LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
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Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Application range
This spec sheet is applied all of the 32”,42”,47”LCD TV with
LJ12B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC, CST : 40 ± 5 ºC
2) Relative Humidity: 65 ± 10 %
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC: CE,IEC
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
NoItemSpecificationRemark
1Receivable System1) Digital : SBTVD /
2) Analog : NTSC / PAL-M / PAL-N
2Available Channel1) VHF : 02 ~ 13
2) UHF : 14 ~ 69
3) DTV : 02 ~ 69
4) CATV : 01 ~ 135
3Input Voltage1) AC 100 - 240V~ 50/60Hz
4MarketCentral and South AMERICA
5Screen Size32 inch Wide(1920x1080) 32LV3700
• HDMI Monitor Range Limits
Min Vertical Freq - 56 Hz
Max Vertical Freq - 62 Hz
Min Horiz. Freq - 30 kHz
Max Horiz. Freq - 80 kHz
Pixel Clock - 170 MHz
- 10 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
* Only 3DTV
9. HDMI Input(1.4a)
10. HDMI Input(1.3a)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed 3D input proposed mode
1 1920*1080 53.95 / 54 23.98 / 24 148.35/148.5 HDTV 1080P Frame packing
2 1280*720 89.9 / 90 59.94/60 148.35/148.5 HDTV 720P Frame packing
3 1280*720 75 50 148.5 HDTV 720P Frame packing
4 1920*1080 67.5 60 148.5 HDTV 1080P Side by Side(half), Top and bottom
5 1920*1080 56.250 50 148.5 HDTV 1080P Side by Side(half), Top and bottom,
6 1280*720 45 60 74.25 HDTV 720P Side by Side(half), Top and Bottom
7 1280*720 37.5 50 74.25 HDTV 720P Side by Side(half), Top and Bottom
8 1920*1080 33.75 60 74.25 HDTV 1080i Side by Side(half), Top and Bottom
9 1920*1080 28.125 50 74.25 HDTV 1080i Side by Side(half), Top and Bottom
10 1920*1080 27 24 74.25 HDTV 1080P Side by Side(half), Top and Bottom
11 1920*1080 33.75 30 89.1 HDTV 1080P Side by Side(half), Top and Bottom
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed 3D input proposed mode
1 1280*720 45.00 60.00 74.25 HDTV 720P Side by Side, Top & Bottom
2 1280*72037.5005074.25 HDTV 720P Side by Side, Top & Bottom
3 1920*1080 33.75 60.00 74.25 HDTV 1080I Side by Side, Top & Bottom
4 1920*1080 28.125 50.00 74.25 HDTV 1080I Side by Side, Top & Bottom
5 1920*1080 27.00 24.00 74.25 HDTV 1080P Side by Side, Top & Bottom, Checkerboard
6 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side, Top & Bottom, Checkerboard
7 1920*1080 67.50 60.00 148.5 HDTV 1080P Side by Side, Top & Bottom, Checkerboard
Single Frame Sequential
8 1920*1080 56.250 50 148.5 HDTV 1080P Side by Side, Top & Bottom, Checkerboard
Single Frame Sequential
- 11 -
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Only for training and service purposes
11. Wireless Input(1.3)
12. RGB input 3D(PC)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed 3D input proposed mode
1 1280*720 45.00 60.00 74.25 HDTV 720P Side by Side, Top & Bottom
2 1280*72037.5005074.25 HDTV 720P Side by Side, Top & Bottom
3 1920*1080 33.75 60.00 74.25 HDTV 1080I Side by Side, Top & Bottom
4 1920*1080 28.125 50.00 74.25 HDTV 1080I Side by Side, Top & Bottom
5 1920*1080 27.00 24.00 74.25 HDTV 1080P Side by Side, Top & Bottom, Checkerboard
6 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side, Top & Bottom, Checkerboard
7 1920*1080 67.50 60.00 148.5 HDTV 1080P Side by Side, Top & Bottom, Checkerboard
Single Frame Sequential
8 1920*1080 56.250 50 148.5 HDTV 1080P Side by Side, Top & Bottom, Checkerboard
Single Frame Sequential
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
PC DDC
1. 1920*1080 67.50 60.00 148.5 WUXGA (Reduced Blanking) (Side by Side), Top and Bottom
O
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Only for training and service purposes
- 12 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied all of the LJ12B/C/D/E/F/N
LCD TV models, which produced in manufacture department
or similar LG TV factory
2. Notice
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ºC ± 5 ºC of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-220
V~ 50 / 60Hz.
(5) Before adjustment, execute Heat-Run for 5 minutes.
A After Receive 100% Full white pattern (06CH) then
process Heat-run
(or “8. Test pattern” condition of Ez-Adjust status)
A How to make set white pattern
1) Press Power ON button of Service Remocon
2) Press ADJ button of Service remocon. Select “8. Test
pattern” and, after select “White” using navigation
button, and then you can see 100% Full White pattern.
* In this status you can maintain Heat-Run useless any
pattern generator
* Notice: if you maintain one picture over 20 minutes
(Especially sharp distinction black with white
pattern – 13Ch, or Cross hatch pattern – 09Ch)
then it can appear image stick near black level.
3. Adjustment Items
3.1. PCB Assembly Adjustment
A MAC Address Download
A Adjust 480i Comp1
A Adjust 1080p Comp1/RGB
• If it is necessary, it can adjustment at Manufacture Line
• You can see set adjustment status at “1. ADJUST
CHECK” of the “In-start menu”
A EDID (The Extended Display Identification Data)/DDC
(Display Data Channel) download
3.2. Set Assembly Adjustment
A Color Temperature (White Balance) Adjustment
A Using RS-232C
A PING Test
A Selection Factory output option
4. PCB Assembly Adjustment
4.1. MAC Address
4.1.1. Equipment & Condition
• Play file: Serial.exe
• MAC Address edit
• Input Start / End MAC address
4.1.2 Download method
4.1.2.1 Communication Prot connection
Connect: PCBA Jig-> RS-232C Port== PC-> RS-232C Port
4.1.2.2 MAC Address Download
• Com 1,2,3,4 and 115200(Baudrate)
• Port connection button click(1)
• Load button click(2) for MAC Address write.
• Start MAC Address write button(3)
• Check the OK Or NG
4.1.3 Equipment & Condition
• Each other connection to LAN Port of IP Hub and Jig
PCBA
PC(RS-232C)
RS-23 2C Po r t
- 13 -
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Only for training and service purposes
4.1.4 LAN inspection solution
• LAN Port connection with PCB
• Network setting at MENU Mode of TV
• Setting automatic IP
• Setting state confirmation
- If automatic setting is finished, you confirm IP and MAC
Address.
4.1.5 LAN Port Inspection (PING Test)
4.1.5.1 Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
4.1.6 LAN Port Inspection (PING Test)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) remove LAN CABLE
4.2. Using RS-232C
Adjust 3 items at 3.1 PCB assembly adjustments “adjustment
sequence” one after the order.
• xb 00 40: Change the mode to Component1 (No actions)
• ad 00 10: Adjust 480i Comp
• ad 00 10: Adjust 1080p Comp
• xb 00 60: Change to RGB-PC mode(No action)
• ad 00 10: Adjust 1080p RGB
• xb 00 90: Endo of Adjustmennt
- 14 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5 Factory Adjustment
5.1 Manual Adjust Component 480i/1080p
RGB 1080p
A Summary : Adjustment component 480i/1080i and RGB
1080p is Gain and Black level setting at Analog to Digital
converter, and compensate the RGB deviation
A Using instrument
• Adjustment remocon, 801GF(802B, 802F, 802R) or
MSPG925FA pattern generator (It can output 480i/1080i
horizontal 100% color bar pattern signal, and its output
level must setting 0.7V±0.1V p-p correctly)
A You must make it sure its resolution and pattern cause
every instrument can have different setting
A Adjustment method 480i Comp1, Adjust 1080p Comp1/RGB
(Factory adjustment)
• ADC 480i Component1 adjustment
- Check connection of Component1
- MSPG-925FA -> Model: 209, Pattern 65
• Set Component 480i mode and 100% Horizontal Color
Bar Pattern(HozTV31Bar), then set TV set to
Component1 mode and its screen to “NORMAL”
• ADC 1080p Component1 / RGB adjustment
- Check connection both of Component1 and RGB
- MSPG-925FA -> Model: 225, Pattern 65
• Set Component 1080p mode and 100% Horizontal Color
Bar Pattern(HozTV31Bar), then set TV set to
Component1 mode and its screen to “NORMAL”
• After get each the signal, wait more a second and enter
the “IN-START” with press IN-START key of Service
remocon. After then select “7. External ADC” with
navigator button and press “Enter”.
• After Then Press key of Service remocon “Right
Arrow(VOL+)”
• You can see “ADC Component1 Success”
• Component1 1080p, RGB 1080p Adjust is same method.
• Component 1080p Adjustment in Component1 input
mode
• RGB 1080p adjustment in RGB input mode
• If you success RGB 1080p Adjust. You can see “ADCRGB-DTV Success”
5.2 EDID (The Extended Display
Identification Data) / DDC (Display Data
Channel) Download.
A Summary
• It is established in VESA, for communication between PC
and Monitor without order from user for building user
condition. It helps to make easily use realize “Plug and
Play” function.
• For EDID data write, we use DDC2B protocol.
A Auto Download
• After enter Service Mode by pushing “ADJ” key,
• Enter EDID D/L mode.
• Enter “START” by pushing “OK” key.
=> Caution : - Never connect HDMI & D-sub Cable when
the user downloading .
- Use the proper cables below for EDID
Writing.
§ Edid data and Model option download (RS232)
- 15 -
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Only for training and service purposes
5.2.1 Manual Download
A Write HDMI EDID data
• Using instruments
- Jig. (PC Serial to D-Sub connection) for PC, DDC
adjustment.
- S/W for DDC recording (EDID data write and read)
- D-sub jack
- Additional HDMI cable connection Jig.
• Preparing and setting.
- Set instruments and Jig. Like pic.5), then turn on PC and
Jig.
- Operate DDC write S/W (EDID write & read)
- It will operate in the DOS mode.
Pic.3) For write EDID data, setting Jig and another instruments.
See Working Guide if you want more information about EDID
communication.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.3 Adjustment Color Temperature (White
balance)
A Using Instruments
• Color Analyzer: CA-210 (CH 9)
- Using LCD color temperature, Color Analyzer (CA-210)
must use CH 9, which Matrix compensated (White, Red,
Green, Blue compensation) with CS-2100. See the
Coordination bellowed one.
• Auto-adjustment Equipment (It needs when Autoadjustment – It is availed communicate with RS-232C :
Baud rate: 115200)
• Video Signal Generator MSPG-925F 720p, 216Gray
(Model: 217, Pattern 78)
A Connection Diagram (Auto Adjustment)
• Using Inner Pattern
• Using HDMI input
<Pic.5 Connection Diagram for Adjustment White balance>
A White Balance Adjustment
If you can’t adjust with inner pattern, then you can adjust it
using HDMI pattern. You can select option at “Ez-Adjust
Menu – 7. White Balance” there items “NONE, INNER,
HDMI”. It is normally setting at inner basically. If you can’t
adjust using inner pattern you can select HDMI item, and
you can adjust.
In manual Adjust case, if you press ADJ button of service
remocon, and enter “Ez-Adjust Menu – 7. White Balance”,
then automatically inner pattern operates. (In case of
“Inner” originally “Test-Pattern. On” will be selected in The
“Test-Pattern. On/Off”.
• Connect all cables and equipments like Pic.5)
• Set Baud Rate of RS-232C to 115200. It may set 115200
orignally.
• Connect RS-232C cable to set
• Connect HDMI cable to set
A RS-232C Command (Commonly apply)
• “wb 00 00”: Start Auto-adjustment of white balance.
• “wb 00 10”: Start Gain Adjustment (Inner pattern)
• “jb 00 c0” :
• …
• “wb 00 1f”: End of Adjustment
* If it needs, offset adjustment (wb 00 20-start, wb 00 2f-
end)
•“wb 00 ff”: End of white balance adjustment (inner pattern
disappear)
CA-100+
COL OR
ANALYZER
TYPE; CA-100+
Full W hite Pattern
RS-232C
-- 17 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
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O Notice) Adjustment Mapping information
• When Color temperature (White balance) Adjustment
(Automatically)
- Press “Power only key” of service remocon and operate
automatically adjustment.
- Set BaudRate to 115200.
• If it needs, then adjustment “Offset”.
A White Balance Adjustment (Manual adjustment)
• Test Equipment: CA-210
- Using LCD color temperature, Color Analyzer (CA-210)
must use CH 9, which Matrix compensated (White, Red,
Green, Blue compensation) with CS-2100. See the
Coordination bellowed one.
• Manual adjustment sequence is like bellowed one.
- Turn to “Ez-Adjust” mode with press ADJ button of
service remocon.
- Select “10.Test Pattern” with CH+/- button and press
enter. Then set will go on Heat-run mode. Over 30
minutes set let on Heat-run mode.
- Let CA-210 to zero calibration and must has gap more
10cm from center of LCD module when adjustment.
- Press “ADJ” button of service remocon and select
“7.White-Balance” in “Ez-Adjust” then press “
G ” button
of navigation key.
(When press “
G ” button then set will go to full white
mode)
- Adjust at three mode (Cool, Medium, Warm)
- If “cool” mode
Let B-Gain to 192 and R, G, B-Cut to 64 and then
control R, G gain adjustment High Light adjustment.
- If “Medium” and “Warm” mode
Let R-Gain to 192 and R, G, B-Cut to 64 and then
control G, B gain adjustment High Light adjustment.
- All of the three mode
Let R-Gain to 192 and R, G, B-Cut to 64 and then
control G, B gain adjustment High Light adjustment.
- With volume button (+/-) you can adjust.
- After all adjustment finished, with Enter (A key) turn to
Ez-Adjust mode. Then with ADJ button, exit from
adjustment mode
Attachment: White Balance adjustment coordination and
color temperature.
• Using CS-1000 Equipment.
- COOL : T=11000K, ∆uv=0.000, x=0.276 y=0.283
- MEDIUM : T=9300K, ∆uv=0.000, x=0.285 y=0.293
- WARM : T=6500K, ∆uv=0.000, x=0.313 y=0.329
• Using CA-210 Equipment. (9 CH)
- Contrast value: 216 Gray
• Using CA-210 Equipment. (14 CH)
- White Balance adjustment coordination and color
temperature for Edge / IOP LED, ALEF
-White Balance adjustment table for Edge (IOP) LED
Color coordination is different according to heat run time.
LGD IOP LED, LGD EDGE LED, LGD 3D EDGE LED
(for LV5500, LW5700)
White Balance adjustment table for ALEF Model
(LW9500)
White Balance adjustment table for IOL LED MODEL
(LZ9700)
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.4 EYE-Q function check
1) Turn on TV
2) Press EYE key of Adj. R/C
3) Cover the Eye Q II sensor on the front of the using your
hand and wait for 6 seconds
4) Confirm that R/G/B value is lower than 10 of the “Raw Data
(Sensor data, Back lignt )” . If after 6 seconds, R/G/B value
is not lower than 10, replace Eye Q II sensor
5) Remove your hand from the Eye Q II sensor and wait for 6
seconds
6) Confirm that “ok” pop up.
If change is not seen, replace Eye Q II sensor
5.5 HDCP (High-Bandwidth Digital
Contents Protection) Setting
• No Need.
5.6 Test of RS-232C control.
Press In-Start button of Service Remocon then set the
“4.Baud Rate” to 115200. Then check RS-232C control and
5.7 Selection of Country option.
Selection of country option is allowed only North American
model (Not allowed Korean model). It is selection of Country
about Rating and Time Zone.
Models: All models which use LA75A Chassis (See the first
page.)
Press “In-Start” button of Service Remocon, then enter the
“Option” Menu with “PIP CH-“ Button
Select one of these three (USA, CANADA, MEXICO) defends
on its market using “Vol. +/-“button.
* Caution : Don’t push The INSTOP KEY after completing
the function inspection.
6. GND and ESD Testing
6.1 Prepare GND and ESD Testing.
A Check the connection between set and power cord
6.2 Operate GND and ESD auto-test.
A Fully connected (Between set and power cord) set enter the
Auto-test sequence.
A Connect D-Jack AV jack test equipment.
A Turn on Auto-controller(GWS103-4)
A Start Auto GND test.
A If its result is NG, then notice with buzzer.
A If its result is OK, then automatically it turns to ESD Test.
A Operate ESD test
A If its result is NG, then notice with buzzer.
A If its result is OK, then process next steps. Notice it with
Good lamp and STOPER Down.Check Items.
A Test Voltage
• GND: 1.5KV/min at 100mA
• Signal: 3KV/min at 100mA
A Test time: just 1 second.
A Test point
• GND test: Test between Power cord GND and Signal
cable metal GND.
• ESD test: Test between Power cord GND and Live and
neutral.
A Leakage current: Set to 0.5mA(rms)
7. Preset Ch information.
In case of POWER ONLY, System color is operated multi
system
In case of IN STOP, System color is operated default system
(PAN-M)
- 19 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. Default Service option.
8.1 ADC-Set.
A R-Gain adjustment Value (default 128)
A G-Gain adjustment Value (default 128)
A B-Gain adjustment Value (default 128)
A R-Offset adjustment Value (default 128)
A G-Offset adjustment Value (default 128)
A B-Offset adjustment Value (default 128)
8.2 White balance. Value.
9. USB DOWNLOAD (*.epk file
download)
9.1 Put the USB Stick to the USB socket
9.2 Press Menu key, and move OPTION
9.3 Press “FAV” Press 7 times.
9.4 Select download file (epk file)
9.5 After download is finished, remove the
USB stick.
9.6 Press “IN-START” key of ADJ remote
control, check the S/W version.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 20 -
300
200
LV1
400
540
530
521
900
910
800
710
120
511
510
A2
A21
A10
310
320
A5
* Set + Stand
* Stand Base + Body
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LG1121 GP3
LG1121_DDR
2010. 10. 20
2
7
C300
22uF
25V
VLCD_POWER
(+12V)
L301
CIS21J121
C303
0.1uF
50V
R301
10K
C306
2200pF
C332
100pF
50V
OPT
MAX 782mA
+1.5V0
C334
22uF
10V
C336
22uF
10V
AOZ1072AI-3
PGND
VIN
AGND
FB
DCDC_Revision
IC303-*1
1
2
3
4
LX_2
8
LX_1
7
EN
6
COMP
5
+3.3VD
R306
47K
C308
0.1uF
16V
EN
6
FB
4
COMP
5
EAN60660601
50V
+1.0V_Normal
VIN
2
IC302
AOZ1024DI
3
AGND
1
PGND
LX
7
L303
3.6uH
R310
2.7K
1%
R1
R311
1.2K
1%
R312
10K
R2
1%
Vout=0.8*(1+R1/R2)
C312
3300pF
50V
OPT
MAX 2.92A
C315
22uF
10V
C318
22uF
10V
+1.0V
C321
0.1uF
16V
VLCD_POWER
(+12V)
L304
CIS21J121
C322
10uF
25V
C324
10uF
25V
C326
0.1uF
16V
+1.5V_DDR0
DCDC_Old
IC303
AOZ1072AI
PGND
AGND
1
VIN
2
3
FB
4
8
7
6
5
EAN60922901
LX_2
LX_1
EN
COMP
R302
15K
C328
0.1uF
16V
L306
3.6uH
C329
2200pF
R319
47K
+2.5V
R1
R321
6.2K
1%
R322
2.7K
1%
R323
R2
10K
1%
Vout=0.8*(1+R1/R2)
PGND
VIN
AGND
FB
DCDC_Revision
IC300-*1
AOZ1072AI-3
1
2
3
4
VLCD_POWER
+3.3V_Normal
(+12V)
L300
CIS21J121
DCDC_Old
IC300
AOZ1072AI
LX_2
8
LX_1
7
EN
6
COMP
5
R300
0
1/10W
C302
10uF
10V
+3.3VD
C301
10uF
25V
C304
0.1uF
16V
C305
10uF
25V
VLCD_POWER
R303
47K
(+12V)
PGND
1
VIN
AGND
FB
2
3
4
EAN60922901
C307
0.1uF
16V
+2.5V_Normal
AP2132MP-2.5TRG1
C309
0.1uF
16V
R304
1.5K
1%
R305
Vout=0.6*(1+R1/R2)
1K
1%
VCTRL
LX_2
8
LX_1
7
EN
6
COMP
5
1
PG
2
EN
3
VIN
4
EAN61387601
IC301
C310
0.1uF
16V
OPT
R307
43K
9
THERMAL
8
7
6
5
L302
3.6uH
C311
2200pF
[EP]
GND
ADJ
VOUT
NC
R308
18K
R309
47K
R1
R313
27K
1%
R314
4.3K
1%
R315
R2
10K
1%
Vout=0.8*(1+R1/R2)
R316
R2
16K
1%
R317
51K
R1
1%
C314
10uF
25V
C313
100pF
50V
OPT
MAX 435mA
C316
22uF
10V
MAX 405mA
C317
10uF
25V
+3.3VD
+2.5V
C319
22uF
10V
C320
0.1uF
16V
VLCD_POWER
(+12V)
VLCD_POWER
(+12V)
L305
CIS21J121
C323
10uF
25V
L308
CIS21J121
C338
10uF
25V
+1.5V_DDR1
DCDC_Old
IC304
AOZ1072AI
C325
10uF
25V
C327
0.1uF
16V
PGND
AGND
VIN
FB
1
2
3
4
EAN60922901
LX_2
8
LX_1
7
C330
EN
0.1uF
6
16V
COMP
5
R318
15K
2D to 3D LG1131 Core
DCDC_Old
IC305
AOZ1072AI
C339
10uF
25V
C340
0.1uF
16V
PGND
AGND
VIN
FB
1
2
3
4
EAN60922901
LX_2
8
LX_1
7
C341
EN
6
0.1uF
16V
COMP
5
R327
5.1K
L307
3.6uH
C331
2200pF
L309
3.6uH
C342
2200pF
R328
47K
+2.5V
R320
47K
R1
R2
Vout=0.8*(1+R1/R2)
+2.5V
R1
R329
2K
1%
R330
1.5K
1%
R324
6.2K
1%
R325
2.7K
1%
R326
10K
1%
100pF
C343
100pF
50V
OPT
C333
50V
OPT
MAX 782mA
C335
22uF
10V
MAX 467mA
+1.0V_2D3D
C344
22uF
10V
+1.5V1
C345
22uF
10V
C337
22uF
10V
PGND
VIN
AGND
FB
PGND
VIN
AGND
FB
DCDC_Revision
IC304-*1
AOZ1072AI-3
1
2
3
4
DCDC_Revision
IC305-*1
AOZ1072AI-3
1
2
3
4
LX_2
8
LX_1
7
EN
6
COMP
5
LX_2
8
LX_1
7
EN
6
COMP
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R331
R2
12K
1%
Vout=0.8*(1+R1/R2)
LG1121 GP3
LG1121_POWER
2010. 10. 20
3
7
VLCD_POWER
(+12V)
HVDD
(+8.4V)
R453
0
1/10W
C401
10uF
25V
VL
(+5V)
R408
150K
1%
R410
TH400
47k-ohm
120K
R409 0
1/10W
Place Bottom
C403
10uF
25V
OPT
R454
10
1/10W
C404
10uF
25V
R405
2.7K
C402
10uF
25V
VDD_LCM
(+16.8V)
to prevent inrush current
TCOMP
L400
22uH
D400
1N4148W
100V
C405
10uF
25V
C409
C406
10uF
25V
OPT
Place Bottom
R411
C407
0.47uF
50V
C408
0.47uF
50V
D401
1N4148W
100V
[PMIC Block]
VLCD_POWER
(+12V)
R451
1/10W
C410
10uF
25V
VL
(+5V)
1uF
25V
L401
10uH
3.1A
R412 0
D402
SMAB34
40V
C413
2.2
1000pF
C411
0.1uF
50V
C412
0.1uF
50V
0
TCOMP
C415
1uF
25V
C414
10uF
25V
VLCD_POWER
R452
0
1/10W
C417
0.1uF
50V
C416
0.01uF
50V
Place Bottom
C418
10uF
25V
OPT
(+12V)
C419
0.1uF
50V
C420
10uF
25V
OPT
EN1
TCOMP
AGND
AVIN
PVINB3
BST3
SWB3
OUT3
PGND3
C422
120pF
50V
C421
10uF
25V
MMBT3906(NXP)
R413
680
1
2
VL
3
4
5
6
7
8
9
10
C424
0.1uF
50V
R414
C425
2200pF
Q400
EBC
C427
0.1uF
50V
[EP]AGND
NC_5
40
THERMAL
11SS12
33K
50V
C423
10uF
25V
PVINB12_2
39
41
MAX17139
13
COMP
PGND_114PGND_2
C426
10uF
25V
OPT
Place Bottom
SWB
IC401
15
SW_116SW_2
C428
4.7uF
50V
NC_435SWB1_136SWB1_237BST138PVINB12_1
34
17
SWI18SWO
C429
10uF
25V
OPT
D403
SMAB34
19
NC_1
C430
4.7uF
50V
40V
LQM2HPN2R2MG0L
PGND232SWB233VLOGIC1
31
30
29
28
27
26
25
24
23
22
21
20
CTRLP
CTRLP
R415 0
1/10W
L402
22uH
2.2A
L403
2.2uH
VLOGIC2
SDA
SCL
A0
RST
NC_3
CTRLN
NC_2
VGL
VGH
R423 33
R424 33
R44933
VGH_S
(+27V)
C431
10uF
25V
R416
18K
1/10W
VCC_LCM
(+3.3V)
R427 0
1/10W
C432
C435
1uF
22uF
25V
10V
R450 0
C457
C458
10uF
10uF
25V
25V
VCC_LCM
(+3.3V)
I2C_SDA
I2C_SCL
VGL_FBVGL_FB
VCC_LCM
(+3.3V)
R455
10K
R456
10K
OPT
C433
C434
10uF
10uF
25V
25V
VGH_S
(+27V)
R417
18K
1/10W
C438
22uF
10V
VCORE
(+1.0V)
1/10W
R448
10K
Place Bottom
C439
10uF
25V
OPT
C441
0.1uF
50V
TCON_RST
R426 680
C442
10uF
25V
OPT
B
R429 0
1/10W
R430
5.1K
C
Q401
2SC3052
E
VDD_LCM
(+16.8V)
R432
9.1K
1/8W
D404
1N4148W
100V
C444
0.22uF
50V
OPT
C445
0.22uF
50V
OPT
1N4148W
C447
0.22uF
50V
C448
0.22uF
50V
SWB
D405
100V
R435
0
R436
2K
1/8W
1%
C449
0.1uF
50V
OPT
OPT
R4370
OPT
VCC_LCM
(+3.3V)
C450
10uF
25V
R440 0
C451
10uF
25V
1/10W
VGL
(-5V)
R442
3.6K
1/10W
[GPM Block]
OPT
VGH
(+27V)
VGH_S
(+27V)
R400 15K
1%
C400
56pF
50V
VGH_M
VGH
RE
CE
IC400
KIA3820FK
1
2
3
4
R401 33
R402 33
VCC_LCM
R403
OPT
(+3.3V)
VFLK
8
GND
7
VDPM
6
VDD
5
R404 33
GSC
FLK
VDD_LCM
(+16.8V)
R406
0
1/10W
DPM
R407
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CTRLP
VCC_LCM
(+3.3V)
VDD_LCM
(+16.8V)
I2C_SDA
R418
10K
R419 0
R420 22
C437
1uF
10V
C436
4.7uF
50V
R425 33
C440
4.7uF
50V
DVDD
VCOM_GND
VCOM_OUT
R433
HVDD
(+8.4V)
I2C_SCL
R42833
EP[GND]
SDA
1
THERMALTHERMAL
A0
2
21
3
IC402
BUF08630
4
0xEA
5
7
6
AVDD_1
VCOM_FB
AVDD_AVDD
0
C443
0.1uF
50V
C446
1uF
25V
NC_117HVDD18GM719GM820SCL
16
GM6
15
GM5
14
GM4
13
GM3
12
GM2
11
9
10
8
GM1
BKSEL
R431
10K
[P-Gamma Block]
V14
V13
V12
V10
V4
V3
V2
V1
VCC_LCM
(+3.3V)
VDD_LCM
(+16.8V)
I2C_SDA
R441
R438 0
R439 22
R443 33
C453
1uF
10K
10V
C452
C454
4.7uF
4.7uF
50V
50V
LG1121 GP3
T-Con Power/P-Gamma/GPM
DVDD
VCOM_GND
VCOM_OUT
SDA
A0
C455
0.1uF
50V
EP[GND]
1
2
3
4
5
VCOM_FB
I2C_SCL
R44433
21
IC403
BUF08630
0xE8
7
6
AVDD_1
AVDD_AVDD
8
HVDD
(+8.4V)
9
BKSEL
R445
10K
C456
1uF
25V
NC_117HVDD18GM719GM820SCL
16
GM6
15
GM5
14
GM4
13
GM3
12
GM2
11
10
GM1
R446 0
R447 0
V18
V17
V16
V15
V9
V7
V6
V5
VCOMOUT
VCOMFB
2010. 10. 20
4
7
[FRC-II 51P LVDS input wafer]
P500
FI-RE51S-HFK-A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
R50033
R50233
CIS21J121
C500
10uF
25V
VLCD_POWER
L500
RXB4P
RXB4N
RXB3P
RXB3N
RXBCLKP
RXBCLKN
RXB2P
RXB2N
RXB1P
RXB1N
RXB0P
RXB0N
RXA4P
RXA4N
RXA3P
RXA3N
RXACLKP
RXACLKN
RXA2P
RXA2N
RXA1P
RXA1N
RXA0P
RXA0N
I2C_SCL
I2C_SDA
3D_SYNC_Out
(+12V)
RESET
C501
10uF
25V
[FRC-II 80P mini-LVDS output wafer][To LED Driver]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C511
10uF
25V
C512
10uF
25V
C513
10uF
25V
C514
10uF
25V
C515
10uF
25V
VDD_LCM
C516
10uF
25V
(+16V)
C517
0.1uF
50V
M5
MDS62110204
GASKET_5.5T
M7
MDS62110204
OPT
M6
MDS62110204
GASKET_5.5T
M5-*1
MDS62110208
GASKET_4.5T
M6-*1
MDS62110208
GASKET_4.5T
[LEFT FFC CONNECTOR][RIGHT FFC CONNECTOR]
LG1121 GP3
LVDS/mini-LVDS wafer
2010. 10. 20
5
7
TXA0P
TXA0N
TXA1P
TXA1N
TXA2P
TXA2N
TXACLKP
TXACLKN
TXA3P
TXA3N
TXA4P
TXA4N
TXB0P
TXB0N
TXB1P
TXB1N
TXB2P
TXB2N
TXBCLKP
TXBCLKN
TXB3P
TXB3N
TXB4P
TXB4N
TXC0P
TXC0N
TXC1P
TXC1N
TXC2P
TXC2N
TXCCLKP
TXCCLKN
TXC3P
TXC3N
TXC4P
TXC4N
TXD0P
TXD0N
TXD1P
TXD1N
TXD2P
TXD2N
TXDCLKP
TXDCLKN
TXD3P
TXD3N
TXD4P
TXD4N
TXE0P
TXE0N
TXE1P
TXE1N
TXE2P
TXE2N
TXECLKP
TXECLKN
TXE3P
TXE3N
TXE4P
TXE4N
TXF0P
TXF0N
TXF1P
TXF1N
TXF2P
TXF2N
TXFCLKP
TXFCLKN
TXF3P
TXF3N
TXF4P
TXF4N
TXG0P
TXG0N
TXG1P
TXG1N
TXG2P
TXG2N
TXGCLKP
TXGCLKN
TXG3P
TXG3N
TXG4P
TXG4N
TXH0P
TXH0N
TXH1P
TXH1N
TXH2P
TXH2N
TXHCLKP
TXHCLKN
TXH3P
TXH3N
TXH4P
TXH4N
IC601
LGE5811A
L17
RXA0P
L18
RXA0N
K18
RXA1P
K17
RXA1N
J18
RXA2P
J17
RXA2N
H16
RXACLKP
J16
RXACLKN
H17
RXA3P
H18
RXA3N
G18
RXA4P
G17
RXA4N
F16
RXB0P
G16
RXB0N
F17
RXB1P
F18
RXB1N
E18
RXB2P
E17
RXB2N
D16
RXBCLKP
E16
RXBCLKN
D17
RXB3P
D18
RXB3N
B18
RXB4P
C18
RXB4N
A17
RXC0P
B17
RXC0N
C16
RXC1P
C17
RXC1N
B16
RXC2P
A16
RXC2N
A15
RXCCLKP
B15
RXCCLKN
C14
RXC3P
C15
RXC3N
B14
RXC4P
A14
RXC4N
A13
RXD0P
B13
RXD0N
C12
RXD1P
C13
RXD1N
B12
RXD2P
A12
RXD2N
A11
RXDCLKP
B11
RXDCLKN
C10
RXD3P
C11
RXD3N
B10
RXD4P
A10
RXD4N
A9
RXE0P
B9
RXE0N
C8
RXE1P
C9
RXE1N
B8
RXE2P
A8
RXE2N
A7
RXECLKP
B7
RXECLKN
C6
RXE3P
C7
RXE3N
B6
RXE4P
A6
RXE4N
A5
RXF0P
B5
RXF0N
C4
RXF1P
C5
RXF1N
B4
RXF2P
A4
RXF2N
A3
RXFCLKP
B3
RXFCLKN
C2
RXF3P
C3
RXF3N
B2
RXF4P
A2
RXF4N
C1
RXG0P
B1
RXG0N
D1
RXG1P
D2
RXG1N
E3
RXG2P
D3
RXG2N
E2
RXGCLKP
E1
RXGCLKN
F1
RXG3P
F2
RXG3N
G3
RXG4P
F3
RXG4N
G2
RXH0P
G1
RXH0N
H1
RXH1P
H2
RXH1N
J3
RXH2P
H3
RXH2N
J2
RXHCLKP
J1
RXHCLKN
K2
RXH3P
K1
RXH3N
L1
RXH4P
L2
RXH4N
LLV0P
LLV0N
LLV1P
LLV1N
LLV2P
LLV2N
LLVCLKP
LLVCLKN
LLV3P
LLV3N
LLV4P
LLV4N
LLV5P
LLV5N
LRV0P
LRV0N
LRV1P
LRV1N
LRV2P
LRV2N
LRVCLKP
LRVCLKN
LRV3P
LRV3N
LRV4P
LRV4N
LRV5P
LRV5N
RLV0P
RLV0N
RLV1P
RLV1N
RLV2P
RLV2N
RLVCLKP
RLVCLKN
RLV3P
RLV3N
RLV4P
RLV4N
RLV5P
RLV5N
RRV0P
RRV0N
RRV1P
RRV1N
RRV2P
RRV2N
RRVCLKP
RRVCLKN
RRV3P
RRV3N
RRV4P
RRV4N
RRV5P
RRV5N
H_CONV
OPT_P
OPT_N
EEP_ADDR
LR_IND
AGP_EN
MODE_SEL
RMLVDS
TEMPSEL0
TEMPSEL1
TEMPSEL2
TMODE0
TMODE1
TMODE2
TMODE3
SCL_M
SDA_M
SCL_S
SDA_S
PORES_N
SOE
GSP
GOE
GSC
POL
FLK
DPM
RBF
I2C Slave Address : 0x72
LG5811 will be change LG5811A.
Please use LG5811 unitil revision.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CI_ADDR[8]:
0: RESETOUTb (in On/Off only) stay asserted until software releases them.
1: Fix amount of delay for de-assertion on RESETOUTb (in On/IOff only)
at end of RESETb pulse (O)
NAND_DATA[3]:
0: MIPS will boot from external flash (O)
1: MIPS will boot from ROM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Run Along COMP_Y_IN,COMP_Pr_IN,COMP_Pb_IN/SC R,G,B Trace
INCM_R
INCM_G
INCM_B
INCM_VID_COMP1
INCM_VID_AV2
INCM_TUNER
INCM_VID_AV1
INCM_VID_SC/COMP2
BCM35230_with_CAP_220pF
IC101-*1
LGE35230
B6
BCM_CAP
VI_R
A6
VI_INCM_R
C7
VI_G
A7
VI_INCM_G
B7
VI_B
C8
VI_INCM_B
C13
HSYNC_IN
A13
VSYNC_IN
C9
VI_Y1
A9
VI_PR1
B9
VI_PB1
B8
VI_INCM_COMP1
C11
VI_SC_R1
A10
VI_SC_G1
B10
VI_SC_B1
C10
VI_INCM_SC1
D10
VI_FB_1/GPIO
F13
VI_FS1
A12
VI_SC_R2
C12
VI_SC_G2
B12
VI_SC_B2
B11
VI_INCM_SC2
E12
VI_FB_2/GPIO
E14
VI_FS2
E15
VI_L1
F17
VI_C1_1
E16
VI_INCM_LC1_1
F14
VI_C1_2
E11
VI_INCM_LC1_2
C18
VI_CVBS1
B18
VI_INCM_CVBS1
A18
VI_CVBS2
C19
VI_INCM_CVBS2
A19
VI_CVBS3
B19
VI_INCM_CVBS3
C20
VI_CVBS4
B20
VI_INCM_CVBS4
E19
VI_SIF1_1
D19
VI_INCM_SIF1_1
E10
VI_SIF1_2
F11
VI_INCM_SIF1_2
SCL3_3.3V
SDA3_3.3V
+3.3V_Normal
R301
1.2K
C301
33pF
50V
PHONE JACK
INCM_AUD_SC/COMP2
R302
1.2K
M_REMOTE_TX
C302
33pF
50V
PC_L_IN
PC_R_IN
AV1_L_IN
AV1_R_IN
INCM_AUD_AV1
AV2_L_IN
AV2_R_IN
INCM_AUD_AV2
SC/COMP2_L_IN
SC/COMP2_R_IN
C3051uF 10V
C3061uF 10V
C3071uF 10V
C3081uF 10V
C3091uF 10V
C3101uF 10V
C3111uF 10V
C3121uF 10V
C3131uF 10V
C3141uF 10V
C3151uF 10V
C3161uF 10V
NON_BCM_CAP
SPDIF_INC_P
SPDIF_INC_N
SPDIF_IND_P
SPDIF_IND_N
I2SSCK_IN/GPIO
I2SWS_IN
I2SSD_IN/GPIO
AADC_LINE_L1
AADC_LINE_R1
AADC_INCM1
AADC_LINE_L2
AADC_LINE_R2
AADC_INCM2
AADC_LINE_L3
AADC_LINE_R3
AADC_INCM3
AADC_LINE_L4
AADC_LINE_R4
AADC_INCM4
AADC_LINE_L5
AADC_LINE_R5
AADC_INCM5
AADC_LINE_L6
AADC_LINE_R6
AADC_INCM6
AADC_LINE_L7
AADC_LINE_R7
AADC_INCM7
IC101
I2SSCK_OUTA/GPIO
I2SWS_OUTA/GPIO
I2SSD_OUTA0/GPIO
I2SSOSCK_OUTA/GPIO
I2SSD_OUTA1/GPIO
I2SSD_OUTA2/GPIO
I2SSCK_OUTC/GPIO
I2SWS_OUTC/GPIO
I2SSD_OUTC/GPIO
I2SSOSCK_OUTC/GPIO
I2SSCK_OUTD/GPIO
I2SWS_OUTD/GPIO
I2SSD_OUTD/GPIO
I2SSOSCK_OUTD/GPIO
SPDIF_OUTA/GPIO
LGE35230(BCM35230KFSBG)
B15
C15
C14
B14
G4
F4
G5
C25
B24
A24
E22
E23
D23
C24
C23
B23
E21
D21
D22
B22
C22
A22
F21
D20
E20
A21
C21
B21
AUDMUTE_0/GPIO
AUDMUTE_1
ADAC_AL_N
ADAC_AL_P
ADAC_AR_N
ADAC_AR_P
ADAC_CL_N
ADAC_CL_P
ADAC_CR_N
ADAC_CR_P
ADAC_DL_N
ADAC_DL_P
ADAC_DR_N
ADAC_DR_P
AF8
AF9
AG9
AC9
AD8
AD9
E2
F2
E3
F3
G2
G3
G1
H1
B13
AG8
E13
C28
C27
D28
D27
C26
A27
B27
B28
B25
A25
A26
B26
R326100
R327100
R328100
R329100
TU_RESET_SUB
HP_DET
AV1_CVBS_DET
TU_RESET
SC_RE1
SC_RE2INCM_AUD_PC
/RST_HUB
S2_RESET
SPDIF_OUT
HP_LOUT_N
HP_LOUT_P
HP_ROUT_N
HP_ROUT_P
SCART1_Lout_N
SCART1_Lout_P
SCART1_Rout_N
SCART1_Rout_P
C337
22pF
OPT
C338
22pF
OPT
C339
22pF
OPT
C340
33pF
OPT
AUD_SCK
AUD_LRCK
AUD_LRCH
AUD_MASTER_CLK
Near
Near
Near
Near
Near
JK1102
JK1103
JK2501
JK1104
JK801
TU2101/2
TU2201/2/3
R3210
R3220
R3230
R3240
AUDIO INCM
Route Between AV1_L_IN & AV1_R_IN Trace
Route Between SC/COMP2_L_IN & SC/COMP2_R_IN Trace
Route Between AV2_L_IN & AV2_R_IN Trace
Route Between PC_L_IN & PC_R_IN Trace
Route Along With TUNER_SIF_IF_N
INCM_AUD_AV1
INCM_AUD_SC/COMP2
INCM_AUD_AV2
INCM_AUD_PC
INCM_SIF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
MAIN AUDIO/VIDEO
3
50
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