.35
18 1920*1080 27.00 24.00 74.25
19 1920*1080 26.97 23.97 74.175
20 1920*1080 33.75 30.00 74.25
21 1920*1080 33.71 29.97 74.175
Don’t insert in
manual spec. out
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with
LB55A/B chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 100-220 V~, 50/60 Hz
(6) Adjustment equipments
: Color Analyzer(CA-210 or CA-110), Service remote control.
(7) Push the “IN STOP" key - For memory initialization.
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at rst.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
(4) Click "Connect" tab. If "Can't" is displayed, check connection
between computer, jig and set.
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
(4)
filexxx.bin
(5)
(7)...........OK
(6)
3. Main PCB check process
▪ APC - After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
(2) Set as below, and then click "Auto Detect" and check "OK"
message.
If "Error" is displayed, check connection between computer,
jig, and set.
(3) Click "Read" tab, and then load download file(XXXX.bin)
by clicking "Read"
(1)
filexxx.bin
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If version of update file in USB Stick is older, it will not
work. But version of update file is newer, USB data will be
detected automatically.
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
(3) Show the message "Copying files from memory".
(4) Updating is starting.
(5) Updating Completed, the TV will restart automatically.
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If updated version is newer than what TV has, the TV can
lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a
DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
(4) Completed selecting Tool option.
*
RS-232C Connection Method.
Connection : PCBA (USB Port) → USB to Serial Adapter
(UC-232A) → RS-232C cable → PC(RS-232C port)
● Product name of USB to Serial Adapter is UC-232A.
4. Total Assembly line process
4.1. Adjustment Preparation
▪ W/B Equipment condition
CA210: CH14, Test signal: Inner pattern(80IRE)-LED Module
▪ Above 5 minutes H/run in the inner pattern. ("power on" key
of Adjustment remote control)
* The spec of color temperature and coordinate.
Mode Color Temp. Color coordinate Remark
Cool
(C50)
Medium
(0)
Warm
(W50)
13,000 K
9,300 K
6,500 K
X = 0.271 (± 0.002)
Y = 0.270 (± 0.002)
X = 0.286 (± 0.002)
Y = 0.289 (± 0.002)
X = 0.313 (± 0.002)
Y = 0.329 (± 0.002)
* W/B Table in process of aging time
- LGD Module
(normal line) March ~ December
Aging time(Min) Cool Medium Warm
color coordinate x y x y x y
Target 271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
(normal line) January ~ Feburary
Aging time Cool Medium Warm
color coordinate x y x y x y
Target 271 270 286 289 313 329
1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346
4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
* Test Signal
- Inner pattern for W/B
adjust
- External white pattern
(80IRE, 204gray)
* W/B luminance Spec
Min. 60
Only for training and service purposes
- 10 -
- AUO/INX/COST/SHARP/BOE Module which cool spec is
13000 K
Cool Medium Warm
x y x y x y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* Connecting picture of the measuring instrument
(On Automatic control)
Inside Pattern is used when W/B is controlled. Connect to
auto controller or push Adjustment Remote control POWER
ON → Enter the mode of White-Balance, the pattern will
come out.
Full White Pattern
RS-232C Communication
CA-210
COLOR
ANALYZER
TYPE : CA-210
* Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10 lux).
(2) Adhere closely the Color analyzer(CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color analyzer's prove vertically.(80° ~ 100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
▪ Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
MIN
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
<Caution>
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.(When R/G/B Gain are all
C0, it is the FULL Dynamic Range of Module)
CENTER
(DEFAULT)
MAX
* Manual W/B process using adjust Remote control.
■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000.
■ Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■ Enter White Balance by pushing “►” key at “9. White
Balance”.
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option6
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance ►
10. 10 Point WB
11. Test Pattern
12 EDID D/L
13. Sub B/C
14. Ext. Input Adjust
15. SPK Lipsync Adjust
16. SPDIF Lipsync Adjust
■ For manual adjustment, it is also possible by the following
sequence.
(1) Set TV in Adj. mode using “P-ONLY” key on remote
controller and then operate heat run longer than 15
minutes.(If not executed this step, the condition for W/B
may be different.)
(2) Push “Exit” key.
(3) Enter White Balance mode by pushing the ADJ key and
select “9. White Balance”. When KEY (►) is pressed,
206 Gray internal pattern will be displayed.
(4) Zero Calibrate the probe of Color Analyzer, then place it
on the center of LCD module within 10 cm of the surface
(5) Select each items (Red/Green/Blue Gain) using ▲/▼
(CH +/-) key on Remote control.
(6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.
(7) Adjust three modes all (Cool / Medium / Warm)
- For All model w/o LS345
Fix the one of R/G/B gain and change the others
- For G-FIX model
Cool Mode
1) Fix the one of R/G/B gain to 192 (default data) and
decrease the others. (If G gain is adjusted over 172
and R and B gain less than 192 , Adjust is O.K.)
2) If G gain is less than 172, Increase G gain by up to
172, and then increase R gain and G gain same
amount of increasing G gain.
3) If R gain or B gain is over 255, readjust G gain less
than 172, Conform to R gain is 255 or B gain is 255
Medium / Warm Mode - Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
(8) When adjustment is completed, exit adjustment mode
using EXIT key on Remote control.
Whit Balance
Color Temp. ◄ ►
R-Gain
G-Gain
B-Gain
R-Cut
G-Cut
B-Cut
Test-Pattern
Backlight
Reset To Set
Cool
172
192
192
64
64
64
ON
100
Only for training and service purposes
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* CASE Cool
First adjust the coordinate far away from the target
value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target, y < target
i) First decrease B, so make y a little more than the
target.
ii) Adjust x value by decreasing the R.
4) x < target, y > target
i) First decrease B, so make x a little more than the
target.
ii) Adjust x value by decreasing the G.
* After You finish all adjustments, Press “In-start” button
and compare Tool option and Area option value with its
BOM, if it is correctly same then unplug the AC cable.
If it is not same, then correct it same with BOM and
unplug AC cable.
For correct it to the model’s module from factory JIG
model.
* Push the “IN STOP" key after completing the function
inspection.
4.2. DDC EDID Write (HDMI 256Byte)
■ Connect HDMI Signal Cable to HDMI Jack.
■ Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
■ Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded.
4.3. EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***: Year : Controlled
****: Check sum
- Auto Download
■ After enter Service Mode by pushing “ADJ” key,
■ Enter EDID D/L mode.
■ Enter “START” by pushing “OK” key.
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option6
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L ►
13. Sub B/C
14. Ext. Input Adjust
15. SPK Lipsync Adjust
16. SPDIF Lipsync Adjust
EDID D/L
HDMI1 NG
HDMI2 NG
Reset
Start
EDID D/L
HDMI1 OK
HDMI2 OK
Reset
Start
[Caution]
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
* Edid data and Model option download (RS232)
NO Item CMD 1 CMD 2 Data 0
Enter download
Mode
EDID data and
Model option
download
(1) FHD 8BIT 2D HDMI EDID DATA
0 00 FF FF FF FF FF FF 00 1E 6D A B
10 C 01 03 80 A0 5a 78 0A EE 91 A3 54 4C 99 26
20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80
30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 A0 5A 00 00 00 1E 66 21 50 B0 51 00 1B 30
50 40 70 36 00 A0 5A 00 00 00 1E 00 00 00 FD 00 3A
60 3E 1E 53 10 00 0A 20 20 20 20 20 20 D
70 D 01 E
80 02 03 22 F1 4E 10 9F 04 13 05 14 03 02 12 20 21
90 22 15 01 26 15 07 50 09 57 07 f
A0 f 01 1d 80 18 71 1c 16 20 58 2c 25 00 20 C2
B0 31 00 00 9e 01 1d 00 72 51 d0 1e 20 6e 28 55 00
C0 20 C2 31 00 00 1e 02 3a 80 18 71 38 2d 40 58 2c
D0 45 00 A0 5a 00 00 00 1e 01 1d 00 Bc 52 d0 1e 20
E0 B8 28 55 40 C4 8e 21 00 00 1e 00 00 00 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 E
(2) Detail EDID Options are below
Model Name HEX EDID Table DDC Function
HD/FHD Model 0001 01 00 Analog/Digital
MODEL NAME MODEL NAME(HEX)
LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)
Download
‘Mode In’
Download A E 00 10
A A 0 0
When transfer the ‘Mode In’,
Carry the command.
Automatically adjustment
(The use of a internal pattern)
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
0 1 2 3 4 5 6 7 8 9 A B C D E F
a. Product ID
b. Serial No: Controlled on production line.
c. Month, Year: Controlled on production line:
ex) Week : '01' -> '01'
Year : '2014' -> '18' fix
d. Model Name(Hex): Refer to the ASCII Code Table.
Cf) model name in EDID data is below.
e. Checksum: Changeable by total EDID data.
EDID C/S data
Check Sum
(Hex)
Block 0 40
Block 1 25 (HDMI1)
2D FHD 8BIT
HDMI
f. Vendor Specic
INPUT MODEL NAME(HEX)
HDMI1 67 03 0C 00 10 00 80 1E
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.4. Function Check
- Check display and sound
(1) TV
(2) AV (CVBS)
(3) COMPONENT (480i)
(4) HDMI
* Display and Sound check is executed by Remote controller.
► Caution : Not to push the INSTOP KEY after completion if
the function inspection.
4.5. Outgoing condition Configuration
■ When pressing IN-STOP key by Service remote control,
Red LED are blinked alternatively. And then automatically
turn off. (Must not AC power OFF during blinking)
4.6. GND and HI-POT Test
4.6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition.
(2) You can’t use Tuner Ground & Tuner signal line at all
models. (applied Isolator inner tuner)
4.6.2. GND & HI-POT auto-check
(1) Pallet moves in the station.(POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process(Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
4.6.3. Checkpoint
(1) Test voltage
1) 3 Poles
- GND: 1.5 KV/min at 100 mA
- SIGNAL: 3 KV/min at 100 mA
2) 2 Poles
- SIGNAL: 3 KV/min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT
1) 3 Poles
- GND Test = POWER CORD GND and SIGNAL
CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE &
NEUTRAL.
2) 2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
1. Disassembly of Back cover
DISASSEMBLY
(1) Unscrew bolts in the set.
(2) Check both right and left hole.
(4) Put ‘long nose’ into the hole.
(5) Open B/C with push/pulling long
nose to upper and lower sides.
(3) Attach tape to ‘Long nose pliers’.
* Scratch can be caused without tape.
Only for training and service purposes
- 14 -
(6) Disassemble Back cover.
* Disassemble it from left to right for top
side hook on Back cover
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
BLOCK DIAGRAM
Serial Flash
SPI_SCK/SDI/SDO/CS
(8Mbit)
System EEPROM
I2C_SCL/SDA
(256Kbit)
SPK_L
SPK_R
30P HD LVDS wafer
51P FHD LVDS wafer
Connector
AUD_SCK
AUD_LRCH,
AUD_LRCK,
NTP7515
AMP_SCL/SDA
KEY1/2, LED_R, IR
RXA0+/-~RXA4+/-,
RXACK+/-
RXBCK+/-
RXB0+/- ~RXB4+/-,
24M
X-tal
AUD_MASTER_CLK,
(IC101)
Main SOC
M1A -256MB (Built-in)
PCM_A[0:7]
IC102 (1Gbit)
NAND FLASH
H27U1G8F2CTR -BC
FE_TS_DATA[0:7]
IF_N/P
IF_AGC
TU_SCL / SDA
DEMOD_SCL/SDA
F/NIM
Growth market
AV2_CVBS_IN
SIDE_USB_DM/DP
DDC_SCL/SDA_2, HDMI_CEC
CK+/ -, D0+/-, D1+/-, D2+/-_HDMI2
USB
HDMI1
REAR
AV2_L/R_IN
COMP2_L/R_IN
HP_L/ROUT, SIDE_HP_MUTE
COMP2_Y+/AV_CVBS_IN, COMP2_Pb+/Pr+
Headphone
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
400
900
LV1
200
540
800
500
120
701
700
A10
A2
901
Set + Stand
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
POWER
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
FROM ADAPTOR 19V
JK400
KJA-DC-1-0032
L472
CIS21J121
4
4
2
Surge Protection
2
1
1
D471
20V
R493
R492
C492
33K
51K
2.2uF
25V
19V TO PANEL VCC(12V) DCDC CONVERTER
+19V
C472
C470
10uF
0.1uF
25V
25V
3.5V_ST POWER_DET
PANEL_CTL
OPT
R473
30K
+3.5V_ST
R410
10K
C400
0.1uF
16V
L408
UBW2012-121F
120OHM
OPT
C425
0.1uF
25V
R441
R472
3.3K
+12V
10K
OPT
C490
1uF
10V
R442
10K
CB2012PK501T
+5V_Normal
R408
100K
R445
B
L404
OPT
ZD408
5V
33K
R446
120K
+12V
POWER_DET
C
TR_NXP
Q403
MMBT3904(NXP)
E
C405
10uF
25V
OPT
OPT
C427
0.22uF
25V
C406
10uF
25V
C408
2200pF
50V
C409
2200pF
50V
R409
91K
Q405
SSM3J332R
S
B
ROSC/SYNC
+5V_USB
G
SW_EN
NFAULT
D
C
E
C407
1uF
10V
R451
5.6K
SS2
EN1
EN2
PANEL_VCC
R452
5.6K
TR_KEC
Q403-*1
2N3904S
[EP]
1
THERMAL
2
3
SN1406035RGER
4
5
6
7
SW_OUT
25
SW_IN
VIN123V7V24SS1
IC400
8
VIN2
22
9
10
PGND2
LX2
BST120LX121PGND1
11
BST2
+5V_Normal
+19V to +3.5V_STANDBY
+19V
R48 6
R48 7
1.2 K
R48 8
+3.5V_ST
2K
1%
1%
1K
1%
5V
5.6B->5V
READY->APPLY
2013.08.07
D470
+12V to PANEL_VCC
+5V_Normal & +1.10V_VDDC
+3.3V_Normal
R403
10K
OPT
C403
4700pF
50V
USB1_CTL
Check the pull down
when AC Power On with HDD
USB1_CTL_Pull_Down
USB1_OCD
OPT
R471
C473
10uF
25V
47K
C474
0.1uF
25V
Q407
SSM3J332R
S
G
D
OPT
C488
C471
68uF
68uF
35V
35V
AAM
GND
IN
SW
IC402
MP2315GJ
1
2
NEW
3
3A
4
8
7
6
5
FB
VCC
EN/SYNC
BST
20130528 cJ.LIM
R477
68
C476
0.1uF
50V
R478
100K
R479
20K
C479
0.1uF
25V
L471
4.7uH
C482
C484
10uF
10uF
10V
10V
X5R => X7R
To improve CST Issue
2013.12.21 by GH.Song
C487
22uF
10V
R485
56K
C489
22uF
10V
C485
0.1uF
25V
+3.5V_ST
OPT
R490
10K
OPT
R489
R470
100K
AAM
GND
IN
SW
IC403
MP2315GJ
1
2
NEW
3
3A
4
8
7
6
5
FB
VCC
EN/SYNC
BST
20130528 cJ.LIM
R475
68
C475
0.1uF
50V
OPT
C477
0.47uF
16V
OPT
R476
47K
10K
R480
10K
C478
0.1uF
25V
L470
10uH
C480
10uF
16V
RL_ON
POWER_ON/OFF_1
C481
C486
10uF
10uF
16V
16V
C483
0.1uF
25V
R481
56K
R48 2
R48 3
3.3 K
R48 4
+12V
OPT
ZD405
11K
1%
1%
1K
1%
15V
+3.5V_ST to +3.3V_Normal
+3.5V_ST
R443
4.7K
POWER_ON/OFF_1
+3.5V_Normal to +1.5V_DDR
+3.3V_Normal
L409
BLM18PG121SN1D
C426
10uF
AZ1117EH-ADJTRG1
10V
Vout=1.25*(1+R2/R1)+Iadj*R2
Vout=0.6(R1/R2)+0.6
L405
4.7uH
C410
0.047uF
25V
19
18
17
16
15
14
13
12
C432
1uF
16V
COMP1
FB1
AGND
RSET
FB2
COMP2
C421
0.047uF
25V
R422
15K
R1
R411
4.7K
1%
R2
R413
5.1K
1%
R41 4
10K
C419 22pF
50V
C420
3300pF
R41 8
50V
20K
L406
4.7uH
C491
470pF
50V
R491
5.1
Vout=0.6(R1/R2)+0.6
1.3A
ADJ/GND
OPT
C411
82pF
50V
C416
22pF
50V
C417
3300pF
50V
R444
10K
IC404
OUTIN
OPT
ZD407
5.1v
B
R415
R416
5.1K
R417
R447
22K
R448
2.2K
100
1%
1%
39K
1%
C428
2.2uF
10V
C
TR_NXP
Q404
MMBT3904(NXP)
E
R449
1K
1/16W
1%
R450
200
1/16W
1%
ZD401
2.5V
R2
R1
BOOST_EN
CB2012PK501T
R1
R2
C412
10uF
6.3V
C418
47pF
50V
+5V_Normal
C423
22uF
16V
FET_AOS
Q406-*1
AO3435
S
FET_TOSHIBA
Q406
SSM3J332R
S
B
R453
0
C431
10uF
10V
C413
22uF
10V
C424
22uF
16V
D
G
D
C429
G
0.1uF
16V
C
TR_KEC
Q404-*1
2N3904S
E
+1.5V_DDR
L411
+1.10V_VDDC
C414
22uF
10V
L410
BLM18PG121SN1D
C430
22uF
10V
BRAZIL_ESD
ZD403
2.5V
+3.3V_Normal
TVS_SEMTECH
ZD402
5V
TVS_KEC
ZD402-*1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5_ECI_M1A
POWER
150112
4
TOTAL LED DRIVER BLOCK
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
L505
CIS21J121
32_43inch
+19V
BOOST_EN
EU_BR
R553
0
R554
0
32_43inch_AJ_KR_CO
R555
0
OPT
C516
0.1uF
OPT
C517
0.1uF
OPT
L503
UBW2012-121F
OPT
L504
UBW2012-121F
C500
47uF
25V
49inch
R500
1K
C501
10uF
25V
C502
0.1uF
50V
OPT
49inch
C503
0.033uF
50V
49inch
R501
18K
1%
49inch
470pF
49inch
R502
1K
1%
49inch
C504
50V
R503
10K
1/16W
49inch
C505
100pF
50V
49inch
C506
0.22uF
REDUCE INDUCTOR TEMP ISSUE
49inch
MBRD10U100CT
L500
33uH
49inch
C531
100V
220pF
R511
47
R508
47
49inch
49inch
R509
49inch
3.3
49inch
R510
3.9K
1%
49inch
R507
3.9K
1%
121211
1K -> 3.9K
220p -> 330p
A1
A2
49inch
D503
R513
OPT
C532
100V
220pF
47
C
R558
49inch
49inch
49inch
C511
33uF
100V
47
R512
0.1
REDUCE RIPPLE CURRENT
49inch
49inch
49inch
C512
33uF
100V
D
49inch
Q500
G
AOD478
S
1W
49inch
R514
C513
33uF
100V
49inch
C514
R515
100K
1uF
1/8W
50V
49inch
49inch
C515
R516
1uF
100K
50V
1/8W
1W
0.1
VOUT#1=50.5V
32_43inch_AJ_KR_CO
C537
4.7uF
50V
32_43inch_AJ_KR_CO
C538
4.7uF
50V
INV_CTL
R518
47K
49inch
R581
1K
49inch
49inch
R517
680
1/8W
1%
OPT
R519
10K
PWM_DIM
R520
10K
B
49inch
R522-*1
32_43inch
150K
R522
120K
43inch
R529-*1
13K
1%
R521
100
BLU_CURRENT_CTL
+3.3V_Normal
R523
R528
3K
1K
C
1%
TR501
MMBT3904(NXP)
E
R525
270K
32inch
1/8W
R529
1%
30K
1%
49inch
R529-*2
8.2K
1%
R524
C518
100pF
100K
50V
R530
100K
43inch
49inch
R532-*1
R532-*2
12K
27K
1%
1%
43inch
49inch
R533-*1
R533-*2
10K
2.7K
1%
1%
R531
C522
100K
1000pF
1%
50V
C521
1000pF
50V
OPT
32inch
R532
15K
1%
32inch
R533
3.6K
1%
10K
R534
49inch
49inch
49inch
R504
R505
180K
180K
49inch
IC500
TPS40210DGQR
RC
1
SS
DIS/EN
COMP
2
3
4
FB
5
16V
11
THERMAL
[EP]
VDD
10
BP
9
GDRV
8
ISNS
7
GND
6
To Improve EMI Issue
49inch
C530
100V
220pF
49inch
49inch
C508
C507
0.1uF
1uF
25V
50V
R506
47
49inch
49inch
C509
330pF
50V
VOUT = VREF*(1+48.8K/680)
= 0.7 *(1+48.8K/680)
= 50.5V
L501
33uH
NC_1
PGND_1
PGND_2
PDIM
RISET
NC_2
EN
OVP
LS8
LS7
LS6
LS5
32inch
L506
CIS21J121
43_49inch
L502
33uH
R535
100
DT1641AS
1
2
3
4
5
6
7
8
9
10
11
12
R536
100
IC501
To Improve EMI Issue
C523
100V
220pF
C524
100V
220pF
R537
R538
R539
100
100
100
[EP]GND
VIN
24
C525 1uF
VREF
25
23
THERMAL
CS
22
NDRV
21
RSS
20
COMP
19
RT
18
LS1
17
LS2
16
LS3
15
LS4
14
LGND
13
R540
100
25V
220K
R545
R541
100
R542
39K
1%
R543
1.5K
+19V
R544
3.3
1/16W
1%
R546
1.5K 1%
1%
C526
100V
220pF
C527
100V
220pF
R547
100
C510
1uF
25V
R548
30K
C528
4700pF
50V
1%
C529
0.1uF
R549
100
25V
UF3D(SUZHOU GRANDE)
32_43inch
R550
100
D
49inch
Q502
SMK630D
G
S
D
G
S
R551
0.1
49inch
D502
D504
BR210
100V
32_43inch
Q502-*1
AOD478
P500
SMAW200-04
FIRST BOOST UP
1
2
3
VOUT#2
4
EXCEPT C500 C501
C533
33uF
49inch
R579
0
43_49inch
C534
33uF
43inch
R580
0
32_43inch
R578
0
49inch
C535
4.7uF
50V
49inch
C536
4.7uF
50V
49inch
C539
4.7uF
50V
33V
ZD500
43_49inch
C519
1uF
100V
49inch
C520
1uF
100V
32inch
C519-*1
4.7uF
50V
32_43inch
C520-*1
0
1/4W
5%
49inch
C540
1uF
100V
49inch
C541
1uF
100V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LED_DRIVER
150112L15.5_ECI_M1A
5
USB
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
JK700
US-04A-VSD
5
OPT
C704
22uF
10V
+5V_USB
SIDE_USB1_DM
SIDE_USB1_DP
USB_HDD_CAP1_10uF
C700-*1
USB_HDD_CAP1_22uF
OPT
ZD700
SD05
1
2
3
4
5V
OPT
C701
OPT
C702
5pF
5pF
50V
50V
10uF
10V
C700
22uF
10V
USB_HDD_CAP2_10uF
C703-*1
10uF
10V
USB_HDD_CAP2_22uF
C703
22uF
10V
R700
2.2
R701
2.2
OPT
D700
RCLAMP0502BA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5_ECI_M1A
USB_S1
150112
7
HDMI (REAR)
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
5V_HDMI_2
SHIELDGND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
ESD_HDMI1_VARISTOR
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG59023302
JK1000
This GND Pattern should be very narrow
HDMI jack burnt problem improvement
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R1001
R1000
1.8K
VA1000
1K
5V_DET_HDMI_2
R1002
3.3K
L1001
DLP11SA900HL2L
4 3
DLP11SA900HL2L
4 3
DLP11SA900HL2L
4 3
DLP11SA900HL2L
4 3
ESD_HDMI1_VARISTOR
VA1001
ESD_HDMI1_CAP
VA1000-*1
1uF
10V
ESD_HDMI1_CAP
VA1001-*1
1uF
10V
L1002
L1003
L1004
21
21
21
21
MMBT3904(NXP)
ESD_HDMI1
VA1002
TR_NXP
AR1003
5.1
AR1004
5.1
AR1005
5.1
AR1006
5.1
Q1000
C
E
TR_KEC
Q1000-*1
2N3904S
B
C
E
ESD_HDMI1
VA1003
CEC
HDMI_CEC
R1003
10K
B
R1004
10K
AR1002
100
1/16W
ESD_HDMI1
VA1004
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
HDMI_DIODE_SUZHOU
D1002-*1
MMBD6100
A1
C
5V_HDMI_2
R1007
2.7K
+5V_Normal
R1008
2.7K
R1009
100
A2
HDMI_DIODE_KEC
A2CA1
KDS184
D1002
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE_S7
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5
2015/01/21
HDMI_R1S1 8
A-MA0
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
A-MA1
A-MA2
A-MA3
A-MA4
A-MA5
A-MA6
A-MA7
A-MA8
A-MA9
A-MA10
A-MA11
A-MA12
A-MA13
A-MA14
A-MBA0
A-MBA1
A-MBA2
A-MCK
A-MCKB
A-MCKE
A-MODT
A-MRASB
A-MCASB
A-MWEB
A-MRESETB
A/B_DDR3_CS
A-MDQSL
A-MDQSU
A-MDML
A-MDMU
A-MDQSLB
A-MDQSUB
A-MDQL0
A-MDQL1
A-MDQL2
A-MDQL3
A-MDQL4
A-MDQL5
A-MDQL6
A-MDQL7
A-MDQU0
A-MDQU1
A-MDQU2
A-MDQU3
A-MDQU4
A-MDQU5
A-MDQU6
A-MDQU7
A-MA0
A-MA1
A-MA2
A-MA3
A-MA4
A-MA5
A-MA6
A-MA7
A-MA8
A-MA9
A-MA10
A-MA11
A-MA12
A-MA13
A-MA14
A-MBA0
A-MBA1
A-MBA2
A-MCK
A-MCKB
A-MCKE
A-MODT
A-MRASB
A-MCASB
A-MWEB
A-MRESETB
A/B_DDR3_CS
A-MDQSL
A-MDQSU
A-MDML
A-MDMU
A-MDQSLB
A-MDQSUB
A-MDQL0
A-MDQL1
A-MDQL2
A-MDQL3
A-MDQL4
A-MDQL5
A-MDQL6
A-MDQL7
A-MDQU0
A-MDQU1
A-MDQU2
A-MDQU3
A-MDQU4
A-MDQU5
A-MDQU6
A-MDQU7
R1109
M1A_256M_UO4
IC101
LGE2134(256M)
E11
B_DDR3_A[0]
F12
B_DDR3_A[1]
D10
B_DDR3_A[2]
B10
B_DDR3_A[3]
E15
B_DDR3_A[4]
B11
B_DDR3_A[5]
F14
B_DDR3_A[6]
C11
B_DDR3_A[7]
D14
B_DDR3_A[8]
A12
B_DDR3_A[9]
F16
B_DDR3_A[10]
D13
B_DDR3_A[11]
D15
B_DDR3_A[12]
C12
B_DDR3_A[13]
E13
B_DDR3_A[14]
A9
B_DDR3_BA[0]
D16
B_DDR3_BA[1]
A10
B_DDR3_BA[2]
C13
B_DDR3_MCLK
B13
B_DDR3_MCLKZ
E17
B_DDR3_MCLKE
B8
B_DDR3_ODT
C8
B_DDR3_RASZ
B9
B_DDR3_CASZ
D11
B_DDR3_WEZ
F10
B_RESET
D12
B_DDR3_CS0
A19
B_DDR3_DQSL
B18
B_DDR3_DQSU
C16
B_DDR3_DQML
D21
B_DDR3_DQMU
C18
B_DDR3_DQSBL
C17
B_DDR3_DQSBU
A20
B_DDR3_DQL[0]
A16
B_DDR3_DQL[1]
C19
B_DDR3_DQL[2]
C15
B_DDR3_DQL[3]
C20
B_DDR3_DQL[4]
C14
B_DDR3_DQL[5]
B21
B_DDR3_DQL[6]
B15
B_DDR3_DQL[7]
F18
B_DDR3_DQU[0]
D19
B_DDR3_DQU[1]
D17
B_DDR3_DQU[2]
E21
B_DDR3_DQU[3]
E19
B_DDR3_DQU[4]
D20
B_DDR3_DQU[5]
D18
B_DDR3_DQU[6]
F20
B_DDR3_DQU[7]
E9
240
1%
ZQ
LGE2133(128M)
E11
B_DDR3_A[0]
F12
B_DDR3_A[1]
D10
B_DDR3_A[2]
B10
B_DDR3_A[3]
E15
B_DDR3_A[4]
B11
B_DDR3_A[5]
F14
B_DDR3_A[6]
C11
B_DDR3_A[7]
D14
B_DDR3_A[8]
A12
B_DDR3_A[9]
F16
B_DDR3_A[10]
D13
B_DDR3_A[11]
D15
B_DDR3_A[12]
C12
B_DDR3_A[13]
E13
B_DDR3_A[14]
A9
B_DDR3_BA[0]
D16
B_DDR3_BA[1]
A10
B_DDR3_BA[2]
C13
B_DDR3_MCLK
B13
B_DDR3_MCLKZ
E17
B_DDR3_MCLKE
B8
B_DDR3_ODT
C8
B_DDR3_RASZ
B9
B_DDR3_CASZ
D11
B_DDR3_WEZ
F10
B_RESET
D12
B_DDR3_CS0
A19
B_DDR3_DQSL
B18
B_DDR3_DQSU
C16
B_DDR3_DQML
D21
B_DDR3_DQMU
C18
B_DDR3_DQSBL
C17
B_DDR3_DQSBU
A20
B_DDR3_DQL[0]
A16
B_DDR3_DQL[1]
C19
B_DDR3_DQL[2]
C15
B_DDR3_DQL[3]
C20
B_DDR3_DQL[4]
C14
B_DDR3_DQL[5]
B21
B_DDR3_DQL[6]
B15
B_DDR3_DQL[7]
F18
B_DDR3_DQU[0]
D19
B_DDR3_DQU[1]
D17
B_DDR3_DQU[2]
E21
B_DDR3_DQU[3]
E19
B_DDR3_DQU[4]
D20
B_DDR3_DQU[5]
D18
B_DDR3_DQU[6]
F20
B_DDR3_DQU[7]
E9
ZQ
M1A_128M_UO4
IC101-*1
M1A_256M_AVS+
LGE2136(256M)
E11
B_DDR3_A[0]
F12
B_DDR3_A[1]
D10
B_DDR3_A[2]
B10
B_DDR3_A[3]
E15
B_DDR3_A[4]
B11
B_DDR3_A[5]
F14
B_DDR3_A[6]
C11
B_DDR3_A[7]
D14
B_DDR3_A[8]
A12
B_DDR3_A[9]
F16
B_DDR3_A[10]
D13
B_DDR3_A[11]
D15
B_DDR3_A[12]
C12
B_DDR3_A[13]
E13
B_DDR3_A[14]
A9
B_DDR3_BA[0]
D16
B_DDR3_BA[1]
A10
B_DDR3_BA[2]
C13
B_DDR3_MCLK
B13
B_DDR3_MCLKZ
E17
B_DDR3_MCLKE
B8
B_DDR3_ODT
C8
B_DDR3_RASZ
B9
B_DDR3_CASZ
D11
B_DDR3_WEZ
F10
B_RESET
D12
B_DDR3_CS0
A19
B_DDR3_DQSL
B18
B_DDR3_DQSU
C16
B_DDR3_DQML
D21
B_DDR3_DQMU
C18
B_DDR3_DQSBL
C17
B_DDR3_DQSBU
A20
B_DDR3_DQL[0]
A16
B_DDR3_DQL[1]
C19
B_DDR3_DQL[2]
C15
B_DDR3_DQL[3]
C20
B_DDR3_DQL[4]
C14
B_DDR3_DQL[5]
B21
B_DDR3_DQL[6]
B15
B_DDR3_DQL[7]
F18
B_DDR3_DQU[0]
D19
B_DDR3_DQU[1]
D17
B_DDR3_DQU[2]
E21
B_DDR3_DQU[3]
E19
B_DDR3_DQU[4]
D20
B_DDR3_DQU[5]
D18
B_DDR3_DQU[6]
F20
B_DDR3_DQU[7]
E9
ZQ
IC101-*2
M1A_128M_AVS+
LGE2135(128M)
E11
B_DDR3_A[0]
F12
B_DDR3_A[1]
D10
B_DDR3_A[2]
B10
B_DDR3_A[3]
E15
B_DDR3_A[4]
B11
B_DDR3_A[5]
F14
B_DDR3_A[6]
C11
B_DDR3_A[7]
D14
B_DDR3_A[8]
A12
B_DDR3_A[9]
F16
B_DDR3_A[10]
D13
B_DDR3_A[11]
D15
B_DDR3_A[12]
C12
B_DDR3_A[13]
E13
B_DDR3_A[14]
A9
B_DDR3_BA[0]
D16
B_DDR3_BA[1]
A10
B_DDR3_BA[2]
C13
B_DDR3_MCLK
B13
B_DDR3_MCLKZ
E17
B_DDR3_MCLKE
B8
B_DDR3_ODT
C8
B_DDR3_RASZ
B9
B_DDR3_CASZ
D11
B_DDR3_WEZ
F10
B_RESET
D12
B_DDR3_CS0
A19
B_DDR3_DQSL
B18
B_DDR3_DQSU
C16
B_DDR3_DQML
D21
B_DDR3_DQMU
C18
B_DDR3_DQSBL
C17
B_DDR3_DQSBU
A20
B_DDR3_DQL[0]
A16
B_DDR3_DQL[1]
C19
B_DDR3_DQL[2]
C15
B_DDR3_DQL[3]
C20
B_DDR3_DQL[4]
C14
B_DDR3_DQL[5]
B21
B_DDR3_DQL[6]
B15
B_DDR3_DQL[7]
F18
B_DDR3_DQU[0]
D19
B_DDR3_DQU[1]
D17
B_DDR3_DQU[2]
E21
B_DDR3_DQU[3]
E19
B_DDR3_DQU[4]
D20
B_DDR3_DQU[5]
D18
B_DDR3_DQU[6]
F20
B_DDR3_DQU[7]
E9
ZQ
IC101-*3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
MAIN3_DDR
2014/06/13
12
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