Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This specification sheet is applied to all of the LCD TV with
LB0EC chassis.
2. Designation
(1) The adjustment is according to the order which is designated
and which must be followed, according to the plan
can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation : Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 220 V, 60 Hz
(6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),
DDC Adjustment Jig, Service remote control.
(7) Push the "IN STOP" key - For memory initialization.
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at rst.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
which
(4) Click "Connect" tab. If "Can't" is displayed, check connection
between computer, jig, and set.
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
(4)
filexxx.bin
(5)
(7)...........OK
(6)
3. Main PCB check process
▪ APC - After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
(2) Set as below, and then click "Auto Detect" and check "OK"
message.
If "Error" is displayed, check connection between computer,
jig, and set.
(3) Click "Read" tab, and then load download file(XXXX.bin)
by clicking "Read"
(1)
filexxx.bin
* USB DOWNLOAD
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting.
(5) Updating Completed, The TV will restart automatically.
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
* [Important] AU (Australia), TS (Malaysia) Suffix have to be
applied “Tool option 3 (AU,TS)” value because of Energy
Saving Standard.
3.1. ADC Process
(1) ADC
- Enter Service Mode by pushing "ADJ" key,
- Enter Internal ADC mode by pushing "►" key at "6. ADC
Calibration".
WUG{GvX
XUG{GvYG
Y
UG{GvZG
UG{Gv[G
Z
[
UG{Gv\G
UGjGnG
\
UGhkjGjGඖ
]
^UG~GiG
_
UGXWGwG~iG
`
UG{GwG
X
WUGlkpkGkVsG
XUGzGiVjG
X
YUG{GzGzG
X
X
ZUlUGpGhG
G
lGhkq|z{
<Caution> Using "power on" key of the Adjustment remote
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER ON -> Enter
the mode of White-Balance, the pattern will come out.
Full White Pattern
RS-232C Communication
* Auto-control interface and directions
(1) Adjust in the place where the i nflux of light like floodlight
around is blocked. (illumination is less than 10 lux).
(2) Adhere closely the Color analyzer(CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color analyzer's prove vertically.(80° ~ 100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using 'no signal' or 'POWER ONLY' or the others, check
the back light on.
X=0.269 (±0.002)
Y=0.273 (±0.002)
X=0.285 (±0.002)
Y=0.293 (±0.002)
X=0.313 (±0.002)
<Test Signal>
Inner pattern
(204gray,80IRE)
Y=0.329 (±0.002)
CoolMediumWarm
Xyxyxy
269273285293313329
CA-210
COLOR
ANALYZER
TYPE : CA-210
▪ Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
MIN
CENTER
(DEFAULT)
MAX
CoolMidWarmCool MidWarm
R Gain jgJajd00172192 192192
G Gain jhJbje00172192 192192
B Gain jiJcjf00192192 172192
R Cut646464128
G Cut646464128
B Cut646464128
<Caution>
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.(When R/G/B Gain are all
C0, it is the FULL Dynamic Range of Module)
* Manual W/B process using adjust Remote control.
▪ After enter Service Mode by pushing "ADJ" key,
▪ Enter White Balance by pushing "►" key at "7. White
* After you finished all adjustments, Press "In-start" key and
compare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is not
same, then correct it same with BOM and unplug AC cable.
For correct it to the model's module from factory Jig model.
* Push the "IN STOP" key after completing the function
inspection.
4.2. DDC EDID Write (RGB 128Byte )
▪ Connect D-sub Signal Cable to D-Sub Jack.
▪ Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
▪ Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to
▪ Connect HDMI Signal Cable to HDMI Jack.
▪ Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
▪ Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4.4. EDID DATA
(1) All Data : HEXA Value
(2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***: Year : Controlled
****: Check sum
4.4.1. Auto Download
▪ After enter Service Mode by pushing "ADJ" key.
▪ Enter EDID D/L menu.
▪ Enter "START" by pushing "OK" key.
<Caution> Never connect HDMI && D-sub cable when EDID
downloaded.
EZ ADJUT
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Country Group
6. ADC Calibration
7. White Balance
8. 10 Point WB
9. Test Pattern
10. EDID D/L ►
11. Sub B/C
12. Touch Sensitivity setting
13. Ext. Input Adjust
HDMI1
HDMI2
HDMI3
RGB
HDMI1
HDMI2
HDMI3
RGB
EDID D/L
Start
EDID D/L
Start
NG
NG
NG
NG
Reset
OK
OK
OK
OK
Reset
4.4.2. Manual Download
<Caution>
1) Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
2) Never connect HDMI & D-sub Cable at the same time.
3) Use the proper cables below for EDID Writing.
4) Download HDMI1, HDMI2 separately because HDMI1 is
different from HDMI2.
For AnalogFor HDMI EDID
D-sub to D-subDVI-D to HDMI or HDMI to HDMI
No.ItemConditionHex Data
1Manufacturer IDGSM1E6D
2VersionDigital : 101
3RevisionDigital : 303
(1) FHD RGB EDID data
0123 4 5678 9A B C D E F
0 0ffff f f f f f f f f 0 1e 6dab
10c13 68 10 9 78 0a ee 91 a3 54 4c 99 26
20 0f 50 54 a1 80 81 80 61 40 45 4 0 31 40 11
30 11 1111 2 3a 80 18 71 38 2d 40 58 2c
40 45 0 a0 5a 000 1e 1 1d 0 72 51 d0 1e 20
50 6e 28 55 0 a0 5a 000 1e 00 0 fd 0 3a
60 3e 1e 53 10 0 0a 20 20 20 20 20 20d
70d0 e
* EDID data and Model option download (RS232)
NOItemCMD 1 CMD 2 Data 0
Enter download
MODE
EDID data and
Model option
download
Download
‘Mode In’
DownloadAE00 10
AA00
Only for training and service purposes
When transfer the ‘Mode
In’, Carry the command.
Automatically download
(The use of a internal
data)
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write : Model Name and Serial Number write in EEPROM,.
Adjust modeCMD(hex)LENGTH(hex)Description
EEPROM WRITEA0h84h+nn-bytes Write (n = 1~16)
4.5.3. Method & notice
(1) Serial number D/L is using of scan equipment.
(2) Sett ing of sca n eq uipment o perated b y Ma nufac turing
Technology Group.
(3) Serial number D/L must be conformed when it is produced in
production line, because serial number D/L is mandatory by
D-book 4.0.
* Manual Download(Model Name and Serial Number)
If the TV set is downloaded by OTA or Service man, sometimes
model name or serial number is initialized.(Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the "Instart" key of Adjustment remote control.
2) Go to the menu "6.Model Number D/L" like below photo.
3) Input the Factory model name or Serial number like photo.
4.5. Model name & Serial number D/L
▪ Press "Power on" key of service remote control.
(Baud rate : 115200 bps)
▪ Connect RS232 Signal Cable to RS-232 Jack.
▪ Write Serial number by use RS-232.
▪ Must check the serial number at the Product/Service info..
(menu key -> red key -> select product/Service info)
4.5.1. Signal Table
CMD LENGTH ADHADL DATA_1 . . . Data_nCSDELAY
CMD : A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 +...+ Data_n
Delay : 20ms
4) Check the model name Instart menu. → Factory name displayed.
5) Check the Product/Service info..(Menu key → Red key →
Select product/Service info) → Buyer model displayed.
4.5.4. Outgoing condition Configuration
■ When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.6. Hi-Pot Test
Confirm whether is normal or not when between power
board's ac block and GND is impacted on 1.5 kV(dc) or 2.2
kV(dc) for one second.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
22
AR101
C102
10uF
C103
0.1uF
AR102
EAN61508001
IC102-*3
TC58NVG0S3ETA0BBBH
VCC
8
WP
7
SCL
6
SDA
5
PCM_A[7]
PCM_A[6]
PCM_A[5]
PCM_A[4]
PCM_A[3]
PCM_A[2]
PCM_A[1]
PCM_A[0]
22
C105
0.1uF
C104
8pF
OPT
PCM_A[0-7]
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O8
44
I/O7
43
I/O6
42
I/O5
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O4
32
I/O3
31
I/O2
30
I/O1
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
+3.3V_Normal
C106
8pF
OPT
DIMMING
A_DIM
PWM_DIM
I2C
22R111
22R112
<CHIP Config(LED_R/BUZZ)>
Boot from SPI CS1N(EXT_FLASH) 1’b0
Boot from SPI_CS0N(INT_FLASH) 1’b1
C112
100pF
50V
<CHIP Config>
R148
56
10K
100
(I2S_OUT_BCK,I2S_OUT_MCK,PAD_PWM1PAD_PWM0)
B51_no_EJ : 4’b0000 Boot from 8051 with SPI flash
SB51_WOS : 4’b0001 Secure B51 without scramble
SB51_WS : 4’b0010 Secure B51 with scramble
MIPS_SPE_NO_EJ : 4’b0100 Boot from MIPS with SPI flash
MIPS_SPI_EJ_1 : 4’b0101 Boot from MIPS with SPI flash
MIPS_SPI_EJ_2 : 4’b0110 Boot from MIPS with SPI flash
MIPS_WOS : 4’b1001 Secure MIPS without scramble
MIPS_WS : 4’b1010 Scerur MIPS with SCRAMBLE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
0
RF_SW_OPT
0
close to TUNER
+1.2V/+1.8V_TU
FULL_NIM
C3738
0.1uF
16V
C3705
100uF
16V
+5V_TU
C3704
C3703
0.1uF
100pF
16V
50V
CN
C3739
10uF
6.3V
close to the tuner pin, add,09029
C3728
0.1uF
16V
OPT
C3707
100pF
50V
HALF_NIM
0R3760
0R3761
HALF_NIM
Close to the tuner
Q3704EB
2SC3052
OPT
+3.3V_TU
C3708
0.1uF
16V
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM_CHINA
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM_CHINA
FULL_NIM_BR
C3731
10uF
10V
OPT
C
R3724
R3730
R3731
R3725
R3727
R3728
R3729
R3726
R3721
R3722
R3723
Close to the CI Slot
R3706
R3754
10K
OPT
0
0
0
0
0
0
0
0
0
0
0
0
GPIO must be added.
OPTION : RF AGC
FE_AGC_SPEED_CTL
IF_AGC_SEL
TU_I2C_NON_FILTER
+3.3V_TU
R3733
R3732
100
100K
C3710
0.1uF
16V
C3716
0.1uF
16V
IF_N_MSTAR
IF_P_MSTAR
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
FE_TS_SYNC
FE_TS_VAL_ERR
FE_TS_CLK
TU_I2C_NON_FILTER
TUNER_RESET
HALF_NIM
FE_TS_DATA[0]
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
BOOSTER_OPT
R3734
0
Q3701
BOOSTER_OPT
ISA1530AC1
E
C
BOOSTER_OPT
C3709
0.01uF
25V
BOOSTER_OPT
TU_IIC_NON_ATSC_SANYO
R3740-*1
1K
TU_IIC_ATSC_SANYO
33
R3735
TU_I2C_NON_FILTER
33
R3736
TU_I2C_NON_FILTER
C3713
C3711
18pF
18pF
50V
50V
C3711-*1
20pF
50V
TU_I2C_FILTER
TU_I2C_FILTER
R3735-*1
TU_I2C_FILTER
MLG1005SR27JT
100R3704
IF_AGC_MAIN
+3.3V_TU
R3740
1.2K
C3742
20pF
50V
C3713-*1
20pF
50V
TU_I2C_FILTER
TU_I2C_FILTER
R3736-*1
MLG1005SR27JT
C3743
20pF
50V
TU_I2C_FILTER
should be guarded by ground
C3714
C3712
22pF
22pF
50V
50V
FULL_NIM
FULL_NIM
R3737
2.2K
B
TU_IIC_NON_ATSC_SANYO
TU_IIC_ATSC_SANYO
R3741
1.2K
R3742
4.7K
FULL_NIM
CN_2INPUT_H_ALTO
FE_TS_DATA[0-7]
FULL_NIM_BR
TU3701-*2
TDFR-B036F
RF_S/W_CNTL
1
BST_CNTL
2
+B1[5V]
3
NC_1[RF_AGC]
4
NC_2
5
SCLT
6
SDAT
7
NC_3
8
SIF
9
NC_4
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_5
16
SCL
17
SDA
18
ERR
19
SYNC
20
VALID
21
MCL
22
D0
23
D1
24
D2
25
D3
26
D4
27
D5
28
D6
29
D7
30
31
SHIELD
Q3702
2SC3052
R3741-*1
1K
TU_SCL
TU_SDA
+3.3V_TU
31
SHIELD
R3744
4.7K
FULL_NIM
TU3701-*4
TDFR-C236D
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
BOOSTER_OPT
C
E
BOOSTER_OPT
RF_S/W_CNTL
BST_CNTL
+B1[+5V]
NC[RF_AGC]
NC_1
SCLT
SDAT
NC_2
SIF
NC_3
VIDEO
GND
+B2[1.2V]
+B3[3.3V]
RESET
NC_4
SCL
SDA
ERR
SYNC
VALID
MCL
D0
D1
D2
D3
D4
D5
D6
D7
R3743
10K
BOOSTER_OPT
B
R3745
10K
FE_BOOSTER_CTL
LNA2_CTL
GPIO must be added for FE_BOOSTER_CTL
NON_BUFFER
0R3773
BUFFER
0R3749
DEMOD_SCL
DEMOD_SDA
200mA
The pull-up/down of LNA2_CTL
is depended on MODLE_OPT_1.
+3.3V_TU
+3.3V_BUFFER
R3774
0
R3751
220
BUFFER
E
BUFFER
B
R3750
OPT
1K
C
Q3703
ISA1530AC1
+3.3V_TU
C3717
0.1uF
16V
+5V_Normal
L3704
FULL_NIM_BCD
+5V_TU
Size change,0929
MLB-201209-0120P-N2
C3719
C3724
22uF
0.1uF
10V
+5V_TUNER
16V
+5V_TUNER
+5V_TU
+5V_BUFFER
R3775
0
R3752
220
BUFFER
IC3703-*2
AZ1117BH-1.8TRE1
IN
2
3
1
ADJ/GND
HALF_NIM_1.8V
IC3703-*1
AP1117EG-13
OUTIN
ADJ/GND
HALF_NIM_1.2V_DIODES
Please, check Multi Item! 10/12
10K
R3771
FULL_NIM_BCD
10K
R3770
FULL_NIM_SEMTEK
10K
R3769
FULL_NIM_BCD
+5V_TUNER
L3702
+5V_TUNER
C3722
22uF
16V
+5V_TUNER
NON_BUFFER
R3753
4.7K
TU_CVBS
OUT
HALF_NIM_1.2V_BCD
AZ1117BH-ADJTRE1
INPUT
AP2132MP-2.5TRG1
PG
1
EN
2
VIN
3
VCTRL
4
SC4215ISTRT
NC_1
1
FULL_NIM_SEMTEK
EN
2
VIN
3
NC_2
4
C3726
0.1uF
16V
+5V_TUNER
+3.3V_BUFFER
0R3772
BUFFER
IC3703
3
2
OUTPUT
IC3701
FULL_NIM_BCD
THERMAL
IC3701-*1
+3.3V_TU
R3776
R3755
470
B
1
HALF_NIM_1.2V
9
60mA
0
ADJ/GND
R3768
1.2K
8
7
6
5
8
7
6
5
BUFFER
E
BUFFER
ISA1530AC1
Q3705
C
R1
[EP]
GND
ADJ
VOUT
NC
GND
ADJ
VO
NC_3
+5V_TU
+5V_BUFFER
R3758
82
DEMOD_RESET
HALF_NIM_1.8V
R3767-*1
0
R2
HALF_NIM_1.2V
R3767
10
FULL_NIM_SEMTEK
+3.3V_TU
R3777
0
TU_SIF
This was being applied to the only china demod,
so this has to be deleted in both main and ISDB sheet.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS1-*5
GAS1-*6
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS2-*5
GAS2-*6
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS3-*5
GAS3-*6
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS4-*5
GAS4-*6
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS5-*5
GAS5-*6
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS6-*5
GAS6-*6
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS7-*5
GAS7-*6
GP3_S7LR
SMD_GAS
20110324
20
Page 41
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