LG ML-03JA, 37LP1DA-ZA Service Manual

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : ML-03JA

MODEL : 37LP1DA-ZA

website:http://biz.LGservice.com

e-mail:http://www.LGEservice.com/techsup.html

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CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION........................................................................................6

TIMING CHART........................................................................................11

ADJUSTMENT INSTRUCTION ...............................................................12

SVC REMOCON ......................................................................................19

TROUBLE SHOOTING............................................................................20

BLOCK DIAGRAM...................................................................................30

WIRING DIAGRAM..................................................................................32

EXPLODED VIEW .................................................................................. 33

EXPLODED VIEW PARTS LIST..............................................................34

REPLACEMENT PARTS LIST ............................................................... 35

SVC. SHEET ...............................................................................................

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500

F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500

F to 600 F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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1. Application range

This specification is applied to ML-03JC chassis.

2. Requirement for Test

Testing for standard of each part must be followed in below condition.

(1) Temperature: 25°C ± 5°C (CST 40°C ± 2°C) (2) Humidity: 65% ± 10% (3) Power: Standard input voltage (AC 100-240V, 50/60Hz) (4) Measurement must be performed after heat-run more than

20min.

(5) Adjusting standard for this chassis is followed a special

standard.

3. Test and Inspection Method

3.1 Capacity : Follow LG electronics TV Testing Standard.

3.2 Another Requite Standard EMI : Following CE Standard(EN 55020) SAFETY : Following CB Standard(EN55013)

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

3.General Specification

No Item Specification Remark

Min Typ Max Unit

1. Video Input applicable system 1) PAL/SECAM-BG EU/Non-EU(PAL Market)

2) PAL/SECAM-DK

3) PAL-I

4) SECAM-L/L'

5) NTSC-M

6) PAL-N/M 6) 7) South America Market

7) NTSC-M

7) South America except other NTSC Market

2. AV input System 1) PAL

2) SECAM

3) NTSC 3.58 / 4.43

3. Available Channel 1) VHF : E5 - E12 PAL UHF : E21 - E69 CATV : S1 - S20 HYPER : S21 - S41

2) L/L' VHF : B, C, D France

3) VHF : 2~13 NTSC UHF : 14~69 CATV : 1~125

4) DVB-T : UHF ID TV Other : S42~S47 (U1 U6)

4. PC Signal Input (RGB Input) VGA Refer to Table 1 SVGA XGA(1024 x 768) WXGA (1360x 768)

5. Input Voltage AC 100 ~ 240 V/50Hz, 60Hz

6. Market EU / Non EU

7. Active Display Size (Diagonal) H: 697.685

V: 392.256 [mm] Active Size

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No Item Specification Remark

Min Typ Max Unit

8. Operating Temperature 0 40 Deg Humidity : 50% (Temp : 40°C)

9. Operating Humidity 85 %

10. Storage Temperature -20 60 Deg

11. Storage Humidity 85 %

12. LCD Panel Model Name LG Philips LCD Feature TFT Active Matrix LCD panel Outline Dimension 877.0 x 516.8 x 55.5 [mm] Aspect Ratio Wide (16:9) Resolution 1366 x 768 Pixel Pitch 0.200 x 0.600 x RGB [mm] Weight TBD g

13. Lamp Backlight System EEFL type Life Time : Quantity EA Until brightness of lamp Power Consumption

88.8 TBD W goes to half of its Life Time 50,000 hrs initial brightness. Operating Voltage Vrms Operating Current mA

14. Weight 21.5 22.5 23.5 kg TV + Speaker

15. Size of Outline (H)501.6mmX(W)1051mmX(D)109mm mm TV + Speaker

16. SPEAKER Impedance 8

Tweeter - 8

Regularity Output Power 15+15 W

17. Power On Time 9 Sec Stand by power on time

18. RS-232C 1 EA S/W Download Half Scart 1 EA EU Full Scart 1 EA EU RF Input(Analogue) 1 EA UK

2 EA Non UK(2 TUNER) DTV ID TV Only UK AV Input 1(EU) Side

2(Non EU/NTSC) Rear/Side S-AV Input 1 Rear Component input 1 EA Rear (option)

Component Audio L,R 1 EA Rear

IR Input

1: Cable IR(Cable IR First of all)

Rear

PERI TV Connector Full SCART : 1 Rear (EU)

Half Scart : 1 DVI Digital Input 1 EA DVI-I DVI Analogue Input RGB Input HDMI Input 1 EA(2 slot) X-STUDIO 0 DVI Audio Input 1 EA Stereo A/V Out 1 EA Non EU/NTSC 2 Carrier Stereo BG, DK NICAM Stereo BG, I, LL'

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No Item Specification Remark

Min Typ Max Unit 2 Carrier Dual BG, DK NICAM Dual BG, I, LL' DW(Double Window) Mode Enable MW(Multi Window) Mode Enable Film Mode Enable Progressive Scan Enable Motion Detection Enable Dolby Virtual Enable SRS WOW Enable Ez-pip Enable

19. Power System PFC(power factor correction) & SMPS

<Table 1.> RGB and DVI-PC Input Mode

- Vertical Frequency : Standard ± 0.5 Hz

- Vertical Lines : Standard ± 7Lines

No Resolution H-freq(KHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 720x400 31.469 70.08 28.32 DOS

2. 720x400 37.927 85.03 35.50 DOS

3. 640x480 31.469 59.94 25.17 VESA(VGA)

4. 800x600 37.879 60.31 40.00 VESA(SVGA)

5. 1024x768 48.363 60.00 65.00 VESA(XGA)

6. 1280x768 47.693 60.00 80.125 VESA(WXGA) svc option

7. 1360x768 49.020 60.00 84.625 VESA(WXGA)

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< Table 2.> Scart Arrangement 1.(Full Scart)

Pin Signal Signal Level Impedance

1 Audio Output B (right) 0.5 Vrms < 1 2 Audio Input B (right) 0.5 Vrms > 10 3 Audio Output A (left) 0.5 Vrms < 1 4 Ground (audio) - 5 Ground (blue) - 6 Audio input A (left) 0.5 Vrms > 10 7 Blue input 0.7 V 75 8 Function Select (AV control) High (9.5 - 12V) - AV Mode

Mid (5 - 8V) - Wide Screen > 10

Low (0 - 2V) - TV Mode

9 Ground (Green) - 10 Comms Data 2 11 Green input 0.7 V 75 12 Comms Data 1 13 Ground (Red) - 14 Ground (Blanking) - 15 Red input 0.7 V 75 16 RGB Switching Control High (1 - 3V) - RGB 75

Low (0 - 0.4V) -Composite 17 Ground (Video input & Output) - 18 Ground (RGB Switching Control) - 19 Video output (Composite) 1V including sync 75 20 Video input (Composite) 1V including sync 75 21 Common ground (Shield) - -

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< Table 3.> Scart Arrangement 2.(Half Scart)

Pin Signal Signal Level Impedance

1 Audio Output B (right) 0.5 Vrms < 1 2 Audio Input B (right) 0.5 Vrms > 10 3 Audio Output A (left) 0.5 Vrms < 1 4 Ground (audio) - 5 Ground (blue) - 6 Audio input A (left) 0.5 Vrms > 10 7- - 8 Function Select (AV control) High (9.5 - 12V) - AV Mode

Mid (5 - 8V) - Wide Screen > 10

Low (0 - 2V) - TV Mode

9 Ground (Green) - 10 Comms Data 2 11 - - 12 Comms Data 1 13 Ground (Red) - 14 Ground (Blanking) - 15 Red input 0.7 V 75 16 - - 17 Ground (Video input & Output) - 18 - - 19 Video output (Composite) 1V including sync 75 20 Video input (Composite) 1V including sync 75 21 Common ground (Shield) - -

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TIMING CHART

VIDEO

SYNC

MODE

H / V

Sync

Polarity

Frequency

[kHz]/[Hz]

Total

Period( E )

Display

( A )

Sync

( D )

Resolution

Dot Clock

[MHz]

Back

Porch(F)

Front

Porch ( B )

1 H(Pixels) + 25.175 31.468 800 640 16 96 48 640 x 350

V(Lines) - 70.090 449 350 37 2 60

2 H(Pixels) - 28.324 31.469 900 720 18 108 54 720 X 400

V(Lines) + 70.082 449 400 13 2 34

3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480

V(Lines) - 59.94 525 480 10 2 33

4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480

V(Lines) - 75 500 480 1 3 16

5 H(Pixels) - 36.0 43.269 832 640 56 56 80 640 x 480

V(Lines) - 85.008 509 480 1 3 25

6 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600

V(Lines) + 60.317 628 600 1 4 23

7 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600

V(Lines) + 75.0 625 600 1 3 21

8 H(Pixels) + 56.25 53.674 1048 800 32 64 152 800 x 600

V(Lines) + 85.061 631 600 1 3 27

9 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624

V(Lines) +/- 74.55 667 624 1 3 39

10 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768

V(Lines) - 60.004 806 768 3 6 29

11 H(Pixels) + 78.75 60.023 1312 1024 16 96 176 1024 x 768

V(Lines) + 75.029 800 768 1 3 28

12 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024

V(Lines) + 60.02 1066 1024 1 3 38

13 H(Pixels) + 79.50 47.776 1664 1280 64 128 192 1280 x 768

V(Lines) - 59.870 798 768 3 7 20

(SVC OP TION)

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1. Scope of Application

This standard is applied to the 37" Wide I-DTV manufactured in the monitor factory or its equivalents.

2. Adjustment

2.1 Summary of adjustment We took a measure so that adjustment can be automatically done by use of factory automation equipment but manual adjustment will be done in principle where error occurs.

2.2 Order of adjustment (For adjustment standard, adjustment commands, sees Command Table)

2.2.1 Adjustment Line Process

- Connect input signal to the 24Pin DVI-I Jack

by using the D-sub to DVI-I Cable.

- Select INPUT value as DVI-PC.

- Adjustment preparation: Check adjustment

commands properly operate and operation status by mode

- Check a normal gray color is embodied by

entering the 16 Gray Scale pattern.

2.2.2 Total Assembly Line Process

- Preliminary operation: Test-run for more than

15 minutes with signal maintained.

- Connect input signal to the 24Pin DVI-I Jack

by using the D-sub to DVI-I Cable.

- Select INPUT value as DVI-PC.

- Default value before adjustment: Contrast

shipment conditions, Brightness shipment conditions. (Setting to PSM-Standard)

2.2.3 Operation status check

2.2.3.1 Operation mode: Check designated mode accurately operates.

2.2.3.2 Check of adjustment status and operation: Check the screen adjustment standards are met.

- Check of Analog/Digital screen status: Check the screen status is good in following mode.:

Designation mode:

- 800x600(75Hz)-No.2 mode,1024x768(60Hz)No.12 mode, 1360x768 (60Hz)-No. 17 mode

2.2.3.3 Check of H/V Position, Clock, Clock

Phase Auto Calibration operation. Enter same pattern as for adjustment in the Mode 10(1024x768,60Hz) and check that normal operation is done by varying H/V Position, Clock and Clock Phase respectively.

Check that normal operation is done by operating Auto Calibration with the Clock and Clock Phase varied.

ADJUSTMENT INSTRUCTION

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*Check of OPTION DATA Setting (SVC MODE)

- Explanation of SVC Menu EEPROM Option items

No Item

Condition

Remark

Option0

1 200PR 0 0 : 100 Program

1 : 200 Program

2 China + Aus 0 0 : Other area OFF

1 : China, Australia ON

3 Teletext 1 0 : Text Off

1 : Text On

4 Top 1 0 : TOP OFF

1 :TOP ON

5 ACMS 1 0 : ACMS On

1 : ACMS Off

6 I/II Save 0

0 : Ch. Sound Non Memory 1 : Ch. Sound Memory

7 A2 Stereo 1

0 : FM Stereo/Dual Automatic recognition 1 : For FM, only MONO is recognized

8 System BGIDK BGIDK : BG/I/DK

BGIDKM

BGIDKM : BG/I/DK/M

Option1

1 Scart 1

0 : SCART OFF 1 : SCARTON

2 Sound Curve 0 0 : Other area OFF

1 : Middle Asia Vol ON

3 HDEV 0 0 : HDEV OFF

1 : HDEV ON

No Item

Condition

Remark

4 OSD Lan 0 0 : Eng Only

1 : 1 : 7 countries (7 countries in West Europe) 2: 11 countries (West Europe + Northern Europe) 3 : Farsi 4: Arab 5: Urdu6 : English Hindi 7 : East Asia4 8 : English Tha 9 : English China

Option2

1 Download 0 0: Download disable

1: Download enable

2 SVC CURSOR 0 0: navigation keys disable

1: navigation keys enable

3 RS232C 1 0 : STI5516

1 : PW181 2 : M2

4 AI Control ON ON : AI ON

OFF : AI OFF

5 TEXT Language 0 0 : WEST EU

1 : EAST EU1 2 : TURKEY EU 3 : EAST EU2 4 : CYRILLIC1 5 : CYRILLIC2 6 : CYRILLIC3 7 : TRUK GRE1

1. Service Menu Overview

2. RGB Menu

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Service Menu

RGB Menu MSP Menu NSP Menu Option 0 Menu Option 1 Menu Option 2 Menu CSM Menu X-STUDIO Menu

Author : L.K.H. Input AV1 PW Version 2.09 Ucom Version 1.07

RGB Menu

AutoGray 0 R Gain 118 G Gain 120 B Gain 108 R Offset 70 G Offset 42 B Offset 63

Input RGB-PC PW Version 3.00 Ucom Version 3.00

If you press the menu button of remote control and the menu key of keypad till more 5 seconds simultaneously. The service menu OSD will appear. This service menu contain the RGB, MSP, NSP menus and 3 optional menus that is Option 0,1,2.

If you want to correct the difference of colour gain of AD converter or set the PC mode R,G,B gain and componet Y,U,V gain you use the AutoGray. First of all, You carry out 16Gray type display (XGA 60HZ) in PC Mode of TV set. Secondly, You change the AutoGray data from '0' to '1'. By doing that, the color setting of TV set is automatically done. The RGB gain and offset values are not fixed , they get changed every time.

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3. MSP Menu

4. NSP Menu

MSP Menu

FM Prescale 15 Nicam Prescale 58 Scart Prescale 6 IIS3 Prescale 4 Scart1 Volume 127 Scart2 Volume 127 MDB Strenth 0 MDB Harmonics 0 MDB High Pass 4 MDB Low Pass 6 MDB Limit 0

PW Version 3.00 Ucom Version 3.00

NSP Menu

Port1&2 MAP 129 Master Vol 224 Channel1 Vol 207 Channel2 Vol 207 Modu Index 181

PW Version 3.00 Ucom Version 3.00

FM Prescale decides input signal level of FM audio signal. It is related to main Volume.

Nicam Prescale decides input signal level of Nicam audio signal. Scart Prescale decides output signal level to speaker volume which is

coming from SCART input. IIS3 Prescale decides signal level of IIS3 signal line.

It decides output signal level to speaker volume which is coming from Digital sound input.

Scart1 Volume decides output level of Scart1(Full). Scart2 Volume decides output level of Scart2(Half).

MDB means medium and low bass. And default data is the same as shown in picture

Note : Don't change these settings without consulting audio experts or

senior research engineers.

Port1&2 MAP means the balance of sound between right and left speaker.

Master Vol decides the main volume of each mode. Channel1 Vol decides the volume of Left channel.

Channel2 Vol decides the volume of Right channel. Modu Index : Prescaler value And default data is the same as shown in picture

Note : Don't change these settings without consulting audio experts or

senior research engineers.

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5. Option 0 Menu

6. Option 1 Menu

Option 0 Menu

200PR 0 China+Aus 0 Teletext 1 TOP 1 ACMS 1 I II Save 1 A2 Stereo 1 System BGIDK

All Value 062 Input RGB-PC PW Version 3.00 Ucom Version 3.00

Option 1 Menu

Scart 1 Sound Curve 0 Hi Deviation 0 OSD Language 0

English Only

Scart 1 Sound Curve 0 Hi Deviation 0 OSD Language 0

English Only

All Value 128 Input RGB-PC PW Version 3.00 Ucom Version 3.00

200PR : In China, You have to change 200PR data to '1' because

China has many channels in broadcast system.

China+Aus : In China or Australia, you have to change China+Aus data

to '1' because these two countries have different broadcast systems.

Teletext : If you want to see broadcasted text then you have to

change Teletext data to '1'.

TOP : If you want to use the Top option in Teletext, you have to

change Top data to '1'.

ACMS : If you want to use the auto channel memory system for

storing channels while auto programming, you have to change ACMS data to '1'.

I IISave : In Europe and Eastern Europe, you have to change 'I II

Save' to '0'. For other areas it is '1'.

A2 Stereo : A2 STEREO means GERMAN 2-carrier system(DUAL FM

System).

System : The system setting is stored according to locations. If the

set is used in europe or eastern europe except France then system setting is set to be BG/I/DK.

Scart : Normally this data is set to '1' in Europe. Sound curve : the value of this feature is set according to the region

that is 0 for europe and 1 for middle asia and other regions.

Hi Deviation : In the region where sound signal is over modulated

causing damage to sound system we set the value for Hi Deviation to 1.

OSD Language : You can select the language of OSD display as per

your convenience, for example '0' for English.

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7. Option 2 Menu

8. CSM Menu

Option 2 Menu

DownLoad 0 SVC CURSDR 0 RS232C 2 M2 : Press

to ISP AI Control ON Text Language 0

WEST EU

DownLoad 0 SVC CURSDR 0 RS232C 2 M2 : Press

to ISP AI Control ON Text Language 0

WEST EU

All Value 032 Input AV1 PW Version 2.09 Ucom Version 1.07

CSM Menu

R Gain 45 G Gain 40 B Gain 27 Sub Contrast 139 Sub Brightness 183

Input AV1 PW Version 2.09 Ucom Version 1.07

DownLoad : While downloading is performed for updating the

software the main Micom should not communicate with other Ics therefore to cut off the communication between main Micom and other Ics we set the value of Download to '1'.

SVC Cursor : This setting disables or enables the working of

navigation(arrow) keys while servicing the set. The value is set to '0' for disable and '1' for enable.

RS232C : This option is used while updating Scalar,

uController(M2) or Mpeg decoder Ics, it works as a switch between these three.

Text Languange : You can select the language of Text display as per

your convenience, like WEST EU etc.

RGB Gain : These fields represents the setting of colour gain

selected by user. It can also be changed through OSD display

Sub Contrast : It is used to set the value of Sub Contrast Sub Brightness : It is used to set the value of Sub Brightness

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9. X-Studio Menu

X-STUDIO Menu

X-STUDIO Version

1.18

X-STUDIO Language

English X-STUDIO ISP Press

to start ISP

X-STUDIO Version

1.18

X-STUDIO Language

English X-STUDIO ISP Press

to start ISP

Input AV1 PW Version 2.09 Ucom Version 1.07

X-Studio Version : It shows the programme version of X-studio. X-Studio Language : This field shows the X-studio OSD language. X-Studio ISP : This field shows that X-studio memory will be

ready for ISP after selecting this option and pressing ok

- 19 -

SVC REMOCON

NO KEY FUNTION

REAMARK

1 POWER 2 POWER ON 3 MUTE

4 P-CHECK 5 S-CHECK 6 ARC 7 CAPTION 8 TXT 9 TV/AV 10 TURBO SOUND 11 TURBO PICTURE

12 IN-START

13 ADJ 14 MPX 15 EXIT 16 APC(PSM) 17 ASC(SSM) 18 MULTIMIDIA 19 FRONT-AV 20 CH 21 VOL 22 ENTER

23 PIP CH-(OP1)

24 PIP CH+(OP2)

25 PIP SWAP(OP3)

26 PIP INPUT(OP4)

27 EYE 28 MENU

29 IN-STOP 30 STILL

31 TIME

32 SIZE

33 MULTI PIP

34 POSITION

35 MODE 36 PIP 37 TILT 38 0~9

To turn the TV on or off To turn the TV on automatically if the power is supplied to the TV. (Use the POWER key to deactivate): It should be deactivated when delivered. To activate the mute function. To check TV screen image easily. To check TV screen sound easily To select size of the main screen (Normal, Spectacle, Wide or Zoom) Switch to closed caption broadcasting To toggle on/off the teletext mode To select an external input for the TV screen To start turbo sound To start turbo picture To enter adjustment mode when manufacturing the TV sets. To adjust the screen voltage (automatic): In-start

mute Adjust AV(Enter into W/B adjustment mode) W/B adjustment (automatic): After adjusting the screen W/B adjustment Exit two times (Adjustment completed) To enter into the adjustment mode. To adjust horizontal line and sub-brightness. To select the multiple sound mode (Mono, Stereo or Foreign language) To release the adjustment mode To easily adjust the screen according to surrounding brightness To easily adjust sound according to the program type To check component input To check the front AV To move channel up/down or to select a function displayed on the screen. To adjust the volume or accurately control a specific function. To set a specific function or complete setting. To move the channel down in the PIP screen. To use as a red key in the teletext mode To move the channel in the PIP screen To use as a green key in the teletext mode To switch between the main and sub screens To use as a yellow key in the teletext mode To select the input status in the PIP screen To use as a blue key in the teletext mode To set a function that will automatically adjust screen status to match the surrounding brightness so natural color can be displayed. To select the functions such as video, voice, function or channel. To set the delivery condition status after manufacturing the TV set. To halt the main screen in the normal mode, or the sub screen at the PIP screen. Used as a hold key in the teletext mode (Page updating is stopped.) Displays the teletext time in the normal mode Enables to select the sub code in the teletext mode Used as the size key in the PIP screen in the normal mode Used as the size key in the teletext mode Used as the index key in the teletext mode (Top index will be displayed if it is the top text.) To select the position of the PIP screen in the normal mode Used as the update key in the teletext mode (Text will be displayed if the current page is updated.) Used as Mode in the teletext mode To select the simultaneous screen To adjust screen tilt To manually select the channel.

Shortcut keys Shortcut keys Shortcut keys

Use the AV key to enter the screen W/B adjustment mode.

Shortcut keys Shortcut keys

Shortcut keys

- 20 -

TROUBLESHOOTING(IMAGE)

No image

Attach the input cable(s)

Push the POWER ON key

Is the Set ON?

Is the input cable

attached?

Component / S-Video

Replace SideAV board

Correct them

What is

the input signal

mode?

Check the

Input Y, Cb, Cr

At the pin no.5,7,9 of

IC-AN15865 on

Jack board

Check the

Condition of all

Connectors, wafers, I2C

In component

Signal flow

Power Error

Replace IC1 AN15865 To sheet 24

To sheet 25

Yes

NO Yes

FAIL PASS

(component)

PASS

(S-Video)

FAIL FAIL

PASS PASS

PASS

FAIL

Check the

output YUV at

R 418, 415, 412

respectively

Check 9V

Across L401and

5V across L404

and L402

+ 42 hidden pages