LG 32LD310H, 32LD310H-UA, 32LD320H, 32LD320H-UA Service Manual

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LA06A

MODEL : 32LD310H

32LD310H-UA

32LD320H 32LD320H-UA

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

Printed in KoreaP/NO : MFL66280202 (1101-REV01)

Only for training and service purposes

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CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ......................................................................... 3

SPECIFICATION....................................................................................... 6

ADJUSTMENT INSTRUCTION .............................................................. 10

EXPLODED VIEW .................................................................................. 19

SVC. SHEET ...............................................................................................

Only for training and service purposes

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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

Only for training and service purposes

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Only for training and service purposes

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Only for training and service purposes

1. Application range

This spec sheet is applied all of the 32”, 37”, 42” LCD TV with LA06A chassis and 26” LCD TV with LA06B chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 ºC ± 5 ºC

2) Relative Humidity: 65 ± 10 %

3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz) * Standard Voltage of each product is marked by models

4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : UL, CSA, IEC specification

- EMC: FCC, ICES, IEC specification

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SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

4. General Specification(TV)

No Item Specification Remark

1 Receivable System 1) ATSC / NTSC-M 2 Available Channel 1) VHF : 02 ~ 13

2) UHF : 14 ~ 69

3) DTV : 02 ~ 69

4) CATV : 01 ~ 135

5) CADTV : 01 ~ 135 3 Input Voltage 1) AC 100 ~ 120V 50/60Hz Mark : 110V, 60Hz 4 Market North America 5 Screen Size 32 / 37 / 42 inches 6 Aspect Ratio 16:9 7 Tuning System FS 8 LCD Module LC370WUG-SCA1 37LD310H-UA/37LD320H-UA

LC320WXE-SCA1 32LD310H-UA/37LD320H-UA LC420WUG-SCA1 42LD320H-UA LC260WXN-SBA3 26LD320H-UA

9 Operating Environment Temp : 0 ~ 40 deg

Humidity : ~ 80 %

10 Storage Environment Temp : -20 ~ 60 deg

Humidity : -85 %

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Only for training and service purposes

5. Chrominance & Luminance

5.1. 32LD310H-UA/32LD320H-UA : LC320WXE-SCA1(LGD)

No. Item Min Typ Max Unit Remarks

1 White brightness 300 350 cd/m

EPA 4.0 2 Luminance uniformity 1.25 5point 3 Color coordinate RED X Typ. 0.636 Typ.

(Default) Y -0.03 0.335 +0.03

GREEN X 0.291

Y 0.603

BLUE X 0.146

Y 0.061

WHITE X 0.279

Y 0.292

4 Contrast ratio 800 1200 EPA 4.0, except RGB mode

10,000:1 50,000:1

6 Color Temperature Cool Typ. 0.269 Typ The W/B Tolerance is

-0.015 0.273 +0.015 ±0.015 for Adjustment

Medium Typ 0.285 Typ

-0.015 0.293 +0.015

Warm Typ 0.313 Typ

-0.015 0.329 +0.015

- EPA 4.0

Luminance : To qualify as ENERGY STAR under this specification, the peak luminance of the product in the ‘home” mode, or in the

default mode as shipped, shall not be less than 65% of the peak luminance of the “retail” mode, or the brightest selectable preset mode, of the product.

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Only for training and service purposes

6. Component Video Input (Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I

2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I

3. 720*480 31.50 60 27.027 SDTV 480P

4. 720*480 31.47 59.94 27.0 SDTV 480P

5. 1280*720 45.00 60.00 74.25 HDTV 720P

6. 1280*720 44.96 59.94 74.176 HDTV 720P

7. 1920*1080 33.75 60.00 74.25 HDTV 1080I

8. 1920*1080 33.72 59.94 74.176 HDTV 1080I

9. 1920*1080 67.500 60 148.50 HDTV 1080P

10. 1920*1080 67.432 59.94 148.352 HDTV 1080P

11. 1920*1080 27.000 24.000 74.25 HDTV 1080P

12. 1920*1080 26.97 23.976 74.176 HDTV 1080P

13. 1920*1080 33.75 30.000 74.25 HDTV 1080P

14. 1920*1080 33.71 29.97 740176 HDTV 1080P

7. RGB Input (PC)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

PC DDC

1. 640*350 31.468 70.09 25.17 EGA X

2. 720*400 31.469 70.08 28.32 DOS O

3. 640*480 31.469 59.94 25.17 VESA(VGA) O

4. 800*600 37.879 60.31 40.00 VESA(SVGA) O

5. 1024*768 48.363 60.00 65.00 VESA(XGA) O

6. 1280*768 47.776 59.87 79.50 CVT(WXGA) X

7. 1360*768 47.712 60.015 85.50 VESA(WXGA) X

8. 1280*1024 63.981 60.020 108.00 VESA (SXGA) O

9. 1600*1200 75.000 60.000 162 VESA (UXGA) O

10. 1920*1080 66.587 59.934 138.50 WUXGA O

Only for training and service purposes

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8. HDMI input (PC/DTV)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

PC DDC

1. 640*350 31.468 70.09 25.17 EGA X

2. 720*400 31.469 70.08 28.32 DOS O

3. 640*480 31.469 59.94 25.17 VESA(VGA) X

4. 800*600 37.879 60.31 40.00 VESA(SVGA) O

5. 1024*768 48.363 60.00 65.00 VESA(XGA) O

6. 1280*768 47.776 59.870 79.5 CVT(WXGA) O

7. 1360*768 47.712 60.015 85.50 VESA (WXGA) O

8. 1280*1024 63.981 60.020 108.00 VESA (SXGA) O

9. 1600*1200 75.000 60.000 162 VESA (UXGA) X

10. 1920*1080 67.500 60.000 148.50 HDTV 1080P O

DTV 1 720*480 31.50 60 27.027 SDTV 480P O 2 720*480 31.47 59.94 27.00 SDTV 480P O 3 1280*720 45.00 60.00 74.25 HDTV 720P O 4 1280*720 44.96 59.94 74.176 HDTV 720P O 5 1920*1080 33.75 60.00 74.25 HDTV 1080I O 6 1920*1080 33.72 59.94 74.176 HDTV 1080I O 7 1920*1080 67.500 60 148.50 HDTV 1080P O 8 1920*1080 67.432 59.939 148.352 HDTV 1080P O 9 1920*1080 27.000 24.000 74.25 HDTV 1080P O

10 1920*1080 26.97 23.976 74.176 HDTV 1080P O 11 1920*1080 33.75 30.000 74.25 HDTV 1080P O 12 1920*1080 33.71 29.97 74.176 HDTV 1080P O

Only for training and service purposes

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ADJUSTMENT INSTRUCTION

1. Application range

This spec. sheet applies to LA06A Chassis applied LCD TV all models manufactured in TV factory

2. Specification

2.1 Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.

2.2 AdjThe adjustment must be performed in the

circumstance of 25 ±5 C of temperature and 65±10% of relative humidity if there is no specific designation.

2.4 The input voltage of the receiver must keep 100~240V, 50/60Hz.

2.5 The receiver must be operated for about 5 minutes prior to the adjustment when module is in the circumstance of over 15

In case of keeping module is in the circumstance of 0°C, it should be placed in the circumstance of above 15°C for 2 hours

In case of keeping module is in the circumstance of below -20°C, it should be placed in the circumstance of above 15°C for 3 hours,.

Caution) When still image is displayed for a period of 20

minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area.

3. Adjustment items

3.1 Board Level Adjustment

• Adjust 480i Comp1 (ADC)

• EDID/DDC download Above adjustment items can be also performed in Final

Assembly if needed. Both Board-level and Final assembly adjustment items can be check using In-Star Menu 1.ADJUST CHECK. Component 1080p RGB-PC Adjust will be calculated by 480i adjust value.

3.2 Final assembly adjustment

• White Balance adjustment

• RS-232C functionality check

• Factory Option setting per destination

• Ship-out mode setting (In-Stop)

3.3 Etc

• Ship-out mode

• Tool option menu

• USB Download(S/W Update, Option, Service only)

• ISP Download(Option)

4. Automatic Adjustment

4.1. ADC Adjustment

(1) Overview

ADC adjustment is needed to find the optimum black level and gain in Analog-to-Digital device and to compensate RGB deviation.

(2) Equipment & Condition

1) Jig (RS-232C protocol)

2) Inner Pattern

- Resolution : 1080P (Inner Pattern)

- Resolution : 1024*768 RGB (Inner Pattern)

- Pattern : Horizontal 100% Color Bar Pattern

- Pattern level : 0.7±0.1 Vp-p

(3) Adjustment

1) Adjustment method

- Using RS-232, adjust items listed in 3.1 in the other shown in “4.1.3.3”

2) Adj. protocol Ref.) ADC Adj. RS232C Protocol_Ver1.0

3) Adj. order

- aa 00 00 [Enter ADC adj. mode]

- xb 00 40 [Change input source to Component1(480i)]

- ad 00 10 [Adjust 480i Comp1]

- xb 00 60 [Change input source to RGB(1024*768)]

- ad 00 10 [Adjust 1024*768 RGB]

- ad 00 90 End adj.

Protocol Command Set ACK Enter adj. mode aa 00 00 a 00 OK00x Source change xb 00 40 b 00 OK40x (Adjust 480i Comp1 )

xb 00 60 b 00 OK60x (Adjust 1080p RGB) Begin adj. ad 00 10 Return adj. result OKx (Case of Success)

NGx (Case of Fail)

Read adj. data (main) (main)

ad 00 20 000000000000000000000000007c007b006dx

(sub) (sub)

ad 00 21 000000070000000000000000007c00830077x Confirm adj. ad 00 99 NG 03 00x (Fail)

NG 03 01x (Fail) NG 03 02x (Fail) OK 03 03x (Success)

End adj. aa 00 90 a 00 OK90x

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5. Manual Adjustment

5.1 ADC(Saturn5) Adjustment

5.1.1 Overview ADC adjustment is needed to find the optimum black level and gain in Analog-to-Digital device and to compensate RGB deviation.

5.1.2 Equipment & Condition

1) Adjust Remocon

2) 801GF(802B, 802F, 802R) or MSPG925FA Pattern

Generator

- Resolution: 480i Comp1 (MSPG-925FA:model-209, pattern-65)

- Resolution: 1024*768 RGB(Inner Pattern)

- Pattern : Horizontal 100% Color Bar Pattern

- Pattern level: 0.7±0.1 Vp-p

- Image

3) Must use standard cable

5.1.3 Adjust method

5.1.3.1 ADC 480i/1080p Comp1 RGB

1) Check connected condition of Comp1 cable to the equipment

2) Give a 480i Mode, Horizontal 100% Color Bar Pattern to Comp1.

(MSPG-925FA -> Model: 209, Pattern: 65)

3) Change input mode as Component1 and picture mode as “Standard”

4) Press the In-start Key on the ADJ remote after at least 1 min of signal reception. Then, select 5. ADC Calibration. And Press OK Button on the menu “Start”. The adjustment will start automatically.

5) If ADC Comp 480i is successful, “ADC Component Success” is displayed and Comp480i/1080p is completed.

If ADC calibration is failure, “ADC Component Fail” is displayed.

6) If ADC calibration is failure, after rechecking ADC pattern or condition, retry calibration.

7) After completing ADC Component, input mode will be changed to RGB automatically.

8) If ADC calibration is successful, “ADC RGB Success” is displayed.

If ADC calibration is failure, “ADC RGB Fail” is displayed.

9) If ADC calibration is failure, after recheck ACD pattern or condition, retry calibration.

5.2. EDID (The Extended Display Identification Data) / DDC (Display Data Channel) download

5.2.1 Overview It is a VESA regulation. A PC or a MNT will display an optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”

5.2.2 Equipment

• Since embedded EDID data is used, EDID download JIG,

HDMI cable and D-sub cable are not need.

• Adjust remocon

5.2.3 Download method

1) Press Adj. key on the Adj. R/C,

2) Select EDID D/L menu.

3) By pressing Enter key, EDID download will begin

4) If Download is successful, OK is display, but If

Download is failure, NG is displayed.

5) If Download is failure, Re-try download.

• Caution) When EDID Download, must remove

RGB/HDMI Cable.

5.2.4 EDID DATA

Only for training and service purposes

HDMI-1 EDID table

HDMI-2 EDID table

Analog (RGB) EDID table

- 12 -

5.3. White Balance Adjustment

(1) Overview

• W/B adj. Objective & How-it-works

- Objective: To reduce each Panel’s W/B deviation

- How-it-works: When R/G/B gain in the OSD is at 192, it means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.

- Adj. condition : normal temperature

1) Surrounding Temperature: 25±5ºC

2) Warm-up time: About 5 Min

3) Surrounding Humidity: 20% ~ 80%

(2) Equipment

1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12)

2) Adj. Computer(During auto adj., RS-232C protocol is needed)

3) Adjust Remocon

4) Video Signal Generator MSPG-925F 720p/216-Gray (Model:217, Pattern:78)

-> Only when internal pattern is not available

• Color Analyzer Matrix should be calibrated using CS-1000

(3) Equipment connection MAP

(4) Adj. Command (Protocol)

1) RS-232C Command used during auto-adj.

Ex) wb 00 00 -> Begin white balance auto-adj.

wb 00 10 -> Gain adj. ja 00 ff -> Adj. data jb 00 c0 ...

... wb 00 1f -> Gain adj. complete *(wb 00 20(start), wb 00 2f(end)) -> Off-set adj. wb 00 ff -> End white balance auto adj.

2) Adjustment Map Applied Model : LA06A Chassis All models.

(5) Auto adj. method

1) Set TV in adj. mode using POWER ON key

2) Zero calibrate probe then place it on the center of the Display

3) Connect Cable(RS-232C)

4) Select mode in adj. Program and begin adj.

5) When adj. is complete (OK Sing), check adj. status pre mode (Warm, Medium, Cool)

6) Remove probe and RS-232C cable to complete adj.

* W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need

(6) Manual adj. method

1) Set TV in Adj. mode using POWER ON

2) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10cm of the surface..

3) Press ADJ key -> EZ adjust using adj. R/C > 6. WhiteBalance then press the cursor to the right (KEY

G).

(When KEY(

G) is pressed 216 Gray internal pattern

will be displayed)

4) One of R Gain / G Gain / B Gain should be fixed at 192, and the rest will be lowered to meet the desired value.

5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of color temperature.

- If internal pattern is not available, use RF input. In EZ

Adj. menu 6.White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner(ON). By selecting OFF, you can adjust using RF signal in 216 Gray pattern.

Only for training and service purposes

Colo r Analyzer

Comp ut er

Pattern Ge n e r ator

RS-232C

Probe

Signal Source

* If TV internal pattern is used, not needed

Connection Diagram of Automatic Adjustment

RS-232C COMMAND

Meaning

[CMD ID DATA] wb 00 00 Begin White Balance adj. wb 00 ff End White Balance adj.(Internal pattern disappeared)

ITEM Command Data Range Default

(Hex.) (Decimal)

Cmd 1 Cmd 2 Min Max

Cool R-Gain j g 00 C0

G-Gain j h 00 C0 B-Gain j i 00 C0 R-Cut G-Cut B-Cut

Medium R-Gain j a 00 C0

G-Gain j b 00 C0 B-Gain j c 00 C0 R-Cut G-Cut B-Cut

Warm R-Gain j d 00 C0

G-Gain j e 00 C0 B-Gain j f 00 C0 R-Cut G-Cut

- 13 -

* Adj. condition and cautionary items

1) Lighting condition in surrounding area Surrounding lighting should be lower 10 lux. Try to isolate adj. area into dark surrounding.

2) Probe location

- LCD: Color Analyzer (CA-210) probe should be

within 10cm and perpendicular of the module surface (80°~ 100°)

3) Aging time

- After Aging Start, Keep the Power ON status during 5

Minutes.

- In case of LCD, Back-light on should be checked

using no signal or Full-white pattern.

(7) Reference (White Balance Adj. coordinate and color

temperature)

• Luminance: 216 Gray

• Standard color coordinate and temperature using CS-

1000

• Standard color coordinate and temperature using CA210(CH 14)

5.4. HDCP (High-Bandwidth Digital Contents Protection) SETTING

- HDCP setting is not necessary in This Chassis.

5.5 Option selection per country

5.5.1 Overview

• Option selection is only done for models in Non-USA North America due to rating

• Applied model: LA06A Chassis applied None USA model(CANADA, MEXICO)

5.5.2 Method

1) Press ADJ key on the Adj. R/C, then select Country Group Meun

2) Depending on destination, select KR or US, then on the lower Country option, select US, CA, MX. Selection is done using +, - KEY

5.6 Tool Option selection

• Method : Press Adj. key on the Adj. R/C, then select Tool option.

5.7 hip-out mode check (In-stop)

• After final inspection, press In-Stop key of the Adj. R/C and

check that the unit goes to Stand-by mode.

• After final inspection, Always turn on the Mechanical S/W.

Only for training and service purposes

Mode Color Coordination Temp ∆UV

COOL 0.269 0.273 11000K 0.0000

MEDIUM 0.285 0.293 9300K 0.0000

WARM 0.313 0.329 6500K 0.0000

Mode Color Coordination Temp ∆UV

COOL 0.269±0.002 0.273±0.002 13000K 0.0000

MEDIUM 0.285±0.002 0.293±0.002 9300K 0.0000

WARM 0.313+0.002 0.329±0.002 6500K 0.0000

Model Tool 1 Tool 2 Tool 3 Tool 4 Tool 5 32LD320H-UA 16864 8786 32772 2305 0 37LD320H-UA 20960 8786 32772 2305 0 42LD320H-UA 25056 8786 32772 2305 0 26LD320H-UA 12768 8786 32772 2305 0

- 14 -

6. GND and Internal Pressure check

6.1. Method

1) GND & Internal Pressure auto-check preparation

- Check that Power Cord is fully inserted to the SET. (If loose, re-insert)

2) Perform GND & Internal Pressure auto-check

- Unit fully inserted Power cord, Antenna cable and A/V arrive to the auto-check process.

- Connect D-terminal to AV JACK TESTER

- Auto CONTROLLER(GWS103-4) ON

- Perform GND TEST

- If NG, Buzzer will sound to inform the operator.

- If OK, changeover to I/P check automatically. (Remove CORD, A/V form AV JACK BOX)

- Perform I/P test

- If NG, Buzzer will sound to inform the operator.

- If OK, Good lamp will lit up and the stopper will allow the pallet to move on to next process.

6.2. Checkpoint

• TEST voltage

- GND: 1.5KV/min at 100mA

- SIGNAL: 3KV/min at 100mA

• TEST time: 1 second

• TEST POINT

- GND TEST = POWER CORD GND & SIGNAL CABLE METAL GND

- Internal Pressure TEST = POWER CORD GND & LIVE & NEUTRAL

• LEAKAGE CURRENT: At 0.5mArms

7. Audio

Measurement condition:

1. RF input : Mono, 1KHz sine wave signal, 100% Modulation

2. CVBS, Component : 1KHz sine wave signal 0.4Vrms

3. RGB PC : 1KHz sine wave signal 0.7Vrms

Only for training and service purposes

No Item Min Typ Max Unit Remark

Audio practical max

9.0 10.0 12.0 W Measurement 32/37/42LD320H-UA Output, L/R 8.5 8.9 9.8 Vrms condition (Distortion=10% 6.3 7.0 8.4 W EQ Off 26LD320H-UA max Output) 7.09 7.48 8.19 Vrms AVL Off

Clear Voice Off

2. Speaker (8Ω 10.0 15.0 W Measurement 32/37/42LD320H-UA Impedance) 5.0 15.0 W condition 26LD320H-UA

EQ Off

AVL Off

Clear Voice Off

- 15 -

8. Etc

9. USB S/W Download (option)

(1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick

- If your downloaded program version in USB Stick is Low, it didn’t work. But your downloaded version is High, USB data is automatically detecting

(3) Show the message “Copying files from memory”

(4) Updating is staring.

(5) Updating Completed, The TV will restart automatically (6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If downloading version is more high than your TV have,

TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.

* After downloading, have to adjust TOOL OPTION again.

1) Push "IN-START" key in service remote controller.

2) Select "Tool Option 1" and Push “OK” button.

3) Punch in the number. (Each model has their number.)

Only for training and service purposes

Power Status

Main B/D Shipping Condition

AC Swithch condtion

Chassis Module Assembly

ON N/A

Front Module Assembly

N/A OFF Factory incoming ON OFF Final Assembly ON ON Ship-Out OFF ON

- 16 -

10. Test factor for commercial model

10.1 IR IN/Out, Lodgenet Check

10.1.1 Check Order “OK” Judgment

1) The method of Cable connecting from jig to TV. a) Power Cable is connected to jig for supplying

voltage. (as below picture point2)

b) Phone jack is Connected for IR out test from TV

REMOTE CONTROL OUT(JK900) to jig. (as below picture point1)

c) In the right side of check jig, 11pin SPI/MPI signal

cable is connected to MPI dummy board. (as below picture point3)

2) Test sequence a) Press EYE using adjust remote-control. b) Then, tuning the channel 96- 1.(Lodgenet digital1.)

automatically.

c) Check it whether the video is clear and 1~5 factor

“OK” like below picture.

(IR IN / IR OUT / SPI TEST / MPI TEST / 12V IN)

If you find any problem, press <Eye> button and retest.

10.1.2 Needs JIG & Equip. & Cable

1) adjust remote-control

2) commercial check jig & adapter

3) 11 pin cable

4) Phone jack Cable

10.2 Auto camport test

After D-box on, AC power Off and On. When available AV signal comes to side AV jack, input mode changing to AV2 automatically.

Only for training and service purposes

IR IN

Power

MPI/SPI SIGNAL 11P

No.3 Pin on nSPI mode

- 17 -

10.3 b_LAN Main board Check

10.3.1 Overview It is LNET RF modem & FTG card

10.3.2 Equipment

1) b_LAN Checker: UTC-1000 (with Cable accessory)

2) Computer(for test result monitoring)

3) Connection JIG

10.3.3 Equipnent connection map & b_LAN Check

4) Check =========================================

1. Setting Procedure

1) Setting JIG (1) Connect UTC-1000 Equipment to JIG device as a like left picture

- Connection Line: UTC-1000 TOP1 <--> Game port(RJ21)

-> TV-LINK CFG (Phone Jack) UTC-1000 TOP2 <--> JIG 11pin Connection UTC-1000 RF1 <--> b_LAN RF IN UTC-1000 LAN <--> PC LAN Port

2. Working procedure

1) Connection UTC-1000 LAN <--> PC LAN Port UTC-1000 TOP1 <--> Game port(RJ21)

-> TV-LINK CFG (Phone Jack)

UTC-1000 RF1 <--> b_LAN RF IN

2) Power on JIG

3) Test Start UTC-1000 TOP2 <--> JIG 11pin Connection

4) Checking b-LAN MAC Address

Check whether it is same their address numbers or not between B-LAN Label and on the pc address numbers.

Only for training and service purposes

TOP1

TOP2

RF1

Power

TOP

AC 110V

UTC-1000

LAN PORT

Computer LA N PORT

b_LAN RF IN

RJ12

Phone Jack (2)

- 18 -

* Checking JIG contents

1. Check whether displaying all “Pass” or not at the number 3.4.6.7.9 contents of UTC-1000 on the PC

2. Check “Version 6.0” of the 1. b_LAN Application version

3. Check whether it is same their address numbers or not between B-LAN Label and 2. MAC Address on the pc.

11. Serial number download.

Connect Bar Code scan equipment and TV set by RS-232C cable.

1) E2PROM Data Write

2) E2PROM Data Read

Only for training and service purposes

- 19 -

300

200

801

802

804

805

806

520

530

540

550

400

900

120

510

500

LV1

560

A10

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

FPGA POWER

+3.3V_Normal

L1227

MLB-201209-0120P-N2

RESET

012:Q17

FPGA_RESET

27MHz

012:Q17

DE_H_SYSCLK

I2C

AMP_SCL

MSCL_3.3V

FE_DEMOD_SCL

001:AG5;002:S20

AMP_SDA

MSDA_3.3V

FE_DEMOD_SDA

001:AG5;002:S20

3.3V_Proidiom

VSB_RESET

C2176 10uF 16V

R2385

R2386

3.3V_Proidiom

OPT

R2390 10K

4.7K

R2563

3.3V_Proidiom

OPT

C2177 100uF 16V

3.3V_Proidiom

C2179

OPT

C2178

0.1uF 16V

22R2387

MLB-201209-0120P-N2

L1228

1N4148W

D1250 OPT

R2393 100

OPT

R2394

1uF

100

25V

OPT

100

R2564

RESET

temp

27MHz

3.3V_Proidiom

10K

R2391

R2446

R2447

3.3V_Proidiom

10K

R2392

R2448

R2449

X1006

Q1114 BSS83

Q1115 BSS83

IC1210

MAX809RTR

1 25 34

D B

B S

012:S26;012:AJ26

+VCCINT_1.5V

VCC

GND

C2255 1uF 25V

012:B17

VSB_RESET

001:AJ21

SYS_RESET

3.3V_Proidiom

+5V_Normal

C2180

0.1uF 16V

OPT

C2181

0.1uF 16V OPT

FPGA

3.3V_Proidiom

+VCCINT_1.5V

MLB-201209-0120P-N2

16V

GNDA_PLL2

GNDG_PLL2

J11

J12

L1231

0.1uF

0.01uFC2191

16V

C2190

GND_25

GND_26J6GNDA_PLL1

GNDG_PLL1

T16

T12

IO4_10N5IO4_11N6IO4_12R6IO4_14M7IO4_15T6IO4_16R7IO4_17N7IO4_19T8IO4_21M8IO4_22N8IO4_23

1uF

C2192

GND_22T1GND_23T5GND_24

L11

0.1uF

16V

C2199

C2198

VCCIO3_1

VCCIO3_2

P16

K11

0.1uF

16V

C2200

C2201

VCCIO4_3

VCCIO4_4

L10

T14

0.1uF

16V

C2202

C2203

VCCIO4_1

VCCIO4_2

0.1uF

16V

C2205

C2204

VCCIO1_2

VCCIO1_3

0.1uF

16V

C2207

C2206

VCCINT_12

VCCIO1_1

T10

0.1uF

16V

C2208

VCCINT_11

0.1uF

16V

C2193

C2197

C2196

C2194

50V

GND_4F6GND_5F8GND_6F9GND_7

GND_8G7GND_9G9GND_10

GND_11H8GND_12

GND_13J7GND_14J9GND_15K6GND_16K8GND_17

GND_18L6GND_19L8GND_20L9GND_21

F11

G11

H10

K10

A12

C2195

VCCIO3_3

VCCIO2_1

VCCIO2_2

VCCIO2_3

VCCIO2_4

GND_1

GND_2A5GND_3

F10

C16

A14

A16

IC1209

LGDT1129

M10

T11

N10

N11

N12

M11

M12

R12

T13

R13

R14

P13

T15

R15

N13

P14

P15

R16

N15

N16

K12

K14

L12

N14

M13

IO3_1

IO3_2

IO3_3

IO3_4

IO3_5

IO3_6

IO3_7

IO3_8

IO4_25T9IO4_27N9IO4_29

IO4_31

IO4_32

IO4_36

IO4_37M9IO4_38

IO4_39

IO4_40

0R2425

IO4_42

IO4_43

IO4_44

IO4_45

IO4_46

IO4_47

IO4_48

IO3_9

IO3_10

IO3_11

0.1uF

16V

C2210

C2209

VCCINT_9

VCCINT_10

M14

L13

IO3_12

IO3_13

R2426 0

0.1uF

16V

C2211

C2212

VCCINT_7

VCCINT_8

J10

M15

M16

IO3_14

IO3_15

0.1uF

16V

C2214

C2213

VCCINT_5

VCCINT_6

L14

L15

IO3_16

IO3_17

0.1uF

16V

C2215

C2216

VCCINT_3

VCCINT_4

G10

L16

K16

IO3_18

IO3_19

0.1uF

16V

C2217

C2218

VCCINT_1

VCCINT_2

A10

K15

J16

IO3_20

IO3_21

16V

IO4_34/CH_CLK

R11

IO4_20/CH_VALID

IO4_26/CH_SOP

IO4_30/CH_ERR

R10

IO4_8/CH_DATA[0]

IO4_13/CH_DATA[1]

IO4_18/CH_DATA[2]

IO4_24/CH_DATA[3]

IO4_28/CH-DATA[4]

IO4_33/CH_DATA[5]

P10

IO4_35/CH_DATA[6]

P11

IO4_41/CH_DATA[7]

P12

IO2_34

IO2_33

IO2_32

IO2_43

IO2_30

IO2_28

IO2_27

IO2_26

IO2_44

IO2_24

E10

IO2_45

IO2_22

IO2_20

IO2_19

D10

IO2_16

A11

IO2_15

B11

IO2_46

IO2_13

D11

IO2_12

D12

IO2_11

IO2_10

E11

IO2_9

E12

IO2_47

IO2_7

B12

IO2_6

A13

IO2_5

B13

IO2_4

C13

IO2_3

B14

IO2_2

A15

IO2_1

B15

IO3_43

D13

IO3_42

C14

IO3_41

C15

IO3_40

B16

IO3_39

G12

IO3_38

H13

IO3_36

E13

IO3_35

F12

IO3_33

D15

IO3_32

D16

IO3_31

E15

IO3_30

E16

IO3_29

F15

IO3_28

F13

IO3_27

F14

IO3_26

F16

IO3_25

G15

IO3_24

G13

IO3_23

G14

IO3_22

H12

CLK2

G16

CLK3

H16

L1232

MLB-201209-0120P-N2

0R2431

MLB-201209-0120P-N2

L1230

0.1uF

C2186

16V

50V

H1 B8 B9 B10 C5 C6 C7 C8 C9 C10 C11 C12 M1 C3 C2 B1 G5 F4 D3 E4 F5 E3 D2 E2 G1 B2 D14 E14 K4 K13 H3 J4 H2 G4 K3 H4 J13 J3 J2 J14 H15 J15 H14 D4 D1 F3 G3 F2 E1 G2 F1 H5 J1 K2 L3 K1 L1 L2 N1 M2 N2 M3 L5 M4

IO1_36K5IO1_37L4IO1_38R1IO1_39P2IO1_40P3IO1_41N4IO1_42

C2187

0.01uFC2188

16V

IO2_35B5IO2_42D6IO2_37D5IO2_38E6IO2_39E5IO2_40

C2189

4.7uF

VCCA_PLL1

VCCA_PLL2

H11

IO4_1T2IO4_2R3IO4_3P4IO4_4R4IO4_5T4IO4_6R5IO4_7M5IO4_9

1uF

0R2424

IO2_29/TP_SOP

IO2_17/TP_ERR

IO1_29

IO1_10 IO1_11 IO1_12

IO2_48/RESET IO3_37/I2C_SCK IO3_34/I2C_SDA

DCLK

CONF_DONE

NCONFIG

DATA0

IO1_21SO

IO1_22/ASDO

NCEO

NSTATUS

MSEL0 MSEL1

IO1_13 IO1_14 IO1_15 IO1_16 IO1_17 IO1_18 IO1_19 IO1_20 IO1_23 IO1_24 IO1_25 IO1_26 IO1_27 IO1_28 IO1_30 IO1_31 IO1_32 IO1_33 IO1_34 IO1_35

CLK1

IO1_2 IO1_3 IO1_4 IO1_5 IO1_6 IO1_7 IO1_8 IO1_9

CLK0

NCE

TCK TDO TMS

4.7uF

C2185

TDI

3.3V_Proidiom

OPT

R2418

IO2_21/TP_VALID

IO2_41/TP_DATA[7] IO2_36/TP_DATA[6] IO2_31/TP_DATA[5] IO2_25/TP_DATA[4] IO2_23/TP_DATA[3] IO2_18/TP_DATA[2] IO2_14/TP_DATA[1]

IO2_8/TP_DATA[0]

10K

R2422

GND

R2420

10K

22R2415 22R2416 22R2417

10KR2412 10KR2413 10KR2414

10KR2409

IO1_1/INIT_DONE

10KR2408

R2421 0

OPT

R2419 0

R2423

TS_0 TS_1

TS_2 TS_3 TS_4 TS_5 TS_6 TS_7

3.3V_Proidiom

TS_CLK

TS_VALID

TS_SYNC

R2399 0

012:C13

012:B19

3.3V_Proidiom

DE_H_SYSCLK

FPGA_RESET

MSCL_3.3V MSDA_3.3V

R2401

3.3V_Proidiom

R2406

GND

1K R2402

R2403

R2404

R2405

OPT

001:AJ17

001:AJ16

001:AJ16 001:AJ16 001:AJ15 001:AJ15 001:AJ15 001:AJ15 001:AJ15 001:AJ14

R2397

TS_0 TS_1

TS_4

TS_2 TS_3

TS_5 TS_6 TS_7

+VCCINT_1.5V

L1235

L1233

L1234

L1236

MLB-201209-0120P-N2

OPT

C2219 62pF

50V 100R2441 100R2442 100R2443 100R2444

PM_TS[0] PM_TS[1] PM_TS[2] PM_TS[3] PM_TS[4] PM_TS[5] PM_TS[6] PM_TS[7]

INNER LAYER PATERN

0R2435 0R2436

001:AJ19

PM_TS_CLK

001:AJ19

PM_TS_VALID

001:AJ19

PM_TS_SYNC

001:AJ19

PM_TS[0-7]

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LD320H-UA_LA06A

FPGA

2010.09.04

12(11)

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