LG 32LB7D Schematic

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LT73B

MODEL : 32LB7D 32LB7D-TB

website:http://biz.LGservice.com

Internal Use Only

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CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ..........................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION .................................................................8

TROUBLE SHOOTING ............................................................................12

BLOCK DIAGRAM...................................................................................19

EXPLODED VIEW .................................................................................. 24

EXPLODED VIEW PARTS LIST..............................................................25

REPLACEMENT PARTS LIST ............................................................... 26

SVC. SHEET ...............................................................................................

LGE Internal Use Only

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LGE Internal Use Only

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument’s exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

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LGE Internal Use Only

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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LGE Internal Use Only

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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LGE Internal Use Only

1. Application range

This spec sheet is applied to the 32" LCD TV used LT73B chassis.

2. Secification

Each part is tested as below without special appointment.

(1) Temperature : 25 ± 5°C(77 ± 9°F), CST : 40 ± 5°C (2) Relative Humidity : 65% ± 10% (3) Power Voltage : Standard input voltage (100-240V~,

50/60Hz)

*Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

(1) Performance : LGE TV test method followed (2) Demanded other specification

Safety : CE, IEC Specification EMC : CE, IEC

SPECIFICATION

4. General Specification(LCD Module)

Remark

32, 37, 47 inch 42 inch Typical (H) x (V) x (D)

Specification

32" TFT WXGA LCD H : 45 ~ 50Khz, V : 47 ~ 63Hz H : 44.65 ~ 50.35Khz, V : 47 ~ 63Hz 32 inch 87.48W(Total) 3.48W(Logic), 84W(Lamp) Type Size 32" 760.0 x 450.0 x 42.8 Pixel Pitch 32" 170.25 x 510.75 x RGB Pixel Format 1366 horiz, By 768 vert Pixels RGB strip

arrangement

Coating Hard coating(3H), Anti-glare treatment of the front

polarizer

Back Light 32" 18 EEFL

Item

Panel Frequency range

Power Consumption LCD Module

Unit

mm um

5. Component Video Input (Y, PB, PR)

Resolution

720 x 480 720 x 480 720 x 480 720 x 576

720 x 576 1280 x 720 1280 x 720

1920 x 1080 1920 x 1080 1920 x 1080

H-freq(kHz)

15.73

15.63

31.47

15.625

31.25

45.00

44.96

31.25

33.75

33.72

V-freq(kHz)

60.00

59.94

50.00

59.94

50.00

60.00

59.94

Remark

SDTV, DVD 480i SDTV, DVD 480i 480p SDTV, DVD 625 Line HDTV 576p HDTV 720p HDTV 720p HDTV 1080i HDTV 1080i HDTV 1080i

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6. RGB Input (Analog PC)

Resolution

720 x 400 640 x 480

800 x 600

832 x 624

1024 x 768

1280 x 768 1360 x 768 1366 x 768

1920 x 1080

H-freq(kHz)

31.468

31.469

37.684

37.879

46.875

49.725

48.363

56.476

60.123

47.78

47.72

47.56

66.647

V-freq(kHz)

70.08

59.94

75.00

60.31

75.00

74.55

60.00

70.00

75.029

59.87

59.8

59.6

59.988

Pixel clock(MHz)

28.32

25.17

31.50

40.00

49.50

57.283

65.00

75.00

78.75

80.125

84.625

138.625

Proposed

VESA

VESA(XGA)

VESA(WXGA) VESA(WXGA)

Supported

WUXGA

Resolution

640 x 480 640 x 480 720 x 480 720 x 480

720 x 576 1280 x 720 1280 x 720 1280 x 720

1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080

H-freq(kHz)

31.469

31.47

31.50

31.25

37.50

44.96

45.00

28.125

33.72

33.75

27.000

56.25

67.433

67.50

V-freq(kHz)

59.94 60

50.00

59.94 60

50.00

59.94 60

24.000

50.00

59.94 60

Pixel clock(MHz)

25.175

25.20

27.00

27.027

27.000

74.176

74.250

74.176

74.250

148.500

148.352

148.500

Remark

SDTV 480p 60Hz SDTV 480p 60Hz SDTV 480p 60Hz SDTV 480p 60Hz SDTV 576p 50Hz HDTV 720p 50Hz HDTV 720p 60Hz

HDTV 720p 60Hz HDTV 1080i 50Hz HDTV 1080i 60Hz HDTV 1080i 60Hz

HDTV 1080P 24Hz HDTV 1080P 50Hz HDTV 1080P 60Hz HDTV 1080P 60Hz

Proposed

HDCP HDCP HDCP HDCP HDCP HDCP HDCP HDCP HDCP HDCP

7. HDMI input (DTV)

Resolution

720 x 400 640 x 480

800 x 600

832 x 624

1024 x 768

1280 x 768 1360 x 768 1366 x 768

1920 x 1080

V-freq(kHz)

70.08

59.94

75.00

60.31

75.00

74.55

60.00

70.00

75.029

59.87

59.8

59.6

59.988

Pixel clock(MHz)

28.32

25.17

31.50

40.00

49.50

57.283

65.00

75.00

78.75

80.125

84.625

138.625

Proposed

VESA

VESA(XGA)

VESA(WXGA) VESA(WXGA)

Supported

WUXGA

H-freq(kHz)

31.468

31.469

37.684

37.879

46.875

49.725

48.363

56.476

60.123

47.78

47.72

47.56

66.647

8. HDMI input (PC)

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LGE Internal Use Only

ADJUSTMENT INSTRUCTION

1. Application Range

This spec sheet is applied all of the LD73A chassis manufactured at LG TV Plant all over the world.

2. Specification

1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.

2) Adjustment must be done in the correct sequence.

3) The adjustment must be performed at 25±5°C temperature and 65±10% relative humidity if there is no specificed designation.

4) The input voltage of the receiver must kept 100~220V, 50/60Hz.

5) Before adjustment, execute Heat-Run for 30 minutes at RF no signal.

3. Method of Download for Cortez & STi (When Rework) Connect Computer & TV Set with RS 232C Download Cable

3.1. Cortez Download

* Press "TILT" Key -> Check TV OSD "GProbe Mode" -> Run

"GProbe" Program As below picture

3.2. STi Download

* Press "TILT" Key -> Check TV OSD "STi5100 Mode" -> Run

"LG Term" Program As below picture

4. ADC Calibration

* Caution: Using ‘power on’ button of the control

R/C , power on TV.

-.Baud rate :115200 bps

-.RS232 Host : PC

-.echo : none

< ADC Calibration >

* Caution : - System control RS-232 Host should be

"PC" for adjustment.

- Before AV ADC Calibration, execute the "Panel size selection" (only LCD model)

4.1. Adjustment of AV

Mandatory point : All models are adjusted PAL in AV mode * Required Equipments

1) Remote controller for adjustment.

2) MSPG-925FS Pattern Generator (Which has Video Signal: 7 Color Bar Pattern shown in Fig. 1).

-> Model : 202 / Pattern : 65 PAL-BGDHI (composite signal)

4.1.1. Method of Auto AV Color Balance(PAL_BGDHI).

1) Input the Video Signal : 7 Color Bar signal into AV3.

2) Set the PSM to Dynamic mode in the Picture menu.

[Fig.1]

3) Press IN-START key on R/C for adjustment.

4) Press the

(Vol.+) key to operate the set, then it becomes

automatically.

5) After downloading complete, the ‘OK’ word appears.

6) Auto-RGB OK means the adjustment is completed.

ADC AV Component RGB-PC

MSPG925FS PAL Model:215 (720P) Model: 3

INPUT SELECT AV1 Pattern:65 (1024*768 Model: 202(PAL-BGDHI) * 720P/50Hz 60Hz)

Pattern: 65 7 Color Bar Pattern:65

*PAL 7 Color Bar

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LGE Internal Use Only

4.2. Adjustment of Component

* Required Equipments

1) Remote controller for adjustment.

2) MSPG-925FS Pattern Generator. (Which has 720p/50Hz YPbPr output Pattern shown in Fig. 2)

-> Model: 215 / Pattern: 65

4.2.1. Method of Auto Component Color Balance

1) Input the Component 720p/50Hz 7 Color Bar(MSPG-925FS model:215, pattern:65) signal into Component.

2) Set the PSM to Dynamic mode in the Picture menu.

[Fig.2]

3) Press the IN-START key on R/C for adjustment.

4) Press the

(Vol.+) key to operate the set , then it becomes

automatically.

5) After downloading complete, the ‘OK’ word appears.

6) Auto-RGB OK means the adjustment is completed.

4.3. Adjustment of RGB

* Required Equipments

1) Remote controller for adjustment.

2) MSPG-925FS Pattern Generator.(Which has XGA [1024*768] 60Hz 1/2 black & white pattern shown in Fig. 3 )

4.3.1. Method of Auto RGB Color Balance

1) Input the PC 1024x768 @ 60Hz 1/2 black & white pattern (MSPG-925FS, Model:3, Pattern:65) into RGB. (using Dsub to D-sub cable)

2) Set the PSM to Dynamic mode in Picture menu.

3) Press the IN-START key on R/C for adjustment.

[Fig.3]

4) Press the

(Vol.+) key operate To set , then it becomes

automatically.

5) After downloading complete, the ‘OK’ word appears.

6) Auto-RGB OK means adjustment is completed.

* Before adjusting White-balance , the AV ADC should be

done.

5. Channel Recovery

* Use Channel Recover of System Control3

of Service Menu.

1. Press ADJ key on Service Remote Control. And then Choice System Control3.

2. Choice Channel Recover.

3. Press

key You can See "OK" letter. And Then The Set

power off automatically.

4. After Turn on the SET. You can confirm The Channel map on Programme Edit OSD. Warning … If you press IN-STOP key, The channel map will disappear.

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