LG 32LB551D-TC Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LB43T

MODEL : 32LB551D-TC 32LB551D-TC

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL67982519 (1402-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 8

BLOCK DIAGRAM ................................................................................. 14

EXPLODED VIEW .................................................................................. 15

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this service manual. CAUTION: Do not connect the test xture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some eld-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used LB43T chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.

5) The receiver must be operated for about5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

No. Item Specication Remarks

1. Market

2. Broadcasting system

3. Channel Storage ATV - 135EA, DTV - 1000EA

4. Receiving system

5. Video(Composite Input) PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60

6. Component Input Y/Cb/Cr, Y/Pb/Pr

7. HDMI Input

8. SPDIF out SPDIF out Except 32”HD model

9. USB Input For My Media(Movie/Photo/Music List) and SVC

10. Headphone

Asia, Oceania, Africa, Middle East (PAL/DVB Market)

1) PAL/SECAM-B/G/D/K/I

2) NTSC-M

3) DVB-T/T2

Analog : Upper Heterodyne Digital : COFDM(DVB-T)

HDMI1-DTV/DVI HDMI2-DTV/MHL

► DTV LB43B/LB43M support DVB-T LB43T support DVB-T//T2

► DVB-T

- Guard Interval (Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

► DVB-T2

- Guard Interval (Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,

- Modulation : Code Rate QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

Support HDCP

Only for training and service purposes

- 6 -

5. Component Video Input (Y, Cb/Pb, Cr/Pr)

No. Resolution H-freq(kHz) V-freq(Hz) Porposed

1 720×480 15.73 60.00 SDTV, DVD 480i

2 720×480 15.63 59.94 SDTV, DVD 480i

3 720×480 31.47 59.94 480p

4 720×480 31.50 60.00 480p

5 720×576 15.625 50.00 SDTV, DVD 625 Line

6 720×576 31.25 50.00 HDTV 576p

7 1280×720 45.00 50.00 HDTV 720p

8 1280×720 44.96 59.94 HDTV 720p

9 1280×720 45.00 60.00 HDTV 720p

10 1920×1080 31.25 50.00 HDTV 1080i

11 1920×1080 33.75 60.00 HDTV 1080i

12 1920×1080 33.72 59.94 HDTV 1080i

13 1920×1080 56.250 50 HDTV 1080p

14 1920×1080 67.5 60 HDTV 1080p

6. HDMI Input : Refer to adjust specification about EDID data.

6.1. DTV mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

1. 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P

2. 720*576 31.25 50 54 SDTV 576P

3. 1280*720 37.500 50 74.25 HDTV 720P

4. 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P

5. 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I

6. 1920*1080 28.125 50.00 74.25 HDTV 1080I

7. 1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 HDTV 1080P

8. 1920*1080 33.716/33.75 29.976/30.00 74.25 HDTV 1080P

9. 1920*1080 56.250 50 148.5 HDTV 1080P

10. 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P

6.2. PC mode

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 640*350 @70Hz 31.468 70.09 25.17 EGA

2. 720*400 @70Hz 31.469 70.08 28.321 DOS

3. 640*480 @60Hz 31.469 59.940 25.175 VESA(VGA)

4. 800*600 @60Hz 37.879 60.31 40.000 VESA(SVGA)

5. 1024*768 @60Hz 48.363 60.00 65.000 VESA(XGA)

6 1152*864 @60Hz 54.348 60.053 80.002 VESA

7. 1280*1024 @60Hz 63.981 60.020 108 VESA(SXGA) FHD only(Support to HDMI-PC)

8. 1360*768 @60Hz 47.712 60.015 85.5 VESA(WXGA)

9. 1920*1080 @60Hz 67.5 60.0 148.5

- 7 -

Only for training and service purposes

WUXGA (Reduced blanking)

FHD only(Support to HDMI-PC)

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with LB43T chassis.

2. Designation

(1) Th e ad justm ent is accord ing to the order whic h is

designated and which must be followed, according to the

plan which can be changed only on agreeing. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25 °C ± 5 °C Relative humidity : 65 ± 10 % Input voltage : 100-220 V~, 50/60 Hz

(6) Adjustment equipments

: Color Analyzer(CA-210 or CA-110), Service remote control.

(7) Push the “IN STOP" key - For memory initialization.

Case1 : Software version up

1. After downloading S/W by USB , TV set will reboot automatically.

2. Push “In-stop” key.

3. Push “Power on” key.

4. Function inspection

5. After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push “In-stop” key at rst.

2. Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

3. After function inspection, Push “In-stop” key.

(4) Click "Connect" tab. If "Can't" is displayed, check connection

between computer, jig and set.

(2)

(3)

Please Check the Speed : To use speed between from 200KHz to 400KHz

(5) Click "Auto" tab and set as below. (6) Click "Run". (7) After downloading, check "OK" message.

(4)

filexxx.bin

(5)

(7)...........OK

(6)

3. Main PCB check process

▪ APC - After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program "Mstar ISP Utility" and then click

"Config" tab.

(2) Set as below, and then click "Auto Detect" and check "OK"

message. If "Error" is displayed, check connection between computer, jig, and set.

(3) Click "Read" tab, and then load download file(XXXX.bin)

by clicking "Read"

(1)

filexxx.bin

* USB DOWNLOAD(*.epk file download)

(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.

- If version of update file in USB Stick is lower, it will not work. But version of update file is higher, USB data will be detected automatically.

Only for training and service purposes

- 8 -

(3) Show the message "Copying files from memory".

(4) Updating is starting.

4. ADC Process

4.1. ADC

- Enter Service Mode by pushing "ADJ" key,

- Enter Internal ADC mode by pushing "►" key at "8. ADC Calibration".

<Caution> Using "P-ONLY" key of the Adjustment remote

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration ►

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L

13. Sub B/C

14. Ext. Input Adjust

control, power on TV.

ADC Calibration

ADC Comp 480i

ADC Comp 1080p

ADC Type ◄ ►

Start

Reset

OPT

NG

(5) Updating Completed, the TV will restart automatically. (6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If updated version is higher than what TV has, the TV can

lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ATV test on production line.

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number) (4) Completed selecting Tool option.

*

RS-232C Connection Method.

Connection : PCBA (USB Port) → USB to Serial Adapter (UC-232A) → RS-232C cable → PC(RS-232C port)

● Product name of USB to Serial Adapter is UC-232A.

* ADC Calibration Protocol (RS232)

NO Item CMD 1 CMD 2 Data 0

Enter Adjust MODE

ADC adjust ADC Adjust A D 1 0

Adjust ‘Mode In’

A A 0 0

When transfer the ‘Mode In’, Carry the command.

Automatically adjustment (The use of a internal pattern)

Adjust Sequence ▪ aa 00 00 [Enter Adjust Mode] ▪ xb 00 40 [Component1 Input (480i)] ▪ ad 00 10 [Adjust 480i Comp1] ▪ aa 00 90 End Adjust mode * Required equipment : Adjustment remote control.

4.2. Function Check

4.2.1. Check display and sound

■ Check Input and Signal items.

(1) TV (2) AV (CVBS) (3) COMPONENT (480i) (4) HDMI * Display and Sound check is executed by Remote control.

<Caution> Not to push the "INSTOP" key after completion if

the function inspection.

Only for training and service purposes

- 9 -

5. Total Assembly line process

5.1. Adjustment Preparation

▪ W/B Equipment condition

CA210: CH14, Test signal: Inner pattern(80IRE)-LED Module

▪ Above 5 minutes H/run in the inner pattern. ("power on" key

of Adjustment remote control)

* Connecting picture of the measuring instrument

(On Automatic control) Inside Pattern is used when W/B is controlled. Connect to auto controller or push Adjustment Remote control POWER ON → Enter the mode of White-Balance, the pattern will come out.

* The spec of color temperature and coordinate.

Mode Color Temp Color coordinate Remark

Cool (C50) 13,000 K

Medium(0) 9,300 K

Warm(W50) 6,500 K

X=0.271 (±0.002) Y=0.270 (±0.002)

X=0.286 (±0.002) Y=0.289 (±0.002)

X=0.313 (±0.002) Y=0.329 (±0.002)

- Inner pattern for W/B adjust

- External white pattern

(80IRE, 204gray)

* W/B Table in process of aging time

- LGD Module

(normal line) March ~ December

Aging time(Min) Cool Medium Warm

color coordinate X y x y x y

Target 271 270 286 289 313 329 1 0-2 282 289 297 308 324 348 2 3-5 281 287 296 306 323 346 3 6-9 279 284 294 303 321 343 4 10-19 277 280 292 299 319 339 5 20-35 275 277 290 296 317 336 6 36-49 274 274 289 293 316 333 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329

(normal line) January ~ Feburary

Aging time Cool Medium Warm

color coordinate x y x y x y

Target 271 270 286 289 313 329 1 0-2 286 295 301 314 328 354 2 3-5 284 290 299 309 326 349 3 6-9 282 287 297 306 324 346 4 10-19 279 283 294 302 321 342 5 20-35 276 278 291 297 318 337 6 36-49 274 275 289 294 316 334 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329

- AUO/INX/COST/SHARP/BOE Module which cool spec is 13000 K

Cool Medium Warm

x y x y x y

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

Full White Pattern

RS-232C Communication

CA-210

COLOR ANALYZER TYPE : CA-210

* Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (Illumination is less than 10 lux).

(2) Adhere closely the Color analyzer(CA210) to the module

less than 10 cm distance, keep it with the surface of the Module and Color analyzer's prove vertically.(80° ~ 100°).

(3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.

▪ Auto adjustment Map(RS-232C)

RS-232C COMMAND [CMD ID DATA] Wb 00 00 White Balance Start Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

MIN

Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0.(When R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)

CENTER

(DEFAULT)

MAX

Only for training and service purposes

- 10 -

* Manual W/B process using adjust Remote control.

■ Color analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000.

■ Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting.

■ After enter Service Mode by pushing “ADJ” key,

■ Enter White Balance by pushing “►” key at “9. White Balance”.

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 10 Point WB

11. Test Pattern

12 EDID D/L

13. Sub B/C

14. Ext. Input Adjust

■ For manual adjustment, it is also possible by the following sequence.

(1) Set TV in Adj. mode using “P-ONLY” key on remote

controller and then operate heat run longer than 15 minutes.(If not executed this step, the condition for W/B

may be different.) (2) Push “Exit” key. (3) Enter White Balance mode by pushing the ADJ key and

select “9. White Balance”. When KEY (►) is pressed,

206 Gray internal pattern will be displayed. (4) Zero Calibrate the probe of Color Analyzer, then place it

on the center of LCD module within 10 cm of the surface (5) Select each items (Red/Green/Blue Gain) using ▲/▼

(CH +/-) key on Remote control. (6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C. (7) Adjust three modes all (Cool / Medium / Warm)

- For All model w/o LS345 Fix the one of R/G/B gain and change the others

- For G-FIX model Cool Mode

1) Fix the one of R/G/B gain to 192 (default data) and

decrease the others. (If G gain is adjusted over 172 and R and B gain less than 192 , Adjust is O.K.)

2) If G gain is less than 172, Increase G gain by up to

172, and then increase R gain and G gain same amount of increasing G gain.

3) If R gain or B gain is over 255, readjust G gain less

than 172, Conform to R gain is 255 or B gain is 255

Medium / Warm Mode - Fix the one of R/G/B gain to 192 (default data) and decrease the others.

(8) When adjustment is completed, exit adjustment mode

using EXIT key on Remote control.

Whit Balance

Color Temp. ◄ ►

R-Gain

G-Gain

B-Gain

R-Cut

G-Cut

B-Cut

Test-Pattern

Backlight

Reset To Set

Cool

172

192

64

ON

100

* CASE Cool

First adjust the coordinate far away from the target value(x, y).

1) x, y > target i) Decrease the R, G.

2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others.

3) x > target, y < target i) First decrease B, so make y a little more than the

target.

ii) Adjust x value by decreasing the R.

4) x < target, y > target i) First decrease B, so make x a little more than the

target.

ii) Adjust x value by decreasing the G.

* After You finish all adjustments, Press “In-start” button

and compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.

If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.

* Push the “IN STOP" key after completing the function

inspection.

5.2. DDC EDID Write (HDMI 256Byte)

■ Connect HDMI Signal Cable to HDMI Jack.

■ Write EDID DATA to EEPROM(24C02) by using DDC2B protocol.

■ Check whether written EDID data is correct or not.

* For SVC main Assembly, EDID have to be downloaded to

Insert Process in advance.

5.3. EDID DATA

1) All Data : HEXA Value

2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***: Year : Controlled ****: Check sum

- Auto Download

■ After enter Service Mode by pushing “ADJ” key,

■ Enter EDID D/L mode.

■ Enter “START” by pushing “OK” key.

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L ►

13. Sub B/C

14. Ext. Input Adjust

EDID D/L

HDMI1 NG

HDMI2 NG

Reset

Start

EDID D/L

HDMI1 OK

HDMI2 OK

Reset

Start

Only for training and service purposes

- 11 -

[Caution]

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

* Edid data and Model option download (RS232)

NO Item CMD 1 CMD 2 Data 0

Enter download Mode

EDID data and Model option download

(1) FHD 8BIT 2D HDMI EDID DATA

0 00 FF FF FF FF FF FF 0 0 1E 6D A B 10 C 01 03 80 A0 5a 78 0A EE 91 A3 54 4C 99 26 20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 4 0 81 80 30 01 01 01 01 01 01 02 3A 8 0 18 71 38 2D 40 58 2C 40 45 0 0 A0 5A 00 00 00 1E 66 21 50 B 0 51 00 1B 30 50 40 70 36 00 A0 5A 0 0 00 0 0 1E 0 0 00 00 FD 00 3A

60 3E 1E 53 10 00 0A 20 20 20 20 20 20 D

70 D 01 E 80 02 03 22 F1 4E 10 9F 04 13 05 14 03 02 12 20 21 90 22 15 01 26 15 07 50 09 57 07 f

A0 80 1E 01 1d 80 18 71 1c 16 20 58 2c 25 00 20 C2 B0 31 00 0 9e 01 1d 00 72 51 d0 1e 20 6e 28 55 00 C0 20 C2 31 00 00 1e 02 3a 80 18 71 38 2d 40 58 2c D0 45 00 A0 5a 00 00 00 1e 01 1d 00 Bc 52 d0 1e 2 0 E0 B8 28 55 40 C4 8e 21 00 00 1e 00 00 00 00 0 0 00 F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 E

(2) HD 8BIT 2D HDMI EDID DATA

0 0 f f f f ff ff ff ff 00 1E 6D a b 10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 4 0 01 01 30 01 01 01 01 01 01 6 6 21 5 0 B0 51 00 1B 30 40 70 40 36 0 0 40 8 4 63 00 00 1E 64 19 00 40 40 00 26 30 50 18 8 8 03 0 6 40 84 63 0 0 00 18 00 00 00 FD 0 0 3 A

60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d

70 d 01 e 80 02 03 22 F1 4E 10 1F 04 93 05 14 03 02 12 20 21 90 22 15 01 26 15 07 50 09 57 07 f

A0 80 1E 01 1D 80 18 71 1C 16 20 58 2C 25 00 A0 5A B0 00 00 00 9E 01 1d 00 72 51 D0 1E 20 6E 28 5 5 00 C0 20 C2 31 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E D0 96 00 A0 5A 00 00 00 18 02 3A 80 18 71 38 2D 4 0 E0 58 2C 45 00 A0 5A 00 00 00 1E 00 00 00 00 0 0 00 F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

(3) Detail EDID Options are below

Model Name HEX EDID Table DDC Function

HD/FHD Model 0001 01 00 Analog/Digital

MODEL NAME MODEL NAME(HEX)

LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)

Download ‘Mode In’

ADC Adjust A E 00 10

A A 0 0

When transfer the ‘Mode In’, Carry the command.

Automatically adjustment (The use of a internal pattern)

No. Item Condition Hex Data

1 Manufacturer ID GSM 1E6D

2 Version Digital : 1 01

3 Revision Digital : 3 03

0 1 2 3 4 5 6 7 8 9 A B C D E F

a. Product ID

b. Serial No: Controlled on production line. c. Month, Year: Controlled on production line:

ex) Week : '01' -> '01'

Year : '2014' -> '18' fix d. Model Name(Hex): Refer to the ASCII Code Table. Cf) model name in EDID data is below.

e. Checksum: Changeable by total EDID data.

EDID C/S data

Check Sum

(Hex)

Block 0 41 75 75

Block 1

FHD-8BIT HD 2D(DTS) HD

HDMI HDMI HDMI

25 (HDMI1) 5B (HDMI1) 52 (HDMI1)

15 (HDMI2) 4B (HDMI2) 42 (HDMI2)

f. Vendor Specific

- FHD/HD 8bit Model Input Model name(HEX)

HDMI1 67030C001000 HDMI2 67030C002000

5.4. Outgoing condition Configuration

■ When pressing IN-STOP key by Service remote control, Red LED are blinked alternatively. And then automatically turn off. (Must not AC power OFF during blinking)

5.5. GND and HI-POT Test

5.5.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition.

(2) You can’t use Tuner Ground & Tuner signal line at all

models (applied Isolator inner tuner)

5.5.2. GND & HI-POT auto-check

(1) Pallet moves in the station.(POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process(Hi-pot test). (Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process automatically.

5.5.3. Checkpoint

(1) Test voltage

1) 3 Poles

- GND: 1.5 KV/min at 100 mA

- SIGNAL: 3 KV/min at 100 mA

2) 2 Poles

- SIGNAL: 3 KV/min at 100 mA (2) TEST time: 1 second (3) TEST POINT

1) 3 Poles

- GND Test = POWER CORD GND and SIGNAL

CABLE GND.

- Hi-pot Test = POWER CORD GND and LIVE &

NEUTRAL.

2) 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5 mArms

Only for training and service purposes

- 12 -

6. 3D function test

(Pattern Generator MSHG-600, MSPG-6100[Support HDMI1.4]) * HDMI mode No. 872 , pattern No.83 (1) Please input 3D test pattern like below.

(2) When 3D OSD appear automatically, then select OK button.

(3) Don't wear a 3D Glasses, check the picture like below.

Only for training and service purposes

- 13 -

BLOCK DIAGRAM

SPK_L

IC1300

IC104

(8Mbit)

Serial Flash

(256Kbit)

System EEPROM

24M

X-tal

I2C_SC L/SDA

SPI_SCK /SDI/SD O/CS

AUD_LR CH,

AUD_MASTER _CLK,

SPK_R

30P HD LVDS wafer

(P1801)

51P FHD LVDS wafer

(P1800)

(P4600)

(IC3401)

STA380BW

AMP_SCL/ SDA

AUD_LR CK, AUD_SCK

Connector

KEY1/2, LED_R , IR

RXA0+/-~RXA4+/-, RXACK+/-

RXB0+/ -~RXB4+/-, RXB CK+/-

(IC101)

Main SOC

M1A -256MB ͳΦΚΝΥΚΟ

USB1_OC P/CTL

AVDD5V_MH L,MHL _OCP

TPS65282

SIDE_U SB_DM/D P

+5V_USB

MHL _CD_SENSE

HP_L/ ROUT, SID E_HP_MUTE

CK+/ -, D0+/-, D1+/-, D2+/-, _HDMI 4, DDC_SC L/SDA_4, HDM I_CEC

5V_HDM I_4

PCM_A[0:7]

SC1_R+/ G+/B+, COM1_Y+/Pb +/Pr+

EPHY

IC102 (1Gbi t)

NAND F LASH

TC74LCX244FT

Buffer

TS_DATA[0:7]

H27U1G8F 2CTR-BC

PCM_A[8:14]

PCM_D ATA[0:7]

LNB _TX

FE_TS_D ATA[0:7]

LNB _OUT, DEMOD _RESET

IF_N /P

IF_AGC

TU_SC L / SDA

DEMOD _SCL/SDA

SPDIF _OUT

DDC _SCL/SDA_2, HD MI_CEC

CK+/ -, D0+/-, D1+/-, D2+/-_H DMI2

SC1/AV2_CVB S_IN,

COMP2_L /R_IN

DTV/ MNT_OUT , DTV/MN T_L/R_OUT

COMP2_Y+/ AV_CVB S_IN, COMP2_Pb +/Pr +

CI Slot(P1900)

F/N IM

USB

(JK700)

(JK801)

(JK3000)

Headp hone

HDM I2(MHL)

HDM I1

SIDE

LAN

(JK2801)

(JK2100)

(JK800)

SPDIF (Optic)

F-SCART

(JK1001)

(JK2802)

COMPON ENT

REAR

Only for training and service purposes

- 14 -

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

500

400

502

501

521

121

410

900

540

530

LV1

120

200

Only for training and service purposes

- 15 -

A10

Set + Stand

A2

TP for NON-EU models(except EU and China)

LGE Internal Use Only

TP for CI slot

/PCM_REG

/PCM_OE

/PCM_WE

/PCM_IORD PCM_A[11]

/PCM_IOWR CI_TS_DATA[1]

/PCM_CE

/PCM_IRQA

/PCM_CD

/PCM_WAIT

PCM_RST

PCM_5V_CTL

/CI_DET

TP for S2

PCM_D[0]

PCM_D[2]

PCM_D[3]

PCM_D[4]

PCM_D[5]

PCM_D[6]

PCM_D[7]

PCM_A[8]

PCM_A[9]

PCM_A[10]

PCM_A[12]

PCM_A[13]

PCM_A[14]

TP for FE_TS_DATA

CI_TS_CLK

CI_TS_VAL

CI_TS_SYNC

CI_TS_DATA[0]

CI_TS_DATA[2]

CI_TS_DATA[3]

CI_TS_DATA[4]

CI_TS_DATA[5]

CI_TS_DATA[6]

CI_TS_DATA[7]

TP for SCART

SCART1_MUTE

SC1_IDPCM_D[1]

SC1_FB

DTV/MNT_VOUT

SCART1_Lout

SCART1_Rout

SC1_R+/COMP1_Pr+

SC1_G+/COMP1_Y+

SC1_B+/COMP1_Pb+

SC1/COMP1_DET

SC1/COMP1_L_IN

SC1/COMP1_R_IN

TP for Headphone

HP_LOUT

HP_ROUT

SIDE_HP_MUTE

HP_DET

FE_TS_DATA[1]

FE_TS_DATA[2]

FE_TS_DATA[3]

FE_TS_DATA[4]

FE_TS_DATA[5]

FE_TS_DATA[6]

FE_TS_DATA[7]

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC5_L14

TP_NON_EN

2013.05.09 3

L14 POWER BLOCK (POWER DETECT 2)

LGE Internal Use Only

FROM LIPS or POWER B/D

+3.5V_ST

OPT

R400

10K

R402

R401

10K

C407 10uF

2012

10V

10K

+3.5V_POWER_DET

L400

CB2012PK501T

C400

+24V_CAP

C432

4.7uF

3216

+12V_CAP

C433

4.7uF

3216

RL_ON

+3.5V_ST

+24V

+12V

1uF 10V

1005

50V

16V

B

OPT

+3.5V_ST

R406 10K

R404

4.7K

C

Q400 MMBT3904(NXP)

E

R456

ZD400

5V

MLB-201209-0120P-N2

C401

0.1uF 50V

MLB-201209-0120P-N2

C402

0.1uF 16V

MMBT3906(NXP)

1

OPT

0

L401

CB2012PK501T

L402

L403

Q401

2

R455

3

0

ZD404

+1.5V_DDR

+3.3V_Normal

L409

BLM18PG121SN1D

C426 10uF

AZ1117EH-ADJTRG1

ADJ/GND

10V

1.3A

OPT

R412

33K

+3.3V_Normal

R420

1K

5V

PWR ON

3.5V

3.5V GND 24V GND 12V 12V GND

P401

SMAW200-H18S5

1

2

3

4

5

6

7

8

10

9 11

12

13

14

15

16

17

18

19

.

DRV ON PDIM#1

3.5V PDMI#2 24V GND 12V NC GND

R419 100

PWM_DIM_PULL_DOWN

R424

3.9K

Vout=1.25*(1+R2/R1)+Iadj*R2

+1.5V_DDR

IC404

OUTIN

R449 1K 1/16W 1%

R450 200 1/16W 1%

R1

R2

L411

CB2012PK501T

R453

0

C431 10uF

10V

ZD403

2.5V

C

B

E

Q402

MMBT3904(NXP)

PWM2_2CH_POWER

R425 10K

R423

100

+3.5V_ST

R426

10K

OPT R467 1K

INV_CTL

PWM_DIM

PWM1

R457

8.2K

C415

0.1uF 16V

C413

0.1uF 16V

+24V

OPT

1%

OPT

R430

2.7K

R431

1.2K

R427

R428

5.1K

OPT

27K

1%

OPT

+12V

1%

+24V

1%

+3.5V_POWER_DET

OPT

R432

0

5%

+3.5V_POWER_DET

OPT

R458

0

5%

Ready - Dual Power Det

* Notice

- Applying all inch models for LCD L14

- Dual Power Det is used for detecting two kinds of voltage

+1.10V_VDDC

ZD401

2.5V

+3.5V_ST

OPT

C424

0.1uF 16V

C437

0.1uF

CB2012PK501T

OPT C436 10uF

10V

16V

C420

C421

22uF

10V

VCC

APX803D29

3

APX803D29

3

L406

C423

50V

270pF

GND

R435 100K

IC401

OPT

R436

100K

OPT

IC402

C414 10uF

10V

2

1

2

1

0.1uF

R43 9

20K

1%

R44 0

47K

1%

PD_+3.5V

R454-*1 300

5%

PD_+12V

R454

RESET

100 5%

POWER_DET_RESET

OPT

R437

100 5%

Detect Valtage

Power Detect +3.5V

Power Detect +12V

Power Detect +24V

C435

16V

C417

L407

0.1uF

3.6uH 16V

R1

R2

+3.5V_ST

OPT

R438

4.7K

C422

0.1uF

Power_DET

POWER_DET

Power Detect activity

Now is

Use Circuit Designator

R432, R454-*1, R438

O R430, R431, R454

R457, R454

IC403

TPS5432DDAR

BOOT

VIN

PH

GND

1

2

3

4

3A

9

THERMAL

8

7

6

5

[EP]GND

SS

EN

COMP

VSENSE

C418

0.01uF

R433

2.7K

C419

0.039uF 50V

1%

Vout=0.808*(1+R1/R2)

C434

390pF

50V

+3.3V_Normal

R429

10K

C416

0.33uF 16V

PANEL_VCC

PANEL_CTL

+3.3V_Normal

POWER_ON/OFF_1

L408

UBW2012-121F

120OHM

OPT

C425

0.1uF 25V

R441

10K

+3.5V_ST

R443

10K

R444 10K

+12V

B

R447 22K

R448

2.2K

R442

10K

C

Q404 MMBT3904(NXP)

E

C428

2.2uF 10V

R445

R446 12K

B

33K

C427 10uF

16V

C

Q403 MMBT3904(NXP)

E

FET_2.5V_DIODE

Q406-*1 DMP2130L

S

FET_2.5V_AOS

Q406

AO3435

S

PANEL_VCC

Q405

DMP2130L

D

S

R451

R452

5.6K

L410

C430 22uF 10V

5.6K

+3.3V_Normal

ZD402

5V

G

D

G

BLM18PG121SN1D

D

C429

G

0.1uF 16V

+5V_Normal & +5V_USB with OCP

OPT

C403

100pF

50V

R408

OPT

R405

4.7K

/VBUS_EN

(Active Low)

MHL_OCP_EN

(Active High)

+3.3V_Normal

MHL_SW_TR

R461

10K

MHL_SW_TR

R462

10K

Q407

B

R463

2.7K

C

MHL_SW_TR

E

MHL_SW_TR

Q409

MHL_SW_TR R464 10K

MHL_SW_TR

Q408

E

B

R465

10K

B

+3.3V_Normal

OPT R403

4.7K

MHL_5V_EN

USB1_CTL

C

MHL_5V_EN

R466

20K

C

E

R410 100K

C404

4700pF

50V

OPT

R459

0

+3.3V_Normal

R407

R409

10K

COMP

ROSC

EN_SW2

EN_SW1

[EP]GND

V7V

EN

1

2

SS

3

4

TPS65282REGR

5

6

FAULT2

+12V

C405 10uF

VIN_223PGOOD

24

THERMAL

25

IC400

4A

7

8

FAULT1

SW_OUT2

USB1_OCD

/MHL_OCP_DET

22

9

C406 10uF 16V

PGND_2

VIN_1

21

10

RLIM11AGND

R415 15K

5%

OPT R416 100K

PGND_1

19

20

18

17

16

15

14

13

12

SW_OUT1

D401

MBR230LSFT1G

C409

L405

0.047uF

4.7uH

25V

BST

LX_2

LX_1

FB

SW_IN_2

SW_IN_1

C410

5V_HDMI_4

10uF

10V

AVDD5V_MHL

R418

10

+5V_USB

30V

C408 10uF

10V

Vout=0.8*(1+R1/R2)

R422

3.3K

R421

R1 R2

+5V_Normal

C411 82pF 50V

C412 22uF 16V

18K 1%

1%

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_M1A

Power_PD2

2013.10.28 4

USB (SIDE)

LGE Internal Use Only

JK700

1234

USB DOWN STR EAM

3AU 04S-3 05-Z C-(LG )

5

OPT C701

5pF 50V

OPT C702

5pF 50V

ZD700

SD05

5V

OPT

+5V_USB

C700 22uF 10V

OPT D700 RCLAMP0502BA

C703 22uF 10V

USB_HDD_CAP

SIDE_USB1_DM

SIDE_USB1_DP

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_M1A

USB_S1

13/04/30

7

HDMI (REAR 1 / SIDE 1 MHL)

LGE Internal Use Only

HDMI_1

SHIELD

20

19

18

17

16

15

14

13

12

11

CK+

10

EAG59023302

JK800

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

5V_HDMI_2

R803

1K

R802

1.8K

VA800

ESD_HDMI1_VARISTOR

5V_DET_HDMI_2

ESD_HDMI1

R805

3.3K

VA801

ESD_HDMI1_VARISTOR

VA800-*1 1uF 10V

ESD_HDMI1_CAP

VA801-*1 1uF 10V

ESD_HDMI1_CAP

VA802

MMBT3904(NXP)

Q800

C

E

VA803

ESD_HDMI1

R808

10K

B

R809

10K

R810 100

R811 100

VA804

ESD_HDMI1

D803

1 2 3 4 5

ESD_HDMI1_IP4294

IP4294CZ10-TBR

D804

1 2 3 4 5

ESD_HDMI1_IP4294

IP4294CZ10-TBR

10 9 8 7 6

HPD2

DDC_SDA_2

DDC_SCL_2

HDMI_ARC HDMI_CEC

CK-_HDMI2

CK+_HDMI2

D0-_HDMI2

D0+_HDMI2

D1-_HDMI2

D1+_HDMI2

D2-_HDMI2

D2+_HDMI2

HDMI_2 MHL

VA805

ESD_HDMI2

GND

20

HP_DET

19

5V

18

GND

17

DDC_DATA

16

DDC_CLK

15

NC

14

CE_REMOTE

13

CK-

12

CK_GND

11

CK+

10

BODY_SHIELD

20

19

HOT_PLUG_DETECT

18

VDD[+5V]

17

DDC/CEC_GND

16

SDA

15

SCL

14

RESERVED

13

CEC

12

TMDS_CLK-

11

TMDS_CLK_SHIELD

10

TMDS_CLK+

9

TMDS_DATA0-

8

TMDS_DATA0_SHIELD

7

TMDS_DATA0+

6

TMDS_DATA1-

5

TMDS_DATA1_SHIELD

4

TMDS_DATA1+

3

TMDS_DATA2-

2

TMDS_DATA2_SHIELD

1

TMDS_DATA2+

JK801-*1 DAADR019A

HDMI-2_EMI_FOOSUNG

EAG62611204

JK801

HDMI-2

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

5V_HDMI_4

R812

1.8K

HDMI-2

5V_DET_HDMI_4

ESD_HDMI2

VA806

R813

3.3K HDMI-2

VA807

5.6V OPT

ESD_HDMI2 VA808

ESD_HDMI2

VA809

HDMI-2

R814

33

HDMI-2

R815 100

R816 100

HDMI-2

VA810

ESD_HDMI2

VA811

ESD_HDMI2

1 2 3 4 5

ESD_HDMI2_IP4294

IP4294CZ10-TBR

1 2 3 4 5

ESD_HDMI2_IP4294

IP4294CZ10-TBR

C800

0.047uF 25V

HDMI-2

D805

D806

10 9 8 7 6

R817 300K

MHL Spec

HDMI-2

HPD4

DDC_SDA_4

DDC_SCL_4

HDMI_CEC

CK-_HDMI4

CK+_HDMI4

D0-_HDMI4

D0+_HDMI4

D1-_HDMI4

D1+_HDMI4

D2-_HDMI4

D2+_HDMI4

MHL_CD_SENSE

CEC

R804

A2CA1

MMBD6100 D800

100

DDC_SDA_2

DDC_SCL_2

CEC_REMOTE_S7

5V_HDMI_4

R806

2.7K

+5V_Normal

A2CA1

MMBD6100 D801

R807

2.7K

+3.5V_ST

DDC_SDA_4

DDC_SCL_4

A2CA1

MMBD6100 D802

HDMI_CEC

5V_HDMI_2

R800

2.7K

+5V_Normal

R801

2.7K

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

D803-*1

TMDS_CH1-

1

2

GND_1

3

4

5

D803-*2

1 2 3 4 5

10

9

8

7

6

10 9 8 7 6

TMDS_CH1+

TMDS_CH2-

TMDS_CH2+

ESD_HDMI1_IP4283

IP4283CZ10-TBA

ESD_HDMI1_SEMTECH

RCLAMP0524PA

NC_4

NC_3

GND_2

NC_2

NC_1

D804-*1

TMDS_CH1-

1

2

GND_1

3

4

5

D804-*2

1 2 3 4 5

10

10 9 8 7 6

TMDS_CH1+

TMDS_CH2-

TMDS_CH2+

ESD_HDMI1_IP4283

IP4283CZ10-TBA

ESD_HDMI1_SEMTECH

RCLAMP0524PA

D805-*1

NC_4

NC_3

9

GND_2

8

NC_2

7

NC_1

6

TMDS_CH1-

1

2

GND_1

3

4

5

D805-*2

1 2 3 4 5

10

10 9 8 7 6

TMDS_CH1+

TMDS_CH2-

TMDS_CH2+

ESD_HDMI2_IP4283

IP4283CZ10-TBA

ESD_HDMI2_SEMTECH

RCLAMP0524PA

NC_4

NC_3

9

GND_2

8

NC_2

7

NC_1

6

D806-*1

TMDS_CH1-

1

TMDS_CH1+

2

GND_1

3

TMDS_CH2-

4

TMDS_CH2+

5

ESD_HDMI2_IP4283

IP4283CZ10-TBA

D806-*2

1 2 3 4 5

ESD_HDMI2_SEMTECH

RCLAMP0524PA

L14_M1A

NC_4

10

NC_3

9

GND_2

8

NC_2

7

NC_1

6

10 9 8 7 6

2013/08/15

HDMI_R1_S1 8

SPDIF

LGE Internal Use Only

SPDIF OPTIC JACK

5.15 Mstar Circuit Application

SPDIF_OUT

+3.3V_Normal

C1001 1uF

OPT

10V

ESD Ready

SPDIF_CAP_47pF C1002 47pF 50V

SPDIF_CAP_18pF C1002-*1 18pF 50V

VINPUT

SPDIF_OPTIC JST1223-001

GND

VCC

JK1001

1

2

3

Fiber Optic

4

FIX_POLE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC5_L14

SPDIF

2013/10/29

10

LVDS (NON EU)

LGE Internal Use Only

[51Pin LVDS Connector] (For FHD 60Hz)

MO_FHD

P1100

FI-RE51S-HF-J-R1500

.

1

.

2

.

3

.

4

.

5

.

6

.

7

.

8

.

9

.

10

.

11

RXA0-

12

RXA0+

13

RXA1-

14

RXA1+

15

RXA2-

16

RXA2+

17

.

18

RXACK-

19

RXACK+

20

.

21

RXA3-

22

RXA3+

23

RXA4-

24

RXA4+

25

.

26

.

27

RXB0-

28

RXB0+

29

RXB1-

30

RXB1+

31

RXB2-

32

RXB2+

33

.

34

RXBCK-

35

RXBCK-

36

.

37

RXB3-

38

RXB3+

39

RXB4-

40

RXB4+

41

.

42

.

43

.

44

.

45

.

46

.

47

.

48

.

49

.

50

.

51

52

.

VCOM_SDA

VCOM_SCL

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2-

RXB1+

RXB1-

RXB0+

RXB0-

R1100 0

MO_FHD

R1101 0

R1102 0

MO_FHD

LVDS_SEL

+3.3V_Normal

OPT R1103

3.3K

OPT R1104

10K

PANEL_VCC

MO_FHD

L1100 120OHM UBW2012-121F

MO_FHD

C1100

0.1uF 16V

FOR FHD REVERSE(10bit) Change in S7LR

MIRROR

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2- RXBCK-

RXB1+

RXB1-

RXB0+

RXB0-

Pol-change

RXA0+

RXA0-

RXA1+

RXA1-

RXA2+

RXA2-

RXACK+

RXACK-

RXA3+

RXA3-

RXA4+

RXA4-

RXB0+

RXB0-

RXB1+

RXB1-

RXB2+

RXB2-

RXBCK+

RXB3+

RXB3-

RXB4+

RXB4-

FOR FHD REVERSE(8bit) Change in S7LR

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2-

RXB1+

RXB1-

RXB0+

RXB0-

MIRROR

Pol-change

RXA4+

RXA4-

RXA0+

RXA0-

RXA1+

RXA1-

RXA2+

RXA2-

RXACK+

RXACK-

RXA3+

RXA3-

RXB4+

RXB4-

RXB0+

RXB0-

RXB1+

RXB1-

RXB2+

RXB2-

RXBCK+

RXBCK-

RXB3+

RXB3-

RXA0-

RXA0+

RXA1-

RXA1+

RXA2-

RXA2+

RXACK-

RXACK+

RXA3-

RXA3+

RXA4-

RXA4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXB4-

RXB4+

Shift

RXA4-

RXA4+

RXA0-

RXA0+

RXA1-

RXA1+

RXA2- RXACK-

RXA2+

RXACK-

RXACK+

RXA3-

RXA3+

RXB4-

RXB4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXA0-

RXA0+

RXA1-

RXA1+

RXA2-

RXA2+

RXACK+

RXA3-

RXA3+

RXA4-

RXA4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXB4-

RXB4+

[30Pin LVDS Connector] (For HD 60Hz_Normal)

MO_HD P1101

10031HR-30

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

VCOM_SCL

VCOM_SDA

LVDS_SEL

+3.3V_Normal

OPT R1109

3.3K

OPT R1110 10K

EU pin assign is different from NON EU. Because of position of HD wafer.

V-COM I2C

+3.3V_Normal

VCOM_I2C_PULL_UP

R1115 2K

URSA/VCOM_SCL

URSA/VCOM_SDA

VCOM_SCL

VCOM_SDA

VCOM_I2C_PULL_UP

R1114

VCOM_I2C

R1105

0

R1106

0

VCOM_I2C

2K

PANEL_VCC

120OHM

MO_HD

MO_HD L1101

UBW2012-121F

C1101

0.1uF 16V

URSA/VCOM_SCL

URSA/VCOM_SDA

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_S7LR(M1A)

LVDS_NON_EU

2013/05/22

11

R12011K1%

LGE Internal Use Only

DDR_EXT

R1202 1K1%

DDR_EXT

C1201 0.1uF

DDR_EXT

C1202 1000pF

A-MVREFDQ

+1.5V_DDR+1.5V_DDR

DDR_EXT

R1204 1K1%

DDR_EXT

R1205 1K1%

DDR_EXT

C1213 0.1uF

1000pF

DDR_EXT

C1214

A-MVREFCA

Option : Ripple Check !!!

+1.5V_DDR

C1217

C1216

10uF 10V

OPT

0.1uF

C1218

OPT

0.1uF

C1219

OPT

+1.5V_DDR

1uF

C1222

OPT

C1223

OPT

1uF

0.1uF

C1224

OPT

C1220

OPT

C1221

OPT

CLose to DDR3

DDR_1600_1G_SS

IC1201-*1

K4B1G1646G-BCK0

EAN61836301

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

M7

NC_5

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

CLose to Saturn7M IC

DDR_1600_1G_HYNIX

IC1201

DDR_1600_2G_HYNIX_OLD

IC1201-*2

H5TQ2G63DFR-PBC

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

N3 P7 P3 N2 P8 P2 R8 R2 T8 R3 L7 R7 N7 T3

M7

M2 N8 M3

J7 K7 K9

L2 K1 J3 K3 L3

T2

F3 G3

C7 B7

E7 D3

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

EAN61829203

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12/BC A13

NC_5

BA0 BA1 BA2

CK CK CKE

CS ODT RAS CAS WE

RESET

DQSL DQSL

DQSU DQSU

DML DMU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

VREFCA

VREFDQ

ZQ

VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9

VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9

NC_1 NC_2 NC_3 NC_4 NC_6

VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8

VSS_9 VSS_10 VSS_11 VSS_12

VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9

M8

H1

L8

B2 D9 G7 K2 K8 N1 N9 R1 R9

A1 A8 C1 C9 D2 E9 F1 H2 H9

J1 J9 L1 L9 T7

A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9

B1 B9 D1 D8 E2 E8 F9 G1 G9

DDR_1600_2G_HYNIX_NEW

IC1201-*3

H5TQ2G63FFR-PBC

EAN61829204

N3

VREFCA

A0

P7

A1

P3

A2

N2

A3

VREFDQ

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7 R7 N7 T3

M7

M2 N8 M3

J7 K7 K9

L2 K1 J3 K3 L3

T2

F3 G3

C7 B7

E7 D3

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

VDD_1

A10/AP

VDD_2

A11

VDD_3

A12/BC

VDD_4 VDD_5

A13

VDD_6 VDD_7

NC_5

VDD_8 VDD_9

BA0 BA1 BA2

VDDQ_1 VDDQ_2

CK

VDDQ_3

CK

VDDQ_4

CKE

VDDQ_5 VDDQ_6

CS

VDDQ_7

ODT

VDDQ_8

RAS

VDDQ_9

CAS WE

NC_1 NC_2

RESET

NC_3 NC_4 NC_6

DQSL DQSL

VSS_1

DQSU

VSS_2

DQSU

VSS_3 VSS_4

DML

VSS_5

DMU

VSS_6 VSS_7

DQL0

VSS_8

DQL1

VSS_9

DQL2

VSS_10

DQL3

VSS_11

DQL4

VSS_12

DQL5 DQL6 DQL7

VSSQ_1 VSSQ_2

DQU0

VSSQ_3

DQU1

VSSQ_4

DQU2

VSSQ_5

DQU3

VSSQ_6

DQU4

VSSQ_7

DQU5

VSSQ_8

DQU6

VSSQ_9

DQU7

DDR_1600_2G_SS

IC1201-*4

K4B2G1646Q-BCK0

M8

H1

L8

ZQ

B2 D9 G7 K2 K8 N1 N9 R1 R9

A1 A8 C1 C9 D2 E9 F1 H2 H9

J1 J9 L1 L9 T7

A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9

B1 B9 D1 D8 E2 E8 F9 G1 G9

N3 P7 P3 N2 P8 P2 R8 R2 T8 R3 L7 R7 N7 T3

M7

M2 N8 M3

J7 K7 K9

L2 K1 J3 K3 L3

T2

F3 G3

C7 B7

E7 D3

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

EAN61848803

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12/BC A13

NC_5

BA0 BA1 BA2

CK CK CKE

CS ODT RAS CAS WE

RESET

DQSL DQSL

DQSU DQSU

DML DMU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT

+1.5V_DDR

10V

A-MVREFCA

A-MVREFDQ

DDR_EXT

C1203 10uF C1204 0.1uF C1205 0.1uF C1206 0.1uF C1207 0.1uF C1208 0.1uF C1209 0.1uF C1210 0.1uF C1211 0.1uF C1212 0.1uF

R1203

240

1%

A-MA14

H5TQ1G63EFR-PBC

EAN61829003

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

A10/AP

A12/BC

NC_7

NC_5

RESET

DQSL DQSL

DQSU DQSU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7 R7

A11

N7 T3

M7

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

F3 G3

C7 B7

E7

DML

D3

DMU

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

A-MA0 A-MA1 A-MA2 A-MA3 A-MA4 A-MA5 A-MA6 A-MA7 A-MA8 A-MA9 A-MA10 A-MA11 A-MA12 A-MA13

A-MBA0 A-MBA1 A-MBA2

A-MCKE

A/B_DDR3_CS

A-MODT A-MRASB A-MCASB A-MWEB

A-MRESETB

A-MDQSL A-MDQSLB

A-MDQSU A-MDQSUB

A-MDML A-MDMU

A-MDQL0 A-MDQL1 A-MDQL2 A-MDQL3 A-MDQL4 A-MDQL5 A-MDQL6 A-MDQL7

A-MDQU0 A-MDQU1 A-MDQU2 A-MDQU3 A-MDQU4 A-MDQU5 A-MDQU6 A-MDQU7

R1207

DDR_EXT

R1208

DDR_EXT

R1206 10K

DDR_EXT

56 1%

C1215

0.01uF 50V

56 1%

+1.5V_DDR

A-MCK

A-MCKB

A-MDQSUB

A-MDQSLB

A-MDQSU

A-MDQSL

A-MA0 A-MA1 A-MA2 A-MA3 A-MA4 A-MA5 A-MA6 A-MA7 A-MA8

A-MA9 A-MA10 A-MA11 A-MA12 A-MA13 A-MA14

A-MBA0 A-MBA1 A-MBA2

A-MCK A-MCKB A-MCKE

A-MODT

A-MRASB A-MCASB

A-MWEB

A-MRESETB

A/B_DDR3_CS

A-MDML A-MDMU

A-MDQL0

A-MDQL1 A-MDQL2 A-MDQL3 A-MDQL4 A-MDQL5 A-MDQL6 A-MDQL7 A-MDQU0 A-MDQU1 A-MDQU2 A-MDQU3 A-MDQU4 A-MDQU5 A-MDQU6 A-MDQU7

R1209

240

1%

M1A_256M

IC101

LGE2132(M1A_256M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

M1A_128M IC101-*1

LGE2131(M1A_128M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC5_S7LR(M1A)

1_DDR

2013/05/20

12