LG 32LF551C-ZA, 32LF550U-ZA, 32LF551C, 43LF540V, 43LF540V-ZB Service Manual

Printed in KoreaP/NO : MFL68646111 (1503-REV00)

CHASSIS : LD55T

MODEL : 32LF550U 32LF550U-ZA

32LF551C 32LF551C-ZA

CAUTION

BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

LED TV

SERVICE MANUAL

North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

Internal Use Only

- 2 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................. 11

BLOCK DIAGRAM ................................................................................. 17

EXPLODED VIEW .................................................................................. 21

SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX

TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 3 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

Always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

SAFETY PRECAUTIONS

- 4 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau­tions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo­sion hazard.

2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam­age caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharg­ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.

2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec­trically shorted together by conductive foam, aluminum foil or
comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate­rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir­cuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropri­ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo­nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 5 -

LGE Internal Use Only

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Only for training and service purposes

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close
as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remain­ing on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos­sible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when­ever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec­tions).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. Carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con­nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

LGE Internal Use Only

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Only for training and service purposes

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used LD55T
chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC specification

4. Model General Specification

No. Item Specication Remarks

1 Market EU(PAL Market-37Countries) DTV & Analog (Total 37 countries)

DTV (MPEG2/4, DVB-T) :37 countries
UK/Italy/Germany/France/Spain/Sweden/Finland/Neth­erlands/ Belgium/Luxemburg/ Greece/Denmark/Czech/
Austria /Hungary/Swiss/Croatia/TurkeyNorway/Slovenia/
Poland/Ukraine/Portugal/Ireland/Morocco/Latvia/Estonia/
Lithania/Rumania/Bulgaria/Russia/SlovakiaBosnia/Serbia/
Albania/Kazakhstan/Belarus

DTV (MPEG2/4, DVB-T2): 8 countries

UK/Denmark/Sweden/Finland/Norway/Ireland/Ukraine/
Kazakhstan

DTV (MPEG2/4, DVB-C): 37 countries

UK/Italy/Germany/France/Spain/Sweden/Finland/Nether­lands/ Belgium/Luxemburg/ Greece/Denmark/Czech/Aus­tria /Hungary/Swiss/Croatia/TurkeyNorway/Slovenia/Poland
/Ukraine/Portugal/Ireland/Morocco/Latvia/Estonia/Lithania/
Rumania/Bulgaria/Russia/SlovakiaBosnia/Serbia/Albania/
Kazakhstan/Belarus

DTV (MPEG2/4,DVB-S): 29 countries

Italy/Germany/France/Spain/Netherlands/ Belgium/Luxem­burg/Greece/Czech/Austria /Hungary/Swiss/Croatia/Turkey/
Slovenia/Poland/Portugal/ Morocco/Latvia/Estonia/Lithania/
Rumania/Bulgaria/Russia/Slovakia/Bosnia/Serbia/Albania/
Belarus

Supported satellite : 22 satellites

HISPASAT 1C/1D, ATLANTIC BIRD 2, NILESAT 101/102,
ATLANTIC BIRD 3, AMOS 2/3, THOR 5/6, IRIUS 4,
EUTELSAT-W3A, EUROBIRD 9A, EUTELSAT-W2A,
HOTBIRD 6/8/9, EUTELSAT-SESAT, ASTRA 1L/H/M/
KR, ASTRA 3A/3B, BADR 4/6, ASTRA 2D, EUROBIRD 3,
EUTELSAT-W7, HELLASSAT 2, EXPRESS AM1, TURK­SAT 2A/3A, INTERSAT10

- 7 -

LGE Internal Use Only

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No. Item Specication Remarks

2 Broadcasting system

Analogue TV

1) PAL-B/G/D/K/I

2) SECAM-B/G/D/K/I, SECAM L/L’

Digital TV

1) DVB-T

2) DVB-C

Satellite Digital TV

1) DVB-T/T2

2) DVB-C

3) DVB-S/S2

Analogue TV :
(RF) VHF: E2 to E12, UHF : E21 to E69
(CATV) S1 to S20, HYPER: S21 to S47

Digital TV : VHF, UHF

Satellite TV :
VHF, UHF,
C-Band, Ku-Band

3 Receiving system

Analog : Upper Heterodyne
Digital : COFDM, QAM

► DVB-T

- Guard Interval(Bitrate_Mbit/s) : 1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

► DVB-T2

- Guard Interval(Bitrate_Mbit/s)
: 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,

- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

► DVB-C

- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s

- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM

► DVB-S/S2

- symbolrate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s

- viterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10

4 Scart Jack (1EA) PAL, SECAM

Scart 1 Jack is Full scart and support RF-OUT(analog). EU
only

5

Component & AV
Common port (1EA)

Video Input RCA (PAL, SECAM, NTSC) 4 System : PAL, SECAM, NTSC, PAL60

Component Input (Y/Cb/Cr, Y/Pb/Pr)

6 HDMI Input (2EA) HDMI1/2-DTV Support HDCP

7 Audio Input (1EA) Component & AV Component & AV’s audio input is used by common port.

8 SDPIF out (1EA) SPDIF out LF62/LF57/LF56/LF55 Series

9 Earphone out (1EA)

Antenna, AV1, AV2, Component,
HDMI1, HDMI2, USB

LF62/LF57/LF56 Series

10 USB (1EA) EMF, DivX HD, For SVC (download) JPEG, MP3, DivX HD

11 DVB

DVB-T

CI : UK, Finland, Denmark, Norway, Sweden, Russia, Spain,

Ireland, Luxemburg, Belgium, Netherland

CI+ : France(Canal+), Italy(DGTVi)

DVB-C

CI : Switzerland, Austria, Slovenia, Hungary, Bulgaria
CI+ : Switzerland(UPC,Cablecom), Netherland(Ziggo),

Germany(KDG,CWB), Finland(labwise)

DVB-S CI + : Germany(Astra HD+ )

12 Ethernet (1EA) DLNA(Wired, DMP only) Only UK T2 Model (LF57/LF56/LF55/LF54) : for MHEG

- 8 -

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5. Video resolutions (2D)

5.1. Component Input (Y, CB/PB, CR/PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1

720*576 15.625 50.00 13.5 SDTV ,DVD 576I

2

720*480 15.73 60.00 13.5135 SDTV ,DVD 480I

3 720*480 15.73 59.94 13.50 SDTV ,DVD 480I

4 720*576 31.25 50.00 27.00 SDTV 576P

5 720*480 31.50 60.00 27.027 SDTV 480P

6 720*480 31.47 59.94 27.00 SDTV 480P

7 1280*720 37.50 50.00 74.25 HDTV 720P

8 1280*720 45.00 60.00 74.25 HDTV 720P

9 1280*720 44.96 59.94 74.176 HDTV 720P

10 1920*1080 28.12 50.00 74.25 HDTV 1080I

11 1920*1080 33.75 60.00 74.25 HDTV 1080I

12 1920*1080 33.72 59.94 74.176 HDTV 1080I

13 1920*1080 56.25 50.00 148.50 HDTV 1080P

14 1920*1080 67.50 60.00 148.50 HDTV 1080P

15 1920*1080 67.43 59.94 148.352 HDTV 1080P

16 1920*1080 27.00 24.00 74.25 HDTV 1080P

17 1920*1080 26.97 23.94 74.176 HDTV 1080P

18 1920*1080 33.75 30.00 74.25 HDTV 1080P

19 1920*1080 33.71 29.97 74.176 HDTV 1080P

- 9 -

LGE Internal Use Only

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5.2. HDMI Input(PC/DTV)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

PC(DVI) DDC

1 640*350 31.468 70.09 25.17 EGA X

2 720*400 31.469 70.08 28.32 DOS O

3 640*480 31.469 59.94 25.17 VESA(VGA) O

4 800*600 37.879 60.31 40.00 VESA(SVGA) O

5 1024*768 48.363 60.00 65.00 VESA(XGA) O

6 1152*864 54.348 60.053 80.00 VESA O

7 1360*768 47.712 60.015 85.50 VESA (WXGA) O

8 1280*1024 63.981 60.020 108.0 VESA (SXGA) O FHD only

9 1920*1080 67.50 60.00 148.5 HDTV 1080P O FHD only

DTV

1 640*480 31.46 59.94 25.125 SDTV 480P

2 640*480 31.50 60.00 25.125 SDTV 480P

3 720*480 31.47 59.94 27.00 SDTV 480P

4 720*480 31.50 60.00 27.027 SDTV 480P

5 720*576 31.25 50.00 27.00 SDTV 576P(DVB)

6 1280*720 37.50 50.00 74.25 HDTV 720P(DVB)

7 1280*720 45.00 60.00 74.25 HDTV 720P

8 1280*720 44.96 59.94 74.176 HDTV 720P

9 1920*1080 28.12 50.00 74.25 HDTV 1080I(DVB)

10 1920*1080 33.75 60.00 74.25 HDTV 1080I

11 1920*1080 33.72 59.94 74.176 HDTV 1080I

12 1920*1080 56.25 50.00 148.50 HDTV 1080P(DVB)

13 1920*1080 67.50 60.00 148.50 HDTV 1080P

14 1920*1080 67.43 59.94 148.35 HDTV 1080P

15 1920*1080 27.00 24.00 74.25 HDTV 1080P

16 1920*1080 26.97 23.97 74.175 HDTV 1080P

17 1920*1080 33.75 30.00 74.25 HDTV 1080P

18 1920*1080 33.71 29.97 74.175 HDTV 1080P

- 10 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
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6. Video resolutions (3D)

6.1. HDMI Input

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1280*720 37.50 50 74.25 HDTV 720P Side by Side(half), Top and Bottom,

2 1280*720 45 60 74.25 HDTV 720P Side by Side(half), Top and Bottom,

3 1280*720 75 50 148.5 HDTV 720P Frame packing

4 1280*720 89.90 / 90 59.94 / 60 148.35/148.5 HDTV 720P Frame packing

5 1920*1080 28.12 50 74.25 HDTV 1080i Side by Side(half), Top and Bottom

6 1920*1080 33.70 60 74.25 HDTV 1080i Side by Side(half), Top and Bottom

7 1920*1080 27.00 24 74.25 HDTV 1080P Side by Side(half), Top and Bottom,

8 1920*1080 33.70 30 89.1 HDTV 1080P Side by Side(half), Top and Bottom

9 1920*1080 53.95 / 54 23.98 / 24 148.35/148.5 HDTV 1080P Frame packing

10 1920*1080 56.30 50 148.5 HDTV 1080P

Side by Side(half), Top and bottom,
Single frame sequential

11 1920*1080 67.50 60 148.5 HDTV 1080P

Side by Side(half), Top and bottom,
Single frame sequential

6.2. DTV Input

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1. 1280*720 37.500 50 74.25 HDTV 720P Side by Side, Top & Bottom

2. 1920*1080 28.125 50 74.25 HDTV 1080I Side by Side, Top & Bottom

6.3. USB Input

6.4. 3D Input mode

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1. 1920*1080 33.75 30 74.25 HDTV 1080P

Side by Side, Top & Bottom,JPS,
MPO(Photo)

No. Side by Side Top & Bottom Single Frame Sequential Frame Packing

1

- 11 -

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ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with
LD55T chassis.

2. Designation

(1) The adjustment is according to the order which is designated

and which must be followed, according to the plan

which

can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation : Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 220 V, 60 Hz
(6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),

DDC Adjustment Jig, Service remote control.
(7) Push the "IN STOP" key - For memory initialization.

3. Main PCB check process

▪ APC - After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program "Mstar ISP Utility" and then click

"Config" tab.
(2) Set as below, and then click "Auto Detect" and check "OK"

message.

If "Error" is displayed, check connection between computer,
jig, and set.

(3) Click "Read" tab, and then load download file(XXXX.bin)

by clicking "Read".

(4) Click "Connect" tab. If "Can't" is displayed, check connection

between computer, jig, and set.

(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.

* USB DOWNLOAD

(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.

- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting.

(3) Show the message "Copying files from memory".
(4) Updating is starting.

(5) Updating Completed, The TV will restart automatically in 5

seconds.

(6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If downloading version is more high than your TV have, TV

can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a DTV/
ATV test on production line.

(1)

filexxx.bin

(4)

(5)

(6)

(7)...........OK

filexxx.bin

(2)

(3)

Please Check the Speed :
To use speed between
from 200KHz to 400KHz

Case1 : Software version up

1. After downloading S/W by USB , TV set will reboot
automatically.

2. Push “In-stop” key.

3. Push “Power on” key.

4. Function inspection

5. After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push

“In-stop” key at rst.

2. Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

3. After function inspection, Push “In-stop” key.

- 12 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
(4) Completed selecting Tool option.

3.1. ADC Process(Optional)

* If ADC processes as OTP, There is no need to proceed

internal ADC.

- Enter Service Mode by pushing "ADJ" key,

- Enter Internal ADC mode by pushing "►" key at "8. ADC

Calibration".

<Caution> Using "P-ONLY" key of the Adjustment remote

control, power on TV.

* ADC Calibration Protocol (RS232)

Adjust Sequence

▪ aa 00 00 [Enter Adjust Mode]
▪ xb 00 40 [Component Input]
▪ ad 00 10 [Adjust 480i & 1080p Comp]
▪ aa 00 90 End Adjust mode

* Required equipment : Adjustment remote control.

3.2. EDID Download

▪ After enter Service Mode by pushing "ADJ" key.
▪ Enter EDID D/L menu.
▪ Enter "START" by pushing "OK" key.

<Caution> Never connect HDMI cable when EDID downloaded.

3.3. EDID data

(1) 2D HD Model HDMI EDID data

(2) Detail EDID Options are below

a. Product ID

b. Serial No: Controlled on production line.
c. Month, Year:

ex) Week : '01' -> '01'

Year : '2015' -> '19' fix

d. Model Name(Hex):

cf) TV set’s model name in EDID data is below.

e. Checksum: Changeable by total EDID data.

f. Vendor Specific(HDMI)

3.4. Function Check

- Check display and sound

■ Check Input and Signal items.

1) TV

2) AV (SCART / CVBS)

3) COMPONENT (480i)

4) HDMI
* Display and Sound check is executed by Remote control.

<Caution>
Not to push the INSTOP key after completion if the function
inspection.

No. Item CMD 1 CMD 2 Data 0

Enter Adjust
MODE

Adjust
‘Mode In’

A A 0 0

When transfer the ‘Mode In’,
Carry the command.

ADC adjust

ADC
Adjust

A D 1 0

Automatically adjustment
(The use of a internal pattern)

MODEL

Tool

Option1

Tool

Option2

Tool

Option3

Tool

Option4

Tool

Option5

Tool

Option6

SHARP 3 111 455 2752 34144 518 2320

LGD 39 455 2752 34144 1538 2320

0 1 2 3 4 5 6 7 8 9 A B C D E F
00 00 FF FF FF FF FF FF 00 1E 6D a b
10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26
20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 01 01
30 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70
40 36 00 40 84 63 00 00 1E 64 19 00 40 41 00 26 30
50 18 88 36 00 40 84 63 00 00 18 00 00 00 FD 00 3A
60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d
70 d 01 e
80 02 03 22 F1 4E 10 1F 04 93 05 14 03 02 12 20 21
90 22 15 01 26 15 07 50 09 57 07 f
A0 f 01 1D 80 18 71 1C 16 20 58 2C 25 00 A0 5A
B0 00 00 00 9E 01 1D 00 72 51 D0 1E 20 6E 28 55 00
C0 20 C2 31 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E
D0 96 00 A0 5A 00 00 00 18 02 3A 80 18 71 38 2D 40
E0 58 2C 45 00 A0 5A 00 00 00 1E 00 00 00 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option6

6. Country Group

7. Area Option

8.ADC Calibration ►

9. White Balance

10. 10 Point WB

11. Test Pattern
12 EDID D/L

13. Sub B/C

14. Ext. Input Adjust

ADC Calibration

ADC Comp 480i
ADC Comp 1080p

ADC Type ◄ ►

OK
OK

OTP

Start Reset

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option6

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L ►

13. Sub B/C

14. Ext. Input Adjust

EDID D/L

HDMI1 NG
HDMI2 NG

Start Reset

MODEL NAME HEX EDID Table DDC Function

HD/FHD Model 0001 01 00 Analog/Digital

Model name MODEL NAME(HEX)

LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)

EDID C/S data

HD

HDMI

Check sum

(Hex)

Block 0 74

Block 1

5B (HDMI1)
4B (HDMI2)

INPUT Model name(HEX)

HDMI1 67 03 0C 00 10 00 80 1E

HDMI2 67 03 0C 00 20 00 80 1E

- 13 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

4. Total Assembly line process

4.1. White Balance adjustment

▪ W/B Equipment condition

CA210 : LED → CH14, Test signal: Inner pattern(80IRE)

▪ Above 5 minutes H/run in the inner pattern. (“power on” key

of adjust remote control)

▪ If it is executed W/B adjustment in 2~3 minutes H/run, it is

adjusted by Target data.

▪ Normal line(LGD/CMI, March ~ December for Gumi, Global)

▪ Normal line(LGD/CMI, January ~ February for Gumi, Apply
not Cinema Screen)

▪ Aging chamber(LGD/CMI)

▪ Use only AUO/Sharp/CSOT(Cool temp Spec is 13000 K)

▪ W/B information

* Connecting picture of the measuring instrument

(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C P-ONLY → Enter the
mode of White-Balance, the pattern will come out.

* Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (illumination is less than 10 lux).

(2) Adhere closely the Color analyzer(CA210) to the module

less than 10 cm distance, keep it with the surface of the
Module and Color analyzer's prove vertically.(80° ~ 100°).

(3) Aging time

- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.

- Using 'no signal' or 'POWER ONLY' or the others, check

the back light on.

▪ Auto adjustment Map(using RS-232C to USB cable)

RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End

<Caution>

Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.(When R/G/B Gain are all
C0, it is the FULL Dynamic Range of Module)

Mode Temp Coordinate spec Target

Cool 13,000 K

X=0.271 (± 0.002)
Y=0.270 (± 0.002)

X=0.278
Y=0.280

Medium 9,300 K

X=0.286 (± 0.002)
Y=0.289 (± 0.002)

X=0.293

Y=0.299

Warm 6,500 K

X=0.313 (± 0.002)
Y=0.329 (± 0.002)

X=0.320

Y=0.339

Aging time

(Min)

Cool Medium Warm

x y x y x y

271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343

4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329

Aging time

(Min)

Cool Medium Warm

x y x y x y

271 270 286 289 313 329

1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346

4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329

Aging time

(Min)

Cool Medium Warm

x y x y x y

271 270 285 293 313 329
1 0-5 280 285 294 308 319 340
2 6-10 276 280 290 303 315 335
3 11-20 272 275 286 298 311 330

4 21-30 269 272 283 295 308 327
5 31-40 267 268 281 291 306 323
6 41-50 266 265 280 288 305 320
7 51-80 265 263 279 286 304 318

8 81-119 264 261 278 284 303 316

9 Over 120 264 260 278 283 303 315

Cool Medium Warm

x y x y x y

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

Model information W/B information

Model Module Panel Backlight Type Using W/B table

All All All Direct LED O

Full White Pattern

CA-210

COLOR
ANALYZER
TYPE : CA-210

RS-232C Communication

RS-232C COMMAND

[CMD ID DATA]

MIN

CENTER

(DEFAULT)

MAX

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 254

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 254

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

- 14 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

* Manual W/B process using adjust Remote control.

▪ After enter Service Mode by pushing "ADJ" key,
▪ Enter White Balance by pushing "►" key at "9. White

Balance".

* CASE Cool Mode

First adjust the coordinate far away from the target
value(x, y).B.

1) x, y > target

2) x, y < target

3) x >target, y < target

4) x < target, y > target

- Every 4 case have to fit y value by adjusting B Gain
and then fit x value by adjusting R-Gain.

- In this case, increasing/decreasing of B Gain and R
Gain can be adjusted.

How to adjust

1) In case G gain more than 172

Adjust R Gain and B Gain less than 192

2) If the G gain value be adjusted down to 172

One of the R/B Gain is 254

3) If G Gain is 172 , More than one of R/B Gain is to be

between 192~254

* CASE Medium / Warm

First adjust the coordinate far away from the target
value(x, y).

1) x, y > target

i) Decrease the R, G.

2) x, y < target

i) First decrease the B gain,
ii) Decrease the one of the others.

3) x > target, y < target

i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R

4) x < target, y > target

i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G

* After you finished all adjustments, Press "In-start" key and

compare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is not
same, then correct it same with BOM and unplug AC cable.
For correct it to the model's module from factory Jig model.

* Push the "IN STOP" key after completing the function

inspection. And Mechanical Power Switch must be set
“ON”.

4.2. 3D function test

(Pattern Generator MSHG-600, MSPG-6100[Support HDMI1.4])

* HDMI mode NO. 872 , pattern No.83
(1) Please input 3D test pattern like below.

(2) When 3D OSD appear automatically , then select OK key.

(3) Don't wear a 3D Glasses, Check the picture like below.

4.3. IR emitter inspection

(1) Start 3D pattern inspection.
(2) If IR emitter signal is correctly received to IR receiver, the

lamp of IR tester turns on.

4.4. Outgoing condition Configuration

■ When pressing IN-STOP key by SVC remocon, Red LED

are blinked alternatively. And then automatically turn off.

(Must not AC power OFF during blinking)

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option6

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 10 Point WB

11. Test Pattern
12 EDID D/L

13. Sub B/C

14. Ext. Input Adjust

Whit Balance

Color Temp. ◄ ►
R-Gain
G-Gain
B-Gain
R-Cut
G-Cut
B-Cut
Test-Pattern
Backlight
Reset To Set

Cool

172
172
192

64
64

64
ON
100

- 15 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

5. HI-POT Test

5.1. HI-POT auto-check preparation

- Check the POWER cable and SIGNAL cable insertion condition

5.2. HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next proc­ess automatically.

5.3. Checkpoint

(1) Test voltage

- Touchable Metal : 3 KV / min at 100 mA

- SIGNAL : 3KV / min at 100 mA

(2) TEST time: 1 second. (case : mass production )
(3) TEST POINT

- Touchable Metal => LIVE & NEUTRAL : Touchable Metal.

- SIGNAL => LIVE & NEUTRAL : SIGNAL.

6. Model name & Serial number D/L

▪ Press "Power on" key of service remote control.

(Baud rate : 115200 bps)

▪ Connect RS232 Signal Cable to USB Jack.
▪ Write Serial number
▪ Must check the serial number at the Diagnostics of SET UP menu.

(Refer to below).

6.1. Signal Table

CMD : A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 +...+ Data_n
Delay : 20ms

6.2. Command Set

* Description

FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write : Model Name and Serial Number write in EEPROM,.

6.3. Method & notice

(1) Serial number D/L is using of scan equipment.
(2) Setting of scan equipment operated by Manufacturing

Technology Group.

(3) Serial number D/L must be conformed when it is produced in

production line, because serial number D/L is mandatory by
D-book 4.0.

* Manual Download(Model Name and Serial Number)

If the TV set is downloaded by OTA or Service man, sometimes
model name or serial number is initialized.(Not always)
There is impossible to download by bar code scan, so It need
Manual download.

1) Press the "Instart" key of Adjustment remote control.

2) Go to the menu "6.Model Number D/L" like below photo.

3) Input the Factory model name or Serial number like photo.

4) Check the model name Instart menu. → Factory name displayed.
ex 47LF560V-ZA)

5) Check the Diagnostics.(DTV country only) → Buyer model

displayed.(ex

47LF560V-ZA

)

CMD LENGTH ADH ADL DATA_1 . . . Data_n CS DELAY

Adjust mode CMD(hex) LENGTH(hex) Description

EEPROM WRITE A0h 84h+n n-bytes Write (n = 1~16)

- 16 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

7. MAC Address & CI+ key download

7.1. MAC Address

7.1.1. Equipment & Condition

▪ Play file : Serial.exe
▪ MAC Address edit
▪ Input Start / End MAC address

7.1.2. Download method

(1) Communication Prot connection

Connection: PCBA(USB Port) → USB to Serial Adapter(UC-

232A) → RS-232C cable → PC(RS-232C port)

* Caution: LJ21* chassis support only UC-232A driver. (only

use this one.)

(2) MAC Address & CI+ Key Download

▪ Set CI+ Key path Directory at Start Mac & CI+ Download

Programme

▪ Com 1,2,3,4 and 115200(Baudrate)

▪ Port connection button click(1)
▪ Push the (2) MAC Address write.
▪ At success Download, check the OK (3)
▪ Start CI+ Key Download, Push the (4)
▪ Check the OK or NG

7.2. LAN Inspection

7.2.1. Equipment & Condition

▪ Each other connection to LAN Port of IP Hub and Jig

7.2.2. LAN inspection solution

▪ LAN Port connection with PCB
▪ Network setting at MENU Mode of TV
▪ Setting automatic IP
▪ Setting state confirmation

-> If automatic setting is finished, you confirm IP and MAC

Address.

7.3. LAN PORT INSPECTION(PING TEST)

Connect SET -> LAN port == PC -> LAN Port

7.3.1. Equipment setting

(1) Play the LAN Port Test PROGRAM.
(2) Input IP set up for an inspection to Test Program.

*IP Number : 12.12.2.2

7.3.2. LAN PORT inspection (PING TEST)

(1) Play the LAN Port Test Program.
(2) Connect each other LAN Port Jack.
(3) Play Test (F9) button and confirm OK Message.
(4) Remove LAN cable.

GP4_LOW

SET PC

- 17 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

BLOCK DIAGRAM

1. CIS T2/C/S2 3D Model

Main SOC

M1A-LGE2133

(IC101, DDR3 128MB)

(P1801)

30P HD LVDS wafer

51P FHD LVDS wafer

(P1800)

COMP2_Y+/Pb+/Pr+/L_R_IN or AV_CVBS_IN/L_R_IN

CK+/-, D0+/ -, D1+/-, D2+/-_HDMI2

DDC_SCL/SDA_2, HDMI_CEC

Serial Flash

(IC1300, 8Mbit)

SPI_SCK/SDI/SDO/CS

System EEPROM

(IC104, 256Kbit)

I2C_SCL/SDA

RXA0+/-~RXA4+/-, RXACK+/ -

RXB0+/-~RXB4+/-, RXBCK+/ -

SPK_R

SPK_L

AMP_SCL/SDA

AUD_MASTER_CLK,

AUD_LRCH,

AUD_LRCK, AUD_SCK

TAS5733

(IC5600)

Connector

(P4600)

Jog KEY, LED_R, IR

HDMI1

(JK800)

SPDIF_OUT

SPDIF(Optic)

(JK1001)

except LF54

USB

(JK700)

HDMI2

(JK801)

CK+/-, D0+/ -, D1+/-, D2+/-,_HDMI4

DM/DP

USB1_OCP/CTL

SN1406035RGER

+5V_USB

HP_L/ROUT

Headphone

(JK3000)

Only LF62/57/56

DDR3 SDRAM

(IC1201, 128MB)

B-MDQL[0 -7], B-MDQU[0 -7],…

NAND FLASH

IC102 (1Gbit)

H27U1G8F2CTR -BC

PCM_A[0:7]

T4LCX244FT Buffer

TS_DATA[0:7]

PCM_DATA[0:7]

COMPONENT

(JK2802)

PCM_A[8:14]

X-tal

24MHZ

TU_SCL / SDA

Tuner

(TU3701)

F/NIM

DEMOD_SCL/SDA

IF_N/P

IF_AGC

FE_TS_DATA[0:7]

LNB_TX

LNB_OUT, DEMOD_RESET

CI SLOT

(P1900)

OCP

DDC_SCL/SDA_4, HDMI_CEC

REAR

SIDE

- 18 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

2. CIS T2/C/S2 2D Model

Main SOC

M1A-LGE2134

(IC101, DDR3 256MB)

(P1801)

30P HD LVDS wafer

51P FHD LVDS wafer

(P1800)

COMP2_Y+/Pb+/Pr+/L_R_IN or AV_CVBS_IN/L_R_IN

CK+/-, D0+/ -, D1+/-, D2+/-_HDMI2

DDC_SCL/SDA_2, HDMI_CEC

Serial Flash

(IC1300, 8Mbit)

SPI_SCK/SDI/SDO/CS

System EEPROM

(IC104, 256Kbit)

I2C_SCL/SDA

RXA0+/-~RXA4+/ -, RXACK+/ -

RXB0+/-~RXB4+/ -, RXBCK+/ -

SPK_R

SPK_L

AMP_SCL/SDA

AUD_MASTER_CLK,

AUD_LRCH,

AUD_LRCK, AUD_SCK

TAS5733

(IC5600)

Connector

(P4600)

Jog KEY, LED_R, IR

HDMI1

(JK800)

SPDIF_OUT

SPDIF(Optic)

(JK1001)

except LF54

USB

(JK700)

HDMI2

(JK801)

CK+/-, D0+/ -, D1+/-, D2+/-,_HDMI4

DM/DP

USB1_OCP/CTL

SN1406035RGER

+5V_USB

HP_L/ROUT

Headphone

(JK3000)

Only LF62/57/56

NAND FLASH

IC102 (1Gbit)

H27U1G8F2CTR -BC

PCM_A[0:7]

T4LCX244FT Buffer

TS_DATA[0:7]

PCM_DATA[0:7]

COMPONENT

(JK2802)

PCM_A[8:14]

X-tal

24MHZ

TU_SCL / SDA

Tuner

(TU3701)

F/NIM

DEMOD_SCL/SDA

IF_N/P

IF_AGC

FE_TS_DATA[0:7]

LNB_TX

LNB_OUT, DEMOD_RESET

CI SLOT

(P1900)

OCP

DDC_SCL/SDA_4, HDMI_CEC

REAR

SIDE

- 19 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

3. EU T2/C/S2 2D Model

Main SOC

M1A-LGE2134

(IC101, DDR3 256MB)

(P1801)

30P HD LVDS wafer

51P FHD LVDS wafer

(P1800)

COMP2_Y+/Pb+/Pr+/L_R_IN or AV_CVBS_IN/L_R_IN

CK+/-, D0+/ -, D1+/-, D2+/-_HDMI2

DDC_SCL/SDA_2, HDMI_CEC

Serial Flash

(IC1300, 8Mbit)

SPI_SCK/SDI/SDO/CS

System EEPROM

(IC104, 256Kbit)

I2C_SCL/SDA

RXA0+/-~RXA4+/-, RXACK+/ -

RXB0+/-~RXB4+/-, RXBCK+/ -

SPK_R

SPK_L

AMP_SCL/SDA

AUD_MASTER_CLK,

AUD_LRCH,

AUD_LRCK, AUD_SCK

TAS5733

(IC5600)

Connector

(P4600)

HDMI1

(JK800)

F-SCART

(JK2801)

SPDIF_OUT

SPDIF(Optic)

(JK1001)

except LF54

USB

(JK700)

HDMI2

(JK801)

CK+/-, D0+/ -, D1+/-, D2+/-,_HDMI4

DM/DP

USB1_OCP/CTL

SN1406035RGER

+5V_USB

HP_L/ROUT

Headphone

(JK3000)

Only LF62/57/56

NAND FLASH

IC102 (1Gbit)

H27U1G8F2CTR -BC

PCM_A[0:7]

T4LCX244FT Buffer

TS_DATA[0:7]

PCM_DATA[0:7]

EPHY_TP/TN/RP/RN

LAN

(JK2100)

Only UK

COMPONENT

(JK2802)

PCM_A[8:14]

X-tal

24MHZ

SC1/AV2_CVBS_IN, SC1_R+/G+/B+

DTV/MNT_OUT, DTV/MNT_L/R_OUT

TU_SCL / SDA

Tuner

(TU3701)

F/NIM

DEMOD_SCL/SDA

IF_N/P

IF_AGC

FE_TS_DATA[0:7]

LNB_TX

LNB_OUT, DEMOD_RESET

CI SLOT

(P1900)

OCP

DDC_SCL/SDA_4, HDMI_CEC

REAR

SIDE

Jog KEY, LED_R, IR

- 20 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

4. EU T/C 2D Model

Main SOC

M1A-LGE2134

(IC101, DDR3 256MB)

(P1801)

30P HD LVDS wafer

51P FHD LVDS wafer

(P1800)

COMP2_Y+/Pb+/Pr+/L_R_IN or AV_CVBS_IN/L_R_IN

CK+/-, D0+/ -, D1+/-, D2+/-_HDMI2

DDC_SCL/SDA_2, HDMI_CEC

Serial Flash

(IC1300, 8Mbit)

SPI_SCK/SDI/SDO/CS

System EEPROM

(IC104, 256Kbit)

I2C_SCL/SDA

RXA0+/-~RXA4+/-, RXACK+/ -

RXB0+/-~RXB4+/-, RXBCK+/ -

SPK_R

SPK_L

AMP_SCL/SDA

AUD_MASTER_CLK,

AUD_LRCH,

AUD_LRCK, AUD_SCK

TAS5733

(IC5600)

Connector

(P4600)

HDMI1

(JK4200)

F-SCART

(JK2801)

SPDIF_OUT

SPDIF(Optic)

(JK1001)

except LF54

USB

(JK700)

HDMI2

(JK4201)

CK+/-, D0+/ -, D1+/-, D2+/-,_HDMI4

DM/DP

USB1_OCP/CTL

SN1406035RGER

+5V_USB

HP_L/ROUT

Headphone

(JK3000)

Only LF62/57/56

NAND FLASH

IC102 (1Gbit)

H27U1G8F2CTR -BC

PCM_A[0:7]

T4LCX244FT Buffer

TS_DATA[0:7]

PCM_DATA[0:7]

COMPONENT

(JK2802)

PCM_A[8:14]

X-tal

24MHZ

SC1/AV2_CVBS_IN, SC1_R+/G+/B+

DTV/MNT_OUT, DTV/MNT_L/R_OUT

TU_SCL / SDA

Tuner

(TU2600)

H/NIM

IF_N/P

IF_AGC

FE_TS_DATA[0:7]

CI SLOT

(P1900)

OCP

DDC_SCL/SDA_4, HDMI_CEC

REAR

SIDE

Jog KEY, LED_R, IR

- 21 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

400

121

501

502

500

900

A2

A10

Set + Stand

120

200

530

540

521

410

LV1

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

THERMAL

THERMAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

POWER

140826

4

L14_CA

Q403
MMBT3904(NXP)

TR_NXP

E

B

C

PANEL_VCC

Q400
MMBT3904(NXP)

TR_NXP

E

B

C

R401

10K
OPT

R442
10K

Q404
MMBT3904(NXP)

TR_NXP

E

B

C

R441
10K

+3.5V_ST

R448

2.2K

R444
10K

+13.2V

R400

10K

+3.5V_ST

R435
100K

L410

BLM18PG121SN1D

POWER_ON/OFF_1

POWER_DET

RL_ON

+3.3V_Normal

+13.2V

C429

0.1uF
16V

PANEL_CTL

R443
10K

R406

10K

+3.5V_ST

POWER_DET_RESET

C425

0.1uF
25V

OPT

C422

0.1uF
16V

R451

5.6K

R404

4.7K

R402

10K

R452

5.6K

R412

33K

OPT

Q401

MMBT3906(NXP)

TR_NXP

1

2

3

R454

100

C430
22uF
10V

C428

2.2uF
10V

ZD402

5V

TVS_SEMTECH

L408

UBW2012-121F

120OHM

L409

BLM18PG121SN1D

+3.3V_Normal

L411

CB2012PK501T

10uF

C426

10V

+1.5V_DDR

10uF

C431

10V

ZD403

2.5V

ZD404

5V

TVS_SEMTECH

R447
22K

R449
1K
1/16W
1%

R450
200
1/16W
1%

IC404

AZ1117EH-ADJTRG1

ADJ/GND

OUTIN

R453

0

L412

BLM18PG121SN1D

R471

22K

1/16W

1%

C441
1uF
10V

R470
10K

R469

68K

1/16W

1%

C443

0.1uF
16V

C440

100pF

50V

ZD405

5V

TVS_SEMTECH

+3.5V_ST

+13.2V

C439

0.1uF
25V

C442

2200pF

50V

C415

0.1uF
25V

R419

100
R426
10K

L403

MLB-201209-0120P-N2

R420

1K

Q402
MMBT3904(NXP)

TR_NXP

E

B

C

A13.2V

+3.3V_Normal

L414

OPT

+13.2V

R425

10K

INV_CTL

+3.5V_ST

PWM1

R467

1K

OPT

R424

3.9K

PWM_DIM

C402

0.1uF
25V

L415

MLB-201209-0120P-N2

C438
10uF
25V

C433

4.7uF
50V

OPT

Q405

SSM3J332R

S

G

D

Q406
SSM3J332R

FET_TOSHIBA

S

G

D

+3.5V_ST

R438

4.7K

OPT

C423
22uF
16V

C432

1uF
16V

C403

4700pF

50V

OPT

+5V_Normal

+5V_USB

USB1_CTL

USB1_OCD

R422
15K

C418

47pF
50V

C404

4700pF

50V

OPT

+5V_Normal

ZD401

2.5V

+1.10V_VDDC

C408

2200pF

50V

OPT

C417

3300pF

50V

C405
10uF
25V

C421

0.047uF
25V

L404

CB2012PK501T

C409

2200pF

50V

OPT

C416

22pF

50V

C411
82pF
50V

OPT

C424
22uF
16V

+13.2V

R403
10K

C419

22pF

50V

C412
10uF

6.3V

OPT

C406
10uF
25V

+3.3V_Normal

C410

0.047uF

25V

+3.3V_Normal

C420

3300pF

50V

R408
100K

C407
1uF
10V

R407

4.7K

OPT

R409

91K

+5V_Normal

L413
2uH

L405

4.7uH

L406

4.7uH

ZD402-*1

TVS_KEC

ZD404-*1

TVS_KEC

ZD405-*1

TVS_KEC

IC401

KIC7529M2

RESET_IC_KEC

1

GND

2

OUT

3

VCC

Q401-*1

2N3906S-RTK

TR_KEC

EBC

Q400-*1
2N3904S

TR_KEC

E

B

C

Q402-*1
2N3904S

TR_KEC

E

B

C

Q403-*1
2N3904S

TR_KEC

E

B

C

Q404-*1
2N3904S

TR_KEC

E

B

C

C446

0.1uF
25V

+3.3V_Normal

R405
10K

R418

20K

R414

10K

C444
22uF

10V

C445
22uF
10V

C413
22uF

10V

C414
22uF

10V

ZD406

5.1v

OPT

ZD407

5.1v

OPT

R468

6.8K

1/16W

1%

R445

33K

R446
120K

Q406-*1

AO3435

FET_AOS

G

D

S

C427

0.22uF
25V

NON_60_SHARP

IC401-*1

APX803E29

RESET_IC_DIODES

1

GND

2

RESET

3

VCC

R411

4.7K
1%

R413

5.1K
1%

SN1406035RGER

IC400

1

SS2

3

EN2

7

SW_OUT

9

VIN2

10

PGND2

11

LX2

12

BST2

13

COMP2

14

FB2

15

RSET

16

AGND

17

FB1

18

COMP1

19

BST120LX121PGND122VIN123V7V24SS1

5

SW_EN

8

SW_IN

6

NFAULT

4

ROSC/SYNC

2

EN1

25

[EP]

P401

SMAW200-H12S5K(BK)(LTR)

9

GND

4

D13.2V

8

A13.2V

3

GND

12

PDIM#1

7

A13.2V

2

PDIM#2

11

DRV_ON

6

D13.2V

1

PWR_ON

10

GND

5

D13.2V

13

R417

39K

1%

R416

5.1K
1%

R415

0

5%

IC405

BD9D321EFJ

3

VREG

2

FB

4

SS

1

EN

5

GND

6

SW

7

BOOT

8

VIN

9

[EP]

R472

3.3K

USB1_CTL_Pull_Down

R430

14K

1%

R431

5.6K
1%

C427-*1

0.1uF
50V

60_SHARP

R473
30K

OPT

R474
30K

OPT

R475
30K

OPT

+13.2V to PANEL_VCC +3.5V_ST to +3.3V_Normal

+3.5V_Normal to +1.5V_DDR

+13.2V POWER_DET

FROM POWER B/D 13.2V

POWER

R2

R1

1.3A

Vout=1.25*(1+R2/R1)+Iadj*R2

+13.2V to +3.5V_STANDBY

R2

Vout=0.765*(1+R1/R2)

R1

3A

Vout=0.6(R1/R2)+0.6

+5V_Normal & +1.10V_VDDC

R2

R1

Vout=0.6(R1/R2)+0.6

R1

R2

Check the pull down
when AC Power On with HDD

Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

USB D OWN STRE AM

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

2014/05/20

USB_S1

7

L14_CA_M1A

JK700

3AU04 S-305-ZC -(LG)

1234

5

D700
RCLAMP0502BA

OPT

SIDE_USB1_DM

SIDE_USB1_DP

C700
22uF
10V

USB_HDD_CAP1_22uF

ZD700

5V

OPT

SD05

C701

5pF
50V

OPT

C702

5pF
50V

OPT

C703
22uF
10V

USB_HDD_CAP2_22uF

+5V_USB

C704
22uF
10V

OPT

C700-*1

10uF

10V

USB_HDD_CAP1_10uF

C703-*1

10uF
10V

USB_HDD_CAP2_10uF

R700

2.2

R701

2.2

USB (SIDE)

Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

140813

HDMI_R1S1 8

L15_M1A

VA804

ESD_HDMI1

R803

1K

HDMI_ARC

VA805

ESD_HDMI2

D1+_HDMI2

CEC_REMOTE_S7

+3.5V_ST

VA800

ESD_HDMI1_VARISTOR

VA808

ESD_HDMI2

R809
10K

D2-_HDMI2

VA802

ESD_HDMI1

R807

2.7K

CK-_HDMI4

CK-_HDMI2

R804
100

VA801

ESD_HDMI1_VARISTOR

R816 100

HDMI-2

R810 100

DDC_SCL_2

R812

1.8K

HDMI-2

DDC_SCL_2

JK800

EAG59023302

14

NC

13

CE_REMOTE

5

D1_GND

20

SHIELDGND

12

CK-

11

CK_GND

2

D2_GND

19

HP_DET

18

5V

10

CK+

4

D1+

1

D2+

17

GND

9

D0-

8

D0_GND

3

D2-

16

DDC_DATA

7

D0+

6

D1-

15

DDC_CLK

D0+_HDMI2

R811 100

VA803

ESD_HDMI1

DDC_SDA_2

5V_HDMI_2

R800

2.7K

HPD4

5V_HDMI_4

CK+_HDMI4

VA809

ESD_HDMI2

VA800-*1
1uF
10V

ESD_HDMI1_CAP

+5V_Normal

R805

3.3K

DDC_SCL_4

VA801-*1
1uF
10V

ESD_HDMI1_CAP

R814

33

HDMI-2

D1-_HDMI4

DDC_SDA_4

5V_DET_HDMI_4

5V_HDMI_4

D1-_HDMI2

HDMI_CEC

CK+_HDMI2

R806

2.7K

R817
300K

HDMI-2_MHL

5V_DET_HDMI_2

DDC_SDA_4

+5V_Normal

DDC_SCL_4

HPD2

HDMI_CEC

Q800

MMBT3904(NXP)

TR_NXP

E

B

C

R801

2.7K

D0-_HDMI2

VA811

ESD_HDMI2

D0-_HDMI4

MHL_CD_SENSE

5V_HDMI_2

R813

3.3K

HDMI-2

VA810

ESD_HDMI2

D2+_HDMI4

VA807

OPT

5.6V

DDC_SDA_2

D1+_HDMI4

R815 100

HDMI-2

C800

0.047uF
25V

HDMI-2_MHL

D2-_HDMI4

R802

1.8K

D2+_HDMI2

R808
10K

HDMI_CEC

D0+_HDMI4

VA806

ESD_HDMI2

JK801

EAG62611204

HDMI-2

14

NC

13

CE_REMOTE

5

D1_GND

20

GND

12

CK-

11

CK_GND

2

D2_GND

19

HP_DET

18

5V

10

CK+

4

D1+

1

D2+

17

GND

9

D0-

8

D0_GND

3

D2-

16

DDC_DATA

7

D0+

6

D1-

15

DDC_CLK

JK801-*1
DAADR019A

HDMI-2_EMI_FOOSUNG

14

RESERVED

13

CEC

5

TMDS_DATA1_SHIELD

20

BODY_SHIELD

12

TMDS_CLK-

11

TMDS_CLK_SHIELD

2

TMDS_DATA2_SHIELD

19

HOT_PLUG_DETECT

18

VDD[+5V]

10

TMDS_CLK+

4

TMDS_DATA1+

1

TMDS_DATA2+

17

DDC/CEC_GND

9

TMDS_DATA0-

8

TMDS_DATA0_SHIELD

3

TMDS_DATA2-

16

SDA

7

TMDS_DATA0+

6

TMDS_DATA1-

15

SCL

D803

IP4294CZ10-TBR

ESD_HDMI1_TMDS

1

8

2

7

3

6

4
5

9

10

D804

IP4294CZ10-TBR

ESD_HDMI1_TMDS

1

8

2

7

3

6

4
5

9

10

D805

IP4294CZ10-TBR

ESD_HDMI2_TMDS

1

8

2

7

3

6

4
5

9

10

D806

IP4294CZ10-TBR

ESD_HDMI2_TMDS

1

8

2

7

3

6

4
5

9

10

AR802

5.1

D801

KDS184

HDMI_DIODE_KEC

A2CA1

D800

KDS184

HDMI_DIODE_KEC

A2CA1

D802

KDS184

HDMI_DIODE_KEC

A2CA1

D800-*1

MMBD6100

HDMI_DIODE_SUZHOU

A2CA1

D801-*1

MMBD6100

HDMI_DIODE_SUZHOU

A2CA1

D802-*1
MMBD6100

HDMI_DIODE_SUZHOU

A2CA1

Q800-*1
2N3904S

TR_KEC

E

B

C

R818

0

HDMI-2_MHL

R819

0

HDMI-2_MHL_Non

R817-*1

3.3K

HDMI-2_MHL_Non

AR801

5.1

AR804

5.1

AR803

5.1

HDMI (REAR 1 / SIDE 1 MHL)

HDMI_2 MHL

HDMI_1

CEC

MHL Spec

HDMI jack burnt problem improvement

This GND Pattern should be very narrow

HDMI jack burnt problem improvement

This GND Pattern should be very narrow







Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only