LG 42LB550A-TA, 42LB552A-TB Schematic

Internal Use Only
North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com
LED TV
SERVICE MANUAL
CHASSIS : LB45B
MODEL : 42LB550A 42LB550A-TA
42LB552A 42LB552A-TB
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL68180003 (1402-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING GUIDE ............................................................... 13
BLOCK DIAGRAM .................................................................................. 24
DISASSEMBLY WORKING GUIDE ........................................................ 25
EXPLODED VIEW .................................................................................. 26
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precau­tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this service manual. CAUTION: Do not connect the test xture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some eld-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharg­ing wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some sol­der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads elec­trically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective mate­rial to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or cir­cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri­ate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain­ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed when­ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LB45B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
ea ch dra wing and speci ficat ion by part number in accordance with BOM.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
* HDMI 1.4 with Deep Color is only apply for FHD Model
No. Item Specication Remarks
1. Market NON EU
2. Broadcasting system
BAND PAL(BG,I) NTSC(M) China(DK)
3. Channel Storage
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC Rear (2EA)
6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear (1EA), Except RGB PC Models
7. USB Input MP3, JPEG,Movie Side (1EA)
8. AV Audio Output RCA-RF/AV/HDMI Audio Output Rear (1EA)
9. D-SUB RGB-PC or Service Only Rear (1EA)
10. HDMI Input HDMI-DTV, Only PCM MODE AV input 2EA
11. Audio Input (1EA) AV&Component &PC 2EA
VHF/UHF 01-C69 2~78 C1~C69
Cable S1~S47 1~71 S1~S47
PAL/SECAM B/G/D/K, PAL I, NTSC-M PALB/B
Only for training and service purposes
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Component Video Input(Y, PB, PR)
No Resolution H-freq. (kHz) V-freq. (Hz) Pixel clock (MHz) Proposed
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.47 59.94 27.000 SDTV 480P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45.00 60.00 74.250 HDTV 720P
9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50 148.5 HDTV 1080P
14 1920*1080 67.432 59.94 148.350 HDTV 1080P
15 1920*1080 67.5 60.00 148.5 HDTV 1080P
6. HDMI input
(PC-Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq. (kHz) V-freq. (Hz) Pixel clock (MHz) Proposed
1 640×480 31.469 59.94 25.17 VESA(VGA)
2 800×600 37.879 60.317 40.00 VESA(SVGA)
3 1024×768 48.363 60.004 65.00 VESA(XGA)
4 1280×768 47.776 59.87 79.5 VESA(WXGA)
5 1360×768 47.72 59.799 84.62 VESA(WXGA)
6 1366×768 47.7 60.00 84.62 WXGA
7 1280×1024 63.595 60.00 108.875 SXGA
8 1920×1080 66.647 59.988 138.625 WUXGA
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
7. HDMI input (DTV)
No. Resolution H-freq. (kHz) V-freq. (Hz) Pixel clock(MHz) Proposed Remarks
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
Spec. out but display.2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.469 59.94 27 SDTV 480P
5 720*480 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1280*720 37.5 50.00 74.25 HDTV 720P
10 1920*1080 28.125 50.00 74.25 HDTV 1080I
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50.00 148.5 HDTV 1080P
14 1920*1080 67.43 59.94 148.350 HDTV 1080P
15 1920*1080 67.5 60.00 148.5 HDTV 1080P
16 1920*1080 27 24.00 74.25 HDTV 1080P
17 1920*1080 33.75 30.00 74.25 HDTV 1080P
18 1920*1080 26.97 23.97 74.25 HDTV 1080P
19 1920*1080 33.716 29.976 74.25 HDTV 1080P
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with LB45B chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation. (4) The input voltage of the receiver must keep 100-220 V,
50/60Hz. (5)
The receiver must be operated for over 5 minutes prior to
the adjustment when module is in the circumstance of
above 15 °C.
In case of keeping module is in the circumstance of 0 °C, it should be placed in the circumstance of above 15 °C for 2 hours. In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.
* Caution
When a still image is displayed for 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch an d/ or Cr os s h at ch pa tt ern 0 9ch), there can s ome afterimage in the black level area.
3. ADC Calibration
- An ADC calibration is automatically adjusted from DFT-Jig
- If it needs to adjust manually, refer to appendix.
* ADC Calibration Protocol (RS232)
NO Item CMD 1 CMD 2 Data 0
Enter Adjust MODE
ADC adjust
Adjust Sequence ▪aa 00 00 [Enter Adjust Mode] ▪xb 00 40 [Component1 Input (480i)] ▪ad 00 10 [Adjust 480i Comp1] ▪xb 00 60 [RGB Input (1024*768)] ▪ad 00 10 [Adjust 1024*768 RGB] ▪aa 00 90 End Adjust mode
Adjust ‘Mode In’
ADC Adjust
A A 0 0
A D 1 0
When transfer the ‘Mode In’, Carry the command.
Automatically adjustment (The use of a internal pattern)
4. EDID Download
4.1. Overview
- It is a VESA regulation. A PC or a MNT will display an optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.
4.2. Equipment
- Since EDID data is embedded, EDID download JIG, HDMI cable are not need.
4.3. Download method
- The EDID data is automatically saved.
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Area Option
3. ADC Calibration
9. W/V ADJUST
5. EDID D/L(AC3)
■ 8BIT FHD Large Inch 42LB5**A Models(LB45B)
** HDMI 1 : 256Bytes
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 01 18 01 03 80 A0 5A 78 0A D9 B0 A3 57 49 9C 25 20 11 49 4B 21 08 00 01 01 45 40 61 40 01 01 81 80 30 01 01 D1 C0 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 45 00 08 44 21 00 00 1E 1B 21 50 A0 51 00 1E 30 50 48 88 35 00 BC 88 21 00 00 1C 00 00 00 FC 00 4C 60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD 70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 80 02 03 28 F1 4F 90 07 01 16 02 03 11 12 13 04 14 90 05 20 22 1F 26 11 07 50 09 7F 07 83 01 00 00 68 A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0
C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D
E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
Checksum: Changeable b y total EDID data.
<Large FHD Model> LB45B- 42LB5xx
EDID C/S data
check sum (Hex)
Block 0 C0
Block 1
EDID D/L
HDMI1 NG
HDMI2 NG
HDMI1 OK
HDMI2 OK
Start
EDID D/L
Start
FHD (8Bit)
HDMI
44 (HDMI1) 34 (HDMI2)
Reset
Reset
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. White Balance Adjustment
5.1. Overview
5.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation (2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.
(3) Adj. condition: normal temperature
1) Surrounding Temperature: 25 °C ± 5 °C
2) Warm-up time: About 5 Min◦
3) Surrounding Humidity: 20% ~ 80%
4) Befor e White balance adjustment, Keep po wer on status, don’t power off.
5.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark surrounding. (2) Probe location: Color Analyzer(CA-210) probe should be
within 10 cm and perpendicular of the module surface (80°~ 100°) (3) Aging time
1) After Aging Start, Keep the Power ON status during 5 Minutes.
2) In case of LCD, Back-light on should be checked using no signal or Full-white pattern.
5.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14) (2) Adj. Computer(During auto adj., RS-232C protocol is needed) (3) Adjust Remote control (4) Video Signal Generator MSPG-925F 720p/204-Gray (Model: 217, Pattern: 49) * Color Analyzer Matrix should be calibrated using CS-1000.
5.3. Equipment connection
Co lor Anal yze r
Pro be
RS -232 C
Pattern Gen era to r
Sig nal Sou rce
* If TV internal pattern is used, not needed
** RS-232C Connection Method.
LB45S/LB45R → RGB cable → UART Jig → RS232C cable and USB AM-BM cable → PC(RS232C Port)
RS- 232 C
Co mp ute r
RS- 232 C
.
5.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMD DATA ID
wb 00 00 Begin White Balance adjustment
wb 00 ff
End White Balance adjustment (internal pattern disappears)
Explanation
(2) Adjustment Map
Cool
Medium
Warm
Adj. item
R Gain j g 00 C0 172 G Gain j h 00 C0 192 B Gain j i 00 C0 192 R Cut 64 G Cut 64 B Cut 64 R Gain j a 00 C0 192 G Gain j b 00 C0 192 B Gain j c 00 C0 192 R Cut 64 G Cut 64 B Cut 64 R Gain j d 00 C0 192 G Gain j e 00 C0 192 B Gain j f 00 C0 192 R Cut 64 G Cut 64 B Cut 64
Command
(lower caseASCII) CMD1 CMD2 MIN MAX
Data Range
(Hex.)
Default
(Decimal)
5.5. Adjustment method
5.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-Only key(or POWER ON key). (2) Place optical probe on the center of the display.
- It need to check probe condition of zero calibration before adjustment.
(3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message, check
adjustment status of pre-set mode.(Cool, Medium, Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
5.5.2. LED White balance table
- If Model is Polaris Model, G-gain fix is applied.
(1) Cool Mode
1) Purpose : Especially G-gain fix adjust leads to the luminance enhancement. Adjust the color temperature to reduce the deviation of the module color temperature.
2) Principle: To adjust the white balance without the saturation,
- Adjust the G gain more than 172 (If R gain or G gain is more than 255, G gain can adjust less than 172) and change the others(R/B Gain).(20LB45X model)
- Fix the G gain to 172(default data) and change the others(R/B Gain).(over 22inch model)
3) Adjustment mode : mode - Cool
Only for training and service purposes
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
(2) Medium / Warm Mode
1) Purpose : Adjust the color temperature to reduce the deviation of the module color temperature.
2) Principle: To adjust the white balance without the saturation,
- In Medium mode, Fix to G gain to 192 and change the others(R/B Gain)(20LB45X model)
- Fix the one of R/G/B gain to 192(default data) and decrease the others.
3) Adjustment mode : Two modes - Medium / Warm
5.6. Reference(White Balance Adjustment coordinate and color temperature)
(1) Luminance: 204 Gray, 80IRE (2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
■ The spec of color temperatre and coordinate.
Mode Color Temp Color coordinate Remark
Cool
(C50)
Medium
(0)
Warm (W50)
13,000 K
9,300 K
6,500 K
x = 0.271 (±0.015) y = 0.270 (±0.015)
x = 0.286 (±0.015) y = 0.289 (±0.015)
x = 0.313 (±0.015) y = 0.329 (±0.015)
* Test signal
- Inner pattern for W/B adjust
- External white pattern (80IRE, 204gray)
- AUO/ INX/ COST/ SHARP/ BOE Module which cool spec is 13000K
cool med Warm
x y x y x Y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
6. Tool Option setting & Inspection per countries
(1) Press 'IN START' key at Factory Service remote control. (2) Select 'Tool Option 1'. (3) Punch in the number and press 'OK'. (Each of models has
their number) (4) Correct 'Tool Option2' ~ 'Tool Option5'. (5) Completed adjusting Tool option.
7. Ship-out mode check (In-stop)
▪ After final inspection, press In-Stop key of the Adjustemnt
Remote Control and check that the unit goes to Stand-by mode.
* Note : x,y coordinates are drifted about 0.007 after 30 mins
heat-run. So checking color coordinate within 5-min at total assembly line, consider x,y coordinates might be up to 0.007 than x,y target of each color temperature.
● W/B Table in process of aging time
- LGD Module
(normal line) March ~ December
Aging time Cool Medium Warm
color coordinate x y x y x y
Target 271 270 286 289 313 329 1 0-2 282 289 297 308 324 348 2 3-5 281 287 296 306 323 346 3 6-9 279 284 294 303 321 343 4 10-19 277 280 292 299 319 339 5 20-35 275 277 290 296 317 336 6 36-49 274 274 289 293 316 333 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329
(normal line) January ~ Feburary
Aging time Cool Medium Warm
color coordinate x y x y x y
Target 271 270 286 289 313 329 1 0-2 286 295 301 314 328 354 2 3-5 284 290 299 309 326 349 3 6-9 282 287 297 306 324 346 4 10-19 279 283 294 302 321 342 5 20-35 276 278 291 297 318 337 6 36-49 274 275 289 294 316 334 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329
8. AUDIO output check
8.1. Audio input condition
(1) RF input: Mono, 1 KHz sine wave signal, 100% Modulation (2) CVBS, Component: 1 KHz sine wave signal (0.4 Vrms)
8.2. Specification
Item Min Typ Max Unit Remark
Audio practical max Output, L/R (Distortion =10% max Output)
4.5 5.0 6.0
(1) Measurement condition
W
- EQ/AVL/Clear Voice: Off
Vrms
(2) Speaker (8 Ω Impedance)
9. GND and HI-POT Test
9.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
9.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX) (5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
Only for training and service purposes
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
9.3. Checkpoint
(1) Test voltage
- GND: 1.5 KV / min at 100 mA
- SIGNAL: 3 KV / min at 100 mA (2) TEST time: 1 second (3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Tes t = POWER CORD GND a nd LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms
10. USB S/W Download
(optional, Service only)
* Warning : Do not Download on Power only mode
(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is lower than that of TV set, it didn’t work.
Otherwise USB data is automatically detected. (3) Show the message “Copying files from memory”.
(4) Updating is starting.
11. Optional adjustments
11.1. Manual ADC Calibration
■ Enter ‘EZ ADJUST’ mode by pressing ‘ADJ’ key.
■ Enter Internal ADC calibration mode by pressing ‘OK’ key at ‘3. ADC CALIBRATION’
* Caution: Using ‘P-ONLY’ button of the Factory SVC remote
control when turns TV on.
If you can’t success ADJUST ADC, please confirm ‘Support Int. ADC’ at TOOL OPTION2.
11.2. Manual White balance Adjustment
11.2.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface. (80°~ 100°) (3) Aging time
1) After Aging Start, Keep the Power ON status during 5 Minutes.
2) In case of LCD, Back-light on should be checked using no signal or Full-white pattern.
(5) Updating Completed, the TV will restart automatically. (6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn't have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number.)
Only for training and service purposes
11.2.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14) (2) Adj. Computer(During auto adj., RS-232C protocol is needed) (3) Adjust Remot control (4) Video Signal Generator MSPG-925F 720p/216-Gray (Model: 217, Pattern: 78)
11.2.3. Adjustment
(1) Set TV in Adj. mode using POWER ON. (2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface. (3) Press ADJ key → EZ adjust using adj. R/C → 6. White-
Balance then press the cursor to the right (Key►). When
Key(►) is pressed 216 Gray interna l pattern will be
displayed. (4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value. (5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
■ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner(ON). By selecting OFF, you can adjust using RF signal in 216 Gray pattern.
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
BLOCK DIAGRAM
JK202
IF_N
11
IF_P
10
USB_5V
IF_AGC
Tuner SDA
Tuner SCL
3
9
USB_DP
USB_DN
IR Board
ST_3.5V
Led_PWR
108
KEY2
P40 0
110
KEY1
111
IR
117
IR/KEY
98
99
44
24Mhz
43
40
39
4
52
53
45
B+
TUNER
Audio R-Out
Audio L-Out
37 38
26,33,34 27,35,3622,20,24,33,34
7
5
IC401
To USB
TU_1.8V
M_3.3V
TU_3.3V
A_OUT_12V
Out
Audio
IC302
x4 Gain
OP-AMP
AV2 In
AV1 In
Comp. R/L In
Y,Pb,Pr In
JK101
Module
POWER BOARD
P60 1/602
2 4 1
P70 1
13~1 5
P_ST 3.5V
5
3
P_24V
10
9
LVDS
Panel_Vcc
Q72 0
XXX
Output
RL On
P Dim
Inv. ON
102 105 101
AO3407A
P_12V
IC501
MST6841XP
XXX
HDMI
100
54
18
SPI_CLK
SPI_DI
SPI_CZ
SPI_DO
EEP SCL
EEP SDA
94
97
95
96
85
84
To USB
24C64
IC50 2
IC50 3
8Mbytes
Serial Flash
EEPROM
Main_5V
IC709
MP1497
107
62
30
116 9
77
41
Main_1.2V
IC701
48
50
51 113 112
115
I2S_WS
I2S_MCLK
Main_1.8V
IC711
1.8V REG
Main_3.3V
Q71 0
MP20051
789
35
40
19
32
S_AMP_24V
JK203
SCL/SDA
I2S_SCK
I2S_SDO
Sound AMP
20
31
JK204
Audio_SCL
Audio_SDA
38
10 11
NTP7513
IC301
21
33
18
30
LPF
LPF
P30 1
(
(
(
(
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
400
410
521
540
420
501
500
502
900
530
LV1
820
200
Only for training and service purposes
- 14 -
121
120
A10
A7
A2
Set + Stand
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
EAX65550501
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
LB45B/LT5B
JK101-*1
PPJ239-26
[RD4]E-LUG
6H
[RD4]O-SPRING
5H
[RD4]CONTACT
4H
[WH3]O-SPRING
5G
[YL]CONTACT
4F
[YL]O-SPRING
5F
[YL]E-LUG-S
7F
[RD3]O-SPRING
5E
[RD3]E-LUG-S
7E
[WH2]O-SPRING
5D
[WH2]E-LUG
6D
[RD2]E-LUG
6N
[RD2]O-SPRING
5N
[RD2]CONTACT
4N
[WH1]O-SPRING
5M
[RD1]O-SPRING
5L
[RD1]E-LUG-S
7L
[BL]O-SPRING
5K
[BL]E-LUG-S
7K
[YL/GL]CONTACT
4J
[YL/GL]O-SPRING
5J
[YL/GL]E-LUG
6J
GREEN & YELLOW
JK101
PPJ239-06
COMPONENT / AV IN / AV AUDIO OUT
7H
6H
4H
5G
4F
6F
8F
5E
8E
5D
7D
7N
6N
4N
AV2RIN
AV2LIN
AV2_VIN
MNTROUT
MNTLOUT
COMMONRIN
D102
ZD10 7
20V
ZD10 6
20V
D101
C105 5600pF 50V
C103 5600pF 50V
ZD108
SD05
READY
ZD110 20V
ZD109
20V
C
B
E
READY Q104
MMBT3904(NXP)
C
B
E
READY Q102
MMBT3904(NXP)
ZD105 20V
R116 220K
R113 220K
R112
75
Size check!!
R111
1K
R110
1K
R107 220K
R114
10K
C E
R108
10K
R117
10K
R151 75
READY
Q103
MMBT3904(NXP)
B
C
B
E
R118 12K
R115
12K
C106
10uF
16V
C104
10uF
16V
Q101
MMBT3904(NXP)
R109 12K
C108 470pF 50V
C107 470pF 50V
MUTE_AOUT
POP NOISE
POP NOISE
C102 470pF 50V
AV2_RIN
AV2_LIN
AV2_VIN
MNT_ROUT
MNT_LOUT
MUTE_AOUT
COMMON_RIN
5M
5L
COMMONLIN
COMP_PR
8L
5K
COMP_PB
8K
4J
6J
COMMON_VIN
7J
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT1
D104
D106
D108
D105
D103
D107
ZD102
SD05
READY
ZD101
SD05
READY
ZD100
SD05
READY
ZD104
20V
R104 220K
R103
R102
75
R101
75
R105
10K
R106
12K
C101 470pF 50V
COMMON_LIN
COMP_PR
75
COMP_PB
V-OUT Buffer(DEBUG)
R150 75
READY
Size check!!
COMMON_VIN
AV2_VIN
32/42LB550A
OPT
R122
0
INPUT1
TP101
DEBUG
R120 75
P_12V
C E
DEBUG
MMBT3904(NXP) Q105
B
DEBUG
R123
220
R121
33
DEBUG
MNT_VOUT
2013/08/15
1 7
EAX65550501
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
LB45B/LT5B
I2C Control
KJA-PH-1-0177
JK201
6 M6
1 M1
3 M3_DETECT
4 M4
5 M5_GND
DEBUG
P201
12505WS-04A00
1
2
3
4
5
DSUB_SCL
USB(SIDE)
3AU04S-305-ZC-(LG)
JK202
1234
USB DOWN STR EAM
READY
READY
ZD221
ZD220
30V
5
30V
R205
0
W/O UART IC
USB_DN
USB_DP
With UART IC
R204
0
W/O UART IC
DSUB_SDA
Close to SIDE_USB
OPT
C220 10uF 10V
R201 100
+3.5V_ST
C221 22uF 10V
W/O UART IC
R206
100
R202 100
With UART IC
PM_RXD
RM_TXD
L220
120OHM
0.1uF
VCC
GND
+3.5V_ST
C201
P202
12507WS-04L
1
2
3
4
5
GND
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
+5V_USB
With UART IC
IC201
MAX3232CDR
16
15
14
13
12
11
10
9
EAN41348201
HDMI(REAR)
R231 1K
+3.5V_ST
10K
R245
READY
ZD230
READY ZD231
GND
IP4283CZ10-TBA ESD_HDMI2_IP4283
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+
5
IP4283CZ10-TBA
ESD_HDMI2_IP4283
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+
5
R242 1K
D241
D234
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
D235
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
HDMI1_DET
30V
READY
+5V_USB
R232
2.7K
READY ZD232
R233
2.7K
R236 100
R237 100
READY ZD233
HDMI1_CK­HDMI1_CK+
HDMI1_D0­HDMI1_D0+
HDMI1_D1­HDMI1_D1+
HDMI1_D2­HDMI1_D2+
HDMI1_SDA HDMI1_SCL
+3.5V_ST
10K
READY ZD240
READY ZD241
TMDS_CH1-
TMDS_CH1+
TMDS_CH2-
TMDS_CH2+
TMDS_CH1-
TMDS_CH1+
TMDS_CH2-
TMDS_CH2+
GND_1
GND_1
D242
D244
IP4283CZ10-TBA
ESD_HDMI2_IP4283
1
2
3
4
5
D245
IP4283CZ10-TBA
ESD_HDMI2_IP4283
1
2
3
4
5
R246
30V
READY
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
HDMI2_DET
+5V_USB
R243
R244
2.7K
2.7K
READY ZD242
READY ZD243
HDMI2_CK­HDMI2_CK+
HDMI2_D0­HDMI2_D0+
HDMI2_D1­HDMI2_D1+
HDMI2_D2­HDMI2_D2+
R247 100
R248 100
HDMI2_SDA HDMI2_SCL
B
HPD
19
+5V_POWER
18
DDC/CEC_GND
17
SDA
16
SCL
15
NC
14
CEC
13
CLK-
12
CLK_SHIELD
11
CLK+
10
DATA0-
9
DATA0_SHIELD
8
DATA0+
7
DATA1-
6
DATA1_SHIELD
5
DATA1+
4
DATA2-
3
DATA2_SHIELD
2
DATA2+
1
C
Q230
MMBT3904(NXP)
E
R230
HDMI1_HPD
C1+
1
V+
2
C1-
3
C2+
4
C2-
5
V-
6
DOUT2
7
RIN2
8
C202
0.1uF
C203
0.1uF
C204
0.1uF
C205
0.1uF
With UART IC
With UART IC
With UART IC
With UART IC
10K
SHIELD
20
JK203
HDMI2_HPD
R241 10K
SHIELD
20
B
HPD
19
+5V_POWER
18
DDC/CEC_GND
17
SDA
16
SCL
15
NC
14
CEC
13
CLK-
12
CLK_SHIELD
11
CLK+
10
DATA0-
9
DATA0_SHIELD
8
DATA0+
7
DATA1-
6
DATA1_SHIELD
5
DATA1+
4
DATA2-
3
DATA2_SHIELD
2
DATA2+
1
C
Q240
MMBT3904(NXP)
E
JK204
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT2
ESD_HDMI_IP4294
D234-*1 IP4294CZ10-TBR
10
1
9
2 3
8
4
7 6
5
ESD_HDMI_IP4294
D235-*1 IP4294CZ10-TBR
10
1
9
2 3
8
4
7 6
5
32/42LB550A
INPUT2
ESD_HDMI_IP4294
D244-*1 IP4294CZ10-TBR
10
1
9
2 3
8
4
7 6
5
ESD_HDMI_IP4294
D245-*1 IP4294CZ10-TBR
10
1
9
2 3
8
4
7 6
5
2013/08/15
2 7
EAX65550501
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
LB45B/LT5B
AUAMP_SDA
AUAMP_SCL
+3.3V_M
I2S_SDO
I2S_WS
I2S_SCK
R308
4.7K
R309
4.7K
R306 100
R307 100
SW_RESET
C320
1000pF
50V
I2S_MCLK
NC_1
NC_2
GND NC_3 DVDD
WCK
BCK
SDA
R304 100
VDD_IO
[EP]GND
1 2 3 4 5 6 7 8 9 10
SCL
CLK_I
GND_IO
39
40
THERMAL
41
11
12
38
13
L301
+3.3V_M
BLM18PG121SN1D
C321 10uF
6.3V
C322
0.1uF 16V
VDD_PLL
C301
0.1uF 16V
OPT
C302
C303
0.1uF 1uF
16V
10V
SDATA
C305 33pF 50V
R301 100
R302 100
R303 100
C306 33pF 50V
FAULT
MONITOR_0
50V
C319
22000pF
PGND1A
BST1A
RESET
AD
34
35
36
37
IC301
NTP7514
0x54
14
15
16
17
BST2B
PGND2B
MONITOR_1
MONITOR_2
C308
22000pF
50V
PVDD1A
OUT1A
32
33
18
19
OUT2B
PVDD2B20PVDD2A
PVDD1B
31
30 29 28 27 26 25 24 23 22 21
+24V_AMP
C318
0.1uF 50V
OUT1B PGND1B BST1B VDR1 NC_4 AGND VDR2 BST2A PGND2A OUT2A
C309
0.1uF 50V
C317 10uF 35V
+24V_AMP
C310 10uF 35V
C315 22000pF 50V
C311 22000pF 50V
C31 2 1uF 10V
R313
12
C325 390pF
50V C326
390pF 50V
R315
12
R317
12
C327 390pF
50V
C328 390pF
50V
R319
12
C314 1uF 10V
R314
R316
12
R318
R320
TAIYO YUDEN
L303-*1
10.0uH
ABCO
12
12
12
L303 10uH
L304 10uH
ABCO
TAIYO YUDEN
L304-*1
10.0uH
TAIYO YUDEN
L305-*1
10.0uH
ABCO L305 10uH
L306
10uH
ABCO
TAIYO YUDEN
L306-*1
10.0uH
C329
0.47uF 50V
C333
0.47uF
50V
C330
0.1uF 50V
C331
0.1uF 50V
C334
0.1uF
50V
C335
0.1uF
50V
R322
4.7K
R323
4.7K
R324
4.7K
R325
4.7K
SPK_L+
SPEAKER_L
SPK_L-
SPK_L+ SPK_L­SPK_R+ SPK_R-
SPK_R+
SPEAKER_R
SPK_R-
JP304
JP303
JP302
JP301
SPK_L+
SPK_L-
SPK_R+
SPK_R-
4
3
2
1 .
SMAW250-H04R
P301
POWER_DET
READY
R311
100
AUDIO_OUT AMP : GAIN X 4
IC302
AS324MTR-E1
MNT_LOUT
MNT_ROUT
C350
0.1uF 16V
C355
0.1uF 16V
P_12V
Q350 MMBT3904(NXP)
C
B
E
R350
4.7K
MNT_L_AMP
MNT_R_AMP
P_12V
Q351 MMBT3904(NXP)
C
B
E
R35 9
4.7 K
R351 1K
C351 6800pF 50V
R358
C356 6800pF 50V
R354 5.6K
1K
10K
R352
C352 33pF 50V
R355
5.6K
33pF
C354
R356
10K
P_12V
50V
R353
6.8K
C353
0.1uF 16V
R357
6.8K
1 OUT1
2 INPUT1-
3 INPUT1+
4 VCC
5 INPUT2+
6 INPUT2-
7 OUT2 8OUT3
14OUT4
13INPUT4-
12INPUT4+
11GND
10INPUT3+
9INPUT3-
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUDIO
32/42LB550A
AUDIO
2013/08/15
3 7
EAX65550501
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
LB45B/LT5B
A1
A1
47
SHIELD
PAL
TU401 TDJH-G101D
B1[+3.3V]
1
NC_1
2
IF_AGC
3
SCL
4
SDA
5
IF[P]
6
IF[N]
7
NC_2
8
NC_3
9
B1
B1
R413
10
PAL
R414
10
PAL
Close to the tuner
IF
close to the tuner pin.
C406
C405
100pF
0.1uF
50V
16V
R412
C410
0.1uF 16V
100
NTSC
R413-*1 0
NTSC R414-*1 0
A1
A1
47
SHIELD
C404 22uF
6.3V
NTSC
TU403 TDJH-H101F
B1[+3.3V]
1
NC_1
2
IF_AGC
3
SCL
4
SDA
5
IF[P]
6
IF[N]
7
NC_2
8
NC_3
9
B1
B1
+3.3V_TU
BLM18PG121SN1D
C412
C411
0.1uF
10uF
16V
6.3V
IF_AGC
should be guarded by ground
L401
IF_P
IF_N
+3.3V_M
C402 47pF 50V
C403 47pF 50V
R405
33
R406
33
+3.3V_TU
R407
2.2K
R408
2.2K
TUNER_SCL
TUNER_SDA
KEY1
KEY2
IR/LED+Control
+3.5V_ST
R422
R421
10K
10K
C423
0.1uF
OPT
C421
0.1uF
C424 1000pF 50V
16V
LED
LED_R_Zener
ZD404
IR_Zener
ZD403
C426
100pF
50V
OPT
C425
0.1uF 16V
P421
12507WR-10L
1
2
3
4
5
6
7
8
9
10
11
ZD401
SD05
ZD402
SD05
+3.5V_ST
R423
3.3K OPT
IR
OPT
C422
0.1uF
L421
BLM18PG121SN1D
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER & IR
32/42LB550A
TUNER & IR
2013/08/15
4 8
Loading...
+ 40 hidden pages