LG 32LT75 Diagram

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LD74A

MODEL : 32LT75/76 32LT75/76-ZA

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

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Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................10

TROUBLE SHOOTING ............................................................................14

BLOCK DIAGRAM...................................................................................23

EXPLODED VIEW .................................................................................. 28

REPLACEMENT PARTS LIST ............................................................... 30

SVC. SHEET ...............................................................................................

Only for training and service purposes

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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

Only for training and service purposes

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500

°F to 600°F)

b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500

°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Only for training and service purposes

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Only for training and service purposes

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SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. General Specification(LCD MODULE)

2. Model General Specification

Item Specification Remark

Market UK, France, Germany, Spain, Sweden, Finland, Italy Broadcasting system PAL-BG UK, France, Germany, Spain, Sweden, Finland, Italy

PAL-DK PAL-I,I’ DVB-T (ID TV)

Receiving system Analog : Upper Heterodyne

Digital : COFDM

Scart Jack (2EA) PAL, SECAM Scart 1 Jack is Full scart and support RF-OUT(analog)

Scart 2 jack is Half scart and support MNT-OUT.

Video Input (2EA) PAL, SECAM, NTSC 4 System :

PAL, SECAM, NTSC, PAL60

S-Video Input (1EA) PAL, SECAM, NTSC 4 System :

PAL, SECAM, NTSC, PAL60 Component Input (1EA) Y/Cb/Cr, Y/ Pb/Pr RGB Input RGB-PC,

RGB-DTV

HDMI Input (2EA) HDMI-PC

HDMI-DTV & SOUND

Audio Input (4 EA) PC Audio, Component, AV (2EA) L/R Input

Item Specification Remark

Display Screen Device 32” wide Color Display Module LCD

Aspect Ratio 16:9

LCD Module 32” TFT WXGA LCD MAKER : LPL

Operating Environment Temp. : 0 ~ 40 deg

Humidity : 0 ~ 85% LGE SPEC

Storage Environment Temp. : -20 ~ 60 deg

Humidity : 0 ~ 85 %

Input Voltage 100-240V~, 50/60Hz

Power Consumption Power on (Green)

Total 114.32W (Typ.) (Logic=4.32(4.1)W, Backlight =110W )

St-By (Red) : 1.0 W

Type Size 760.0 x 450.0 x 48.0

Pixel Pitch 0.17025 x 0.51075

Back Light 18 EEFL

Display Colors 16.7M (16,777,216)

Coating 3H, AG

Only for training and service purposes

Item Min Typ Max Unit Maker Remark Luminance 400 500 cd/m LPL(0RT)32” -50cm from the surface (W/O PC mode) - Full White Pattern View angle (R/L, U/D) 178/178 degree 32” Color Coordinate White X Typ. 0.279/0.279/0.279 Typ. LPL 32”

Y -0.03 0.292/0.292/0.292 +0.03

Red X 0.635/0.636/0.635

Y 0.339/0.343/0.344

Green X 0.282/0.284/0.286

Y 0.606/0.615/0.614

Blue X 0.145/0.144/0.146

Y 0.064/0.063/0.061 Contrast ratio (W/O PC mode) 600 800 32” LPL(0-RT) Luminance Variation 1.3

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3. Chroma & Brightness (LCD Module-LPL)

4. Component Video Input (Y, PB, PR)

Specification

Proposed

Resolution H-freq(kHz) V-freq(Hz) 1 720*480 15.73 60.00 SDTV, DVD 480i 2 720*480 15.63 59.94 SDTV, DVD 480i 3 720*480 31.47 59.94 480p 4 720*576 15.625 50.00 SDTV, DVD 625 Line 5 720*576 31.25 50.00 HDTV 576p 6 1280*720 45.00 50.00 HDTV 720p 7 1280*720 44.96 59.94 HDTV 720p 8 1920*1080 31.25 50.00 HDTV 1080i 9 1920*1080 33.75 60.00 HDTV 1080i

10 1920*1080 33.72 59.94 HDTV 1080i

Only for training and service purposes

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6. HDMI input (DTV Mode)

5. RGB PC INPUT Mode Table

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 720*400 31.468 70.08 28.321

2. 640*480 31.469 59.94 25.17 VESA Input 848*480 60Hz, 852*480 60Hz

37.684 75.00 31.50 --> 640*480 60Hz Display

3 800*600 37.879 60.31 40.00 VESA

46.875 75.00 49.50 4 832*624 49.725 74.55 57.283 Macintosh 5 1024*768 48.363 60.00 65.00 VESA(XGA)

56.470 70.00 75.00

60.123 75.029 78.75 6 1280*768 47.78 59.87 79.5 WXGA 7 1360*768 47.72 59.8 84.75 WXGA 8 1366*768 47.56 59.6 84.75 WXGA 9 1280*1024 63.595 60.0 108.875 SXGA FHD Model only

10 1400*1050 65.160 60.0 122.50 SXGA FHD Model only 11 1600*1200 74.077 60.0 130.375 UXGA Reduced Blanking Timing, FHD Model only

Input 1920*1200 60Hz -> 1600*1200 60Hz Display

12 1920*1080 66.647 59.988 138.625 WUXGA Reduced Blanking Timing

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 720*480 31.47 59.94 27.00 SDTV 480P(4:3) PC mode -> 640*480 60Hz Display

2. 720*480 31.50 60 27.027 SDTV 480P(4:3)

3. 640*480 31.469 59.94 25.175 SDTV 480P(4:3)

4. 640*480 31.469 60.00 25.20 SDTV 480P(4:3)

5. 720*480 31.47 59.94 27.000 SDTV 480P(16:9)

6. 720*480 31.50 60.00 27.027 SDTV 480P(16:9)

7. 720*576 31.25 50.00 27.000 SDTV 576P

8. 1280*720 37.50 50.00 74.176 HDTV 720P

9. 1280*720 44.96 59.94 74.176 HDTV 720P PC mode -> 1280*720 60Hz Display

10. 1280*720 45.00 60.00 74.250 HDTV 720P 11 1920*1080 33.72 59.94 74.176 HDTV 1080I 12 1920*1080 33.75 60.00 74.250 HDTV 1080I 13 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz 14 1920*1080 27.000 24.00 74.250 HDTV 1080P 24Hz 15 1920*1080 56.250 50 148.500 HDTV 1080P 50Hz 16 1920*1080 67.433 59.94 148.352 HDTV 1080P PC mode -> 1920*1080 60Hz Display 17 1920*1080 67.500 60 148.500 HDTV 1080P

Only for training and service purposes

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7. HDMI input (PC Mode)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 720*400 31.468 70.08 28.321

2. 640*480 31.469 59.94 25.17 VESA DTV mode --> 480p Display

37.684 75.00 31.50 848*480 60Hz, 852*480 60Hz Ë No signal

3 800*600 37.879 60.31 40.00 VESA

46.875 75.00 49.50

4. 832*624 49.725 74.55 57.283 Macintosh

5. 1024*768 48.363 60.00 65.00 VESA(XGA)

56.470 70.00 75.00

60.123 75.029 78.75 6 1280*768 47.78 59.87 79.5 WXGA PC mode only 7 1360*768 47.72 59.8 84.75 WXGA 8 1366*768 47.56 59.6 84.75 WXGA 9 1280*1024 63.595 60.0 108.875 SXGA FHD Model only

10 1400*1050 65.160 60.0 122.50 SXGA FHD Model only 11 1600*1200 74.077 60.0 130.375 UXGA Reduced Blanking Timing, FHD Model only

Input 1920*1200 60Hz --> No Signal

12 1920*1080 66.647 59.988 138.625 WUXGA Reduced Blanking Timing

DTV mode --> 1080P Display

Only for training and service purposes

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ADJUSTMENT INSTRUCTION

1. Application Range

This spec. sheet is applied to all of the LD74A chassis manufactured at LG TV Plant all over the world.

2. Specification.

1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation transformer will help to protect test instruments

2) Adjustment must be done in the correct sequence.

3) The adjustment must be performed at 25±5°C temperature

and 65±10% relative humidity if there is no specified designation.

4) The input voltage of the receiver must be kept between

100-220V~, 50/60Hz.

5) Before adjustment, execute Heat-Run for 30 minutes at RF

no signal.

3. Channel Memory

1) Press ADJ key in Adjust remote control.

2) Select “Channel Recover” by using

D/E (CH+/-) key, and

press

G (VOL+).

3) The set is turned off automatically.

4) Press ‘power’ key of Adjust Remote control.

4. EDID

* Caution

1) Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

2) Never connect HDMI & D-sub Cable at the same time.

3) Use the proper cables below for EDID Writing.

4) Download HDMI1, HDMI2 separately because HDMI1 is different from HDMI2.

4.1. EDID Data

4.2. Data

(1) ANALOG (128 bytes)

(2) HDMI 1 (256 bytes)=>

=> Detail EDID Options are below (a, b, c, d, e-1, e-2, f-1, f-2)

(3) HDMI 2 (256 bytes)

=> Detail EDID Options are below (a, b, c, d, e-1, e-2, f-1, f-2)

ⓐ Product ID ⓑ Serial No: Controlled on production line.

ex) Monthly : ‘09’ -> ‘09’

Year : ‘2006’ -> ‘10’

ⓓ Model Name(Hex): ⓔ-1, ⓔ-2, ⓕ-1, ⓕ-2 Checksum: Changeable by total

EDID data.

Item

Manufacurer ID

Version

Revision

Condition

GSM Digital : 1 Digital : 3

Data(Hex)

1E6D

01 03

D-sub to D-sub DVI-D to HDMI or HDMI ro HDMI

For HDMI EDID

0x000x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B0x0C 0x0D 0x0E0x0F

0x00 00 FF FF FF FF FF FF 00 1E 6D ⓐⓑ 0x01 ⓒ 01 03 01 46 27 78 EA D9 B0 A3 57 49 9C 25 0x02 11 49 4B A5 6E 00 31 40 45 40 61 40 D1 C0 01 01 0x03 01 01 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88 0x04 35 00 BC 86 21 00 00 1C 26 36 80 A0 70 38 1F 40 0x05 50 20 85 04 BC 86 21 00 00 18 ⓓ 0x06 ⓓ 00 00 00 FD 0x07 00 3C 4B 1D 43 0E 00 0A 20 20 20 20 20 20 00 ⓔ-1

For Analog EDID

0x000x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B0x0C 0x0D 0x0E0x0F

0x00 00 FF FF FF FF FF FF 00 1E 6D ⓐⓑ 0x01 ⓒ 01 03 80 46 27 78 EA D9 B0 A3 57 49 9C 25 0x02 11 49 4B A5 6E 00 31 40 45 40 61 40 D1 C0 01 01 0x03 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 0x04 45 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30 0x05 48 88 35 00 BC 86 21 00 00 1C ⓓ 0x06 ⓓ 00 00 00 FD 0x07 00 32 4B 1C 43 0F 00 0A 20 20 20 20 20 20 01 ⓔ-2 0x00 02 03 21 F1 4E 02 11 01 03 12 13 04 14 05 21 1F 0x01 20 22 10 23 09 07 07 83 01 00 00 65 3 0C 00 10 0x02 00 01 1D 00 BC 52 D0 1E 20 B8 28 55 40 C4 8E 21 0x03 00 00 1E 01 1D 00 72 51 D0 1E 20 6E 28 55 00 C4 0x04 8E 21 00 00 1E 01 1D 80 D0 72 1C 16 20 10 2C 25 0x05 80 C4 8E 21 00 00 9E 8C 0A D0 90 20 40 31 20 0C 0x06 40 55 00 C4 8E 21 00 00 18 4E 1F 00 80 51 00 1E 0x07 30 40 80 37 00 BC 88 21 00 00 18 00 00 00 00 ⓕ-1

0x000x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B0x0C 0x0D 0x0E0x0F

0x00 0 FF FF FF FF FF FF 0 1E 6D ⓐⓑ 0x01 ⓒ 1 3 80 46 27 78 EA D9 B0 A3 57 49 9C 25 0x02 11 49 4B A5 6E 0 31 40 45 40 61 40 D1 C0 1 1 0x03 1 1 1 1 1 1 2 3A 80 18 71 38 2D 40 58 2C 0x04 45 0 C4 8E 21 0 0 1E 1B 21 50 A0 51 0 1E 30 0x05 48 88 35 0 BC 86 21 0 0 1C ⓓ 0x06 ⓓ 000FD 0x07 0 32 4B 1C 43 0F 0 0A 20 20 20 20 20 20 1 ⓔ-2 0x00 2 3 21 F1 4E 2 11 1 3 12 13 4 14 5 21 1F 0x01 20 22 10 23 9 7 7 83 1 0 0 65 3 0C 0 10 0x02 0 1 1D 0 BC 52 D0 1E 20 B8 28 55 40 C4 8E 21 0x03 0 0 1E 1 1D 0 72 51 D0 1E 20 6E 28 55 0 C4 0x04 8E 21 0 0 1E 1 1D 80 D0 72 1C 16 20 10 2C 25 0x05 80 C4 8E 21 0 0 9E 8C 0A D0 90 20 40 31 20 0C 0x06 40 55 0 C4 8E 21 0 0 18 4E 1F 0 80 51 0 1E 0x07 30 40 80 37 0 BC 88 21 0 0 18 0 0 0 0 ⓕ-2

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