LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
Page 4
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Application range
This spec sheet is applied all of the 37”, 42”, 47” LCD TV with
LA01Z chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25±5ºC, (77°±9ºF), CST: 40±5°C
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
ModelMarketAppliance
37LD450C-UA North America Safety : UL1492, CSA C22.2.No.1,
42LD450C-UA EMC : FCC Class B, IEC Class B
47LD450C-UA
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 9 -
ADJUSTMENT INSTRUCTION
1. Application range
This spec. sheet applies to LA01Z Chassis applied LCD TV all
models manufactured in TV factory
2. Specification
2.1 Because this is not a hot chassis, it is not necessary
to use an isolation transformer. However, the use of
isolation transformer will help protect test instrument.
2.2 AdjThe adjustment must be performed in the
circumstance of 25 ±5 C of temperature and
65±10% of relative humidity if there is no specific
designation.
2.4 The input voltage of the receiver must keep
100~240V, 50/60Hz.
2.5 The receiver must be operated for about 5 minutes
prior to the adjustment when module is in the
circumstance of over 15
In case of keeping module is in the circumstance of
0°C, it should be placed in the circumstance of above
15°C for 2 hours
In case of keeping module is in the circumstance of
below -20°C, it should be placed in the circumstance of
above 15°C for 3 hours,.
Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
3. Adjustment items
3.1 Board Level Adjustment
•Adjust 480i Comp1(ADC)
•EDID/DDC download
Above adjustment items can be also performed in Final
Assembly if needed. Both Board-level and Final assembly
adjustment items can be check using In-Star Menu 1.ADJUST
CHECK. Component 1080p and RGB-PC Adjust will be
calculated by 480i adjust value.
3.2 Final assembly adjustment
•White Balance adjustment
•RS-232C functionality check
•Factory Option setting per destination
•Ship-out mode setting (In-Stop)
3.3 Etc
•Ship-out mode
•Service Option Default
•USB Download(S/W Update, Option, Service only)
•ISP Download (Optional)
4. Automatic Adjustment
4.1. ADC Adjustment
(1) Overview
ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate
RGB deviation.
1) Check connected condition of Comp1 cable to the
equipment
2) Give a 480i Mode, Horizontal 100% Color Bar Pattern
to Comp1.
(MSPG-925FA -> Model: 209, Pattern: 65)
3) Change input mode as Component1 and picture mode
as “Standard”
4) Press the In-start Key on the ADJ remote after at least
1 min of signal reception. Then, select 5.ADC
Calibration. And Press OK Button on the menu “Start”.
The adjustment will start automatically.
5) If ADC Comp 480i is successful, “ADC Component
Success” is displayed and Comp480i/1080p is
completed.
If ADC calibration is failure, “ADC Component Fail” is
displayed.
6) If ADC calibration is failure, after rechecking ADC
pattern or condition, retry calibration
7) After completing ADC Component, input mode will be
changed to RGB automatically.
8) If ADC calibration is successful, “ADC RGB Success”
is displayed. If ADC calibration is failure, “ADC RGB
Fail” is displayed.
9) If ADC calibration is failure, after recheck ADC pattern
or condition, retry calibration
5.2 EDID/DDC Download
(1) Overview
It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
(2) Equipment
• Adjust remocon.
• Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
(3) Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If
Download is failure, NG is displayed.
5) If Download is failure, Re-try downloads.
•Caution) When EDID Download, must remove RGB/HDMI
Cable.
(4) EDID DATA
1)LD450 Tool(FHD)
• HDMI 1 EDID Table
• HDMI 2 EDID Table
Page 11
- 11 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
• HDMI 3 EDID Table
• HDMI 4 EDID Table
• Analog RGB EDID Table
5.3. White Balance Adjustment
(1) Overview
• W/B adj. Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic
Range. In order to prevent saturation of
Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is
lowered to find the desired value.
- Adj. condition : normal temperature
1) Surrounding Temperature: 25±5ºC
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
(2) Equipment
1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model:217, Pattern:78)
-> Only when internal pattern is not available
• Color Analyzer Matrix should be calibrated using CS-1000
(3) Equipment connection MAP
(4) Adj. Command (Protocol)
1) RS-232C Command used during auto-adj.
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.
wb 00 ff -> End white balance auto adj.
Colo r Analyzer
Comp ut er
Pattern Ge n e r ator
RS-232C
RS-232C
RS-232C
Probe
Signal Source
* If TV internal pattern is used, not needed
Connection Diagram of Automatic Adjustment
RS-232C COMMAND
Meaning
[CMDIDDATA]
wb0000Begin White Balance adj.
wb00ffEnd White Balance adj.(Internal pattern disappeared)
Page 12
- 12 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
2) Adjustment Map
Applied Model : 37LD450C-UA, 42LD450C-UA,
47LD450C-UA
(5) Adj. method
• Auto adj. method
1) Set TV in adj. mode using POWER ON key
2) Zero calibrate probe then place it on the center of the
Display
3) Connect Cable(RS-232C)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sing), check adj. status pre
mode (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
* W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if
need
• Manual adj. method
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place
it on the center of LCD module within 10cm of the
surface..
3) Press ADJ key -> EZ adjust using adj. R/C > 6. WhiteBalance then press the cursor to the right (KEY
G).
(When KEY(
G) is pressed 216 Gray internal pattern
will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at
192, and the rest will be lowered to meet the desired
value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes
of color temperature.
- If internal pattern is not available, use RF input. In EZ
Adj. menu 6.White Balance, you can select one of 2
Test-pattern: ON, OFF. Default is inner(ON). By
selecting OFF, you can adjust using RF signal in 216
Gray pattern.
* Adj. condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
- LCD: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module
surface (80°~ 100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked
using no signal or Full-white pattern.
(6) Reference (White Balance Adj. coordinate and color
temperature)
• Luminance: 216 Gray
• Standard color coordinate and temperature using CS-
1000
• Standard color coordinate and temperature using CA-210
ITEMCommandData RangeDefault
(Hex.)(Decimal)
Cmd 1Cmd 2MinMax
CoolR-Gainjg00C0
G-Gainjh00C0
B-Gainji00C0
R-Cut
G-Cut
B-Cut
Medium R-Gainja00C0
G-Gainjb00C0
B-Gainjc00C0
R-Cut
G-Cut
B-Cut
WarmR-Gainjd00C0
G-Gainje00C0
B-Gainjf00C0
R-Cut
G-Cut
ModeColor CoordinationTemp∆UV
xy
COOL0.2690.27313000K0.0000
MEDIUM0.2850.2939300K0.0000
WARM0.3130.3296500K0.0000
ModeColor CoordinationTemp∆UV
xy
COOL0.269±0.0020.273±0.00213000K0.0000
MEDIUM0.285±0.0020.293±0.0029300K0.0000
WARM0.313+0.0020.329±0.0026500K0.0000
Page 13
- 13 -
5.4. HDCP SETTING
- HDCP setting is not necessary in Saturn5 model.
5.5 Option selection per country
(1) Overview
- Option selection is only done for models in Non-USA
North America due to rating
- Applied model: LA92A Chassis applied None USA
model(CANADA, MEXICO)
(2) Method
1) Press ADJ key on the Adj. R/C, then select Country
Group Menu
2) Depending on destination, select KR or US, then on the
lower Country option, select US, CA, MX. Selection is
done using +, - KEY
5.6. Tool Option selection
• Method: Press Adj. key on the Adj. R/C, then select Tool
option.
5.7. Ship-out mode check (In-stop)
• After final inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode.
• After final inspection, Always turn on the Mechanical S/W.
6. GND and Internal Pressure check
6.1. Method
1) GND & Internal Pressure auto-check preparation
- Check that Power Cord is fully inserted to the SET.
(If loose, re-insert)
2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V
arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
6.2. Checkpoint
• TEST voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
• TEST time: 1 second
• TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &
NEUTRAL
• LEAKAGE CURRENT: At 0.5mArms
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 14 -
7. USB S/W Download (option)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work.
But your downloaded version is High, USB data is
automatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote controller.
2) Select "Tool Option 1" and Push “OK” button.
3) Punch in the number. (Each model has their number.)
Page 15
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
300
200
530
810
400
510
120
500
A7
A2
A10
A21
900
910
800
LV1
LV2
540
521
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Page 16
PStoPDF trial version. http://www.oakdoc.com
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30K
1%
TCON_47_FHD_60_LAMP
R622-*4
11K
1%
TCON_47_FHD_60_LAMP
R602-*1
1K
1%
TCON_32_FHD
R621-*4
220K
1%
TCON_47_FHD_60_LAMP
VGL
R637-*4
51K
1%
TCON_47_FHD_60_LAMP
R643-*4
270K
1%
TCON_47_FHD_60_LAMP
47_FHD
R620-*2
47K
1%
TCON_37_FHD
R622-*2
12K
1%
TCON_37_FHD
R635-*2
910K
1%
TCON_37_FHD
R636-*2
56K
1%
TCON_37_FHD
R601-*2
1K
1%
TCON_37_FHD
R652-*2
1.5K
5%
TCON_37_FHD
VGH
R620-*5
51K
1%
TCON_47_FHD
R622-*5
11K
1%
TCON_47_FHD
R621-*2
220K
1%
TCON_37_FHD
R640-*2
470K
1%
TCON_37_FHD
R641-*2
56K
1%
TCON_37_FHD
R602-*2
1K
1%
TCON_37_FHD
(Without 60Hz Lamp)
R621-*5
220K
1%
TCON_47_FHD
TCON_37_FHD
TCON_37_FHD
HVDD
TCON_37_FHD
TCON_37_FHD
VGL
R637-*2
20K
1%
R643-*2
150K
1%
R609-*2
470K
1%
R610-*2
91K
1%
R637-*5
51K
1%
TCON_47_FHD
R643-*5
270K
1%
TCON_47_FHD
R611 OPEN
42_FHD_60_LAMP
VGH
SHEET7
VDD
SHEET7
VCOM FEED BACK
R601 OPEN
R652-*4
1K
1%
TCON_42_FHD_60_LAMP
R602-*4
1K
1%
TCON_42_FHD_60_LAMP
55_FHD
VGH
R620-*6
510K
1%
TCON_55_FHD
R622-*6
27K
1%
TCON_55_FHD
R621-*6
68K
1%
TCON_55_FHD
VGL
SHEET7
HVDD
SHEET7
VGL
R637-*6
27K
1%
TCON_55_FHD
R643-*6
150K
1%
TCON_55_FHD
42_FHD
VGH
R620-*3
56K
1%
TCON_42_FHD
R622-*3
11K
1%
TCON_42_FHD
VDD
R635-*3
150K
1%
TCON_42_FHD
R636-*3
75K
1%
TCON_42_FHD
VCOM FEED BACK
R601 OPEN
R652-*3
1K
1%
TCON_42_FHD
(Without 60Hz Lamp)
R621-*3
220K
1%
TCON_42_FHD
R640 OPEN
R641-*3
15K
1%
TCON_42_FHD
R602-*3
1K
1%
TCON_42_FHD
VGL
R637-*3
27K
1%
TCON_42_FHD
R643-*3
150K
1%
TCON_42_FHD
HVDD
R609-*3
510K
1%
TCON_42_FHD
R610-*3
150K
1%
TCON_42_FHD
R611-*3
200K
1%
TCON_42_FHD
VDD
R635-*4
180K
1%
TCON_47_FHD_60_LAMP
R636-*4
68K
1%
TCON_47_FHD_60_LAMP
VCOM FEED BACK
SHEET7
R640 OPEN
R641-*4
20K
1%
TCON_47_FHD_60_LAMP
HVDD
R609-*4
510K
1%
TCON_47_FHD_60_LAMP
R610-*4
150K
1%
TCON_47_FHD_60_LAMP
R611-*4
220K
1%
TCON_47_FHD_60_LAMP
VDD
R635-*5
180K
1%
TCON_47_FHD
R636-*5
75K
1%
TCON_47_FHD
VCOM FEED BACK
R601-*5
1K
1%
TCON_47_FHD
R652-*5
1K
1%
TCON_47_FHD
R640 OPEN
R641-*5
20K
1%
TCON_47_FHD
R602-*5
1K
1%
TCON_47_FHD
HVDD
TCON_47_FHD
TCON_47_FHD
R609-*5
510K
1%
R610-*5
150K
1%
R611-*5
220K
1%
TCON_47_FHD
R635-*6
150K
1%
TCON_55_FHD
R636-*6
75K
1%
TCON_55_FHD
R640 OPEN
R641-*6
15K
1%
TCON_55_FHD
VCOM FEED BACK
R601 OPENR602 OPEN
R652-*6
0
5%
TCON_55_FHD
HVDDVDD
R609-*6
180K
1%
TCON_55_FHD
R610-*6
68K
1%
TCON_55_FHD
R611-*6
56K
1%
TCON_55_FHD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
ISDB_DEMOD
MSTAR DEMOD
R3002
0
IF_AGC_MAIN
TP3002
IF_AGC_SEL
GP2_Saturn7M
13ISDB DEMOD
Page 19
PStoPDF trial version. http://www.oakdoc.com
LGIT CAN H/N TUNER for US
NTSC_1INPUT_H_LGIT
TU5001
TDVJ-H001F
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
R5002
0
RF_S/W_OPT
R5001
0
RF_AGC_OPT
R5003
0
+1.2V/+1.8V_TU
C5001
100pF
50V
C5002
0.1uF
16V
RF_S/W_OPT
+5V_TU
C5003
16V
0.1uF
OPTION : RF S/W
RF_SWITCH_CTL
Pull-up can’t be applied
because of MODEL_OPT_2
+3.3V_TU
C5006
C5007
100pF
50V
0.1uF
16V
NON_DEMOD_OPT
R5035
0
R5009
100
+3.3V_TU
C5010
16V
R5011
100K
0.1uF
TUNER_RESET
NON_DEMOD_OPT
R5034
Q5001
ISA1530AC1
BOOSTER_OPT
0
+5V_TU
C5011
0.01uF
25V
BOOSTER_OPT
L5001
MLB-201209-0120P-N2
BOOSTER_OPT
R5014
0
BOOSTER_OPT
E
C
C5012
18pF
50V
IF_N_MSTAR
IF_P_MSTAR
B
C5013
18pF
50V
BOOSTER_OPT
33
33
R5015
R5016
R5017
2.2K
2SC3052
BOOSTER_OPT
+3.3V_TU
R5018
1.2K
R5019
10K
BOOSTER_OPT
C
Q5002EB
R5020
1.2K
OPTION : BOOSTER
R5021
10K
BOOSTER_OPT
The pull-up/down of LNA2_CTL
is depended on MODLE_OPT_1.
GPIO must be added for FE_BOOSTER_CTL
TU_SCL
TU_SDA
LNA2_CTL
C5016
0.1uF
16V
R5022
1K
OPT
Close to the tuner
IF_AGC
should be guarded by ground
C5025
0.1uF 16V
R5024
0
C5026
0.1uF
16V
RF_AGC_OPT
RF_AGC_OPT
C
Q5003EB
2SC3052
C5027
10uF
10V
RF_AGC_OPT
R5025
4.7K
R5026
1K
OPT
TU_CVBS_BYPASS
R5027
1K
OPT
R5028
10K
RF_AGC_OPT
+5V_TU
R5029
470
B
+5V_TU
R5030
220
NON_TU_CVBS_BYPASS
R5039
0
B
OPTION : RF AGC
IF_AGC_SEL
R5032
ISA1530AC1
Q5004
NON_TU_CVBS_BYPASS
R5031
220
ISA1530AC1
82
E
C
E
Q5005
C
NON_TU_CVBS_BYPASS
GPIO must be added.
TU_SIF
TU_CVBS
NTSC_1INPUT_H_SANYO
19
SHIELD
TU5001-*1
UDA45AL
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
M1
MDS61887705
SMD GASKET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.3V_TU
C5031
0.1uF
16V
IC5001
AZ1117H-ADJTRE1(EH11A)
INPUT
3
OUTPUT
100
R5006
R5007
DEMOD_OPT
DEMOD_OPT
100
IF_N_EXT
IF_P_EXT
*Change History.
Ver 1.0 --> 1.1:Change of chip type, 091019, w.s.jeong
1.De-reting
1) R5029,R5030,R5031 : 1005 Type ==> 1608 Type(w.s.Jeong_1019)
2) R5030,R5031 : 200/1608 Type ==> 220/2012 Type(w.s.Jeong_1116)
2.ADD of TUNER P/N (w.s.Jeong_1116)
+5V_Normal
+5V_TU
BLM18PG121SN1D
C5019
22uF
16V
BLM18PG121SN1D
C5020
22uF
16V
16V
C5021
0.1uF
16V
L5002
C5022
0.1uF
L5003
C5023
0.1uF
16V
+3.3V_Normal
C5024
0.1uF
16V
CONTROL_ATTEN
This was being applied to the only china demod,
so this has to be deleted in both main and ISDB sheet.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
AMP/NTP7000
10
Page 22
PStoPDF trial version. http://www.oakdoc.com
RJP
+12V/+15V
C1107
100pF
50V
C1108
100pF
50V
R1021
10
C1110
470pF
R130
10K
+3.5V_ST
R1022
47K
C120
2.2uF
R1102
470K
R1103
470K
0
OPT
GND
16V
Q102
AO3407A
R1107
15K
S
G
C113
1uF
25V
OPT
R1110
10K
R1108
15K
014:J22
008:AB22;001:L4
C1109
470pF
5.1VD101
10K
IR
TX
D
R1111
R1112
0
0.01uFC115
R1113
0
5.1VD102
0.01uFC116
C114
47uF
25V
5.1VD103
PC_R_IN
PC_L_IN
0.01uF
C117
R131
10K
5.1VD104
0.01uFC118
2:S16
2:S16
5.1VD105
0.01uFC119
SIDE_AV
PPJ235-01
JK3302
SIDE_AV_OPT
5A
4A
3A
[YL]CONTACT
4B
3C
[RD]CONTACT
4C
5C
510R154
510R166
510R167
510R164
510R153
OPT
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF_OUT
2:X18
[YL]E-LUG
[YL]O-SPRING
[WH]O-SPRING
[RD]O-SPRING
[RD]E-LUG
PC AUDIO
PEJ027-01
JK1100
PEJ027-01
JK1102
IR
6A
7A
7B
6B
3
6A
7A
4
5
7B
6B
E_SPRING
3
T_TERMINAL1
B_TERMINAL1
R_SPRING
4
T_SPRING
5
B_TERMINAL2
T_TERMINAL2
E_SPRING
T_TERMINAL1
B_TERMINAL1
R_SPRING
T_SPRING
B_TERMINAL2
T_TERMINAL2
JK1105
MJ-657PT-8-SD
9
9
GND
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
R1016
0
L101
MLB-201209-0120P-N2
R114
D1101
AMOTECH
5.6V
OPT
D1102
AMOTECH
5.6V
OPT
R1017
GND
0
5.1V
D1103
GND
10K
R1024
+3.3V_Normal
SIDE_AV_OPT
SIDE_AV_OPT
SIDE_AV_OPT
SIDE_AV_OPT
D3301
D3302
D3303
5.6V
D3304
5.6V
3.9K
30V
5.6V
R165
R161
OPT
3.9K
OPT
4.7K
R152
R1152
SIDE_AV_OPT
R162
3.9K
3.9K
A
B
GND
R3301
75
SIDE_AV_OPT
SIDE_AV_OPT
R163
3.9K
IC1104
NL17SZ00DFT2G
OPT
1
2
3
C3301
100pF
SIDE_AV_OPT
R3303
470K
R3304
470K
5
4
SIDE_AV_OPT
BLM18PG121SN1D
+3.3V_Normal
SIDE_AV_OPT
10K
R3302
SIDE_AV_OPT
L3301
BLM18PG121SN1D
SIDE_AV_OPT
L3302
BLM18PG121SN1D
USB_DIODES
IC1450
AP2191SG-13
$0.077
47R1451
50V
C1126
68pF
50V
OPT
JK1104
SPG09-DB-010
R1139
0R1452
4.7K
R1150
0
GND
1
IN_1
2
IN_2
3
EN
4
0R1453
ENKMC2838-T112
C1128
18pF
50V
D1113
30V
RED_GND
GND_2
6
1
SIDE_USB_DM
SIDE_USB_DP
TP1451
D1115
C
R1140
4.7K
RED
GREEN_GND
DDC_DATA
11
7
12
2
R1141
22
GREEN
C1452
10uF
10V
R1454
10K
A1
A2
10K
D1114
5.6V
OPT
BLUE_GND
H_SYNC
8
R1142
13
3
USB1_OCD
BLUE
NC
9
V_SYNC
14
4
GND_1
+5V_USB
C1453
0.1uF
/RST_HUB
C1129
0.1uF
16V
SYNC_GND
DDC_CLOCK
10
R1143
22
DDC_GND
15
5
+3.3V_Normal
R1455
4.7K
OPT
D1116
5.6V
OPT
SHILED
16
0R1456
USB1_CTL
+5V_Normal
EDID_WP
RGB_DDC_SCL
RGB_DDC_SDA
+3.3V_Normal
R1146
10K
D1117
5.6V
R1147
1K
DSUB_DET
NC
OUT_2
OUT_1
8
7
6
FLG
5
RJP_CTRL0
RJP_CTRL1
RJP_CTRL2
RJP_CTRL3
RJP_CTRL4
008:AP15
008:AD19
008:AD20
008:AR28
008:AE21
USB DOWN STREAM
JK1450
KJA-UB-4-0004
5
L1451
MLB-201209-0120P-N2
120-ohm
C1451
22uF
16V
1234
D1451
CDS3C05HDMI1
5.6V
OPT
D1452
CDS3C05HDMI1
5.6V
OPT
RGB PC
IC1105
AT24C02BN-10SU-1.8
A0
A1
A2
R1133
75
R1135
75
R1137
75
GND
C1122
68pF
50V
OPT
0
R1134
0
R1136
0
R1138
+3.3V_Normal
VCC
C1117
0.1uF
16V
OPT
R1126
Y
22
OPT
R1127
0
L3303
SIDE_AV_OPT
R3305
1K
SIDE_AV_OPT
R3306
100pF
C3303
100pF
C3302
50V
50V
10K
SIDE_AV_OPT
R3307
10K
SIDE_AV_OPT
SIDE_AV_OPT
C1131
0.1uF
16V
VINPUT
C1121
100pF
50V
C3304
100pF
OPT
SIDE_AV_OPT
R3308
12K
SIDE_AV_OPT
R3309
12K
GND
1
2
3
4
FIX_POLE
Fiber Optic
JK1103
JST1223-001
SIDEAV_CVBS_IN
SIDEAV_DET
SIDEAV_L_IN
SIDEAV_R_IN
VCC
DSUB_VSYNC
DSUB_HSYNC
DSUB_B+
DSUB_B-
DSUB_G+
DSUB_G-
DSUB_R+
DSUB_R-
VCC
1
8
WP
2
7
SCL
3
6
SDA
4
5
C1127
18pF
R1148
0
D1109
30V
OPT
OPT
OPT
C1123
OPT
C1125
OPT
C1124
OPT
D1111
30V
D1112
30V
D1110
30V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
COMMON AREA
Ver. 1.0
9
Page 23
PStoPDF trial version. http://www.oakdoc.com
SCART OPTION BLOCK
SC1_CVBS_IN
TP3801
TP3802
TP3803
TP3804
TP3805
TP3806
TP3807
TP3808
TP3809
COMPONET & AV & SPK OUT
JK3802
PPJ239-02
[RD1]E-LUG
6H
[RD1]O-SPRING_2
5H
[RD1]CONTACT_2
4H
[WH1]O-SPRING_2
5G
[RD1]CONTACT_1
4F
[RD1]O-SPRING_1
5F
[RD1]E-LUG-S
7F
[WH1]O-SPRING_1
5E
[WH1]E-LUG-S
7E
[YL1]CONTACT
4D
[YL1]O-SPRING
5D
[YL1]E-LUG
6D
[RD2]E-LUG
6N
[RD2]O-SPRING_2
5N
[RD2]CONTACT
4N
[WH2]O-SPRING
5M
[RD2]O-SPRING_1
5L
[RD2]E-LUG-S
7L
[BL2]O-SPRING
5K
[BL2]E-LUG-S
7K
[GN2]CONTACT
4J
[GN2]O-SPRING
5J
[GN2]E-LUG
6J
SC1_FB
SC1_ID
SC_RE1
SC_RE2
SCART1_MUTE
SC1_SOG_IN
SCART1_Lout
SCART1_Rout
DTV/MNT_VOUT
D3305
5.6V
D3306
5.6V
D3808
30V
D3807
5.6V
D3806
5.6V
D3803
30V
D3805
30V
D3804
30V
L3304
MLB-201209-0120P-N2
D3307
5.6V
OPT
L3305
MLB-201209-0120P-N2
D3308
5.6V
OPT
470K
R6004
470K
R6002
R3810
0
R3808
0
R3807
0
R3806
0
R3818
75
R3819
470K
R3816
470K
R3812
75
R3820
75
R3814
003:S9
EXT_OUT_R
003:S8
EXT_OUT_L
R3811
10K
C5032
1000pF
50V
R6003
10K
C3801
1000pF
50V
OPT
C3806
10pF
50V
R3826
10K
C3807
1000pF
50V
R3825
10K
C3805
1000pF
50V
OPT
C3802
10pF
50V
OPT
C3804
10pF
50V
OPT
C3808
10pF
75
50V
R3817
12K
R3815
12K
R3829
12K
R3828
12K
AV_R_IN
AV_L_IN
AV_CVBS_IN
COMP_R_IN
COMP_L_IN
COMP_Pr+
COMP_Pr-
COMP_Pb+
COMP_Pb-
COMP_Y+
COMP_Y-
10K
R3822
D3802
5.6V
+3.3V_Normal
R3813
5.6V
+3.3V_Normal
R3804
10K
C3803
100pF
50V
OPT
R3827
1K
R3805
1K
COMP_DET
AV_CVBS_DET
HDMI_1
SHIELD
$0.253
HDMI_1
EAG59023302
JK802
SIDE_HDMI
JACK_GND
20
$0.253
EAG42463001
HDMI_SIDE
JK803
5V_HDMI_1
20
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
5V_HDMI_4
R897
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
1K
R837
1.8K
R896
1K
R804
1.8K
D811
D802
R835
5V_DET_HDMI_1
3.3K
R802
5V_DET_HDMI_4
3.3K
JP806
C803
0.1uF
16V
C802
0.1uF
16V
JP805
JP803
JP804
R840
R841
R810
R807
R817
R809
R813
R811
R849
R808
R825
R826
R824
R847
R846
R845
R844
R843
R842
R850
R848
C
R862
10K
R830
10K
HPD1
DDC_SDA_1
DDC_SCL_1
HDMI_CEC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
HDMI EEPROM
For CEC
HDMI_CEC
AT24C02BN-10SU-1.8
A0
1
A1
2
A2
3
GND
4
AT24C02BN-10SU-1.8
A0
1
A1
2
A2
3
GND
4
D804
OPT
D803
AVRL161A1R1NT
GND
D826
AVRL161A1R1NT
GND
HDMI_1
$0.055
HDMI_SIDE
$0.055
D825
OPT
IC801
IC804
5V_HDMI_1
+5V_Normal
A2
A1
ENKMC2838-T112
D821
C
R874
5V_HDMI_4
R871
+3.3V_Normal
GND
GND
R856
10K
C805
0.1uF
16V
R893
10K
C810
0.1uF
16V
10K
R884
4.7K
10K
R887
4.7K
+3.5V_ST
R888
4.7K
+5V_Normal
A2
C
R891
4.7K
R857
68K
OPT
R858
0
R853
68K
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
68K
R854
68K
R892
R855
C806
0.1uF
JP809
22R876
22R875
C809
0.1uF
JP812
22R881
22R882
0
OPT
S
B
D
Q806
G
BSS83
R883
0
OPT
S
B
D
Q805
G
BSS83
A1
ENKMC2838-T112
D824
EDID_WP
DDC_SCL_4
DDC_SDA_4
CEC_ON/OFF
CEC_REMOTE_NEC
EDID_WP
DDC_SCL_1
DDC_SDA_1
CEC_REMOTE_S7
Q802EB
2SC3052
22
22
100
0
0
0
0
0
0
0
0
C
Q803EB
2SC3052
22R839
22
100
0
0
0
0
0
0
0
0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
HDMI
Ver. 1.2
8
Page 24
PStoPDF trial version. http://www.oakdoc.com
[LEVEL Shift Block]
VCC_LCM
(+3.3V)
R625
100
GIP
C600
R600
3K
GVDD_ODD_I
GVDD_EVEN_I
GSP/GVST_I
GCLK6_I
GCLK5_I
GCLK4_I
GSC/GCLK3_I
GCLK2_I
GOE/GCLK1_I
C612
0.22uF
50V
GIP
VGH
(+25V)
OPT
OPT
R623
22
GIP22GIP
GIP
A9
A8
A7
A6
A5
A4
A3
R624
EP[VGOFF]
VSENSE
28
1
THERMAL
2
3
4
5
6
7
8
A2
FLK
FLK2
FLK1
26
27
29
IC602
MAX17119DS
GIP
9
10
A1
GON1
C611
1uF
50V
GIP
FLK3
GOFF
GND
RE
24
25
11
12
Y1
GON2
R626
10
GIP
VGL
(-5V)
DISCHG
R632
10K
GIP
YDCHG
22
23
Y9
21
Y8
20
Y7
19
Y6
18
Y5
17
Y4
16
Y3
15
13
14
Y2
C618
R603
1uF
OPT
50V
OPT
GIP
R633
R630
10
10
GIP
GIP
VGH
(+25V)
VDD_ODD
VDD_EVEN
VST
CLK6
CLK5
CLK4
CLK3
CLK2
CLK1
[POWER Block]
VGH
(+25V)
4.7uF/50V(3216)
R619
R668
18K
18K
C633
50V
TCON_42_FHD_60_LAMP
4.7uF
TCON_42_FHD_60_LAMP
TCON_42_FHD_60_LAMP
R620
56K
1%
R621
220K
1%
R622
11K
1%
OPT
D606
MMSD4148T1G
100V
TH700
47k-ohm
C615
1uF
50V
GIP
NCP18WB473F10RB
VGH_FB
D607
MMSD4148T1G
100V
TCON_42_FHD_60_LAMP
R635
910K
1%
TCON_42_FHD_60_LAMP
TCON_42_FHD_60_LAMP
R642-*1
33K
NON_GIP
R688
33K
R689
2.7K
VGH_M
(+25V)
C627
1uF
50V
C626-*1
470pF
50V
NON_GIP
VGH
(+25V)
R692
NON_GIP
R693
NON_GIP
R690
R691
R694
510
NON_GIP
68pF
C676
0.047uF
C677
VGH_FB
VCC_LCM
(+3.3V)
R639
0
VDD_LCM
(+16V)
NON_GIP
R689-*1
0
NON_GIP
EN2
R631-*1
200
NON_GIP
(-5V)
D602
KDS226
C
AC
A
VDD_LCM
(+16V)
R644
3.6K
VGL
R627
0
C617
1uF
50V
R629
R631
10
10
GIP
GIP
R629-*1
200
NON_GIP
GIP
C621
0.47uF
25V
R694-*1
0
GIP
R695-*1
0
GIP
C622
1uF
10V
C630
10uF
R637
16V
27K 1%
TCON_42_FHD_60_LAMP
R643
150K
TCON_42_FHD_60_LAMP
REF
VGL_FB
1%
R695
510
NON_GIP
NON_GIP
OPT
R638
0
0
0
0
0
TCON_42_FHD_60_LAMP
GIP
GIP
NON_GIP
R686
0
GIP
D603
KDS226
C
AC
A
R636
47K
MODE
GPGND
1%
DRVP
GND2
GON
THR
SRC
DRN
DLP
FBP
NON_GIP
C632
1uF
50V
R687
C626
1000pF
50V
GIP
0
R640
470K
1%
R641
56K
1%
27pF
NON_GIP
1
2
3
4
5
6
7
8
9
10
C625
R642
AGND
40
11
CTL
FLK
C628
OPT
OPT
C629
OPT
OPT
50V
10K
GIP
COMP
PGOOD
CRST
38
39
MAX17113ETL+
MINI_LVDS
12
13
FBN
DRVN
AGND
37
14
FB1
36
IC603
15
REF
VGL_FB
C635
0.1uF
C636
1uF 50V
LX1
SW1
SW0
33
34
35
16
17
18
FB2
BST
DEL1
REF
C634
0.1uF
50V
EN2
C642
C645-*1
560pF
50V
NON_GIP
(+12V)
C651
1uF
10V
C646
0.1uF
50V
R656
1uF
50V
360
C655
OPT
OPT
DPM_A
Change 100ohm -> 10ohm
50V
LX1
32
19
LX2
PGND
LX2
C637
0.1uF
C638
C640
47uF
1uF
25V
50V
L602
C645
1000pF
C644
0.1uF
50V
L601
22UH
2.8A
D604
MBRA340T3G
40V
22UH
2.8A
C654
22uF
25V
50V
GIP
0
C641
150pF
50V
PANEL_VCC
EN2
C606
R648
1uF
1K
50V
R649
OPT
OPT
C648
22uF
10V
C643
0.1uF
50V
R634
MBRA340T3G40VD605
MBRA340T3G40VD608
2.2R647
31
PGND
30
EN2
29
VL
28
DEL2
27
EN1
26
FSEL
25
VIN
24
IN2
23
IN2
22
OUT
21
20
50V
C657
22uF
25V
VCC_LCM
(+3.3V)
C653
22uF
25V
PANEL_VCC
(+12V)
R651
5.1K
VDD_LCM
C663
22uF
25V
(+16V)
R612
10
CHECK Value!!
R650
9.1K
1/8W
R613
1K
EN2
[P-GAMMA Block]
Slave Address : 0xE8h
(AO Pin - GND)
VCOM
C601
0.1uF
50V
VCC_LCM
(+3.3V)
AMP_SDA
VCOM_FB0
TCON_47_FHD_60_LAMP
VCOM
VCOM_FB0
R652
1K
R669
AGND_AMP
R601 OPEN -->
42FHD_60_LAMP
R654
0
R655
0
GMA16
AMP_SCL
GMA15
GMA6
GMA5
GMA4
GMA3
GMA2
1uF/50V(2012)
C604
1uF
50V
C603
0.1uF
50V
33
R670
EP[GND]
SCL
20
SDA
1
A0
DVDD
VCOM
THERMAL
2
3
MAX9668ETP+
4
5
6
VCOM_FB
1KR601
1KR602
TCON_47_FHD_60_LAMP
VCOMRFB
VCOMLFB
VCOMR
VCOML
33
AVDD_2
NC_2
GMA7
GMA8
16
17
18
19
21
IC601
MINI_LVDS
7
8
9
10
NC_1
GMA1
AVDD_1
AVDD_AMP
C602
0.1uF
50V
TCON_47_FHD_60_LAMP
15
14
13
12
11
VDD_LCM
(+16V)
R618
10
1/8W
GMA13
GMA12
GMA7
GMA6
GMA4
GMA3
For P-Gamma Data Download
P700URSA_DEBUG
12505WS-03A00
1
2
3
4
AMP_SCL
AMP_SDA
VDD_LCM
(+16V)
VDD_LCM
(+16V)
OPT
L603
10uF/25V(3216)
C610
10uF
25V
R605
47K
OPT
PANEL_VCC
(+12V)
MINI_LVDS
R672
24K
D609
100V
MMSD4148T1G
R616
10K
OPT
PANEL_VCC
[HVDD Block]
L604
C619
10uF
25V
PGND_1
EN2
C639
1uF
25V
R606
20K
R607
7.5K
VIN_1
VIN_2
VCC_LCM
(+3.3V)
R628
3.3K
R661
GIP
C605
15pF
50V
NON_GIP
GIP
GIP
R617
0
R645
0
OPT
C665
15pF
50V
0
C666
15pF
50V
FLK
0R614
VGI_P
0R615
VGI_N
VGL_I
POL
SOE
RXD3-
RXD3+
GSP_R
RXDCK+
RXDCK-
GVDD_EVEN
DISCHG
10
VGH
(+25V)
VGL
(-5V)
R604
VGL
(-5V)
R660
NON_GIP
0
RXA3-
C661
10uF
16V
R658
2.2K
HVDD
R657
2.2K
RXD4-
RXD4+
6.8uH/1.8A
(6x6x2mm)
L600
6.8uH
MINI_LVDS
R696
R698
0
1M
GIP
NON_GIP
PG
SW_1
SW_2
PGND_2
13
14
15
16
1
2
IC600
TPS62110RSAR
3
MINI_LVDS
EN
4
5
6
LBO
SYNC
GND_2
12
GND_1
11
FB
10
AGND
9
7
8
VINA
R608
10
TCON_42_FHD_60_LAMP
C649
1uF
50V
LBI
R1
R609
510K
1%
TCON_42_FHD_60_LAMP
R610
150K
1%
TCON_42_FHD_60_LAMP
C652
C659
22pF
22uF
50V
16V
R2
R611
200K
1%
Vo = 1.153*(1+R1/R2)
R665
0
R659
0
R685
0
NON_GIP
VCC_LCM
R671
4.7K
GIP
R662
0
R653
0
GIP
R646
0
GIP
(+3.3V)
R673
3.3K
NON_GIP
C667
15pF
50V
NON_GIP
For GOE Masking
C675
15pF
50V
NON_GIP
C672
15pF
50V
NON_GIP
C669
15pF
50V
OPT
C668
15pF
50V
OPT
GSP/GVST_I
GOE/GCLK1_I
GSC/GCLK3_I
GVDD_ODD_IGVDD_ODD
GVDD_EVEN_I
GCLK2
GCLK4
RXA4-
RXA4+
VCC_LCM
(+3.3V)
R5266
R5267
3.3K
0
OPT
MINI_LVDS
R667
0
R663
0
GIP
R664
0
R666
0
GIP
GIP
GIP
H_CONV
C670
15pF
50V
C673
15pF
50V
C674
15pF
50V
C671
15pF
50V
GCLK2_I
OPT
GCLK4_I
OPT
GCLK5_I
OPT
GCLK6_I
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
T-CON
Ver. 2.1
7
Page 25
PStoPDF trial version. http://www.oakdoc.com
CONTROL
IR & LED
KEY1
KEY2
+3.5V_ST
Q2405
2SC3052
R2429
+3.5V_ST
47K
+3.5V_ST
R2426
3.3K
R2431
OPT
47K
C
B
E
R2425
Q2406
2SC3052
47K
R2430
C
10K
B
E
R2427
0
OPT
R2428
IR
22
R2404
10K
R2401
100
R2402
100
+3.5V_ST
1%
R2405
10K
1%
L2401
BLM18PG121SN1D
L2402
BLM18PG121SN1D
+3.5V_ST
C2401
0.1uF
C2402
0.1uF
L2403
BLM18PG121SN1D
C2403
0.1uF
16V
D2401
AMOTECH
5.6V
AMOTECH
C2404
1000pF
50V
+3.3V_Normal
D2402
5.6V
LED_B/LG_LOGO
BLM18PG121SN1D
L2404
C2405
0.1uF
NEC_EEPROM_SCL
NEC_EEPROM_SDA
16V
C2406
1000pF
50V
EYEQ/TOUCH_KEY
EYEQ/TOUCH_KEY
R2410
100
LED_R/BUZZ
R2412
C2407
100pF
50V
R2411
100
100
C2408
1000pF
50V
OPT
C2409
1000pF
50V
OPT
1.5KR2413
R2414
C2410
0.1uF
D2405
5.6B
1.5K
P2401
5.6B
D2403
5.6B
D2404
JP2407
JP2408
OPT
16V
JP2411
OPT
R2416
10K
12507WR-12L
1
2
3
4
5
6
7
JP2409
JP2410
8
9
10
11
12
13
RS232C
0.33uFC1101
C1+
C1102
0.1uF
V+
C1103
0.1uF
C1-
C2+
C1104
0.1uF
C2-
C1105
0.1uF
DOUT2
RIN2
Zener Diode is
close to wafer
0
R1105
100K
R1156
D1108
30V
0R1157
0
3.3K
R1106
B
+3.5V_ST
R1123
100
R1124
100
C
Q1002
E
JP1121
JP1122
S7_RXD
NEC_RXD
9
8
7
6
SPG09-DB-009
JK1101
10
5
4
3
2
1
+3.5V_ST
R1104
IC1101
MAX3232CDR
1
2
3
4
5
V-
6
7
8
16
15
14
13
12
11
10
9
EAN41348201
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
C1106
0.1uF
+3.5V_ST
R1109
4.7K
OPT
TX
R1114
4.7K
OPT
100K
D1107
30V
R6007
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
MICOM
Ver. 1.4
5
Page 27
PStoPDF trial version. http://www.oakdoc.com
RL_ON
100uF
100uF
C401
C402
+3.5V_ST
16V
+12V/+15V
16V
PIN No
R401
10K
<OS MODULE PIN MAP>
B
MLB-201209-0120P-N2
L402
MLB-201209-0120P-N2
C404
0.1uF
16V
LGD/LIPS
INV_ON
18
20
22
PWM_DIM
24
23
C
Q401
2SC3052
E
L404
C406
0.1uF
16V
VBR-A
Err_out
GND
FROM LIPS & POWER B/D
+3.5V_ST
R406
4.7K
C408
0.1uF
16V
C407
0.1uF
16V
CMO
A-DIM
NC
PWM_DIM
INV_ON
GND
RT1P141C-T112
Q402
3
1
R476
0
INV_ON
2
POWER_23_GND
AUO
NORMAL_EXPEPT_32
GND/P.DIM2
R478
0
SHARP
INV_ON
Err_out
NC
PWM_DIM
PWM_DIM
GNDGND GND
OLP
P403
FW20020-24S
PWR ON
24V
GND
GND
3.5V
3.5V
GND
GND
12V
12V
12V
0.1uF
16V
C412
C484
1uF
25V
POWER_23_SCAN_BLK2
SCAN_BLK2
NC
PWM_DIM
GND
1
1
1
3
3
3
5
5
5
7
7
7
9
9
9
11
11
11
13
13
13
15
15
15
17
17
17
19
19
19
2122
2122
21
2324
2324
23
25
25
SLIM_32~52
P401
SMAW200-H24S2
OPT
OPT
IPS-@
INV_ON
Err_out
GND
NORMAL_32
2
2
2
4
4
4
6
6
6
8
8
8
10
10
10
12
12
12
14
14
14
16
16
16
18
18
18
20
20
20
22
24
P404
FM20020-24
24V
24V
GND
GND
3.5V
3.5V
GND
GND/V-sync
INV ON
A.DIM
P.DIM1
Err OUT
MLB-201209-0120P-N2
POWER_16_GND
R475
0
POWER_24_GND
POWER_24_PWM_DIM
POWER_22_PWM_DIM
L407
C418
0.1uF
50V
POWER_16_V_SYNC
R477
0
0
POWER_18_INV_CTL
R425
100
R412
POWER_24_INV_CTL
R472
R471
OPT
POWER_20_ERROR_OUT
POWER_24_ERROR_OUT
+3.3V_Normal
R415
100
R418
6.8K
OPT
POWER_20_PWM_DIM
R479
0
0
0
C416
0.1uF
16V
R437
R420
V_SYNC
C
E
R484
0
OPT
C419
1uF
25V
100
100
R419
1K
B
2SC3052
POWER_18_A_DIM
POWER_22_A_DIM
POWER_20_A_DIM
PWM_PULL-DOWN
+24V
C426
68uF
35V
+3.5V_ST
R426
10K
R421
10K
Q405
0
R451
0
R485
0
R453
C419-*1
3.9K
SCAN_BLK1/OPC_OUT
0
R422
POWER_22_SCAN_BLK1/OPC_OUT
OPT
0
R470
+3.3V_Normal
R486
4.7K
OPT
R427
10K
OPT
OPT
ERROR_OUT
INV_CTL
A_DIM
PWM_DIM
OPC_OUT
PANEL_CTL
1:AK10
Placed on SMD-TOP
C IN
+12V/+15V
L412
NON_GIP_CCFL_55"
NON_GIP_CCFL_55"
+3.5V_ST
C461
22uF
10V
R439-*1
10K
R440-*1
1.8K
R429
47K
CIC21J501NE
L420
+3.3V_Normal
OPT
R430
10K
C432
0.1uF
16V
C436
0.01uF
25V
EXCEPT_NON_GIP_CCFL_55"
R431
22K
EXCEPT_NON_GIP_CCFL_55"
C
Q406
B
2SC3052
E
S7M DDR 1.5V
MP2212DN
FB
R2
IC402
1
GND
2
3A
IN
3
BS
4
VOUT
3
2
GND
R449
11K
1/10W
5%
AZ2940D-2.5TRE1
VIN
1
Vd=550mV
IC407
R435
R452
15V-->3.6V
20V-->3.5V
PANEL_POWER
C442
C438
10uF
0.1uF
16V
16V
OPT
R439
33K
R440
5.6K
C
Q407
B
2SC3052
E
22K
C443
4.7uF
16V
AO3407A
Q409
New item
S
D
G
C451
1uF
25V
OPT
C455
0.1uF
16V
PANEL_DISCHARGE_RES
PANEL_DISCHARGE_RES
R405
2.2K
PANEL_VCC
R407
2.2K
24V-->3.48V
12V-->3.58V
ST_3.5V-->3.5V -> 3.375V
POWER_+24V
POWER_+24V
R482
R403
+24V
24K
4.3K
1074 mA
+12V/+15V
C463
100pF
50V
Replaced Part
R1
R457
10K
1%
Close to IC
EN/SYNC
8
SW_2
7
SW_1
6
VCC
5
0R455
10
1/10W
1%
C465
1uF
10V
C467
0.1uF
50V
10K
R464
L423
3.6uH
NR8040T3R6N
C472
22uF
10V
Vout=0.8*(1+R1/R2)
POWER_ON/OFF1
Placed on SMD-TOP
+1.5V_DDR
C476
0.1uF
C457
10uF
25V
+12V/+15V
L416
C459
10uF
25V
+2.5V/+1.8V
L417
C458
10uF
25V
R473
+2.5V_Normal
300 mA
1
C403
C440
10uF
0.1uF
10V
16V
+24V
+12V/+15V
OPT
12K
30K
1%
R448
R446
R447
5.1K
1%
R482-*1
24K
1%
POWER_+20V
1%
R403-*1
5.1K
POWER_+20V
R482-*2
POWER_+18.5V
5%
R403-*2
POWER_+18.5V
Only for 32/37LED MODEL
24K
5.6K
+3.3V_Normal
IC405
AOZ1073AIL
PGND
1
VIN
2
AGND
3A
3
FB
4
Vout=(1+R1/R2)*0.8
+5V_Normal
PGND
VIN
C460
10uF
25V
AGND
FB
PD_+12V
1/16W
1%
1%
1%
5%
PD_+12V
8
7
6
5
IC406
AOZ1072AI
1
2
2A
3
4
+3.5V_ST
Vout=0.8*(1+R1/R2)
LX_2
LX_1
EN
COMP
0
R450
27K
R447-*1
VCC
+3.5V_ST -> 3.375V
5%
PD_+3.5V
VCC
1%
PD_+3.5V
R404
100K
IC409
NCP803SN293
3
1
GND
POWER_ON/OFF2_2
R456
10K
9.1K
R454
LX_2
8
LX_1
7
EN
6
COMP
5
ON-SEMI
NCP803SN293
3
GND
PD_+12V
RESET
2
PD_+12V
L421
3.6uH
NR8040T3R6N
2200pF
C464
R458
R488
100K
IC408
RESET
2
1
Power_DET
R460
27K
4.7K
R461
OPT
C423
100pF
R462
10K
L422
3.6uH
NR8040T3R6N
POWER_ON/OFF2_2
R459
10K
12K
2200pF
C466
PD_+12V
1%
R1
1%
50V
1%
R2
R402
100
R480
100
1934 mA
+3.5V_ST
OPT
MAX 1A
R465
51K
1.5K
R466
R467
10K
R463
1%
OPT
C427
100pF
10K
POWER_DET
C474
0.1uF
GMT
IC408-*1
G671L293T73Uf
3
GND
CIC21J501NE
1
L424
RESET
2
+3.3V_Normal
+5V_Normal
C485
0.1uF
16V
C477
0.1uF
16V
VCC
C473
C469
0.1uF
22uF
16V
16V
5%
C471
R1
22uF
16V
50V
1%
R2
+12V/+15V
C405
10uF
25V
L401
+5V_USB
IC401
MP8706EN-C247-LF-Z
IN
1
SW_1
2
SW_2
3A
C410
0.1uF
R487
22
3
BST
4
L406
3.6uH
NR8040T3R6N
MAX 2000mA
GND
8
VCC
7
FB
6
EN/SYNC
5
C414
1uF
50V
R411
R410
10K
10K
OPT
C482
100pF
50V
POWER_ON/OFF2_1
+5V_USB
R416
R417
33K
6.2K
1%
R1
1%
R2
Vout=(1+R1/R2)*0.8
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NON CHINA HOTEL
AMP_MUTE_HOTEL
GP2_Saturn7M
NON CHB
0R6001
/PIF_SPI_CS
CHB_CVBS_IN
16TP/JP
Page 32
Page 33
LD450C Block Diagram
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
< Contents >
Overall Block Diagram
Overall Block Diagram
Video Signal Block
Video SignalBlock
Audio Signal Block
Audio Signal Block
Flash Block & Reset
Flash Block & Reset
GPIO Block
LVDS 출력 Block
LVDS 출력Block
I2C Block
I2C Block
GPIO Block
POWER Block
POWER Block
LG Electronics/ BS Division
Commercial Gr.
Page 34
IF +/-
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LVDS
LCD Module
(FHD, 60Hz)
JACK PACK
JACK PACK
at REAR
at REAR
RF
TDVJ
TU_CVBS
SIF
- H001F
Side AV2
AV1
Component 1
External Speaker L/R OUT
D-sub RGB
Audio L/R
(for RGB)
HDMI 1
HDMI 2
(side HDMI)
RJP
IR_IN
Digital Audio
(Optic)
RS-232C
(CTRL./SVC)
USB
SDA/SCL_5V
Reset / IF_AGC …
CVBS, L/R
CVBS, L/R
Y Pb Pr, L/R
L/R OUT
RGB/H/V
Audio L/R
IR_IN
RX/TX
DP/DM/ +5V
Ext Amp.
GPIO
SPDIF
MAX3232
RX/TX
S7(LGE101D)
& S7 T (LGE105)
Mini LVDS
P-Gamma
Power Shift
Power Control
DDR_Data[0:15], DQS, DM …
Addr.[ ], ctrl. data
Data[16:31]
PCM_A [0 … 7]
CS ,RE,WE……
SCL, SDA_3.3V
Audio L/R
I2S
I2C(SCL/SDA)
S/W Reset
24MHz
LCD Module
(FHD,M+S, 60Hz)
DDR2 (1 G bit)
H5TQ1G63BFR-H9C
DDR2 (1 G bit)
H5TQ1G63BFR-H9C
NAND Flash(1 G bit)
NAND01GW3A2CN6E
NVRAM
H/P
Digital AMP
NTP7000L
Micom
(UPD78F0513AGA)
X-tal
Reset Switch
Page 35
Video Signal Block
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Video Signal Block
RF
TDVJ
- H001F
IF +/IF_AGC
TU_SIF
TU_CVBS
DSUB_R
DSUB_G
DSUB_B
DSUB_HSYNC
DSUB_VSYNC
COMP1_Y
COMP1_Pr
COMP1_Pb
AV_CVBS_IN
SIDEAV_CVBS_IN
IP/IF
IFAGC
SIFP
CVBS0P
RIN0P/M
GIN0P/M
BIN0P/M
HSYNC0
VSYNC0
GIN1P/M
RIN1P/M
BIN1P/M
CVBS0P
CVBS1P
S7(LGE101D)
& S7 T (LGE105)
RXCAKP
RXCAKN
RXA0P
RXA0N
RXA1P
RXC1N
RXA2P
RXA2N
RXCCKP
RXCCKN
RXC0P
RXC0N
RXC1P
RXC1N
RXC2P
RXC2N
CK+/-_HDMI1
D0+/-_HDMI1
D1+/-_HDMI1
D2+/-_HDMI1
CEC_REMOTE
CK+/-_HDMI4
D0+/-_HDMI4
D1+/-_HDMI4
D2+/-_HDMI4
CEC_REMOTE
Page 36
Audio Signal Block
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Audio Signal Block
RF
TDVJ
- H001F
IF +/IF_AGC
TU_SIF
TU_CVBS
AV_L_IN
AV_R_IN
COMP1_L_IN
COMP1_R_IN
SIDEAV_L_IN
SIDEAV_R_IN
PC_L_IN
PC_R_IN
IP/IF
IFAGC
SIFP
CVBS0P
AUL2
AUR2
AUL1
AUR1
AUL0
AUR0
AUL4
AUL5
S7(LGE101D)
& S7 T (LGE105)
I2S_OUT_MCK
I2S_OUT_WS
I2S_OUT_BCK
I2S_OUT_SD
HP_ROUT
HP_LOUT
SPDIF_OUT
I2S_MASTER_CLK
I2S_LCRK
I2S_SCK
I2S_LCRH
Audio R
Audio L
SPDIF_OUT
Digital AMP
NTP7000N
+3.3V
1K
Page 37
Flash & EJTAG Block
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
I2C Block
Tuner
TDVJ-H001F
TU5001
EEPROM
(M24M01)
IC104
EEPROM
(CAT24WC08W)
IC103
EEPROM
AT24C02BN8
IC1105
100 ohm
100 ohm
22 ohm
22 ohm
22 ohm
22 ohm
+5V_Gen.
+5V_Gen.
+3.3V_TU
3.3k ohm
4.7k ohm
4.7k ohm
3.3k ohm
TU_SCL/SDA
+3.3V_Nor.
2.2k ohm
I2C_SCL/SDA
RGB_DDC_SCL/SDA
+3.3V_Nor
1.2k ohm
+3.3V_Nor
1.2k ohm
0 ohm
0 ohm
33ohm
33 ohm
AMP_SCL/SDA
AUDIO AMP
(NTP7000)
IC501
MAX9668ETP+
(P-GAMMA)
IC1601
TGPIO2
TGPIO3
2.2k ohm
0 ohm
0 ohm
DDCR_CK
TGPIO0
TGPIO1
0 ohm
0 ohm
DDCR_DA
3.2k ohm
3.3k ohm
S7(LGE101D)
& S7 T (LGE105)
GPIO 174
GPIO 175
NEC_SCL/SDA
+3.3V_Nor
22 ohm
22 ohm
Micom
(UPD78F0513AGA)
IC1002
22 ohm
2 ohm
DDCA_CK
DDCA_DA
3.2k ohm
3.3k ohm
33ohm
33 ohm
4.7k ohm
4.7k ohm
EEPROM
AT24C02BN8
IC801/IC804
22 ohm
22 ohm
RGB_DDC_SCL/SDA
DDCDA_CK/DDCDC_CK
DDCDA_DA/DDCDC_DA
22 ohm
22 ohm
EEPROM
(AT24C512BW)
IC1001
Page 39
GPIO Block(S7 & S7 T)
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
GPIO Block(S7 & S7 T)
DSUB_DET
COMP1_DET
AV_CVBS_DET
SIDEAV_DET
5V_HDMI_1
5V_HDMI_4
GPIO31
GPIO40
GPIO17/PM11
GPIO151/TCON8
GPIO143/TCON0
GPIO147/TCON4
& S7 T (LGE105)
GPIO 8/PM2
S7(LGE101D)
PWM0
PWM2
GPIO 41
UART_RX2
UART_TX2
A_DIM
PWM_DIM
Error_DET
S7_RXD
S7_TXD
R2619
R2618
P403 or P402
( POWER WAFER)
RS232C
(MAX3232CDR)
USB_DM1
USB_DP1
USB_DM
USB_DP
JK1204
(USB JACK)
Page 40
GPIO Block(S7 & S7 T)
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
GPIO Block(S7 & S7 T)
P i n N u mb e rP i n N a meS i g n a l N a meP i n N u mb e rP i n N a meS i g n a l N a me
41UART _TX 2/ GPIO 65M 23S7_TXD91G PI O17/ PM 11/ INT 3G12AV_C VBS_DET
42UA RT_ RX 2/ GPI O64N23S7_RXD92PM _S PI _C S2/ GP IO16/ P M10D8DE M OD_ RE SE T
43D DCR_ DA/ GP IO71M 22I2C_SDA94PM _SP I_WP2/ GP IO 14/P M 8/I NT2F7MODEL_OPT_2
44D DCR_ CK/ GP IO72N22I2C_SCL95PM_SPI_WP1/GPIO13/PM7E 9FLAS H_WP
47PWM0/GPIO66K23PWM0100GPIO 8/P M2E 11HP _DE T
48PWM1/GPIO67K22PWM1101GP IO 7/P M 1/P M _UAR T_T XD7USB1_CT L
49PWM2/GPIO68G23PWM2102GP IO6/ PM 0/ INT 0E 7US B1_O CD
50PWM3/GPIO69G22SC_RE2
51PWM4/GPIO70G21SC_RE1103GP IO 51/UA RT1_ TXF19M_REMOTE_TX
52SA R0/ GP IO31C 6DSUB _DE T
53SA R1/ GP IO32B 6MODEL_OPT_105GP IO42G19MODEL_OPT_0
54SA R2/ GP IO33C 8PCM_5V_CTL106GP IO 41G20ERROR_OUT
55SA R3/ GP IO34C 7RST_PHY107G PIO 40M 20SC1/COMP1_DET
56SA R4/ GP IO35A 6RS T_HUB108G PI O39L20FRC_RESET
62M PI F_C S_ ND14PIF_SPI_CS110GPI O37/ UAR T3_T XL 23WIRELESS_DL_TX
63M PI F_CL KD12.111GP IO36/ UAR T3_ RXK21WIRELESS_DL_RX
86PM_SPI_DO/GPIO3D10SPI_SDO112GPI O151/ TC ON8P 21SIDEAV_DET
87PM_SPI_DI/GPIO2E10SPI_SDI113G PIO 149/ TCO N6L 215V _ DET _HDM I_ 3
88GP IO0/ PM _S PI _CZD11.114GPIO 147/T CON 4L 225V _DE T_HDM I_ 4
89PM_SPI_CK/GPIO1D9SPI_SCK115GP IO145/ TCO N2M215V _DE T_HDM I_ 2
90GP IO18/ PM 12/ INT 4F10.
93GPIO 15/P M9F6TUNER_RESET
96PM _ SPI_ CS1/ GPI O12/ PM 6E8SPI_CS
99GP IO9/ P M3G 9CONTROL_ATTEN
104GP IO50/ UAR T1_ RXF 20M_REMOTE_RX
109G PIO 38K20ET_RXER
116GP IO143/ TC ON0N215V _DE T_ HDM I_1
Page 41
GPIO Block(MICOM)
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
GPIO Block(MICOM)
Micom
(UPD78F0513AGA)
P71
P140
P73
P74
INT_CTL
RL_ON
AMP_RESET_N
AMP_MUTE
P403 or P402
( POWER WAFER)
AUDIO AMP
( NTP3100L)
KEY1
KEY2
IR
ANI6
ANI7
INTP5
IC1002
RXD0
TXD0
NEC_RXD
NEC_TXD
R2619
R2618
RS232C
(MAX3232CDR)
Page 42
GPIO Block(MICOM)
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
GPIO Block(MICOM)
Pin NumberPin NameSignal Name
1P60/SCL0NEC _SCL
2P61/SDA0NE C_SDA
3P 62/ E X SCL0NEC_EEPROM_SCL
4P63NEC _E EP ROM _SDA
5P33/ TI 51/ TO 51/IN TP 4CEC_REM OTE_NEC
6P75POWER_ON/OFF2_1
7P74AMP_MUTE
8P 73/ KR3MODEL1_OPT_0
25A NI7/ P 27KEY 1
26A NI6/ P 26KEY 2
27A NI5/ P 25SIDE_HP_MUTE
28A NI4/ P 24OLP
29A NI3/ P 23POWER_ON/OFF1
30A NI2/ P 22MODEL1_OPT_2
31A NI1/ P 21MODEL1_OPT_3
32P 20/ ANI0SCART1_MUTE
33P130WIRE L E SS_S W_CTRL
34P01/ TI 010/TO 00EDID_WP
35P 00/ TI000OPC_E N
36P 140/PCL / INT P6RL _ON
37P 120/ INTP0/ E XL VIKE Y 2
38P41WIRELESS_PWR_EN
39P40WIRELESS_DETECT
40RE SE TMICOM_RESET
43FL MD0FLMD0
Page 43
LVDS 출력Block(32”/37”)
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes