Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to LA44B Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
▪ ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate RGB
deviation.
▪ ADC adjustment is OTP (Auto ADC)
4.2.5. EDID DATA
4.2.5.1. North America (PCM)
4.2.5.1.1. FHD Model
■ HDMI 1-FHD-8BIT (C/S : E708)
EDID Block 0, Bytes 0-127 [00H-7FH]
4.2. EDID Download
4.2.1. Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
(1) Since EDID data is embedded, EDID download JIG, HDMI
cable is not need.
(2) Adjust by using remote controller
4.2.3. Download method (using DFT)
※ PC(for communication through RS-232C), UART baud rate:
115200 bps
Command : aa 00 00 (Start Factory mode)
Command : ae 00 10 (Download All EDID)
Command : aa 00 90 (End of Factory mode)
4.2.4. Download method (using Service Remocon)
(1) Press Adj. key on the Adj. R/C.
(2) Select EDID D/L menu.
(3) By pressing Enter key, EDID download will begin
(4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
(5) If Download is failure, Re-try downloads.
※Caution : Wh en EDID Download, must remove HDMI
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 ºC
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
※ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
5.1.5.2. Manual adj. method
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 204 Gray(80IRE) internal
pattern will be displayed)
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
※ CASE
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
► How to adjust
(1) Fix G gain at least 172
Adjust R, B Gain (In Case of Mostly Blue Gain Saturation)
(2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically
6.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
* USB S/W Download (option, Service only)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
7.2. Specification
NoItemMinTypMaxUnitRemark
1Audio practical
max Output, L/R
(Distortion=10%
max Output)
9.0
8.5
10.9
9.3
12.0
9.8WVrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker
(8Ω Impedance)
8. Eye Sensor Function check
(1) Press EYE key of Adj. R/C in dark room
(2) Check below two conditions in dark room
i) Check if Check Result is OK.
ii) Check if the Backlight value is lower than 40
-> When Check Result is OK and Backlight value is lower
than 40, Eye Sensor operates normally.
(3) After coming out of Darkroom, check if Sensor Data value
and Backlight value rise
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In thi s case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
※After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
Power_PD2
2013/05/07
4_CI
Page 25
USB (SIDE)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+5V_USB
3AU 04S-3 05-Z C-(LG )
JK700
USB DOWN STR EAM
C701
5pF
50V
OPT
C703
22uF
10V
C702
5pF
50V
OPT
SIDE_USB1_DM
SIDE_USB1_DP
C700
OPT
22uF
ZD700
10V
5V
1234
5
D700
RCLAMP0502BA
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
USB
13/03/27
7
Page 26
HDMI (REAR 1 / SIDE 1 MHL)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
SHIELD
20
19
18
17
16
15
14
13
12
11
CK+
10
EAG59023302
JK800
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_2
R803
1K
R802
1.8K
VA800
ESD_HDMI1
5V_DET_HDMI_2
R805
3.3K
VA801
ESD_HDMI1
VA802
ESD_HDMI1
MMBT3904(NXP)
Q800
C
E
VA803
ESD_HDMI1
R808
10K
B
R809
10K
R810 100
R811 100
VA804
ESD_HDMI1
D803
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI1_NXP
D804
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI1_NXP
RCLAMP0524PA
D803-*1
1
10
2
9
8
3
7
4
6
5
ESD_HDMI1_SEMTECH
10
9
8
7
6
10
9
8
7
6
RCLAMP0524PA
D804-*1
1
2
3
4
5
ESD_HDMI1_SEMTECH
10
9
8
7
6
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
HDMI_2 MHL
GND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG63530101
JK801
SIDE_HDMI_EMI
RCLAMP0524PA
1
2
3
4
5
ESD_HDMI2_SEMTECH
D805-*1
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
10
9
8
7
6
5V_HDMI_4
VA805
ESD_HDMI2
R812
1.8K
ESD_HDMI2
VA806
RCLAMP0524PA
D806-*1
1
10
2
9
8
3
7
4
6
5
ESD_HDMI2_SEMTECH
5V_DET_HDMI_4
R813
3.3K
VA807
5.6V
OPT
ESD_HDMI2
VA808
ESD_HDMI2
VA809
R814
100
VA810
ESD_HDMI2
VA811
ESD_HDMI2
R815100
R816100
D805
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI2_NXP
D806
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI2_NXP
C800
0.047uF
25V
R817
300K
MHL Spec
10
9
8
7
6
10
9
8
7
6
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
MHL_CD_SENSE
CEC
R804
A2CA1
MMBD6100
D800
100
DDC_SDA_2
DDC_SCL_2
HDMI_CEC
5V_HDMI_2
R800
2.7K
+5V_Normal
R801
2.7K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CEC_REMOTE_S7
5V_HDMI_4
R806
2.7K
+5V_Normal
A2CA1
MMBD6100
D801
R807
2.7K
+3.5V_ST
DDC_SDA_4
DDC_SCL_4
A2CA1
MMBD6100
D802
BODY_SHIELD
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
51U019S-312HFN-E-R-B-LG
JK801-*1
SIDE_HDMI_NON_EMI
HOT_PLUG_DETECT
VDD[+5V]
DDC/CEC_GND
SDA
SCL
RESERVED
CEC
TMDS_CLK-
TMDS_CLK_SHIELD
TMDS_CLK+
TMDS_DATA0-
TMDS_DATA0_SHIELD
TMDS_DATA0+
TMDS_DATA1-
TMDS_DATA1_SHIELD
TMDS_DATA1+
TMDS_DATA2-
TMDS_DATA2_SHIELD
TMDS_DATA2+
NC4_S7LRM
2013/05/07
HDMI_R1_S18_CI
Page 27
SPDIF
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF_OUT
+3.3V_Normal
C1001
1uF
10V
OPT
VINPUT
C1002
68pF
50V
SPDIF-68pF
C1002-*1
47pF
50V
SPDIF-47pF
C1002-*2
18pF
50V
SPDIF-18pF
JST1223-001
GND
VCC
SPDIF
JK1001
1
2
3
Fiber Optic
4
FIX_POLE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
SPDIF
2012/06/12
10
Page 28
LVDS (NON EU)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[51Pin LVDS Connector]
(For FHD 60Hz)
FHD
P1100
FI-RE51S-HF-J-R1500
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
VCOM_SDA
VCOM_SCL
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
FHD
R11110
FHD
R11120
R11130
FHD
LVDS_SEL
+3.3V_Normal
OPT
R1100
3.3K
OPT
R1101
10K
PANEL_VCC
FHD
L1100
120OHM
UBW2012-121F
FHD
C1100
0.1uF
16V
FOR FHD REVERSE(10bit)
Change in S7LR
MIRROR
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-RXBCK-
RXB1+
RXB1-
RXB0+
RXB0-
Pol-change
RXA0+
RXA0-
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXA4+
RXA4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXB3+
RXB3-
RXB4+
RXB4-
FOR FHD REVERSE(8bit)
Change in S7LR
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
MIRROR
Pol-change
RXA4+
RXA4-
RXA0+
RXA0-
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXB4+
RXB4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXBCK-
RXB3+
RXB3-
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
Shift
RXA4-
RXA4+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-RXACK-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXB4-
RXB4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
HD
P1101
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
VCOM_SCL
VCOM_SDA
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
LVDS_SEL
+3.3V_Normal
OPT
R1103
3.3K
OPT
R1104
10K
EU pin assign is different from NON EU.
Because of position of HD wafer.
V-COM I2C
: For FHD 60Hz M+S module - 42LN54(M+S)
+3.3V_Normal
OPT
R1114
R1109
OPT
VCOM_SCL
VCOM_SDA
0
R1108
OPT
0
OPT
R1115
2K
2K
V-COM_SCL
V-COM_SDA
PANEL_VCC
120OHM
HD
L1101
UBW2012-121F
HD
C1101
0.1uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
LVDS_NON_EU
2013/03/21
11
Page 29
ATSC tuner block
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TU3700
TDSS-H501F(B)
B1
B1
12
10
11
A1
SHIELD
NC_1
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
NC_2
6
+B2[1.8]
7
NC_3
8
IF_AGC
9
DIF[P]
DIF[N]
A1
Close to the tuner
C3701
0.1uF
16V
R3732
100
+3.3V_TU
R3733
100K
C3710
0.1uF
16V
R37610
R37600
Close to the tuner
TUNER_RESET
IF_P_MSTAR
IF_N_MSTAR
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
C3738
C3737
0.1uF
100pF
16V
50V
C3716
0.1uF
16V
C3711
C3713
18pF
18pF
50V
50V
+1.8V_TU
R3704 100
should be guarded by ground
R373533
R373633
C3707
100pF
50V
OPT
C3742
20pF
50V
+3.3V_TU
IF_AGC_MAIN
C3708
0.1uF
16V
+3.3V_TU
R3740
1.8K
OPT
C3743
20pF
50V
R3741
1.8K
TU_SCL
TU_SDA
+3.3V_TU
+3.3V_TU
C3717
0.1uF
16V
C3723
22uF
6.3V
L3703
UBW2012-121F
C3725
0.1uF
16V
+3.3V_Normal
C3715
22uF
6.3V
IC3703
AP1117E18G-13
3
IN1ADJ/GND
OUT
2
C3727
0.1uF
16V
+1.8V_TU
C3740
0.1uF
16V
R3766
1
C3741
10uF
10V
85C
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER_NON_EU
2012.06.21NC4_S7LRM
14
Page 30
COMPONENT & AV(COMMON)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
JK1701
PPJ245N2-01
[RD2]E-LUG
6E
[RD2]O-SPRING
5E
[RD2]CONTACT
4E
[WH]O-SPRING
5D
[RD1]CONTACT
4C
[RD1]O-SPRING
5C
[RD1]E-LUG-S
7C
[BL]O-SPRING
5B
[GN/YL]CONTACT
4A
[GN/YL]O-SPRING
5A
[GN/YL]E-LUG
6A
D1707
D1710
D1704
D1705
D1706
5.6V
OPT
D1703
D1708
D1709
5.6V
OPT
R1703
470K
R1704
470K
+3.3V_Normal
R1709
10K
R1705
75
R1706
75
R1712
1K
+3.3V_Normal
R1710
10K
C1704
1000pF
50V
OPT
C1705
1000pF
50V
OPT
R1714
10K
R1715
10K
COMP2_DET
R1713
1K
R1720
12K
R1721
12K
COMP2_R_IN
COMP2_L_IN
COMP2_Pr+
COMP2_Pb+
AV_CVBS_DET
D1712
D1711
R1707
75
R1708
75
OPT
+3.3V_Normal
OPT
R1723
75
COMP2_Y+/AV_CVBS_IN
OPT
IC1700
MM1756DURE
VCC
6
PS
5
OUT
4
IN
1
GND
2
BIAS
3
OPT
C1706
0.1uF
C1708
4.7uF
OPT
C1707
0.1uF
OPT
DTV/MNT_VOUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2013.05.07NC4_S7LRM
REAR_NON_EU_L17_CI
Page 31
AUDIO AMP(TI)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPK_L+
SPK_L-
SPK_R+
SPK_R-
NC4_S7LRM
AMP_TI34_CI
WAFER-ANGLE
4
3
2
1
P5600
2013/05/07
Page 32
MSTART DEBUG_4PIN
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
P3900
12507WS-04L
5
JP_GND2
JP_GND3
1
2
3
4
RGB_DDC_SCL
RGB_DDC_SDA
JP_GND1
JP_GND4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
2012/06/20
MSTAR DEBUG_4PIN39
Page 33
IR/LED and Control
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
10K
R600
100
R601
100
R603
10K
1%
1%
+3.5V_ST
R607
3.3K
+3.5V_ST
OPT
C609
0.1uF
16V
L600
PZ1608U121-2R0TF
C602
0.1uF
OPT
C608
0.1uF
16V
R610
C603
1000pF
50V
16V
SENSOR_SCL
SENSOR_SDA
LED_R/BUZZ
+3.3V_Normal
Digital Eye
R608
1K
1.8K
C604
100pF
50V
R609
1K
Digital Eye
R604 100
Digital Eye
R605 100
Digital Eye
D601
C606
18pF
50V
OPT
D602
OPT
C605
18pF
50V
OPT
OPT
P600
12507WR-08L
1
2
3
4
5
6
7
8
9
P601
12507WR-10L
1
2
3
4
5
6
7
8
9
10
11
R602
KEY1
KEY2
IR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
IR/CONTROL
2013/05/07
46_CI
Page 34
<CHIP Config(LED_R/BUZZ)>
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Boot from SPI CS1N(EXT_FLASH) 1’b0
Boot from SPI_CS0N(INT_FLASH) 1’b1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
2012/09/19
MAIN1_NON_EU51
Page 35
MODEL OPTION
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
IRIN/GPIO4
ARC0
HWRESET
N4
T6
N5
R210 0
OPT
C231 1uF
OPT
IR
HDMI_ARC
SOC_RESET
NC4_S7LRM
MAIN2_NON_EU
2013/05/07
52_CI
Page 36
RS-232C
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C5302
0.1uF
C5303
0.1uF
C5304
0.1uF
C5305
0.1uF
DOUT2
RIN2
C1+
C1-
C2+
C2-
V+
V-
IC5301
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
OPT
R5309
R5302
+3.5V_ST
OPT
D5301
ADUC 20S 02 010L
C5306
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
PM_RXD
PM_TXD
20V
100
R5301
100
OPT
D5302
ADUC 20S 02 010L
20V
0
6M6
1M1
3M3_DETECT
4M4
5M5_GND
KJA-PH-1-0177
JK5301
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
RS232C_PHONE
2012/06/21
53
Page 37
+1.5V_DDR+1.5V_DDR
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
M1_DDR (1DDR)
2012/06/21
54
Page 38
Serial Flash for SPI boot_NON_OS
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
/FLASH_WP
R5505
0
OPT
R5507
10K
R5508
10K
OPT
+3.5V_ST
/SPI_CS
SPI_SDO
+3.5V_ST
OPT
R5503
4.7K
SFLASH_MX
IC1300
MX25L6406EM2I-12G
CS
1
SO/SIO1
2
WP
3
GND
4
8
7
6
5
VCC
HOLD
SCLK
SI/SIO0
+3.5V_ST
R5504
33
0.1uF
C5501
SPI_SCK
SPI_SDI
DO[IO1]
WP[IO2]
GND
SFLASH_WINBOND
IC1300-*1
W25Q64FVSSIG
CS
1
2
3
4
8
7
6
5
VCC
%HOLD[IO3]
CLK
DI[IO0]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
S_FLASH_NON_OS
2013/05/07
55_CI
Page 39
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.