Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15 uF
Ω
Page 3
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 4
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 5
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LCD TV used LT01B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
7) Push The “IN STOP KEY” - For memory initialization.
3. Main PCB check process
* APC - After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message.
If “Error” is displayed, Check connection between
computer, jig, and set..
(3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”.
(4) Click “Connect” tab. If “Can’t” is displayed, check
connection between computer, jig, and set.
(5) Click “Auto” tab and set as below
(6) Click “Run”.
(7) After downloading, check “OK” message.
filexxx.bin
(7)
(5)
(8) ……….OK
(6)
(1) (3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
(4)
filexxx.bin
Case1 : Software version up
1. After downloading S/W by USB, TV set will reboot
automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “I n-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at first.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
Page 9
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 10 -
LGE Internal Use Only
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn’t work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool
option. (refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In this case, you have to
channel recover. If all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
1. Push "IN-START" key in service remote controller.
2. Select "Tool Option 1" and Push “OK” button.
3. Punch in the number. (Each model has their number.)
4. Completed selecting Tool option.
3.1. ADC Process
(1) ADC
• Enter Service Mode by pushing “ ADJ” key
• Enter Internal ADC mode by pushing “G” key at “6. ADC
Calibration”
*
Caution: Using ‘power on’ button of the Adj. R/C, power on TV.
* ADC Calibration Protocol (RS232)
- Adjust Sequence
• aa 00 00[Enter Adjust Mode]
• xb 00 40[Component1 Input (480i)]
• ad 00 10[Adjust 480i Comp1]
• xb 00 60 [RGB Input (1024x768)]
• ad 00 10[Adjust 1024x768 RGB]
• aa 00 90[End Adjust Mode]
* Required equipment : Adjustment R/C
3.2. Function Check
(1) Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (CVBS)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In
* Display and sound check is executed by remote control.
Do not remove he memory card from the pc
Do not plug off!
No.ItemCMD1 CMD2 Data0
1 Enter Adjust Mode A A 00
2 ADC AdjustA D 00
Page 10
- 11 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. Total Assembly line process
4.1. Adjustment Preparation
· W/B Equipment condition
CA210 : CH 9, Test signal : Inner pattern (85IRE)
· Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
4.1.1. Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER ON -> Enter
the mode of White-Balance, the pattern will come out
4.1.2. Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10ux).
2) Adhere closely the Color Analyzer (CA210) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 15minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
4.1.3. Auto adjustment Map (RS-232C)
**Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range of
Module)
4.2. Manual W/B process using adj. R/C
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “G”
* After done all adjustments, Press “In-start” button and compare
Tool option and Area option
value with its BOM, if it is correctly same then unplug the AC
cable.
If it is not same, then correct it same with BOM and unplug AC
cable.
For correct it to the model’s module from factory JIG model.
* Push The “IN STOP KEY” after completing the function
inspection.
Cool 13,000k ºKX=0.269(±0.002)All
Y=0.273(±0.002)<Test Signal>
Medium 9,300kºKX=0.285(±0.002)Inner pattern
Y=0.293(±0.002)(216gray,85IRE)
Warm6,500kºKX=0.313(±0.002)
Y=0.329(±0.002)
Cool 9,300k ºKX=0.285(±0.002)Only 22LD350
Y=0.293(±0.002)<Test Signal>
Medium 8,000kºKX=0.295(±0.002)Inner pattern
Y=0.305(±0.002)(216gray,85IRE)
Warm6,500kºKX=0.313(±0.002)
Y=0.329(±0.002)
Full White Pattern
COLOR
ANALYZER
TYPE: CA-210
RS-232C Communication
CA-210
RS-232C COMMAND MINCENTERMAX
[CMD ID DATA](DEFAULT)
CoolMidWarmCoolMidWarm
R Gainjg Ja jd 00172 192 192255
G Gain jh Jbje 00172 192 192255
B Gain ji Jc jf00192 192 172 255
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 12 -
4.3. DDC EDID Write (RGB 128Byte )
· Connect D-sub Signal Cable to D-Sub Jack.
· Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
· Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4.4 DDC EDID Write (HDMI 256Byte)
· Connect HDMI Signal Cable to HDMI Jack.
· Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
· Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4.5 EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
- Auto Download
- Manual Download
* Caution
1) Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
2) Nerver connect HDMI & D-sub Cable at the same time.
3) Use the proper cables below for EDID Writing.
4) Download HDMI1, HDMI2 separately because each data is
different.
EZ ADJUT
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Country Group
5. ADC Calibration
6. White Balance
7. Test Pattern
8. EDID D/L
9. Sub B/C
EDID D/L
HDMI1
HDMI2
HDMI3
RGB
NG
NG
NG
NG
Reset
Start
EDID D/L
HDMI1
HDMI2
HDMI3
RGB
OK
OK
OK
OK
Reset
Start
D-sub to D-sub
DVI-D to HDMI or HDMI to HDMI
For HDMI EDIDFor Analog EDID
Item
Manufacturer ID
Version
Revision
Condition
GSM
Digital : 1
Digital : 3
Data(Hex)
1E6D
01
03
Page 12
- 13 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
(1) FHD RGB EDID Data (CS : 1D)
(2) FHD HDMI EDID Data (CS : D739)
(3) FHD HDM2 EDID Data (CS : D739)
(4) HD RGB EDID Data (CS : 93)
(5) HD HDMI1 EDID Data (CS : 7AD5)
(6) HD HDMI2 EDID Data (CS : 7AD5)
(7) HD HDMI3 EDID Data (CS : 7AB5)
(8) ASCII Code
Page 13
- 14 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.6. V-COM Adjust(Only LGD(M+S) Module)
- Why need Vcom adjustment?
A The Vcom (Common Voltage) is a Reference Voltage of
Liquid Crystal Driving.
-> Liquid Crystal need for Polarity Change with every frame.
- Adjust sequence
· Press the PIP key of th ADJ remote control.(This PIP key is
hot key to enter the VCOM adjusting mode)
(Or After enter Service Mode by pushing “ADJ” key, then
Enter V-Com Adjust mode by pushing “
G” key at “10. V-
Com”
· As pushing the right or the left key on the remote control,
and find the V-COM value which is no or minimized the
Flicker. (If there is no flicker at default value, Press the exit
key and finish the VCOM adjustment.)
· Push the “OK” key to store value. Then the message
“Saving OK” is pop.
· Press the exit key to finish VCOM adjustment.
(Visual Adjust and control the Voltage level)
· V-COM default value is different from module.
1) 32LD450 : 417
2) 37LD450 : 432
3) 42LD450 : 433
4.7. Outgoing condition Configuration
- When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then Automatically turn off.
(Must not AC power OFF during blinking)
4.8. Internal pressure
Confirm whether is normal or not when between power
board’s ac block and GND is impacted on 1.5 kV(dc) or 2.2
kV(dc) for one second.
Row Li ne
Column Line
CLC
CST
Panel
S
Y
S
T
E
M
Gat e Driv e IC
Source D r ive I C
Circuit Block
Tim i ng
Cont r o lle r
Pow er
Blo ck
V
COM
Gamma
Ref erence V oltage
Gamm a Reference
Volta ge
Data (R,G ,B) & C ont rol s ignal
Control si gnal
Data (R,G,B ) &
Control si gnal
In terf ace
TFT
Pow er n p ut
Power Input
n p
Da ta I n put
V
COM
Liquid
Crystal
V
COM
Page 14
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
300
200
530
810
400
510
120
500
A4
A2
A5
A10
900
910
800
LV1
LV2
540
521
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED V EW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Page 15
NC 1
NC 2
NC 3
NC 4
NC 5
NC 6
NC 7
NC 8
VCC 1
VSS 1
NC 9
NC 10
NC 11
NC 12
NC 13
NC 14
NC 15
/PF WP
R/B
RE
CE
CLE
ALE
WE
WP
NAND FLASH MEMORY
+3 5V ST
IC102 *1
HY27US08121B TPCB
512MBIT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
/PF CE0
H Serial Flash
L NAND Flash
/PF CE1
H 16 bit
L 8 bit
R103
OPT
R101
3 3K
3 3K
R102
/F RB
/PF OE
/PF CE0
+3 3V Normal
10K
OPT
R104
0
B
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
/PF CE1
C
Q101
KRC103S
E
NC 28
NC 27
NC 26
NC 25
I/O7
I/O6
I/O5
I/O4
NC 24
NC 23
PRE
VCC 2
VSS 2
NC 22
NC 21
NC 20
I/O3
I/O2
I/O1
I/O0
NC 19
NC 18
NC 17
NC 16
PF ALE
/PF WE
OPT
R105
1K
OPT
R106
VDD 1
VSS 1
NC 10
NC 11
NC 12
NC 13
NC 14
NC 15
1K
NC 1
NC 2
NC 3
NC 4
NC 5
NC 6
NC 7
NC 8
NC 9
R1081K
RB
R
E
CL
AL
W
WP
1K
R107
OPT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
+3 3V Normal
R109 3 9K
C101
0 1uF
IC102 *2
NAND01GW3B2CN6E
1GBIT
NC 1
NC 2
NC 3
NC 4
NC 5
NC 6
R/B
NC 7
NC 8
VCC 1
VSS 1
NC 9
NC 10
CLE
ALE
NC 11
NC 12
NC 13
NC 14
NC 15
1
2
3
4
5
6
7
RE
8
CE
9
10
11
12
13
14
15
16
17
WE
18
WP
19
20
21
22
23
24
IC102
HY27UF082G2B TPCB
2GBIT
NC 29
48
NC 28
47
NC 27
46
NC 26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC 25
40
NC 24
39
NC 23
38
VDD 2
37
VSS 2
36
NC 22
35
NC 21
34
NC 20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC 19
28
NC 18
27
NC 17
26
NC 16
25
+3 3V Normal
NC 29
48
NC 28
47
NC 27
46
NC 26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC 25
40
NC 24
39
NC 23
38
VCC 2
37
VSS 2
36
NC 22
35
NC 21
34
NC 20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC 19
28
NC 18
27
NC 17
26
NC 16
25
S7M_NON_DIVX & MS10
IC101 *2
LGE107 (S7M Non Divx/RM)
FC DD 3 0DD 2 NC
A1
FC DD 3 1DD 2 A6
FC DD 3 2DD 2 A7
E
FC DD 3 3DD 2 A1
FC DD 3 4DD 2 CAZ
FC DD 3 5DD 2 A10
A1
FC DD 3 6DD 2 A0
FC DD 3 7DD 2 A5
FC DD 3 8DD 2 A2
D
FC DD 3 9DD 2 A9
FC DD 3 1/D R2 A1
A1
FC DD 3 1/D R2 A4
FC DD 3 1/D R2 A8
F
FC DD 3 A/D R2 B2
FC DD 3 A/D R2 OT
D
FC DD 3 A/D R2 A2
A1
FC DD 3 CK/ D 2 CLK
A1
FC DD 3 K/D R2 RSZ
FC DD 3 CKZ D R2MC KZ
E
FC DD 3 D/D R2 B1
FC DD 3 AZ/ D 2 EZ
F
FC DD 3 AZ/ D 2 KE
FC DD 3 E/D R2 B0
E
FC DD 3 EET / DR2A3
F
FC DD 3 QL/ D 2 QS0
FC DD 3 QLB D R2DQ B0
E
FC DD 3 QU/ D 2 QS1
F
FC DD 3 QUB D R2DQ B1
A1
FC DD 3 M/D R2 D7
F
FC DD 3 M/D R2 D11
FC DD 3 Q0/ D 2 Q6
A1
FC DD 3 Q1/ D 2 Q0
FC DD 3 Q2/ D 2 Q1
FC DD 3 Q3/ D 2 Q2
E
FC DD 3 Q4/ D 2 Q4
FC DD 3 Q5/ D 2 C
F
FC DD 3 Q6/ D 2 Q3
FC DD 3 Q7/ D 2 Q5
A1
FC DD 3 Q0/ D 2 Q8
FC DD 3 Q1/ D 2 Q14
FC DD 3 Q2/ D 2 Q13
MIPS no EJ NOR8 4’h3 (MIPS as host No EJ PAD Byte mode NAND flash )
MIPS EJ1 NOR8 4’h4 (MIPS as host EJ use PAD1 Byte mode NAND flash )
MIPS EJ2 NOR8 4’h5 (MIPS as host EJ use PAD2 Byte mode NAND flash )
B51 Secure no scramble 4’hb (8051 as host Internal SPI flash secure boot no scramble)
B51 Sesure scramble 4’hc (8051 as host Internal SPI flash secure boot with scarmble)
C102
10uF
C103
0 1uF
AR101
22
PCM A[0 7]
PCM A[7]
PCM A[6]
PCM A[5]
PCM A[4]
R115
AR102
PCM A[3]
PCM A[2]
PCM A[1]
PCM A[0]
22
R116
& MS10 :Region that support MS10(ex:DTV Country)
& DD :Region that support only Dolby Digital(ex:AISA Analog/KOREA)
ACP/ L 3PR D[]
ACM/ L 3NR D[]
AP/ L 0PR D[]
AM/ L 0NR D[]
AP/ L 1PR D[]
AM/ L 1NR D[]
AP/ L 2PR D[]
AM/ L 2NR D[]
AP/ L 4PR D[]
AM/ L 4NR D[]
4PRL 5 /GE N[]
4MRL 5 /GE N[]
CP/ CO 1/G EN[ ]
CM/ CO 1/G EN[ ]
0PRL 6 /GE N[]
0MRL 6 /GE N[]
1PRL 7 /GE N[]
1MRL 7 /GE N[]
2PRL 8 /GE N[]
2MRL 8 /GE N[]
3PTC N 1/L E[]
3MTC N 0/L E[]
B4/T O 9/L E[]
B4/T O 8/L E[]
C0/L V P/L E[]
C0/L V N/L E[]
C1/L V P/L E[]
C1/L V N/L E[]
C2/L V P/L E[]
C2/L V N/L E[]
FRCG I 0/A T X
FRCG I 9/A T X
S7M_NON_DIVX & DD
IC101 *3
LGE107B LF 1 (S7M Non Divx/RM/MS10)
FC DD 3 0DD 2 NC
ACP/ L 3PR D[]
W5
U5
V5
Y6
Y4
A26
A25
A26
A24
A24
A23
CK/ LV P
CK/ LV N
A26
A25
A23
C3/ LV P
C3/ LV N
A22
C4/ LV P
C4/ LV N
A19
CK/ CO 5
CK/ CO 4
A21
D0/ LV P
D0/ LV N
D1/ LV P
A20
D1/ LV N
D2/ LV P
A20
D2/ LV N
D3/ CO 3
D3/ CO 2
A18
D4/ CO 1
D4/ CO 0
A22
A23
A14
FRC PI 1
FRC PI 3
Y6
FRC PI 8
A14
RCG IO 0
FC 2M A
A15
FC 2M K
FC 2S A
A11
FC 2S K
A15
FC PW 0
FC PW 1
A1
E
A1
D
A1
F
D
A1
A1
E
F
E
F
E
F
A1
F
A1
E
F
A1
D
E
E
1
FC DD 3 1DD 2 A6
FC DD 3 2DD 2 A7
FC DD 3 3DD 2 A1
FC DD 3 4DD 2 CAZ
FC DD 3 5DD 2 A10
FC DD 3 6DD 2 A0
FC DD 3 7DD 2 A5
FC DD 3 8DD 2 A2
FC DD 3 9DD 2 A9
FC DD 3 1/D R2 A1
FC DD 3 1/D R2 A4
FC DD 3 1/D R2 A8
FC DD 3 A/D R2 B2
FC DD 3 A/D R2 OT
FC DD 3 A/D R2 A2
FC DD 3 CK/ D 2 CLK
FC DD 3 K/D R2 RSZ
FC DD 3 CKZ D R2MC KZ
FC DD 3 D/D R2 B1
FC DD 3 AZ/ D 2 EZ
FC DD 3 AZ/ D 2 KE
FC DD 3 E/D R2 B0
FC DD 3 EET / DR2A3
FC DD 3 QL/ D 2 QS0
FC DD 3 QLB D R2DQ B0
FC DD 3 QU/ D 2 QS1
FC DD 3 QUB D R2DQ B1
FC DD 3 M/D R2 D7
FC DD 3 M/D R2 D11
FC DD 3 Q0/ D 2 Q6
FC DD 3 Q1/ D 2 Q0
FC DD 3 Q2/ D 2 Q1
FC DD 3 Q3/ D 2 Q2
FC DD 3 Q4/ D 2 Q4
FC DD 3 Q5/ D 2 C
FC DD 3 Q6/ D 2 Q3
FC DD 3 Q7/ D 2 Q5
FC DD 3 Q0/ D 2 Q8
FC DD 3 Q1/ D 2 Q14
FC DD 3 Q2/ D 2 Q13
FC DD 3 Q3/ D 2 Q12
FC DD 3 Q4/ D 2 Q15
FC DD 3 Q5/ D 2 Q9
FC DD 3 Q6/ D 2 Q10
FC DD 3 Q7/ D 2 QM1
FC DD 3 CDD 2 DQ0
FC RE T
FC TE TPN
ACM/ L 3NR D[]
AP/ L 0PR D[]
AM/ L 0NR D[]
AP/ L 1PR D[]
AM/ L 1NR D[]
AP/ L 2PR D[]
AM/ L 2NR D[]
AP/ L 4PR D[]
AM/ L 4NR D[]
4PRL 5 /GE N[]
4MRL 5 /GE N[]
CP/ CO 1/G EN[ ]
CM/ CO 1/G EN[ ]
0PRL 6 /GE N[]
0MRL 6 /GE N[]
1PRL 7 /GE N[]
1MRL 7 /GE N[]
2PRL 8 /GE N[]
2MRL 8 /GE N[]
3PTC N 1/L E[]
3MTC N 0/L E[]
B4/T O 9/L E[]
B4/T O 8/L E[]
C0/L V P/L E[]
C0/L V N/L E[]
C1/L V P/L E[]
C1/L V N/L E[]
C2/L V P/L E[]
C2/L V N/L E[]
CI TS DATA[0]
CI TS DATA[1]
CI TS DATA[2]
CI TS DATA[3]
CI TS DATA[4]
CI TS DATA[5]
CI TS DATA[6]
CI TS DATA[7]
FE TS DATA[0]
FE TS DATA[1]
FE TS DATA[2]
FE TS DATA[3]
FE TS DATA[4]
FE TS DATA[5]
FE TS DATA[6]
FE TS DATA[7]
R160
1K
5V DET HDMI 1
5V DET HDMI 2
5V DET HDMI 4
5V DET HDMI 3
SIDEAV DET
WIRELESS DL RX
WIRELESS DL TX
ET RXER
FRC RESET
SC1/COMP1 DET
ERROR OUT
MODEL OPT 0
M REMOTE RX
M REMOTE TX
USB1 OCD
USB1 CTL
HP DET
CONTROL ATTEN
MODEL OPT 6
MODEL OPT 1
/FLASH WP
MODEL OPT 2
TUNER RESET
DEMOD RESET
AV CVBS DET
SPI SCK
R15133
SPI SDI
SPI SDO
/PIF SPI CS
URSA degug port
UART FRC RX
UART FRC TX
for WIRELESS READY
for ETHERNET PHY
/SPI CS
for SERIAL FLASH
CI TS CLK
CI TS VAL
CI TS SYNC
CI TS DATA[0 7]
FE TS CLK
FE TS VAL ERR
FE TS SYNC
FE TS DATA[0 7]
URSA DEBUG
P3903
12505WS 03A00
1
2
3
from CI SLOT
Internal demod out
/External demod in
FRC SCL
FRC SDA
4
URSA DEBUG
P3904
12505WS 03A00
1
2
3
4
HDCP EEPROM
R113
4 7K
CAT24WC08W-T
A0
1
$0.199
A1
2
A2
3
VSS
4
IC103
8
7
6
5
VCC
WP
SCL
SDA
R127 4 7K
+3 3V Normal
R128
R129 22
C107
0 1uF
EEPROM
Addr:10101--
IC104
M24M01-HRMN6TP
NC
22
I2C SCL
I2C SDA
E1
E2
VSS
8
1
2
7
A0’h
3
6
4
5
+3 3V Normal
C105
0 1uF
VCC
WP
SCL
SDA
C104
8pF
OPT
R11122
R11222
C106
8pF
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
I2S OUT SD/GPIO182
I2S OUT SD1/GPIO183
I2S OUT SD2/GPIO184
I2S OUT SD3/GPIO185
I2S OUT WS/GPIO180
LINE IN 0L
LINE IN 0R
LINE IN 1L
LINE IN 1R
LINE IN 2L
LINE IN 2R
LINE IN 3L
LINE IN 3R
LINE IN 4L
LINE IN 4R
LINE IN 5L
LINE IN 5R
LINE OUT 0L
LINE OUT 2L
LINE OUT 3L
LINE OUT 0R
LINE OUT 2R
LINE OUT 3R
MIC DET IN
HP OUT 1L
HP OUT 1R
ET RXD0
ET TXD0
ET RXD1
ET TXD1
ET REFCLK
ET TX EN
ET MDC
ET MDIO
ET CRS
AVLINK
TESTPIN
U3 RESET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NO FRC
50/60Hz LVDS
LVDS
DDR 256MB
VIFP
VIFM
IP
IM
QP
QM
IFAGC
DM P0
DP P0
DM P1
DP P1
MICCM
MICIN
AUCOM
VRM
VAG
VRP
IRINT
RESET
LOW
HD
W2
W1
V2
V1
Y2
Y1
U3
V3
Y5
Y4
U1
U2
R3
T3
T2
T1
G14
G13
B7
A7
AF17
AE17
F14
F13
F15
D20
E20
D19
F18
E18
D18
E19
N1
P3
P1
P2
P4
P5
R6
T6
U5
V5
U6
V6
U4
W3
W4
V4
Y3
W5
R4
OPT
C234
T5
C235
R5
OPT
T4
P7
R7
P6
CM2012F5R6KT
R1
L203
L2055 6uH
R2
CM2012F5R6KT
E21
E22
R27833
D21
F21
R28033
E23
D22
R28233
F22
R28333
D23
R28433
F23
R28533
F8
G8
K8
A4
Y17
10K
R4017
OPT
NO FRC LOW LOW
U3 INTERNAL HIGH LOW
U3 EXTERNAL HIGH HIGH
PWIZ TCON with LG FRC HIGH HIGH
TP201
TP202
TP203
TP204
R4032
R4033
DEMOD OPT
DEMOD OPT
R287
R4028
R296100
R4029
2 2uF
2 2uF
2 2uF
2 2uF
2 2uF
OPT
2 2uF
OPT
C249
4 7uF
OPT
R298100
FRC
R205
10K
0
0
R29122
R29222
1M
OPT
0
0
C253
1uF
+3 3V Normal
NEC SDA
COMP2 DET
NEC SCL
OPT
C256
0 1uF
EPHY RXD0
EPHY TXD0
EPHY RXD1
EPHY TXD1
EPHY REFCLK
EPHY EN
EPHY MDC
EPHY MDIO
EPHY CRS DV
3’d5 boot from internal SRAM
3’d6 boot from EEPROM
3’d7 boot form SPI flash
+3 3V Normal
R322
1K
R323
R321
1K
1K
R320
1K
OPT
OPT
R325
R324
R318
R319
1K
1K
1K
1K
OPT
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
DDR3(FRC)
Ver. 1.4
3
Page 18
RL ON
C401
100uF
16V
+12V/+15V
C402
100uF
16V
R401
10K
+3 5V ST
C404
0 1uF
<OS MODULE PIN MAP>
PIN No
18
20
24
23
C
Q401
B
2SC3052
E
L404
MLB 201209 0120P N2
C406
0 1uF
16V
L402
MLB 201209 0120P N2
16V
LGD(PSU)
or LIPS
INV_ON
VBR-A
22
PWM_DIM
Err_out
GND
FROM LIPS & POWER B/D
+3 5V ST
RT1P141C T112
Q402
R406
4 7K
C407
0 1uF
16V
A-DIM
PWM_DIM
INV_ON
C408
0 1uF
16V
CMO
NC
GND
3
1
R476
0
2
POWER_23_GND
NORMAL EXPEPT 32
R478
AUO
INV_ON
Err_out
INV_ON
52/60 ERROR
NC
PWM_DIM
GNDGNDGND
OLP
P403
FW20020 24S
PWR ON
24V
GND
GND
3 5V
3 5V
GND
GND
12V
12V
12V
GND/P DIM2
C412
0 1uF
0
POWER_23_SCAN_BLK2
C484
1uF
SCAN_BLK2
SHARP
(PSU) (PSU)(PSU)(PSU)
26/32HD NC
26/32/52 PWM
60 NC
26/32/52 GND
60 PWM
1
1
1
3
3
3
5
5
5
7
7
7
9
9
9
11
11
11
13
13
13
15
15
15
17
17
17
19
19
19
21
2122
2122
23
2324
2324
OPT
16V
25V
OPT
IPS-@
INV_ON
Err_out
PWM_DIM
NORMAL 32
P404
FM20020 24
24V
2
2
2
24V
4
4
4
GND
6
6
6
GND
8
8
8
3 5V
10
10
10
3 5V
12
12
12
GND
14
14
14
GND/V sync
16
16
16
INV ON
18
18
18
A DIM
20
20
20
P DIM1
22
Err OUT
24
25
25
SLIM 32 52
P401
SMAW200 H24S2
NC
L407
MLB 201209 0120P N2
POWER 16 V SYNC
POWER 18 INV CTL
R4120
POWER_16_GND
POWER 24 INV CTL
R475
0
POWER_24_GND
POWER 24 PWM DIM
POWER 22 PWM DIM
C418
0 1uF
50V
R477
0
R415
100
R425
100
POWER 20 PWM DIM
R479
0R472
0
0R471
C416
OPT
0 1uF
16V
POWER 20 ERROR OUT
POWER 24 ERROR OUT
R420
V SYNC
+3 3V Normal
R419
1K
C
R418
6 8K
OPT
E
R484
0
OPT
C419
1uF
25V
100R437
100
+24V
C426
68uF
35V
R421
10K
B
Q405
2SC3052
POWER 18 A DIM
0
R451
POWER 22 A DIM
R485 0
POWER 20 A DIM
0
R453
C419 *1
3 9K
PWM PULL DOWN
R422 0
OPT
R470
+3 3V Normal
+3 5V ST
R426
OPT
10K
R427
10K
OPT
SCAN BLK1/OPC OUT
OPT
0
OPT
R486
4 7K
ERROR OUT
INV CTL
A DIM
PWM DIM
OPC OUT
+12V/+15V
L412
PANEL CTL
1 AK10
Placed on SMD TOP
C461
C IN
22uF
10V
+3 5V ST
+3 3V Normal
OPT
R430
10K
R429
47K
B
CIC21J501NE
L420
R449
11K
1/10W
5%
VIN
C432
0 1u
16V
R435
22K
C438
0 1uF
16V
R439
R440
B
33K
5 6K
C
Q407
2SC3052
E
R431
22K
C
Q406
2SC3052
E
C436
0 01uF
25V
S7M DDR 1.5V
C463
100pF
50V
Replaced Part
IC407
MP2212DN
R2
GND
IC402
AZ2940D 2 5TRE1
3
1
Vd=550mV
2
GND
FB
1
2
3A
IN
3
BS
4
VOUT
R452
10
R473
R4550
1/10W
1%
1
8
7
6
5
C403
10uF
10V
EN/SYNC
SW 2
SW 1
VCC
C442
10uF
16V
OPT
R457
10K
Close to IC
10V
C443
4 7uF
1%
C465
1uF
16V
Q409
AO3407A
D
S
G
C451
1uF
25V
OPT
R1
10K
R464
L423
3 6uH
NR8040T3R6N
C467
0 1uF
50V
+2.5V/+1.8V
+2 5V Normal
C440
0 1uF
16V
PANEL_POWER
New item
POWER ON/OFF1
C472
22uF
10V
Placed on SMD TOP
300 mA
C455
0 1uF
16V
PANEL DISCHARGE RES
1074 mA
Vout=0 8*(1+R1/R2)
+1.5V_DDR
0 1uF
PANEL VCC
R407
R405
2 2K
2 2K
PANEL DISCHARGE RES
C476
ST 3 5V > 3 375V
20V >3 51V
24V >3 64V
12V >3 58V
18 5V >3 5V
+24V
POWER +24V
POWER +24V
+12V/+15V
R482
R403
1%
24K
POWER +20V
1%
4 3K
POWER +20V
L416
C457
C459
10uF
10uF
25V
25V
Vout=(1+R1/R2)*0.8
+12V/+15V
L417
C458
C460
10uF
10uF
25V
25V
Vout=0.8*(1+R1/R2)
+24V
R482-*1
24K
R403-*1
5 1K
R446
1%
5%
30K
+12V/+15V
OPT
R448
1%
R447
R482-*2
24K
POWER +18 5V
R403-*2
POWER +18 5V
Only for 32/37LED MODEL
12K
5 1K
5 6K
1%
PD_+12V
1/16W
5%
1%
1%
PD_+12V
+3 5V ST
R4501K1%
R447-*1
27K
VCC
PD_+3 5V
1%
PD_+3 5V
R404
100K
IC409
NCP803SN293
3
GND
+3.3V_Normal
IC405
AOZ1073AIL
PGND
AGND
1
VIN
2
3A
3
FB
4
LX 2
8
LX 1
7
POWER ON/OFF2 2
EN
6
R456
COMP
5
9 1K
R454
+5V_Normal
IC406
AOZ1072AI
PGND
VIN
AGND
1
2
3
FB
4
2A
8
7
6
5
+3 5V ST > 3 375V
R488
100K
IC408
NCP803SN293
VCC
3
1
GND
PD +12V
RESET
2
1
PD +12V
L421
3 6uH
NR8040T3R6N
10K
2200pF
C464
LX 2
LX 1
EN
COMP
R459
12K
R458
10K
NR8040T3R6N
+3 5V ST
R463
10K
OPT
R402
100
RESET
2
PD +12V
R480
100
Power_DET
1934 mA
1%
R460
27K
4 7K
R461
C423
100pF
R462
10K
L422
3 6uH
POWER ON/OFF2 2
2200pF
C466
C469
R1
22uF
1%
10V
OPT
50V
1%
R2
MAX 1A
5%
R465
51K
R1
1%
1 5K
R466
OPT
C427
100pF
50V
1%
R2
R467
10K
C474
0 1uF
CIC21J501NE
C473
0 1uF
16V
C471
22uF
10V
POWER DET
+3 3V Normal
L424
C485
0 1uF
16V
+5V Normal
C477
0 1uF
16V
+12V/+15V
C405
10uF
25V
L401
+5V_USB
IC401
MP8706EN-C247-LF-Z
IN
1
SW 1
2
SW 2
3A
BST
3
4
L406
3 6uH
NR8040T3R6N
C410
0 1uF
R487
22
8
7
6
5
GND
VCC
FB
EN/SYNC
C414
1uF
50V
R410
10K
POWER ON/OFF2 1
R411
10K
+5V USB
OPT
C482
100pF
50V
MAX 2000mA
OPT
1%
R416
33K
C429
100pF
R1
50V
1%
R417
6 2K
R2
C420
22uF
10V
C424
0 1uF
16V
+5V USB
Vout=(1+R1/R2)*0.8
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MODEL OPTION
PIN NO
MODEL OPT 0
LOWLOWLOW
HIGHHIGH
HIGH
HIGH
HIGH
B/L LED
8
11
PWM BUZZ/IIC LED
30
TOUCH KEYTACT KEY
31GPIO LED
MODEL OPT 1
LOW
HIGH
HIGH
LOWLOW
HIGH
MODEL OPT 2
HIGH
LOWLOW
LOWPIN NAME
B/L LAMP
PWM LED
NON GPIO LED
MODEL OPT 3
LOW
LOW
LOW
LOW
HIGH
HIGH
LD350/450/550
19/22/26LE3300(5500)
32/37/42/47/55LE5300(10)
LD420
LE7300
TBD
P17/TI50/TO50
P31/INTP2/OCD1A
M_REMOTE
NON_M_REMOTE
R10 62 22
R10 61 22
RF_ENABLE
P16/TOH1/INTP5
22
R10 69
OCD1A
POWER_DET
LED_B/LG_LOGO
IR
22
R10 68
LED_R/BUZZ
NEC_ISP_Rx
P11/SL10/RXD0
P10/SCK10/TXD0
22
22
R10 41
R10 37
22
R10 36
NEC_RXD
NEC_ISP_Tx
NEC_TXD
POWER_ON/OFF2_2
R1044 10K
R1045 10K
R1083 10K
+3 5V ST
OPT
OPT
OPT
C1009 1uF
GP2_Saturn7M
MICOM
Ver. 1.4
5
Page 20
CONTROL
IR & LED
+3 5V ST
EYEQ/TOUCH KEY
R2411
LED R/BUZZ
50V
100
EYEQ/TOUCH KEY
100
R2412
R24131 5K
R2410
100
C2407
100pF
50V
C2408
1000pF
50V
OPT
C2409
1000pF
50V
OPT
C2410
0 1uF
D2405
5 6B
R2414
1 5K
P2401
5 6B
D2403
5 6B
D2404
JP2407
JP2408
OPT
16V
JP2411
OPT
R2416
10K
12507WR 12L
1
2
3
4
5
6
7
JP2409
JP2410
8
9
10
11
12
13
LED B/LG LOGO
L2404
BLM18PG121SN1D
C2405
0 1uF
16V
NEC EEPROM SCL
NEC EEPROM SDA
C2406
1000pF
R2405
R2404
10K
10K
1%
1%
R2401
100
KEY1
R2402
100
KEY2
+3 5V ST
R2425
Q2406
2SC3052
47K
R2430
C
B
R2427
0
OPT
R2428
IR
22
+3 5V ST
R2431
47K
R2426
3 3K
+3 5V ST
OPT
COMMERCIAL
IR OUT
Commercial
R2403
22
Commercial EU
Commercial EU
Q2401
2SC3052
R2429
47K
10K
C
B
Q2405
2SC3052
BLM18PG121SN1D
L2402
BLM18PG121SN1D
+3 5V ST
R2406
47K
C
B
Commercial EU
R2422
0
Commercial US
L2401
+3 5V ST
R2407
10K
Commercial
C2401
0 1uF
R2408
Commercial
Q2402
2SC3052
C2402
0 1uF
L2403
BLM18PG121SN1D
C2403
0 1uF
+3 5V ST
47K
C
B
Commercial
16V
R2409
47K
D2401
5 6V
AMOTECH
D2402
AMOTECH
C2404
1000pF
50V
+3 3V Normal
5 6V
Zener Diode is
WIRELESS
IR PASS
R2417
WIRELESS
+3 5V ST
R2420
47K
WIRELESS
22
R2418
C
Q2404
B
2SC3052
WIRELESS
WIRELESS
+3 5V ST
R2419
47K
WIRELESS
10K
Q2403
2SC3052
WIRELESS
R2421
47K
C
B
WIRELESS
close to wafer
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
T-CON
Ver. 2.1
7
Page 22
HDMI_1
SHIELD
$0.253
HDMI_1
EAG59023302
JK802
HDMI EEPROM
5V HDMI 1
+5V Normal
A1CA2
ENKMC2838 T112
R874
10K
R884
4 7K
5V HDMI 2
10K
R873
R885
4 7K
5V HDMI 3
R872
R886
4 7K
R888
4 7K
A2
10K
+5V Normal
R889
4 7K
R890
4 7K
D821
A1
ENKMC2838 T112
D822
C
+5V Normal
A1CA2
ENKMC2838 T112
D823
EDID WP
DDC SCL 1
DDC SDA 1
EDID WP
DDC SCL 2
DDC SDA 2
EDID WP
DDC SCL 3
DDC SDA 3
5V HDMI 1
20
19
18
17
16
15
14
13
12
11
CK+
10
D0
9
D0 GND
8
D0+
7
D1
6
D1 GND
5
D1+
4
D2
3
D2 GND
2
D2+
1
R896
1K
R804
1 8K
D802
5V DET HDMI 1
3 3K
R802
C802
0 1uF
16V
JP803
JP804
R825
R826
R824
R847
R846
R845
R844
R843
R842
R850
R848
HDMI_3
C
Q802
2SC3052
22
22
100
0
0
0
0
0
0
0
0
R830
B
10K
E
HPD1
DDC SDA 1
DDC SCL 1
HDMI CEC
CK HDMI1
CK+ HDMI1
D0 HDMI1
D0+ HDMI1
D1 HDMI1
D1+ HDMI1
D2 HDMI1
D2+ HDMI1
$0.253
HDMI_3
5V HDMI 3
SHIELD
20
19
18
17
16
15
14
13
12
11
10
EAG59023302
9
8
7
6
5
4
3
2
1
JK804
CK+
D0
D0 GND
D0+
D1
D1 GND
D1+
D2
D2 GND
D2+
R894
1K
R838
1 8K
D812
5V DET HDMI 3
3 3K
R836
C804
0 1uF
16V
JP807
JP808
R859
R851
R860
R852
R821
R814
R819
R818
R820
R812
R816
C
Q804
2SC3052
22
22
100
0
0
0
0
0
0
0
0
R864
B
10K
E
HPD3
DDC SDA 3
DDC SCL 3
HDMI CEC
CK HDMI3
CK+ HDMI3
D0 HDMI3
D0+ HDMI3
D1 HDMI3
D1+ HDMI3
D2 HDMI3
D2+ HDMI3
HDMI 1
IC801
AT24C02BN 10SU 1 8
A0
1
$0.055
A1
2
A2
3
GND
4
HDMI 2
IC802
AT24C02BN 10SU 1 8
A0
1
$0.055
A1
2
A2
3
GND
4
AT24C02BN 10SU 1 8
A0
1
$0.055
A1
2
A2
3
GND
4
HDMI 3
IC803
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
JP809
R876 22
R875 22
JP810
R878 22
R877 22
JP811
C806
0 1uF
0 1uF
R879 22
R880 22
C807
C808
0 1uF
HDMI_2
SHIELD
20
$0.253
HDMI_2
EAG59023302
JK801
5V HDMI 2
R895
19
18
17
16
15
14
13
12
11
CK+
10
D0
9
D0 GND
8
D0+
7
D1
6
D1 GND
5
D1+
4
D2
3
D2 GND
2
D2+
1
1K
R803
1 8K
D801
5V DET HDMI 2
R801
3 3K
C801
0 1uF
16V
JP802
JP801
R805 22
R806
R815 100
R831
R834
R822
R832
R827
R829
R823
R833
C
R828
Q801
2SC3052
22
0
0
0
0
0
0
0
0
10K
B
E
HPD2
DDC SDA 2
DDC SCL 2
HDMI CEC
CK HDMI2
CK+ HDMI2
D0 HDMI2
D0+ HDMI2
D1 HDMI2
D1+ HDMI2
D2 HDMI2
D2+ HDMI2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDE_HDMI
JACK GND
20
$0.253
19
18
17
16
15
14
13
12
11
10
EAG42463001
9
HDMI_SIDE
8
7
6
5
4
3
2
1
JK803
CK+
D0
D0 GND
D0+
D1
D1 GND
D1+
D2
D2 GND
D2+
5V HDMI 4
R897
1K
R837
1 8K
D811
5V DET HDMI 4
R835
3 3K
JP806
C803
0 1uF
16V
JP805
R839 22
R840
R841
R810
R807
R817
R809
R813
R811
R849
R808
+5V Normal
5V HDMI 4
A2
A1
R871
10K
R887
4 7K
+3 5V ST
ENKMC2838 T112
D824
C
R891
4 7K
R857
68K
OPT
CEC ON/OFF
R853
68K
Ver. 1.2
8
EDID WP
DDC SCL 4
DDC SDA 4
R858
0
CEC REMOTE S7
CEC REMOTE NEC
C
Q803
2SC3052
22
100
0
0
0
0
0
0
0
0
R862
B
10K
E
HPD4
DDC SDA 4
DDC SCL 4
HDMI CEC
CK HDMI4
CK+ HDMI4
D0 HDMI4
D0+ HDMI4
D1 HDMI4
D1+ HDMI4
D2 HDMI4
D2+ HDMI4
For CEC
HDMI CEC
OPT
D803
AVRL161A1R1NT
GND
OPT
D826
AVRL161A1R1NT
GND
HDMI SIDE
IC804
AT24C02BN 10SU 1 8
A0
1
$0.055
A1
2
A2
3
GND
4
D804
D825
VCC
8
WP
7
SCL
6
SDA
5
68K
R854
68K
R892
R855
OPT
R883
0
SBD
G
OPT
0
SBD
G
JP812
R881 22
R882 22
Q806
BSS83
Q805
BSS83
C809
0 1uF
+3 3V Normal
R856
10K
C805
0 1uF
16V
GND
R893
10K
C810
0 1uF
16V
GND
GP2_Saturn7M
HDMI
Page 23
COMMON AREA
New Item Development
EARPHONE BLOCK
EXCEPT CHINA HOTEL OPT
HP LOUT
2 X19
HP ROUT
2 X19
C1118
10uF
C1115
16V
1000pF
50V
OPT
EXCEPT CHINA HOTEL OPT
C1119
10uF
16V
C1116
1000pF
50V
OPT
R1125
1K
R1128
1K
Q1101
MMBT3904 (F)
Q1102
MMBT3904 (F)
C
B
E
C
B
E
MMB 3904 (F)
B
MMB 3904 (F)
B
E
Q1104
C
HP DET
E
Q1103
C
+3 3V Normal
R1130
10K
R1155
1K
JK3301
KJA PH 0 0177
5GND
4L
3DETECT
1R
SPK R+ HOTEL
2 X19
SPK R HOTEL
2 X19
C
Q1105
ISA1530AC1
E
B
R1129
3 3K
+3 5V ST
C
E
B
Q1106
2SC3052
SIDE HP MUTE
PC AUDIO
JK1102
PEJ027 01
E SPRING
3
T TERMINAL1
6A
B TERMINAL1
7A
R SPRING
4
T SPRING
5
B TERMINAL2
7B
T TERMINAL2
6B
D1101
AMOTECH
5 6V
OPT
D1102
AMOTECH
5 6V
OPT
C1107
100pF
50V
C1108
100pF
50V
R1102
470K
R1103
470K
R1107
15K
R1108
15K
R1110
10K
10K
R1111
R1112
0
R1113
0
PC R IN
PC L IN
2 S16
2 S16
SPDIF OPTIC JACK
5 15 Mstar Circuit Application
SPDIF OUT
2 X18
OPT
4 7K
R1152
A
B
GND
IC1104
NL17SZ00DFT2G
OPT
1
2
3
D1116
5 6V
OPT
+5V Normal
EDID WP
RGB DDC SCL
RGB DDC SDA
+3 3V Normal
R1146
10K
D1117
5 6V
R1147
1K
DSUB DET
+3 3V Normal
VCC
5
C1117
0 1uF
16V
OPT
R1126
Y
4
22
OPT
R1127
0
C1131
0 1uF
16V
VINPUT
C1121
100pF
50V
GND
Fiber Optic
1
VCC
2
JK1103
JST1223-001
3
4
FIX_POLE
RGB PC
DSUB VSYNC
DSUB HSYNC
DSUB B+
DSUB B
DSUB G+
DSUB G
DSUB R+
DSUB R
R1133
75
0
R1135
75
0
R1137
75
0
C1122
68pF
50V
OPT
R1134
R1136
R1138
GND
IC1105
AT24C02BN-10SU-1 8
A0
1
A1
2
A2
3
4
C1123
OPT
C1124
OPT
C1125
OPT
R1148
0
OPT
OPT
OPT
D1115
ENKMC2838 T112
A1
C
A2
4 7K
R1150
0
C1128
18pF
50V
D1113
30V
R1140
4 7K
R1141
22
D1114
5 6V
OPT
R1142
10K
C1129
0 1uF
16V
R1143
22
R1139
VCC
8
WP
7
SCL
6
SDA
5
C1127
18pF
50V
C1126
D1109
68pF
30V
50V
OPT
D1110
30V
D1111
30V
D1112
30V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RED2GREEN3BLUE4GND_15DDC_GND
RED_GND7GREEN GND8BLUE_GND9NC10SYNC_GND
GND 212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK
11
SPG09-DB-010
6
1
JK1104
GP2_Saturn7M
COMMON AREA
SH LED
16
Ver. 1.0
9
Page 24
RS232C
C1101 0 33uF
C1102
0 1uF
C1103
0 1uF
C1104
0 1uF
C1105
0 1uF
DOUT2
RIN2
C1+
C1
C2+
C2
V+
V
IC1101
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
10
5
9
8
7
6
SPG09 DB 009
JK1101
4
3
2
1
S7 RXD1
NEC RXD
S7 TXD1
NEC TXD
R1123
100
R1124
100
OPT
R1122
0
JP1121
JP1122
IR OUT
+3 5V ST
D1107
CDS3C30GTH
30V
C1106
0 1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
+3 5V ST
4 7K
OPT
R1109
4 7K
OPT
R1114
D1108
CDS3C30GTH
30V
R1157 0
R1156
R1154
R1153
0
0
0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RS232C 9PIN
Ver. 1.0GP2_Saturn7M
10
Page 25
(New Item Developmen H:9.2mm)
SIDE_AV
SIDE AV OPT
D3301
30V
SIDE AV OPT
D3302
5 6V
SIDE AV OPT
D3303
5 6V
SIDE AV OPT
D3304
5 6V
PPJ235 01
JK3302
SIDE AV OPT
5A
[YL]E LUG
4A
[YL]O SPRING
3A
[YL]CONTACT
4B
[WH]O SPRING
3C
[RD]CONTACT
4C
[RD]O SPRING
5C
[RD]E LUG
SIDE AV OPT
R3301
75
SIDE AV OPT
SIDE AV OPT
C3301
100pF
SIDE AV OPT
R3303
470K
R3304
470K
SIDE AV OPT
L3303
BLM18PG121SN1D
+3.3V_Normal
SIDE AV OPT
10K
R3302
SIDE AV OPT
L3301
BLM18PG121SN1D
SIDE AV OPT
L3302
BLM18PG121SN1D
SIDE AV OPT
SIDE AV OPT
C3302
100pF
50V
SIDE AV OPT
SIDE AV OPT
C3303
100pF
50V
R3305
1K
SIDE AV OPT
R33 06
10K
R33 07
10K
C3304
100pF
OPT
SIDE AV OPT
R3308
12K
SIDE AV OPT
R3309
12K
SIDEAV CVBS IN
SIDEAV DET
SIDEAV L IN
SIDEAV R IN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
SIDE AV
Ver. 1.0
11
Page 26
WIRELESS DL RX
WIRELESS TX
S7 TXD
WIRELESS READY MODEL
Wireless power
+24V
R2618
IC2601
1
2
3
4
5
6
7
8
R2605
27K
B
WIRELESS
OPT
R2604
22K
C
Q2601
E
0
16
15
14
13
12
11
10
9
WIRELESS PWR EN
WIRELESS
R2601
R2620
WIRELESS
C2601
0 1uF
50V
R2603
10K
WIRELESS
0
MC14053BDR2G
Y1
Y0
Z1
Z
Z0
INH
VEE
VSS
0
C2602
2 2uF
G
Q2602
AO3407A
WIRELESS
VDD
Y
X
X1
X0
A
B
C
R2606
S
D
+3 5V ST
OPT
0
S7 TXD1
S7 RXD1
R2615
WIRELESS
R2619
0
C2603
0 01uF
50V
WIRELESS
R2607
0
1/4W
3216
+3 3V Normal
0
S7 RXD
WIRELESS DETECT
WIRELESS SCL
WIRELESS SDA
WIRELESS RX
WIRELESS TX
OPT
R2608
0
C2604
0 1uF
WIRELESS DL TX
WIRELESS RX
+3 5V ST
IR PASS
OPT
OPT
OPT
4 7K
47K
R2609
R2610
+3 3V Normal
R2612
10K
R2617 1K
WIRELESS SW CTRL
JK2601
KJA PH 3 0168
VCC[24V/20V/17V] 1
VCC[24V/20V/17V] 2
VCC[24V/20V/17V] 3
VCC[24V/20V/17V] 4
VCC[24V/20V/17V] 5
VCC[24V/20V/17V] 6
TP2601
TP2602
DETECT
INTERRUPT
GND 1
RESET
GND 2
I2C SCL
I2C SDA
GND 3
UART RX
UART TX
GND 4
GND 5
GND 6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
IR
18
19
20
21
SHIELD
RS232C & Wireless
WIRELESS_SW_CTRL
HIGH
LOW
SELECT PIN
X1/Y1/Z1
X0/Y0/Z0
From wireless_I2C to micom I2C
OPT
R2602
WIRELESS PWR EN
AMP SDA
AMP SCL
10K
B
OPT
E
C
Q2603
ISA1530AC1
D
Q2604
FDV301N
WIRELESS
STATUS
WIRELESS Dongle connect --> WIRELESS RS232
WIRELESS Dongle Dis_con --> S7 RS232
+3 3V Normal
OPT
G
OPT
S
G
OPT
D
Q2605
FDV301N
R2611 0
R2613
0
WIRELESS
10K
S
R2614
WIRELESS SDA
WIRELESS SCL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Page 28
32_FHD
VGHVGL
R620 *1
22K
1%
TCON 32 FHD
R622 *1
11K
1%
TCON 32 FHD
R621 *1
220K
1%
TCON 32 FHD
R637 *1
51K
1%
TCON 32 FHD
R643 *1
270K
1%
TCON 32 FHD
37_FHD
VGHVGL
R620 *2
47K
1%
TCON 37 FHD
R622 *2
12K
1%
TCON 37 FHD
R621 *2
220K
1%
TCON 37 FHD
R637 *2
20K
1%
TCON 37 FHD
R643 *2
150K
1%
TCON 37 FHD
42_FHD_60_LAMP
VGHVGL
SHEET7
SHEET7
42_FHD
VGH
R620 *3
56K
1%
TCON 42 FHD
R622 *3
11K
1%
TCON 42 FHD
(Without 60Hz Lamp)
R621 *3
220K
1%
TCON 42 FHD
VGL
R637 *3
27K
1%
TCON 42 FHD
R643 *3
150K
1%
TCON 42 FHD
VDD
R635 *1
150K
1%
TCON 32 FHD
R636 *1
27K
1%
TCON 32 FHD
R640 OPEN
R641 *1
24K
1%
TCON 32 FHD
HVDD
R609 *1
510K
1%
TCON 32 FHD
R610 *1
150K
1%
TCON 32 FHD
R611 *1
200K
1%
TCON 32 FHD
VDD
R635 *2
910K
1%
TCON 37 FHD
R636 *2
56K
1%
TCON 37 FHD
R640 *2
470K
1%
TCON 37 FHD
R641 *2
56K
1%
TCON 37 FHD
HVDD
R609 *2
470K
1%
TCON 37 FHD
R610 *2
91K
1%
TCON 37 FHD
R611 OPEN
VCOM FEED BACKVCOM FEED BACKVCOM FEED BACK
R601 *1
1K
1%
TCON 32 FHD
R652 *1
1K
1%
TCON 32 FHD
R602 *1
1K
1%
TCON 32 FHD
47_FHD_60_LAMP
VGH
R620 *4
30K
1%
TCON 47 FHD 60 LAMP
R622 *4
11K
1%
TCON 47 FHD 60 LAMP
VDD
R635 *4
180K
1%
TCON 47 FHD 60 LAMP
R636 *4
68K
1%
TCON 47 FHD 60 LAMP
R621 *4
220K
1%
TCON 47 FHD 60 LAMP
R640 OPEN
R641 *4
20K
1%
TCON 47 FHD 60 LAMP
VGL
R637 *4
51K
1%
TCON 47 FHD 60 LAMP
R643 *4
270K
1%
TCON 47 FHD 60 LAMP
HVDD
R609 *4
510K
1%
TCON 47 FHD 60 LAMP
R610 *4
150K
1%
TCON 47 FHD 60 LAMP
R611 *4
220K
1%
TCON 47 FHD 60 LAMP
R601 *2
1K
1%
TCON 37 FHD
R652 *2
1 5K
5%
TCON 37 FHD
47_FHD
VGH
R620 *5
51K
1%
TCON 47 FHD
R622 *5
11K
1%
TCON 47 FHD
VDD
R635 *5
180K
1%
TCON 47 FHD
R636 *5
75K
1%
TCON 47 FHD
R602 *2
1K
1%
TCON 37 FHD
(Without 60Hz Lamp)
R621 *5
220K
1%
TCON 47 FHD
R640 OPEN
R641 *5
20K
1%
TCON 47 FHD
VGL
R637 *5
51K
1%
TCON 47 FHD
R643 *5
270K
1%
TCON 47 FHD
HVDD
R609 *5
510K
1%
TCON 47 FHD
R610 *5
150K
1%
TCON 47 FHD
R611 *5
220K
1%
TCON 47 FHD
VDD
SHEET7
VCOM FEED BACK
R601 OPEN
R652 *4
1K
1%
TCON 42 FHD 60 LAMP
55_FHD
VGH
R620 *6
510K
1%
TCON 55 FHD
R622 *6
27K
1%
TCON 55 FHD
R635 *6
150K
1%
TCON 55 FHD
R636 *6
75K
1%
TCON 55 FHD
R602 *4
1K
1%
TCON 42 FHD 60 LAMP
R621 *6
68K
1%
TCON 55 FHD
R640 OPEN
R641 *6
15K
1%
TCON 55 FHD
HVDD
SHEET7
VGL
R637 *6
27K
1%
TCON 55 FHD
R643 *6
150K
1%
TCON 55 FHD
HVDDVDD
R609 *6
180K
1%
TCON 55 FHD
R610 *6
68K
1%
TCON 55 FHD
R611 *6
56K
1%
TCON 55 FHD
VDD
R635 *3
150K
1%
TCON 42 FHD
R636 *3
75K
1%
TCON 42 FHD
R601 OPEN
R652 *3
1K
1%
TCON 42 FHD
R640 OPEN
R641 *3
15K
1%
TCON 42 FHD
R602 *3
1K
1%
TCON 42 FHD
HVDD
R609 *3
510K
1%
TCON 42 FHD
R610 *3
150K
1%
TCON 42 FHD
R611 *3
200K
1%
TCON 42 FHD
VCOM FEED BACK
SHEET7
VCOM FEED BACK
R601 *5
1K
1%
TCON 47 FHD
R652 *5
1K
1%
TCON 47 FHD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R602 *5
1K
1%
TCON 47 FHD
VCOM FEED BACK
R601 OPENR602 OPEN
R652 *6
0
5%
TCON 55 FHD
GP2_Saturn7M
T-CON Power Table
Ver. 1.2
15
Page 29
VCC 1 5V DDR
R1201
1K 1%
R1202
1K 1%
0 1uF
1000pF
C1202
C1201
CLose to DDR3
A MVREFDQ
VCC 1 5V DDR
R1204
1K 1%
0 1uF
R1205
1K 1%
C1204
C1203
CLose to Saturn7M IC
1000pF
A MVREFCA
VCC 1 5V DDR
C1205
10uF
C1206
Close to DDR Power Pin
DDR3 1.5V By CAP - Place these Caps near Memory
0 1uF
0 1uF
C1207
0 1uF
0 1uF
0 1uF
0 1uF
C1208
C1210
C1211
C1212
C1213
0 1uF
C1214
C1216
0 1uF
0 1uF
C1215
1000pF
VCC 1 5V DDR
0 1uF
C1249
C1250
R1227
1K 1%
R1228
1K 1%
VCC 1 5V DDR
DDR3 1.5V By CAP - Place these Caps near Memory
0 1uF
0 1uF
C1218
C1217
C1219
C1220
0 1uF
C1221
C1222
0 1uF
0 1uF
0 1uF
0 1uF
0 1uF
0 1uF
C1224
C1223
0 1uF
0 1uF
C1227
C1228
0 1uF
0 1uF
C1230
C1231
0 1uF
0 1uF
C1232
0 1uF
C1229
C1233
C1235
0 1uF
0 1uF
0 1uF
0 1uF
C1236
C1234
C1237
0 1uF
0 1uF
C1238
C1239
0 1uF
0 1uF
0 1uF
C1242
C1241
C1243
VCC 1 5V DDR
R1224
1K 1%
B MVREFCA
0 1uF
C1246
10uF
0 1uF
0 1uF
C1245
C1244
1000pF
C1247
C1248
B MVREFDQ
R1225
1K 1%
Close to DDR Power Pin
CLose to Saturn7M IC
CLose to DDR3
A MVREFCA
A MVREFDQ
VCC 1 5V DDR
R1203
240
1%
IC1201
H5TQ1G63BFR-H9C
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD 1
D9
VDD 2
G7
VDD 3
K2
VDD 4
K8
VDD 5
N1
VDD 6
N9
VDD 7
R1
VDD 8
R9
VDD 9
A1
VDDQ 1
A8
VDDQ 2
C1
VDDQ 3
C9
VDDQ 4
D2
VDDQ 5
E9
VDDQ 6
F1
VDDQ 7
H2
VDDQ 8
H9
VDDQ 9
J1
NC 1
J9
NC 2
L1
NC 3
L9
NC 4
T7
NC 6
A9
VSS 1
B3
VSS 2
E1
VSS 3
G8
VSS 4
J2
VSS 5
J8
VSS 6
M1
VSS 7
M9
VSS 8
P1
VSS 9
P9
VSS 10
T1
VSS 11
T9
VSS 12
B1
VSSQ 1
B9
VSSQ 2
D1
VSSQ 3
D8
VSSQ 4
E2
VSSQ 5
E8
VSSQ 6
F9
VSSQ 7
G1
VSSQ 8
G9
VSSQ 9
A10/AP
A12/BC
RESET
DQSL
DQSL
DQSU
DQSU
DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7
DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7
+1 5V DDR
L1201
A MA0
A MA2
A MA11
A MA1
A MA8
A MCK
A MCKB
A MA6
A MBA0
A MA3
A MA5
A MA7
A MA4
A MA12
A MBA1
A MA10
A MRESETB
A MBA2
A MA13
A MA9
A MCK
A MCKB
A MRASB
A MCASB
A MODT
A MWEB
A MDQSL
A MDQSLB
A MDQSU
A MDQSUB
A MDQL1
A MDQL3
A MDML
A MDQU2
A MCKE
A MDQL7
A MDQL5
A MDQL0
A MDQL2
A MDQL6
A MDQL4
A MDQU7
A MDQU3
A MDQU5
A MDMU
A MDQU6
A MDQU0
A MDQU4
A MDQU1
A MCKE
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
R7
A11
N7
T3
A13
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
F3
G3
C7
B7
E7
DML
D3
DMU
E3
F7
F2
F8
H3
H8
G2
H7
D7
C3
C8
C2
A7
A2
B8
A3
A MA0
A MA1
A MA2
A MA3
A MA4
A MA5
A MA6
A MA7
A MA8
A MA9
A MA10
A MA11
A MA12
A MA13
A MBA0
A MBA1
A MBA2
A MCKE
A MODT
A MRASB
A MCASB
A MWEB
A MRESETB
A MDQSL
A MDQSLB
A MDQSU
A MDQSUB
A MDML
A MDMU
A MDQL0
A MDQL1
A MDQL2
A MDQL3
A MDQL4
A MDQL5
A MDQL6
A MDQL7
A MDQU0
A MDQU1
A MDQU2
A MDQU3
A MDQU4
A MDQU5
A MDQU6
A MDQU7
1%
R1235
56
1%
R1236
56
VCC 1 5V DDR
R1231
10K
C1209
0 01uF
25V
R1213
10
R1214
10
AR1208
10
AR1203
10
AR1204
10
AR1201
10
R1206
10
R1207
10
AR1202
10
R1208
10
R1209
10
R1211
10
R1212
10
AR1209
10
AR1210
10
AR1205
10
AR1206
10
AR1207
10
R1210
10
R123310K
A TMA0
A TMA2
A TMA11
A TMA1
A TMA8
A TMA6
A TMBA0
A TMA3
A TMA5
A TMA7
A TMA4
A TMA12
A TMBA1
A TMA10
A TMRESETB
A TMBA2
A TMA13
A TMA9
A TMCK
A TMCKB
A TMRASB
A TMCASB
A TMODT
A TMWEB
A TMDQSL
A TMDQSLB
A TMDQSU
A TMDQSUB
A TMDQL1
A TMDQL3
A TMDML
A TMDQU2
A TMCKE
A TMDQL7
A TMDQL5
A TMDQL0
A TMDQL2
A TMDQL6
A TMDQL4
A TMDQU7
A TMDQU3
A TMDQU5
A TMDMU
A TMDQU6
A TMDQU0
A TMDQU4
A TMDQU1
A TMA0
A TMA1
A TMA2
A TMA3
A TMA4
A TMA5
A TMA6
A TMA7
A TMA8
A TMA9
A TMA10
A TMA11
A TMA12
A TMA13
A TMBA0
A TMBA1
A TMBA2
A TMCK
A TMCKB
A TMCKE
A TMODT
A TMRASB
A TMCASB
A TMWEB
A TMRESETB
A TMDQSL
A TMDQSLB
A TMDQSU
A TMDQSUB
A TMDML
A TMDMU
A TMDQL0
A TMDQL1
A TMDQL2
A TMDQL3
A TMDQL4
A TMDQL5
A TMDQL6
A TMDQL7
A TMDQU0
A TMDQU1
A TMDQU2
A TMDQU3
A TMDQU4
A TMDQU5
A TMDQU6
A TMDQU7
LGE107D (S7M Divx_Non RM)
B8
A DDR3 A0/DDR2 A13
B9
A DDR3 A1/DDR2 A8
A8
A DDR3 A2/DDR2 A9
C21
A DDR3 A3/DDR2 A1
B10
A DDR3 A4/DDR2 A2
A22
A DDR3 A5/DDR2 A10
A10
A DDR3 A6/DDR2 A4
B22
A DDR3 A7/DDR2 A3
C9
A DDR3 A8/DDR2 A6
C23
A DDR3 A9/DDR2 A12
B11
A DDR3 A10/DDR2 RASZ
A9
A DDR3 A11/DDR2 A11
C10
A DDR3 A12/DDR2 A0
B23
A DDR3 A13/DDR2 A7
B21
A DDR3 BA0/DDR2 BA2
A11
A DDR3 BA1/DDR2 CASZ
A23
A DDR3 BA2/DDR2 A5
A12
A DDR3 MCLK/DDR2 MCLK
C11
A DDR3 MCLKZ/DDR2 MCLKZ
B12
A DDR3 CKE/DDR2 DQ5
C20
A DDR3 ODT/DDR2 ODT
A20
A DDR3 RASZ/DDR2 WEZ
B20
A DDR3 CASZ/DDR2 BA1
A21
A DDR3 WEZ/DDR2 BA0
C22
A DDR3 RESETB
C16
A DDR3 DQSL/DDR2 DQS0
B16
A DDR3 DQSLB/DDR2 DQSB0
A16
A DDR3 DQSU/DDR2 DQSB1
C15
A DDR3 DQSUB/DDR2 DQS1
A14
A DDR3 DML//DDR2 DQ13
B18
A DDR3 DMU/DDR2 DQ6
C18
A DDR3 DQL0/DDR2 DQ3
B13
A DDR3 DQL1/DDR2 DQ7
A19
A DDR3 DQL2/DDR2 DQ1
C13
A DDR3 DQL3/DDR2 DQ10
C19
A DDR3 DQL4/DDR2 DQ4
A13
A DDR3 DQL5/DDR2 DQ0
B19
A DDR3 DQL6/DDR2 CKE
C12
A DDR3 DQL7/DDR2 DQ2
A15
A DDR3 DQU0/DDR2 DQ15
A17
A DDR3 DQU1/DDR2 DQ9
B14
A DDR3 DQU2/DDR2 DQ8
C17
A DDR3 DQU3/DDR2 DQ11
B15
A DDR3 DQU4/DDR2 DQM1
A18
A DDR3 DQU5/DDR2 DQ12
C14
A DDR3 DQU6/DDR2 DQM0
B17
A DDR3 DQU7/DDR2 DQ14
IC101
S7M DIVX
VCC 1 5V DDR
C1225
C1226
10uF
0 1uF
10V
16V
B DDR3 A0/DDR2 A13
B DDR3 A1/DDR2 A8
B DDR3 A2/DDR2 A9
B DDR3 A3/DDR2 A1
B DDR3 A4/DDR2 A2
B DDR3 A5/DDR2 A10
B DDR3 A6/DDR2 A4
B DDR3 A7/DDR2 A3
B DDR3 A8/DDR2 A6
B DDR3 A9/DDR2 A12
B DDR3 A10/DDR2 RASZ
B DDR3 A11/DDR2 A11
B DDR3 A12/DDR2 A0
B DDR3 A13/DDR2 A7
B DDR3 BA0/DDR2 BA2
B DDR3 BA1/DDR2 CASZ
B DDR3 BA2/DDR2 A5
B DDR3 MCLK/DDR2 MCLK
B DDR3 MCLKZ/DDR2 MCLKZ
B DDR3 CKE/DDR2 DQ5
B DDR3 ODT/DDR2 ODT
B DDR3 RASZ/DDR2 WEZ
B DDR3 CASZ/DDR2 BA1
B DDR3 WEZ/DDR2 BA0
B DDR3 RESETB
B DDR3 DQSL/DDR2 DQS0
B DDR3 DQSLB/DDR2 DQSB0
B DDR3 DQSU/DDR2 DQSB1
B DDR3 DQSUB/DDR2 DQS1
B DDR3 DML/DDR2 DQ13
B DDR3 DMU/DDR2 DQ6
B DDR3 DQL0/DDR2 DQ3
B DDR3 DQL1/DDR2 DQ7
B DDR3 DQL2/DDR2 DQ1
B DDR3 DQL3/DDR2 DQ10
B DDR3 DQL4/DDR2 DQ4
B DDR3 DQL5/DDR2 DQ0
B DDR3 DQL6/DDR2 CKE
B DDR3 DQL7/DDR2 DQ2
B DDR3 DQU0/DDR2 DQ15
B DDR3 DQU1/DDR2 DQ9
B DDR3 DQU2/DDR2 DQ8
B DDR3 DQU3/DDR2 DQ11
B DDR3 DQU4/DDR2 DQM1
B DDR3 DQU5/DDR2 DQ12
B DDR3 DQU6/DDR2 DQM0
B DDR3 DQU7/DDR2 DQ14
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
DDR3(256MB)
Ver. 1.0
21
Page 30
/FLASH WP
R1401
OPT
R1402
0
0
+3 3V Normal
R1403
10K
C
Q1401
B
KRC103S
E
/SPI CS
SPI SDO
+3 3V Normal
R1404
4 7K
S FLASH
IC1401
MX25L8005M2I-15G
CS#
1
SO
2
WP#
3
GND
4
+3 3V Normal
R1405
33
C1401
0 1uF
SPI SCK
SPI SDI
VCC
8
HOLD#
7
SCLK
6
SI
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
S-Flash(1MB)
Ver. 1.2
23
Page 31
LGIT CAN H/N TUNER for US&KOR&BRAZIL&TAIWAN&AUS
RF S/W CTL
1
BST CTL
2
+B1[5V]
3
NC 1[RF AGC]
4
NC 2
5
SCLT
6
SDAT
7
NC 3
8
SIF
9
NC 4
10
VIDEO
11
GND
12
+B2[1 2V]
13
+B3[3 3V]
14
RESET
15
IF/AGC
16
DIF 1[N]
17
DIF 2[P]
18
19
SHIELD
TU5001-*1
TDTR-T035F
NTSC_2INPUT_H_LGIT
ANT PWR[OPT]
1
BST CNTL
2
+B
3
NC[RF AGC]
4
AS
5
SCL
6
SDA
7
NC(IF TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1 2V
13
3 3V
14
RESET
15
IF AGC CNTL
16
DIF 1
17
DIF 2
18
19
SHIELD
TU5001-*2
TDVJ-H031F
NTSC_1INPUT_V_LGIT
ANT PWR[OPT]
1
BST CNTL
2
+B
3
NC[RF AGC]
4
AS
5
SCL
6
SDA
7
NC(IF TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1 2V
13
3 3V
14
RESET
15
IF AGC CNTL
16
DIF 1
17
DIF 2
18
19
SHIELD
TU5001-*3
TDVJ-H001F
NTSC_1INPUT_H_LGIT
NTSC 1INPUT H SANYO
U5001 *4
UCA36AL
NC 1
1
NC 2
2
GND 1
3
+5V[MAIN]
4
NC 3[RF AGC]
5
NC 4[VT]
6
GND 2
7
SDA
8
SCL
9
AS
10
NC 5
11
D IF1
12
D IF2
13
IF AGC
14
+5V[VIF]
15
SIF
16
NC 6[AFT]
17
NC 7
18
VIDEO
19
20
SHIELD
DVB_1INPUT_H_LGIT
TU5001
TDTJ-S001D
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC[IF_TP]
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
R5002
0
RF S/W OPT
R5001
0
RF AGC OPT
R5003
0
+1.2V/+1.8V_TU
C5001
100pF
50V
C5002
0 1uF
16V
RF S/W OPT
+5V_TU
C5003
0 1uF
16V
OPTION : RF S/W
RF SWITCH CTL
Pull up can’t be applied
because of MODEL OPT 2
+3 3V_TU
C5006
C5007
100pF
0 1uF
50V
16V
R5009
100
NON DEMOD OPT
0
R5035
+3.3V_TU
R5011
100K
C5010
0 1uF
16V
TUNER RESET
NON DEMOD OPT
R5034
Q5001
ISA1530AC1
BOOSTER OPT
0
+5V_TU
C5011
0 01uF
25V
BOOSTER OPT
C5012
18pF
50V
L5001
MLB 201209 0120P N2
BOOSTER OPT
R5014
0
BOOSTER OPT
E
B
BOOSTER OPT
C
33
33
R5016
C5013
18pF
50V
IF_N_MSTAR
IF_P_MSTAR
R5017
2 2K
Q5002
2SC3052
BOOSTER OPT
+3 3V_TU
R5018
1 2KR5020
R5019
10K
BOOSTER OPT
C
BOOSTER OPT
B
E
1 2KR5015
R5006100
DEMOD OPT
R5007100
DEMOD OPT
OPTION : BOOSTER
R5021
10K
LNA2 CTL
The pull up/down of LNA2 CTL
is depended on MODLE OPT 1
GPIO must be added for FE BOOSTER CTL
TU SCL
TU SDA
C5016
0 1uF
16V
OPT
Close to the tuner
R5022
1K
should be guarded by ground
IF N EXT
IF P EXT
IF_AGC
C5025
0 1uF 16V
R5024
C5026
0
0 1uF
16V
RF AGC OPT
RF AGC OPT
Q5003
2SC3052
C5027
10uF
10V
RF AGC OPT
C
B
E
R5025
4 7K
R5026
1K
OPT
TU CVBS BYPASS
R5027
1K
OPT
R5028
10K
RF AGC OPT
+5V_TU
R5029
470
B
+5V_TU
R5030
220
NON TU CVBS BYPASS
R5039
0
B
OPTION : RF AGC
IF AGC SEL
R5032
E
C
E
Q5005
C
82
ISA1530AC1
Q5004
R5031
220
NON TU CVBS BYPASS
ISA1530AC1
GPIO must be added
TU SIF
TU CVBS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.3V_TU
C5031
0 1uF
16V
IC5001
AZ1117H ADJTRE1(EH11A)
INPUT
3
2
OUTPUT
1
ADJ/GND
R5038
1 2K
R5036
10
+1.2V/+1.8V_TU
R5033
1
C5029
10uF
10V
C5028
0 1uF
16V
60mA
200mA
+5V_TU
C5018
22uF
16V
OPT
+3 3V_TU
C5017
22uF
16V
OPT
BLM18PG121SN1D
C5019
22uF
16V
BLM18PG121SN1D
C5020
22uF
16V
+5V_Normal
L5002
C5021
0 1uF
16V
+3.3V_Normal
L5003
C5022
0 1uF
16V
*Change History
Ver 1 0 > 1 1 Change of chip type 091019 w s jeong
Ver 1 1 > 1 2 Change of chip type Add of Tuner P/N for NTSC 1INPUT 091116 w s jeong
1 De reting
C5023
0 1uF
16V
C5024
0 1uF
16V
GP2 Saturn7M
ATSC CAN TUNER
1) R5029 R5030 R5031 1005 Type ==> 1608 Type(w s Jeong 1019)
2) R5030 R5031 200/1608 Type ==> 220/2012 Type(w s Jeong 1116)
2 ADD of TUNER P/N (w s Jeong 1116)
CONTROL ATTEN
This was being applied to the only china demod
so this has to be deleted in both main and ISDB sheet
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7MVer. 1.0
ISDB-T Demodulator
28
Page 33
Panasonic Demodulator Power(3.3V,1.2V)
ISDB POWER
IC3001
SC4215ISTRT
NC 1
EN
VIN
NC 2
1
2
3
4
GND
8
7
6
5
ADJ
VO
NC 3
ISDB POWER
R3004
5.1K
10K
R3003
ISDB_POWER
+1.2V_DE
ISDB POWER
C3005
0 1uF
16V
ISDB POWER
C3006
22uF
16V
+3.3V_Normal
0.1uF
ISDB POWER
C3001
ISDB POWER
L3001
BLM18PG121SN1D
+3.3V_DE
0.1uF
ISDB POWER
C3002
+3.3V_DE
ISDB POWER
C3003
0 1uF
16V
ISDB POWER
C3004
10uF
10V
IF AGC SELECTION
IF AGC ISDB
R3001
0
IF AGC
ISDB DEMOD
R3002
MSTAR DEMOD
0
IF AGC MAIN
TP3002
IF AGC SEL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7MVer. 1.0
Demodulator
29
Page 34
SCART OPTION BLOCK
SC1 CVBS IN
JK3801
PPJ238-01
NON CI 30
TP3801
TP3802
TP3803
TP3804
TP3805
TP3806
TP3807
TP3808
TP3809
[RD1]E-LUG
6C
[RD1]O-SPRING
5C
[RD1]CONTACT
4C
[WH1]O-SPRING
5B
[YL1]CONTACT
4A
[YL1]O-SPRING
5A
[YL1]E-LUG
6A
[RD2]E-LUG
6H
[RD2]O-SPRING_2
5H
[RD2]CONTACT
4H
[WH2]O-SPRING
5G
[RD2]O-SPRING_1
5F
[RD2]E-LUG-S
7F
[BL2]O-SPRING
5E
[BL2]E-LUG-S
7E
[GN2]CONTACT
4D
[GN2]O-SPRING
5D
[GN2]E-LUG
6D
SC1 FB
SC1 ID
SC RE1
SC RE2
SCART1 MUTE
SC1 SOG IN
SCART1 Lout
SCART1 Rout
DTV/MNT VOUT
JK3802
PPJ239-01
NON CI 4/5/60
[RD1]E-LUG
6H
[RD1]O-SPRING_2
5H
[RD1]CONTACT_2
4H
[WH1]O-SPRING
5G
[RD1]CONTACT_1
4F
[RD1]O-SPRING_1
5F
[RD1]E-LUG-S
7F
[BL1]O-SPRING
5E
[BL1]E-LUG-S
7E
[GN1]CONTACT
4D
[GN1]O-SPRING
5D
[GN1]E-LUG
6D
[RD2]E-LUG
6N
[RD2]O-SPRING_2
5N
[RD2]CONTACT
4N
[WH2]O-SPRING
5M
[RD2]O-SPRING_1
5L
[RD2]E-LUG-S
7L
[BL2]O-SPRING
5K
[BL2]E-LUG-S
7K
[GN2]CONTACT
4J
[GN2]O-SPRING
5J
[GN2]E-LUG
6J
D3801
5 6V
+3 3V Normal
R3802
10K
C3801
100pF
50V
OPT
R3803
1K
AV CVBS DET
+3 3V Normal
R3804
10K
D3802
5 6V
R3805
1K
001 AR23
SC1/COMP1 DET
D3811
30V
D3809
30V
D3808
30V
SC1/COMP1_DET
R3811
0
R3809
0
R3810
0
D3807
5 6V
D3806
5 6V
D3803
30V
D3805
30V
D3804
30V
R3817
75
R3815
75
R3818
75
R3806
0
D3812
5 6V
D3810
5 6V
R3808
0
R3807
0
+3 3V Normal
R3822
10K
D3813
5 6V
R3821
470K
R3820
470K
OPT
C3810
10pF
50V
OPT
C3808
10pF
50V
C3813
0 47uF
OPT
C3806
10pF
50V
R3819
470K
R3816
470K
R3812
75
R3813
75
R3814
75
AV_CVBS_DET
25V
OPT
OPT
C3803
10pF
50V
R3827
1K
C3807
1000pF
50V
C3805
1000pF
50V
C3802
10pF
50V
OPT
C3804
10pF
50V
OPT
R3852
4 7K
OPT
C3811
1000pF
50V
R3823
10K
C3809
1000pF
50V
R3826
10K
R3825
10K
R3824
10K
R3851
3 6K
R3848
0
R3860
0
R3853
R3861
0
R3828
12K
12K
R3830
12K
OPT
82
OPT
R3854
82
R3829
12K
R3831
B
OPT
R3833
0
OPT
R3835
0
SC1 B+/COMP1 Pb+
SC1 B /COMP1 Pb
+5V Normal
R3857
OPT
0
C
Q3802
2SC3052
R3858
E
0
R3855
270
B
OPT
+5V Normal
R3859
0
OPT
C
Q3803
2SC3052
E
R3838
0
R3856
270
COMP2 R IN
RESULT
COMP2 L IN
COMP2 DET
AV R IN
SC1/COMP1 R IN
AV L IN
SC1/COMP1 L IN
AV CVBS IN
SC1 R+/COMP1 Pr+
SC1 R /COMP1 Pr
AV CVBS IN2
SC1 G+/COMP1 Y+
OPT
SC1 G /COMP1 Y
COMP2 Pr+
COMP2 Pr
COMP2 Pb+
COMP2 Pb
COMP2 Y+
COMP2 Y
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CLK1
CLK2
CLK3
CLK4
CLK5
CLK6
VGI N
VGI P
VDD ODD
VDD EVEN
VST
VCC LCM
VGL I
HVDD
C706
0 1uF
16V
MINI LVDS
R703
3 3K
MINI LVDS
Z OUT
R767
R768
R769
R770
R771
R772
C712
10uF
16V
MINI LVDS
VCC LCM
NON GIP
0
NON GIP
0
NON GIP
0
NON GIP
0
NON GIP
0
NON GIP
0
10uF/25V(3216)
C705
10uF
MINI LVDS
C708
0 01uF
50V
MINI LVDS
VGH M
(+25V)
VDD LCM
VGL
( 5V)
C707
0 1uF
50V
MINI LVDS
GSC/GCLK3 I
GOE/GCLK1 I
[51Pin LVDS Connector]
(For FHD 60/120Hz)
P703
TF05 51S
WAFER FHD
52
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
PANEL VCC
R7130
NON SCAN
L702
120 ohm
WAFER FHD
C700
10uF
16V
OPT
R720 0
SCAN
R721 0
OPT
R728 0
SCAN
R723 0
OPT
R702 33
3D
R70633
240Hz
R70733
240Hz/3D
R70833
240Hz/3D
R704 33
3D
WAFER FHD
RXACK
RXACK+
RXA2
RXA2+
RXA1
RXA1+
RXA0
RXA0+
RXB4
RXB4+
RXB3
RXB3+
RXBCK
RXBCK+
RXB2
RXB2+
RXB1
RXB1+
RXB0
RXB0+
C710
C709
0 1uF
1000pF
16V
50V
WAFER FHD
RXA4
RXA4+
RXA3
RXA3+
BIT SEL
R709
10K
BIT SEL LOW
SCAN BLK2
OPC EN
SCAN BLK1/OPC OUT
PWM DIM
/3D FPGA RESET
FRC RESET
I2C SCL
I2C SDA
3D POWER EN
LVDS SEL
+3 3V Normal
R705
3 3K
LVDS SEL HIGH
R710
10K
LVDS SEL LOW
[41Pin LVDS Connector]
(For FHD 120Hz)
P704
TF05 41S
WAFER FHD 120HZ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
P705
FF10001 30
WAFER HD
RXD4
RXD4+
RXD3
RXD3+
RXDCK
RXDCK+
RXD2
RXD2+
RXD1
RXD1+
RXD0
RXD0+
RXC4
RXC4+
RXC3
RXC3+
RXCCK
RXCCK+
RXC2
RXC2+
RXC1
RXC1+
RXC0
RXC0+
C714
C713
1000p
10uF
50V
16V
3D
OPT
1
2
R716 0
WAFER HD
3
R717 0
4
R714 0
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
R724 0
22
23
24
25
26
27
28
29
30
31
L703
120 ohm
C715
0 1uF
16V
3D
3D
PWM DIM
OPT
OPC OUT
OPT
RXA3
RXA3+
RXACK
RXACK+
RXA2
RXA2+
RXA1
LVDS SEL
RXA1+
+3 3V Normal
RXA0
RXA0+
OPC EN
OPT
PANEL VCC
PANEL VCC
LVDS SEL HIGH
LVDS SEL LOW
L701
120 ohm
WAFER HD
R712
3 3K
R711
10K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
AUDIO[NTP]
Ver. 1.1
38
Page 37
NOT USING B/T
BT ON/OFF
BT DM
BT DP
BT LOUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
NON B/T
Ver. 1.0
44
Page 38
NON CI Region
/PCM CD
PCM 5V CTL
/PCM CE
/PCM IRQA
FE TS SYNC
FE TS VAL ERR
FE TS CLK
CI TS DATA[0]
CI TS DATA[1]
CI TS DATA[2]
CI TS DATA[3]
CI TS DATA[4]
CI TS DATA[5]
CI TS DATA[6]
CI TS DATA[7]
/PCM REG
/PCM OE
/PCM WE
/PCM IORD
/PCM IOWR
PCM RST
/PCM WAIT
CI TS CLK
CI TS VAL
CI TS SYNC
PCM A[0]
PCM A[1]
PCM A[2]
PCM A[3]
PCM A[4]
PCM A[5]
PCM A[6]
PCM A[7]
PCM A[8]
PCM A[9]
PCM A[10]
PCM A[11]
PCM A[12]
PCM A[13]
PCM A[14]
FE TS DATA[0 7]
PCM D[0 7]
FE TS DATA[0]
FE TS DATA[1]
FE TS DATA[2]
FE TS DATA[3]
FE TS DATA[4]
FE TS DATA[5]
FE TS DATA[6]
FE TS DATA[7]
PCM D[0]
PCM D[1]
PCM D[2]
PCM D[3]
PCM D[4]
PCM D[5]
PCM D[6]
PCM D[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7MVer. 1.0
PCMCI
46
Page 39
NON ETHERNET
TP2101
TP2102
TP2103
TP2104
TP2105
TP2106
TP2107
TP2108
TP2109
TP2110
TP2111
EPHY RXD0
EPHY RXD1
EPHY TXD1
EPHY TXD0
EPHY REFCLK
EPHY CRS DV
EPHY MDIO
ET RXER
/RST PHY
EPHY MDC
EPHY EN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NON ETHERNET
Ver. 1.0GP2_Saturn7M
48
Page 40
NON Motion Remocon Region
TP2501
TP2502
TP2503
TP2504
M REMOTE RX
M REMOTE TX
RF RESET
RF ENABLE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
NON M REMOCON
Ver. 1.0
50
Page 41
NON CHINA HOTEL
AMP MUTE HOTEL
SPK R+ HOTEL
SPK R HOTEL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
NON CHINA HOTEL
Ver. 1.0
52
Page 42
/PIF SPI CS
R6001 0
CHB CVBS IN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
NON CHB
Ver. 1.0
68
Page 43
Page 44
1. Power-up boot check
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check stand-by Voltage.
P403 or P404 9~12pin : +3.5V_ST
ok
Check Micom Voltage
IC1002 pin 48 : +3.5V
ok
Check X1002 clock
32 KHz
ok
Check P403 or P404 PWR_ON.
1pin : 3.3V
ok
Check Multi Voltage
P403 2 pin : 20V, 17 pin : 12V
P404 2 pin : *20V, 17 pin : 12V
ok
No
No
No
No
Check Power connector
okNo
-. P403 : 37inch / 42inch Model
-. P404 : 26inch / 32inch Model
Replace L404
Replace X1002
Re-download Micom software.
Replace Power Board
Main B/D 3.5V Line
Short Check
ok
No
Replace Micom(IC1002)or Main board
*20V Voltage is dependent on Model
26LD350 => 24V
Replace Power board.
Check IC402/3/5/7 Output Voltage
IC402 : 2.5V
IC403 : 1.26V
IC405 : 3.3V
IC407 : 1.5V
ok
Check X201 Clock
24 MHz
ok
Check LVDS Power Voltage
Q409 : 12V
ok
Check Mstar LVDS Output
ok
Check Inverter Control & Error Out
P403 or P404 18 pin : High
P403 or P404 24 pin : Low
No
Replace IC402/ 3 / 5 / 7
No
Replace X201
No
Replace Q409
No
Replace Mstar(IC101) or Main Board
No
Check Power Board or Module
ok
Change Module
Page 45
2. Digital TV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check RF Cable & Signal
ok
Check Tuner 5V Power
L5002
ok
Check Tuner 3.3V Power
L5003
ok
Check Tuner 1.2V Power
IC5001 2 pin : 1.2V
ok
Check IF_P/N Signal
TU5001 17/18 Pin
ok
Check Mstar LVDS Output
No
No
No
No
No
No
Check IC401
ok
Replace L5003
Replace IC5001.
Bad Tuner. Replace Tuner.
Replace Mstar(IC101) or Main Board.
Replace IC401
Replace L5002
Page 46
3. Analog TV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check RF Cable & Signal
ok
Check Tuner 5V Power
L5002
ok
Check Tuner 3.3V Power
L5003
ok
Check Tuner 1.2V Power
IC5001 2 pin : 1.2V
ok
Check CVBS Signal
TU5001 11 Pin
ok
Check Mstar LVDS Output
No
No
No
No
No
No
Check IC401
ok
Replace L5003
Replace IC5001.
Bad Tuner. Replace Tuner.
Replace Mstar(IC101) or Main Board.
Replace IC401
Replace L5002
Page 47
4. AV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
ok
Check AV Cable for damage
for damage or open conductor
ok
Check JK3801 , JK3302
CVBS Signal Line
R246 , R4016
No
ok
No
Check CVBS_DET Signal
ok
No
Check Mstar LVDS Output
5. Component Video
Check input signal format.
Is it supported?
ok
Check Component Cable
for damage or open conductor.
Replace Jack
Replace R3802 or R3803
Replace Mstar(IC101) or Main Board.
ok
Check JK3801
Y/PB/PR signal Line
No
ok
No
Check COMP_DET Signal
ok
No
Check Mstar LVDS Output
Replace Jack
Replace R3804 or R3805
Replace Mstar(IC101) or Main Board.
Page 48
6. RGB Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
ok
Check RGB Cable conductors
for damage or open conductor
ok
Check EDID & EEPROM
IC1105 I2C Signal
R1141, R1143(SDA,SCL)
ok
Check JK1104
H/V_Sync/R/G/B Signal Line
ok
Check DSUB_DET
ok
Check Mstar LVDS Output
No
Replace the defective IC or re-download EDID data
No
Replace Jack
No
Replace R1146 or R1147
No
Replace Mstar(IC101) or Main Board.
Page 49
7. HDMI Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
ok
Check HDMI Cable conductors
for damage or open conductor.