Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch),
there can some afterimage in the black level area.
1. Application Range
This specification sheet is applied to all of the LED LCD TV
with LC22E chassis.
2. Designation
(1) ecause this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of
isolation transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 C of temperature and 65±10% of relative humidity if
there is no specific designation.
(4) The input voltage of the receiver must keep 100~240V, 50/60Hz.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over 15.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours
In case of keeping module is in the circumstance of below -20
°C, it should be placed in the circumstance of above 15 °C for
3 hours.
■ Enter ADC mode by pushing “► key at “8. ADC Calibration”
■ There are 2 ways for ADC Calibration. ( OTP, External )
*. OTP mode
: Automatic ADC Calibration. (Internal ADC Calibration) On the
manufacture line, OTP is used for ADC Calibration automatically.
*. External mode
: Manual ADC Calibration. When OTP mode is failed, ADC
calibration should be “OK” by using External mode.
■ Press “Power on” key of service remocon.(Baud rate :
115200 bps)
■ Connect RS-232C Signal to USB Cable to USB.
■ Write Serial number by use USB port.
■ Must check the serial number at Instart menu.
b. check the menu on in-start
4.3.2 Method & notice
A. Serial number D/L is using of scan equipment.
B. Setting of scan equipment operated by Manufacturing
Technology Group.
C. Serial number D/L must be conformed when it is produced in
production line, because serial number D/L is mandatory by
D-book 4.0
* Manual Download (Model Name and Serial Number)
If the TV set is downloaded By OTA or Service man,
Sometimes model name or serial number is initialized.( Not always)
There is impossible to download by bar code scan, so It need
Manual download.
a. Press the ‘instart’ key of ADJ remote controller.
b. Go to the menu ‘5.Model Number D/L’ like below photo.
c. Input the Factory model name(ex 47LM6200-CC) or Serial
number like photo.
5. Manual Adjustment
5.1. ADC adjustment is not needed because\
of OTP(Auto ADC adjustment)
5.2. EDID (The Extended Display Identification Data) / DDC (Display Data Channel)
download
5.2.1 Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
5.2.2 Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust remocon
5.2.3 Download method
1) Press Adj. key on the Adj. R/C, then select “12.EDID D/L”.
By pressing Enter key, enter EDID D/L menu.
2) Select [Start] button by pressing Enter key, HDMI1 / HDMI2 / HDMI3
/ HDMI4 / RGB are Writing and display OK or NG.
d. Check the model name Instart menu -->Factory name displayed
(ex 47LM62000-CA)
e. Check the Diagnostics (DTV country only) --> Buyer model
displayed (ex 47LM6200-CC)
- How-it-works: When R/G/B gain in the OSD is at 192, it means the
panel is at its Full Dynamic Range. In order to prevent saturation
of Full Dynamic range and data, one of R/G/B is fixed at 192, and the
other two is lowered to find the desired value.
-Adj. condition : normal temperature
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
5.3.2 Equipment
1) Color Analyzer: CA-210 (LED Module : CH 14)
2) Adj. Computer(During auto adj., RS-232C protocol is needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/204-Gray(Model:217,
Pattern:49)
→ Only when internal pattern is not available
▪Color Analyzer Matrix should be calibrated using CS-100。
5.3.3 Equipment connection MAP
*Model Name(Hex): LGTV
*Checksum(LG TV): Changeable by total EDID data.
Only for training and service purposes
5.3.4 Adj. Command (Protocol)
<Command Format>
START 6E A 50 A LEN A 03 A CMD A 00 A VAL A CS A STOP
- LEN: Number of Data Byte to be sent
- CMD: Command
- VAL: FOS Data value
- CS: Checksum of sent data
- A: Acknowledge
Ex) [Send: JA_00_DD] / [Ack: A_00_okDDX]
▪RS-232C Command used during auto-adj.
-equipment : RF Remocon for test, IR-KEY-Code Remocon for test
-You must confirm the battery power of RF-Remocon before test
(recommend that change the battery per every lot)
-Sequence (test)
a)if you select the ‘start key(OK)’ on the controller, you can
pairing with the TV SET.
b)You can check the cursor on the TV Screen, when select the
‘OK Key’ on the controller
c) You must remove the pairing with the TV Set by
‘Mute + OK Key’ on the controller。
5.7 3D function test
Step 1) Turn on TV
Step 2) Press EYE key of Adj. R/C
Step 3) Cover the Eye Q II sensor on the front of the using your hand
and wait for 6 seconds
Step 4) Confirm that R/G/B value is lower than 10 of the “Raw Data
(Sensor data, Back light )” . If after 6 seconds, R/G/B value is
not lower than 10, replace Eye Q II sensor
Step 5) Remove your hand from the Eye Q II sensor and wait for 6
seconds
Step 6) Confirm that “ok” pop up. s
If change is not seen, replace Eye Q II sensor
5.5 Local Dimming Function Check
Step 1) Turn on TV
Step 2) At the Local Dimming mode, module Edge Backlight moving
right to left
Back light of IOP module moving
Step 3) confirm the Local Dimming mode
Step 4) Press “exit” Key.
2. Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Lower, it didn’t work.
But your downloaded version is Higher, USB data is automatically detecting
(Download Version High & Power only mode, Set is automatically Download)
3. Show the message “Copying files from memory
4. Updating is staring.
5. Updating Completed, The TV will restart automatically
6. If your TV is turned on, check your updated version and Tool
option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
ecover. if all channel data is cleared, you didn’t have a DTV/ATV
test on production line.
* After downloading, have to adjust TOOL OPTION again.
1. Push "IN-START" key in service remote controller.
2. Select "Tool Option 1" and Push “OK” button.
3. Punch in the number. (Each model has their number.)
9.3 Tool Option selection
▪ Method: Press Adj. key on the Adj. R/C, then select Tool option.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these spec ial safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AR100
10K
R150
1K
R151
1K
OPT
+3.3V_NORMAL
R144
10K
MTK_JTAG
R153
1K
OPT
R154
1K
+3.3V_NORMAL
R145
10K
MTK_JTAG
LED_PWM0
LED_PWM1
OPCTRL3
R146
10K
MTK_JTAG
R149
10K
+3.3V_NORMAL
NO_FRC
MODEL_OPT_0
MODEL_OPT_1
0
0
MODEL_OPT_2
MODEL_OPT_3
MODEL_OPT_4
MODEL_OPT_5
MODEL_OPT_6
MODEL_OPT_7
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
3D DEPTH
DDR
CP BOX
T2 Tuner
S Tuner
Reserved
EPI
MODEL OPTION 8 is just for CP Box
It should not be appiled at MP
MTK_JTAG
R152
1K
12507WS-12L
MTK_JTAG
P100
1
2
3
4
5
6
7
8
9
10
11
12
13
Close to eMMC Flash
(IC8100)
EMMC_CLK
STRAPPING LED_PWM0 LED_PWM1 OPCTRL3
ICE mode + 27M + Serial boot 0 0 0
ICE mode + 27M + ROM to Nand boot 0 0 1
ICE mode + 27M + Rom to eMMC boot 0 1 0
from eMMC pins (share pins w/s NAND)
ICE mode + 27M + ROM to eMMC boot 0 1 1
from SDIO pins
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DECAP FOR SOC (HIDDEN - UCC)DECAP FOR SOC (BOTTOM)
+1.2V_MTK_CORE
+1.5V_DDR
C508
0.1uF
C514
0.1uF
C520
0.1uF
C523
0.1uF
C527
0.1uF
+1.2V_MTK_CORE
C531
0.1uF
+1.5V_DDR
C533
0.1uF
C536
0.1uF
C537
0.1uF
C545
0.1uF
C547
0.1uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_MAIN_3
2011.12.09
10
Page 23
PLACE AT JACK SIDE
R610
C601
10pF
51K
1/16W
1%
EU
R611
0
EU
OPT
C607
1000pF
SC_ID
READY FOR FILTER (EMI)
SC_CVBS_IN
SC_ID_SOC
R613
10K
EU
SC_CVBS_IN_IF
R604
75
OPT
1%
EU
SC_L_IN
SC_R_IN
SC_FB
SC_R
SC_G
SC_B
R601
470K
OPT
R602
470K
OPT
R605
75
1%
R606
75
1%
R608
75
1%
EU
EU
R607
75
1%
EU
EU
R609
22
EU
C604
10pF
EU
C605
10pF
EU
C606
10pF
EU
READY FOR FILTER (EMI)
R625
0
EU
C602
330pF
50V
OPT
R626
0
EU
C603
330pF
50V
OPT
SC_FB_SOC
C608
330pF
50V
OPT
C609
330pF
50V
OPT
C610
10uF
16V
C611
10uF
16V
PLACE AT MAIN SOC SIDE
R623 100
R622 100
R620 100
R621 100
SC_CVBS_IN_IF
SCART_Rout_SOC
SCART_Lout_SOC
R614
30K
EU
EU
1/16W
5%
EU
R624
30K
1/16W
5%
EU
R617 100
SC_L_IN_SOC
SC_R_IN_SOC
C615 0.01uF
EU
EU
EU
EU
EU
EU
C614 0.01uF
EU
C612 0.01uF
EU
C613 0.01uF
EU
C616 0.047uF
EU
R61815K
EU
R61915K
EU
R627
330pF
50V
EU
R603
330pF
50V
EU
SC_R_SOC
SC_G_SOC
SC_COM_SOC
SC_B_SOC
SC_CVBS_IN_SOC
PLACE AT IC6000
+12V
OPT
R630
R628
100K
R629
100K
OPT
OPT
R635
22K
EU
R636
100K
SCART_Rout
OPT
R631
100K
SCART_Lout
SCART_AMP_R_FB
22K
EU
SCART_AMP_L_FB
R632
R633
+12V
0
EU
0
EU
R612
0
EU
R634
0
EU
R615
DTV/MNT_V_OUT_SOC
R616
EU
75
1%
TU_CVBS
75
1%
EU
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CI_IN_TS_VAL
CI_IN_TS_CLK
CI_IN_TS_SYNC
MID_MAIN_CI
2011.11.21
13
Page 26
FROM LIPS & POWER B/D
+3.5V_ST
+12V
C2401
0.1uF
+3.5V_ST
RL_ON
L2402
CIS21J121
C2406
0.1uF
16V
L2401
CIS21J121
50V
#16/#20/#23
LD - GND OR USE
LE(N.L.D.) - OPEN
LE(L.D.) - USE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
1
MC8101_ABOV
(TACT_KEY)
CM3231_CAPELLA
POWER_ON/OFF1
+3.3V_NORMAL
R3034
4.7K
OPT
LOGO_LIGHT
LOGO_LIGHT
POWER_DET
SOC_RESET
LED_B/GP4_LED_R
C
B
E
INV_CTL
SOC_TX
Q3000
MMBT3904(NXP)
EDID_WP
SOC_RX
AMP_MUTE
EXT_AMP_MUTE
EDID_WP
EXT_AMP_RESET
CEC_REMOTE
MICOM
D3000
BAT54_SUZHO
D
For CEC
R3028
27K
G
Q3001-*1
SI1012CR-T1-GE3
S
HDMI_CEC_FET_VISHAY
+3.5V_ST
G
D
Q3001
RUE003N02
HDMI_CEC_FET_ROHM
R3029
120K
S
HDMI_CEC
2011.11.21
30
Page 28
BODY_SHIELD
GND
20
19
18
17
16
15
14
13
12
11
10
EAG62611201
RSD-105156-100
JK3301
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
ARC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R33 00
0
CEC_REMOTE
CK-_HDMI4_JACK
CK+_HDMI4_JACK
D0-_HDMI4_JACK
D0+_HDMI4_JACK
D1-_HDMI4_JACK
D1+_HDMI4_JACK
D2-_HDMI4_JACK
D2+_HDMI4_JACK
5V_HDMI_4_JACK
R3307
100K
MMBT3904(NXP)
R3308 100
R3309 100
C
Q3301
E
DDC_SDA_4_JACK
DDC_SCL_4_JACK
R3310
1K
R3311
1K
B
R3312
4.7K
HDMI_HPD_4_JACK
HDMI_ARC
UI : HDMI1
BODY_SHIELD
20
EAG62611201
JK3303
RSD-105156-100
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_3_JACK
R3327
100K
MMBT3904(NXP)
R3328 100
R3329 100
C
Q3303
E
DDC_SDA_3_JACK
DDC_SCL_3_JACK
CEC_REMOTE
CK-_HDMI3_JACK
CK+_HDMI3_JACK
D0-_HDMI3_JACK
D0+_HDMI3_JACK
D1-_HDMI3_JACK
D1+_HDMI3_JACK
D2-_HDMI3_JACK
D2+_HDMI3_JACK
R3330
1K
R3331
1K
B
UI : HDMI3
R3336
4.7K
HDMI_HPD_3_JACK
E0
E1
E2
VSS
IC3300
M24C02-RMN6T
1
2
HDMI_EXT_EDID
3
4
5V_HDMI_1_SOC
VCC
8
WC
7
SCL
6
SDA
5
EDID_WP
R3319
22
HDMI_EXT_EDID
R3320
22
HDMI_EXT_EDID
C3300
0.1uF
16V
R3323
47K
+5V_NORMAL
A2CA1
MMBD6100
D3300
R3325
47K
DDC_SCL_1_SOC
DDC_SDA_1_SOC
5V_HDMI_3_JACK
C3302
0.1uF
16V
R3337
47K
+5V_NORMAL
A2CA1
MMBD6100
D3302
R3339
47K
DDC_SCL_3_JACK
DDC_SDA_3_JACK
BODY_SHIELD
20
EAG62611201
JK3302
RSD-105156-100
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_2_JACK
R3313
100K
MMBT3904(NXP)
R3314 100
R3315 100
CEC_REMOTE
CK-_HDMI2_JACK
CK+_HDMI2_JACK
D0-_HDMI2_JACK
D0+_HDMI2_JACK
D1-_HDMI2_JACK
D1+_HDMI2_JACK
D2-_HDMI2_JACK
D2+_HDMI2_JACK
C
Q3302
E
DDC_SCL_2_JACK
R3316
1K
R3317
1K
B
UI : HDMI2
R3318
4.7K
HDMI_HPD_2_JACK
BODY_SHIELD
20
19
18
17
16
15
14
13
12
11
10
EAG62611201
JK3300
RSD-105156-100
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_1_SOC
R3301
MMBT3904(NXP)
100K
R3302 100
R3303 100
CEC_REMOTE
CK-_HDMI1_SOC
CK+_HDMI1_SOC
D0-_HDMI1_SOC
D0+_HDMI1_SOC
D1-_HDMI1_SOC
D1+_HDMI1_SOC
D2-_HDMI1_SOC
D2+_HDMI1_SOC
C
Q3300
E
DDC_SDA_1_SOCDDC_SDA_2_JACK
DDC_SCL_1_SOC
R3304
1K
R3306
4.7K
HDMI_INTERNAL_EDID
R3305
1K
B
R3321
4.7K
HDMI_EXT_EDID
UI : HDMI4
HDMI_HPD_1_SOC
5V_HDMI_2_JACK
C3301
0.1uF
16V
R3324
47K
+5V_NORMAL
A2CA1
MMBD6100
D3301
R3326
47K
DDC_SCL_2_JACK
DDC_SDA_2_JACK
5V_HDMI_4_JACK
C3303
0.1uF
16V
R3338
47K
+5V_NORMAL
A2CA1
MMBD6100
D3303
R3340
47K
DDC_SCL_4_JACK
DDC_SDA_4_JACK
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HDMI 4
2011.10.29
33
Page 29
RGB/ PC AUDIO/ SPDIF
RGB PC
DSUB_VSYNC
DSUB_HSYNC
DSUB_R+
DSUB_B+
DSUB_G+
M24C02-RMN6T
E0
E1
E2
VSS
1
2
3
4
IC3600
RGB_EDID
D3615
30V
OPT
D3616
30V
OPT
RGB_5V
VCC
8
WC
7
SCL
6
SDA
5
Closed to JACK
C3633
RGB_5V
18pF
50V
R3641
R3642
2.7K
2.7K
C3634
18pF
50V
111112121313141415
6677889
112233445
A1
C
A2
MMBD6100
D3620
R3645
10K
RGB_EDID
D3621
ADUC 5S 02 0R5L
5.5V
JK3603
SLIM-15F-D-2
OPT
91010
+5V_NORMAL
JK3602
2F11TC1-EM52-4F
VIN
A
VCC
B
GND
C
Fiber Optic
4
SHIELD
R3620
2.7K
R3615
33
D3613
5.5V
ADUC 5S 02 0R5L
D3612-*1
OPT
OPT
D3611-*1
ESD_MTK
5.6V
ESD_MTK
5.6V
+3.3V_NORMAL
PC_L_IN
PC_R_IN
C3615
0.1uF
16V
EDID_WP
R3643 22
RGB_DDC_SCL
R3644 22
RGB_DDC_SDA
D3622
ADUC 5S 02 0R5L
5.5V
OPT
RGB_DEBUG
R3602
100
SOC_RX
RGB_DEBUG
R3647
100
R3600
D3600
0
20V
R3601
+3.3V_NORMAL
R3646
10K
D3623
5.6V
OPT
OPT
NON_RGB_DEBUG
DSUB_DET
0
NON_RGB_DEBUG
5
15
16
16
D3601
SOC_TX
20V
OPT
SPDIF OUT
PC AUDIO
JK3601
KJA-PH-0-0177
SPDIF_OUT
D3613-*1
ADUC 5S 02 0R5L
ESD_MTK
5 GND
4 L
3 DETECT
1 R
5.5V
D3611
5.6V
OPT
D3612
5.6V
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
JACK HIGH / MID
2011.11.21
36
Page 30
HP_LOUT
HP_ROUT
HP_DET
+3.3V_NORMAL
R3700
10K
HP_OUT
VA3700
5.6V
OPT
JK3700
KJA-PH-0-0177
5GND
4L
3DETECT
1R
EAG61030001
HP_OUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
ESD for MTK
VA3700-*1
5.6V
ESD_MTK_HP_OUT
ESD for LG1152
VA3700-*2
5.6V
ESD_LG1152_HP_OUT
JACK_COMMON
2011.11.21
37
Page 31
RS232C
0.1uF
0.1uF
RS232
RS232
RS232
RS232
C38000.1uF
C3801
C38020.1uF
C3803
DOUT2
12V_COMMERCIAL_OUT
12V 1A FOR COMMERCIAL(RS-232C POWER)
12V_COMMERCIAL_OUT
R3811
IR_OUT
RS232
100
R3820
RS232
100
R3821
+3.5V_ST
OPT_RS232
R3834
10K
FOR COMMERCIAL
R3814
D3805
20V
OPT
4.7K
OPT
D3804
20V
OPT
4.7K
OPT
IC3800
+3.5V_ST
MAX3232CDR
C1+
V+
C1-
C2+
C2-
V-
RIN2
1
2
3
4
RS232
5
6
7
8
EAN41348201
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
+3.5V_ST
SOC_RX
SOC_TX
9
8
7
6
RS232
SPG09-DB-009
JK3803
+3.5V_ST
10
5
4
3
2
1
UART_4PIN_STRAIGHT
P3800
12507WS-04L
1
2
3
4
5
UART_4PIN_ANGLE
P3801
12507WR-04L
1
2
3
4
5
CVBS 1 PHONE JACK
AV_JACK_BLACK
JK3800
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
AV_JACK_YELLOW
JK3800-*1
KJA-PH-1-0177-1
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
D3800
5.6V
OPT
D3801
5.6V
D3802
5.6V
+3.3V_NORMAL
R3810
10K
OPT
OPT
AV1_CVBS_DET
AV1_CVBS_IN
AV1_L_IN
AV1_R_IN
COMPONENT 1 PHONE JACK
COMP_JACK_BLACK
JK3801
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
COMP_JACK_GREEN
JK3801-*1
KJA-PH-1-0177-2
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
D3803
5.6V
OPT
+3.3V_NORMAL
R3806
10K
COMP1_DET
COMP1_Y
COMP1_Pb
COMP1_Pr
ESD For MTKESD For LG1152
D3803-*1
5.6V
ESD_MTK
D3800-*1
5.6V
ESD_MTK
D3801-*1
5.6V
ESD_MTK
D3802-*1
5.6V
ESD_MTK
D3803-*2
5.6V
ESD_LG1152
D3800-*2
ESD_LG1152
D3801-*2
5.6V
ESD_LG1152
D3802-*2
5.6V
ESD_LG1152
5.6V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
JACK_COMMON
2011.11.21
38
Page 32
IR
IR & KEY
COMMERCIAL
MMBT3904(NXP)
COMMERCIAL_IR
Q4100
+3.5V_ST
R4101
1K
IR_BYPASS
COMMERCIAL_IR
C
B
E
COMMERCIAL_IR
COMMERCIAL_IR
R4100
0
COMMERCIAL_IR
R4102
10K
MMBT3904(NXP)
R4103
Q4101
+3.5V_ST
3.3K
IR_OUT
R4104
C
B
E
COMMERCIAL_IR
COMMERCIAL_IR
47K
COMMERCIAL
COMMERCIAL_IR_EU
R4105
22
MMBT3904(NXP)
COMMERCIAL_IR_EU
+3.5V_ST
IR_BYPASS
R4107
10K
+3.5V_ST
R4109
1K
COMMERCIAL_IR_EU
C
Q4102
B
E
R4108
0
COMMERCIAL_IR_US
KEY1
KEY2
COMMERCIAL_IR
R4111
10K
Q4104
MMBT3904(NXP)
COMMERCIAL_IR
R4115
3.3K
+3.5V_ST
R4117
10K
5%
R4113
100
R4114
100
+3.5V_ST
R4118
C
B
COMMERCIAL_IR
E
10K
5%
R4119
47K
+3.5V_ST
C4100
0.1uF
C4102
0.1uF
AMOTECH CO., LTD.
L4100
BLM18PG121SN1D
AMOTECH CO., LTD.
D4100
5.6V
OPT
C4104
1000pF
50V
Soft Touch Micom D/L
Zener Diode is
close to wafer
RGB Sensor
D4101
5.6V
OPT
LED_B/GP4_LED_R
EEPROM_SCL
EEPROM_SDA
C4107
100pF
50V
R4123
100
R4124
100
R4125 1.5K
D4104
5.6V
D4105
ADUC 20S 02 010L
20V
OPT
D4106
ADUC 20S 02 010L
20V
OPT
OPT
AMOTECH CO., LTD.
GP4_IR_10P
P4102
12507WR-10L
1
2
3
4
5
6
7
8
9
10
11
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
ESD for MTK
D4105-*1
ADUC 20S 02 010L
10pF
20V
ESD_MTK
D4106-*1
ADUC 20S 02 010L
20V
10pF
ESD_MTK
D4100-*1
200pF
5.6V
ADMC 5M 02 200L
ESD_MTK
D4101-*1
5.6V
200pF
ADMC 5M 02 200L
ESD_MTK
D4104-*1
200pF
5.6V
ADMC 5M 02 200L
ESD_MTK
ESD for LG1152
D4100-*2
200pF
5.6V
ADMC 5M 02 200L
ESD_LG1152
D4101-*2
5.6V
200pF
ADMC 5M 02 200L
ESD_LG1152
D4104-*2
200pF
5.6V
ADMC 5M 02 200L
ESD_LG1152
IR / KEY
2011.11.21
41
Page 33
+5V_USB FOR USB1
POWER_ON/OFF2_4
+24V
L4305
BLM18PG121SN1D
C4324
10uF
35V
R4328
10K
C4327
0.1uF
16V
0.1uF
C4326
0.1uF
50V
OPT
Vout=0.8*(1+R1/R2)
330K
16V
R4329
C4329
BOOT
SS/TR
C4328
0.01uF
50V
0
R4330
VIN
EN
IC4305
TPS54331D
1
2
3
3A
4
+3.3V_NORMAL
R4327
MAX 2A
D4304-*1
40V
SX34
L4308
6.8uH
PH
8
D4304
SMAB34
GND
7
COMP
6
VSENSE
5
C4333
C4336
22uF
10V
C4334
4700pF
50V
R4336
20K
0.1uF
16V
/USB_OCD1
820
1%
R4343
R1
R2
OPT
C4338
1%
1000pF
R4338
10K
50V
1%
2K
R4339
USB_CTL1
USB_DM1
USB_DP1
40V
C4332
47pF
50V
R4323
10K
10K
OPT
IN_1
IN_2
ILIM_SEL
IC4303
TPS2554
GND
1
2
3
4
EN
5
11
THERMAL
[EP]
FAULT
10
OUT_2
9
1/10W
C4323
10uF
10V
OPT
OUT_1
8
ILIM0
7
ILIM1
6
R4300
27K
R4341
27K
1/10W
OPT
D4303
RCLAMP0502BA
USB1
DVR Ready
MAX 1.8A
04S -305- ZC-( LG)
3AU
JK4 303
1234
USB DOWN STR EAM
5
DEV_USB_DCDC_BD86180
IC4306-*1
BD86180MUV
EN
1
COMP
2
SS
3
RT
4
CTL2
5
CTL1
6
FLG2
7
FLG1
8
USB_OUT2
9
GND_1
10
GND_2
11
USB_OUT113USB_IN_1
12
+12V
L4306
BLM18PG121SN1D
C4325
10uF
16V
+5V_USB
[EP]GND
VREG
24
GND_3
25
23
THERMAL
VIN_2
22
VIN_1
21
PGND_2
20
PGND_1
19
BST
18
SW_2
17
SW_1
16
USB_IN_3
15
USB_IN_2
14
ESD for MTK
C4337
22uF
R4342
C4342
100pF
50V
R4332
10K
0.1uF
16V
10K
5%
C4340
4700pF
IC4306
SN1104041, DC-DC+2CH USB SW
[EP]GNDC4300
V7V
24
C4341
4.7uF
10V
L4307
3.6uH
C4301
22uF
10V
10V
C4331
0.1uF
16V
AGND_3
VIN_2
VIN_1
PGND_2
PGND_1
BST
LX_2
LX_1
SW_IN_3
SW_IN_2
SW_IN_1
THERMAL
25
23
22
21
20
19
18
17
16
15
14
13
EN
1
COMP
2
SS
3
ROSC
4
USB_DCDC_SN1104041
EN_SW2
5
EN_SW1
6
NFAULT2
7
NFAULT1
8
SW_OUT2
9
AGND_1
10
USB_DCDC_SN1104041
AGND_2
11
SW_OUT1
12
USB_DCDC_SN1104041
C4340-*1
0.01uF
50V
50V
USB_DCDC_BD86180
+5V_USB_3
+5V_USB_2
POWER_ON/OFF2_4
10K
R4301
10K
R4302
+3.3V_NORMAL
10K
10K
OPT
R4304
R4303
OPT
USB_CTL2
/USB_OCD2
USB_DM2
USB_DP2
+5V_USB_2
C4322
10uF
10V
USB2
MAX 1.5A
3AU 04S-3 05-Z C-(LG )
OPT
D4302
RCLAMP0502BA
JK4 302
1234
USB DOWN STR EAM
5
USB3
+5V_USB_3
ESD for LG1152
MAX 1.5A
3AU 04S-3 05-Z C-(LG )
JK4 300
1234
D4300-*2
RCLAMP0502BA
ESD_LG1152
D4302-*1
RCLAMP0502BA
ESD_LG1152
D4303-*3
RCLAMP0502BA
ESD_LG1152
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
From SoC
USB_CTL3
/USB_OCD3
USB_DM3
USB_DP3
WIFI_DM
WIFI_DP
USB_WIFI
+5V_USB
L4302
WIFI120-ohm
BLM18PG121SN1D
C4319
0.1uF
16V
WIFI
For EMI
USB3_HUB_WiFi
C4320
0.1uF
16V
WIFI
C4310
10uF
C4321
10uF
WIFI
USB DOWN STR EAM
P4301
12507WR-04L
WIFI
1
2
3
4
5
.
5
OPT
D4300
10V
C4339
10uF
10V
10V
WIFI
RCLAMP0502BA
MAX 0.4A
VDD
DM
DP
GND
2011.10.26
43
Page 34
Full Scart(18 Pin Gender)
D4611
5.6V
OPT
D4609
D4600
20V
OPT
5.5V
OPT
D4610
5.5V
OPT
D4600-*1
20V
10pF
ESD_MTK_SCART
D4606
5.6V
OPT
D4607
5.6V
OPT
D4608
5.6V
OPT
D4603
5.5V
D4604
5.5V
D4601
5.6V
OPT
D4602
5.5V
OPT
OPT
OPT
19
DA1R018H91E
JK4600
EU
SHIELD
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
AV_DET
COM_GND
SYNC_IN
SYNC_OUT
SYNC_GND
RGB_IO
R_OUT
R_GND
G_OUT
G_GND
ID
B_OUT
AUDIO_L_IN
B_GND
AUDIO_GND
AUDIO_L_OUT
AUDIO_R_IN
AUDIO_R_OUT
D4611-*2
5.6V
200pF
ESD_LG1152_SCART
SC_CVBS_IN
D4609-*1
5.5V
15pF
ESD_MTK_SCART
D4610-*1
5.5V
15pF
ESD_MTK_SCART
D4603-*1
5.5V
15pF
ESD_MTK_SCART
D4604-*1
5.5V
15pF
ESD_MTK_SCART
D4600-*2
20V
10pF
ESD_LG1152_SCART
D4606-*1
5.6V
200pF
ESD_MTK_SCART
D4601-*1
5.6V
200pF
ESD_MTK_SCART
D4602-*1
5.5V
15pF
ESD_MTK_SCART
D4605
5.6V
OPT
BLM18PG121SN1D
EU
C4600
1000pF
50V
BLM18PG121SN1D
EU
C4601
1000pF
50V
D4611-*1
5.6V
200pF
ESD_MTK_SCART
D4605-*1
5.6V
200pF
ESD_MTK_SCART
D4606-*2
5.6V
200pF
ESD_LG1152_SCART
L4600
EU
L4601
EU
+3.3V_NORMAL
EU
R4601
10K
EU
D4609-*2
5.5V
15pF
ESD_LG1152_SCART
R460075
EU
D4601-*2
5.6V
200pF
ESD_LG1152_SCART
SC_L_IN
SC_R_IN
EU
C4602
4700pF
EU
C4603
4700pF
CLOSE TO JUNCTION
C4604
0.1uF
C4605
100uF
16V
SC_FB
SC_R
SC_G
SC_B
D4605-*2
5.6V
200pF
ESD_LG1152_SCART
EU
SC_ID
DTV/MNT_L_OUT
DTV/MNT_R_OUT
SC_DET
MMBT3906(NXP)
Q4600
Gain=1+Rf/Rg
+12V
EU
E
C
R4608
R4603
390
R4602
390
B
EU
EU
Rf
470
Q4601
MMBT3904(NXP)
C
E
Rg
R4604
180
0
OPT
EU
R4605
EU
R4606
47K
B
EU
R4607
15K
EU
C4606
0.1uF
50V
EU
EU
C4607
47uF
25V
EU
DTV/MNT_V_OUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SCART GENDER
2011.10.26
46
Page 35
ZigBee_Radio Pulse M_REMOTE OPTION
P4800
12507WR-08L
M_REMOTE
9
+3.3V_NORMAL
L4800
120-ohm
3.3V
1
GND
2
RX
3
TX
4
RESET
5
DC
6
DD
7
GND
8
C4800
0.1uF
M_REMOTE
AR4800
100
1/16W
M_REMOTE
M_REMOTE_RX
M_REMOTE_TX
M_RFModule_RESET
M_RFModule_ISP
3D_SYNC_RF
3D_SYNC_RF
Only For PDP
ALL M_REMOTE OPTION
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MOTION REMOTE
2011.11.21
48
Page 36
Ethernet Block
LAN_JACK_POWER
JK5000
XRJH-01A-4-DA7-180-LG(B)
LAN_XML
P1[CT]
1
P2[TD+]
2
P3[TD-]
3
P4[RD+]
4
P5[RD-]
5
P6[CT]
6
P7
7
P8
8
P9
9
P10[GND]
10
P11
11
YL_C
D1
YL_A
D2
GN_C
D3
GN_A
D4
12
SHIELD
JK5000-*1
TLA-6T764
LAN_TDK
R1
1
R2
2
R3
3
R4
4
R5
5
R6
6
R7
7
R8
8
R9
9
R10[GND]
10
R11
11
YL_C
D1
YL_A
D2
GN_C
D3
GN_A
D4
12
SHIELD
C5000
0.1uF
16V
C5001
0.01uF
50V
D5000
5.5V
OPT
C5002
0.1uF
16V
D5001
5.5V
OPT
C5003
0.01uF
50V
D5002
5.5V
EPHY_TDP
EPHY_TDN
EPHY_RDP
EPHY_RDN
D5003
5.5V
OPT
OPT
ESD for MTK
ESD for LG1152
ESD_LG1152
D5000-*1
ESD_MTK
ADUC 5S 02 0R5L
D5001-*1
ESD_MTK
ADUC 5S 02 0R5L
D5000-*2
5.5V
ADUC 5S 02 0R5L
ESD_LG1152
D5001-*2
5.5V
ADUC 5S 02 0R5L
ESD_LG1152
D5002-*1
ESD_MTK
ADUC 5S 02 0R5L
D5002-*2
5.5V
ADUC 5S 02 0R5L
ESD_LG1152
D5003-*1
ESD_MTK
ADUC 5S 02 0R5L
D5003-*2
5.5V
ADUC 5S 02 0R5L
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPK_L+
SPK_L-
SPK_R+
SPK_R-
GP4_MT5369
AUDIO[ST]
4
3
2
1
P5800
2011.11.21
58
Page 38
AUD_OUT >> EU/CHINA_HOTEL_OPT
DTV/MNT_L_OUT
EU
C6000
1uF
25V
OPT
C6002
6800pF
EU
R60002.2K
R6002
OPT
470K
SCART_AMP_L_FB
SCART_Lout
33pF
+12V
EU
IC6000
AZ4580MTR-E1
EU
VCC
8
OUT2
7
IN2-
6
IN2+
5
OUT1
EU
R600433K
C6003
EU
IN1-
IN1+
1
2
3
VEE
4
L6000
C6004
0.1uF
50V
EU
SIGN600005
R6008 33K
C6005
EU
EU
33pF
SCART_AMP_R_FB
SCART_Rout
OPT
R6010
470K
R6011
OPT
C6007
6800pF
2.2K
EU
C6008
1uF
25V
EU
DTV/MNT_R_OUT
[SCART AUDIO MUTE]
DTV/MNT_L_OUT
Q6000
MMBT3904(NXP)
DTV/MNT_R_OUT
Q6001
MMBT3904(NXP)
C
B
EU
E
C
B
EU
E
R6013
EU
510
+3.5V_ST
R6012
4.7K
OPT
SCART_MUTE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SCART AUDIO AMP
2011.11.21
60
Page 39
+3.3V_NORMAL
EARPHONE AMP
HP_LOUT_MAIN
HP_ROUT_MAIN
4.7K
R6100
OPT
R6101
C6100
1uF
10V
C6103
1uF
10V
R6102
4.7K
OPT
R6103
4.7K
Close to the IC
INL-
1
INL+
2
INR+
3
INR-
4
OUTL
16
EAN60724701
5
OUTR
L6100
120-ohm
BLM18P G12 1SN1D
C6104
1uF
10V
VDD
SGND
14
15
IC6100
TPA6132A2
6G07G18
EN
13
HPVSS
C6105
10uF
10V
12
11
10
9
C6106
2.2uF
10V
HPVDD
CPP
PGND
CPN
C6107
0.1uF
16V
C6108
2.2uF
10V
C6109
2.2uF
10V
R6104
100K
OPT
HP_LOUT_AMP
Q6100
MMBT3904(NXP)
HP_ROUT_AMP
+3.3V_NORMAL
R6105
4.7K
C
B
E
OPT
R6106
0
R6107
1K
SIDE_HP_MUTE
From Micom
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HEADPHONE AMP
2011.09.29
61
Page 40
CI POWER ENABLE CONTROL
+5V_NORMAL
C6202
OPT
0.1uF
16V
PCM_5V_CTL
R6218
10K
CI
R6221
10K
OPT
R6223
4.7K
CI
B
CI
C
E
C6207
R6241
4.7uF
22K
10V
R6242
2.2K
CI
Q6200
MMBT3904(NXP)
CI
C6210
1uF
25V
OPT
+5V_CI_ON
R6248
10K
CI
Q6201
AO3407A
D
S
CI
G
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Option FOR MTK
C6210-*1
1uF
25V
CI_MTK
Option FOR LG1152
CI SLOT
2011.10.31
62
Page 41
T/C/S & H/NIM & T2/C TUNER(EU & CHINA)
TU6504
TDSH-T151F
TW_H/NIM
RF_S/W_CTL
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
IF_AGC
DIF[P]
DIF[N]
12
SHIELD
TDSS-G151D
1
2
3
4
5
6
7
8
9
10
11
TU6500
T/C_H/NIM_V
NC
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
IF_AGC
DIF[P]
DIF[N]
12
SHIELD
1
2
3
4
5
6
7
8
9
10
11
TU6501
TDSN-G351D
T2/C_F/NIM_DEV
NC_1
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
NC_2
NC_3
NC_4
+B3[3.3V]
+B4[1.23V]
NC_5
GND
ERROR
SYNC
VALID
MCLK
D0
D1
D2
D3
D4
D5
D6
D7
28
SHIELD
TDSQ-H051F
+5V[SPLITTER]
1
RESET
2
TU_SCL
3
TU_SDA
4
M_+3.3V
5
M_SIF
6
M_+1.8V
7
M_CVBS
8
M_IF_AGC
9
M_DIF[P]
10
M_DIF[N]
11
S_3.3V
12
S_1.8V
13
S_CVBS
14
GND_1
15
SD_ERROR
16
SD_SYNC
17
SD_VALID
18
SD_MCLK
19
SD_SERIAL_D0
20
N.C_1
21
N.C_2
22
N.C_3
23
N.C_4
24
N.C_5
25
N.C_6
26
N.C_7
27
GND_2
GND_3
SD_1.23V_DEMOD
SD_RESET
SD_3.3V_DEMOD
N.C_8
SD_SCL
SD_SDA
TU6502
CHB_V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
RF_SWITCH_CTL USE: T2/C,T/C,ATSC,DTMB.ISDB-T
TU6503
TDSQ-G051D
T/C/S2_V
N.C_1
RESET
SCL
SDA
+3.3V_TUNER
SIF
+1.8V_TUNER
CVBS
T/C_IF_AGC
T/C_DIF[P]
T/C_DIF[N]
N.C_2
N.C_3
N.C_4
GND_1
ERROR
SYNC
VALID
MCLK
D0
D1
D2
D3
D4
D5
D6
D7
GND_2
GND_3
+1.23V_S2_DEMOD
S2_RESET
+3.3V_S2_DEMOD
S2_F22_OUTPUT
S2_SCL
S2_SDA
LNB
GND_4
SHIELD
BR_F/NIM_V
CN_ATBM
TU6501-*1
TU6501-*2
TDSN-B051F
TDSN-C251D
RF_S/W_CTL
1
1
RESET
2
2
SCL
3
3
SDA
4
4
+B1[3.3V]
5
5
SIF
6
6
+B2[1.8V]
7
AT_H/NIM_V
TU6500-*1
TDSS-H151F
NC
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBS
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
12
SHIELD
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
SHIELD
7
CVBS
8
8
NC_1
9
9
NC_2
10
NC_3
11
+B3[3.3V]
12
+B4[1.23V]
13
NC_4
14
GND
15
ERROR
16
SYNC
17
VALID
18
MCLK
19
D0
20
D1
21
D2
22
D3
23
D4
24
D5
25
D6
26
D7
27
28
SHIELD
RF_S/W_CTL
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
NC_1
NC_2
NC_3
+B3[3.3V]
+B4[1.23V]
NC_4
GND
ERROR
SYNC
VALID
MCLK
D0
D1
D2
D3
D4
D5
D6
D7
28
SHIELD
CN_LG3921
TU6501-*3
TDSN-C051D
RF_S/W_CTL
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBS
8
NC_1
9
NC_2
10
NC_3
11
+B3[3.3V]
12
+B4[1.23V]
13
NC_4
14
GND
15
ERROR
16
SYNC
17
VALID
18
MCLK
19
D0
20
D1
21
D2
22
D3
23
D4
24
D5
25
D6
26
D7
27
T2/C/S2
TU6503-*1
TDSQ-G351D
N.C_1
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBS
8
N.C_2
9
N.C_3
10
N.C_4
11
+B3[3.3V]
12
+B4[1.23V]
13
N.C_5
14
GND_1
15
ERROR
16
SYNC
17
VALID
18
MCLK
19
D0
20
D1
21
D2
22
D3
23
D4
24
D5
25
D6
26
D7
27
GND_2
28
GND_3
29
+B5[1.23V]
30
S2_RESET
31
+B6[3.3V]
32
S2_F22_OUTPUT
33
S2_SCL
34
S2_SDA
35
LNB
36
GND_4
37
38
SHIELD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
CHB
OPT
C6523
C6525
100pF
0.1uF
50V
16V
+1.23V_TU
+1.8V_TU
DVB_S&CHB
BLM18PG121SN1D
C6515
0.1uF
DVB_S&CHB
C6517
18pF
50V
C6518
18pF
50V
L6501
LNB_TX
+1.23V_TU
C6519
10uF
10V
DVB_S&CHB
R6503 22
DVB_S&CHB
R6504 22
DVB_S&CHB
OPT
R6511
100K
C6520
0.1uF
16V
R6518
82
E
Q6500
C
MMBT3906(NXP)
Ground Width >= 24mils
+3.3V_D_Demod
OPT
C6528
10uF
6.3V
CHB_CVBS
CHB_ERR
CHB_SYNC
CHB_VAL
CHB_CLK
TU_TS_ERR
FE_TS_SYNC
TU_TS_VAL
FE_TS_CLK
CHB_DATA
FE_TS_DATA[0-7]
+3.3V_D_Demod
OPT
R6512
2.2K
R6513
10
C6521
DVB_S&CHB
0.1uF
OPT
OPT
C6524
100pF
/TU_RESET
TUNER_SIF
C6527
/S2_RESET
0.1uF
OPT
R6521
220
E
Q6501
MMBT3906(NXP)
C
+3.3V_D_Demod
I2C_SCL4
I2C_SDA4
CHB_CVBS
CHB_ERR
CHB_SYNC
CHB_VAL
CHB_CLK
CHB_DATA
ATV_OUT
2012 perallel
because of derating
+3.3V_TU
+3.3V_TU_IN
NOT_T/C&AT
C6533
10uF
16V
C6531
0.1uF
ERROR & VALID PIN
TU_CVBS
T/C_H/NIM
NOT_DVB_S
Not_L9_T2/C/S
BLM18PG121SN1D
T/C/S2T2/C_F/NIMT2/C/S2CHB
DVB_S&CHBDVB_S&CHBDVB_S&CHB
NOT_T/C&AT
T/C&AT&CHB
Not_L9_T2/C/S
+5V_NORMAL
C6535
1uF
OPT
+3.3V_D_Demod
NOT_T/C&AT
L6506
+3.3V_NORMAL
L9_T2/C/S
IC6500
74LVC1G08GW
TU_TS_VAL
TU_TS_ERR
DVB_SDVB_ST/C&AT&CHBT/C&AT&CHB
NOT_T/C&AT
T2/C
T2/C&CN
T2/C&CHB&CN
NOT_T/C&AT&CHBNOT_T/C&AT&CHB
NOT_DVB_S
Not_L9_T2/C/SNot_L9_T2/C/S
C6540
0.1uF
B
A
GND
NOT_T/C&AT
T2/C
T2/C&CN
T2/C&CHB&CN
NOT_T/C&AT&CHB
L9_T2/C/S
AP2132MP-2.5TRG1
PG
EN
R6523
10K
VIN
VCTRL
1
2
3
NOT_L9_T2/C/S
NOT_T/C&AT
IC6501
1
2
3
4
2A
EAN61387601
R6525
0
NOT_T/C&AT
T/C&AT&CHB
T2/C&CHB&CN
H/NIM&CHB
9
THERMAL
CHB
5
4
8
7
6
5
+3.3V_TU
VCC
L9_T2/C/S
Y
L9_T2/C/S
AT_H/NIM
NOT_DVB_S
Not_L9_T2/C/S
[EP]
GND
ADJ
VOUT
NC
C6544
Vout=0.6*(1+R1/R2)
NOT_T/C&AT
C6538
10uF
10V
Close to the tuner
L6503
BLM18PG121SN1D
C6529
C6526
0.1uF
22uF
10V
16V
NOT_T/C&AT
C6542
0.1uF
465mA(MAX)
+3.3V_TU
C6530
0.1uF
16V
Close to the tuner
TUNER
+3.3V_TU
IC6503
AZ1117BH-1.8TRE1
IN
3
+5V_NORMAL
C6532
0.1uF
0.1uF
16V
R6526
100
1/16W
5%
NOT_T/C&AT
RF_SWITCH
NOT_T/C&AT&CHB
NOT_DVB_S
Not_L9_T2/C/S
T2 : Max 1.7A
else : Max 0.7A
NOT_T/C&AT
R6527
20K
1%
NOT_T/C&AT
R6528
11K
1%
R6529
10K
1%
NOT_T/C&AT
OUT
2
1
ADJ/GND
BR_TW_CN_TUNER
R6532-*1
BLM18PG121SN1D
120-ohm
MTK/L9_DVB/ATSC/NTSC
R6532
0
16V
FE_TS_VAL
CN
CN
BR
+1.23V_TU
R2
R1
CHB : Max 480mA
else : Max 240mA
+1.8V_TU
R6531
1
C6546
C6548
10uF
0.1uF
10V
16V
C6534
C6536
22uF
10V
Close to the tuner
2011.11.21
CN
R6528-*1
12K
1/16W
1%
NOT_T/C&AT
C6549
10uF
16V
150mA(MAX)
+5V_TU
22uF
10V
C6539
0.1uF
16V
LNB_TX
LNB_OUT
ATV_OUT
+5V_TU
R6520
220
B
R6519
1K
OPT
65
Page 42
DVB-S2 LNB Part Allegro
DCDC_GND and A_GND are connected
DCDC_GND and A_GND are connected in pin#27
PCB_GND and A_GND are connected
(Option:LNB)
LNB_OUT
C6915
18pF
OPT
C6916
18pF
LNB
Close to Tuner
Surge protectioin
C6913
33pF
OPT
C6914
33pF
LNB
D6904
LNB
R6906
2.2K
1W
LNB
MBR230LSFT1G
C6900
0.22uF
LNB
25V
A_GND
2A
D6900
LNB
30V
D6901-*1
LNB_SX34
40V
D6901
LNB_SMAB34
40V
C6901
0.01uF
50V
LNB
C6912
C6902
1uF
68uF
50V
LNB
close to Boost pin(#1)
LNB_TX
35V
LNB
C6904
0.1uF
50V
LNB
C6903 0.1uF
LNB
A_GND
A_GND
C6905 22000pF
C6906
68uF
35V
LNB
DCDC_GND
LNB
D6902
LNB_SMAB34
40V
D6902-*1
LNB_SX34
40V
A_GND
A_GND
D6903-*1
LNB_SX34
LNB_SMAB34
BOOST
VCP
TCAP
NC_1
TDO
EXTM
TDI
40V
D6903
40V
DCDC_GND
LNB
[EP]
1
2
3
4
5
6
7
GND
28
THERMAL
8
3A
LNB
L6900
33UH
SP-7850_33
2.4A
BFI
VIN
GNDLX
24
25
26LX27
29
IC6900
A8290SETTR-T
LNB
9
10
SDA11ADD12SCL
VREG
LNB
R6901 33
R6900 33
LNB
OPT
C69070.22uF
C6908 27pF
Input trace widths should be sized to conduct at least 3A
Ouput trace widths should be sized to conduct at least 2A
+12V_LNB
A_GND
A_GND
C6911
0.1uF
50V
close to VIN pin(#25)
LNB
NC_9
23
13
NC_2
LNB
27pF
C6909
BFO
IRQ
OPT
22
14
21
20
19
18
17
16
15
DCDC_GND
NC_8
NC_7
BFC
NC_6
NC_5
NC_4
NC_3
+3.3V_NORMAL
R6903
4.7K
LNB
C6910
10uF
25V
LNB
R6904
0
A_GND
+12V
BLM18PG121SN1D
C6917
0.1uF
50V
LNB
L6901
LNB
DCDC_GND
Max 1.3A
+12V_LNB
A_GND
C6918
0.1uF
50V
LNB
R6905
0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
A_GND
I2C_SDA4
I2C_SCL4
LNB
2011.11.21
69
Page 43
FOR COMMERCIAL 12V OUT RS-232C 9 PIN
(OPT:COMMER_EXT_12V)
R7001
100
IC7000
MP5000DQ
COMMERCIAL_12V_CTL
FOR 12V CONTROL (FROM MICOM)
AUDIO OUT JACK
(OPT:COMMER_EXT_AMP)
C7000
470pF
50V
R7000
1K
DV/DT
ENABLE/FAULT
I-LIMIT
SPK_L_OUT_COMMERCIAL
SPK_R_OUT_COMMERCIAL
GND
C7001
1uF
25V
10
9
8
7
6
SOURCE_5
SOURCE_4
SOURCE_3
SOURCE_2
SOURCE_1
+12V
C7002
22uF
25V
C7006
10uF
16V
C7007
10uF
16V
D7000
5.6V
C7003
22uF
25V
D7001
5.6V
12V_COMMERCIAL_OUT
L7000
BLM18PG121SN1D
C7004
0.1uF
50V
R7004
100K
R7005
22K
COMMER_EXT_AMP_JACK
KJA-PH-0-0177
5GND
4L
3DETECT
1R
EAG61030001
1
2
3
4
NC
5
11
VCC
B
JK7000
+3.5V_ST
C
Q7001
MMBT3904(NXP)
E
R7006
10K
12V_EXT_PWR_DET
FOR COMMERCIAL AUDIO OUT
(OPT:COMMER_EXT_AMP)
+24V
L7001
BLM18PG121SN1D
C7005
0.1uF 50V
AUDIO_L_OUT_COMMERCIAL
AUDIO_R_OUT_COMMERCIAL
EXT_AMP_RESET
FOR AMP RESET (MAIN SOC)
EXT_AMP_MUTE
SPK_L_OUT_COMMERCIAL
PATTERN SHOULD BE CONSIDERED (MAX 3W)
SPK_R_OUT_COMMERCIAL
P7000
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMMERCIAL_OPTION
2011.11.21
70
Page 44
LVDS
LVDS_51PIN
P7100
FI-RE51S-HF-J-R1500
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
GND
[51Pin LVDS OUTPUT Connector]
NC
NC
NC
NC
NC
AUO_65_MIRROR
LVDS_SEL
NC
NC
L/DIM_ENABLE
GND
RA0N
RA0P
RA1N
RA1P
RA2N
RA2P
GND
RACLKN
RACLKP
GND
RA3N
RA3P
RA4N
RA4P
GND
BIT_SEL
RB0N
RB0P
RB1N
RB1P
RB2N
RB2P
GND
RBCLKN
RBCLKP
GND
RB3N
RB3P
RB4N
RB4P
GND
GND
GND
GND
GND
NC
VLCD
VLCD
VLCD
VLCD
R7100 33
LGD_2D/3D_CTRL
R7105 33
CP_BOX
R7106 33
CP_BOX
R710733
LGD_32/37_LVDS_PWM
R7108
33
LGD_32/37_LVDS_OPC
2D/3D_CTL
PWM_DIM1
OPC_EN
PANEL_VCC
I2C_SDA1
I2C_SCL1
TXA0N
TXA0P
TXA1N
TXA1P
TXA2N
TXA2P
TXACLKN
TXACLKP
TXA3N
TXA3P
TXA4N
TXA4P
TXB0N
TXB0P
TXB1N
TXB1P
TXB2N
TXB2P
TXBCLKN
TXBCLKP
TXB3N
TXB3P
TXB4N
TXB4P
L7100
BLM18SG121TN1D
LVDS_51PIN
C7100
C7101
10uF
1000pF
16V
50V
OPT
OPT
LVDS_SEL
+3.3V_NORMAL
R7101
3.3K
LVDS_SEL_HIGH
R7102
10K
LVDS_SEL_LOW
BIT_SEL
C7102
0.1uF
50V
OPT
[41Pin LVDS OUTPUT Connector]
LVDS_41PIN
P7101
FI-RE41S-HF-J-R1500
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
R7103
10K
BIT_SEL_LOW
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
GND
NC
NC
NC
NC
NC
NC
NC
NC
GND
RC0N
RC0P
RC1N
RC1P
RC2N
RC2P
GND
RCCLKN
RCCLKP
GND
RC3N
RC3P
RC4N
RC4P
GND
GND
RD0N
RD0P
RD1N
RD1P
RD2N
RD2P
GND
RDCLKN
RDCLKP
GND
RD3N
RD3P
RD4N
RD4P
GND
GND
R7104 33
AUO_2D/3D_CTRL
2D/3D_CTL
TXC0N
TXC0P
TXC1N
TXC1P
TXC2N
TXC2P
TXCCLKN
TXCCLKP
TXC3N
TXC3P
TXC4N
TXC4P
TXD0N
TXD0P
TXD1N
TXD1P
TXD2N
TXD2P
TXDCLKN
TXDCLKP
TXD3N
TXD3P
TXD4N
TXD4P
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LVDS_HIGH_MID
2011.08.11
71
Page 45
LOCAL DIMMING
[To LED DRIVER]
P7600
12507WR-08L
1
2
3
4
5
6
7
8
9
+3.3V_NORMAL
R7600
10K
OPT
R7601
10K
AR7600
33
1/16W
R7606 33
R7607
4.7K
L/DIM0_SCLK
L/DIM0_MOSI
I2C_SCL1
I2C_SDA1
L/DIM0_VS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Page 49
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