LG 32LB75, 32LB76 Service manual

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LD73C

MODEL : 32LB75 32LB75-ZB

MODEL : 32LB76 32LB76-ZD

website:http://biz.LGservice.com

Internal Use Only

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CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION .................................................................9

TROUBLE SHOOTING ............................................................................13

BLOCK DIAGRAM...................................................................................19

EXPLODED VIEW .................................................................................. 20

REPLACEMENT PARTS LIST ............................................................... 22

SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument’s exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500

°F to 600°F)

b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit baord printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500

°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. General Specification(TV)

No Item Specification Remark

1. Video input applicable system PAL-D/K, B/G, I, SECAM

2. Receivable Broadcasting System 1) PAL/SECAM BG EU(PAL Market)

2) PAL/SECAM DK

3) PAL I/I

4) SECAM L/L'

5) DVB-T

3. RF Input Channel VHF : E2 ~ E12 PAL

UHF : E21 ~ E69

CATV : S1 ~ S20

HYPER : S21~ S47

4. Input Voltage 100 - 240V~ / 50Hz, 60Hz

5. Market EU

6. Picture Size 32 inch

7. Tuning System FVS 100 program PAL, 200 PR.(Option)

8. Operating Environment 1) Temp : 0 ~ 40 deg

2) Humidity : 10~90 %

9. Storage Environment 3) Temp : -20 ~ 50 deg

4) Humidity : 10~90 %

10. Display LCD Module LPL/CMO

2. General Specification(LCD Module) - L320WX4-SLD2

No Item Specification Unit Remark

1 Display area 930.24(H) x 523.26(V) mm

2 Outline dimension 760.0(W) x 450.0(H) x 42.8(D) mm

3 Number of Pixels 1366(H) x 768(V) 1 Pixel = 3 RGB

4 Cell pitch 170.25(H) x 510.75 (V) μm Basis : G cell

5 Color arrangement RGB stripe arrangement

6 Coating Hard coating (3H), Anti-glare

7 Operating Environment Temperature 0 ~ 50 deg Altitude : 0 to 1400 feet

Humidity 10 ~ 90 %

8 Storage Environment Temperature -20 ~ 60 deg Altitude : 0 to 4000 feet

Humidity 10 ~ 90 %

9 Back Light 18 EEFL

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3. Optical Feature (LCD Module)

4. Component Video Input (Y, P

B, PR)

Specification

Proposed

Resolution H-freq(kHz) V-freq(Hz)

1 720x480 15.73 60.00 SDTV, DVD 480i

2 720x480 15.63 59.94 SDTV, DVD 480i

3 720x480 31.47 59.94 SDTV 480p

4 720x480 31.50 60.00 SDTV 480p

5 720x576 15.625 50.00 SDTV, DVD 576i

6 720x576 31.25 50.00 HDTV 576p

7 1280x720 44.96 59.94 HDTV 720p

8 1280x720 45.00 60.00 HDTV 720p

9 1280x720 37.50 50.00 HDTV 720p

10 1920x1080 28.125 50.00 HDTV 1080i

11 1920x1080 33.75 60.00 HDTV 1080i

12 1920x1080 33.72 59.94 HDTV 1080i

No Item Specification Min. Typ. Max. Remark

1 Viewing Angle [CR>10] R/L, U/D 178, 178

2 Luminance Luminance(cd/m

) 320 500 32” without PC

Variation 1.3 MAX/MIN

3 Contrast Ratio CR(32") 600 1000 All White/All Black

D (With AI)(32") 1200 5000 All White/All Black

4 CIE Color Coordinates White Wx Typ 0.285 Typ LPL(32”)

Wy -0.03 0.293 +0.03

Red Xr 0.640

Yr 0.343

Green Xg 0.280

Yg 0.605

Blue Xb 0.145

Yb 0.065

5. RGB PC INPUT Mode Table

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

1. 720X400 31.468 70.08 28.321

2. 640X480 31.469 59.94 25.17 VESA

37.500 75.00 31.50

3. 800X600 37.879 60.31 40.00 VESA

46.875 75.00 49.50

4. 832X624 49.725 74.55 57.283

5. 1024X768 48.363 60.00 65.00 VESA(XGA)

56.476 70.00 75.00

60.023 75.03 78.75

6. 1280X768 47.693 59.99 80.125 VESA(WXGA)

7. 1360X768 47.649 59.94 84.625 VESA(WXGA)

8. 1366X768 47.649 59.94 84.625 Supported

9. 1920X1080 66.647 59.988 138.625 WUXGA

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6. HDMI DTV Mode Table

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark Proposed

1. 640X480 31.469 59.94 25.175 SDTV 480p 60Hz PC mode

2. 640X480 31.469 60.00 25.20 SDTV 480p 60Hz -> Display

3. 720X480 31.47 59.94 27.00 SDTV 480p 60Hz 640*480

4. 720X480 31.50 60.00 27.027 SDTV 480p 60Hz

5. 720X576 31.25 50.00 27.000 SDTV 576p 50Hz

6. 1280X720 37.50 50.00 74.176 HDTV 720p 50Hz HDCP

7. 1280X720 44.96 59.94 74.176 HDTV 720p 60Hz HDCP

8. 1280X720 45.00 60.00 74.250 HDTV 720p 60Hz HDCP

9. 1920X1080 28.125 50.00 74.250 HDTV 1080i 50Hz HDCP

10. 1920X1080 33.72 59.94 74.176 HDTV 1080i 60Hz HDCP

11. 1920X1080 33.75 60.00 74.250 HDTV 1080i 60Hz HDCP

12. 1920X1080 27.00 24.00 74.250 HDTV 1080P 24Hz HDCP

13. 1920X1080 56.25 50.00 148.500 HDTV 1080P 50Hz HDCP

14. 1920X1080 67.433 59.94 148.352 HDTV 1080P 60Hz HDCP

15. 1920X1080 67.50 60.00 148.500 HDTV 1080P 60Hz HDCP

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

1. 720X400 31.468 70.08 28.32