Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
LGD Edge LED 13000K 9300K 6500K O
LGD Edge LED 13000K 9300K 6500K O
LGD Edge LED 13000K 9300K 6500K O
LGD EEFL 11000K 9300K 6500K X
LGD EEFL 11000K 9300K 6500K X
LGD Direct LED 13000K 9300K 6500K X
LGD Direct LED 13000K 9300K 6500K X
LGD Direct LED 13000K 9300K 6500K X
LGD Edge LED 13000K 9300K 6500K O
LGD Edge LED 13000K 9300K 6500K O
Cool
(C50)
Medium
(0)
Warm
(W50)
LGD edge LED
W/B table for
※ Connecting picture of the measuring instrument (On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C P-ONLY à
Enter the mode of White-Balance, the pattern will come out.
Auto-control interface and directions
1. Adjust in the place where the influx of light like floodlight around is blocked. (Illumination is less than 10ux).
2. Adhere closely the Color Analyzer ( CA210 ) to the module less than 10cm distance, keep it with the surface of
the Module and Color Analyzer’s Prove vertically.(80~100°).
3. Aging time
-. After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.
-. Using ‘no signal’ or ‘POWER ONLY’ or the others, check the back light on.
■ Enter White Balance by pushing “►” key at “7. White Balance”.
using adjusts Remote control.
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Country Group
6. ADC Calibration
7. White Balance ▶
8. 10 Point WB
9. Test Pattern
10. EDID D/L
11. Sub B/C
12. Touch Sensitivity Setting
※ After You finish all adjustments, Press “In-start” button and compare Tool option and Area option
※ Push the “IN-STOP KEY” after completing the function inspection.
13. Ext. Input Adjust
value with its BOM, if it is correctly same then unplug the AC cable.
If it is not same, then correct it same with BOM and unplug AC cable.
For correct it to the model’s module from factory JIG model.
Color Temp. ◀Cool ▶
R-Gain 172
G-Gain 172
B-Gain 192
R-Cut 64
G-Cut 64
B-Cut 64
Test-Pattern ON
Backlight 100
Reset To Set
White Balance
4.2 DDC EDID Write (RGB 128Byte )
■ Connect D-sub Signal Cable to D-Sub Jack.
■ Write EDID DATA to EEPROM (24C02) by using DDC2B protocol.
■ Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert Process in advance.
4.3 DDC EDID Write (HDMI 256Byte)
■ Connect HDMI Signal Cable to HDMI Jack.
■ Write EDID DATA to EEPROM(24C02) by using DDC2Bprotocol.
■ Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert Process in advance.
Data write : Model Name and Serial Number write in EEPROM,.
4.5.4 Method & notice
A. Serial number D/L is using of scan equipment.
B. Setting of scan equipment operated by Manufacturing Technology Group.
C. Serial number D/L must be conformed when it is produced in production line, because serial number
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safety parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4L_S7LR2
POWER_LARGE
2011/11.22
4
Page 32
LVDS for large inch
[51Pin LVDS Connector]
(For FHD 60Hz)
FHD
P703
FI-RE51S-HF-J-R1500
OPT
C700
10uF
16V
R709
10K
AUO_GND
LVDS_SEL
+3.3V_Normal
OPT
C709
1000pF
50V
OPT
R705
3.3K
OPT
R710
10K
FHD
C710
0.1uF
16V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
PSU_T120_LGD
R706
0
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
PWM_DIM
AUO_GND/LGD_NC
PANEL_VCC
FHD
L702
70-ohm
SCANNING_EN
+3.3V_Normal
OPT
R703
3.3K
OPT
R704
10K
OPC&SCANNING_CTRL
FOR FHD REVERSE(10bit)
Change in S7LR
MIRROR
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+RXA2+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
Pol-change
RXA0+
RXA0-
RXA1+
RXA1-
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXA4+
RXA4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXBCK-
RXB3+
RXB3-
RXB4+
RXB4-
FOR FHD REVERSE(8bit)
Change in S7LR
MIRROR
RXA4+
RXA4-
RXA3+
RXA3-RXA0-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-RXB0+
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
Pol-changeShift
RXA4+
RXA4-
RXA0+
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXB4+
RXB4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXBCK-RXBCK+
RXB3+
RXB3-
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
RXA4-
RXA4+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXB4-
RXB4+
RXB0-
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXB3-
RXB3+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
HD
P705
FF10001-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
OPT
R713
0
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
LVDS_SEL
+3.3V_Normal
OPT
R712
3.3K
OPT
R711
10K
OPT
C701
10uF
16V
OPT
C702
1000pF
50V
HD
C703
0.1uF
16V
PANEL_VCC
HD
L701
70-ohm
BLM18SG700TN1D
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R1913
10K
R1924
10K
R1922
2.2K
B
C
Q1901
MMBT3904(NXP)
E
CI_ADDR[12]
CI_ADDR[13]
CI_ADDR[14]
CI_OE
CI_WE
CI_IORD
CI_IOWR
AR1913 33
REG
AR1909 33
PCM_A[12]
PCM_A[13]
PCM_A[14]
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORD
/PCM_IOWR
GP4L_S7LR2
PCMCI
11/08/13
19
Page 36
ETHERNET
* H/W option : ETHERNET
JK2100-*1
BS-R430051
JK2100
XRJV-01V-0-D12-080
+2.5V_Normal
ETHERNET
L3707
BLM18PG121SN1D
1
1
2
2
3
3
ETHERNET_UDE
4
4
5
5
6
6
7
7
8
8
9
9
1
2
3
ETHERNET_XMULTIPLE
4
5
6
7
8
9
9
ETHERNET
C2104
0.01uF
50V
OPT
D2103
5.5V
ADLC 5S 02 015
OPT
D2101
5.5V
ADLC 5S 02 015
OPT
D2105
5.5V
ADLC 5S 02 015
OPT
D2104
5.5V
ADLC 5S 02 015
EPHY_TP
EPHY_TN
EPHY_RP
EPHY_RN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4L_S7LR2
ETHERNET
2011/06/14
21
Page 37
IR/LED and control for on.y ’12 sub without IR-OUT.
+3.5V_ST
R2405
KEY1
KEY2
R2401
100
R2402
100
LED_B/LG_LOGO
R2404
10K
10K
1%
1%
L2401
BLM18PG121SN1D
L2402
BLM18PG121SN1D
+3.5V_ST
IR_OUT
C2401
0.1uF
L2403
BLM18PG121SN1D
C2402
OPT
0.1uF
D2401
5.6V
AMOTECH CO., LTD.
C2403
0.1uF
16V
AMOTECH CO., LTD.
OPT
D2402
5.6V
C2404
1000pF
50V
IR
SENSOR_SCL
SENSOR_SDA
LED_R/BUZZ
R2412 100
+3.5V_ST
R2426
3.3K
R2411
100
R2413
1.5K
C2407
100pF
P2400
OPT
D2403
C2408
5.48VTO5.76V
18pF
50V
OPT
D2404
C2409
5.48VTO5.76V
18pF
50V
OPT
C2410
0.1uF
50V
16V
JP2407
JP2408
D2405
5.48VTO5.76V
12507WR-10L
1
2
3
4
5
6
7
JP2409
8
JP2410
9
10
11
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
This was being applied to the only china demod,
so this has to be deleted in both main and ISDB sheet.
[EP]GND
GND
ADJ/SENSE
VOUT
NC_2
Vo=0.8*(1+R2/R1)
FULL_NIM
R2633
12K
FULL_NIM
R2634
22K
1%
+3.3V_S2_DE
DVB_S
DVB_S
C2634
C2632
0.1uF
10uF
16V
10V
1%
DEMOD_RESET
IF_AGC_SEL
LNA2_CTL
R2
R1
OPT
R2631
0
+3.3V_TU
FULL_NIM
C2643
22uF
10V
C2645
0.1uF
+3.3V_T2_TU
T2
T2
C2631
C2633
10uF
0.1uF
10V
16V
+3.3V_TU
16V
CIS21J121
C2644
0.1uF
16V
OPT
C2640
0.1uF
16V
+1.23V_TU
L2606
ERROR & VALID PIN
OPT
R2627
0
R2625
220
E
Q2601
MMBT3906(NXP)
C
FE_TS_VAL
FE_TS_ERR
TU_CVBS
+3.3V_TU
IC2603
AP1117E18G-13
INADJ/GND
OUT
R2872
0
R2
Vo=VREF*(1+R2/R1)
VREF=1.25V
FULL_NIM
R2629
3.3K
C2635
0.1uF
16V
+2.5V_TU+3.3V_Normal
OPT
R2620
1
1/16W
5%
OPT
C2628
10uF
10V
OPT
C2629
0.1uF
16V
+3.3V_TU
C2630
0.1uF
16V
R1
OPT
R2873
200
1%
TJ4220GDP-ADJ
NC_1
EN2
VIN3
NC4
BLM18PG121SN1D
BLM18PG121SN1D
+1.8V_TU
C2641
0.1uF
16V
FULL_NIM
IC2602
1
2
3
4
DVB_S
L2602
T2
L2603
FE_TS_VAL_ERR
FULL_NIM
C2647
10uF
10V
C2646
22uF
10V
C2648
0.1uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4L_S7LR2
TUNER_EU26
2011/12/09
Page 39
DVB-S2 LNB Part Allegro
(Option:LNB)
LNB_OUT
A_GND
LNB
C2700
0.22uF
25V
2A
LNB
D2703
MBR230LSFT1G
30V
LNB
ZD1
40V
LNB
C2701
0.01uF
50V
LNB
C2713
1uF
50V
close to Boost pin(#1)
LNB_TX
LNB
C2702
0.1uF
LNB
C2705
68uF
35V
LNB
C2703
0.1uF
50V
A_GND
A_GND
LNB
C2707
68uF
35V
DCDC_GND
LNB
D2700
SX34
40V
LNB
C2706
22000pF
A_GND
A_GND
BOOST
VCP
TCAP
NC_1
TDO
EXTM
TDI
LNB
D2702
40V
SX34
DCDC_GND
LNB
[EP]
1
THERMAL
2
3
4
5
6
7
GND
28
8
3A
LNB
L2700
33UH
SP-7850_33
2.4A
BFI
VIN
GNDLX
24
25
26LX27
29
IC2700
A8290SETTR-T
LNB
9
10
SDA11ADD12SCL
VREG
LNB
R2702 33
R2701 33
OPT
LNB
C2709 27pF
C27080.22uF
NC_9
23
13
NC_2
LNB
27pF
C2710
+12V_LNB
BFO
22
21
20
19
18
17
16
15
14
IRQ
OPT
DCDC_GND
NC_8
NC_7
BFC
NC_6
NC_5
NC_4
NC_3
+3.3V_Normal
LNB
R2704
4.7K
LNB
C2711
10uF
25V
A_GND
A_GND
LNB
C2712
0.1uF
50V
close to VIN pin(#25)
A_GND
+12V/+15V
R2705
0
DCDC_GND
Max 1.3A
LNB
L2701
BLM18PG121SN1D
+12V_LNB
DCDC_GND and A_GND are connected
DCDC_GND and A_GND are connected in pin#27
PCB_GND and A_GND are connected
Input trace widths should be sized to conduct at least 3A
Ouput trace widths should be sized to conduct at least 2A
R2706
0
A_GND
A_GND
DEMOD_SCL
DEMOD_SDA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4L_S7LR2
2011/11/16
AMP_STA380BWE34
Page 41
IC102
NAND FLASH MEMORY
/F_RB
/PF_OE
/PF_CE0
+3.3V_Normal
OPT
R104
10K
/PF_WP
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
R/B
RE
CE
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
CLE
ALE
WE
WP
NC_11
NC_12
NC_13
NC_14
NC_15
B
OS
3.3K
R102
NAND_FLASH_1G_HYNIX
EAN35669102
IC102-*1
H27U1G8F2BTR-BC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
DIMMING
A_DIM
PWM_DIM
A_DIM
C111
2.2uF
HDCP EEPROM
*Option : HDCP_EEPROM
IC103
CAT24WC08W-T
R113
4.7K
A0
1
8
A1
2
7
A2
3
6
VSS
4
5
/PF_CE1
C
E
VCC
WP
SCL
SDA
R156
R157
R127 4.7K
OPT
R105
1K
PF_ALE
/PF_WE
OPT
Q101
MMBT3904(NXP)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A_DIM
10K
100
OS
R107
1K
OPT
R108
1K
OS
R106
1K
NC_29
NC_28
NC_27
NC_26
I/O7
I/O6
I/O5
I/O4
NC_25
NC_24
NC_23
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
+3.3V_Normal
R128
R129 22
C107
0.1uF
22
OS
C101
0.1uF
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
R/B
CLE
ALE
PWM0
PWM2
+3.3V_Normal
OS
R109
3.9K
1
2
3
4
5
6
7
RE
8
CE
9
10
11
12
13
14
15
16
17
WE
18
WP
19
20
21
22
23
24
Addr:10101--
VDD_1
VSS_1
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
NAND01GW3B2CN6E
NC_1
1
NAND_FLASH_1G_NUMONYX
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
RB
7
R
8
E
9
NC_7
10
NC_8
11
12
13
NC_9
14
15
CL
16
AL
17
W
18
WP
19
20
21
22
23
24
NAND_FLASH_1G_SS
EAN61857001
IC102-*2
K9F1G08U0D-SCB0
I2C
I2C_SCL
I2C_SDA
EAN60762401
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
R141
R140
1K
1K
NC_29
NC_28
NC_27
NC_26
I/O7
I/O6
I/O5
I/O4
NC_25
NC_24
NC_23
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
R1601KR161
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1K
EEPROM
NC_29
NC_28
NC_27
NC_26
I/O7
I/O6
I/O5
I/O4
NC_25
NC_24
NC_23
VDD_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
+3.3V_Normal
+3.3V_Normal
OS
C102
10uF
OS
C103
0.1uF
NAND_FLASH_1G_TOSHIBA
TC58NVG0S3ETA0BBBH
NC_1
1
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
RY/BY
7
RE
8
CE
9
NC_7
10
NC_8
11
VCC_1
12
VSS_1
13
NC_9
14
NC_10
15
CLE
16
ALE
17
WE
18
WP
19
NC_11
20
NC_12
21
NC_13
22
NC_14
23
NC_15
24
R144
R145
2.2K
2.2K
IC104
AT24C256C-SSHL-T
NVRAM_ATMEL
A0
1
A1
2
A0’h
A2
3
GND
4
EAN61133501
OS
AR101
22
PCM_A[0-7]
PCM_A[7]
PCM_A[6]
PCM_A[5]PCM_D[4]
PCM_A[4]
OS
AR102
22
PCM_A[3]
PCM_A[2]
PCM_A[1]
PCM_A[0]
EAN61508001
IC102-*3
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O8
44
I/O7
43
I/O6
42
I/O5
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O4
32
I/O3
31
I/O2
30
I/O1
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
AMP_SDA
AMP_SCL
I2C_SDA
I2C_SCL
SENSOR_SDA
SENSOR_SCL
+3.3V_Normal
C105
0.1uF
VCC
8
WP
7
SCL
6
SDA
5
C104
8pF
OPT
R11122
R11222
C106
8pF
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
<CHIP Config(LED_R/BUZZ)>
Boot from SPI CS1N(EXT_FLASH) 1’b0
Boot from SPI_CS0N(INT_FLASH) 1’b1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4L_S7LR2
USB_OCP_DIODE_1EA
2011/11/18
52
Page 44
HDMI_2EA(NON SIDE HDMI)
HDMI_1
SHIELD
EAG59023302
JK802
+5V_Normal
5V_HDMI_1
20
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
R896
1K
R804
1.8K
5V_DET_HDMI_1
R802
3.3K
OPT
D802
NON_CI_CAP
C802
0.1uF
16V
R806
10K
C
R830
Q802
2SC3052
10K
B
E
HPD1
DDC_SDA_1
DDC_SCL_1
HDMI_CEC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
5V_HDMI_1
R884
2.7K
For CEC
HDMI_CEC
A1
A2
D821
MMBD6100
C
R888
2.7K
DDC_SDA_1
DDC_SCL_1
R855
100
CEC_REMOTE_S7
5V_HDMI_2
R885
2.7K
HDMI_2
+5V_Normal
A1
A2
C
R889
2.7K
HDMI_2
D822
MMBD6100
HDMI_2
DDC_SDA_2
DDC_SCL_2
HDMI_2
SHIELD
20
EAG59023302
HDMI_2
JK801
R805
HDMI_2
R807
10K
HDMI_2
C
HDMI_2
Q801
2SC3052
0
R828
10K
B
E
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
5V_HDMI_2
HDMI_2
R895
1K
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
HDMI_2
R803
1.8K
OPT
D801
5V_DET_HDMI_2
NON_CI_CAP_HDMI_2
C801
0.1uF
16V
HDMI_2
R801
3.3K
HDMI_ARC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4L_S7LR2
HDMI_2EA(NON SIDE HDMI)
2011/08/12
53
Page 45
COMPONENT
JK2803
PPJ234-05
[RD]E-LUG
6E
[RD]O-SPRING_2
5E
[RD]CONTACT_2
4E
[WH]O-SPRING
5D
[RD]CONTACT_1
4C
[RD]O-SPRING_1
5C
[RD]E-LUG-S
7C
[BL]O-SPRING
5B
[BL]E-LUG-S
7B
[GN]CONTACT
4A
[GN]O-SPRING
5A
[GN]E-LUG
6A
Full Scart
EU_OPT
JK2801
PSC008-01
AV_DET
22
COM_GND
21
SYNC_IN
20
SYNC_OUT
19
SYNC_GND2
18
SYNC_GND1
17
RGB_IO
16
R_OUT
15
RGB_GND
14
R_GND
13
D2B_OUT
12
G_OUT
11
D2B_IN
10
G_GND
9
ID
8
B_OUT
7
AUDIO_L_IN
6
B_GND
5
AUDIO_GND
4
AUDIO_L_OUT
3
AUDIO_R_IN
2
AUDIO_R_OUT
1
D2816
5.6V
D2815
5.6V
OPT
D2813
20V
OPT
D2812
20V
OPT
D2817
5.6V
D2814
R2831
10K
OPT
D2801
20V
OPT
D2802
20V
OPT
D2803
20V
OPT
D2804
20V
OPT
D2805
20V
OPT
D2806
5.6V
OPT
D2808
5.6V
OPT
D2807
5.6V
OPT
D2800
5.6V
OPT
C2811
1000pF
50V
R2832
10K
OPT
C2810
1000pF
50V
+3.3V_Normal
R2841
10K
OPT
D2818
5.6V
+3.3V_Normal
R2837
10K
OPT
D2809
20V
C2813
0.1uF
16V
OPT
D2810
5.6V
EU_OPT
R2806
75
EU_OPT
R2802
75
EU_OPT
R2803
75
EU_OPT
R2804
470K
EU_OPT
R2805
470K
R2833
12K
R2834
12K
R2842
1K
R2838
1K
EU_OPT
C2801
0.1uF
16V
+3.3V_Normal
EU_OPT
R2808
10K
EU_OPT
R2807
75
BLM18PG121SN1D
BLM18PG121SN1D
COMP2_DET
AV_CVBS_DET
EU_OPT
R2810
1K
EU_OPT
C2800
47pF
50V
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
EU_OPT
L2803
120-ohm
EU_OPT
L2802
120-ohm
EU_OPT
L2800
EU_OPT
L2801
SC1/COMP1_DET
EU_OPT
R2809
0
OPT
C2802
220pF
50V
SC1_SOG_IN
SC1_CVBS_IN
OPT
D2811
20V
EU_OPT
C2805
330pF
50V
EU_OPT
C2806
330pF
50V
EU_OPT
C2803
1000pF
50V
EU_OPT
C2804
1000pF
50V
EU_OPT
R2811
75
EU_OPT
R2814
15K
EU_OPT
R2812
10K
EU_OPT
R2813
10K
EU_OPT
EU_OPT
OPT
R2826
470K
OPT
R2825
470K
R28 23
75
R28 24
75
OPT
R2822
75
20V
MMBT3906(NXP)
R2816
75
R2815
22
COMP2_R_IN
COMP2_L_IN
COMP2_Pr+
COMP2_Pb+
COMP2_Y+/AV_CVBS_IN
EU_OPT
E
Q2800
EU_OPT
C2809
100uF
16V
EU_OPT
R2817
3.9K
EU_OPT
R2818
12K
EU_OPT
R2819
12K
EU_OPT
C2807
4700pF
EU_OPT
C2808
4700pF
B
C
EU_OPT
R2821
390
EU_OPT
R2820
390
Rf
Gain=1+Rf/Rg
EU_OPT
R2828
470
EU_OPT
Q2801
MMBT3904(NXP)
C
B
E
EU_OPT
R2827
Rg
180
SC1_FB
SC1_ID
SC1/COMP1_L_IN
SC1/COMP1_R_IN
DTV/MNT_L_OUT
DTV/MNT_R_OUT
EU_OPT
R2829
47K
EU_OPT
R2830
15K
EU_OPT
C2812
47uF
25V
EU_OPT
C2814
0.1uF
50V
IN CASE OF SMALL= 15V
+12V/+15V
EU_OPT
L2804
EU_OPT
C2815
0.1uF
50V
DTV/MNT_VOUT
SCART AUDIO OUT
+12V/+15V
SCART1_Lout
EU_OPT
C2817
0.1uF
50V
SCART1_Rout
SCART AUDIO MUTE
DTV/MNT_L_OUT
DTV/MNT_R_OUT
EU_OPT
Q2802
MMBT3904(NXP)
EU_OPT
Q2803
MMBT3904(NXP)
CLOSE TO MSTAR
EU_OPT
C2819
330pF
EU_OPT
C2820
330pF
EU_OPT
R2839
2K
EU_OPT
R2840
2K
DTV/MNT_L_OUT
EU_OPT
R2857
220K
EU_OPT
R2858
220K
DTV/MNT_R_OUT
EU_OPT
Q2804
MMBT3906(NXP)
3
1
2
EU_OPT
C2816
0.1uF
EU_OPT
C2821
10uF
16V
EU_OPT
C2822
10uF
16V
EU_OPT
R2844
10K
EU_OPT
R2861
2.2K
OPT
R2865
470K
EU_OPT
R2862
5.6K
EU_OPT
R2863
5.6K
EU_OPT
R2860
2.2K
+3.5V_ST
OPT
R2864
470K
EU_OPT
R2866
33K
EU_OPT
C2823
33pF
EU_OPT
R2867
33K
EU_OPT
C2824
33pF
SCART1_MUTE
OUT1
INV_IN1
NON_INV_IN1
NON_INV_IN2
INV_IN2
OUT2
OUT1
IN1-
EU_OPT
R2868
IN1+
10K
IN2+
IN2-
EU_OPT
R2869
10K
OUT2
EU_OPT_AUK
1
2
3
VCC
4
5
6
7
EU_OPT_BCD
AS324MTR-E1
1
2
3
VCC
4
5
6
7
IC2800-*1
SN324
IC2800
14
13
12
11
10
9
8
14
13
12
11
10
9
8
OUT4
INV_IN4
NON_INV_IN4
GND
NON_INV_IN3
INV_IN3
OUT3
OUT4
IN4-
IN4+
GND
IN3+
IN3-
OUT3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4L_S7LR2
REAR_JACK_EU(ERRC)
2011/08/13
55
Page 46
RS-232C 4PIN
PM_RXD
PM_TXD
+3.5V_ST
PM_RXD
PM_TXD
VCC
GND
P1000
12507WS-04L
1
2
3
4
5
GND
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4L_S7LR2
2011/09/26
RS232C_4PIN57
Page 47
MSTART DEBUG_4PIN
P1
12505WS-04A00
5
MSTAR_DEBUG_4P
1
2
3
4
RGB_DDC_SCL
RGB_DDC_SDA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4L_S7LR2
2011/09/05
MSTAR DEBUG_4PIN58
Page 48
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