LG 32LK450-DA Schematic

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LT01U

MODEL : 32LK450 32LK450-DA

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

Printed in KoreaP/NO : MFL67002804 (1103-REV00)

Only for training and service purposes

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CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................15

EXPLODED VIEW .................................................................................. 20

SVC. SHEET ...............................................................................................

Only for training and service purposes

- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument’s exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

IMPORTANT SAFETY NOTICE

0.15uF

Ω

Only for training and service purposes

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500

°F to 600°F)

b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500

°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Only for training and service purposes

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Only for training and service purposes

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SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

4. Electrical specification

4.1. Module Specification

1. Application range

This specification is applied to LCD TV used LT01U chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

Temperature : 25 ºC ± 5 ºC (77 ºF ± 9 ºF), CST : 40ºC ± 5 ºC

2) Relative Humidity : 65 ± 10 %

3) Power Voltage : Standard input voltage (100-240V~50/60Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

5) The receiver must be operated for about 20 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety: CE / IEC / BSMI specification EMI: CE / IEC / BSMI

No Item Specification Remark

1 Screen Device 32”/37”/42”/47”/55” wide Color Display module LCD 2 Aspect Ratio 16:9 3 LCD Module 31.5" Color TFT-LCD Module T315HW04 V9(AUO)

37” Color WUXGA TFT-LCD Module LC370WUE-SCA1(LGD) 42” Color WUXGA TFT-LCD Module LC420WUE-SCA2(LGD) 42” Color WUXGA TFT-LED Module V420H2-LE5(CMI) 47” Color WUXGA TFT-LCD Module LC470WUF-SCA2(LGD) 55” Color WUXGA TFT-LCD Module LC550EUF-SDA1(LGD)

4 Operating Environment 1) Temp. : 0 ~ 40 deg

2) Humidity : 0 ~ 80%

5 Storage Environment 1) Temp.: -20 ~ 60 deg

2) Humidity : 0 ~ 85 % 6 Input Voltage AC100-240V~, 50/60Hz 7 Power Consumption 105W 32” FHD T315HW04 V9(AUO)

148W 37” FHD LC370WUE-SCA1(LGD) 176W 42” FHD LC420WUE-SCA2(LGD) 125W 42” FHD V420H2-LE5(CMI) 233W 47” FHD LC470WUF-SCA2(LGD)

128.3W 55” FHD LC550EUF-SDA1(LGD) 8 Module Size AUO 32” 760.0 (H) x 450.0 (V) x 46.9 (D) T315HW04 V9(AUO)

LGD 37” 877.0 (H) x 516.8 (V) x 36.4 (D) LC370WUE-SCA1(LGD) LGD 42” 983.0 (H) x 576.0 (V) x 46.0 (D) LC420WUE-SCA2(LGD) CMI 42” 968.4 (H) x 564 (V) x 10.8 (D) V420H2-LE5(CMI) LGD 47” 1096.0(H) x 640.0(V) x 35.5 (D) LC470WUF-SCA2(LGD)

Only for training and service purposes

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5. Chroma& Brightness

5.1. Module optical specification

5.1.1. 32” TFT-LCD Module (AUO) – T315HW04 V9

1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m

) 320 400

2. Luminance Variation - 1.3

3. Contrast Ratio CR 3200 4000 All white/ All black White WX 0.28

WY Typ 0.29 Typ

RED Xr - 0.03 0.64 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.33 White (85IRE) Green Xg 0.29

Yg 0.60

Blue Xb 0.15

Yb 0.06

1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 88 CR > 10 Luminance (cd/m

) 360 450

2. Luminance Variation - 1.3

3. Contrast Ratio CR 3750 5000 All white/ All black White WX 0.280

WY Typ 0.290 Typ

RED Xr - 0.03 0.648 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.321 White (85IRE) Green Xg 0.304

Yg 0.617

Blue Xb 0.149

Yb 0.063

5.1.2. 32” TFT-LCD Module (CMI) – V315B5-LE3

Only for training and service purposes

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1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 88 CR > 10 Luminance (cd/m

)

2. Luminance Variation - 1.3

3. Contrast Ratio CR 700 1200 All white/ All black White WX 0.278

WY Typ 0.285 Typ

RED Xr - 0.03 0.645 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.330 White (85IRE) Green Xg 0.300

Yg 0.620

Blue Xb 0.153

Yb 0.065

5.1.4. 32” TFT-LCD Module (IPS) – VVX32H109G00

1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 88 CR > 10 Luminance (cd/m

) 360 450

2. Luminance Variation - 1.3

3. Contrast Ratio CR 3500 5000 All white/ All black White WX 0.280

WY Typ 0.290 Typ

RED Xr - 0.03 0.635 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.323 White (85IRE) Green Xg 0.288

Yg 0.600

Blue Xb 0.148

Yb 0.050

5.1.3. 32” TFT-LCD Module (CMI) – V315H3-LE7

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Only for training and service purposes

1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m

) 400 500

2. Luminance Variation - 1.3

3. Contrast Ratio CR 1100 1500 All white/ All black White WX 0.279

WY Typ 0.292 Typ

RED Xr - 0.03 0.634 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.334 White (85IRE) Green Xg 0.289

Yg 0.606

Blue Xb 0.145

Yb 0.065

5.1.5. 37” TFT-LCD Module (LGD) – LC37WUE-SCA1

1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m

) 320 400

2. Luminance Variation - 1.3

3. Contrast Ratio CR 3200 4000 All white/ All black White WX 0.280

WY Typ 0.290 Typ

RED Xr - 0.03 0.640 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.330 White (85IRE) Green Xg 0.320

Yg 0.620

Blue Xb 0.150

Yb 0.050

5.1.6. 37” TFT-LCD Module (AUO) – T370HW05-V1

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Only for training and service purposes

1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m

) 400 500

2. Luminance Variation - 1.3

3. Contrast Ratio CR 1100 1500 All white/ All black White WX 0.279

WY Typ 0.292 Typ

RED Xr - 0.03 0.636 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.335 White (85IRE) Green Xg 0.291

Yg 0.603

Blue Xb 0.146

Yb 0.061

5.1.7. 42” LCD Module (LGD) – LC420WUE-SCA2

1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 80 80 CR > 10 Luminance (cd/m

) 300 400

2. Luminance Variation - 1.3

3. Contrast Ratio CR 4200 6000 All white/ All black White WX 0.280

WY Typ 0.290 Typ

RED Xr - 0.03 0.644 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.331 White (85IRE) Green Xg 0.295

Yg 0.617

Blue Xb 0.148

Yb 0.053

5.1.8. 42” TFT-LCD Module (CMO) – V420H2-LE5

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Only for training and service purposes

1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m

) 400

2. Luminance Variation - 1.3

3. Contrast Ratio CR 4200 6000 All white/ All black White WX 0.280

WY Typ 0.290 Typ

RED Xr - 0.03 0.640 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.330 White (85IRE) Green Xg 0.281

Yg 0.590

Blue Xb 0.144

Yb 0.060

5.1.9. 42” TFT-LCD Module (AUO) – T420HW08-V1

1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m

) 400 500

2. Luminance Variation - 1.3

3. Contrast Ratio CR 1100 1450 All white/ All black White WX 0.279

WY Typ 0.292 Typ

RED Xr - 0.03 0.639 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.334 White (85IRE) Green Xg 0.290

Yg 0.606

Blue Xb 0.146

Yb 0.058

5.1.10. 47” LCD Module (LGD) – LC470WUF-SCA2

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Only for training and service purposes

No. Item Min Typ Max Remark

1. Cool White Balance,X axis 0.267 0.269 0.271 PSM: Vivid, CSM: Cool, White Balance,Y axis 0.271 0.273 0.275 White (85IRE)

2. Medium White Balance,X axis 0.283 0.285 0.287 Color Temp : C50 -> Cool White Balance,Y axis 0.291 0.293 0.295 0 -> Medium

3. Warm White Balance,X axis 0.311 0.313 0.315 W50 -> Warm White Balance,Y axis 0.327 0.329 0.331

5.2. Chroma (PSM:Vivid, Color Temperature:Cool)

- except “RGB PC Mode PSM: Standard, Color Temperature:Medium” ** The W/B Tolerance is ±0.002 for Adjustment, but for DQA ±0.015

1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C

2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels displaying white.

No. Item Specification Min. Typ. Max. Remark

1. Viewing Angle<CR>10> Right/Left/Up/Down 89 CR > 10 Luminance (cd/m

) 360 450

2. Luminance Variation - 1.3

3. Contrast Ratio CR 1100 1600 All white/ All black White WX 0.279

WY Typ 0.292 Typ

RED Xr - 0.03 0.649 +0.03 PSM: Vivid, CSM: Cool

4. CIE Color Coordinates Yr 0.332 White (85IRE) Green Xg 0.307

Yg 0.595

Blue Xb 0.149

Yb 0.059

5.1.11. 55” LCD Module (LGD) – LC550EUF-SDA1

Only for training and service purposes

- 13 -

6. Component Video Input (Y, CB/PB, CR/PR)

Specification

Remark

Resolution H-freq(kHz) V-freq(Hz)

1. 720x480 15.73 60.00 SDTV,DVD 480i

2. 720x480 15.63 59.94 SDTV,DVD 480i

3. 720x480 31.47 59.94 480p

4. 720x480 31.50 60.00 480p

5. 720x576 15.625 50.00 SDTV,DVD 625 Line

6. 720x576 31.25 50.00 HDTV 576p

7. 1280x720 37.50 50.00 HDTV 720p

8. 1280x720 44.96 59.94 HDTV 720p

9. 1280x720 45.00 60.00 HDTV 720p

10. 1920x1080 28.125 50.00 HDTV 1080i

11. 1920x1080 33.75 60.00 HDTV 1080i

12. 1920x1080 33.72 59.94 HDTV 1080i

13. 1920x1080 56.250 50 HDTV 1080p

14. 1920x1080 67.43/67.5 59.94/60 HDTV 1080p

Specification

Proposed Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

1. 720*400 31.468 70.08 28.321 For only DOS mode

2. 640*480 31.469 59.94 25.17 VESA

Input 848*480

60Hz, 852*480 60Hz

-> 640*480 60Hz Display

3. 800*600 37.879 60.31 40.00 VESA

4. 1024*768 48.363 60.00 65.00 VESA(XGA)

5. 1280*768 47.78 59.87 79.5 WXGA

6. 1360*768 47.72 59.8 84.75 WXGA

7. 1920*1080 66.587 59.93 138.625 WUXGA FHD model

7. RGB (PC)

Only for training and service purposes

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No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 720*400 31.468 70.08 28.321 HDCP

2. 640*480 31.469 59.94 25.17 VESA HDCP

3. 800*600 37.879 60.31 40.00 VESA HDCP

4. 1024*768 48.363 60.00 65.00 VESA(XGA) HDCP

5. 1280*768 47.78 59.87 79.5 WXGA HDCP

6. 1360*768 47.72 59.8 84.75 WXGA HDCP

7. 1920*1080 67.5 60 148.5 WUXGA HDCP

8.2. PC Mode

8. HDMI Input (PC/DTV)

8.1. DTV Mode

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 720*480 31.469 /31.5 59.94 / 60 27.00/27.03 SDTV 480P

2. 720*576 31.25 50 54 SDTV 576P

3. 1280*720 37.500 50 74.25 HDTV 720P

4. 1280*720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P

5. 1920*1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I

6. 1920*1080 28.125 50.00 74.25 HDTV 1080I

7. 1920*1080 26.97 / 27 23.97 / 24 74.17/ 74.25 HDTV 1080P

8. 1920*1080 33.716 / 33.75 29.976 / 30.00 74.25 HDTV 1080P

9. 1920*1080 56.250 50 148.5 HDTV 1080P

10. 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P

Only for training and service purposes

- 15 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LCD TV with LT01T/U chassis.

2. Designation

1) The adjustment is according to the order which is designated and which must be followed, according to the plan which can be changed only on agreeing.

2) Power Adjustment: Free Voltage

3) Magnetic Field Condition: Nil.

4) Input signal Unit: Product Specification Standard

5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25±5ºC Relative humidity : 65±10% Input voltage : 220V, 60Hz

6) Adjustment equipments: Color Analyzer (CA-210 or CA-

110), Pattern Generator(MSPG-925L or Equivalent), DDC Adjustment Jig equipment, SVC remote controller

7) Push The “IN STOP KEY” - For memory initialization.

3. Main PCB check process

* APC - After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program “Mstar ISP Utility” and then click

“Config” tab.

(2) Set as below, and then click “Auto Detect” and check “OK”

message. If “Error” is displayed, Check connection between computer, jig, and set..

(3) Click “Read” tab, and then load download file (XXXX.bin)

by clicking “Read”.

(4) Click “Connect” tab. If “Can’t” is displayed, check

connection between computer, jig, and set.

(5) Click “Auto” tab and set as below (6) Click “Run”. (7) After downloading, check “OK” message.

filexxx.bin

(7)

(5)

(8) ……….OK

(6)

(1) (3)

Please Check the Speed : To use speed between from 200KHz to 400KHz

(4)

filexxx.bin

Case1 : Software version up

1. After downloading S/W by USB, TV set will reboot automatically

2. Push “In-stop” key

3. Push “Power on” key

4. Function inspection

5. After function inspection, Push “I n-stop” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push “In-stop” key at first.

2. Push “Power on” key for turning it on.

-> If you push “Power on” key, TV set will recover channel information by itself.

3. After function inspection, Push “In-stop” key.

Only for training and service purposes

* USB DOWNLOAD(*.epk file download)

(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.

- If your downloaded program version in USB Stick is Low, it didn’t work. But your downloaded version is High, USB data is automatically detecting

(3) Show the message “Copying files from memory”

(4) Updating is staring.

(5) After updating is complete, The TV will restart automatically. (6) If TV turns on, check your updated version and Tool

option. (refer to the next page about tool option)

* If downloading version is higher than your TV have, TV

can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ATV test on production line.

* After downloading, have to adjust Tool Option again.

1. Push "IN-START" key in service remote controller.

2. Select "Tool Option 1" and Push “OK” button.

3. Punch in the number. (Each model has their number.)

4. Completed selecting Tool option.

3.1. ADC Process

(1) ADC

• Enter Service Mode by pushing “ ADJ” key

• Enter Internal ADC mode by pushing “G” key at “6. ADC

Calibration”

Caution: Using ‘power on’ button of the Adj. R/C, power on TV.

* ADC Calibration Protocol (RS232)

- Adjust Sequence

• aa 00 00 [Enter Adjust Mode]

• xb 00 40 [Component1 Input (480i)]

• ad 00 10 [Adjust 480i Comp1]

• xb 00 60 [RGB Input (1024x768)]

• ad 00 10 [Adjust 1024x768 RGB]

• aa 00 90 [End Adjust Mode]

* Required equipment : Adjustment R/C

3.2. Function Check

(1) Check display and sound

- Check Input and Signal items. (cf. work instructions)

1) TV

2) AV (CVBS)

3) COMPONENT (480i)

4) RGB (PC : 1024 x 768 @ 60hz)

5) HDMI

6) PC Audio In * Display and sound check is executed by remote control.

- 16 -

Model Tool option1 Tool option2 Tool option3 Tool option4 Tool option5

42LV3500-DA_CMI 26468 19478 55332 26892 41

37LV3500-DA_AUO 22376 19478 55332 26892 41

32LV3500-DA_CMI 18276 19478 55332 26892 41 32LV2500-DA_CMI 18212 19478 55332 26892 41

26LV2500-DA_LGD 14112 8714 55332 26892 41

47LK550-DC_LGD 34529 19478 55300 26892 8224 42LK450-DA_LGD 26241 18966 55300 26892 8224 37LK450-DA_LGD 22145 18966 55300 26892 8224 32LK450-DA_AUO 18056 18966 55300 26892 33

i TV Software Upgrade

Upgrading...

Do not plug off!

63%

i TV Software Upgrade

Upgrading COMPLETED

The TV will restart after seconds.

100%

i TV Software Upgrade

Copying files from memory

Do not remove the memory card from the pc Do not plug off!

No. Item CMD1 CMD2 Data0

1 Enter Adjust Mode A A 0 0 2 ADC Adjust A D 0 0

Model Tool option1 Tool option2 Tool option3 Tool option4 Tool option5

32LK330-DB_IPS 18000 18966 51204 26892 33

26LK330-DB_AUO 13896 18966 51204 26892 33

22LK330-DB_CMI 9796 18966 51204 26892 33

55LV3500-DA_LGD 46944 19478 55332 26892 8224

4. Total Assembly line process

4.1. Adjustment Preparation

· W/B Equipment condition CA210 : CH 9, Test signal : Inner pattern (85IRE)

· Above 5 minutes H/run in the inner pattern. (“power on” key

of adjust remote control)

4.1.1. Connecting picture of the measuring instrument

(On Automatic control) Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER ON -> Enter the mode of White-Balance, the pattern will come out

4.1.2. Auto-control interface and directions

1) Adjust in the place where the influx of light like floodlight

around is blocked. (illumination is less than 10ux).

2) Adhere closely the Color Analyzer (CA210) to the module

less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°).

3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 15minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.

4.1.3. Auto adjustment Map (RS-232C)

**Caution **

Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0. (when R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)

4.2. Manual W/B process using adj. R/C

• After enter Service Mode by pushing “ADJ” key,

• Enter White Balance by pushing “G”key at “7.White Balance”

* After done all adjustments, Press “In-start” button and compare

Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.

* Push The “IN STOP KEY” after completing the function

inspection.

- 17 -

Only for training and service purposes

Cool 13,000k ºK X=0.269(±0.002) All

Y=0.273(±0.002) <Test Signal>

Medium 9,300k ºK X=0.285(±0.002) Inner pattern

Y=0.293(±0.002) (216gray,85IRE)

Warm 6,500k ºK X=0.313(±0.002)

Y=0.329(±0.002)

Cool 9,300k ºK X=0.285(±0.002) Only 22LD350

Y=0.293(±0.002) <Test Signal>

Medium 8,000k ºK X=0.295(±0.002) Inner pattern

Y=0.305(±0.002) (216gray,85IRE)

Warm 6,500k ºK X=0.313(±0.002)

Y=0.329(±0.002)

Full White Pattern

COLOR ANALYZER TYPE: CA-210

RS-232C Communication

CA-210

RS-232C COMMAND MIN CENTER MAX

[CMD ID DATA] (DEFAULT)

Cool Mid Warm Cool Mid Warm R Gain jg Ja jd 00 172 192 192 255 G Gain jh Jb je 00 172 192 192 255 B Gain ji Jc jf 00 192 192 172 255 R Cut 64 64 64 128 G Cut 64 64 64 128 B Cut 64 64 64 128

4.3. DDC EDID Write (RGB 128Byte )

· Connect D-sub Signal Cable to D-Sub Jack.

· Write EDID DATA to EEPROM (24C02) by using DDC2B protocol.

· Check whether written EDID data is correct or not.

* For SVC main Ass’y, EDID have to be downloaded to Insert

Process in advance.

4.4 DDC EDID Write (HDMI 256Byte)

· Connect HDMI Signal Cable to HDMI Jack.

· Write EDID DATA to EEPROM(24C02) by using DDC2B protocol.

· Check whether written EDID data is correct or not.

* For SVC main Ass’y, EDID have to be downloaded to Insert

Process in advance.

4.5 EDID DATA

1) All Data : HEXA Value

2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***:Year : Controlled ****:Check sum

- Auto Download

· After enter Service Mode by Pushing “ADJ” key

· Enter EDID D/L mode.

· Enter “START’ by pushing “OK” key.

HDMI number is dependent on model.

- Manual Download

* Caution

1) Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

2) Nerver connect HDMI & D-sub Cable at the same time.

3) Use the proper cables below for EDID Writing.

4) Download HDMI1, HDMI2 separately because each data is different.

(1) FHD RGB EDID Data (CS : 1C)

(2) FHD HDMI 1 EDID Data (CS : E299)

- 18 -

Only for training and service purposes

D-sub to D-sub

DVI-D to HDMI or HDMI to HDMI

For HDMI EDIDFor Analog EDID

Item

Manufacturer ID

Version

Revision

Condition

GSM

Digital : 1

Digital : 3

Data(Hex)

1E6D

(3) FHD HDMI 2 EDID Data (CS : E289)

(4) FHD HDMI 3 EDID Data (CS : E279)

(5) HD RGB EDID Data (CS : CD)

(6) HD HDMI 1 EDID Data (CS : B465)

(7) HD HDMI 2 EDID Data (CS : B455)

(8) HD HDMI 3 EDID Data (CS : B445)

(9) ASCII Code

4.7. Outgoing condition Configuration

- When pressing IN-STOP key by SVC remocon, Red LED

are blinked alternatively. And then Automatically turn off.

(Must not AC power OFF during blinking)

4.8. Internal pressure

Confirm whether is normal or not when between power board’s ac block and GND is impacted on 1.5 kV(dc) or 2.2 kV(dc) for one second.

- 19 -

Only for training and service purposes

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