LG 32LH550B Schematic

LED TV
SERVICE MANUAL
CHASSIS : LA66K
MODEL : 32LH550B
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL69442201 (1601-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
BLOCK DIAGRAM ...................................................................................17
EXPLODED VIEW .................................................................................. 18
PRODUCT DISASSEMBLY PROCESS ...................................................19
SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX
TROUBLESHOOTING .............................................................. APPENDIX
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent poten­tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electri­cally shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This spec sheet is applied to the LED TV used LA66K chassis
2. Test condition
Each part is tested as below without special notice.
(1) Temperature : 25 ºC±5 ºC (77 ºC±9ºC), CST : 40 ºC±5 ºC (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage
Standard input voltage (100~240V@ 50/60Hz)
(4) Specification and performance of each parts are followed
each drawing and specification by part number in accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance: LGE TV test method followed (2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
4. General Specification
No Item Specication Result Remark
1. Receiving System ATSC / NTSC-M / 64 & 256 QAM
2. Available Channel VHF : 02~13 UHF : 14~69 DTV : 02-69 CATV : 01~135 CADTV : 01~135
3. Input Voltage AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz
4. Market NORTH AMERICA
5. Screen Size 32", 43”, 49", 55”
6. Aspect Ratio 16:9
7. Tuning System FS
8. Module LC550DUE-FJA1 LGD FHD
NC550DUE-VCCP3 CSOT FHD
NC490DUE-SADP3 LGD FHD
NC490DUE-ABEX1 BOE FHD
HC430DUN-SLVX1 LGD FHD
HC430DUN-ABVX1 BOE FHD
HC320DXN-ABVS1 BOE HD
HC320DXN-SLVS5 LGD HD
HC320DXN-VHVS1 SHARP HD
9. Operating Environment Temp : 0 ~ 40 deg Humidity : ~ 80 %
10. Storage Environment Temp : -20 ~ 60 deg Humidity : ~ 85 %
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Supported video resolutions
5.1. Component 2D input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 720*480 15.730 60.000 13.513 SDTV ,DVD 480I
2 720*480 15.730 59.940 13.500 SDTV ,DVD 480I
3 720*480 31.500 60.000 27.027 SDTV 480P
4 720*480 31.470 59.940 27.000 SDTV 480P
5 1280*720 45.000 60.000 74.250 HDTV 720P
6 1280*720 44.960 59.940 74.176 HDTV 720P
7 1920*1080 33.750 60.000 74.250 HDTV 1080I
8 1920*1080 33.720 59.940 74.176 HDTV 1080I
9 1920*1080 67.500 60.000 148.500 HDTV 1080P
10 1920*1080 67.432 59.940 148.352 HDTV 1080P
11 1920*1080 27.000 24.000 74.250 HDTV 1080P
12 1920*1080 26.970 23.976 74.176 HDTV 1080P
13 1920*1080 33.750 30.000 74.250 HDTV 1080P
14 1920*1080 33.710 29.970 74.176 HDTV 1080P
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.2. HDMI Input (PC/DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC
1 640*350 31.46 70.09 25.17 EGA
2. 720*400 31.46 70.08 28.32 DOS
3. 640*480 31.46 59.94 25.17 VESA(VGA)
4 800*600 37.87 60.31 40.00 VESA(SVGA)
5 1024*768 48.36 60.00 65.00 VESA(XGA)
6 1152*864 54.34 60.05 80.00 VESA
7 1280*1024 63.98 60.02 108.00 VESA (SXGA) FHD only
8 1360*768 47.71 60.01 85.50 VESA (WXGA)
9 1920*1080 67.5 60.00 148.5 WUXGA
(Reduced Blanking)
DTV
1 640 * 480 31.46 59.94 25.125 SDTV 480P
2 640 * 480 31.5 60.00 25.125 SDTV 480P
3 720 * 480 15.73 59.94 13.500 SDTV 480I Spec. out but display
4 720 * 480 15.75 60.00 13.514 SDTV 480I Spec. out but display
5 720 * 480 31.47 59.94 27.00 SDTV 480P
6 720 * 480 31.5 60 27.027 SDTV 480P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1920*1080 33.72 59.94 74.176 HDTV 1080I
10 1920*1080 33.75 60.00 74.25 HDTV 1080I
11 1920*1080 26.97 23.97 63.296 HDTV 1080P
12 1920*1080 27.00 24.00 63.36 HDTV 1080P
13 1920*1080 33.71 29.97 79.120 HDTV 1080P
14 1920*1080 33.75 30.00 79.20 HDTV 1080P
15 1920*1080 67.43 59.94 148.350 HDTV 1080P
16 1920*1080 67.5 60.00 148.50 HDTV 1080P
FHD only
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA66K Chassis applied LED TV all models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation (4) The input voltage of the receiver must keep 100~240V,
50/60Hz (5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
Caution When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment(OTP) : Component (2) EDID downloads for HDMI
3.2. Final assembly adjustment
(1) White Balance adjustment (2) RS-232C functionality check (3) Factory Option setting per destination (4) Shipment mode setting (In-Stop) (5) GND and HI-POT test
4. MAIN PCBA Adjustments
4.1. ADC Calibration
- An ADC calibration is not necessary because MAIN SoC (LGExxxx) is already calibrated from IC Maker
- If it needs to adjust manually, refer to appendix.
4.2. MAC Address, ESN Key and Widevine Key download
4.2.1. Equipment & Condition
(1) Play file: keydownload.exe
4.2.2. Communication Port connection
(1) Key Write: Com 1,2,3,4 and 115200 (Baudrate) (2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
(1) Select the download items. (2) Mode check: Online Only (3) Check the test process
- US, Canada models: DETECT -> MAC_WRITE ->
WIDEVINE_WRITE
- Korea, Mexico models: DETECT -> MAC_WRITE ->
WIDEVINE_WRITE (4) Play : START (5) Check of result: Ready, Test, OK or NG
4.2.4. Communication Port connection
(1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
Port
4.2.5. Download
(1) All models (16Y LCD TV + MAC + Widevine + ESN Key
and HDCP2.2)
3.3. Appendix
(1) Tool option menu, USB Download (S/W Update, Option and
Service only) (2) Manual adjustment for ADC calibration and White balance. (3) Shipment conditions, Channel pre-set
Only for training and service purposes
4.2.6. Inspection
- In INSTART menu, check these keys.
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.3. LAN port Inspection (Ping Test)
4.3.1. Equipment setting
(1) Play the LAN Port Test PROGRAM. (2) Input IP set up for an inspection to Test Program.
* IP Number : 12.12.2.2.
4.3.2. LAN PORT inspection (PING TEST)
(1) Play the LAN Port Test Program. (2) connect each other LAN Port Jack. (3) Play Test (F9) button and confirm OK Message. (4) remove LAN CABLE
4.4.3. EDID DATA
4.4.3.1. HD PCM (2D 8bit xvYCC : off) : 32LH570B-UC (1) HDMI1 (6D , 08)
(2) HDMI2 (6D , F8)
Step 1) Step 3) Check ‘OK’ Signal
4.4. EDID Download
4.4.1 Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.
4.4.2 Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust remocon
4.4.3.2. HD AC3 (2D 8bit xvYCC : off) : 32LH570B-UC (1) HDMI1 (6D , 96)
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
(2) HDMI2 (6D , 86)
4.4.3.3. HD DTS (2D 8bit xvYCC : off) : 32LH570B-UC (1) HDMI1 (6D , 8D)
4.4.3.4. FHD PCM (2D 8bit xvYCC : off) : 43/49/55LH5700-UD (1) HDMI1 (E5 , CC)
(2) HDMI2 (E5 , BC)
(2) HDMI2 (6D , 7D)
Only for training and service purposes
4.4.3.5. FHD AC3 (2D 8bit xvYCC : off) : 43/49/55LH5700-UD (1) HDMI1 (E5 , 5A)
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
(2) HDMI2 (E5 , 4A)
* If TV internal pattern is used, not needed
4.4.3.6. FHD DTS (2D 8bit xvYCC : off) : 43/49/55LH5700-UD (1) HDMI1 (E5 , 51)
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel’s W/B deviation (2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status, don’t power off
5.1.1.2. Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface (80°~ 100°) (3) Aging time
- After Aging Start, Keep the Power ON status during 5 Minutes.
- In case of LCD, Back-light on should be checked using no signal or Full-white pattern.
(2) HDMI2 (E5 , 41)
5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49) Color Analyzer Matrix should be calibrated using CS-1000
5.1.3. Equipment connection
Color Analyzer
Probe
RS-232C
Pattern Generator
Signal Source
RS-232C
Computer
RS-232C
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMD DATA ID
Explanation
Wb 00 00 Begin White Balance adj.
Wb 00 ff End White Balance adj.
(internal pattern disappears )
(2) Adjustment Map
Adj. item
Cool R Gain j g 00 C0 TBD
G Gain j h 00 C0 TBD
B Gain j i 00 C0 TBD
R Cut TBD
G Cut TBD
B Cut TBD
Medium R Gain j a 00 C0 TBD
G Gain j b 00 C0 TBD
B Gain j c 00 C0 TBD
R Cut TBD
G Cut TBD
B Cut TBD
Warm R Gain j d 00 C0 TBD
G Gain j e 00 C0 TBD
B Gain j f 00 C0 TBD
R Cut TBD
G Cut TBD
Command (lower caseASCII)
CMD1 CMD2 MIN MAX
Data Range (Hex.)
Default (Decimal)
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration (1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment. (3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm) (6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.1.5.2. Manual adjustment (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C à 9. White-
Balance then press the cursor to the right (KEY►). When KEY(►) is pressed 206 Gray internal pattern will be
displayed. (4) Adjust Cool modes (i) Fix the one of R/G/B gain to 192 (default data) and
decrease the others.
( If G gain is adjusted over 172 and R and B gain less than
192 , Adjust is O.K.) (ii) If G gain is less than 172, Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain. (iii) If R gain or B gain is over 255, Readjust G gain less than 172, Conform to R gain is 255 or
B gain is 255 (5) Adjust two modes (Medium / Warm) Fix the one of R/G/B
gain to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
5.1.6. Reference (White Balance Adj. coordinate and color temperature)
(1) Luminance: 204 Gray, 80IRE (2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
5.1.7. Reference (White Balance Adj. coordinate and color temperature)
▪ Luminance: 204 Gray ▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode
Cool 0.271 0.270 13,000K 0.0000
Medium 0.286 0.289 9,300K 0.0000
Warm 0.313 0.329 6,500K 0.0000
Coordinate
X Y
Temp uv
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
(1) Normal line in Korea (From January to February)
Aging time
(Min)
1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346
4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
(2) Normal line in Korea (From March to December) : LGD
Normal line in Mexico : LGD
Aging time
(Min)
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
Cool Medium Warm
X Y X Y X Y
271 270 286 289 313 329
Cool Medium Warm
X Y X Y X Y
271 270 286 289 313 329
5.2. Option selection per country
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: LA42B Chassis applied to CANADA and
MEXICO
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu
(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX.
Selection is done using +, - KEY
5.2.3. Tool Option inspection
▪ Press Adj. key on the Adj. R/C, then select Tool option
* Tool option can be reconstructed by Software
5.2.3. Country Group Code
Country Area Option
US 02
5.3. Wi-Fi MAC Address Check
5.3.1. Using RS232 Command
Command Set ACK
Transmission [A][l][][Set ID][][20][Cr] [O][K][x] or [N][G]
5.3.2. Check the menu on in-start
(3) O/S Module(AUO, INX, Sharp, CSOT, BOE)
cool med warm
x y x y x y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
Only for training and service purposes
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.6. HDMI ARC Function Inspection
5.6.1. Test equipment
- Optic Receiver Speaker
- MSHG-600 (SW: 1220 ↑)
- HDMI Cable (for 1.4 version)
6. AUDIO output check
6.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation (2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
5.6.2. Test method
(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
(2) Check the sound from the TV Set
(3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
* Remark: Inspect in Power Only Mode and check SW version
in a master equipment
6.2. Specification
No Item Min Typ Max Unit Remark
1 Audio
practical max Output, L/R (Distor­tion=10% max Output)
2 2.7
4.5
6.0
4.03
5.0
6.32
3.0
4.24
6.0
6.93WVrms
3.6
4.64WVrms
(1) Measurement condition
- EQ/AVL/Clear Voice: Off
(2) Speaker (6Ω
Impedance) (3) 49/43LH57
(1) Measurement condition
- EQ/AVL/Clear Voice: Off
(2) Speaker (6Ω
Impedance) (3) 32LH57
7. GND and HI-POT Test
7.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
7.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process automatica
5.7. Ship-out mode check (In-stop)
▪ After final inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode.
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
7.3. Checkpoint
(1) Test voltage
Products/Model TV
2Poles Other 3000V(AC)/
3Poles Other 1500V(AC)/
Cut off current 100mA(AC)/100mA(DC)
Earth Continutiy test
(3Poles only)
(2) TEST time: 1 second (3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms
4242V(DC)
2121V(DC)
≤0.1Ὼ at 25A/1 sec
9. USB S/W Download (optional, Service only)
(1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower than that of TV set, it didn’t work. Otherwise USB data is automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring.
10. Optional adjustments
10.1. Manual White balance Adjustment
10.1.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface (80°~ 100°) (3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern
10.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14) (2) Adj. Computer (During auto adj., RS-232C protocol is
needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model: 217, Pattern: 78)
10.1.3. Adjustment
(1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►).
When KEY(►) is pressed 216 Gray internal pattern will be
displayed. (4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner(ON). By selecting OFF, you can adjust using RF signal in 216 Gray pattern.
(5) Updating Completed, The TV will restart automatically (6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ ATV test on production line.
* After downloading, TOOL OPTION setting is needed again. (1) Push "IN-START" key in service remote controller. (2) Select "Tool Option 1" and Push “OK” button. (3) Punch in the number. (Each model has their number.)
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
BLOCK DIAGRAM
SUB
ASSY
KEY
I2C
IR
WIFI
eMMC 5.0 (4GB)
DDR3 1866 2Gb x16
DDR3 1866 2Gb x16
X_TAL
24MHz
EEPROM (256Kb)
I2C
* HD Model : 30P
51P
LVDS
Audio AM P
I2S
I2C
USB_WIFI
IR / KEY
Sub Micom
(R5F100GEAFB)
I2C
M2
(NON MCP)
HDMI
MUX
Digital Demod
Analog Demod
USB
CVBS/YPbPr
ETHERNET
SPDIF OUT
RS-232
Only for training and service purposes
IF (+/-)
Tuner
REAR
1.5A
OCP
USB1
SIDE
HDMI1
- 17 -
(ARC)
HDMI2
AV/COMP
REAR
LAN
OPTIC
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* RS-232 US Only
RS-232
400
570
540
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these spec ial safety parts s hould be replaced with the same components a s recommended in this manual to prevent, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
LV1
200
900
A2
700
Only for training and service purposes
720
120
- 18 -
522
521
500
600
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Product Disassembly Process
List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1 Unlock screw (“A-10EA”) to separate back cover assembly.
[Fig.1]
Separate speaker assembly from back cover. Separate the cushion (B,C,D) from backcover.
2
Separate the WIFI boardL) from backcover.
[Fig.2]
Unlock screw (”E-2EA”) to separate the base.
3 Unlock screw (”F-4EA”) to sepparate main board and AV bracket (H, I). [Fig
Separate the receive assembly from front cover;
4
Separate the cushion (J) from receive board;
[Fig.4] Separate the receive board from IR LENS; Separate the PC sheet (K) from IR LENS.
1.OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting the locations of items contained within the product which require selective treatment
(with descriptions and arrows identifying locations) can be inserted below:
.3]
Only for training and service purposes
- 19 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
A
A
A
A
A
A
A
A
A
A
Fig.1
B
C
E
D
E
L
Fig.2
Only for training and service purposes
- 20 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
J
K
F
F
F
F
H
I
Fig.3
Fig.4
Only for training and service purposes
- 21 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
I2C
Copyright © 2016 LG Electronics Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
NVRAM
IC100
AT24C256C-SSHL-T
A0
1
A1
2
A2
3
GND
4
NVRAM_ATMEL
8
7
6
5
+3.3V_NORMAL
VCC
0.1uF
WP
SCL
SDA
C112
Write Protection
- Low : Normal Operation
- High : Write Protection
AR101
33
X-TAL
3225
SUNNY ELECTRONICS CORPORATION
X100
8pF
8pF C101-*1
C100-*1
8pF
8pF
50V
50V
0CZZB00024A
10pF Option
I2C_1 : AMP, L/D, NVM, TCON I2C_2 : TUNER I2C_3 : MICOM I2C_4 : S/Demod,T2/Demod, LNB ==> only for LNB - Satellite Model
+3.3V_SB
AR102
OPT
3.3K
+3.3V_NORMAL
R141
0
R140
C100 10pF 50V
10pF
0
X-TAL_1
R115
1.8K
1
GND_1
2
+3.3V_TUNER
R116
1.8K
24MHz
4
3
GND_2
X-TAL_2
+3.3V_NORMAL
C101 10pF 50V
10pF
AR103
3.3K
R137 1M
XTAL_IN
XTAL_OUT
I2C_SCL1
I2C_SDA1
I2C_SCL2 I2C_SDA2 I2C_SCL3 I2C_SDA3
NVRAM_ROHM
IC100-*1
BR24G256FJ-3
A0
1
A1
2
A2
3
GND
4
I2C_SCL1 I2C_SDA1
INSTANT_BOOT
VCC
8
WP
7
SCL
6
SDA
5
PCM_5V_CTL
PWM_DIM2
PWM_DIM
+3.3V_SB
R105 10K
OPT
R106 10K
OPT
+3.3V_NORMAL
R138
10K
NON_EU
PWM_DIM2
100
100
RETENTION_DISABLE
R136
R135
MIU1_STR_PD
MIU0_STR_PD
MIU1_STR_PD
MIU0_STR_PD
AMP_RESET_N
TP1030
TP1031
R152 33
AGP
WOL_WAKE_UP_SOC
DDCA_CK DDCA_DA
DDTS_TX DDTS_RX
BIT7
5V_DET_HDMI_2
AV_CVBS_DET
SOC_TX
COMP2_DET /USB_OCD1 /USB_OCD2
SOC_RX
USB_CTL1
/TU_RESET1
M_RFModule_RESET
5V_DET_HDMI_1 5V_DET_HDMI_3
USB_CTL2
I2C_SCL1 I2C_SDA1
I2C_SCL2 I2C_SDA2
I2C_SCL3 I2C_SDA3
P/NO MCP : EAN64207701 (MSD93F2GW) NON MCP : EAN64207702 (MSD93F2G)
LGE6322(MSD93F2G, w/oT2S2 : M2)
A25
PWM0
B26
PWM1
B25
PWM2
C24
PWM3
D7
PWM_PM
E6
SAR0
E5
SAR1
F5
SAR2
F6
SAR3
G5
SAR4
B2
PM_SPI_CK
A2
PM_SPI_DI
B1
PM_SPI_DO
H8
NC_13
C1
GPIO_PM[6]/(SPI-CZ1N)
C2
GPIO_PM[10]/(SPI-CZ2N)
A3
PM_SPI_HOLDN(GPIO)
C3
PM_SPI_WPN/(GPIO)
D5
DDCA_CK
D6
DDCA_DA
J21
DDCR_CK
H21
DDCR_DA
H22
UART_TX2
H23
UART_RX2
E22
GPIO7/TX1
F21
GPIO8/RX1
E20
GPIO11/TX3
F20
GPIO12/RX3
AB6
PCM2_WAIT_N/TX4
M23
PCM2_IRQA_N
M22
PCM2_CE_N
AC6
NC_14
J5
GPIO_PM[0]
E8
GPIO_PM[1](PM_UART)
M4
GPIO_PM[2]
J6
GPIO_PM[3]
N4
GPIO_PM[4]
F8
GPIO_PM[5](PM_UART)
K5
GPIO_PM[7]
K6
GPIO_PM[8]
L6
GPIO_PM[9]
C4
GPIO_PM[11]/(PM_UART)
B4
GPIO_PM[12](PM_UART)
B3
GPIO_PM[15]
K21
GPIO17/SCKM0
L22
GPIO18/SDAM0
K22
GPIO15/SCKM2
L21
GPIO14/SDAM2
J22
TCON5/SCKM4
K23
TCON4/SDAM4
NON-MCP
EAN64207702
IC101
R_ODD[7]/LVB0N R_ODD[6]/LVB0P R_ODD[5]/LVB1N R_ODD[4]/LVB1P R_ODD[3]/LVB2N
R_ODD[2]/LVB2P R_ODD[1]/LVBCLKN R_ODD[0]/LVBCLKP
G_ODD[7]/LVB3N
G_ODD[6]/LVB3P
G_ODD[5]/LVB4N
G_ODD[4]/LVB4P
G_ODD[3]/LVA0N
G_ODD[2]/LVA0P
G_ODD[1]/LVA1N
G_ODD[0]/LVA1P
B_ODD[7]/LVA2N
B_ODD[6]/LVA2P B_ODD[5]/LVACLKN B_ODD[4]/LVACLKP
B_ODD[3]/LVA3N
B_ODD[2]/LVA3P
B_ODD[1]/LVA4N
B_ODD[0]/LVA4P
VSYNC_LIKE
TS2_D[1] TS2_D[3]
TS2_D[2] LINEIN_L3 LINEIN_R3
TS2_D[4]
TS2_D[5]
TS2_D[6]
TS2_D[7]
XTAL_OUT
SPI1_DI SPI1_CK
GPIO6 GPIO9
GPIO10
NC_15 NC_16
IRIN
VID0 VID1
XTAL_IN
GND_1 GND_2 NC_17 RESET
G25 G24 H25 H24 J25 J26 J24 K26 K25 K24 L25 L24 M25 M26 M24 N26 N25 N24 P25 P24 R25 R26 R24 T26
F25 F26 L23 N23 N22 F24 AA23 Y23 AA22 Y2 Y4
Y22 W23 W22 W21
AD2 AD1
C5
F7 E7
AE1 AF2
M11 M7 J7 D8
BIT4 BIT5 BIT6
FE_DEMOD1_TS_DATA[1] FE_DEMOD1_TS_DATA[3] FE_DEMOD1_TS_DATA[2]
FE_DEMOD1_TS_DATA[4] FE_DEMOD1_TS_DATA[5] FE_DEMOD1_TS_DATA[6] FE_DEMOD1_TS_DATA[7]
R153 33
XTAL_IN XTAL_OUT
TXB3P TXB3N TXBCLKP TXBCLKN TXB2P TXB2N TXB1P TXB1N TXB0P TXB0N
TXA3P TXA3N TXACLKP TXACLKN TXA2P TXA2N TXA1P TXA1N TXA0P TXA0N
CI_CD#
MCP_SCL MCP_SDA
R150 0
SOC_RESET
OPT
VID_CTRL
VDD33
EB_DATA[0] EB_DATA[1] EB_DATA[2] EB_DATA[3] EB_DATA[4] EB_DATA[5] EB_DATA[6] EB_DATA[7]
EB_ADDR[0] EB_ADDR[1] EB_ADDR[2] EB_ADDR[3] EB_ADDR[4] EB_ADDR[5] EB_ADDR[6] EB_ADDR[7] EB_ADDR[8] EB_ADDR[9] EB_ADDR[10] EB_ADDR[11] EB_ADDR[12] EB_ADDR[13] EB_ADDR[14]
+3.3V_NORMAL
R154
10K
OPT
EMMC_DATA[0] EMMC_DATA[1] EMMC_DATA[2] EMMC_DATA[3] EMMC_DATA[4] EMMC_DATA[5] EMMC_DATA[6] EMMC_DATA[7]
CI_IREQ#
CI_OE#
CI_IORD#
CI_CE1#
CI_WE#
CI_RESET
CI_REG# CI_IOWR# CI_WAIT#
EMMC_STRB
EMMC_CLK EMMC_CMD EMMC_RST
NON-MCP
LGE6322(MSD93F2G, w/oT2S2 : M2)
T25
PCM_D[0]
AB26
PCM_D[1]
Y24
PCM_D[2]
P21
PCM_D[3]
R22
PCM_D[4]
AA24
PCM_D[5]
T21
PCM_D[6]
V21
PCM_D[7]
V26
PCM_A[0]
V23
PCM_A[1]
N21
PCM_A[2]
U23
PCM_A[3]
W26
PCM_A[4]
AA25
PCM_A[5]
U22
PCM_A[6]
V25
PCM_A[7]
V22
PCM_A[8]
V24
PCM_A[9]
P22
PCM_A[10]
U21
PCM_A[11]
W25
PCM_A[12]
Y25
PCM_A[13]
AB24
PCM_A[14]
T23
PCM_IRQA_N
R21
PCM_OE_N
T22
PCM_IORD_N
AB25
PCM_CE_N
AA26
PCM_WE_N
U25
PCM_CD_N
T24
PCM_RESET
P23
PCM_REG_N
U24
PCM_IOWR_N
W24
PCM_WAIT_N
AD26
EMMC_IO[8](EMMC_DS)(NAND_ALE)
AC25
EMMC_IO[10](EMMC_CLK)(NAND_RBZ)
AC24
EMMC_IO[9](EMMC_CMD)
AD25
EMMC_IO[11](EMMC_RSTN)
AF24
EMMC_IO[0](EMMC_D0)(NAND_CEZ)
AE24
EMMC_IO[1](EMMC_D1)(NAND_WPZ)
AF25
EMMC_IO[2](EMMC_D2)(NAND_CLE)
AD23
EMMC_IO[3]/(EMMC_D3)(NAND_DQS)
AF23
EMMC_IO[4](EMMC_D4)(NAND_REZ)
AE23
EMMC_IO[5](EMMC_D5)(NAND_CE1Z)
AE26
EMMC_IO[6](EMMC_D6)(NAND_WEZ)
AE25
EMMC_IO[7](EMMC_D7)
IC101
TS1_D[0] TS1_D[1] TS1_D[2] TS1_D[3] TS1_D[4] TS1_D[5] TS1_D[6] TS1_D[7]
TS1_SYNC
TS0_D[0] TS0_D[1] TS0_D[2] TS0_D[3] TS0_D[4] TS0_D[5] TS0_D[6] TS0_D[7]
TS0_SYNC
TS2_SYNC
TS2_D[0]
TGPIO2/SCKM1 TGPIO3/SDAM1
TS1_CLK TS1_VLD
TS0_CLK TS0_VLD
TS2_CLK TS2_VLD
NC_1 NC_2 NC_3 NC_4 NC_5
NC_6
VIFP VIFM SIFP SIFM
IFAGC
TGPIO0 TGPIO1
NC_7 NC_8
NC_9 NC_10 NC_11 NC_12
AA21 W20 AB20 AB19 W19 AB21 AA19 AA20 Y20 Y21 Y19
AF20 AC21 AE21 AF21 AC19 AD20 AE20 AE19 AD19 AE22 AD21
AB22 AC22 AC23 AB23
AC3 AB2 AB3 AA1 AC2
AC4
AF4 AE4 AF5 AE5
AD4
AB4 AD5 AE3 AD3
P10 N10 N11 P11 R10 R11
I_P_SoC I_N_SoC Q_P_SoC Q_N_SoC IF_AGC_S_SOC
LNB_TX
TP343 TP344 TP345 TP346 TP347
TPO_DATA[0] TPO_DATA[1] TPO_DATA[2] TPO_DATA[3] TPO_DATA[4] TPO_DATA[5] TPO_DATA[6] TPO_DATA[7]
TPI_DATA[0] TPI_DATA[1] TPI_DATA[2] TPI_DATA[3] TPI_DATA[4] TPI_DATA[5] TPI_DATA[6] TPI_DATA[7]
I2C_SCL4 I2C_SDA4
TPO_CLK TPO_VAL TPO_SYNC
TPI_CLK TPI_VAL TPI_SYNC
FE_DEMOD1_TS_SYNC FE_DEMOD1_TS_CLK FE_DEMOD1_TS_VAL FE_DEMOD1_TS_DATA[0]
SATELLITE
+3.3V_NORMAL
R101
10K
T2/S2
R104 10K
OPT
TPO_DATA[0-7]
TPI_DATA[0-7]
TUNER_IF_100ohm
R145-*1 100
TUNER_IF_100ohm
R146-*1 100
Close to MSTAR
R145 0
TUNER_IF_0ohm
R146
TUNER_IF_0ohm
TU_SIF
C102 0.1uF C103 0.1uF
TU_SIF
0
R102 R103 47
C119
0.1uF
IF_FILTER
C120
0.1uF
IF_FILTER
TU_SIF
TU_SIF
IF_FILTER_CAP
47
+3.3V_NORMAL
IF_FILTER
L102 BLM15PX121SN1
R144
IF_FILTER C118
0.1uF
10K
IF_FILTER
R147 0
IF_FILTER
C124
0.022uF 16V
IF_FILTER
MCP for T2/S2
C122 33pF
OPT C121
100pF
C123 33pF
IF_FILTER_CAP
C110 1000pF
OPT
IF_AGC
OPT
R117
300 1%
IF_P
IF_N
TU_SIF
MCP Debug
MCP DEBUG
JK102
12507WS-04L
1
2
3
4
5
+3.3V_NORMAL
AR104
3.3K
MCP DEBUG
MCP_SCL
MCP_SDA
Mstart Debug
DEBUG JK100
12507WS-04L
1
2
3
4
5
DDCA_CK
DDCA_DA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDTS_Debug
DEBUG JK101
12507WS-04L
5
+3.3V_SB
1
2
3
4
MCP
EAN64207701
IC101-*1
LGE6321(MSD93F2GW, w/ T2S2 : M2)
A25
PWM0
B26
PWM1
B25
PWM2
C24
PWM3
D7
PWM_PM
E6
SAR0
E5
SAR1
F5
SAR2
F6
SAR3
G5
SAR4
B2
SATELLITE
TP139 TP140
PCM_5V_CTL
TPO_DATA[0-7] TPI_DATA[0-7]
EB_ADDR[0] EB_ADDR[1] EB_ADDR[2] EB_ADDR[3] EB_ADDR[4] EB_ADDR[5] EB_ADDR[6] EB_ADDR[7] EB_ADDR[8]
OPT
R148 10K
DDTS_RX
OPT
R149 10K
DDTS_TX
EB_ADDR[9] EB_ADDR[10] EB_ADDR[11] EB_ADDR[12] EB_ADDR[13] EB_ADDR[14]
TPO_CLK TPO_VAL
TPO_SYNC
HP_LOUT_SOC
HP_ROUT_SOC
HP_DET
M_RFModule_RESET
EYE_SDA EYE_SCL
FOR LH57 EU MODEL
TP148
TP199 TP198 TP115
TP116 TP117 TP118 TP119 TP120 TP121 TP109 TP110 TP111 TP112 TP113 TP114 TP106 TP108 TP147 TP145 TP146
TP1012
TP1013
TP1014
TP1015 TP1016 TP1017
TP141 TP142 TP143 TP144 TP137 TP138 TP126 TP127 TP128 TP129 TP130 TP131 TP132
TP133 TP134 TP135
TP123
TP125 TP136
TP1011
TP1001 TP1002 TP1003 TP1004 TP1005 TP1006 TP1007 TP1008 TP1009 TP1010
FOR LH57 HD MODEL
EB_DATA[0] EB_DATA[1] EB_DATA[2] EB_DATA[3] EB_DATA[4] EB_DATA[5] EB_DATA[6] EB_DATA[7] CI_REG# CI_CE1# TPI_SYNC CI_WE# CI_OE# CI_RESET TPI_VAL
TPI_CLK CI_IREQ# CI_WAIT#
CI_CD#
CI_IORD# CI_IOWR#
PWM_DIM2
TXB3P TXB3N TXBCLKP TXBCLKN TXB2P TXB2N TXB1P TXB1N TXB0P TXB0N
TP149 TP150 TP160 TP161 TP162 TP163
TP164 TP165
SATELLITE - LNB only
TP166 TP167 TP168
FOR BRAZIL Energy Regulation need to ADD SILK "LJ6 CHASSIS"
I_P_SoC I_N_SoC Q_P_SoC Q_N_SoC IF_AGC_S_SOC
LNB_TX
I2C_SCL4 I2C_SDA4
5V_DET_HDMI_2 /USB_OCD2
USB_CTL2
PM_SPI_CK
A2
PM_SPI_DI
B1
PM_SPI_DO
H8
NC_13
C1
GPIO_PM[6]/(SPI-CZ1N)
C2
GPIO_PM[10]/(SPI-CZ2N)
A3
PM_SPI_HOLDN(GPIO)
C3
PM_SPI_WPN/(GPIO)
D5
DDCA_CK
D6
DDCA_DA
J21
DDCR_CK
H21
DDCR_DA
H22
UART_TX2
H23
UART_RX2
E22
GPIO7/TX1
F21
GPIO8/RX1
E20
GPIO11/TX3
F20
GPIO12/RX3
AB6
PCM2_WAIT_N/TX4
M23
PCM2_IRQA_N
M22
PCM2_CE_N
AC6
NC_14
J5
GPIO_PM[0]
E8
GPIO_PM[1](PM_UART)
M4
GPIO_PM[2]
J6
GPIO_PM[3]
N4
GPIO_PM[4]
F8
GPIO_PM[5](PM_UART)
K5
GPIO_PM[7]
K6
GPIO_PM[8]
L6
GPIO_PM[9]
C4
GPIO_PM[11]/(PM_UART)
B4
GPIO_PM[12](PM_UART)
B3
GPIO_PM[15]
K21
GPIO17/SCKM0
L22
GPIO18/SDAM0
K22
GPIO15/SCKM2
L21
GPIO14/SDAM2
J22
TCON5/SCKM4
K23
TCON4/SDAM4
R_ODD[7]/LVB0N R_ODD[6]/LVB0P R_ODD[5]/LVB1N R_ODD[4]/LVB1P R_ODD[3]/LVB2N
R_ODD[2]/LVB2P R_ODD[1]/LVBCLKN R_ODD[0]/LVBCLKP
G_ODD[7]/LVB3N
G_ODD[6]/LVB3P
G_ODD[5]/LVB4N
G_ODD[4]/LVB4P
G_ODD[3]/LVA0N
G_ODD[2]/LVA0P
G_ODD[1]/LVA1N
G_ODD[0]/LVA1P
B_ODD[7]/LVA2N
B_ODD[6]/LVA2P B_ODD[5]/LVACLKN B_ODD[4]/LVACLKP
B_ODD[3]/LVA3N
B_ODD[2]/LVA3P
B_ODD[1]/LVA4N
B_ODD[0]/LVA4P
VSYNC_LIKE
TS2_D[1] TS2_D[3]
TS2_D[2] LINEIN_L3 LINEIN_R3
TS2_D[4]
TS2_D[5]
TS2_D[6]
TS2_D[7]
XTAL_OUT
SPI1_DI SPI1_CK
XTAL_IN
GPIO6 GPIO9
GPIO10
NC_15 NC_16
IRIN
VID0 VID1
GND_1 GND_2 NC_17 RESET
G25 G24 H25 H24 J25 J26 J24 K26 K25 K24 L25 L24 M25 M26 M24 N26 N25 N24 P25 P24 R25 R26 R24 T26
F25 F26 L23 N23 N22 F24 AA23 Y23 AA22 Y2 Y4
Y22 W23 W22 W21
AD2 AD1
C5
F7 E7
AE1 AF2
M11 M7 J7 D8
LGE6321(MSD93F2GW, w/ T2S2 : M2)
T25
AB26
Y24 P21 R22
AA24
T21 V21
V26 V23 N21 U23 W26
AA25
U22 V25 V22 V24 P22 U21 W25 Y25
AB24
T23 R21
T22 AB25 AA26
U25
T24
P23
U24
W24
AD26 AC25 AC24 AD25 AF24 AE24 AF25 AD23 AF23 AE23 AE26 AE25
16Y_M2
MAIN1
MCP
IC101-*1
PCM_D[0] PCM_D[1] PCM_D[2] PCM_D[3] PCM_D[4] PCM_D[5] PCM_D[6] PCM_D[7]
PCM_A[0] PCM_A[1] PCM_A[2] PCM_A[3] PCM_A[4] PCM_A[5] PCM_A[6] PCM_A[7] PCM_A[8] PCM_A[9] PCM_A[10] PCM_A[11] PCM_A[12] PCM_A[13] PCM_A[14]
PCM_IRQA_N PCM_OE_N PCM_IORD_N PCM_CE_N PCM_WE_N PCM_CD_N PCM_RESET PCM_REG_N PCM_IOWR_N PCM_WAIT_N
EMMC_IO[8](EMMC_DS)(NAND_ALE) EMMC_IO[10](EMMC_CLK)(NAND_RBZ) EMMC_IO[9](EMMC_CMD) EMMC_IO[11](EMMC_RSTN) EMMC_IO[0](EMMC_D0)(NAND_CEZ) EMMC_IO[1](EMMC_D1)(NAND_WPZ) EMMC_IO[2](EMMC_D2)(NAND_CLE) EMMC_IO[3]/(EMMC_D3)(NAND_DQS) EMMC_IO[4](EMMC_D4)(NAND_REZ) EMMC_IO[5](EMMC_D5)(NAND_CE1Z) EMMC_IO[6](EMMC_D6)(NAND_WEZ) EMMC_IO[7](EMMC_D7)
AA21
TS1_D[0]
W20
TS1_D[1]
AB20
TS1_D[2]
AB19
TS1_D[3]
W19
TS1_D[4]
AB21
TS1_D[5]
AA19
TS1_D[6]
AA20
TS1_D[7]
Y20
TS1_CLK
Y21
TS1_VLD
Y19
TS1_SYNC
AF20
TS0_D[0]
AC21
TS0_D[1]
AE21
TS0_D[2]
AF21
TS0_D[3]
AC19
TS0_D[4]
AD20
TS0_D[5]
AE20
TS0_D[6]
AE19
TS0_D[7]
AD19
TS0_CLK
AE22
TS0_VLD
AD21
TS0_SYNC
AB22
TS2_SYNC
AC22
TS2_CLK
AC23
TS2_VLD
AB23
TS2_D[0]
AC3
NC_1
AB2
NC_2
AB3
NC_3
AA1
NC_4
AC2
NC_5
AC4
NC_6
AF4
VIFP
AE4
VIFM
AF5
SIFP
AE5
SIFM
AD4
IFAGC
AB4
TGPIO0
AD5
TGPIO1
AE3
TGPIO2/SCKM1
AD3
TGPIO3/SDAM1
P10
NC_7
N10
NC_8
N11
NC_9
P11
NC_10
R10
NC_11
R11
NC_12
2015.10.02
1
NON-MCP
Copyright © 2016 LG Electronics Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
EAN64207702
LGE6322(MSD93F2G, w/oT2S2 : M2)
0
VDDC_1 VDDC_2 VDDC_3 VDDC_4 VDDC_5 VDDC_6 VDDC_7 VDDC_8 VDDC_9 VDDC_10 VDDC_11 VDDC_12 VDDC_13 VDDC_14 AVDDL_MOD AVDDL_DVI
DVDD_DDR_A_1 DVDD_DDR_A_2 DVDD_DDR_B_1 DVDD_DDR_B_2
VDDC_SRAM_1 VDDC_SRAM_2
CTRL_SRAMLDO
AVDD_DDR0_C AVDD_DDR0_D_1 AVDD_DDR0_D_2 AVDD_DDR1_C AVDD_DDR1_D_1 AVDD_DDR1_D_2
AVDD04_DDR_B AVDD04_DDR_A AVDD11_DDR_B AVDD11_DDR_A
AVDD_PLL AVDD_MOD VDDP
AVDD3P3_ETH AVDD3P3_ADC AVDD3P3_DADC AVDD_AU33 AVDD3P3_DMPLL AVDD3P3_USB_1 AVDD3P3_USB_2 AVDD_NODIE
AVDD_5V_HDMI_D
VSENSE_VDD
NC_21 NC_22
VDDP_3318
GND_3 GND_4 GND_5 GND_6 GND_7 GND_8 GND_9 GND_10 GND_11 GND_12 GND_13 GND_14 GND_15 GND_16 GND_17 GND_18 GND_19 GND_20 GND_21 GND_22 GND_23 GND_24 GND_25 GND_26 GND_27 GND_28 GND_29 GND_30 GND_31 GND_32 GND_33 GND_34 GND_35 GND_36 GND_37 GND_38 GND_39 GND_40 GND_41 GND_42 GND_43 GND_44 GND_45 GND_46 GND_47 GND_48 GND_49 GND_50 GND_51 GND_52 GND_53 GND_54 GND_55 GND_56
IC101-*1
K2 L3 L2 M3 M2 M1 K3 K1 M5 M6 T4
G2 H3 H2 J3 J2 J1 G3 G1 J4 K4 V4
D2 E3 E2 F3 F2 F1 D3 D1 F4 E4 R4
L5 G4
H5 H6
MCP
L8
GND_57
L9
GND_58
L10
GND_59
L11
GND_60
L12
GND_61
L13
GND_62
L14
GND_63
L15
GND_64
L16
GND_65
M8
GND_66
M9
GND_67
M10
GND_68
M12
GND_69
M13
GND_70
M14
GND_71
M15
GND_72
M16
GND_73
M17
GND_74
M18
GND_75
M19
GND_76
M20
GND_77
M21
GND_78
N9
GND_79
N12
GND_80
N13
GND_81
N14
GND_82
N15
GND_83
N16
GND_84
N17
GND_85
N19
GND_86
N20
GND_87
P8
GND_88
P9
GND_89
P12
GND_90
P13
GND_91
P14
GND_92
P15
GND_93
P16
GND_94
P17
GND_95
P18
GND_96
P19
GND_97
P20
GND_98
R7
GND_99
R8
GND_100
R9
GND_101
R12
GND_102
R13
GND_103
R16
GND_104
R17
GND_105
R18
GND_106
R19
GND_107
T3
GND_108
T8
GND_109
T9
GND_110
T10
GND_111
T11
GND_112
T12
GND_113
T13
GND_114
T17
GND_115
T19
GND_116
T20
GND_117
U8
GND_118
U9
GND_119
U10
GND_120
U11
GND_121
U12
GND_122
U13
GND_123
U14
GND_124
U15
GND_125
U16
GND_126
U17
GND_127
U18
GND_128
U19
GND_129
U20
GND_130
V7
GND_131
V8
GND_132
V9
GND_133
V10
GND_134
V11
GND_135
V12
GND_136
V13
GND_137
V14
GND_138
V15
GND_139
V16
GND_140
V17
GND_141
V18
GND_142
V19
GND_143
V20
GND_144
W7
GND_145
W8
GND_146
W9
GND_147
W10
GND_148
W11
GND_149
W12
GND_150
W13
GND_151
W14
GND_152
W15
GND_153
W16
GND_154
W17
GND_155
W18
GND_156
Y8
GND_157
Y9
GND_158
Y10
GND_159
Y11
GND_160
Y12
GND_161
Y13
GND_162
Y14
GND_163
Y15
GND_164
Y16
GND_165
Y17
GND_166
AA4
GND_167
AA5
GND_168
AA6
GND_169
AA8
GND_170
AA9
GND_171
AA13
GND_172
AB1
GND_173
AC7
GND_174
AC10
GND_175
AC13
GND_176
AC16
GND_177
AD6
GND_178
AD7
GND_179
AD17
GND_180
AD18
GND_181
AD22
GND_182
AD24
GND_183
AE2
GND_184
AE6
GND_185
AF10
GND_186
AF13
GND_187
AF16
GND_188
D0-_HDMI3
D0+_HDMI3 D1-_HDMI3 D1+_HDMI3
D2-_HDMI3
D2+_HDMI3
CK-_HDMI3 CK+_HDMI3
DDC_SCL_3
DDC_SDA_3
HDMI_HPD_5V_3
D0-_HDMI2 D0+_HDMI2 D1-_HDMI2 D1+_HDMI2 D2-_HDMI2 D2+_HDMI2 CK-_HDMI2 CK+_HDMI2 DDC_SCL_2 DDC_SDA_2
HDMI_HPD_5V_2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HDMI_ARC
TP320 TP321 TP322 TP323 TP324 TP325 TP326 TP327 TP328 TP329 TP330
CEC
TP300
HDMI_HPD_5V_2
HDMI_HPD_5V_1
C370
1uF
25V
D0-_HDMI2 D0+_HDMI2 D1-_HDMI2
D1+_HDMI2
D2-_HDMI2 D2+_HDMI2
CK-_HDMI2 CK+_HDMI2
DDC_SCL_2 DDC_SDA_2
D0-_HDMI1 D0+_HDMI1
D1-_HDMI1
D1+_HDMI1 D2-_HDMI1
D2+_HDMI1 CK-_HDMI1
CK+_HDMI1
DDC_SCL_1 DDC_SDA_1
R345
CEC
BIT0 BIT1
LGE6321(MSD93F2GW, w/ T2S2 : M2)
G26 H19 J20 J17 J18 J19 K20 K17 K18 K19 L20 L17 L18 L19 N18 T18
R14 R15 H12 J12
H17 H18
H20
T14 T15 T16 J13 J14 J15
A8
AF7
B8
AE7
G7 L7 H7
U7 P7
AB7
T7
AA7
N7 N8 Y7
D4
R20
AB5 AC5
Y18
A11 A14 A17
B7 C6 C7 C8
C9 C19 D14 D17
E9
F9 F10 F11
G6
G8
G9 G10 G11 G12 G13 G14 G15 G16 G17 G18 G19 G20 G21 G22 G23
H9 H10 H11 H13 H14 H15 H16
J8
J9 J10 J11 J16
K7
K8
K9 K10 K11 K12 K13 K14 K15 K16
IC101
A_RX0N A_RX0P A_RX1N A_RX1P A_RX2N A_RX2P A_RXCN A_RXCP DDCDA_CK DDCDA_DA HOTPLUGA
B_RX0N B_RX0P B_RX1N B_RX1P B_RX2N B_RX2P B_RXCN B_RXCP DDCDB_CK DDCDB_DA HOTPLUGB
D_RX0N D_RX0P D_RX1N D_RX1P D_RX2N D_RX2P D_RXCN D_RXCP DDCDD_CK DDCDD_DA HOTPLUGD
ARC0 CEC
GPIO_PM[13]/MHL_CBUS GPIO_PM[14]/MHL_VBUS_EN
LINEIN_L1 LINEIN_R1 LINEIN_L2 LINEIN_R2
LINEOUT_L0 LINEOUT_R0 LINEOUT_L2 LINEOUT_R2
AVSS_VRM_ADC
SPDIF_IN
SPDIF_OUT
I2S_OUT_BCK I2S_OUT_MCK
I2S_OUT_WS
I2S_OUT_SD I2S_OUT_SD1/SDAM5 I2S_OUT_SD2/SCKM5 I2S_OUT_SD3(GPIO)
I2S_IN_BCK
I2S_IN_SD I2S_IN_WS
DDCDC_CK(GPIO_PM) DDCDC_DA(GPIO_PM)
GPIO2/EJ_TCK GPIO3/EJ_TMS GPIO4/EJ_TDI GPIO5/EJ_TDO
+3.3V_SB
C371
0.1uF JTAG
P300
12505WS-10A00
JTAG
1
2
3
4
5
6
7
8
OPT
R347
9
10
11
MCP
IC101-*1
LGE6321(MSD93F2GW, w/ T2S2 : M2)
K2
A_RX0N
L3
A_RX0P
L2
A_RX1N
M3
A_RX1P
M2
A_RX2N
M1
A_RX2P
K3
A_RXCN
K1
A_RXCP
M5
DDCDA_CK
M6
DDCDA_DA
T4
HOTPLUGA
G2
B_RX0N
H3
B_RX0P
H2
B_RX1N
J3
B_RX1P
J2
B_RX2N
J1
B_RX2P
G3
B_RXCN
G1
B_RXCP
J4
DDCDB_CK
K4
DDCDB_DA
V4
HOTPLUGB
D2
D_RX0N
E3
I2S_OUT_SD1/SDAM5
D_RX0P
E2
I2S_OUT_SD2/SCKM5
D_RX1N
F3
I2S_OUT_SD3(GPIO)
D_RX1P
F2
D_RX2N
F1
D_RX2P
D3
D_RXCN
D1
D_RXCP
F4
DDCDD_CK
E4
DDCDD_DA
R4
HOTPLUGD
DDCDC_CK(GPIO_PM) DDCDC_DA(GPIO_PM)
L5
ARC0
G4
CEC
H5
GPIO_PM[13]/MHL_CBUS
H6
GPIO_PM[14]/MHL_VBUS_EN
MCP
IC101-*1
LGE6321(MSD93F2GW, w/ T2S2 : M2)
P3
RIN0P
N2
GIN0M
N1
GIN0P
N3
BIN0P
GPIO19(LAN_LED[0])/ET_COL
P5
GPIO20(LAN_LED[1])/ET_TX_TXD1
HSYNC0
N6
VSYNC0
GPIO21/ET_TXD0
R1
GPIO22/ET_TX_EN
RIN1P
R2
GPIO23/ET_TX_CLK
GIN1M
R3
GPIO24/ET_RXD0
GIN1P
P2
GPIO25/ET_MDC
BIN1P
U5
GPIO26/ET_MDIO
HSYNC1
U6
GPIO27/ET_RXD1
VSYNC1
W4
NC_18
T2
NC_19
W6
VCOM
W5
CVBS0
Y6
CVBS1
V5
CVBS2
V6
CVBS_OUT1
Y5
NC_20
VAG
47K
LINEOUT_L0 LINEOUT_R0 LINEOUT_L2 LINEOUT_R2
AVSS_VRM_ADC
I2S_OUT_BCK I2S_OUT_MCK
I2S_OUT_WS I2S_OUT_SD
I2S_IN_BCK
GPIO2/EJ_TCK GPIO3/EJ_TMS GPIO4/EJ_TDI GPIO5/EJ_TDO
V1 V3 W1 W2
T1 U3 W3 Y3
V2 U2
E21 D21
C26 D25 C25 D26 D24 E25 E24
F22 E23 F23
AA2 AA3
B20 D22 D20 D23
JTAG
1K
1K
R346
V1
LINEIN_L1
V3
LINEIN_R1
W1
LINEIN_L2
W2
LINEIN_R2
T1 U3 W3 Y3
V2
VAG
U2
E21
SPDIF_IN
D21
SPDIF_OUT
C26 D25 C25 D26 D24 E25 E24
F22 E23
I2S_IN_SD
F23
I2S_IN_WS
AA2 AA3
B20 D22 D20 D23
A5
TN
B5
TP
B6
RN
A6
RP
C22 B21
A21 C20 C21 B22 B23 C23 A22
P6
DM_P0
N5
DP_P0
R5
DM_P1
R6
DP_P1
A24
DM_P2
B24
DP_P2
T6
DM_P3
T5
DP_P3
JTAG
R348
R360
4.7K
R363
4.7K
JTAG
1K
R349
Closed to SoC Side
OPT
R361
4.7K
OPT
R364
4.7K
JTAG
Jtag I/F For Main
JTAG
1K
R350
1K
OPT
R351
C3022.2uF C3032.2uF
HP_LOUT_SOC HP_ROUT_SOC
C304
0.1uF
+3.3V_SB
OPT
R362
4.7K
R365
4.7K
BIT2 BIT3
TCK0 TMS0 TDI0 TDO0
R367
R366
OPT OPT OPT
32inch_NON_EU
C305 10uF 10V
OPT
4.7K
OPT
4.7K
0 0
1K
TDI0 TDO0 TMS0 TCK0 SOC_RESET
BLM15PX121SN1
R355 100
R356 100 R357 100 R358 100 R359 100
Chip config.
R352 R353 R354
L300
C307 1000pF 50V
SPDIF_OUT
C372 22pF
OPT
AREA OPTION
BIT [0/1]
0 / 0 0 / 1 1 / 0 1 / 1
COMP2_L_IN COMP2_R_IN
32inch_NON_EU C308 1000pF 50V
C374
C373
33pF
22pF
OPT
OPT
DVB
EU/CIS
CHINA/HONGKONG
TAIWAN/COLOM
ASIA/AFRICA
I2S_I/F
AUD_SCK AUD_MASTER_CLK AUD_LRCK
AUD_LRCH C375 22pF
TP380
OPT
Model Option
+3.3V_SB
R300
4.7K
R304
4.7K
BIT0_1
BIT1_1
AREA OPTION
R305
4.7K
R301
4.7K BIT1_0
BIT0_0
JP
ATSC
N/AMERICA
KOREA
JAPAN
S/AMERCIA
COMP2_Y+/AV_CVBS_IN
AUD_MASTER_CLK
BIT0
BIT1
BIT2_1
BIT2_0
R309
R310
COMP2_Pr+
COMP2_Pb+
DTV/MNT_VOUT
4.7K BIT3_1
4.7K
BIT3_0
NON-MCP
G26 H19 J20 J17 J18 J19 K20 K17 K18 K19 L20 L17 L18 L19 N18 T18
R14 R15 H12 J12
H17 H18
H20
T14 T15 T16 J13 J14 J15
A8
AF7
B8
AE7
G7 L7 H7
U7 P7
AB7
T7
AA7
N7 N8 Y7
D4
R20
AB5 AC5
Y18
A11 A14 A17
B7 C6 C7 C8
C9 C19 D14 D17
E9
F9 F10 F11
G6
G8
G9 G10 G11 G12 G13 G14 G15 G16 G17 G18 G19 G20 G21 G22 G23
H9 H10 H11 H13 H14 H15 H16
J8
J9 J10 J11 J16
K7
K8
K9 K10 K11 K12 K13 K14 K15 K16
VDDC_1 VDDC_2 VDDC_3 VDDC_4 VDDC_5 VDDC_6 VDDC_7 VDDC_8 VDDC_9 VDDC_10 VDDC_11 VDDC_12 VDDC_13 VDDC_14 AVDDL_MOD AVDDL_DVI
DVDD_DDR_A_1 DVDD_DDR_A_2 DVDD_DDR_B_1 DVDD_DDR_B_2
VDDC_SRAM_1 VDDC_SRAM_2
CTRL_SRAMLDO
AVDD_DDR0_C AVDD_DDR0_D_1 AVDD_DDR0_D_2 AVDD_DDR1_C AVDD_DDR1_D_1 AVDD_DDR1_D_2
AVDD04_DDR_B AVDD04_DDR_A AVDD11_DDR_B AVDD11_DDR_A
AVDD_PLL AVDD_MOD VDDP
AVDD3P3_ETH AVDD3P3_ADC AVDD3P3_DADC AVDD_AU33 AVDD3P3_DMPLL AVDD3P3_USB_1 AVDD3P3_USB_2 AVDD_NODIE
AVDD_5V_HDMI_D
VSENSE_VDD
NC_21 NC_22
VDDP_3318
GND_3 GND_4 GND_5 GND_6 GND_7 GND_8 GND_9 GND_10 GND_11 GND_12 GND_13 GND_14 GND_15 GND_16 GND_17 GND_18 GND_19 GND_20 GND_21 GND_22 GND_23 GND_24 GND_25 GND_26 GND_27 GND_28 GND_29 GND_30 GND_31 GND_32 GND_33 GND_34 GND_35 GND_36 GND_37 GND_38 GND_39 GND_40 GND_41 GND_42 GND_43 GND_44 GND_45 GND_46 GND_47 GND_48 GND_49 GND_50 GND_51 GND_52 GND_53 GND_54 GND_55 GND_56
IC101
GND_57 GND_58 GND_59 GND_60 GND_61 GND_62 GND_63 GND_64 GND_65 GND_66 GND_67 GND_68 GND_69 GND_70 GND_71 GND_72 GND_73 GND_74 GND_75 GND_76 GND_77 GND_78 GND_79 GND_80 GND_81 GND_82 GND_83 GND_84 GND_85 GND_86 GND_87 GND_88 GND_89 GND_90 GND_91 GND_92 GND_93 GND_94 GND_95 GND_96 GND_97 GND_98
GND_99 GND_100 GND_101 GND_102 GND_103 GND_104 GND_105 GND_106 GND_107 GND_108 GND_109 GND_110 GND_111 GND_112 GND_113 GND_114 GND_115 GND_116 GND_117 GND_118 GND_119 GND_120 GND_121 GND_122 GND_123 GND_124 GND_125 GND_126 GND_127 GND_128 GND_129 GND_130 GND_131 GND_132 GND_133 GND_134 GND_135 GND_136 GND_137 GND_138 GND_139 GND_140 GND_141 GND_142 GND_143 GND_144 GND_145 GND_146 GND_147 GND_148 GND_149 GND_150 GND_151 GND_152 GND_153 GND_154 GND_155 GND_156 GND_157 GND_158 GND_159 GND_160 GND_161 GND_162 GND_163 GND_164 GND_165 GND_166 GND_167 GND_168 GND_169 GND_170 GND_171 GND_172 GND_173 GND_174 GND_175 GND_176 GND_177 GND_178 GND_179 GND_180 GND_181 GND_182 GND_183 GND_184 GND_185 GND_186 GND_187 GND_188
L8 L9 L10 L11 L12 L13 L14 L15 L16 M8 M9 M10 M12 M13 M14 M15 M16 M17 M18 M19 M20 M21 N9 N12 N13 N14 N15 N16 N17 N19 N20 P8 P9 P12 P13 P14 P15 P16 P17 P18 P19 P20 R7 R8 R9 R12 R13 R16 R17 R18 R19 T3 T8 T9 T10 T11 T12 T13 T17 T19 T20 U8 U9 U10 U11 U12 U13 U14 U15 U16 U17 U18 U19 U20 V7 V8 V9 V10 V11 V12 V13 V14 V15 V16 V17 V18 V19 V20 W7 W8 W9 W10 W11 W12 W13 W14 W15 W16 W17 W18 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15 Y16 Y17 AA4 AA5 AA6 AA8 AA9 AA13 AB1 AC7 AC10 AC13 AC16 AD6 AD7 AD17 AD18 AD22 AD24 AE2 AE6 AF10 AF13 AF16
2015.10.02
3
LGE6322(MSD93F2G, w/oT2S2 : M2)
C344
0.1uF 16V
AVDDL_DVI
VDD33
AVDD_3P3_USB
+1.5V_DDR_1
+1.5V_DDR_0
AVDD_AU33
W_VDD
+1.10V_VDDC
AVDDL_MOD
DVDD_DDR
+1.10V_VDDC
+1.5V_DDR_0
+1.5V_DDR_1
AVDD_3P3
C366 0.22uF C367 0.22uF C368 0.22uF C369 0.22uF
TP342
TP310 TP312
COMP2_Y+/AV_CVBS_IN
TP314
COMP2_Y+/AV_CVBS_IN
TP313
COMP2_Pr+
COMP2_Pb+
TU_CVBS
DTV/MNT_VOUT
R337 68
R308 33
OPT C345 1000pF
R340 33
NON-MCP
LGE6322(MSD93F2G, w/oT2S2 : M2)
P3 N2 N1 N3
P5 N6
C3140.047uF
R33333 R33468 R33533 R33633
C3150.047uF C3160.047uF C3170.047uF
C318 0.047uF
C336 0.047uF C321 0.047uF
R1 R2 R3 P2 U5 U6
W4 T2
W6
W5 Y6 V5
V6 Y5
IC101
RIN0P GIN0M GIN0P BIN0P
GPIO19(LAN_LED[0])/ET_COL
HSYNC0
GPIO20(LAN_LED[1])/ET_TX_TXD1
VSYNC0
RIN1P GIN1M GIN1P BIN1P HSYNC1 VSYNC1
NC_18 NC_19
VCOM
CVBS0 CVBS1 CVBS2
CVBS_OUT1 NC_20
GPIO21/ET_TXD0
GPIO22/ET_TX_EN
GPIO23/ET_TX_CLK
GPIO24/ET_RXD0
GPIO25/ET_MDC GPIO26/ET_MDIO GPIO27/ET_RXD1
DM_P0 DP_P0 DM_P1 DP_P1 DM_P2 DP_P2 DM_P3 DP_P3
A5
TN
B5
TP
B6
RN
A6
RP
C22 B21
A21 C20 C21 B22 B23 C23 A22
P6 N5 R5 R6 A24 B24 T6 T5
WIFI_DM WIFI_DP USB_DM2 USB_DP2
USB_DM1 USB_DP1
EPHY_TDN EPHY_TDP EPHY_RDN EPHY_RDP
HP_DET MODEL_OPT_8 MODEL_OPT_9 MODEL_OPT_10 MODEL_OPT_11 MODEL_OPT_12 MODEL_OPT_13
TP331 TP332
USB_DM2 USB_DP2
Normal Power 3.3V
+3.3V_SB
DDR3 1.5V
+1.5V_DDR_0
C309
0.1uF 16V
DDR3 1.5V
+1.5V_DDR_1
C310
0.1uF 16V
L301
BLM15PX121SN1
VDDC 1.05V
+1.10V_VDDC
C325
C323
10uF
10uF
10V
10V
C311 10uF 10V
C312 10uF 10V
C322
C324
0.1uF
10uF
16V
10V
AVDD_PLL
0.1uF
0.1uF
C328
C338
10uF
1uF
10V
10V
C313
C320
0.1uF
16V
16V
C334
C319
0.1uF 16V
16V
C347
1uF
0.1uF
10V
+1.10V_VDDC
C350
0.1uF
16V
L311
BLM15PX121SN1
L309
BLM15PX121SN1
L310
BLM15PX121SN1
C353
16V
VDD33
C354
C348
C337
0.1uF 16V
AVDD_MOD
0.1uF
C351
0.1uF
0.1uF 16V
16V
16V
VDDP
C327
0.1uF 16V
0.1uF
C355
0.1uF
0.1uF
0.1uF
C363
C359
0.1uF
0.1uF 16V
16V
16V
AVDDL_MOD
C362
C358
0.1uF 16V
16V
AVDDL_DVI
C360
C356
0.1uF 16V
16V
DVDD_DDR
C361
C357
0.1uF
16V
16V
AVDD_DMPLL
W_VD33
VDDP_NAND
STby 3.4V
+3.3V_SB
L303
BLM15PX121SN1
L306
BLM15PX121SN1
L307
BLM15PX121SN1
L314
BLM15PX121SN1
TUNER OPTION
BIT [6/7]
0 / 0 0 / 1 1 / 0 1 / 1
R317
R315
4.7K
R314
4.7K
R311
4.7K BIT5_1
BIT4_1
R316
R312
4.7K
4.7K
R313
4.7K BIT5_0
BIT4_0
BACK-END OPTION
BIT[2/3/4/5]
0 / 0 / 0 / 0 0 / 0 / 0 / 1 0 / 0 / 1 / 0 0 / 0 / 1 / 1 0 / 1 / 0 / 0 0 / 1 / 0 / 1 0 / 1 / 1 / 0 0 / 1 / 1 / 1 1 / 0 / 0 / 0 1 / 0 / 0 / 1 1 / 0 / 1 / 0 1 / 0 / 1 / 1 1 / 1 / 0 / 0 1 / 1 / 0 / 1 1 / 1 / 1 / 0 1 / 1 / 1 / 1
4.7K
BIT6_1
BIT7_1
BIT2
BIT3 BIT4
BIT5
R318
4.7K BIT7_0
BIT6_0
FRC
FHD
TYPE
LVDS FHD, 60Hz EPI FHD, 120Hz, v14_32inch (6 lane) EPI FHD, 120Hz, V13 (6 lane) EPI FHD, 120Hz, V12 (6 lane)
EPI FHD, 60Hz, V14_32 inch (6lane) LVDS FHD, 120Hz EPI FHD, 120Hz, V14 (8 lane) LVDS HD, 60Hz LVDS FHD, 60Hz, CP BOX LVDS HD, 60Hz SMALL SMART
Vby1 FHD, 120Hz LVDS FHD, 120Hz OLED
(T2/C/S2)_EXT/ATV_CVBS
(T2/C/S2)_SOC/ATV_CVBS
R319
4.7K
R320
4.7K
PANEL TYPE
OLED
EU/CIS
(T2/C)_SOC/ATV_CVBS
(T2/C)_SOC/ATV_IF
OPT
BIT6 BIT7
DDR_1GB/512MB
(T2/C)_SOC/ATV_CVBS
(T2/C/S2)_SOC/ATV_CVBS
R321
4.7K
R323
4.7K
Brazil
R324
4.7K
R322
4.7K
Non_Brazil
AJJA
(T/C)_SOC/ATV_CVBS
(T2/C)_SOC/ATV_IF
OPT
R325
4.7K
R327
4.7K
EXT_EEPROM
R326
4.7K
R328
4.7K
INT_EEPROM
LH60 DDR OPTION
MODEL_OPT_8 / MODEL_OPT_12
LH57 DDR OPTION
MODEL_OPT_8 / MODEL_OPT_13
OPT
R341
R342
TAIWAN/COL
T/C/ATV_CVBS
T2/C/ATV_CVBS
T/C/ATV_IF T2/C/ATV_IF
4.7K
DDR_LH57_512MB
4.7K
CHINA/HONG
(DTMB)_EXT/ATV_CVBS
R343
4.7K
R344
4.7K
DDR_LH60/DDR_LH57_1GB
0 / 0
1 / 0
0 / 1
1 / 1
0 / 0
1 / 0
0 / 1
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
MODEL_OPT_11
MODEL_OPT_12
MODEL_OPT_13
KOREA
ATSC_CVBS
NORTH AMERICA
DDR
1GB
768MB
DDR
1GB
768MB
512MB
1 / 1
ATSC_CVBS
-
-
-
BRAZIL
ISDB/ATV_CVBS
ISDB/ATV_IF
DDR Brazil OPT_LH60/LH57 COMMON
MODEL_OPT_9
0
1
DDR Country OPT
Non Brazil
Brazil
+3.3V_NORMAL
T2/S2 L302
BLM15PX121SN1
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
C331
C332
C330
C376
C333
T2/S2
16V
16V
16V
16V
16V
AVDD_3P3
C341
0.1uF 16V
AVDD_AU33
C342
0.1uF 16V
AVDD_DMPLL
C340
0.1uF
16V
AVDD_3P3_USB
C377
0.1uF
16V
W_VD33
C343
0.1uF
16V
T2/S2
0.1uF
C329
16V
C346
0.1uF 16V
C339
0.1uF 16V
D_Demod_Core
BLM15PX121SN1
T2/S2
L304
3.3V_EMMC
DVDD18_EMMC
C301
10uF
10V
T2/S2
OPT
L313
BLM15PX121SN1
L312
BLM15PX121SN1
C306
0.1uF 16V
T2/S2
0.1uF
T2/S2
C326
16V
VDDP_NAND
C364 10uF
10V
0.1uF
T2/S2
C365
0.1uF 16V
0
OPT
R303
0
OPT
R307
W_VDD
C335
16V
16Y_M2
MAIN2
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