LG 32LB530A-TA Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LB35B

MODEL : 32LB530A 32L530A-TA

CAUTION

BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL67732808 (1404-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS .................................................................... 4

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

BLOCK DIAGRAM .................................................................................. 13

EXPLODED VIEW .................................................................................. 14

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental sh orts of the cir cui try that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 1 MΩ and 5.2 MΩ.

When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor

between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage

measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.

In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau­tions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo­sion hazard.

2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam­age caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharg­ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.

2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec­trically shorted together by conductive foam, aluminum foil or
comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate­rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir­cuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropri­ate tip size and shape that will maintain tip temperature within

the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)

b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo­nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique

as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close
as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remain­ing on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos­sible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.

3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when­ever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec­tions).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con­nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

Only for training and service purposes

- 5 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LB35B chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %

(3) Power Voltage

: Standard input voltage (AC 100-240 V~, 50/60 Hz)

* Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

ea ch dra wing and spe cificat ion by part n umber in
accordance with BOM.

(5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

* HDMI 1.4 with Deep Color is only apply for FHD Model

No. Item Specication Remarks

1. Market NON EU

PAL/SECAM B/G/D/K

2. Broadcasting system

BAND PAL(BG,I) NTSC(M) China(DK)

3. Channel Storage

4. Receiving system Upper Heterodyne

5. Video Input PAL, SECAM, NTSC Rear (2EA)

6. Component Input Y/Cb/Cr, Y/Pb/Pr Rear (1EA)

7. USB Input MP3, JPEG,Movie Side(1EA)

8. AV Audio Output RF/AV/HDMI Audio Output Rear (1EA)

9. D-SUB INPUT S/W Upgrade Only Rear (1EA)

10. HDMI Input HDMI-DTV, Only PCM MODE Rear (2EA)

11. Audio Input (1EA) AV&Component L/R Input(2EA)

VHF/UHF 01-C69 2~78 C1~C69

Cable S1~S47 1~71 S1~S47

PAL-I
NTSC-M

Only for training and service purposes

- 6 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

5. Component Video Input (Y, PB, PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4. 720*480 31.47 59.94 27.000 SDTV 480P

5. 720*480 31.50 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45.00 60.00 74.250 HDTV 720P

9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

11. 1920*1080 33.72 59.94 74.176 HDTV 1080I

12. 1920*1080 33.75 60.00 74.25 HDTV 1080I

13. 1920*1080 56.25 50 148.5 HDTV 1080P

14. 1920*1080 67.432 59.94 148.350 HDTV 1080P

15. 1920*1080 67.5 60.00 148.5 HDTV 1080P

6. HDMI Input

6.1. PC Mode

* Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks

1. 640×480 31.469 59.94 25.17 VESA(VGA)

2. 800×600 37.879 60.317 40.00 VESA(SVGA)

3. 1024×768 48.363 60.004 65.00 VESA(XGA)

4. 1280×768 47.776 59.87 79.5 VESA(WXGA)

5. 1360×768 47.72 59.799 84.62 VESA(WXGA)

6 1366×768 47.7 60.00 84.62 WXGA

7. 1280×1024 63.595 60.00 108.875 SXGA

8. 1920×1080 66.647 59.988 138.625 WUXGA

* Monitor Range Limits

Min Vertical Freq - 58 Hz / Max Vertical Freq - 63 Hz

Min Horiz. Freq - 28 kHz / Max Horiz. Freq - 68 kHz

Pixel Clock - 150 MHz

Only for training and service purposes

- 7 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

6.2. DTV Mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

Spec. out but display.2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4. 720*480 31.47 59.94 27 SDTV 480P

5. 720*480 31.5 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27 SDTV 576P

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45 60.00 74.25 HDTV 720P

9. 1280*720 37.5 50.00 74.25 HDTV 720P

10. 1920*1080 28.125 50.00 74.25 HDTV 1080I

11 1920*1080 33.72 59.94 74.176 HDTV 1080I

12 1920*1080 33.75 60.00 74.25 HDTV 1080I

13 1920*1080 56.25 50.00 148.5 HDTV 1080P

14 1920*1080 67.432 59.94 148.350 HDTV 1080P

15 1920*1080 67.5 60.00 148.5 HDTV 1080P

16 1920*1080 27 24.00 74.25 HDTV 1080P

17 1920*1080 33.75 30.00 74.25 HDTV 1080P

18 1920*1080 26.97 23.97 74.25 HDTV 1080P

19 1920*1080 33.716 29.976 74.25 HDTV 1080P

Only for training and service purposes

- 8 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with

LB35B chassis.

2. Designation

(1) Because this is not a hot chassis, it is not necessary to

use an isolation transformer. However, the use of isolation

transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of

25 °C ± 5 °C of temperature and 65 % ± 10 % of relative

humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 100-220 V,

50/60Hz.
(5)

The receiver must be operated for over 5 minutes prior to

the adjustment when module is in the circumstance of

above 15 °C.

► In case of keeping module is in the circumstance of 0

°C, it should be placed in the circumstance of above 15
°C for 2 hours.

► In case of keeping module is in the circumstance of

below -20 °C, it should be placed in the circumstance of
above 15 °C for 3 hours.

* Caution

When a still image is displayed for 20 minutes or longer
(especially where W/B scale is strong. Digital pattern 13ch
an d/ or Cr os s h at ch pa ttern 09ch), there can some
afterimage in the black level area.

3. MAIN PCBA Adjustments

3.1. ADC Calibration

3.1.1. Using D/L Jig

- An ADC calibration is automatically adjusted from DFT-Jig

- If it needs to adjust manually, refer to appendix.

* ADC Calibration Protocol (RS232)

NO Item CMD 1 CMD 2 Data 0

Enter Adjust
MODE

ADC adjust

Adjust Sequence

▪ aa 00 00 [Enter Adjust Mode]
▪ xb 00 40 [Component1 Input (480i)]
▪ ad 00 10 [Adjust 480i Comp1]
▪ aa 00 90 End Adjust mode

Adjust
‘Mode In’

ADC
Adjust

A A 0 0

A D 1 0

When transfer the ‘Mode In’,
Carry the command.

Automatically adjustment
(The use of a internal pattern)

3.2. EDID Download

▪ HD MODEL

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01

10 01 17 01 03 80 A0 5A 78 0A F3 30 A4 54 46 96 26
20 0F 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01
80 02 03 28 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 26 11 07 50 09 7F 07 83 01 00 00 68
A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20
B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0
C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14
D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D
E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

▪ 8BIT FHD MODEL

** HDMI 1 : 256Bytes

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01

10 01 17 01 03 80 A0 5A 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 01 01 45 40 61 40 01 01 81 80
30 01 01 D1 C0 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 08 44 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 88 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01
80 02 03 28 F1 4F 90 07 01 16 02 03 11 12 13 04 14
90 05 20 22 1F 26 11 07 50 09 7F 07 83 01 00 00 68
A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20
B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0
C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14
D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D
E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

a. White Balance Adjustment

EDID C/S data

Check sum

(Hex)

** HDMI 1 : 256Bytes

HD FHD (8Bit)

HDMI HDMI

Block 0 A5 C1

Block 1

44(HDMI1) 44 (HDMI1)
34(HDMI2) 34 (HDMI2)

ⓐ

ⓐ

ⓐ

ⓐ

Only for training and service purposes

- 9 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

4. White Balance Adjustment

4.1. Overview

4.1.1. W/B adj. Objective & How-it-works

(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it

means the panel is at its Full Dynamic Range. In order to

prevent saturation of Full Dynamic range and data, one of

R/G/B is fixed at 192, and the other two is lowered to find

the desired value.
(3) Adj. condition: normal temperature

1) Surrounding Temperature: 25 °C ± 5 °C

2) Warm-up time: About 5 Min◦

3) Surrounding Humidity: 20% ~ 80%

4) Befor e White balance adjustment, Keep power on
status, don’t power off

4.1.2. Adj. condition and cautionary items

(1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux.
Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer(CA-210) probe should be

within 10 cm and perpendicular of the module surface

(80°~ 100°)

(3) Aging time

1) After Aging Start, Keep the Power ON status during 5

Minutes.

2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.

4.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)

(2) Adj. Computer (During auto adj., RS-232C protocol is

needed)

(3) Adjust Remocon

(4) Video Signal Generator MSPG-925F 720p/204-Gray

(Model: 217, Pattern: 49)
* Color Analyzer Matrix should be calibrated using CS-1000.

4.3. Equipment connection

Co lor Anal yze r

Pro be

RS -232 C

Sig nal Sou rce

* If TV internal pattern is used, not needed

Pattern Gen era to r

4.4. Adjustment Command (Protocol)

(1) RS-232C Command used during auto-adj.

RS-232C COMMAND

CMD DATA ID

wb 00 00 Begin White Balance adjustment

wb 00 ff

End White Balance adjustment
(internal pattern disappears )

Explantion

RS- 232 C

Co mp ute r

RS- 232 C

(2) Adjustment Map

Cool

Medium

Warm

Adj. item

R Gain j g 00 C0
G Gain j h 00 C0
B Gain j i 00 C0
R Cut
G Cut
B Cut
R Gain j a 00 C0
G Gain j b 00 C0
B Gain j c 00 C0
R Cut
G Cut
B Cut
R Gain j d 00 C0
G Gain j e 00 C0
B Gain j f 00 C0

R Cut

G Cut

Command

(lower caseASCII)

CMD1 CMD2 MIN MAX

Data Range

(Hex.)

Default

(Decimal)

4.5. Adjustment method

4.5.1. Auto WB calibration

(1) Set TV in ADJ mode using P-Only key(or POWER ON key).
(2) Place optical probe on the center of the display.

- It need to check probe condition of zero calibration before
adjustment.

(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.

(5) When WB adjustment is completed with OK message,

check adjustment status of pre-set mode. (Cool, Medium,
Warm)

(6) Remove probe and RS-232C cable.

▪ W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need.

4.5.2. LED White balance table

- G-gain should be fixed.

(1) Cool Mode

1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.

2) Pr inciple : To adjust the white balance without the
saturation, Fix the G gain to 172 (default data) and
change the others (R/B Gain ).

3) Adjustment mode : mode - Cool

(2) Medium / Warm Mode

1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.

2) Pr inciple : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to 192 (default
data) and decrease the others.

3) Adjustment mode : Two modes - Medium / Warm

Only for training and service purposes

- 10 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

4.6. Reference(White Balance Adjustment
coordinate and color temperature)

(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and temperature using

CS-1000 (over 26 inch)

Mode Color Temp Color coordinate Remark

Cool

(C50)

Medium

(0)

Warm

(W50)

■ Direct LED & 32” POLA W/B adjust target value

Target

(Direct

LED)

13,000 K

9,300 K

6,500 K

Cool Medium Warm

x y x y x y

271 276 287 296 315 332

x = 0.269 (±0.002)
y = 0.273 (±0.002)

x = 0.285 (±0.002)
y = 0.293 (±0.002)

x = 0.313 (±0.002)
y = 0.329 (±0.002)

* Test signal

- Inner pattern for
W/B adjust

- External white
pattern

(80IRE, 204gray)

7. GND and HI-POT Test

7.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

7.2. GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next

process automatically.

■ 42” POLA LED W/B adjust target value (42LS3450 series)

Target

(Direct

LED)

Cool Medium Warm

x y x y x y

274 280 290 300 318 336

5. Tool Option setting & Inspection per
countries

(1) Press 'IN START' key at Factory Service remote control.
(2) Select 'Tool Option 1'.
(3) Punch in the number and press 'OK'. (Each of models has

their number)

(4) Correct 'Tool Option2' ~ 'Tool Option5'.
(5) Completed adjusting Tool option.

6. AUDIO output check

6.1. Audio input condition

(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)

6.2. Specification

Item Min Typ Max Unit Remark

Audio practical
max Output, L/R
(Distortion=10%
max Output)

4.5 5.0 6.0

(1) Measurement condition

W

- EQ/AVL/Clear Voice: Off

Vrms

(2) Speaker (8Ω Impedance)

7.3. Checkpoint

(1) Test voltage

- GND: 1.5 KV / min at 100 mA

- SIGNAL: 3 KV / min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT

- GND Test = POWER CORD GND and SIGNAL CABLE
GND.

- Hi-pot Tes t = POWER CO RD GN D an d L IV E &
NEUTRAL.

(4) LEAKAGE CURRENT: At 0.5 mArms

Only for training and service purposes

- 11 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

8. USB S/W Download

(optional, Service only)

(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.

- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work.

Otherwise USB data is automatically detected.
(3) Show the message “Copying files from memory”.

(4) Updating is starting.

(5) Updating Completed, The TV will restart automatically.

(6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If downloading version is more high than your TV have,

TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn't
have a DTV/ATV test on production line.

* After downloading, have to adjust TOOL OPTION again.

1) Push "IN-START" key in service remote control.

2) Select "Tool Option 1" and push "OK" key.

3) Punch in the number. (Each model has their number.)

9. Optional adjustments

9.1. Manual ADC Calibration

■ Enter ‘EZ ADJUST’ mode by pressing ‘ADJ’ key.

■ Enter Internal ADC calibration mode by pressing ‘’ or ‘OK’

key at ‘7. ADC Calibration’

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration ►

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L

13. Sub B/C

14. Ext. Input Adjust

► Caution : Using ‘P-ONLY’ key of th e Facto ry Service

remote control when turns TV on.

9.2. Manual White balance Adjustment

9.2.1. Adjustment condition and cautionary items

(1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark
surrounding.

(2) Probe location: Color Analyzer (CA-210) probe should be

within 10cm and perpendicular of the module surface

(80°~ 100°)

(3) Aging time

1) After Aging Start, Keep the Power ON status during 5

Minutes.

2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.

9.2.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)
(2) Adj. Computer(During auto adj., RS-232C protocol is needed)
(3) Adjust Remot control

(4) Video Signal Generator MSPG-925F 720p/216-Gray

(Model: 217, Pattern: 78)

9.2.3. Adjustment

(1) Set TV in Adj. mode using POWER ON.

(2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface.

(3) Press ADJ key → EZ adjust using adj. R/C → 6. White-

Balance then press the cursor to the right (Key►). When

Key(►) is pressed 216 Gray inte rnal pattern will be

displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,

and the rest will be lowered to meet the desired value.

(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of

color temperature.

ADC Calibration

ADC Comp 480i

ADC Comp 1080p

ADC RGB

Start

Reset

NG

NG

NG

Only for training and service purposes

- 12 -

■ If internal pattern is not available, use RF input. In EZ Adj.

menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

BLOCK DIAGRAM

JK202

IF_N

11

IF_P

10

USB_5V

IF_AGC

Tuner SDA

Tuner SCL

3

9

USB_DP

USB_DN

IR Board

ST_3.5V

Led_PWR

108

KEY2

P400

110

KEY1

111

IR

117

IR/KEY

98

99

44

24Mhz

43

40

39

4

52

53

45

7

5

B+

IC401

To USB

TU_1.8V

M_3.3V

TU_3.3V

TUNER

A_OUT_12V

Out

Audio

Audio R-Out

Audio L-Out

37 38

26,33,34 27,35,3622,20,24,33,34

IC302

x4 Gain

OP-AMP

AV2 In

AV1 In

Comp. R/L In

Y,Pb,Pr In

JK101

Module

POWER BOARD

P601/602

2 4 1

P701

13~1 5

P_ST 3.5V

5

3

P_24V

10

9

LVDS

Panel_Vcc

Q720

XXX

Output

RL On

P Dim

Inv. ON

102 105 101

AO3407A

P_12V

IC501

MST6841XP

XXX

HDMI

100

54

18

SPI_CLK

SPI_DI

SPI_CZ

SPI_DO

EEP SCL

EEP SDA

94

97

95

96

85

84

To USB

24C64

IC502

IC503

8Mbytes

Serial Flash

EEPROM

Main_5V

IC709

MP1497

107

62

30

116

9

77

41

Main_1.2V

IC701

48

50

51 113 112

115

I2S_WS

I2S_MCLK

Main_1.8V

IC711

1.8V REG

Main_3.3V

Q710

MP20051

789

35

40

19

32

S_AMP_24V

JK203

SCL/SDA

I2S_SCK

I2S_SDO

Sound AMP

20

31

JK204

Audio_SCL

Audio_SDA

38

10 11

NTP7513

IC301

21

33

18

30

LPF

LPF

P301

(

(

(

(

Only for training and service purposes

- 13 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

521

400

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these sp ecial safet y parts shoul d be replac ed with the same compon ents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

510

LV1

200

300

540

530

123

301

500

120

122

200T

Only LGD Module

910

A10

A9

900

Set + Stand

Stand Base+Stand Body

Only for training and service purposes

- 14 -

A2

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

EAX65027101

Copyright © 2014 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

LB35B/LC35B/LL35B

COMPONENT / AV IN / AV AUDIO OUT

JK101

PPJ239-06

7H

4N

6H

4H

5G

4F

6F

8F

5E

8E

5D

7D

7N

6N

AV2RIN

AV2LIN

AV2_VIN

MNTROUT

MNTLOUT

COMMONRIN

D102

READY

ZD10 7

20V

ZD10 6

20V

D101

READY

C105
5600pF
50V

C103
5600pF
50V

ZD108

SD05

ZD110
20V

ZD109

20V

C

B

E

READY
Q104

MMBT3904(NXP)

C

B

E

READY
Q102

MMBT3904(NXP)

ZD105
20V

R112

75

R111

1K

R110

R107
220K

R116
220K

R113
220K

1K

R114

10K

C
E

R108

10K

R117

10K

Q103

MMBT3904(NXP)

B

C

B

E

R118
12K

R115

12K

C106

10uF

16V

C104

10uF

16V

Q101

MMBT3904(NXP)

R109
12K

C108
470pF
50V

C107
470pF
50V

MUTE_AOUT

POP NOISE

POP NOISE

C102
470pF
50V

AV2_RIN

AV2_LIN

AV2_VIN

MNT_ROUT

MNT_LOUT

MUTE_AOUT

COMMON_RIN

5M

5L

COMMONLIN

COMP_PR

8L

5K

COMP_PB

8K

4J

6J

COMMON_VIN

7J

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

INPUT1

D104

READY

D106

READY

D108

READY

D103

READY

D105

READY

D107

READY

ZD102

SD05

ZD101

SD05

ZD100

SD05

ZD104

20V

R104
220K

R103

R102

75

R101

75

R105

10K

R106

12K

C101
470pF
50V

COMMON_LIN

COMP_PR

75

COMP_PB

V-OUT Buffer(DEBUG)

COMMON_VIN

AV2_VIN

TP101

OPT

R122

0

32LN5100

INPUT1

DEBUG

R120
75

P_12V

C
E

DEBUG

MMBT3904(NXP)
Q105

B

DEBUG

R123

220

R121

33

DEBUG

MNT_VOUT

2012/11/15

1 7

EAX65027101

Copyright © 2014 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

LB35B/LC35B/LL35B

I2C Control

KJA-PH-1-0177

JK201

6 M6

1 M1

3 M3_DETECT

4 M4

DEBUG
P201

12505WS-04A00

5

5 M5_GND

1

2

3

4

R205

0

W/O UART IC

R204

0

W/O UART IC

With UART IC

R201
100

+3.5V_ST

R206

0

W/O UART IC

With UART IC

R202
100

PM_RXD

RM_TXD

0.1uF

VCC

GND

+3.5V_ST

C201

P202

12507WS-04L

1

2

3

4

5

GND

DOUT1

RIN1

ROUT1

DIN1

DIN2

ROUT2

VCC

GND

With UART IC

IC201

MAX3232CDR

16

15

14

13

12

11

10

9

EAN41348201

HDMI(REAR)

R231

READY

ZD230

1K

READY
ZD231

HDMI1_DET

R235

R234

4.7K

10K

HDMI1_CK­HDMI1_CK+

HDMI1_D0­HDMI1_D0+

HDMI1_D1­HDMI1_D1+

HDMI1_D2­HDMI1_D2+

+5V_USB

D230

BAT54C

R232

2.7K

A2CA1

R233

2.7K

READY
ZD232

READY
ZD233

R236
100

R237
100

HDMI1_SDA
HDMI1_SCL

B

HPD

19

+5V_POWER

18

DDC/CEC_GND

17

SDA

16

SCL

15

NC

14

CEC

13

CLK-

12

CLK_SHIELD

11

CLK+

10

DATA0-

9

DATA0_SHIELD

8

DATA0+

7

DATA1-

6

DATA1_SHIELD

5

DATA1+

4

DATA2-

3

DATA2_SHIELD

2

DATA2+

1

C

Q230

MMBT3904(NXP)

E

R230

HDMI1_HPD

C1+

1

V+

2

C1-

3

C2+

4

C2-

5

V-

6

DOUT2

7

RIN2

8

C202

0.1uF

C203

0.1uF

C204

0.1uF

C205

0.1uF

With UART IC

With UART IC

With UART IC

With UART IC

10K

SHIELD

20

JK203

USB(SIDE)

3AU04S-305-ZC-(LG)

JK202

1234

USB DOWN STR EAM

5

DSUB_SCL

READY

READY

ZD221

ZD220

30V

30V

DSUB_SDA

Close to SIDE_USB

OPT

C220
10uF
10V

USB_DN

USB_DP

C221
22uF
10V

L220

120

+5V_USB

HDMI2_HPD

R241
10K

JK204

SHIELD

20

B

HPD

19

+5V_POWER

18

DDC/CEC_GND

17

SDA

16

SCL

15

NC

14

CEC

13

CLK-

12

CLK_SHIELD

11

CLK+

10

DATA0-

9

DATA0_SHIELD

8

DATA0+

7

DATA1-

6

DATA1_SHIELD

5

DATA1+

4

DATA2-

3

DATA2_SHIELD

2

DATA2+

1

C

Q240

MMBT3904(NXP)

E

READY
ZD240

R242
1K

READY
ZD241

HDMI2_DET

R246

R245

4.7K

10K

HDMI2_CK­HDMI2_CK+

HDMI2_D0­HDMI2_D0+

HDMI2_D1­HDMI2_D1+

HDMI2_D2­HDMI2_D2+

+5V_USB

R243

2.7K

A2CA1

D240

BAT54C

R244

2.7K

READY
ZD242

READY
ZD243

R247
100

R248
100

HDMI2_SDA
HDMI2_SCL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

INPUT2

INPUT2

2012/11/1532LN5100

2 7

EAX65027101

Copyright © 2014 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

LB35B/LC35B/LL35B

AUAMP_SDA

AUAMP_SCL

+3.3V_M

I2S_SDO

I2S_WS

I2S_SCK

R308

4.7K

R309

4.7K

R306 100

R307 100

SW_RESET

C320

1000pF

50V

I2S_MCLK

GND
DGND
DVDD

WCK

BCK

SDA

R304 100

VDD_IO

[EP]GND

1
2
3
4
5
6
7
8
9
10

SCL

CLK_I

GND_IO

38

39

40

THERMAL

41

11

12

13

L301

+3.3V_M

BLM18PG121SN1D

C321
10uF

6.3V

C322

0.1uF
16V

AGND_PLL

VDD_PLL

C301

0.1uF
16V

OPT

C302

C303

0.1uF
1uF

16V

10V

R301 100

R302 100

R303 100

C305

C306

33pF

33pF

50V

50V

DGND_PLL

SDATA

FAULT

MONITOR_0

50V

C319

22000pF

PGND1A

BST1A

RESET

AD

34

35

36

37

IC301

NTP7513

0x54

14

15

16

17

BST2B

PGND2B

MONITOR_1

MONITOR_2

C308

22000pF

50V

PVDD1A

OUT1A

32

33

18

19

OUT2B

PVDD2B20PVDD2A

PVDD1B

31

30
29
28
27
26
25
24
23
22
21

+24V_AMP

C318

0.1uF
50V

OUT1B
PGND1B
BST1B
VDR1
VCC5
AGND
VDR2
BST2A
PGND2A
OUT2A

C309

0.1uF
50V

C317
10uF
35V

+24V_AMP

C310
10uF
35V

C315
22000pF
50V

C311
22000pF
50V

C31 2
1uF
10V

1uF
10V

C31 3

R313

12

C325
390pF

50V
C326

390pF
50V

R315

12

R317

12

C327
390pF

50V

C328
390pF

50V

R319

12

C314
1uF
10V

R314

R316

12

R318

R320

12

12

12

L303
10uH

L304
10uH

L305
10uH

L306
10uH

C329

0.47uF
50V

C333

0.47uF

50V

C330

0.1uF
50V

C331

0.1uF
50V

C334

0.1uF

50V

C335

0.1uF

R322

4.7K

R323

4.7K

R324

4.7K

R325

4.7K

50V

SPK_L+

SPEAKER_L

SPK_L-

SPK_L+
SPK_L­SPK_R+
SPK_R-

SPK_R+

SPEAKER_R

SPK_R-

JP304

JP303

JP302

JP301

SPK_L+

SPK_L-

SPK_R+

SPK_R-

4

3

2

1
.

SMAW250-H04R

P301

POWER_DET

R311

100

AUDIO_OUT AMP : GAIN X 4

IC302

AS324MTR-E1

MNT_LOUT

MNT_ROUT

C350

0.1uF
16V

C355

0.1uF
16V

P_12V

Q350
MMBT3904(NXP)

C

B

E

R350

4.7K

MNT_L_AMP

MNT_R_AMP

P_12V

Q351
MMBT3904(NXP)

C

B

E

R35 9

4.7 K

R351 1K

C351
6800pF
50V

R358

C356
6800pF
50V

R354 5.6K

1K

10K

R352

C352 33pF 50V

R355

5.6K

33pF

C354

R356

10K

P_12V

50V

R353

6.8K

C353

0.1uF
16V

R357

6.8K

1 OUT1

2 INPUT1-

3 INPUT1+

4 VCC

5 INPUT2+

6 INPUT2-

7 OUT2 8OUT3

14OUT4

13INPUT4-

12INPUT4+

11GND

10INPUT3+

9INPUT3-

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

AUDIO

32LN5100

AUDIO

2012/11/15

3 7

EAX65027101

Copyright © 2014 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

LB35B/LC35B/LL35B

B1

B1

B2

B2

READY

PAL

TU401
TDSH-G501D(B)

1

2

3

4

5

6

7

8

9

10

11

A1

A2

A2

C430

0.1uF
250V

IF

NC

RESET

SCL

SDA

+B1[3.3V]

SIF

+B2[1.8V]

CVBS

IF_AGC

DIF[P]

DIF[N]

A1

+3.5V_ST

R422

R421

10K

10K

KEY1

KEY2

+3.5V_ST

R423

4.7K
OPT

IR

NTSC
TU402
TDSS-H501F(B)

NC_1

1

RESET

2

SCL

3

SDA

4

+B1[3.3V]

5

NC_2

6

+B2[1.8]

7

NC_3

8

IF_AGC

9

DIF[P]

10

DIF[N]

11

X

B1

A1

A1

Near the pin

C406
100pF
50V

12

SHIELD

+3.3V_TU

R403
100

C405

C404

0.1uF

22uF

16V

6.3V

R411

1

C409
100pF

50V

C408

0.1u F
16V

NTSC

R413-*1
0

R413

10

PAL

R414

10

PAL

Close to the tuner

NTSC
R414-*1
0

R404
100K

C401

0.1uF
16V

C402
47pF
50V

C403
47pF
50V

C407
10uF

6.3V

R405

33

R406

33

+3.3V_TU

C410

0.1uF
16V

TUNER_RESET

R407

R408

2.2K

2.2K

R412
100

should be guarded by ground

TUNER_SCL

TUNER_SDA

R409

1

1/10W

R410

1

1/10W

IC401

AP1117E18G-13

1

ADJ/GND

OUT

2

3

IN

IF_AGC

IF_P

IF_N

ZD402

SD05

ZD401

SD05

OPT

C422

0.1uF

L421

BLM18PG121SN1D

+3.3V_TU

C411

0.1uF
16V

OPT

C421

0.1uF

C423

0.1uF
16V

Size change,0929

L401

BLM18PG121SN1D

C412
10uF

6.3V

C424
1000pF
50V

+3.3V_M

IR

LED

C426

100pF

50V

OPT

C425

0.1uF
16V

P421

12507WR-08L

1

2

3

4

5

6

7

8

9

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TUNER & IR

READY

C431

0.1uF
250V

R401

0

NTSC

32LN5100

TUNER & IR

2012/11/15

4 8