Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
2.1 The adjustment is according to the order which is designated and which must be followed, according to the plan
which can be changed only on agreeing.
2.2. Power adjustment : Free Voltage.
2.3. Magnetic Field Condition: Nil.
2.4. Input signal Unit: Product Specification Standard.
2.5. Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25℃±5°C
Relative humidity : 65 ±10%
Input voltage : 220V, 60Hz
In case of keeping module is in the circumstance of 0°C, it should be placed in the circumstance of
above 15°C for 2 hours.
In case of keeping module is in the circumstance of below -20°C, it should be placed in the circum
stance of above 15°C for 3 hours.
2.6. Adjustment equipments : Color Analyzer (CA-210 or CA-110), Pattern Generator (MSPG-925L or Equivalent),
1. Adjust in the place where the influx of light like floodlight around is blocked. (illumination is less than
10ux).
2. Adhere closely the Color Analyzer (CA210) to the module less than 10cm distance, keep it with the surface
of the Module and Color Analyzer’s Prove vertically.(80~100°).
3. Aging time
-. After aging start, keep the power on (no suspension of power supply) and heat-run over 15 minutes.
-. Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.
Auto adjustment Map(RS-232C)
Index
Equipment Æ Wireless unit Wireless unit Æ Set
CMD1 CMD2 Set IDData CMD1 CMD2 CMD3 CMD4
Start w b 0 00 1F 04 00 00
Gain start w b 0 10 1F 04 00 10
Gain End w b 0 1F 1F 04 00 1F
Offset Start w b 0 20 1F 04 00 20
Offset End w b 0 2F 1F 04 00 2F
End w b 0 FF 1F 04 00 FF
RS-232C COMMAND
R Gain jg ja jd 00 172 192 192 192
G Gain jh jb je 00 172 192 192 192
B Gain ji jc jf 00 192 192 172 192
[CMD ID DATA]
Cool Mid Warm
MIN
CoolMidWarm
CENTER
(DEFAULT)
MAX
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
** Caution **
Color Temperature : Cool, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range of module)
*
Manual W/B process using factory SVC remocon.
■ Enter ‘EZ ADJUST’ mode by pushing ‘ADJ’ key.
■ Enter White Balance mode by pushing ‘OK’ or ‘►’ key after selecting ‘7.White Balance’.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HIGH
FRC_HW_OPT
100/120Hz LVDS
PHM_ON
DVB_T2
FHD
default
OLED
W2
W1
V2
IP
V1
IM
Y2
Y1
U3
QP
V3
QM
Y5
Y4
U1
U2
R3
T3
T2
T1
G14
G13
B7
A7
AF17
AE17
F14
F13
F15
D20
E20
D19
F18
E18
D18
E19
N1
P3
P1
P2
P4
P5
R6
T6
U5
V5
U6
V6
U4
W3
W4
V4
Y3
W5
R4
T5
R5
T4
P7
VRM
R7
VAG
P6
VRP
R1
R2
E21
E22
D21
F21
E23
D22
F22
D23
F23
F8
G8
K8
A4
Y17
NO_FRC : LOW LOW
U3_INTERNAL : HIGH LOW
U5_EXTERNALBOOT :HIGH HIGH
reserved for FRC : LOW HIGH
--> This option is only applied in EU.
In case of NON_EU, default value set LOW.
-->In case of GP2, This port was used for GIP/NON_GIP
--> MODEL_OPT_5, MODEL_OPT_6
: Only 3D_SG GPIO OUTPUT CONTROL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2R
FRC_DDR
20101023
3
Page 32
FROM LIPS & POWER B/D
+3.5V_ST
RT1P141C-T112
Q402
RL_ON
C401
100uF
C402
100uF
16V
16V
+3.5V_ST
+12V/+15V
R401
10K
B
MLB-201209-0120P-N2
C406
0.1uF
16V
L402
MLB-201209-0120P-N2
C404
0.1uF
16V
L402-*1
CIS21J121
C
Q401
2SC3052
E
L404
L404-*1
CIS21J121
C407
0.1uF
16V
OPT
R406
4.7K
C408
0.1uF
16V
3
1
OPT
R476
0
2
POWER_23_GND
NORMAL_EXPEPT_32
P403
FW20020-24S
PWR ON
24V
GND
GND
3.5V
3.5V
GND
GND
12V
12V
12V
GND/P.DIM2
<MODULE PIN MAP>
CMO10"Lamp
AUO 10"Lamp
(PSU)
(PSU)
GND
A-DIM
INV_ON
Err_out
NC
PWM_DIM
INV_ON
PWM_DIM
GND
32LE5300-TA
NC
INV_ON
err_out
NC
--> NC
CMO10"LED
NC
32LE4500-TA
AUO 10"LED
(PSU)
INV_ON
err_out
--> NC
NC
PWM_DIM
NC
PWM_DIM
NC
NC
GND
NC
NC
NC
SHARP
(PSU)
GND
INV_ON
52/60:ERROR
26/32HD:NC
26/32/52:PWM
26/32/52:GND
60:PWM
32LE5300-TA
LGD 10"LED
(PSU)
INV_ON
PWM_DIM
err_out
--> NC
60:NC
GND
NC
NC
NC
IPS-@
(PSU)
INV_ON
Err_out
PWM_DIM
GND
16
18
20
24
23
22
LGD(PSU)
or LIPS
GND
INV_ON
VBR-A
PWM_DIM
Err_out
GND
PIN No
<LED MODULE PIN MAP -> latest update 20100618>
PIN No
LGD LPB/
OS LPB (PSU)
16
INV_ON
18
20
22
PWM_DIM
err_out
24
--> NC
23
LGD edge led error-out use or not? checking is necessary...
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PWM_BUZZ/IIC_LED :Using IIC for LED Breathing & PWM Buzz
PWM_LED : Using PWM Signal for LED Lighting
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MODEL OPTION
PIN NO.
8
11
PWM_BUZZ/IIC_LED
30
31
HIGH
B/L_LED
TOUCH_KEY
GP2
LOW
B/L_LAMP
PWM_LED
TACT_KEY
GP3
MODEL_OPT_0
LOW
LOW
LOW : LED
HIGH : LAMP
MODEL_OPT_1
LOW
LOW
HIGH
HIGH
Low
MODEL_OPT_2
LOW
LOW
HIGH
LOW
HIGH
MODEL_OPT_3
LOW
HIGH
LOW
LOW
LOW
Description
LK330/LK430 for KR/US
10Y EYE-Q Sensor
KEY & PWM LED & No Buzz & No LED Blink
LK330/LK430/LK530
KEY & PWM LED & No Buzz & No LED Blink
LV25/LV35/LV45/LW45/LV55/LK45/LK55
S/T & IIC LED & NO BUZZ & LED Blink
IIC LED(09Y IIC Protocol) & No BUZZ
S/T & IIC LED & No Buzz & LED Blink
TBD
TBD
R10 41
R10 37
22
22
R10 68
R10 69
IR
OCD1A
POWER_DET
LED_R/BUZZ
LED_B/LG_LOGO
NEC_ISP_Rx
NEC_ISP_Tx
S7_NEC_RXD
S7_NEC_TXD
POWER_ON/OFF2_2
MODEL OPTION
PIN NAME
MODEL_OPT_0
MODEL_OPT_1
MODEL_OPT_2
MODEL_OPT_3
PWM_BUZZ/IIC_LED : For model that use LED Lighting used IIC
PWM_LED : For model that use LED Lighting used PWM Signal
PIN NO.
8
11
30
31
PWM_BUZZ/IIC_LED
R1083 10K
B/L_LED
TOUCH_KEY
GPIO_LED
OPT
2010Y,GP2
LOW
B/L_LAMP
PWM_LED
TACT_KEY
NON_GPIO_LED
MODEL_OPT_0
HIGH
HIGH
HIGH
MODEL_OPT_1
LOW
LOW
LOW
LOW
HIGH
HIGH
GP2R
MICOM Rev.4
LOW
HIGH
HIGH
LOW
LOW
MODEL_OPT_3
LOW
PWM LED & No Buzz & No LED Blink
LOW
LOW
LOW
HIGH
19/22/26LE5300/5300
IIC LED & PWM IIC BUZZ
32/37/42/47/55LE5300
IIC LED & PWM BUZZ
IIC LED(09Y IIC Protocol) & No BUZZ
LD350/450/550HIGH
LD420
LE7300
GPIO LED & NO BUZZ
MODEL_OPT_2
LOW
20101125
5
Page 34
CONTROL
IR & LED
+3.5V_ST
C2406
1000pF
50V
EYEQ/TOUCH_KEY
EYEQ/TOUCH_KEY
R2412
R24131.5K
C2407
100pF
LED_R/BUZZ
R2411
100
100
50V
C2408
18pF
50V
OPT
C2409
18pF
50V
OPT
C2410
0.1uF
D2405
5.6V
R2414
1.5K
OPT
16V
EYEQ/TOUCH_KEY
5.6V
D2403
EYEQ/TOUCH_KEY
5.6V
D2404
JP2407
JP2408
OPT
R2416
10K
OLD_SUB
P2401
12507WR-12L
1
2
3
4
5
6
7
JP2409
8
JP2410
9
10
JP2411
11
12
13
NEW_SUB
P2402
12507WR-15L
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
R2405
R2404
10K
10K
1%
1%
R2429
Q2405
2SC3052
BLM18PG121SN1D
L2402
BLM18PG121SN1D
+3.5V_ST
47K
OPT
C
B
E
OPT
L2401
R2431
47K
OPT
R2426
+3.5V_ST
47K
S/T_SCL
S/T_SDA
+3.5V_ST
C2401
0.1uF
C2402
0.1uF
L2403
BLM18PG121SN1D
C2403
0.1uF
16V
D2401
5.6V
AMOTECH
D2402
AMOTECH
C2404
1000pF
50V
+3.3V_Normal
C906
18pF
50V
OPT
C907
18pF
50V
OPT
5.6V
R2401
100
KEY1
R2402
100
KEY2
+3.5V_ST
R2425
Q2406
2SC3052
47K
OPT
R2430
C
10K
B
E
OPT
OPT
R2427
0
R2428
IR
22
LED_B/LG_LOGO
L2404
BLM18PG121SN1D
C2405
0.1uF
16V
NEW_SUB
D902
CDS3C05HDMI1
5.6V
NEW_SUB
D903
CDS3C05HDMI1
5.6V
NEC_EEPROM_SCL
NEC_EEPROM_SDA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2R
IR/CONTROL-L
20101023
6
Page 35
USB_JACK_LV3400
JK1450-*1
1234
USB DOWN STREAM
3AU04S-345-ZC-H-LG
5
USB_DIODES
R1458
2K
1/8W
1%
USB_JACK
JK1450
USB DOWN STR EAM
3AU 04S-3 05-Z C-(LG )
1234
5
SIGN6409
L1451-*1
CIS21J121
L1451
MLB-201209-0120P-N2
120-ohm
R1459
2K
C1451
1/8W
1%
22uF
16V
D1451
RCLAMP0502BA
OPT
OUT_2
OUT_1
NC
FLG
EAN61849601
IC1450
AP2191DSG
8
$0.077
7
6
5
R1451 47
GND
1
IN_1
2
IN_2
3
EN
4
SIDE_USB_DM
SIDE_USB_DP
R1454
10K
C1452
10uF
10V
USB1_OCD
C1453
0.1uF
+5V_USB
+3.3V_Normal
R1455
4.7K
OPT
USB1_CTL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
20101023GP2R
USB_OCP_DIODE7
Page 36
HDMI_1
HDMI_1
EAG59023302
SHIELD
20
JK802
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
5V_HDMI_1
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R896
1K
R804
1.8K
OPT
D802
5V_DET_HDMI_1
3.3K
R802
C802
0.1uF
16V
R824
HDMI EEPROM
5V_HDMI_1
+5V_Normal
A1CA2
ENKMC2838-T112
R874
10K
R884
2.7K
5V_HDMI_2
10K
R873
R885
2.7K
D821
R888
2.7K
+5V_Normal
A2
A1
ENKMC2838-T112
D822
C
R889
2.7K
EDID_WP
DDC_SCL_1
DDC_SDA_1
EDID_WP
DDC_SCL_2
DDC_SDA_2
HDMI_1_RENESAS
IC801-*1
R1EX24002ASAS0A
C
Q802
2SC3052
0
R830
B
10K
E
HPD1
DDC_SDA_1
DDC_SCL_1
HDMI_CEC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
A0
1
A1
2
A2
3
VSS
4
HDMI_2_RENESAS
IC802-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
HDMI_1_ATMEL
AT24C02BN-SH-T
A0
1
A1
2
A2
3
GND
4
AT24C02BN-SH-T
A0
1
A1
2
A2
3
GND
4
IC801
$0.055
HDMI_2_ATMEL
IC802
$0.055
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
R876 22
R875 22
JP810
R878 22
R877 22
C806
0.1uF
C807
0.1uF
HDMI_2
SHIELD
20
HDMI_2
EAG59023302
JK801
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_2
R895
1K
R803
1.8K
5V_DET_HDMI_2
C
R828
Q801
2SC3052
C801
0.1uF
16V
R801
3.3K
R815 0
OPT
D801
10K
B
E
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDE_HDMI
BODY_SHIELD
20
19
18
17
16
15
14
13
12
11
10
EAG62611201
9
HDMI_SIDE
8
7
6
5
4
3
2
1
JK803
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_4
R897
1K
R837
1.8K
+5V_Normal
C809
0.1uF
+3.3V_Normal
R856
10K
C805
0.1uF
16V
GND
R893
10K
GND
5V_HDMI_4
R871
R887
2.7K
C810
0.1uF
16V
10K
+3.5V_ST
A1CA2
ENKMC2838-T112
D824
R891
2.7K
R857
68K
OPT
CEC_ON/OFF
R853
68K
EDID_WP
DDC_SCL_4
DDC_SDA_4
CEC_REMOTE_S7
CEC_REMOTE_NEC
5V_DET_HDMI_4
C
Q803
2SC3052
C803
0.1uF
16V
3.3K
JP806
JP805
R841
0
R835
OPT
D811
R862
B
10K
E
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
HDMI_SIDE_RENESAS
IC804-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
VCC
8
WP
7
SCL
6
SDA
5
For CEC
HDMI_CEC
OPT
D803
AVRL161A1R1NT
GND
OPT
D826
AVRL161A1R1NT
GND
HDMI_SIDE_ATMEL
AT24C02BN-SH-T
A0
1
A1
2
A2
3
GND
4
D804
D825
IC804
$0.055
VCC
8
WP
7
JP812
SCL
6
5
R881 22
SDA
R882 22
68K
R854
R855
0
OPT
SBD
Q806
G
BSS83
68K
R892
R883
0
OPT
SBD
Q805
G
BSS83
20101023 GP2R
HDMI8
Page 37
RGB/SPDIF/PC/HP
New Item Development
EARPHONE BLOCK
HP_LOUT
002:V7
HP_ROUT
002:V7
C1118
10uF
16V
C1119
10uF
16V
C1115
1000pF
50V
OPT
C1116
1000pF
50V
OPT
R1125
1K
R1128
1K
Q1101
MMBT3904-(F)
Q1102
MMBT3904-(F)
C
B
E
C
B
E
MMBT3904-(F)
B
MMBT3904-(F)
B
E
Q1104
C
E
Q1103
C
HP_DET
+3.3V_Normal
R1130
10K
R1155
1K
HEAD_PHONE
JK3301
KJA-PH-0-0177
5GND
4L
3DETECT
1R
C
Q1105
ISA1530AC1
E
B
R1129
3.3K
+3.5V_ST
C
E
B
Q1106
2SC3052
SIDE_HP_MUTE
PC AUDIO
JK1102
PEJ027-01
E_SPRING
3
T_TERMINAL1
6A
B_TERMINAL1
7A
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
D1101
AMOTECH
5.6V
OPT
D1102
AMOTECH
5.6V
OPT
C1107
100pF
50V
C1108
100pF
50V
R1102
470K
R1103
470K
R1107
15K
R1108
15K
R1110
10K
R1111
10K
PC_R_IN
PC_L_IN
002:S12
002:S12
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF_OUT
002:T18
+3.3V_Normal
C1131
0.1uF
16V
VINPUT
C1121
100pF
50V
D1116
5.6V
OPT
+5V_Normal
EDID_WP
RGB_DDC_SCL
RGB_DDC_SDA
+3.3V_Normal
R1146
10K
D1117
5.6V
OPT
R1147
1K
DSUB_DET
RGB PC
GND
Fiber Optic
1
VCC
2
JK1103
JST1223-001
3
4
FIX_POLE
RGB_EEMPROM_RENESAS
R1EX24002ASAS0A
A0
A1
A2
VSS
DSUB_VSYNC
DSUB_HSYNC
DSUB_B+
DSUB_G+
DSUB_R+
IC1105-*1
1
2
3
4
VCC
8
WP
7
SCL
6
SDA
5
R1133
75
R1135
75
R1137
75
RGB_EEMPROM_ATMEL
A0
A1
A2
GND
C1122
68pF
50V
OPT
IC1105
AT24C02BN-SH-T
1
2
3
4
R1139
D1109
30V
D1111
30V
D1112
30V
D1110
30V
C1127
18pF
2.2K
50V
C1126
68pF
50V
OPT
VCC
8
WP
7
SCL
6
SDA
5
C1128
18pF
50V
D1113
30V
D1115
ENKMC2838-T112
A1
C
A2
R1140
2.2K
R1141
22
D1114
5.6V
OPT
R1142
10K
C1129
0.1uF
16V
R1143
22
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RED2GREEN3BLUE4GND_15DDC_GND
RED_GND7GREEN_GND8BLUE_GND9NC10SYNC_GND
GND_212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK
JK1104
SPG09-DB-010
11
6
1
SHILED
16
RGB/SPDIF/HP9
20101023GP2R
Page 38
RS232C
0.33uF
C1101
C1102
0.1uF
C1103
0.1uF
C1104
0.1uF
C1105
0.1uF
DOUT2
RIN2
C1+
C1-
C2+
C2-
V+
V-
IC1101
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
10
5
9
4
R1123
100
S7_NEC_RXD
S7_NEC_TXD
R1124
100
+3.5V_ST
D1107
CDS3C30GTH
30V
OPT
C1106
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
D1108
CDS3C30GTH
30V
OPT
JP1121
JP1122
8
7
6
SPG09-DB-009
JK1101
3
2
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
20101023GP2R
RS232C_9PIN10
Page 39
[51Pin LVDS Connector]
(For FHD 60/120Hz)
P703
FI-RE51S-HF-J-R1500
WAFER_FHD
52
PANEL_VCC
L702
120-ohm
WAFER_FHD
C709
C700
10uF
16V
R703
0
LVDS_PWM_44
R701
0
3D_SG
R702
0
3D_SG
OPT
RXACK-
RXACK+
RXA2-
RXA2+
RXA1-
RXA1+
RXA0-
RXA0+
RXB4-
RXB4+
RXB3-
RXB3+
RXBCK-
RXBCK+
RXB2-
RXB2+
RXB1-
RXB1+
RXB0-
RXB0+
R707
0
LVDS_51PIN_GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
C710
1000pF
0.1uF
50V
16V
OPT
WAFER_FHD
RXA4-
RXA4+
RXA3-
RXA3+
BIT_SEL
R709
10K
BIT_SEL_LOW
SCAN_BLK2
SCAN_BLK1/OPC_OUT
PWM_DIM
LED_DRIVER_D/L_SDA
LED_DRIVER_D/L_SCL
100
LVDS_51PIN_GPIO
R706
[41Pin LVDS Connector]
(For FHD 120Hz)
FI-RE41S-HF-J-R1500
LVDS_SEL
+3.3V_Normal
R705
3.3K
OPT
R710
10K
OPT
2D/3D_CTL
P704
WAFER_FHD_120HZ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
RXD4-
RXD4+
RXD3-
RXD3+
RXDCK-
RXDCK+
RXD2-
RXD2+
RXD1-
RXD1+
RXD0-
RXD0+
RXC4-
RXC4+
RXC3-
RXC3+
RXCCK-
RXCCK+
RXC2-
RXC2+
RXC1-
RXC1+
RXC0-
RXC0+
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
P705
FF10001-30
HD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
OPT
R7130
TP721
TP722
RXA3-
RXA3+
RXACK-
RXACK+
RXA2-
RXA2+
RXA1-
RXA1+
RXA0-
RXA0+
PWM_DIM
OPC_OUT
LVDS_SEL
+3.3V_Normal
R712
3.3K
R711
10K
C701
10uF
16V
OPT
OPT
OPT
C702
1000pF
50V
PANEL_VCC
L701
120-ohm
HD
OPT
C703
0.1uF
16V
HD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2R
SFLASH_1MB
20101023
13
Page 42
GP2R_LARGE_TUNER
close to TUNER
OPT
R3762 0
CN_2INPUT_H_LG3911
TU3702
TDTJ-S001D
DVB_1INPUT_H_LGIT
TUNER MULTI-OPTION
TU3702-*1
TDVJ-H101F
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
GP3_ATSC_1INPUT_H_LGIT
RF_S/W_CTL
1
BST_CTL
2
+B1[5V]
3
NC_1[RF_AGC]
4
NC_2
5
SCLT
6
SDAT
7
NC_3
8
SIF
9
NC_4
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
NTSC_2INPUT_H_LGIT
RESET
15
IF/AGC
16
DIF_1[N]
17
DIF_2[P]
18
19
SHIELD
TU3702-*2
TDTR-T036F
19
SHIELD
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC[IF_TP]
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
GP3_ATSC_1INPUT_H_SANYO
TU3702-*3
UDA55AL
NC_1
1
NC_2
2
+B[+5V]
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC_3
10
VIDEO
11
GND
12
+1.2V
13
+3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
GP2R_AU_1INPUT_H_LGIT
TU3702-*4
TDTJ-S101D
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
SHIELD
ANT_PWR
NC_1
+B1[5V]
RF_AGC
MOPLL_AS
SCL
SDA
NC_2
SIF
NC_3
VIDEO
GND
+B2[1.2V]
+B3[3.3V]
RESET
IF_AGC
DIF_1[N]
DIF_2[P]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
31
SHIELD
TU3701
TDFR-C036D
close to TUNER
RF_S/W_CNTL
1
BST_CNTL
2
+B1[+5V]
3
NC[RF_AGC]
4
NC_1
5
SCLT
6
SDAT
7
NC_2
8
SIF
9
NC_3
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_4
16
SCL
17
SDA
ERR
SYNC
VALID
MCL
D0
D1
D2
D3
D4
D5
D6
D7
R3701 100
FULL_NIM
18
19
20
21
22
23
24
25
26
27
28
29
30
R3705 0
C3701
0.1uF
16V
R3707 0
C3706
0.1uF
16V
C3702
0.1uF 16V
C3737
100pF
50V
FULL_NIM
R3702 100
close to IF line
RF_SW_OPT
OPT
close to TUNER
+1.2V/+1.8V_TU
FULL_NIM
C3738
0.1uF
16V
C3705
100uF
16V
+5V_TU
C3704
C3703
0.1uF
100pF
16V
50V
close to the tuner pin, add,09029
CONTROL_ATTEN
CN
C3739
10uF
6.3V
Close to the tuner
Pull-up can’t be applied
because of MODEL_OPT_2
C3728
0.1uF
16V
OPT
+3.3V_TU
C3707
100pF
50V
HALF_NIM
R3760 0
R3761 0
HALF_NIM
FULL_NIM_CHINA
FULL_NIM_CHINA
RF_SWITCH_CTL
C3731
10uF
10V
OPT
C
Q3704
2SC3052
OPT
E
C3708
0.1uF
16V
R3724
FULL_NIM
FULL_NIM
FULL_NIM
R3725
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
R3727
R3728
R3729
R3726
R3721
R3722
R3723
Close to the CI Slot
R3706
FULL_NIM_BR
B
R3730
R3731
OPTION : RF AGC
R3754
10K
OPT
FE_AGC_SPEED_CTL
IF_AGC_SEL
TU_I2C_NON_FILTER
+3.3V_TU
R3733
R3732
100K
100
C3710
0.1uF
16V
IF_N_MSTAR
IF_P_MSTAR
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
0
0
0
0
0
0
0
0
0
0
0
0
FE_TS_SYNC
FE_TS_VAL_ERR
FE_TS_CLK
TU_I2C_NON_FILTER
C3711
18pF
50V
TUNER_RESET
R3704
FE_TS_DATA[0]
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
GPIO must be added.
33
TU_I2C_NON_FILTER
C3713
33
TU_I2C_NON_FILTER
18pF
50V
TU_I2C_FILTER
C3711-*1
20pF
50V
TU_I2C_FILTER
TU_I2C_FILTER
R3735-*1
COIL
0
HALF_NIM
BOOSTER_OPT
TU_IIC_NON_ATSC_SANYO
R3740-*1
1K
TU_IIC_ATSC_SANYO
R3735
R3736
C3742
20pF
TU_I2C_FILTER
50V
C3713-*1
20pF
50V
TU_I2C_FILTER
TU_I2C_FILTER
R3736-*1
C3743
20pF
50V
COIL
IF_AGC_MAIN
should be guarded by ground
C3712
22pF
50V
FULL_NIM
FE_TS_DATA[0-7]
FULL_NIM_BR
TU3701-*2
TDFR-B036F
RF_S/W_CNTL
1
BST_CNTL
2
+B1[5V]
3
NC_1[RF_AGC]
4
NC_2
5
SCLT
6
SDAT
7
NC_3
8
SIF
9
NC_4
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_5
16
SCL
17
SDA
18
ERR
19
SYNC
20
VALID
21
MCL
22
D0
23
D1
24
D2
25
D3
26
D4
27
D5
28
D6
29
D7
30
31
SHIELD
+5V_TU
C3709
0.01uF
25V
+3.3V_TU
R3740
1.2K
L3701
BLM18PG121SN1D
BOOSTER_OPT
R3734
0
Q3701
ISA1530AC1
E
B
C
BOOSTER_OPT
TU_IIC_ATSC_SANYO
R3741
1.2K
FULL_NIM
C3714
22pF
50V
FULL_NIM
BOOSTER_OPT
BOOSTER_OPT
R3737
2.2K
C
Q3702
2SC3052
E
TU_IIC_NON_ATSC_SANYO
R3741-*1
1K
TU_SCL
TU_SDA
+3.3V_TU
R3742
R3744
4.7K
4.7K
FULL_NIM
CN_2INPUT_H_ALTO
TU3701-*4
TDFR-C236D
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
SHIELD
BOOSTER_OPT
R3743
10K
BOOSTER_OPT
B
BOOSTER_OPT
RF_S/W_CNTL
1
BST_CNTL
2
+B1[+5V]
3
NC[RF_AGC]
4
NC_1
5
SCLT
6
SDAT
7
NC_2
8
SIF
9
NC_3
VIDEO
GND
+B2[1.2V]
+B3[3.3V]
RESET
NC_4
SCL
SDA
ERR
SYNC
VALID
MCL
D0
D1
D2
D3
D4
D5
D6
D7
BOOSTER : CHINA OPT
R3745
10K
FE_BOOSTER_CTL
LNA2_CTL
The pull-up/down of LNA2_CTL
is depended on MODLE_OPT_1.
GPIO must be added for FE_BOOSTER_CTL
R3749 0
R3750
1K
OPT
DEMOD_SCL
DEMOD_SDA
+5V_TU
R3751
220
B
+3.3V_TU
C3717
0.1uF
16V
+5V_Normal
FULL_NIM_BCD
R3752
220
E
Q3703
ISA1530AC1
C
HALF_NIM_1.2V_DIODES
Please, check multi Item! 10/12
R3771 10K
FULL_NIM_BCD
R3770 10K
FULL_NIM_SEMTEK
R376910K
FULL_NIM_BCD
L3704
200mA
IC3703-*1
AP1117EG-13
OUTIN
ADJ/GND
+5V_TU
C3719
22uF
10V
TUNER_L
R3753
4.7K
TU_CVBS
HALF_NIM_1.2V_BCD
AZ1117BH-ADJTRE1
INPUT
IC3701
AP2132MP-2.5TRG1
PG
1
FULL_NIM_BCD
EN
2
VIN
3
VCTRL
4
IC3701-*1
SC4215ISTRT
NC_1
1
FULL_NIM_SEMTEK
EN
2
VIN
3
NC_2
4
MLB-201209-0120P-N2
C3724
0.1uF
16V
GP2R
+5V_TU
R3755
470
E
B
Q3705
C
IC3703
ADJ/GND
3
1
2
HALF_NIM
OUTPUT
R3768
1.2K
R1
[EP]
GND
8
ADJ
9
7
THERMAL
VOUT
6
NC
5
GND
8
ADJ
7
VO
6
NC_3
5
+5V_TUNER
L3702
C3722
22uF
16V
location movement,0929
R3758
82
TU_SIF
ISA1530AC1
DEMOD_RESET
This was being applied to the only china demod,
so this has to be deleted in both main and ISDB sheet.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2R
AMP_NTP
20101023
16
Page 44
Rear AV
JK1604
PPJ233-01
FIX-TER
PPJ-230-01
JK1601
COMPONENT1
REAR_AV
11
5C
4C
3C
4B
3A
4A
5A
10
9
8
7
6
5
4
13
[RD]E-LUG
[RD]O-SPRING
[RD]CONTACT
[WH]C-LUG
[YL]CONTACT
[YL]O-SPRING
[YL]E-LUG
[GN]GND
[GN]G
[GN]C_DET
[BL]B
[RD]R
[WH]L_IN
[RD]R_IN
[RD]MONO
L-MONO
0
R4223
COMPONENT1
EU_OPT
PSC008-01
JK1602
Full Scart/ Comp1
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
AV_DET
COM_GND
SYNC_IN
SYNC_OUT
SYNC_GND2
SYNC_GND1
RGB_IO
R_OUT
RGB_GND
R_GND
D2B_OUT
G_OUT
D2B_IN
G_GND
ID
B_OUT
AUDIO_L_IN
B_GND
AUDIO_GND
AUDIO_L_OUT
AUDIO_R_IN
AUDIO_R_OUT
R4221
0
EU_OPT
REAR_AV
D1619
30V
R1654
75
REAR_AV
REAR_AV
D1626
5.6V
C1643
47pF
50V
REAR_AV
D1625
5.6V
REAR_AV
R1672
470K
REAR_AV
D1624
5.6V
OPT
R1671
470K
REAR_AV
D1602
30V
OPT
D1603
30V
OPT
D1604
30V
D1605
30V
D1606
30V
D1607
5.6V
NON_EU
D1609
5.6V
NON_EU
D1608
5.6V
OPT
D1601
5.6V
OPT
C1648
220pF
50V
OPT
+3.3V_Normal
C1646
0.1uF
16V
REAR_AV
L1609
120-ohm
REAR_AV
L1610
120-ohm
REAR_AV
D1610
30V
OPT
R1660
10K
REAR_AV
R1604
75
R1605
R1607
470K
R1608
75
75
R1606
470K
R1666
1K
REAR_AV
C1663
330pF
50V
REAR_AV
C1662
330pF
50V
REAR_AV
AV_CVBS_IN
REAR_AV
R1685
10K
REAR_AV
R1684
10K
D1611
5.6V
OPT
R1689
12K
EU_OPT
R1609
75
REAR_AV
R1688
12K
REAR_AV
EU_OPT
L1602
BLM18PG121SN1D
AV_CVBS_DET
AV_R_IN
AV_L_IN
+3.3V_Normal
R1613
10K
EU_OPT
C1604
47pF
50V
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
L1604
120-ohm
L1603
120-ohm
EU_OPT
L1601
BLM18PG121SN1D
C1607
0.1uF
16V
C1608
220pF
50V
OPT
R1614
1K
EU_OPT
R4210
0
C1611
330pF
50V
C1612
330pF
50V
EU_OPT
C1609
1000pF
50V
EU_OPT
C1610
1000pF
50V
OPT
D1618
30V
R1617
10K
R1618
10K
SC1_SOG_IN
SC1_CVBS_IN
EU_OPT
R1616
75
SC1/COMP1_DET
ISA1530AC1
EU_OPT
R1628
75
EU_OPT
R1627
22
EU_OPT
R1623
15K
COMPONENT2
6A
5A
4A
7B
5B
7C
5C
5D
4E
5E
6E
PPJ234-01
JK1603
REAR_COMP2
EU_OPT
E
Q1601
B
C
EU_OPT
R4211
390
EU_OPT
R1635
390
Rf
EU_OPT
C1620
Gain=1+Rf/Rg
100uF
16V
SC1_FB
OPT
30V
D1716
EU_OPT
R1629
3.9K
R1630
12K
R1631
12K
EU_OPT
C1618
4700pF
EU_OPT
C1619
4700pF
SC1_ID
SC1/COMP1_L_IN
SC1/COMP1_R_IN
[GN]E-LUG
[GN]O-SPRING
[GN]CONTACT
[BL]E-LUG-S
[BL]O-SPRING
[RD]E-LUG-S
[RD]O-SPRING_1
[WH]O-SPRING
[RD]CONTACT
[RD]O-SPRING_2
[RD]E-LUG
EU_OPT
R1640
470
EU_OPT
Q1602
2SC3052
C
B
E
EU_OPT
Rg
R1639
180
REC_8
DTV/MNT_L_OUT
DTV/MNT_R_OUT
EU_OPT
R1641
47K
EU_OPT
R1642
15K
D1614 30V
EU_OPT
C1621
47uF
16V
+3.3V_Normal
OPT
D1612
30V
D1615
30V
D1616
D1617
IN CASE OF SMALL= 15V
EU_OPT
L1606
EU_OPT
C1623
0.1uF
50V
R1612
10K
5.6V
5.6V
D1613
5.6V
+12V/+15V
EU_OPT
C1625
0.1uF
50V
DTV/MNT_VOUT
R1625
470K
R1626
470K
R1615
1K
R1619
75
R16 20
75
R16 21
75
[SCART AUDIO MUTE]
DTV/MNT_L_OUT
DTV/MNT_R_OUT
EU_OPT
Q1607
2SC3052
EU_OPT
Q1608
2SC3052
C1616
1000pF
50V
C1617
1000pF
50V
EU_OPT
R1648
2K
EU_OPT
R1650
2K
R1633
10K
R1632
10K
COMP2_DET
COMP2_Y+
COMP2_Pb+
COMP2_Pr+
R1636
12K
OPT
R1634
12K
OPT
COMP2_L_IN
COMP2_R_IN
CLOSE TO MSTAR
C1664
0.01uF
R4219100
R4216100
SCART1_MUTE
C1665
0.01uF
EU_OPT
RT1P141C-T112
Q1610
3
1
2
EU_OPT
C1636
0.1uF
+12V/+15V
EU_OPT
R1652
10K
C1642
0.1uF
50V
EU_OPT
SCART1_Lout
SCART1_Rout
+3.5V_ST
ETHERNET FOR DVB_T2
TP1610
TP1611
TP1612
TP1613
TP1614
TP1615
TP1616
TP1617
TP1618
TP1619
TP1620
DTV/MNT_L_OUT
R4218
22K
R4217
22K
DTV/MNT_R_OUT
EU_OPT
[SCART PIN 8]
OPT
R1675
2K
SC_RE1
SC_RE2
OPT
R1676
560
OPT
R1678
680
EU_OPT
C1644
10uF
16V
C1645
10uF
16V
OPT
R1677
10K
OPT
R1681
1K
EU_OPT
R1655
2.2K
R1680
1K
EU_OPT
R1656
2.2K
OPT
R1662
470K
R1687
10K
OPT
EU_OPT
R1657
5.6K
EU_OPT
R1658
5.6K
OPT
B
OPT
R1661
470K
C
Q1611
2SC3052
E
OPT
ET_RXD0
ET_TXD0
ET_RXD1
ET_TXD1
ET_REF_CLK
ET_TX_EN
ET_MDC
ET_MDIO
ET_CRS
ET_RXER
/RST-PHY
EU_OPT
R1664
33K
EU_OPT
C1654
33pF
EU_OPT
R1665
33K
C1655
33pF
EU_OPT
EU_OPT
+12V/+15V
IN CASE OF SMALL= 15V
OPT
R1695
12K
C
B
Q1613
E
2SC3052
OPT
EU_OPT
R1667
10K
R1668
10K
OPT
NON_INV_IN1
NON_INV_IN2
OUT1
IN1-
IN1+
VCC
IN2+
IN2-
OUT2
R4207
51K
OUT1
1
INV_IN1
2
3
VCC
4
5
INV_IN2
6
OUT2
7
EU_OPT_BCD
IC1601
AS324MTR-E1
1
2
3
4
5
6
7
C
B
Q1615
2SC3052
E
IC1601-*1
SN324
EU_OPT_AUK
14
13
12
11
10
9
8
OPT
REC_8
OUT4
IN4-
IN4+
GND
IN3+
IN3-
OUT3
14
13
12
11
10
9
8
OUT4
INV_IN4
NON_INV_IN4
GND
NON_INV_IN3
INV_IN3
OUT3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2R
REAR_JACK
20101023
17
Page 45
PPJ235-01
JK9903
SIDE_AV_3HOLE
5A
[YL]E-LUG
4A
[YL]O-SPRING
3A
[YL]CONTACT
4B
[WH]O-SPRING
3C
[RD]CONTACT
4C
[RD]O-SPRING
5C
[RD]E-LUG
SIDE CVBS PHONE JACK
(New Item Development)
JK9901
KJA-PH-1-0177
SIDE_AV_GENDER
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
ADUC30S03010L_AMODIODE
SIDE COMPONENT PHONE JACK
(New Item Developmen)
JK9902
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
SIDE_COMP
SIDE_CVBS
D9901
30V
OPT
D9902
SIDE_CVBS
D9903
5.6V
SIDE_CVBS
D9904
5.6V
5.6V
ADMC5M03200L_AMODIODE
ADMC5M03200L_AMODIODE
ADMC5M03200L_AMODIODE
+3.3V_Normal
D9907
30V
SIDE_COMP
D9905
30V
SIDE_COMP
D9906
30V
SIDE_COMP
SIDE_CVBS
R9907
75
SIDE_CVBS
SIDE_CVBS
SIDE_CVBS
R9906
470K
R9905
470K
R9904
10K
SIDE_COMP
D9908
5.6V
OPT
+3.3V_Normal
C9901
100pF
SIDE_CVBS
L9902
BLM18PG121SN1D
SIDE_CVBS
L9901
BLM18PG121SN1D
SIDE_COMP
SIDE_COMP
SIDE_COMP
SIDE_CVBS
L9903
BLM18PG121SN1D
SIDE_CVBS
10K
R9911
R9912
1K
SIDE_COMP
R9910
75
75
R99 09
75
R99 08
SIDE_CVBS
C9906
100pF
50V
SIDE_CVBS
C9905
100pF
50V
SIDE_CVBS
R9915
1K
SIDE_CVBS
R99 14
10K
SIDE_CVBS
R99 13
10K
C9907
100pF
OPT
SIDE_CVBS
R9917
12K
SIDE_CVBS
R9916
12K
COMP2_DET
SIDEAV_CVBS_IN
SIDEAV_DET
SIDEAV_L_IN
SIDEAV_R_IN
COMP2_Y+
COMP2_Pb+
COMP2_Pr+
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2R
PCMCI
20101023
20
Page 47
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
8.5T_GAS
MDS62110209
GAS1-*5
8.5T_GAS
MDS62110209
GAS2-*5
8.5T_GAS
MDS62110209
GAS3-*5
8.5T_GAS
MDS62110209
GAS4-*5
8.5T_GAS
MDS62110209
GAS5-*5
8.5T_GAS
MDS62110209
GAS6-*5
8.5T_GAS
MDS62110209
GAS7-*5
12.5T_GAS
MDS61887708
GAS1-*4
12.5T_GAS
MDS61887708
GAS2-*4
12.5T_GAS
MDS61887708
GAS3-*4
12.5T_GAS
MDS61887708
GAS4-*4
12.5T_GAS
MDS61887708
GAS5-*4
12.5T_GAS
MDS61887708
GAS6-*4
12.5T_GAS
MDS61887708
GAS7-*4
9.5T_GAS
MDS61887710
GAS1-*3
9.5T_GAS
MDS61887710
GAS2-*3
9.5T_GAS
MDS61887710
GAS3-*3
9.5T_GAS
MDS61887710
GAS4-*3
9.5T_GAS
MDS61887710
GAS5-*3
9.5T_GAS
MDS61887710
GAS6-*3
9.5T_GAS
MDS61887710
GAS7-*3
7.5T_GAS
MDS62110205
GAS1-*2
7.5T_GAS
MDS62110205
GAS2-*2
7.5T_GAS
MDS62110205
GAS3-*2
7.5T_GAS
MDS62110205
GAS4-*2
7.5T_GAS
MDS62110205
GAS5-*2
7.5T_GAS
MDS62110205
GAS6-*2
7.5T_GAS
MDS62110205
GAS7-*2
5.5T_GAS
MDS62110204
GAS1-*1
5.5T_GAS
MDS62110204
GAS2-*1
5.5T_GAS
MDS62110204
GAS3-*1
5.5T_GAS
MDS62110204
GAS4-*1
5.5T_GAS
MDS62110204
GAS5-*1
5.5T_GAS
MDS62110204
GAS6-*1
5.5T_GAS
MDS62110204
GAS7-*1
6.5T_GAS
MDS62110206
GAS1
6.5T_GAS
MDS62110206
GAS2
6.5T_GAS
MDS62110206
GAS3
6.5T_GAS
MDS62110206
GAS4
6.5T_GAS
MDS62110206
GAS5
6.5T_GAS
MDS62110206
GAS6
6.5T_GAS
MDS62110206
GAS7
SMD GASKET
SMD_GAS
GP2R
20101023
20
Page 48
L/DIM_LED/DRIVER
P2100
12507WR-08L
1
2
3
4
5
6
7
8
9
C2100
18pF
50V
OPT
+3.3V_Normal
R2102
10K
R2103
10K
FRC_L/DIM_REVERSE_SEL
C2101
18pF
50V
OPT
+3.3V_Normal
OPT
R2100
2.2K
R2101
2.2K
LED_DRIVER_D/L
LED_DRIVER_D/L_SCL
LED_DRIVER_D/L_SDA
L/DIM_SCLK
L/DIM_MOSI
V_SYNC
C2102
18pF
50V
OPT
C2103
18pF
50V
OPT
LED_DRIVER_D/L
R4029
22
R4028
22
LED_DRIVER_D/L
C2104
18pF
50V
OPT
LED_DRIVER_D/L
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2R
L/DIM_LED
20101023
21
Page 49
TI solution RF-3D OPTION
P3401
12507WR-12L
3D_SG
13
.
3D_SG
+3.3V_Normal
R3411
2.7K
3D_SG
R3412
2.7K
3D_SG
M_RFModule_RESET
DC_MREMOTE
DD_MREMOTE
FREQ.
3D Off
60Hz
59.94Hz
50Hz
RESERVED
RESERVED
RESERVED
RESERVED
GPOIO_0
GPOIO_1
00
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
GPOIO_2
1
0
1
0
1
0
1
+3.3V_Normal
L3401
120-ohm
3.3V
1
GND
2
RX
3
TX
4
RESET
5
DC
6
DD
7
GND
8
GPIO_0
9
GPIO_1
10
GPIO_2
11
3D_SYNC
12
3D_SG
R3402
100
3D_SG
R3401
100
3D_SG
3D_SG
R3408
100
3D_SG
R3409
100
3D_SG
R3407
100
3D_SG
R3406
22
3D_SG
R3404
22
3D_SG
R3405
22
3D_SG
R3403
22
M_REMOTE_RX
M_REMOTE_TX
3D_GPIO_0
3D_GPIO_1
3D_GPIO_2
3D_SYNC_RF
R3410
2.7K
ALL 3D-SG OPTION
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Page 50
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