Page 1
Internal Use Only
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
LED TV
SERVICE MANUAL
CHASSIS : LA57H
MODEL : 32LF5600 32LF5600-UB
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL68646501(1502-REV00)
Page 2
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION .............................................................. 10
TROUBLE SHOOTING ............................................................................ 16
BLOCK DIAGRAM .................................................................................. 22
EXPLODED VIEW .................................................................................. 23
SCHEMATIC CIRCUIT DIAGRAM ............................................APPENDIX
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 3
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 4
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 5
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 6
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
1. Application range
This spec sheet is applied LED TV with LA57H chassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Market Input voltage Frequency Remark
USA 100~240V 50/60Hz Standard Voltage of each
product is marked by
models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM
5) The receiver must be operated for about 20 minutes prior to
the adjustment
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
Safety : UL, CSA, IEC specification
EMC: FCC, ICES, IEC specification
.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 7
4. General Specification
No Item Specication Result Remark
1. Receiving System ATSC / NTSC-M / 64 & 256 QAM
2. Available Channel 1) VHF : 02~13
3. Input Voltage AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz (N.America)
4. Market NORTH AMERICA
5. Screen Size 32/42/43/49/55 inch Wide
6. Aspect Ratio 16:9
7. Tuning System FS
8. Module Direct LC320DXE-MGA3 LGD HD / 60Hz 32LF560B-Ux
9. Operating Environment 1) Temp : 0 ~ 40 deg
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
(1920 × 1080)
32 inch Wide (1366 × 768) HD / 60Hz 32LF560B-Ux
HC320DXN-ABHS3 BOE HD / 60Hz 32LF560B-Ux
LC320DUE-MGA3 LGD FHD / 60Hz 32LF5600-Ux
NC320DUN-VBBP3 BOE FHD / 60Hz 32LF5600-Ux
LC420DUE-MGA3 LGD FHD / 60Hz 42LF5600-Ux
NC420DUN-VUBP5 AUO FHD / 60Hz 42LF5600-Ux
LC420DUE-MGA6 LGD FHD / 60Hz 42LF5500-Ux
NC420DUN-VUBP8 AUO FHD / 60Hz 42LF5500-Ux
LC490DUE-MGA6 LGD FHD / 60Hz 49LF5500-Ux
LC550DUE-MGA6 LGD FHD / 60Hz 55LF5500-Ux
NC430EUN-AACR1 LGD FHD / 60Hz 43LF5400-Ux
NC490EUN-AACR1 LGD FHD / 60Hz 49LF5400-Ux
2) Humidity : ~ 80 %
2) Humidity : ~ 85 %
FHD / 60Hz 32LF5600-Ux
42LF5500-Ux
42LF5600-Ux
43LF5400-Ux
49LF5500-Ux
49LF5400-Ux
55LF5500-Ux
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 8
5. Supported video resolutions
5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 720*480 15.73 59.94 13.50 SDTV ,DVD 480I
2 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I
3 720*480 31.47 59.94 27.00 SDTV 480P
4 720*480 31.50 60.00 27.027 SDTV 480P
5 1280*720 44.96 59.94 74.176 HDTV 720P
6 1280*720 45.00 60.00 74.25 HDTV 720P
7 1920*1080 33.72 59.94 74.176 HDTV 1080I
8 1920*1080 33.75 60.00 74.25 HDTV 1080I
9 1920*1080 26.97 23.976 74.176 HDTV 1080P
10 1920*1080 27.00 24.00 74.25 HDTV 1080P
11 1920*1080 33.71 29.97 74.176 HDTV 1080P
12 1920*1080 33.75 30.00 74.25 HDTV 1080P
13 1920*1080 67.432 59.94 148.352 HDTV 1080P
14 1920*1080 67.50 60.00 148.50 HDTV 1080P
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 9
5.2. HDMI Input (DTV / PC)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
DTV
1 640*480 31.46 59.94 25.125 SDTV 480P
2 640*480 31.5 60.00 25.125 SDTV 480P
3 720*480 15.73 59.94 13.500 SDTV 480I Spec-Out.
4 720*480 15.75 60.00 13.514 SDTV 480I Spec-Out.
5 720*480 31.47 59.94 27.00 SDTV 480P
6 720*480 31.5 60.00 27.027 SDTV 480P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1920*1080 33.72 59.94 74.176 HDTV 1080I
10 1920*1080 33.75 60.00 74.25 HDTV 1080I
11 1920*1080 26.97 23.97 74.176 HDTV 1080P
12 1920*1080 27.00 24.00 74.25 HDTV 1080P
13 1920*1080 33.71 29.97 74.176 HDTV 1080P
14 1920*1080 33.75 30.00 74.25 HDTV 1080P
15 1920*1080 67.43 59.94 148.352 HDTV 1080P
16 1920*1080 67.5 60.00 148.50 HDTV 1080P
PC
1 640*350 @70Hz 31.46 70.09 25.17 EGA X
2 720*400 @70Hz 31.46 70.08 28.32 DOS O
3 640*480 @60Hz 31.46 59.94 25.17 VESA(VGA) O
4 800*600 @60Hz 37.87 60.31 40.00 VESA(SVGA) O
5 1024*768 @60Hz 48.36 60.00 65.00 VESA(XGA) O
6 1152*864 @60Hz 54.34 60.05 80.002 VESA O
7 1280*1024 @60Hz 63.98 60.02 108.0 VESA (SXGA) O FHD only
8 1360*768 @60Hz 47.71 60.01 85.50 VESA (WXGA) O
9 1920*1080 @60Hz 67.5 60.00 148.5 WUXGA(CEA 861D) O FHD only
(Just Display)
(Just Display)
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 10
ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA57H Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p
(2) EDID download: HDMI and RGB-PC
4. MAIN PCBA Adjustments
* Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig, and
set.
(3) Click “Connect” tab. If display “Can’t ”, Check connect
computer, jig, and set.
(4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”
(5) Click “Auto” tab and set as below
(6) Click “Run”.
(7) After downloading, check “OK” message.
■ Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly tages can be checked by using the INSTART
Menu(1.ADJUST CHECK)
Component 1080p and RGB-PC Adjust will be calculated by
480i adjust value.
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
3.3. Appendix
(1) Shipment conditions
(2) Tool option menu
(3) USB Download (S/W Update, Option and Service only)
(4) Preset CH Information
Only for training and service purposes
4.1. ADC Calibration
4.1.1. Overview
▪ ADC adjustment is needed to find the optimum black level and
gain in Analog-to-Digital device and to compensate RGB
deviation
▪ ADC adjustment is OTP (Auto ADC)
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 11
4.2. EDID Download
4.2.1. Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust by using remote controller
4.2.3. Download method (using DFT)
※ PC(for communication through RS-232C), UART baud rate:
115200 bps
Command : aa 00 00 (Start Factory mode)
Command : ae 00 10 (Download All EDID)
Command : aa 00 90 (End of Factory mode)
▪
2D / 8bit / FHD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
4.2.4. Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
※ Caution) When EDID Download, must remove RGB/HDMI
Cable.
6) EDID Write confirmation
4.2.5. Models for EDID Data
2D
North America
(PCM)
HD / 8bit
HDMI 2ea
32LF560B-Ux
32LF550B-Ux
FHD / 8bit
HDMI 2ea
32/42LF5600-Ux
42/49/55LF5500-Ux
43/49LF5400-Ux
4.2.6. EDID DATA
■ L15_M1L EDID - PCM
▪
2D / 8bit / HD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
■ L15_M1L EDID - AC3
▪
2D / 8bit / HD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
▪
2D / 8bit / FHD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
Only for training and service purposes
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
4.2.7. Tool Option Input
▪ Input Model Tool Option according to BOM
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 12
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
→ Only when internal pattern is not available
※ Color Analyzer Matrix should be calibrated using CS-1000
5.1.3. Equipment connection
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMD DATA ID
Wb 00 00 Begin White Balance adj.
Wb 00 ff End White Balance adj.
(internal pattern disappears )
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.
wb 00 ff ->End white balance auto adj.
(2) Adjustment Map
Adj.
item
Cool R Gain j g 00 C0 172
G Gain j h 00 C0 172
B Gain j i 00 C0 192
R Cut 128
G Cut 128
B Cut 128
Medium R Gain j a 00 C0 192
G Gain j b 00 C0 192
B Gain j c 00 C0 192
R Cut 128
G Cut 128
B Cut 128
Warm R Gain j d 00 C0 192
G Gain j e 00 C0 192
B Gain j f 00 C0 172
R Cut 128
G Cut 128
B Cut 128
Command
(lower case ASCII)
CMD1 CMD2 MIN MAX
Explanation
Data Range
(Hex.)
Default
(Decimal)
▪ When you connect the RS232 to set Phone jack, please use
3pin phone jack cable.
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 13
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.1.5.2. Manual adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key → EZ adjust using adj. R/C → 6. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 204 Gray(80IRE) internal
pattern will be displayed)
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
※ CASE
First adjust the coordinate far away from the target value(x,
y).B
(1) x, y >target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
► How to adjust
(1) Fix G gain at least 172 :
Adjust R, B Gain ( In Case of Mostly Blue Gain Saturation )
(2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※ CASE : Medium / Warm mode
First adjust the coordinate far away from the target value(x, y).
(1) x, y >target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
5.1.6. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 204 Gray, 80IRE
** (normal line) LGD Cell (LF56xx, LF55xx,LF54xx)
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
Aging time
L15
1 0-2 281 285 296 304 323 344
2 3-5 280 284 295 303 322 343
3 6-9 279 282 294 301 321 341
4 10-19 277 279 292 288 319 338
5 20-35 275 275 290 294 317 334
6 36-49 273 273 288 292 315 332
7 50-79 272 272 287 291 314 331
8 80-119 271 270 286 289 313 329
9 Over 120 271 270 286 289 313 329
(Min)
** (Aging chamber) LGD Cell (LF56xx, LF55xx,LF54xx)
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
Aging time
L15
1 0-5 280 285 295 304 319 340
2 6-10 276 280 291 299 315 335
3 11-20 272 275 287 294 311 330
4 21-30 269 272 284 291 308 327
5 31-40 267 268 282 287 306 323
6 41-50 266 265 281 284 305 320
7 51-80 265 263 280 282 304 318
8 81-119 264 261 279 280 303 316
9 Over 120 264 260 279 279 303 315
(Min)
** For INX,AUO,SHARP,CSOT Module.( In the case of , the
color temperature spec of cool mode is 13000K)
L15
spec 271 270 286 289 313 329
target 276 277 291 296 318 336
cool med warm
x y x y x y
Cool Medium Warm
X Y X Y X Y
271 270 286 289 313 329
Cool Medium Warm
X Y X Y X Y
271 270 286 289 313 329
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 14
5.2. Option selection per country
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: LA57H Chassis applied to CANADA and
MEXICO
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu
(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX.
Selection is done using +, - KEY
(3) Using DFT(Auto)
※ PC (for communication through RS-232C) -> UART Baud
rate : 115200 bps
Command : ah 00 00 DATA(Area Number(hexadecimal))
ITEM DATA(Area Number) AREA
AREA OPTION1 0 USA
1 CANADA
2 MEXICO
5.2.3. Tool Option inspection
▪ Press Adj. key on the Adj. R/C, then select Tool option.
2,3th
Model
32LF560B
-Ux
32LF550B
-Ux
32LF5600
-Ux
32LF5600
-Ux
42LF5600
-Ux
42LF5500
-Ux
49LF5500
-Ux
55LF5500
-Ux
4th
Sufx
- M Sharp 13074 13314 41036 28768
CC/US M Sharp 13074 17410 53324 24672
WM M Sharp 13074 17410 53316 24672
CC/US F BOE 21266 17410 53324 24672
WM F BOE 21266 17410 53316 24672
CC/US Y LGD 785 17410 49228 24672
WM Y LGD 785 17410 49220 24672
CC/US Y LGD 785 1030 45132 28768
WM Y LGD 785 1030 45124 28768
CC/US F BOE 21264 1030 49228 20576
WM F BOE 21264 1030 49220 20576
CC/US Y LGD 1553 1030 49228 28768
WM Y LGD 1553 1030 49220 28768
CC/US D AUO 9744 1030 49228 24672
WM D AUO 9744 1030 49220 24672
CC/US Y LGD 1553 5126 49228 28768
WM Y LGD 1553 5126 49220 28768
CC/US D AUO 9744 5126 49228 24672
WM D AUO 9744 5126 49220 24672
CC/US Y LGD 2321 5126 49228 24672
WM Y LGD 2321 5126 49220 24672
CC/US Y LGD 2833 5126 53324 24672
WM Y LGD 2833 5126 53316 24672
Module Tool 1 Tool 2 Tool 3 Tool 4
Sufx
6. GND and HI-POT Test
6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically.
6.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
7.2. Specification
No Item Min Typ Max Unit Remark
1 Audio practical
max Output,
L/R
(Distortion=10% max
Output)
2 Audio practical
max Output,
L/R
(Distortion=10% max
Output)
4.5
6.0
9.0
8.5
5.0
6.3
10.0
8.9
6.0
6.9WVrms
12.0
9.8WVrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)
(3) LF55 Series
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)
(3) LF56 Series
※ Tool option can be reconstructed by Software
Only for training and service purposes
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 15
8. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 16
1. Power-up boot check
TROUBLE SHOOTING
Check PSU DC Voltage
P401_5,6,7,8 pin : 13.2V
OK
Check stand-by Voltage
L202 : +3.3V
OK
Check X100 clock
24 MHz
OK
Check P200 PWR_ON.
1pin : 3.3V
OK
Check IC402/3/4 Output
Voltage
IC202 : 1.15V & 5V
IC200 : 1.8V
Q204 : 3.3V
OK
Check TCON(Module)
Panel_VCC
Q205 : 13.2V
NO
Check 12pin
Power connector
NO
Main B/D 3.3V Line
Short Check
NO
Replace X100
NO
Re-download software.
NO
Replace IC402, IC403,
IC404, Q403
NO
Replace Q205
OK
Main B/D 13.2V Line
Short Check
OK
Replace IC201
(DCDC)
NO
Replace Mstar(IC102)
or Main board
OK
Replace PSU
OK
Check Mstar LVDS
Output
OK
Check DRV ON Control
P200 11pin : High
OK
Change Module
NO
Replace Mstar(IC102) or
Main Board
NO
Check PSU
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 17
2. Digital / Analog TV Video
Check RF Cable & Signal
OK
Check Tuner 3.3V Power
L500
OK
Check IF_P/N Signal
TU501 6,7 Pin
OK
Check Mstar LVDS Output
3. AV Video
Check input signal format.
Is it supported?
OK
Check AV Cable for damage
for damage or open
conductor
OK
NO
Replace L500
NO
Bad Tuner. Replace
Tuner.
NO
Replace Mstar(IC102)
or Main Board.
Check JK401,
CVBS Signal Line
R120
OK
Check CVBS_DET Signal
OK
Check Mstar LVDS
Output
Only for training and service purposes
NO
NO
NO
Replace Jack
Replace AR401 or R110
Replace Mstar(IC102)
or Main Board.
- 17 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 18
4. Component Video
Check input signal format.
Is it supported?
OK
Check Component Cable
for damage or open
conductor.
OK
Check JK401
Y/PB/PR signal Line
OK
Check COMP_DET
Signal
OK
Check Mstar LVDS
Output
NO
Replace Jack
NO
Replace AR401or R109
NO
Replace Mstar(IC101) or
Main Board.
Only for training and service purposes
- 18 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 19
5. HDMI Video
Check input signal format.
Is it supported?
OK
Check HDMI Cable conductors
for damage or open conductor.
OK
Check EDID
AR102, AR101, AR410, AR411 I2C
Signal
OK
Check JK403, JK404
OK
Check HDMI_DET (HPD)
OK
Check HDMI Signal
OK
Check Mstar LVDS
Output
NO
NO
NO NO
NO
NO
Replace the defective IC or
re-download EDID data
Replace Jack
Replace R418, R410,
Q400, R419
Check other set
If no problem, check signal line
Replace Mstar(IC101) or
Main Board.
Replace Main Board
Only for training and service purposes
- 19 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 20
6. All Source Audio
Check the TV Speaker Menu
(Menu -> Audio -> TV Speaker)
ON
Check AMP IC(IC5600) Power
24V, 3.3V
OK
Check Mstar AUDIO_MASTER_CLK
R148
OK
Check AMP I2C Line
R140, R141
OK
Check Mstar I2S Output
IC5600 20,21,22 Pin
OK
Check Output Signal
P5600
1, 2, 3, 4 pin.
OK
NO
NO
NO
OFF
Toggle the Menu
NO
Main B/D 3.3V Line
Short Check
NO
Replace Mstar(IC101)
or Main Board.
Check signal line.
Or replace Mstar(IC101)
Check signal line.
Or replace Mstar(IC101)
Replace Audio AMP
IC(IC5600)
Check Connector &
P5600
OK
Check speaker resistance
and connector damage.
NO
Replace connector
if found to be damaged.
NO
Replace speaker.
Only for training and service purposes
- 20 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 21
7. Digital / Analog TV Audio
Check RF Cable & Signal
OK
Check Tuner 3.3V Power
L500
OK
Check Tuner I2C
AR500, R502, R503
OK
Check IF_P/N Signal
TU501 6/7 Pin
OK
Follow procedure
‘7. All source audio’
trouble shooting guide.
8. AV Audio
Check AV Cable for damage
for damage or open conductor
OK
NO
Replace L500
NO
Replace AR500, R502,
R503
NO
Bad Tuner. Replace
Tuner.
Check JK401 Signal Line
R409 ,R406
OK
Follow procedure
‘7. All source audio’
trouble shooting guide.
9. Component Audio
Check Component Cable
for damage or open conductor.
OK
Check JK401 Signal Line
R409 ,R406
OK
Follow procedure
‘7. All source audio’
trouble shooting guide.
NO
NO
Replace Jack
Replace Jack
Only for training and service purposes
- 21 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 22
BLOCK DIAGRAM
Power Board(LPB)
Sound AMP
TAS5733
IC301
(
(
(
(
Module
JK601
Y,Pb,Pr In
LGE8220 / M1L
5
9
3
4
10
11
Tuner SCL
Tuner SDA
TUNER
IF_AGC
B+
53
24Mhz
49
50
IC101
46
LPF
1
39
36
P305
P200
P300/301
4 2 1
79 ~ 89
54
116 117
94 95
Audio_SCL
Audio_SDA
Panel_12V
INV_on
PWM
RL_on
M_3.3V
TU_3.3V
23 24
152021
22
I2S_MCLK
I2S_WS
I2S_SCK
I2S_SDO
105
106
LED
110 100 101
59
58
62
EEP SDA
EEP SCL
114 113 112 111
SPI_CLK
SPI_DI
SPI_CZ
SPI_DO
S_AMP_24V
3
13
LPF
JK605
USB_5V
P304
IR
KEY1
KEY2
ST_3.5V
Q204
DMP2130L
Panel_Vcc
USB_DN
USB_DP
IF_N
33
JK602
4
34
Comp. R/L In
AV1 In
29,34,3522,24,26,34,35
21
33
51
32
57
131
56
132
144
134,135,145~152
48
IF_P
HDMI2
JK603
67 ~ 78
MHL_5V
USB_DN
USB_DP
124
123
52
87 127
636465
66
139,140,1~4,153~156
HDMI1
HDMI2
SPDIF
JK608
Debug
TDSS-H701F
Tx, Rx
TU701
JK607/P601/P602
P_13.2V
3, 4, 7, 8
IC101
Serial Flas h
8Mbytes
IC100
EEPROM
24C512
VDDC_1.15V
Q204
DMP2130L
IC200
AZ1117EH
DDR_1.8V
N_3.3V
IC201
TI ( TBD)
2BU CK 1OCP
AVDD_ST_3.5V
IC202
BD9D321EFJ
IR
KEY1/2
LED
IR Board
Only for training and service purposes
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
- 22 -
Page 23
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
400
521
120
410
900
540
310
530
LV1
121
A10
Set + Stand
A2
200
Only for training and service purposes
- 23 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 24
<SOC_RESET>
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
OPT
R103
470
+3.3V_ST
OPT
C100
4.7uF
10V
<HW_OPTION>
+3.3V_NORMAL
FHD
R102
4.7K
HD
R101
4.7K
SUB_NVRAM_ROHM
IC100-*1
BR24G512FJ-3
A0
1
A1
2
A2
3
GND
4
EEPROM(512KB)
NVRAM_ATMEL
IC100
AT24C512C-SSHD-T
A0
1
A1
2
A2
3
GND
4
POWER_DET_RESET
C101
4.7uF
10V
R104
470K
MODEL_OPT
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
OPT
C102
8pF
C103
0.1uF
16V
C105
0.1uF
16V
OPT
C104
8pF
SOC_RESET
AR100
33
1/16W
+3.3V_ST
R106
2.2K
LED_RED
+1.15V_VDDC
DDC_SCL_1
DDC_SDA_1
COMP_DET
5V_DET_HDMI_2
DDC_SDA_2
DDC_SCL_2
HDMI2_5V
R107
2.2K
I2C_SCL
I2C_SDA
AVDD_MOD
KEY1
KEY2
DDR_DATA
AV_DET
HPD2
AR103
100
1/16W
Closed to SoC as possible
R111 1K
R110 1K
AR102
100
1/16W
R109 1K
R108 10K
R128 10K
MHL Disable
AR101 100
1/16W
+1.15V_VDDC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
DM_P1
DP_P1
AVDD_MOD_4
SAR0/GPIO75
SAR1/GPIO74
SAR2/GPIO73
VDDC_3
VDDIO_DATA
GPIO54
DDCDD_CL
DDCDD_DA
DDCDA_CL
DDCDA_DA
MHL_DET/GPIO86
DDCDB_DA
DDCDB_CL
HOTPLUG_B
AVDD_5V_MHL
GND_EFUSE
VDDC_4
RXCN_D
RXCP_D
RX0N_D
RX0P_D
RX1N_D
RX1P_D
RX2N_D
RX2P_D
RXCN_B
RXCP_B
RX0N_B
RX0P_B
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
E-PAD
SIDE_USB_DM
SIDE_USB_DP
DM_P0
DP_P0
123
124
1
+3.3V_ST
PM_RXD
AR104
TEST
118
OPT
AR105
4.7K
AR106331/16W
PM_TXD
ARC/GPIO87
DDCA_DA
DDCA_CK
115
116
117
SPI_CK
SOC_RESET
IR
POWER_DET
Closed to SoC as possible
100
1/16W
RESET
122
CEC
IRIN
INT/GPIO64/I2S_OUT_MCK
119
120
121
LGE8220(MSD8220LBM)
157
THERMAL
5
6
SPI_SCK
/SPI_CS
SPI_CZ
113
114
SPI_SDO
SPI_SDI
AR107
33
1/16W
SPI_DO
SPI_DI
112
111
PWM_DIM
PWM_DIM2
R115 1K
R112 1K
<Chip config.>
4.7K
AR108
1/16W
HPD1
R114
5V_DET_HDMI_1
10K
GPIO0/TCON0
HOTPLUG_D
HOTPLUG_A
PWM1/GPIO14
PWM0/GPIO15
107
108
109
110
15
16
17
/FLASH_WP
I2C_SDA
I2C_SCL
GPIO3/TCON3
GPIO2/TCON2
GPIO1/TCON1
103
104
105
106
IC102
[M1L]
20
21
22
RL_ON
PANEL_CTL
INV_CTL
POWER_ON/OFF
R117
10K
GPIO4/TCON4
102
23
Closed to SoC as possible
GPIO8/TCON8
GPIO7/TCON7
GPIO6/TCON6
GPIO5/TCON5
99
100
101
24
AMP_RESET
AMP_MUTE
MODEL_OPT
AR111331/16W
AR110
100
1/16W
GPIO10/TCON10
GPIO9/TCON9
LVSYNC/GPIO16/RLV0-/GPIO16
95
96
97
98
27
28
30
USB_CTL
USB_OCD
AMP_SDA
AMP_SCL
AR112
1/16W
LCK/GPIO19/RLV1+/GPIO19
LDE/GPIO18/RLV1-/GPIO18
LHSYNC/GPIO17/RLV0+/GPIO17
92
93
94
31
32
33
RXB3+
RXB3-
100
R_ODD[4]/LVB1+/RLV3(CLK)+/EPI6+
R_ODD[5]/LVB1-/RLV3(CLK)-/EPI6-
R_ODD[6]/LVB0+/RLV2+/EPI7+
R_ODD[7]/LVB0-/RLV2-/EPI7-
88
89
90
91
34
RXBCK-
RXBCK+
AVDD_MOD
AVDD_MOD_3
87
RXB2+
R_ODD[1]/LVBCLK-/RLV5-/EPI4-
R_ODD[2]/LVB2+/RLV4+/EPI5+
R_ODD[3]/LVB2-/RLV4-/EPI5-
84
85
86
<MAIN SoC Vcc>
RXB1+
RXB2-
G_ODD[7]/LVB3-/RLV6-/EPI3-
R_ODD[0]/LVBCLK+/RLV5+/EPI4+
82
83
42
RXB0-
RXB1-
RXB0+
+3.3V_ST
+1.8V_DDR
G_ODD[4]/LVB4+/LLV0+/EPI2+
G_ODD[5]/LVB4-/LLV0-/EPI2-
G_ODD[6]/LVB3+/RLV6+/EPI3+
79
80
81
44
45
G_ODD[3]/LVA0-/LLV1-/EPI1-
78
G_ODD[2]/LVA0+/LLV1+/EPI1+
77
G_ODD[1]/LVA1-/LLV2-/EPI0-
76
G_ODD[0]/LVA1+/LLV2+/EPI0+
75
B_ODD[7]/LVA2-/LLV3(CLK)-
74
B_ODD[6]/LVA2+/LLV3(CLK)+
73
B_ODD[5]/LVACLK-/LLV4-
72
B_ODD[4]/LVACLK+/LLV4+
71
B_ODD[3]/LVA3-/LLV5-
70
B_ODD[2]/LVA3+/LLV5+
69
B_ODD[1]/LVA4-/LLV6-
68
B_ODD[0]/LVA4+/LLV6+
67
GPIO53/I2S_OUT_SD
66
GPIO52/I2S_OUT_BCK
65
GPIO51/I2S_OUT_MCK
64
GPIO50/I2S_OUT_WS
63
GPIO49/SPDIF_OUT
62
GPIO47
61
GPIO46/MHL_VBUS
60
GPIO45/I2C_SCLM/UART_RX1
59
GPIO44/I2C_SDAM/UART_TX1
58
VDDC_2
57
VDDIO_CMD
56
AVDD_MOD_2
55
XOUT
54
XIN
53
AVDD3P3_DMPLL
52
AVDD3P3_DADC
51
VIFM
50
VIFP
49
IFAGC
48
LINEOUTR0
47
46
L102
PZ1608U121-2R0TF
+1.15V_VDDC
L101
PZ1608U121-2R0TF
C118
10uF
6.3V
C120
10uF
6.3V
C121
10uF
6.3V
DDR_CMD
R122 0
R123 0
C126
1uF
10V
C119
0.1uF
16V
C127
1uF
10V
OPT
C125
0.1uF
16V
C124
0.1uF
16V
C131
0.1uF
16V
C129
0.1uF
16V
+1.8V_DDR
C132
0.1uF
16V
C130
0.1uF
16V
C137
0.1uF
16V
L104
PZ1608U121-2R0TF
SPDIF
R126
100
+1.15V_VDDC
DDR_CMD
AVDD_MOD
AVDD_DMPLL
AVDD_DADC
C123
0.1uF
16V
OPT
C128
100pF
C139
C140
0.1uF
0.1uF
16V
16V
C138
0.1uF
16V
DDR_DATA
C135
10uF
6.3V
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
AUD_LRCH
AUD_SCK
AUD_MASTER_CLK
AUD_LRCK
SPDIF_OUT
VCOM_SDA
VCOM_SCL
TU_SCL
TU_SDA
R127
1M
Closed to SoC
OPT
C134
100pF
Closed to SoC
AVDD_MOD
C136
0.1uF
16V
X100
24MHz
IF_N_MSTAR
IF_P_MSTAR
OPT
C141
0.1uF
16V
C143 15pF
C142 15pF
+3.3V_ST
L105
PZ1608U121-2R0TF
C147
0.1uF
16V
L108
PZ1608U121-2R0TF
C146
0.1uF
16V
L107
PZ1608U121-2R0TF
C145
0.1uF
16V
L106
PZ1608U121-2R0TF
C144
0.1uF
16V
Closed to Main SoC Each Pin
AVDD_DADC
AVDD_AU33
AVDD_DMPLL
AVDD_VIDEO
VCC
8
%HOLD[IO3]
7
CLK
6
DI[IO0]
5
+3.3V_ST
SERIAL FLASH(64MB)
OPT
R105
4.7K
R100
/SPI_CS
10K
/FLASH_WP
SPI_SDO
Not USe Macronix (EAN63146601)
DO[IO1]
WP[IO2]
GND
IC101
W25Q64FVSSIG
CS
1
2
3
4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C106
0.1uF
16V
SPI_SCK
SPI_SDI
RX1N_B2RX1P_B3RX2N_B4RX2P_B
AVDD_MOD_1
D1-_HDMI2
D1+_HDMI2
D2+_HDMI2
D2-_HDMI2
AVDD_MOD
RXCN_A7RXCP_A8RX0N_A9RX0P_A10RX1N_A11RX1P_A12RX2N_A13RX2P_A14HSYNC0
BIN0P
GIN0P18GIN0M19RIN0P
SOGIN0
BIN1P
VSYNC0
SOGIN1
AVDD3P3_ADC
25V
50V
C107 0.047uF
C108 1000pF
R113 33
AR109 33
COMP_Pb+
AVDD_VIDEO
GIN1P25GIN1M26RIN1P
C109 0.047uF
COMP_Y+
25V
25V
C110 0.047uF
R118 68
VSYNC1
25V
C111 0.047uF
R119 33
COMP_Pr+
VCOM
CVBS129CVBS0
25V
C112 0.047uF
C113 0.047uF
R121 180
R120 150
COMP_Y+
VDDC_1
CVBS_OUT1
AVDD_AU33
25V
TP1
AVDD_AU33
+1.15V_VDDC
AUR035AUL036AUR137AUL138AUR239AUL240AUR341AUL3
10V
10V
C114 2.2uF
C115 2.2uF
COMP_R_IN
COMP_L_IN
VAG43VRM
C116
0.1uF
16V
C117
10uF
6.3V
LINEOUTL3
LINEOUTR3
LINEOUTL0
L100
PZ1608U121-2R0TF
+3.3V_NORMAL
MAIN
C122
0.1uF
16V
L103
PZ1608U121-2R0TF
R124
10K
R125
100
Close to MSTAR
C133
0.047uF
25V
IF_AGC_MAIN
140822L15_M1L
1
5
Page 25
L15 NA POWER BLOCK
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
FROM LIPS or POWER B/D
R205
B
C
E
TR_NXP
MMBT3906(NXP)
Q201
1
2
10K
OPT
R207
0
ICVS0518150FR_
R206
R209
1K
100
C
TR_NXP
Q200
MMBT3904(NXP)
E
MLB-201209-0120P-N2
C203
C205
10uF
0.1uF
25V
25V
3
OPT
VR200
MLB-201209-0120P-N2
L201
+3.3V_ST
OPT
R201
10K
RL_ON
R202
10K
To make high at RL_ON
when AC On
+3.3V_ST
M13.2V
10K
TR_KEC
Q200-*1
2N3904S
INV_CTL
R200
R203
10K
B
+3.3V_NORMAL
+1.8V_DDR
+3.3V_NORMAL
C201
10uF
6.3V
IC200
AZ1117EH-ADJTRG1
IN
ADJ/GND
OUT
R1
1%
R212
3.9K
R2
1%
R213
1.6K
+1.8V_DDR
OPT
R215
33K
L208
OPT
R214
0
C208
10uF
6.3V
Check ESR!!
TR_KEC
Q201-*1
2N3906S-RTK
C
E
B
P200
SMAW200-H12S5K(BK)(LTR)
PWR_ON
1
D13.2V
A13.2V
DRV_ON
ZD200
2.5V
GND
GND
2
3
4
5
6
7
8
10
9
11
12
13
.
OPT
ZD205
5.1v
PDIM#2
D13.2V
D13.2V
A13.2V
GND
PDIM#1
C241
0.1uF
25V
A13.2V
PWM_DIM2
PWM_DIM
PANEL_Vcc
M13.2V
L203
UBW2012-121F
OPT
C212
0.1uF
25V
PANEL_CTL
+3.3V_Normal
POWER_ON/OFF
+3.3V_ST
OPT
R216
10K
OPT
R217
10K
R218
Power_DET
PANEL_VCC
Q205
SSM3J332R
S
G
C
TR_KEC
Q202-*1
B
2N3904S
E
FET_3.3V_TOSHIBA
Q204
SSM3J332R
S
G
C
B
E
D
SUB_FET_3.3V_AOS
S
G
PZ1608U121-2R0TF
D
C215
0.1uF
16V
TR_KEC
Q203-*1
2N3904S
R224
3.3K
D
AO3435
Q204-*1
L204
OPT
R225
3.3K
+3.3V_NORMAL
C218
10uF
6.3V
OPT
ZD202
5V
C224
0.1uF
16V
Panel_Cgs_0.22uF
10%
1608
10%
1608
C
TR_NXP
Q202
MMBT3904(NXP)
E
R221
12K
R222
1.8K
C
TR_NXP
B
E
C213
0.22uF
25V
Panel_Cgs_0.1uF
C213-*1
0.1uF
50V
C214
4.7uF
10V
Q203
MMBT3904(NXP)
R219
33K
R220
120K
B
10K
PANEL_VCC
R232
14K
1%
R233
5.6K
1%
+3.3V_ST
OPT
R236
0
OPT
R237
0
Reset_IC_KEC
KIC7529M2
VCC
3
RESET_IC_DIODES
APX803E29
VCC
3
R241
100K
IC203
IC203-*1
2
1
GND
RESET
2
1
GND
+13.2V --> 3.56V
+3.3V_ST
R245
300
OUT
POWER_DET_RESET
R246
4.7K
C238
0.1uF
POWER_DET
+5V_Normal & +1.15V_VDDC
Vout=1.25*(1+R2/R1)+I(ADJ)XR2
+3.3V_STANDBY
M13.2V
L200
BLM18PG121SN1D
OPT
C200
C202
10uF
0.1uF
25V
25V
R204
6.2K
1/16W
1%
C204
100pF
50V
R20 8
68K
1/1 6W
1%
R210
100K
R1
1/1 6W
1%
Vout=0.6(R1/R2)+0.6
R2
C237
22uF
6.3V
C235
47pF
50V
+5V_NORMAL
C236
22uF
16V
3216
85C
+1.15V_VDDC
C240
22uF
6.3V
C239
22uF
16V
3216
85C
OPT
ZD204
5.1v
M13.2V
L205
CB2012PK501T
C219
C220
10uF
10uF
25V
25V
R223
OPT
R249
300K
OPT
C217
4700pF
50V
+3.3V_ST
R226
10K
OPT
R250
300K
R247
3.3K
+3.3V_NORMAL
R227
4.7K
OPT
+3.3V_NORMAL
R228
10K
50V
2200pF
2200pF
R229
91K
+3.3V_NORMAL
+3.3V_ST
10K
OPT
C216
4700pF
IC201
BD9D321EFJ
R248
33K
R2
C206
R21 1
22K
1uF
10V
C207
2200pF
50V
VREG
EN
1
FB
2
3
SS
4
3A
9
THERMAL
[EP]
VIN
8
7
6
5
BOOT
SW
GND
0.1uF
C209
16V
L202
2uH
C210
22uF
10V
3216
125C
CST Check!!
C211
22uF
3216
125C
OPT
ZD201
5V
SD05
10V
50V
USB_CTL
USB_OCD
C221
C222
OPT
50V
OPT
C223
SS2
EN1
EN2
ROSC/SYNC
SW_EN
NFAULT
+5V_USB
1uF
10V
[EP]
1
THERMAL
2
3
SN1406035RGER
4
5
6
7
SW_OUT
25
SW_IN
VIN123V7V24SS1
IC202
8
VIN2
16V
22uF
22
9
C225
10
PGND2
LX2
0
R230
BST120LX121PGND1
19
18
17
16
15
14
13
11
12
BST2
+5V_NORMAL
25V
0.047uF
C226
R231
0
COMP1
FB1
AGND
RSET
FB2
COMP2
C227
1uF
16V
L206
4.7uH
R1
R238
4.7K
1%
R2
R239
5.1K
1%
R240
10K
R234
15K
C230
22pF
50V
C229
3300pF
R235
50V
20K
C228
L207
0.047uF
4.7uH
25V
Vout=0.6(R1/R2)+0.6
OPT
C231
82pF
50V
C233
22pF
50V
3300pF
C232
50V
ZD203
2.5V
OPT
OPT
C234
10uF
6.3V
R242
200
1%
R243
5.1K
1%
R244
39K
1%
R1
Vout=0.765*(1+R1/R2)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1L
POWER
141020
2 5
Page 26
AUDIO AMP(TI)/LVDS/IR
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[51Pin LVDS Connector]
(For FHD 60Hz)
FHD
P300
SP14-11592-01-51Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
R300 0
R320 0
FHD_GND_26
FHD_GND_27
FHD_GND_42_43
AR300
0
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
VCOM_SDA_M
VCOM_SCL_M
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
FHD_VCC_Cap
C300
10uF
25V
LVDS_SEL
+3.3V_NORMAL
OPT
R302
3.3K
OPT
R301
10K
PANEL_VCC
FHD
L300
UBW2012-121F
FHD
C301
0.1uF
25V
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
HD
P301
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
Separate DGND AND AVSS
Need to Check.
AMP_MUTE
POWER_DET
R303
1/16W
0
AMP_SDA
AMP_SCL
OPT
R304
0
VCOM_SCL_M
VCOM_SDA_M
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
+3.3V_NORMAL
LVDS_SEL
+3.3V_NORMAL
OPT
R307
3.3K
OPT
R306
10K
HD_VCC_Cap
R305
4.7K
AUD_MASTER_CLK
OPT
C302
1000pF
50V
+3.3V_NORMAL
AR301
4.7K
1/16W
C303
10uF
25V
A13.2V
L301
120OHM
AUD_LRCK
AUD_SCK
AUD_LRCH
AMP_RESET
PANEL_VCC
+13.2V_AMP
+3.3V_NORMAL
HD
L302
120OHM
UBW2012-121F
HD
C306
0.1uF
25V
OPT
C307
0.1uF
50V
C305
0.1uF
16V
V-COM I2C or GPIO(Tuner)
VCOM_SCL_M VCOM_SCL
VCOM_SDA_M
This parts are Located
on AVSS area.
C313
4700pF
C311
4700pF
C310
R310
470
0.047uF
AVDD
MCLK
OSC_RES
DVSSO
VR_DIG
PDN
LRCLK
SCLK
SDIN
SDA
SCL
+3.3V_NORMAL
C312
0.1uF
16V
13
14
15
16
17
18
19
20
21
22
23
24
C309
0.1uF
16V
C308
0.1uF
16V
R309
R308
18K 1%
2.2K
A_SEL_FAULT
OPT
ZD300
5V
R311
470
C314
0.047uF
VR_ANA
12
25
RESET26STEST
PLL_FLTM
PLL_FLTP
11
10
IC300
TAS5733
27
DVDD28DVSS
0.1uF
C315
2200pF
50V
29
GND
C316
16V
V_COM
NC_28PBTL9AVSS
7
30
AGND31VREG
+3.3V_NORMAL
V_COM
R316
AR302
0
R323
C318
0.033uF
50V
BST_A5NC_16SSTIMER
4
32
33
BST_D
GVDD_OUT
C317
1uF
16V
2K
OPT
2K
PVDD_AB_1
PVDD_AB_2
OUT_A
1
2
3
48
THE RMAL
47
46
49
45
44
43
42
41
40
39
38
37
34
36
OUT_D
PVDD_CD_135PVDD_CD_2
C319
0.033uF
50V
C320
0.1uF
50V
[EP]
PGND_AB_2
PGND_AB_1
OUT_B
NC_6
NC_5
BST_B
BST_C
NC_4
NC_3
OUT_C
PGND_CD_2
PGND_CD_1
+13.2V_AMP
C321
0.1uF
50V
V_COM
R317
2K
OPT
R324
2K
+13.2V_AMP
C322
10uF
25V
VCOM_SDA
AUDIO AMP(TI)
R312
1/16W
18
1%
C326
330pF
50V
C327
330pF
50V
R313181/16W
1%
C324
0.033uF
50V
C325
0.033uF
50V
R314
1/16W
18
1%
C328
330pF
50V
C329
330pF
C323
10uF
25V
50V
R315181/16W
1%
IR
KEY1
KEY2
+3.3V_ST
L304
10.0uH
NRS6045T100MMGK
L306
10.0uH
NRS6045T100MMGK
L303
10.0uH
NRS6045T100MMGK
L305
10.0uH
NRS6045T100MMGK
+3.3V_ST
AR303
10K
1/16W
PZ1608U121-2R0TF
LED_RED
C330
0.33uF
50V
C331
0.33uF
50V
L307
C335
0.1uF
C332
0.1uF
50V
C333
0.1uF
50V
VR302
OPT
VR301
16V
C334
0.1uF
50V
C340
0.1uF
50V
OPT
C338
0.1uF
16V
OPT
C337
0.1uF
16V
C336
1000pF
50V
OPT
VR300
IR
+3.3V_ST
OPT
R322
3.3K
C339
100pF
50V
OPT
VR303
OPT
P302
12507WR-08L
1
2
3
4
5
6
7
8
9
P303
12507WR-10L
1
2
3
4
5
6
7
8
9
10
11
Close to Speaker
SPK_L+
OPT
C341
2200pF
50V
SPEAKER_L
OPT
C342
2200pF
50V
OPT
C343
2200pF
50V
OPT
C344
2200pF
50V
SPK_L-
SPK_R+
SPEAKER_R
SPK_R-
SPK_L+
SPK_L-
SPK_R+
SPK_R-
SPK Wafer Box Type
P304
250A1-WR-H04M
4
3
2
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1L
LVDS/S_AMP/IR
140828
3 5
Page 27
EXTERNAL INTERFACE
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
AV/COMPONENT
JK401
PPJ245N2-01
[RD2]E-LUG
6E
R405
75 1%
comp-shape=1005
R404
75 1%
comp-shape=1005
R403
75
1%
comp-shape=3216
IC400
1
2
3
4
5
6
7
8
OPT
C402
1000pF
50V
OPT
C401
1000pF
50V
C1+
V+
C1-
C2+
C2-
V-
DOUT2
RIN2
VR403
R402
OPT
5E
4E
5D
4C
5C
7C
5B
4A
5A
6A
UART For DEBUG
JK400
KJA-PH-1-0177
6 M6
1 M1
3 M3_DETECT
4 M4
5 M5_GND
OPT
R400
0
[RD2]O-SPRING
[RD2]CONTACT
[WH]O-SPRING
[RD1]CONTACT
[RD1]O-SPRING
[RD1]E-LUG-S
[BL]O-SPRING
[GN/YL]CONTACT
[GN/YL]O-SPRING
[GN/YL]E-LUG
1/16W
5%
PM_TXD
PM_RXD
+3.3V_ST
C400
0.1uF
AR400
100
1/16W
P400
12507WS-04L
1
2
3
4
5
ZD404
ZD405
ZD402
ZD403
ZD401
ZD400
470K
R401
VR401
470K
OPT
OPT
VR402
OPT
VA402
ICVS0518150FR_
OPT
VA401
ICVS0518150FR_
OPT
VR400
OPT
VA400
ICVS0518150FR_
MAX3232CDR
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
EAN41348201
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R406
10K
C406
0.1uF
0.1uF
0.1uF
0.1uF
R409
10K
C405
C404
C403
R408
12K
R407
12K
AR401
10K
1/16W
+3.3V_NORMAL
COMP_R_IN
COMP_L_IN
COMP_DET
COMP_Pr+
COMP_Pb+
AV_DET
COMP_Y+
USB(SIDE)
SPDIF OPTIC JACK
P401
3AU04S-305-ZC-(LG)
1234
USB DOW N ST REAM
5
SPDIF_OUT
OPT
ZD406
5V
C407
22uF
16V
3216
RCLAMP0502BA
OPT
D400
+3.3V_NORMAL
C408
1uF
OPT
10V
ESD Ready
OPT
C409
22uF
16V
3216
OPT
C413
5pF
50V
OPT
C417
22uF
10V
2012
SPDIF
C412
18pF
50V
+5V_USB
OPT
C418
22uF
10V
2012
OPT
C414
5pF
50V
GND
VCC
VINPUT
SPDIF
JK402
JST1223-001
1
2
3
4
FIX_POLE
SIDE_USB_DM
SIDE_USB_DP
Fiber Optic
HDMI_1(REAR)
JK404
GND
SHIELD
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG59023302
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
HDMI_2(SIDE)
Check!!
HPD2 Pull-Up
HDMI2_5V
R420
10
AR404
AR405
AR402
AR403
JK403
GND
BODY_SHIELD
20
19
18
17
16
15
14
13
12
11
10
EAG62611204
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R410
1K
R413
2.7K
OPT
VR404
L401
DLP11SA900HL2L
4 3
21
L402
DLP11SA900HL2L
4 3
21
L403
DLP11SA900HL2L
4 3
21
L404
DLP11SA900HL2L
4 3
21
HDMI_EMI_Filter
OPT
R411
1K
R412
2.7K
VR405
OPT
5.1
1/16W
5.1
1/16W
5.1
1/16W
5.1
1/16W
L15_M1L
COMP/USB/SPDIF
OPT
R414
10K
MMBT3904(NXP)
OPT
VR408
5V_DET_HDMI_1
VR409
OPT
AR406
AR407
AR408
AR409
OPT
VR406
5V_DET_HDMI_2
VR407
OPT
OPT
D401
IP4283CZ10-TBA
1
2
3
4
5 6
1
2
3
4
5 6
D402
IP4283CZ10-TBA
OPT
TR_NXP
Q400
R416
4.7K
R415
4.7K
C
R418
10K
B
E
C
TR_KEC
B
Q400-*1
2N3904S
E
OPT
VR410
5.1
1/16W
5.1
1/16W
5.1
1/16W
5.1
1/16W
R419
33
10
9
8
7
10
9
8
7
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
OPT
VR411
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
AR410
4.7K
1/16W
OPT
VR412
AR411
1/16W
VR413
4.7K
OPT
JP422
+5V_NORMAL
+5V_NORMAL
JP423
JP424
HPD1
DDC_SDA_1
DDC_SCL_1
HPD2
DDC_SDA_2
DDC_SCL_2
JP425
141020
4 5
Page 28
TUNER for ATSC W/O Isolator
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3.3V_NORMAL -> 3.3V_TU
A1
A1
47
TU501
TDJH-H301F
+3.3V
1
NC_1
2
DIF_AGC
3
SCL_RF
4
SDA_RF
5
DIF[P]
6
DIF[N]
7
SIF
8
CVBS
9
B1
B1
+3.3V_TU
C500
100pF
50V
C503
0.1uF
16V
close to the tuner pin
C502
0.1uF
16V
should be guarded by ground
C501
15pF
50V
R501
33
1/16W
5%
R500
33
1/16W
5%
Close to the tuner
C504
15pF
50V
AR500
33
1/16W
IF_AGC_MAIN
IF_P_MSTAR
IF_N_MSTAR
OPT
C505
20pF
50V
+3.3V_NORMAL
C507
0.1uF
16V
+3.3V_TU
R502
1.8K
OPT
C506
20pF
50V
R503
1.8K
PZ1608U121-2R0TF
C508
22uF
6.3V
TU_SCL
TU_SDA
L500
C509
22uF
6.3V
+3.3V_TU
C510
0.1uF
16V
SHIELD
TU_GND_A
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1L
TUNER
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
140822
5 5
Page 29
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