LG 42LX530S-ZA Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LD5CS

MODEL : 42LX530S 42LX530S-ZA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL68883411 (1506-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 9

BLOCK DIAGRAM ................................................................................. 16

EXPLODED VIEW .................................................................................. 17

SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX

TROUBLE SHOOTING GUIDE ................................................. APPENDIX

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

Always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. Carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used LD5CS chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC specification

4. Model General Specification

No. Item Specication Remarks

1 Market EU/CIS

(PAL Market-37 Countries)

DTV & Analog (Total 37 countries) DTV (MPEG2/4, DVB-T) :37 countries

UK/Italy/Germany/France/Spain/Sweden/Finland/Netherlands/ Belgium/Luxemburg/ Greece/Denmark/Czech/Austria /Hungary/Swiss/Croatia/TurkeyNorway/Slovenia/Poland/Ukraine/ Portugal/Ireland/Morocco/Latvia/Estonia/Lithania/Rumania/ Bulgaria/Russia/SlovakiaBosnia/Serbia/Albania/Kazakhstan/ Belarus

DTV (MPEG2/4, DVB-T2): 8 countries

UK/Denmark/Sweden/Finland/Norway/Ireland/Ukraine/Kazakhstan

DTV (MPEG2/4, DVB-C): 37 countries

UK/Italy/Germany/France/Spain/Sweden/Finland/Netherlands/ Belgium/Luxemburg/ Greece/Denmark/Czech/Austria /Hungary/Swiss/Croatia/TurkeyNorway/Slovenia/Poland /Ukraine/ Portugal/Ireland/Morocco/Latvia/Estonia/Lithania/Rumania/ Bulgaria/Russia/SlovakiaBosnia/Serbia/Albania/Kazakhstan/ Belarus

DTV (MPEG2/4,DVB-S): 29 countries

Italy/Germany/France/Spain/Netherlands/ Belgium/Luxemburg/ Greece/Czech/Austria /Hungary/Swiss/Croatia/Turkey/Slovenia/Poland/Portugal/ Morocco/Latvia/Estonia/Lithania/Rumania/ Bulgaria/Russia/Slovakia/Bosnia/Serbia/Albania/Belarus

Supported satellite : 22 satellites

HISPASAT 1C/1D, ATLANTIC BIRD 2, NILESAT 101/102, ATLANTIC BIRD 3, AMOS 2/3, THOR 5/6, IRIUS 4, EUTELSAT-W3A, EUROBIRD 9A, EUTELSAT-W2A, HOTBIRD 6/8/9, EUTELSAT-SESAT, ASTRA 1L/H/M/KR, ASTRA 3A/3B, BADR 4/6, ASTRA 2D, EUROBIRD 3, EUTELSAT-W7, HELLASSAT 2, EXPRESS AM1, TURKSAT 2A/3A, INTERSAT10

Only for training and service purposes

- 6 -

No. Item Specication Remarks

Analogue TV

2 Broadcasting system

3 Receiving system

1) PAL-B/G/D/K/I

2) SECAM-B/G/D/K/I SECAM L/L’ Digital TV

1) DVB-T

2) DVB-C Satellite Digital TV

1) DVB-T/T2

2) DVB-C

3) DVB-S/S2

Analog : Upper Heterodyne Digital : COFDM, QAM

Analogue TV : (RF) VHF: E2 to E12, UHF : E21 to E69 (CATV) S1 to S20, HYPER: S21 to S47

Digital TV : VHF, UHF

Satellite TV : VHF, UHF, C-Band, Ku-Band

► DVB-T

- Guard Interval(Bitrate_Mbit/s) : 1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

► DVB-T2

- Guard Interval(Bitrate_Mbit/s) : 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256

- Modulation : Code Rate QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

► DVB-C

- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s

- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM

► DVB-S

- symbol rate DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s DVB-S (QPSK) : 2 ~ 45Msymbol/s

- viterbi DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8 DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10

4 Scart Jack (1EA) PAL, SECAM Scart 1 Jack is Full scart and support RF-OUT(analog).

Component & AV

5

Common port (1EA)

7 HDMI Input (2 EA) HDMI1/2-DTV Support HDCP

8 Audio Input (1EA) Component & AV Component & AV’s audio input is used by common port.

9 SDPIF out (1EA) SPDIF out

10 Earphone out (1EA)

11 USB (1EA) EMF, DivX HD, For SVC (download) JPEG, MP3, DivX HD

12 DVB

13 Ethernet (1EA) Wired, DMP only Only UK T2 Model (UF67/LF57/LF56/LF54) : for MHEG

Video Input RCA (PAL, SECAM, NTSC) 4 System : PAL, SECAM, NTSC, PAL60

Component Input(Y/Cb/Cr, Y/Pb/Pr)

Antenna, AV1, AV2, Component, HDMI1, HDMI2, USB

DVB-T

DVB-C

DVB-S CI + : Germany(Astra HD+)

CI : UK, Finland, Denmark, Norway, Sweden, Russia, Spain,

Ireland, Luxemburg, Belgium, Netherland

CI+ : France(Canal+), Italy(DGTVi)

CI : Switzerland, Austria, Slovenia, Hungary, Bulgaria CI+ : Switzerland(UPC,Cablecom), Netherland(Ziggo),

Germany(KDG,CWB), Finland(labwise)

Only for training and service purposes

- 7 -

5. Video resolutions (2D)

5.1. Component Input (Y, CB/PB, CR/PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

720*576 15.625 50.00 13.5 SDTV ,DVD 576I

1

720*480 15.73 60.00 13.5135 SDTV ,DVD 480I

2

3 720*480 15.73 59.94 13.50 SDTV ,DVD 480I

4 720*576 31.25 50.00 27.00 SDTV 576P

5 720*480 31.50 60.00 27.027 SDTV 480P

6 720*480 31.47 59.94 27.00 SDTV 480P

7 1280*720 37.50 50.00 74.25 HDTV 720P

8 1280*720 45.00 60.00 74.25 HDTV 720P

9 1280*720 44.96 59.94 74.176 HDTV 720P

10 1920*1080 28.125 50.00 74.25 HDTV 1080I

11 1920*1080 33.75 60.00 74.25 HDTV 1080I

12 1920*1080 33.72 59.94 74.176 HDTV 1080I

13 1920*1080 56.25 50.00 148.50 HDTV 1080P

14 1920*1080 67.50 60.00 148.50 HDTV 1080P

15 1920*1080 67.432 59.94 148.352 HDTV 1080P

16 1920*1080 27.00 24.00 74.25 HDTV 1080P

17 1920*1080 26.97 23.94 74.176 HDTV 1080P

18 1920*1080 33.75 30.00 74.25 HDTV 1080P

19 1920*1080 33.71 29.97 74.176 HDTV 1080P

5.2. HDMI Input(PC/DTV)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

PC(DVI) DDC

1 640*350 31.468 70.09 25.17 EGA X

2 720*400 31.469 70.08 28.32 DOS O

3 640*480 31.469 59.94 25.17 VESA(VGA) O

4 800*600 37.879 60.31 40.00 VESA(SVGA) O

5 1024*768 48.363 60.00 65.00 VESA(XGA) O

6 1152*864 54.348 60.053 80.00 VESA O

7 1360*768 47.712 60.015 85.50 VESA (WXGA) O

8 1280*1024 63.981 60.020 108.0 VESA (SXGA) O FHD only

9 1920*1080 67.50 60.00 148.5 HDTV 1080P O FHD only

DTV

1 720*480 31.469 59.94 27.00 SDTV 480P

2 720*480 31.50 60.00 27.027 SDTV 480P

3 720*576 31.250 50.00 27.00 SDTV 576P

4 1280*720 37.50 50.00 74.25 HDTV 720P

5 1280*720 45.00 60.00 74.25 HDTV 720P

6 1280*720 44.96 59.94 74.176 HDTV 720P

7 1920*1080 28.125 50.00 74.25 HDTV 1080I

8 1920*1080 33.75 60.00 74.25 HDTV 1080I

9 1920*1080 33.72 59.94 74.176 HDTV 1080I

10 1920*1080 56.250 50.00 148.50 HDTV 1080P

11 1920*1080 67.50 60.00 148.50 HDTV 1080P

12 1920*1080 67.432 59.94 148.35 HDTV 1080P

13 1920*1080 27.00 24.00 74.25 HDTV 1080P

14 1920*1080 26.973 23.976 74.175 HDTV 1080P

15 1920*1080 33.75 30.00 74.25 HDTV 1080P

16 1920*1080 33.716 29.976 74.175 HDTV 1080P

Only for training and service purposes

- 8 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with LD5CS chassis.

2. Designation

(1) The adjustment is according to the order which is designated

and which must be followed, according to the plan

can be changed only on agreeing. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation : Above 5 Minutes (Heat Run) Temperature : at 25 °C ± 5 °C Relative humidity : 65 ± 10 % Input voltage : 220 V, 60 Hz (6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),

DDC Adjustment Jig, Service remote control.

(7) Push the "IN STOP" key - For memory initialization.

Case1 : Software version up

1. After downloading S/W by USB , TV set will reboot automatically.

2. Push “In-stop” key.

3. Push “Power on” key.

4. Function inspection

5. After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push

“In-stop” key at rst.

2. Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

3. After function inspection, Push “In-stop” key.

which

3. Main PCB check process

▪ APC - After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program "Mstar ISP Utility" and then click

"Config" tab.

(2) Set as below, and then click "Auto Detect" and check "OK"

message. If "Error" is displayed, check connection between computer, jig, and set.

(3) Click "Read" tab, and then load download file(XXXX.bin)

by clicking "Read".

(4) Click "Connect" tab. If "Can't" is displayed, check connection

between computer, jig, and set.

(2)

(3)

Please Check the Speed : To use speed between from 200KHz to 400KHz

(5) Click "Auto" tab and set as below. (6) Click "Run". (7) After downloading, check "OK" message.

(4)

filexxx.bin

(5)

(7)...........OK

(6)

* USB DOWNLOAD

(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.

- If your downloaded program version in USB Stick is Low, it didn't work. But your downloaded version is High, USB data is automatically detecting.

(3) Show the message "Copying files from memory".

(4) Updating is starting.

(1)

filexxx.bin

Only for training and service purposes

(5) Updating Completed, The TV will restart automatically in 5

seconds.

(6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If downloading version is more high than your TV have, TV

can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ ATV test on production line.

- 9 -

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control. (2) Select "Adjust Check" and push "OK" key. (3) Punch in the number. (Each of model has their number) (4) Completed selecting Tool option.

3.1. ADC Process(Optional)

* If ADC processes as OTP, There is no need to proceed

internal ADC.

(1) Enter Service Mode by pushing "ADJ" key,

(2) Enter Internal ADC mode by pushing "►" key at "9. ADC

Calibration".

<Caution> Using "P-ONLY" key of the Adjustment remote

control, power on TV.

* ADC Calibration Protocol (RS232)

NO Item CMD 1 CMD 2 Data 0

Enter Adjust MODE

ADC adjust

Adjust ‘Mode In’

ADC Adjust

A A 0 0

A D 1 0

When transfer the ‘Mode In’, Carry the command.

Automatically adjustment (The use of a internal pattern)

Adjust Sequence

▪ aa 00 00 [Enter Adjust Mode] ▪ xb 00 40 [Component Input] ▪ ad 00 10 [Adjust 480i & 1080p Comp] ▪ aa 00 90 End Adjust mode

* Required equipment : Adjustment remote control.

3.2. EDID Download

▪ After enter Service Mode by pushing "ADJ" key. ▪ Enter EDID D/L menu. ▪ Enter "START" by pushing "OK" key.

<Caution> Never connect HDMI cable when EDID downloaded.

3.3. EDID data

(1) RGB

1) HD RGB EDID DATA

0 1 2 3 4 5 6 7 8 9 A B C D E F 00 00 ff ff ff ff ff ff 00 1e 6d a b 10 c 01 03 68 a0 5a 78 0a ee 91 a3 54 4c 99 26 20 0f 50 54 a1 08 00 71 40 61 40 45 40 31 40 01 01 30 01 01 01 01 01 01 1b 21 50 a0 51 00 1e 30 48 88 40 35 00 40 84 00 00 00 1c 01 1d 00 72 51 d0 1e 20 50 6e 28 55 00 a0 5a 00 00 00 1e 00 00 00 fd 00 3a 60 3e 1e 53 10 00 0a 20 20 20 20 20 20 d 70 d 00 e

2) FHD RGB EDID DATA

0 1 2 3 4 5 6 7 8 9 A B C D E F 00 00 ff ff ff ff ff ff 00 1e 6d a b 10 c 01 03 68 a0 5a 78 0a ee 91 a3 54 4c 99 26 20 0f 50 54 a1 08 00 31 40 45 40 61 40 71 40 81 80 30 01 01 01 01 01 01 02 3a 80 18 71 38 2d 40 58 2c 40 45 00 a0 5a 00 00 00 1e 66 21 50 B0 51 00 1B 30 50 40 70 36 00 a0 5a 00 00 00 1e 00 00 00 fd 00 3a 60 3e 1e 53 10 00 0a 20 20 20 20 20 20 d 70 d 00 e

(2) HDMI

1) HD HDMI EDID data (2D Model)

0 1 2 3 4 5 6 7 8 9 A B C D E F 00 00 FF FF FF FF FF FF 00 1E 6D a b 10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 01 01 30 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70 40 36 00 40 84 63 00 00 1E 64 19 00 40 41 00 26 30 50 18 88 36 00 40 84 63 00 00 18 00 00 00 FD 00 3A 60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d 70 d 01 e 80 02 03 22 F1 4E 10 1F 04 93 05 14 03 02 12 20 21 90 22 15 01 26 15 07 50 09 57 07 f A0 f 01 1D 80 18 71 1C 16 20 58 2C 25 00 A0 5A 5A B0 00 00 00 9E 01 1D 00 72 51 D0 1E 20 6E 28 55 00 C0 20 C2 31 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E D0 96 00 A0 5A 00 00 00 18 02 3A 80 18 71 38 2D 40 E0 58 2C 45 00 A0 5A 00 00 00 1E 00 00 00 00 00 00 F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

2) FHD HDMI EDID data (2D Model)

0 1 2 3 4 5 6 7 8 9 A B C D E F 00 00 FF FF FF FF FF FF 00 1E 6D a b 10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80 30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 45 00 A0 5A 00 00 00 1E 66 21 50 B0 51 00 1B 30 50 40 70 36 00 A0 5A 00 00 00 1E 00 00 00 FD 00 3A 60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d 70 d 01 e 80 02 03 22 F1 4E 10 9F 04 13 05 14 03 02 12 20 21 90 22 15 01 26 15 07 50 09 57 07 f A0 f 01 1D 80 18 71 1C 16 20 58 2C 25 00 20 C2 5A B0 31 00 00 9E 01 1D 00 72 51 D0 1E 20 6E 28 55 00 C0 20 C2 31 00 00 1E 02 3A 80 18 71 38 2D 40 58 2C D0 45 00 A0 5A 00 00 00 1E 01 1D 00 BC 52 D0 1E 20 E0 B8 28 55 40 C4 8E 21 00 00 1E 00 00 00 00 00 00 F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

Only for training and service purposes

- 10 -

- Detail EDID Options are below a. Product ID

MODEL NAME HEX EDID Table DDC Function

HD/FHD Model 0001 01 00 Analog/Digital

b. Serial No: Controlled on production line. c. Month, Year: Week : '01' -> '01', Year : '2014' -> '18' fix d. Model Name(Hex): cf) TV set’s model name in EDID data is below.

Model name MODEL NAME(HEX)

LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)

e. Checksum: Changeable by total EDID data.

EDID C/S data

Check sum

(Hex)

Block 0

Block 1

HD FHD

RGB HDMI RGB HDMI

74

5B (HDMI1) 25 (HDMI1)

A2

4B (HDMI2) 15 (HDMI2)

59

Only 60"

EDID C/S data

Check sum

(Hex)

Block 0

Block 1

HD FHD

RGB HDMI RGB HDMI

-

- DE (HDMI1)

- CE (HDMI2)

59

f. Vendor Specific(HDMI)

- HD Model

INPUT Model name(HEX)_2D

HDMI1 67 03 0C 00 10 00 80 1E

HDMI2 67 03 0C 00 20 00 80 1E

- FHD Model

INPUT Model name(HEX)_2D

HDMI1 67 03 0C 00 10 00 80 1E

HDMI2 67 03 0C 00 20 00 80 1E

3.4. Function Check

- Check display and sound

■ Check Input and Signal items.

1) TV

2) AV (SCART / CVBS)

3) COMPONENT (480i)

4) HDMI * Display and Sound check is executed by Remote control.

40

4. Total Assembly line process

4.1. White Balance adjustment

▪ W/B Equipment condition

CA210 : LED -> CH14, Test signal: Inner pattern(80IRE)

▪ Above 5 minutes H/run in the inner pattern. (“power on” key

of adjust remote control)

▪ If it is executed W/B adjustment in 2~3 minutes H/run, it is

adjusted by Target data.

Mode Temp Coordinate spec Target

Color Temperature

Cool 13,000K

Warm 6,500K

X=0.276 (±0.04) Y=0.275 (±0.04)

X=0.290 (±0.04) Y=0.298 (±0.04)

X=0.318 (±0.04) Y=0.334 (±0.04)

X=0.278 Y=0.280

X=0.293 Y=0.299

X=0.320 Y=0.339

▪ Normal line(LGD/CMI, March ~ December for Gumi, Global)

NC5.0

Aging time

(Min)

1 0-2 282 289 297 308 324 348 2 3-5 281 287 296 306 323 346 3 6-9 279 284 294 303 321 343 4 10-19 277 280 292 299 319 339 5 20-35 275 277 290 296 317 336 6 36-49 274 274 289 293 316 333 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329

Cool Medium Warm

x y x y x y

271 270 286 289 313 329

▪ Normal line(LGD/CMI, January ~ February for Gumi, Apply

not Cinema Screen)

NC5.0

8 80-119 272 271 287 290 314 330

Aging time

(Min)

1 0-2 286 295 301 314 328 354 2 3-5 284 290 299 309 326 349 3 6-9 282 287 297 306 324 346 4 10-19 279 283 294 302 321 342 5 20-35 276 278 291 297 318 337 6 36-49 274 275 289 294 316 334 7 50-79 273 272 288 291 315 331

9 Over 120 271 270 286 289 313 329

Cool Medium Warm

x y x y x y

271 270 286 289 313 329

Chassis

or Model

ALL ModelMedium 9,300K

<Caution> Not to push the INSTOP key after completion if the function inspection.

Only for training and service purposes

- 11 -

▪ Aging chamber (LGD/CMI)

NC5.0

1 0-2 280 285 294 308 319 340 2 3-5 276 280 290 303 315 335 3 6-9 272 275 286 298 311 330 4 10-19 269 272 283 295 308 327 5 20-35 267 268 281 291 306 323 6 36-49 266 265 280 288 305 320 7 50-79 265 263 279 286 304 318

8 80-119 264 261 278 284 303 316

9 Over 120 264 260 278 283 303 315

Aging time

(Min)

Cool Medium Warm

x y x y x y

271 270 285 293 313 329

▪ Use only AUO/Sharp/CSOT (Cool temp Spec is 13000K)

Aging time

(Min)

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

Cool Medium Warm

x y x y x y

▪ W/B information

Model information W/B information

Chassis

or Model

Module Panel

Backlight

Type

Using W/B table

22/28LX** All All Edge LED X

60LX** Sharp Sharp Edge LED X

Direct LED

Ohters LGD LGD

or

O

Edge LED

▪ Auto adjustment Map(using RS-232C to USB cable)

RS-232C COMMAND

[CMD ID DATA]

Wb 00 00 White Balance Start Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 254

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 254

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

MIN

CENTER

(DEFAULT)

MAX

Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0.(When R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)

* Manual W/B process using adjust Remote control.

▪ After enter Service Mode by pushing "ADJ" key, ▪ Enter White Balance by pushing "►" key at "10. White

Balance".

* Connecting picture of the measuring instrument

(On Automatic control) Inside PATTERN is used when W/B is controlled. Connect to

auto controller or push Adjustment R/C P-ONLY → Enter the

mode of White-Balance, the pattern will come out.

Full White Pattern

RS-232C Communication

CA-210

COLOR ANALYZER TYPE : CA-210

* Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (illumination is less than 10 lux).

(2) Adhere closely the Color analyzer(CA210) to the module

less than 10 cm distance, keep it with the surface of the Module and Color analyzer's prove vertically.(80° ~ 100°).

(3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.

- Using 'no signal' or 'POWER ONLY' or the others, check the back light on.

* CASE Cool Mode

First adjust the coordinate far away from the target value(x, y).B.

1) x, y > target

2) x, y < target

3) x >target, y < target

4) x < target, y > target

- Every 4 case have to fit y value by adjusting B Gain and then fit x value by adjusting R-Gain.

- In this case, increasing/decreasing of B Gain and R Gain can be adjusted.

How to adjust

1) In case G gain more than 172

Adjust R Gain and B Gain less than 192

2) If the G gain value be adjusted down to 172

One of the R/B Gain is 254

3) If G Gain is 172 , More than one of R/B Gain is to be

between 192~254

Only for training and service purposes

- 12 -

* CASE Medium / Warm

First adjust the coordinate far away from the target value(x, y).

1) x, y > target i) Decrease the R, G.

2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others.

3) x > target, y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R

4) x < target, y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G

* After you finished all adjustments, Press "In-start" key and

compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model's module from factory Jig model.

* Push the "IN STOP" key after completing the function

inspection. And Mechanical Power Switch must be set “ON”.

4.2. Outgoing condition Configuration

■ When pressing IN-STOP key by SVC remocon, Red LED

are blinked alternatively. And then automatically turn off.

(Must not AC power OFF during blinking)

6. Model name & Serial number D/L

▪ Press "Power on" key of service remote control.

(Baud rate : 115200 bps)

▪ Connect RS232 Signal Cable to USB Jack. ▪ Write Serial number ▪ Must check the serial number at the Diagnostics of SET UP menu.

(Refer to below).

6.1. Signal Table

CMD LENGTH ADH ADL DATA_1 . . . Data_n CS DELAY

CMD : A0h LENGTH : 85~94h (1~16 bytes) ADH : EEPROM Sub Address high (00~1F) ADL : EEPROM Sub Address low (00~FF) Data : Write data CS : CMD + LENGTH + ADH + ADL + Data_1 +...+ Data_n Delay : 20ms

5. HI-POT Test

5.1. HI-POT auto-check preparation

- Check the POWER cable and SIGNAL cable insertion condition

5.2. HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process automatically.

5.3. Checkpoint

(1) Test voltage

- Touchable Metal : 3 KV / min at 100 mA

- SIGNAL : 3KV / min at 100 mA

(2) TEST time: 1 second. (case : mass production ) (3) TEST POINT

- Touchable Metal => LIVE & NEUTRAL : Touchable Metal.

- SIGNAL => LIVE & NEUTRAL : SIGNAL.

6.2. Command Set

Adjust mode CMD(hex) LENGTH(hex) Description

EEPROM WRITE A0h 84h+n n-bytes Write (n = 1~16)

* Description

FOS Default write : <7mode data> write Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0, Phase Data write : Model Name and Serial Number write in EEPROM,.

6.3. Method & notice

(1) Serial number D/L is using of scan equipment. (2) Setting of scan equipment operated by Manufacturing

Technology Group.

(3) Serial number D/L must be conformed when it is produced in

production line, because serial number D/L is mandatory by D-book 4.0.

Only for training and service purposes

- 13 -

* Manual Download(Model Name and Serial Number)

If the TV set is downloaded by OTA or Service man, sometimes model name or serial number is initialized.(Not always) There is impossible to download by bar code scan, so It need Manual download.

1) Press the "Instart" key of Adjustment remote control.

2) Go to the menu "6.Model Number D/L" like below photo.

3) Input the Factory model name or Serial number like photo.

4) Check the model name Instart menu. → Factory name

displayed.

5) Check the Diagnostics.(DTV country only) → Buyer model

displayed.

7. MAC Address & CI+ key download

7.1 MAC Address

7.1.1 Equipment & Condition

▪ Play file : Serial.exe ▪ MAC Address edit ▪ Input Start / End MAC address

7.1.2 Download method

(1) Communication Prot connection

Connection: PCBA(USB Port) → USB to Serial Adapter(UC-

232A) → RS-232C cable → PC(RS-232C port)

* Caution: LJ21* chassis support only UC-232A driver. (only

use this one.)

(2) MAC Address & CI+ Key Download

▪ Set CI+ Key path Directory at Start Mac & CI+ Download

Programme

▪ Com 1,2,3,4 and 115200(Baudrate)

GP4_LOW

▪ Port connection button click(1) ▪ Push the (2) MAC Address write. ▪ At success Download, check the OK (3) ▪ Start CI+ Key Download, Push the (4) ▪ Check the OK or NG

Only for training and service purposes

- 14 -

7.2. LAN Inspection

7.2.1. Equipment & Condition

▪ Each other connection to LAN Port of IP Hub and Jig

7.2.2. LAN inspection solution

▪ LAN Port connection with PCB ▪ Network setting at MENU Mode of TV ▪ Setting automatic IP ▪ Setting state confirmation

-> If automatic setting is finished, you confirm IP and MAC Address.

7.3. LAN PORT INSPECTION(PING TEST)

Connect SET -> LAN port == PC -> LAN Port

SET PC

7.3.1. Equipment setting

(1) Play the LAN Port Test PROGRAM. (2) Input IP set up for an inspection to Test Program.

*IP Number : 12.12.2.2

7.3.2. LAN PORT inspection (PING TEST)

(1) Play the LAN Port Test Program. (2) Connect each other LAN Port Jack. (3) Play Test (F9) button and confirm OK Message. (4) Remove LAN cable.

Only for training and service purposes

- 15 -

BLOCK DIAGRAM

(P1801)

30P HD LVDS wafer

51P FHD LVDS wafer

(P1800)

COMP2_L/R_IN

COMP2_Y+/AV_CVBS_IN, COMP2_Pb+/Pr+

CK+/-, D0+/-, D1+/-, D2+/-_HDMI2

DDC_SCL/SDA_2, HDMI_CEC

Serial Flash

(8Mbit)

IC1300

SPI_SCK/SDI/SDO/CS

System EEPROM

(256Kbit)

IC104

I2C_SCL/SDA

RXA0+/-~RXA4+/-, RXACK+/-

RXB0+/-~RXB4+/-, RXBCK+/-

SPK_R

SPK_L

AMP_SCL/SDA

AUD_MASTER_CLK,

AUD_LRCH,

AUD_LRCK, AUD_SCK

TAS5733

(IC5600)

IR Connector

(P4600)

KEY1/2, LED_R, IR

REAR

HDMI1

(JK800)

F-SCART

(JK4300)

SPDIF_OUT

SPDIF(Optic)

(JK1001)

SIDE

USB(JK700)

HDMI2(MHL)

(JK801)

CK+/-, D0+/-, D1+/-, D2+/-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC

SIDE_USB2_DM/DP

USB1_OCD/CTL

SN1406035RGER

+5V_USB

MHL_CD_SENSE

AVDD5V_MHL,MHL_OCP

GGGGjpGzOwX`WWPG

uhukGGmshzoG

pjXWYGOYnP G

H27U2G8F2DTR-BC

PCM_A[0:7]

TC74LCX244FT

Buffer

TS_DATA[0:7]

PCM_DATA[0:7]

COMPONENT

(JK4301/4302)

5V_HDMI_4

PCM_A[8:14]

TG

Y[tG

SC1/AV2_CVBS_IN,

DTV/MNT_OUT, DTV/MNT_L/R_OUT

SC1_R+/G+/B+, COMP1_Y+/Pb+/Pr+

Main SOC

M1A -128MB Imbedded

(IC101)

IF_P

IF_N

FE_TS_DATA[0:7]

RGB

(P3600)

RS212C

(P3200)

R,G,B Hsync,Vsync

UART_TX, UART_RX

BD82020FVJ

Head Phone(JK3000)

HP_EXT_SPK_ROUT/LOUT

Extnal SPK

(JK3400)

LAN

(JK2100)

EPHY_TP/RP, EPHY_TN/RN

SIDE_USB1_DM/DP

USB(JK3100)

DDR3

(2Gbit)

IC1201

Only for training and service purposes

- 16 -

900

200

400

410

420

540

521

530

820

501

500

120

310

121

LV1

A2

AW1

A10

Set + Stand

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

Only for training and service purposes

- 17 -

POWER

LGE Internal Use Only

FROM POWER B/D 13.2V

+3.5V_ST

MMBT3906(NXP)

R406

10K

R404

4.7K

TR_NXP

Q400 MMBT3904(NXP)

R419

100

TR_NXP

Q402 MMBT3904(NXP)

1

TVS_SEMTECH

RL_ON

INV_CTL

+3.5V_ST

R400

10K

R401

10K

OPT

+3.5V_ST

R426

10K

TR_KEC Q400-*1 2N3904S

B

R402

10K

+3.3V_Normal

R425

10K

TR_KEC Q402-*1 2N3904S

B

R420

C

E

C

E

C

E

1K

C

E

+13.2V to +3.5V_STANDBY

+13.2V

L412

BLM18PG121SN1D

C438

C439

10uF

0.1uF

25V

R1

R46 9

R468

68K

6.8K 1/1 6W

1/16W

1%

C440

100pF

50V

R2

R471

C441

22K

1/16W

1%

2200pF

1uF 10V

Vout=0.765*(1+R1/R2)

TR_NXP

Q401

TVS_KEC ZD404-*1

R470 10K

OPT

C442

50V

2

ZD404

2N3906S-RTK

3

5V

EN

R475 30K

FB

VREG

SS

TR_KEC Q401-*1

EBC

OPT

R412

33K

P401

SMAW200-H12S5K(BK)(LTR)

PWR_ON

1

GND

3

D13.2V

5

A13.2V

7

GND

9

DRV_ON

11

13

IC405

BD9D321EFJ

1

2

3

4

3A

9

THERMAL

8

7

6

5

[EP]

VIN

BOOT

SW

GND

+13.2V POWER_DET

+13.2V

R430

14K

1%

R431

C415

5.6K

0.1uF 1%

25V

PWM1_CAP

R467-*1 1000pF 50V

PWM1

PWM1_Pulldown_R

R467

R424

3.9K

1K

L403

MLB-201209-0120P-N2

OPT

0.1 uF

L414

L415

MLB-201209-0120P-N2

PWM_DIM

C40 2

4.7 uF

25V

0.1 uF

PDIM#2

2

D13.2V

4

D13.2V

6

A13.2V

8

GND

10

PDIM#1

12

OPT C43 3

50V

C44 6

25V

+13.2V

A13.2V

R435 100K

RESET_IC_KEC

IC401

KIC7529M2

VCC

3

1

IC401-*1

RESET_IC_DIODES

APX803E29

VCC

3

1

OUT

2

GND

RESET

2

GND

R454

100

+3.5V_ST

C422

0.1uF 16V

OPT R438

4.7K

POWER_DET

POWER_DET_RESET

+13.2V to PANEL_VCC +3.5V_ST to +3.3V_Normal

PANEL_VCC

D

R451

R452

5.6K

G

C

TR_KEC Q403-*1 2N3904S

E

POWER_ON/OFF_1

+3.5V_ST

R443

10K

R444 10K

B

R447 22K

R448

2.2K

C428

2.2uF 10V

C

TR_NXP Q404 MMBT3904(NXP)

E

UBW2012-121F

PANEL_CTL

L408

120OHM

OPT

C425

0.1uF 25V

R441

+13.2V

10K

R442

10K

B

R445

R446 120K

33K

NON_60_SHARP

C

TR_NXP Q403 MMBT3904(NXP)

E

SSM3J332R

C427

0.22uF 25V

Q405

S

60_SHARP

C427-*1

0.1uF 50V

B

FET_AOS Q406-*1

AO3435

S

G

FET_TOSHIBA

Q406 SSM3J332R

S

B

G

C

E

D

C429

0.1uF 16V

TR_KEC

Q404-*1 2N3904S

L410

BLM18PG121SN1D

C430 22uF 10V

+3.3V_Normal

ZD402

5V

TVS_SEMTECH

TVS_KEC ZD402-*1

+3.5V_Normal to +1.5V_DDR

C443

0.1uF 16V

L413

2uH

C444 22uF

10V

+3.5V_ST

C445 22uF

10V

TVS_SEMTECH

ZD405

5V

TVS_KEC ZD405-*1

+3.3V_Normal

L409

BLM18PG121SN1D

C426 10uF

10V

IC404

AZ1117EH-ADJTRG1

OUTIN

ADJ/GND

1.3A

R449 1K 1/16W 1%

R450 200 1/16W 1%

Vout=1.25*(1+R2/R1)+Iadj*R2

R1

R2

L411

CB2012PK501T

R453

0

C431

10uF

10V

+1.5V_DDR

OPT

ZD403

2.5V

OPT ZD406

5.1v

+5V_Normal & +1.10V_VDDC

+13.2V

L404

CB2012PK501T

C405

C406

10uF

25V

+3.3V_Normal

R403 10K

OPT

C403

4700pF

50V

USB1_CTL

Check the pull down when AC Power On with HDD

USB1_CTL_Pull_Down

USB1_OCD

+3.3V_Normal

OPT R473

C404

30K

4700pF

R405

10K

OPT

R474

+3.3V_Normal

30K

50V

R472

3.3K

OPT

R407

4.7K

R408 100K

+5V_Normal

C408

2200pF

OPT

50V

OPT

C409

50V

R409

91K

C407 1uF

10V

SS2

EN1

EN2

ROSC/SYNC

SW_EN

NFAULT

+5V_USB

VIN123V7V24SS1

[EP]

22

1

THERMAL

25

2

3

IC400

SN1406035RGER

4

5

6

7

9

8

VIN2

SW_IN

SW_OUT

10

PGND2

LX2

25V

0.047uF

C410

BST120LX121PGND1

19

COMP1

18

FB1

17

AGND

16

RSET

15

FB2

14

COMP2

13

11

12

BST2

+5V_Normal

Vout=0.6(R1/R2)+0.6

L405

4.7uH

R1

OPT C411

R411

82pF

4.7K 50V

1%

R2

R413

5.1K 1%

C416

22pF

50V

C417

R41 4

3300pF

10K

50V

R422 15K

C419

22pF 50V

C420

3300pF

R41 8

50V

20K

L406

C421

0.047uF

4.7uH

25V

OPT

ZD407

5.1v

R1

R415

R416

5.1K

R417

+1.10V_VDDC

OPT

C412

C413

ZD401

10uF

2.5V

6.3V

0 5%

R2

1%

39K

1%

C418

47pF 50V

+5V_Normal

C423 22uF 16V

22uF

C414 22uF

10V

C424 22uF 16V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

C432

1uF 16V

L14_CA

POWER

Vout=0.6(R1/R2)+0.6

2014/12/03

4

USB (SIDE)

LGE Internal Use Only

USB_HDD_CAP1_10uF

C700-*1

USB_HDD_CAP1_22uF

OPT

JK700

1234

USB DOW N ST REAM

3AU 04S- 305- ZC-( LG)

5

ZD700

SD05

C701

5V

OPT

C702

5pF

50V

10uF

10V

USB_HDD_CAP2_10uF

C703-*1

USB_HDD_CAP2_22uF C700 22uF 10V

OPT D700 RCLAMP0502BA

10uF

10V

C703 22uF 10V

R700

2.2

R701

2.2

+5V_USB

OPT

C704 22uF 10V

SIDE_USB1_DM

SIDE_USB1_DP

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

USB_S1

2014/05/20

7

HDMI (REAR 1 / SIDE 1 MHL)

LGE Internal Use Only

HDMI_1

5V_HDMI_2

R802

1.8K

VA800

R803

1K

SHIELDGND

20

HP_DET

19

5V

18

GND

17

DDC_DATA

ESD_HDMI1_VARISTOR

16

DDC_CLK

15

NC

14

CE_REMOTE

13

CK-

12

CK_GND

11

CK+

10

EAG59023302

JK800

This GND Pattern should be very narrow

HDMI jack burnt problem improvement

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

5V_DET_HDMI_2

R805

3.3K

ESD_HDMI1_VARISTOR VA801

ESD_HDMI1_CAP

VA800-*1 1uF 10V

ESD_HDMI1_CAP VA801-*1 1uF 10V

AR801

5.1

AR802

5.1

MMBT3904(NXP)

ESD_HDMI1 VA802

TR_NXP

Q800

C

E

TR_KEC Q800-*1 2N3904S

B

C

B

E

ESD_HDMI1

VA803

ESD_HDMI1_TMDS

IP4294CZ10-TBR

ESD_HDMI1_TMDS

IP4294CZ10-TBR

HDMI_2 MHL

5V_HDMI_4

R808

10K

R809

10K

R810 100

R811 100

ESD_HDMI1 VA804

D803

1 2 3 4 5

D804

10 9 8 7 6

HPD2

DDC_SDA_2

DDC_SCL_2

HDMI_ARC HDMI_CEC

CK-_HDMI2

CK+_HDMI2

D0-_HDMI2

D0+_HDMI2

D1-_HDMI2

D1+_HDMI2

D2-_HDMI2

D2+_HDMI2

BODY_SHIELD

20

JK801-*1 DAADR019A

HDMI-2_EMI_FOOSUNG

GND

20

HP_DET

19

5V

18

GND

17

DDC_DATA

16

DDC_CLK

15

NC

14

CE_REMOTE

13

CK-

12

CK_GND

11

CK+

10

EAG62611204

HDMI-2

JK801

19

HOT_PLUG_DETECT

18

VDD[+5V]

17

DDC/CEC_GND

16

SDA

This GND Pattern should be very narrow

15

SCL

HDMI jack burnt problem improvement

14

RESERVED

13

CEC

12

TMDS_CLK-

11

TMDS_CLK_SHIELD

10

TMDS_CLK+

9

TMDS_DATA0-

8

TMDS_DATA0_SHIELD

7

TMDS_DATA0+

6

TMDS_DATA1-

5

TMDS_DATA1_SHIELD

4

TMDS_DATA1+

3

TMDS_DATA2-

2

TMDS_DATA2_SHIELD

1

TMDS_DATA2+

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

HDMI-2

R812

1.8K

5V_DET_HDMI_4

ESD_HDMI2 VA805

HDMI-2

R813

3.3K

ESD_HDMI2 VA806

OPT

VA807

5.6V

AR804

AR803

HDMI-2_MHL_Non

R819

0





5.1

ESD_HDMI2

HDMI-2_MHL

R818

0

ESD_HDMI2

VA809

ESD_HDMI2

VA808

VA811

ESD_HDMI2 VA810

HDMI-2_MHL

HDMI-2

R814

33

HDMI-2

R815 100

R816 100

HDMI-2

D805

1 2 3 4 5

ESD_HDMI2_TMDS

IP4294CZ10-TBR

D806

1 2 3 4 5

ESD_HDMI2_TMDS

IP4294CZ10-TBR

HDMI-2_MHL

C800

R817

0.047uF 300K

25V

MHL Spec

HDMI-2_MHL_Non

R817-*1

3.3K

10 9 8 7 6

HPD4

DDC_SDA_4

DDC_SCL_4

HDMI_CEC

CK-_HDMI4

CK+_HDMI4

D0-_HDMI4

D0+_HDMI4

D1-_HDMI4

D1+_HDMI4

D2-_HDMI4

D2+_HDMI4

MHL_CD_SENSE

CEC

HDMI_CEC

HDMI_DIODE_SUZHOU

D800-*1

MMBD6100

A1

C

5V_HDMI_2

R800

2.7K

+5V_Normal

R801

2.7K

R804 100

A2

HDMI_DIODE_KEC

A2CA1

KDS184 D800

DDC_SDA_2

DDC_SCL_2

CEC_REMOTE_S7

HDMI_DIODE_SUZHOU

D801-*1

MMBD6100

A1

C

R806

2.7K

+5V_Normal

R807

2.7K

5V_HDMI_4

HDMI_DIODE_SUZHOU

A2

HDMI_DIODE_KEC

A2CA1 KDS184 D801

D802-*1

MMBD6100

DDC_SDA_4

DDC_SCL_4

A2

A1

C

+3.5V_ST

A2CA1

HDMI_DIODE_KEC

KDS184 D802

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L15_M1A

HDMI_R1S1 8

140813

SPDIF

LGE Internal Use Only

SPDIF_OUT

+3.3V_Normal

OPT

C1001

1uF 10V

ESD Ready

SPDIF_OPTIC C1002 18pF 50V

VINPUT

SPDIF_OPTIC

JK1001

JST1223-001

GND

VCC

1

2

3

4

FIX_POLE

Fiber Optic

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

SPDIF

2014/06/02

10

DDR_EXT

LGE Internal Use Only

R1201

DDR_EXT

R1202

1K 1%

DDR_EXT

1K 1%

CLose to DDR3

DDR_EXT

C1201

C1202

0.1uF

1000pF

A-MVREFDQ

+1.5V_DDR+1.5V_DDR

DDR_EXT

R1204

DDR_EXT

R1205

1K 1%

CLose to MAIN IC

DDR_EXT

C1213

C1214

0.1uF

1000pF

A-MVREFCA

+1.5V_DDR

Option : Ripple Check !!!

OPT

C1217

0.1uF

C1218

0.1uF

OPT

C1216

10uF

10V

C1219

+1.5V_DDR

OPT

C1221

OPT

C1222

1uF

C1220

1uF

C1223

OPT

C1224

0.1uF

1uF

DDR_1600_1G_NAN

IC1201-*1

NT5CB64M16FP-DH

EAN61859502

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12

T3

NC_6

M7

NC_5

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

DDR_1600_1G_SS

IC1201

K4B1G1646G-BCK0

EAN61836301

DDR_EXT

R1203

240 1%

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

+1.5V_DDR

A-MVREFCA

A-MVREFDQ

C1203 10uF 10V C1204 0.1uF C1205 0.1uF C1206 0.1uF C1207 0.1uF C1208 0.1uF C1209 0.1uF C1210 0.1uF C1211 0.1uF C1212 0.1uF

A-MA14

DDR_1600_2G_SS

IC1201-*2

K4B2G1646Q-BCK0

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_7

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

N3 P7 P3 N2 P8 P2 R8 R2 T8 R3 L7 R7 N7 T3

M7

M2 N8 M3

J7 K7 K9

L2 K1 J3 K3 L3

T2

F3 G3

C7 B7

E7 D3

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

EAN61848803

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12/BC A13

NC_5

BA0 BA1 BA2

CK CK CKE

CS ODT RAS CAS WE

RESET

DQSL DQSL

DQSU DQSU

DML DMU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

DDR_1600_2G_SK

IC1201-*3

H5TQ2G63FFR-PBC

EAN61829204

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

M7

NC_5

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT

A10/AP

A12/BC

NC_5

RESET

DQSL DQSL

DQSU DQSU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7 R7

A11

N7 T3

A13

M7

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

F3 G3

C7 B7

E7

DML

D3

DMU

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

A-MA0 A-MA1 A-MA2 A-MA3 A-MA4 A-MA5 A-MA6 A-MA7 A-MA8 A-MA9 A-MA10 A-MA11 A-MA12 A-MA13

A-MBA0 A-MBA1 A-MBA2

A-MCKE

A/B_DDR3_CS A-MODT A-MRASB A-MCASB A-MWEB

A-MRESETB

A-MDQSL A-MDQSLB

A-MDQSU A-MDQSUB

A-MDML A-MDMU

A-MDQL0 A-MDQL1 A-MDQL2 A-MDQL3 A-MDQL4 A-MDQL5 A-MDQL6 A-MDQL7

A-MDQU0 A-MDQU1 A-MDQU2 A-MDQU3 A-MDQU4 A-MDQU5 A-MDQU6 A-MDQU7

DDR_EXT

R1207

DDR_EXT

R1208

56 1%

DDR_EXT

R1206

10K

DDR_EXT

C1215

0.01uF 50V

+1.5V_DDR

A-MCK

A-MCKB

A-MA0 A-MA1 A-MA2 A-MA3 A-MA4 A-MA5 A-MA6 A-MA7 A-MA8

A-MA9 A-MA10 A-MA11 A-MA12 A-MA13 A-MA14

A-MBA0 A-MBA1 A-MBA2

A-MCK A-MCKB A-MCKE

A-MODT

A-MRASB A-MCASB

A-MWEB

A-MRESETB

A/B_DDR3_CS

A-MDQSL A-MDQSU

A-MDML A-MDMU

A-MDQSLB A-MDQSUB

A-MDQL0 A-MDQL1 A-MDQL2 A-MDQL3 A-MDQL4 A-MDQL5 A-MDQL6 A-MDQL7 A-MDQU0 A-MDQU1 A-MDQU2 A-MDQU3 A-MDQU4 A-MDQU5 A-MDQU6 A-MDQU7

R1209

240

1%

M1A_256M_UO4

LGE2134(256M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

IC101

LGE2133(128M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

M1A_128M_UO4

IC101-*1

M1A_256M_AVS+

LGE2136(256M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

IC101-*2

M1A_128M_AVS+

LGE2135(128M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

IC101-*3

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

DDR

2014/06/13

12

Serial Flash for SPI boot

LGE Internal Use Only

/FLASH_WP

OPT

R1300 10K

+3.5V_ST

/SPI_CS

SPI_SDO

R1301

4.7K

OPT

WP#/SIO2

SPI_FLASH_MACRONIX

IC1300

MX25L8035EM2I-10G

CS#

1

SO/SIO1

2

3

GND

4

SPI_FLASH_WINBOND

IC1300-*1

W25Q80DVSSIG

CS

1

DO[IO1]

2

WP[IO2]

3

GND

4

8

7

6

5

8

7

6

5

VCC

NC/SIO3

SCLK

SI/SIO0

VCC

HOLD[IO3]

CLK

DI[IO0]

R1302

33

+3.5V_ST+3.5V_ST

C1300

0.1uF 16V

SPI_SCK

SPI_SDI

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

S_FLASH

140721

13

LVDS

LGE Internal Use Only

[51Pin LVDS Connector] (For FHD 60Hz)

MO_FHD

P1800

SP14-11592-01-51Pin

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

PANEL_VCC

C1800

0.1uF 25V

VCOM_SDA

VCOM_SCL

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

MO_FHD_non_55CSOT

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2-

RXB1+

RXB1-

RXB0+

MO_FHD_non_55CSOT

RXB0-

MO_FHD_VCC_CAP C1801 10uF 25V

LVDS_SEL

+3.3V_Normal

Cell_CSOT_55inch R1806

1K

OPT

R1807

10K

R1801

0

R1812

Cell_INX_FHD

AR1800

0

1/16W

FOR FHD REVERSE(10bit) Change in S7LR

MIRROR

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2- RXBCK-

RXB1+

RXB1-

RXB0+

RXB0-

Pol-change

RXA0+

RXA0-

RXA1+

RXA1-

RXA2+

RXA2-

RXACK+

RXACK-

RXA3+

RXA3-

RXA4+

RXA4-

RXB0+

RXB0-

RXB1+

RXB1-

RXB2+

RXB2-

RXBCK+

RXB3+

RXB3-

RXB4+

RXB4-

FOR FHD REVERSE(8bit) Change in S7LR

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2-

RXB1+

RXB1-

RXB0+

RXB0-

MIRROR

Pol-change

RXA4+

RXA4-

RXA0+

RXA0-

RXA1+

RXA1-

RXA2+

RXA2-

RXACK+

RXACK-

RXA3+

RXA3-

RXB4+

RXB4-

RXB0+

RXB0-

RXB1+

RXB1-

RXB2+

RXB2-

RXBCK+

RXBCK-

RXB3+

RXB3-

RXA0-

RXA0+

RXA1-

RXA1+

RXA2-

RXA2+

RXACK-

RXACK+

RXA3-

RXA3+

RXA4-

RXA4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXB4-

RXB4+

Shift

RXA4-

RXA4+

RXA0-

RXA0+

RXA1-

RXA1+

RXA2- RXACK-

RXA2+

RXACK-

RXACK+

RXA3-

RXA3+

RXB4-

RXB4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXA0-

RXA0+

RXA1-

RXA1+

RXA2-

RXA2+

RXACK+

RXA3-

RXA3+

RXA4-

RXA4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXB4-

RXB4+

[30Pin LVDS Connector] (For HD 60Hz_Normal)

MO_HD P1801

10031HR-30

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

VCOM_SDA

VCOM_SCL

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

PANEL_VCC

LVDS_SEL

+3.3V_Normal

OPT

R1808

3.3K

OPT

R1809

10K

EU pin assign is different from NON EU. Because of position of HD wafer.

V-COM I2C

URSA/VCOM_SCL

URSA/VCOM_SDA

VCOM_SCL

VCOM_SDA

+3.3V_Normal

VCOM_I2C_PULL_UP

R1810

VCOM_I2C

R1804

0

VCOM_I2C

R1805

0

VCOM_I2C_PULL_UP

2K

R1811 2K

URSA/VCOM_SCL

URSA/VCOM_SDA

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

LVDS

140613

18

CI Region

LGE Internal Use Only

* Option name of this page : CI_SLOT

CI SLOT

/CI_CD1

AR1900

33

R1903 R1904

R1905 100 R1906 R1907 33

AR1901

33

47 47

33

+5V_Normal

R1900

CLOSE TO SOC

CI_TS_DATA[4] CI_TS_DATA[5] CI_TS_DATA[6] CI_TS_DATA[7]

CI_IORD CI_IOWR

CI_MDI[0] CI_MDI[1] CI_MDI[2] CI_MDI[3]

CI_MDI[4] CI_MDI[5]

10K

CI_MDI[6] CI_MDI[7]

PCM_RST

/PCM_WAIT

CI_TS_CLK CI_TS_VAL

CI_TS_SYNC

CI_TS_DATA[0] CI_TS_DATA[1] CI_TS_DATA[2] CI_TS_DATA[3]

REG

C1900

2pF 50V

CLOSE TO SOC

+5V_Normal

R1909

R1912

10K

4 OUT_Y

4

100

+3.3V_Normal

VCC

Y

CI DETECT

/CI_CD2

/CI_CD1

/CI_CD2

CI_MISTRT

CI_MIVAL_ERR

CI_MCLKI

OR_GATE_CI_TOSHIBA

TOSHIBA ELECTRONICS KOREA CORPORATION

IC1900

1IN_B 5 VCC

2IN_A

3GND

OR_GATE_CI_NXP

74LVC1G32GW

1B5

A

2

GND

3

IC1900-*1

CI POWER ENABLE CONTROL

IC1901

AP2151WG-7

IN

5

R1902

EN

PCM_5V_CTL

R1901 10K

100

4

+5V_Normal

R1908

10K

OUT

1

GND

2

FLG

3

R1910 10K

C1901

GND

0.1uF

R1911

+3.3V_Normal

R1913

10K

CI_ADDR[9] CI_ADDR[8]

CI_ADDR[7] CI_ADDR[6] CI_ADDR[5] CI_ADDR[4] CI_ADDR[3] CI_ADDR[2] CI_ADDR[1] CI_ADDR[0]

CI_DATA[0-7]

/PCM_CE

+5V_Normal

CI_OE

R1920

10K

CI_WE

C1905

0.1uF

CLOSE TO SOC

CI_ADDR[0-14]

CI TS INPUT

AR1903

/PCM_IRQA

CI_MDI[7] CI_MDI[6] CI_MDI[5] CI_MDI[4]

CI_MDI[3] CI_MDI[2] CI_MDI[1] CI_MDI[0]

CI_MISTRT

CI_MIVAL_ERR

CI_MCLKI

33

AR1904

33

R1921 33 R1922 33 R1923 100

FE_TS_DATA[7] FE_TS_DATA[6] FE_TS_DATA[5] FE_TS_DATA[4]

FE_TS_DATA[3] FE_TS_DATA[2] FE_TS_DATA[1] FE_TS_DATA[0]

FE_TS_SYNC FE_TS_VAL_ERR

FE_TS_CLK

FE_TS_DATA[0-7]

CI HOST I/F

GND

CI_DET

PCM_A[0]

AR1902

CI_DATA[0-7]

CI_ADDR[8]

CI_ADDR[9] CI_ADDR[10] CI_ADDR[11]

CI_ADDR[13] CI_ADDR[14]

CI_OE

CI_WE CI_IORD CI_IOWR

100

CI_DATA[0] CI_DATA[1] CI_DATA[2] CI_DATA[3]

CI_DATA[4] CI_DATA[5] CI_DATA[6] CI_DATA[7]

REG

PCM_A[1]

PCM_A[2]

PCM_A[3]

AR1905

AR1906

AR1908

AR1909

AR1907

33

CI_ADDR[7] CI_ADDR[6] CI_ADDR[5] CI_ADDR[4]

CI_DATA[0-7]

CI_BUFFER_TOSHIBA

IC1902

74LCX244FT

1OE

1

1A1

2

2Y4

3

1A2

4

2Y3

5

1A3

6

2Y2

7

1A4

8

2Y1

9

GND

10

PCM_D[0] PCM_D[1] PCM_D[2] PCM_D[3]

PCM_D[4] PCM_D[5] PCM_D[6] PCM_D[7]

PCM_A[8] PCM_A[9]

PCM_A[10] PCM_A[11]

PCM_A[12]CI_ADDR[12] PCM_A[13] PCM_A[14] /PCM_REG

/PCM_OE /PCM_WE /PCM_IORD /PCM_IOWR

PCM_D[0-7]

+3.3V_Normal

VCC

20

2OE

19

1Y1

18

2A4

17

1Y2

16

2A3

15

1Y3

14

2A2

13

1Y4

12

2A1

11

PCM_D[0-7]

C1906

0.1uF 16V

PCM_A[7]

PCM_A[6]

PCM_A[5]

PCM_A[4]

AR1910 100

CI_BUFFER_NXP

IC1902-*1

74LVC244APW

1OE

1

1A0

2

2Y0

3

1A1

4

2Y1

5

1A2

6

2Y2

7

1A3

8

2Y3

9

GND

10

CI_ADDR[0] CI_ADDR[1] CI_ADDR[2] CI_ADDR[3]

VCC

20

2OE

19

1Y0

18

2A0

17

1Y1

16

2A1

15

1Y2

14

2A2

13

1Y3

12

2A3

11

+5V_CI_ON

C1903

10uF

10V

CI_SLOT_JACK

P1900

CI_DET

/PCM_CD

10067972-000LF

35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59

65 66 67 68

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 2660 2761 2862 2963 3064 31 32 33 34

G1G2

69

GND

R1917

47

R1918

100

C1904

0.1uF GND

GND

R1914

100

10K

GND

R1924 0

R1915 47

+5V_CI_ON+5V_Normal

L1900

BLM18PG121SN1D

R1916

C1902

100K

1uF 10V

CI_DATA[3] CI_DATA[4] CI_DATA[5] CI_DATA[6] CI_DATA[7]

CI_DATA[0] CI_DATA[1] CI_DATA[2]

CI_DATA[0-7]

R1919

10K

CI_DATA[0-7]

CI_ADDR[10]

CI_ADDR[11]

CI_ADDR[13] CI_ADDR[14]

CI_ADDR[12]

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

PCMCI_EU

2015/01/10

19