LG 32LB520B Schematic

Internal Use Only

US/Canada/Mexico http://aic.lgservice.com

http://eic.lgservice.com

http://biz.lgservice.com

LED TV

SERVICE MANUAL

CHASSIS : 6M62N

MODEL: 32LB520B

CAUTION

BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in Korea

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 8

EXPLODED VIEW .................................................................................. 13

SCHEMATIC CIRCUIT DIAGRAM ..........................................................

14

Only for training and service purposes

- 2 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental shorts of the circ uitry that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 10 MΩ and 200 MΩ.

When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

the two AC plug prongs. Place the AC

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.
In case any measurement is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

out of the limits specified, there is

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau­tions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo­sion hazard.

2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam­age caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharg­ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.

2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.

4. Use only an anti-static type solder removal device. Some sol­der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec­trically shorted together by conductive foam, aluminum foil or
comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate­rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir­cuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropri­ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo­nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through

cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close
as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remain­ing on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos­sible to diode body.

2. Bend the two remaining leads perpendicularly to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.

3. Solder the connections.
CAUTION: Maintain original spacing between the replaced

-

component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when­ever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec­tions).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con­nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so then
it does not touch components or sharp edges.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

Only for training and service purposes

- 5 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used
6M62N chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage

: Standard input voltage (AC 120V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed
ea ch drawing and spe ci fication b y p ar t number in
accordance with BOM.

5) ehT receiver must be operated for about 5 minutes prior to
the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : UL specification

- EMC : FCC

4. Model General Specification

No. Item Remarks

1. Market US/Canada/Mexico

1) NTSC

2. Broadcasting system

3. Channel Storage 1) VHF : 02~13

2)AIR:ATSC

3)CABLE:64QAM/256QAM

2) UHF : 14~69

3) DTV : 02-69

4) CATV :01~135 (N.America)

5) CADTV : 01~135 (N.America)

4. Receiving system

5. Video(Composite Input) PAL, NTSC 4 System : PAL M, PAL N, NTSC, PAL60

6. Component Input Y/Cb/Cr, Y/Pb/Pr

7. HDMI Input

8. SPDIF out SPDIF out

9. USB Input Music :MP3; Photo: JPEG

10. Headphone

Only for training and service purposes

Analog : Upper Heterodyne
Digital : 8VSB/64&256QAM

HDMI: DTV/DVI

- 6 -

Support HDCP

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

5. Component Video Input (Y, CB /PB , CR /PR )

No. Resolution H-freq(kHz) V-freq(Hz) Porposed

1 720×480 15.73 60.00 SDTV, DVD 480i

2 720×480 15.63 59.94 SDTV, DVD 480i

3 720×480 31.47 59.94 480p

4 720×480 31.50 60.00 480p

1280×720 44.96 59.94 HDTV 720p

5

1280×720 45.00

6

1920×1080

7

1920×1080

8

1920×1080

9

1920×1080

10

11 1920×1080

12 1920×1080

1920×1080

13

14 1920×1080 67.5 60 HDTV 1080p

26.97

27

33.72

33.75

33.75 60.00 HDTV 1080i

33.72

67.432 59.94

60.00 HDTV 720p

23.976

24

29.97

30

59.94 HDTV 1080i

HDTV 1080p

HDTV 1080p

HDTV 1080p

HDTV 1080p

HDTV 1080p

6. HDMI Input : Refer to adjust specification about EDID data.

6.1. DTV mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

1. 640*480 31.469 / 31.5 59.94 / 60 25.175/25.200 SDTV 480P

2.

3.

4. 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P

5. 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I

6.

7.

8.

720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P

720(1440)*480 15.73 / 15.75 59.94 / 60 27.00/27.028 SDTV 480i

1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 HDTV 1080P

1920*1080 33.716/33.75 29.976/30.00 74.25 HDTV 1080P

1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P

6.2. PC mode

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1.

720*400 @70Hz 31.469 70.08 28.321 DOS

2.

640*480 @60Hz 31.469 59.940 25.175 VESA(VGA)

3.

800*600 @60Hz 37.879 60.31 40.000 VESA(SVGA)

4.

1024*768 @60Hz 48.363 60.00 65.000 VESA(XGA)

1280*1024 @60Hz 63.981

5.

1360*768 @60Hz 47.712

6

7.

1920*1080 @60Hz 67.5

Only for training and service purposes

60.020 108 VESA(SXGA)

60.015 85.5 VESA(WXGA)

60.0 148.5

WUXGA
(Reduced blanking)

- 7 -

FHD only(Support to HDMI-PC)

FHD only(Support to HDMI-PC)

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with
MSD3393LU chassis.

2. Designation

(1) Th e ad justm ent is according to the orde r wh ich is

designated and which must be followed, according to the

plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 120V~, 50/60 Hz

(6) Adjustment equipments

: Color Analyzer(CA-210 or CA-310), Service remote control.

(7) Push the “RESTORE" key - For memory initialization.

Case1 : Software version up

1. , BSU yb W/S gnidaolnwod retfA TV set will reboot
automatically.

2. Push “RESTORE” key.

3. Push “Power on” key.

4. Function inspection

5. After function inspection, Push “RESTORE” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push
“RESTORE” key at first.

2. Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

3. After function inspection, Push “RESTORE” key.

3. Click “Connect”to get communication from the TV set,
and read out the device type.

:

4. Click “HDCP”to enter HDCP management
interface. Change the Value“HDCP Key Index”
to “1”, “HDCP Key Allocation”to "0X390000"for

32LB520B/60LB5200/65LB5200.

3. Main PCB check process

▪ APC - After Manual-Insert, executing APC

*. Burning HDCP EY

1.

Connect your PC to TV set with USB debug cable.
Turn on the TV set, then open the HDCP operating tool

2.
“MStar IS P Utility V4.5.7 Alpha”.

Only for training and service purposes

- 8 -

5. Click “HDCP Key File”to load the HDCP Key file
provided.

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

6. Click “Read” to load the main software for this TV set.

7. Click “Auto”to ready for HDCP Key updating. Settings
as below:

9. Click “Run” to update the HDCP Key.

Warm Tips:
The HDCP Key index value will be increased automatically.

That means after you update the first TV set, you only need
to connect another TV set to your PC, click “Connect”, then
“Run” to update.

4. ADC Process

4.1. ADC

- Set TV to YUV source by pushing"YUV)key

- Input full color bar signal using HD signal generator
Begin adjust by pushing “ADC ADJ" key

* Required equipment : Factory remote control.

HD signal generator.

EZ ADJUST

0

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L

13. Sub B/C

14. Ext. Input Adjust

ADC Calibration

ADC Comp 480i

ADC Comp 1080p

ADC Type

Reset

NG

NG

8. Click to select “Partial Erase”, then click Setup. An erase
block setting window will pop up. Choose the bank according
to "0X390000"for 32LB520B/60LB5200/65LB5200. Click
“OK”to confirm.

Only for training and service purposes

- 9 -

100% color bar

Note: 1. The YPBPR Auto White Balance adjust
(AUTO ADC) must be done on the product line.
2

In YPBPR channel ,must adjust the SD

and HD two modes.

4.2. Function Check

4.2.1. Check display and sound

■ Check Input and Signal items.

(1) TV
(2) AV (CVBS)
(3) COMPONENT (1080I/480i)
(4) HDMI
* Display and Sound check is executed by Remote control.

<Caution> Not to push the "RESTORE" key after

completion if the function inspection.

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

5. Total Assembly line process

5.1. Adjustment Preparation

▪ W/B Equipment condition

CA310

▪ evobA 5 minutes H/run in the inner pattern. ("power on" key

of Adjustment remote control)

* * The spec of color temperature and coordinate.

Mode Color Temp Color coordinate Remark

Cool (C50) 13,000 K

Medium(0) 9,300 K

Warm(W50) 6,500 K

Auto Adjust -W/B

CH01, Test signal: Inner pattern(80IRE)-LED Module

X=0.271 (±0.002)
Y=0.270 (±0.002)

X=0.286 (±0.002)
Y=0.289 (±0.002)

X=0.313 (±0.002)
Y=0.329 (±0.002)

Probe

Color
analyzer

<Test Signal>

- Inner pattern

for W/B adjust

- External white
pattern

(80IRE, 204gray)

HD signal generator

Click the "application "button and begin to adjust

5

automatically when finished ,it will display PASS.

*STEPS:

1

Connect Debug line.

2. Connect HDMI port and input 80% full white signal.
3

Calibrate the color analyzer (CA310).

Positioning

Ring

4

Open W/B auto adjust system and load saved parameters.

Only for training and service purposes

- 10 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

* Manual W/B process using adjust Remote control.

■ Color analyzer(CA310,CA210)should be used in the
calibrated ch.

■ Operate the zero-calibration of the CA310 or CA210,
then stick sensor to the module when adjusting.

■ Enter factory mode by pushing customer remote controller:

input 3195.

■ Select W/B ADJUST item , push "ok" then enter into
adjust page.

■ For manual adjustment, it is also possible by the following
sequence.

(1) Set TV in aging mode by play a picture or music by USB for

more than 30 minutes. (if not executed this step the condition
for w/B will be different).

(2) Push “Exit” key.
(3) Enter factory mode by pushing customer remote controller:

input 3195. Select W/B ADJUST item , push "ok" then en

ter into adjust page.

(4) Zero Calibrate the probe of Color Analyzer, then place it

on the center of LCD module within 10cm of the surface

(5) Select each items (Red/Green/Blue Gain) using

▲/▼(CH +/-) key on Remote control.

(6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.
(7) Adjust three modes all (Cool / Medium / Warm)

- For All model
Fix the one of R/G/B gain and change the others

- For G-FIX model
Cool Mode

1) Fix the one of R/G/B gain to 192 (default data) and

decrease the others. (If G gain is adjusted over 172
and R and B gain less than 192 , Adjust is O.K.)

2) If G gain is less than 172, Increase G gain by up to

172, and then increase R gain and G gain same
amount of increasing G gain.

3) If R gain or B gain is over 255, readjust G gain less

than 172, Conform to R gain is 255 or B gain is 255

Medium / Warm Mode - Fix the one of R/G/B gain
to 192 (default data) and decrease the others.

(8) When adjustment is completed, exit adjustment mode

using EXIT key on Remote control.

* CASE Cool

First adjust the coordinate far away from the target
value(x, y).

1) x, y > target
i) Decrease the R, G.

2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.

3) x > target, y < target
i) First decrease B, so make y a little more than the

target.

ii) Adjust x value by decreasing the R.

4) x < target, y > target

st decrease B, so make x a little more than the

i) Fir

target.

ii) Adjust x value by decreasing the G.

*

After You finish all adjustments and function inspections,
Press “SETTING” button , choose Initial Setting” option,
and choose “Yes”. It will show choose language picture,
then turn off TV and unplug the AC cable.

Only for training and service purposes

- 11 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

5.4. Outgoing condition Configuration

■ When pressing RESTORE key by Service remote control,
Red LED are blinked alternatively. And then automatically
turn off. (Must not AC power OFF during blinking)

5.5. GND and HI-POT Test

5.5.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition.

(2) You can’t use Tuner Ground & Tuner signal line at all

models (applied Isolator inner tuner)

5.5.2. GND & HI-POT auto-check

(1) Pallet moves in the station.(POWER CORD / AV CORD is

tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller on.
(4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process(Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next
process automatically.

5.5.3. Checkpoint

(1) Test voltage

1) 3 Poles

- GND: 1.5 KV/min at 100 mA

- SIGNAL: 3 KV/min at 100 mA

2) 2 Poles

- SIGNAL: 3 KV/min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT

1) 3 Poles

- GND Test = POWER CORD GND and SIGNAL

CABLE GND.

- Hi-pot Test = POWER CORD GND and LIVE &

NEUTRAL.

2) 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms

Only for training and service purposes

- 12 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

522

540

521

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these spec ial safety parts s hould be replace d with the same compone nts as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

200

900

610

400

120

A2

511

A3

510

512

A9

500

600

513

A10

Only for training and service purposes

- 13 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

SCHEMATIC CIRCUIT DIAGRAM

5

Connetor

D D

+12V_PWR

BL-ON/OFF
BL-ADJUST

+12V

BL-ON/OFF
BL-ADJUST

5V Standby Power(option) 3A

+12V_PWR

C2

C3

10uF/16V/0805

0.1uF/0402/16V

10uF/16V/0805

C4

20K/0402/5%

2.2nF/0402/16V

4

R1 100K/0402/5%

R3 27K/0402/5%

C5

1nF/0402/16V/NC

R7

0.1uF/0402/16V

C8

C6

U1
AOZ3015PI/SOP8

2

VIN

7

EN

6

COMP

4

VCC

3

2

Inverter controller

+5V_Standby

9

L1 22uH_3A

LX

8

Vo

5

FB

1

PGND

AGND

3

R1

R5 51K/0402/1%
C7

0.1uF/0402/16V/NC

R2

R10 9.1K/0402/1%

+

CA3

470uF/16V/EC3.5

C1

0.1uF/0402/16V

BL-ON/OFF

BL-ADJUST

R6

100R/0402/5%

R9

22K/0402/5%

+5V_Normal

R2

200R/0402/5%/NC

Q2

3904/SOT-23

2 3

R4

4.7K/0402/5%

Q1

3904/SOT-23

2 3

1

1

10K/0402/5%

R11

4.7K/0402/5%

R8

VBL_CTRL

BRI_ADJ

1

Vout=0.8V*(1+R1/R2)

C

Power Switch

STANDBY

STANDBY

B

STANDBY

STANDBY

R15

22K/0402/5%

R24

22K/0402/5%

+5V_Standby

R12
100K/0402/5%

1

Q3
3904/SOT-23

2 3

+12V_PWR

R21
100K/0402/5%

1

Q4
3904/SOT-23

2 3

0.1uF/0402/16V

R13

100K/0402/5%

0.1uF/0402/16V
R23
100K/0402/5%

C9

0.1uF/0402/16V/NC
U2
4953/SOP8

1
2
3

C10

4

C20

S1
G1
S2
G2

C11

0.1uF/0402/16V/NC

8

+5V_Normal

D1

7

D1

6

+12V_NORMAL

D2

5

D2

Standby controller

+3.3V_Normal

STANDBY

STANDBY

R19

200R/0402/5%

H :Power on
L :Power off

R16

4.7K/0402/5%

PWR-ON/OFF

If POWER BOARD IS 5stb ONLY ,PL NOT PATCH THESE GUY.

1.5V/1.8V Power_Normal

4

U4

ADJ

OUT

AMS1117-Adj

IN

C22

2.2uF/0603/16V

0.1uF/0402/16V

CA9

+

200uF/35V/ECS-5M

321

0.1uF/0402/16V
C24

C23

2.2uF/0603/16V

+1.8V_DDR2

C25

R1

220R/0402/5%/470R/0402/5%

R26

+5V_Normal

R2

R27

100R/0402/5%

A A

3.3V Power

4

ADJ

OUT

+5V_Standby

C26

2.2uF/0603/16V

0.1uF/0402/16V

IN

321

C27

U5

AMS1117-3.3

+3.3V_Normal

C28

2.2uF/0603/16V

+3.3V_Normal

C29

0.1uF/0402/16V

Test Point & MARK

H1

1

5

4

3

2

NC

1

1

H5

NC

NC

H2

9

8

7

6

H6

1

5

9

4

8

3

7

2

6

NC

1

H7

NC

H3

1

5

4

3

2

NC

H4

1

5

9

4

8

3

7

2

6

NC

1.15V Core Power

+12V_PWR

C17

10uF/16V/0805

C18
10uF/16V/0805

Vout=0.8V*(1+R1/R2)

NOTICE:

9

8

7

6

R17
10K/0402/5%

3

5

1

U3
MP1470

IN

EN

GND

R14

6

BST

20R/0402/5%

C12

2

SW

4

FB

C21
10pF/0402/16V

If chip is 3393,The R2 Value is 10K 1%

If chip is 6306,The R2 Value is 8.2K 1%

1uF/0402/16V

L2
22uH_3A

R18

4.7K/0402/1%

R1

R20

100K/0402/5%

Resistors close to the DC-DC

R22
10K/0402/1% or 8.2K/0402/1%

R2

C13

10uF/16V/0805

R25

470R/0402/5%

Max :1.0A

VDDC

0.1uF/0402/16V

C19

C14

10uF/16V/0805

10uF/16V/0805

C15

10uF/16V/0805

C16

100uF/35V/ECS-5M

+

CA8

Vout=1.25V*(R1+R2)/R1

C

B

NOTICE:

If chip is 3393,The R1 Value is 220R 5% Vout=1.8V

If chip is 6306,The R1 Value is 470R 5% Vout=1.5V

5

4

Title

Title

Title

Custom

Custom

3

2

Custom

MSD3393

MSD3393

MSD3393

System power

System power

System power

1

veRrebmuN tnemucoDeziS

veRrebmuN tnemucoDeziS

veRrebmuN tnemucoDeziS

1.0

1.0

teehS:etaD

1 9Friday, September 27, 2013

1 9Friday, September 27, 2013

1 9Friday, September 27, 2013

teehS:etaD

teehS:etaD

1.0

of

of

of

5

HDMI Interface

HDMI0-RX0P

HDMI0-RX0N

HDMI0-RX1P

HDMI0-RX1N

HDMI0-RX2P
HDMI0-RX2N

HDMI0-CLKN

HDMI0-CLKP

HDMI0-SCL
HDMI0-SDA

HDMI0-HPDIN

HDMI1-RX0P
HDMI1-RX0N
HDMI1-RX1P

D D

HDMI1-RX1N
HDMI1-RX2P
HDMI1-RX2N

HDMI1-CLKN

HDMI1-CLKP

HDMI1-SCL
HDMI1-SDA

HDMI1-HPDIN

HDMI2-RX0P
HDMI2-RX0N
HDMI2-RX1P
HDMI2-RX1N
HDMI2-RX2P
HDMI2-RX2N

HDMI2-CLKN

HDMI2-CLKP

HDMI2-SCL
HDMI2-SDA

HDMI2-HPDIN

MHL_CABLE-DET

HDMI-ARC
HDMI-CEC

PC & YPBPR Interface

VGA-Rin

VGA-Gin
VGA-Bin

VGA_HSYNC
VGA_VSYNC

C C

YPbPr_PR

YPbPr_Y
YPbPr_PB

CVBS IN & OUT

AV1

CVBS1_OUT

HDMI0-RX0P

HDMI0-RX0N

HDMI0-RX1P

HDMI0-RX1N

HDMI0-RX2P
HDMI0-RX2N
HDMI0-CLKN
HDMI0-CLKP
HDMI0-SCL
HDMI0-SDA

HDMI0-HPDIN

HDMI1-RX0P
HDMI1-RX0N
HDMI1-RX1P
HDMI1-RX1N
HDMI1-RX2P
HDMI1-RX2N
HDMI1-CLKN
HDMI1-CLKP
HDMI1-SCL
HDMI1-SDA

HDMI1-HPDIN

HDMI2-RX0P
HDMI2-RX0N
HDMI2-RX1P
HDMI2-RX1N
HDMI2-RX2P
HDMI2-RX2N
HDMI2-CLKN
HDMI2-CLKP
HDMI2-SCL
HDMI2-SDA

HDMI2-HPDIN

MHL_CABLE-DET

HDMI-ARC
HDMI-CEC

R28 33R/0402/5%
R29 68R/0402/5%
R30 33R/0402/5%
R31 33R/0402/5%

R32 33R/0402/5%
R33 68R/0402/5%
R34 33R/0402/5%
R35 33R/0402/5%
R36 0R/0402/5%

R38 150R/0402/5%

R39 180R/0402/5%

C48 47nF/0402/16V
C49 47nF/0402/16V
C50 47nF/0402/16V
C51 47nF/0402/16V

VGA_HSYNC
VGA_VSYNC

C52 47nF/0402/16V
C53 47nF/0402/16V
C54 47nF/0402/16V
C55 47nF/0402/16V
C56 1nF/0402/16V

C58 47nF/0402/16V

C60 47nF/0402/16V

RGB0_R+
RGB0_G­RGB0_G+
RGB0_B+

RGB1_R+
RGB1_G­RGB1_G+
RGB1_B+

RGB1_SOG

CVBS0+

CVBS_VCOM
CVBS1_OUT

HDMI2-RX1N
HDMI2-RX1P
HDMI2-RX2N
HDMI2-RX2P

+3.3V_Normal

HDMI1-CLKN
HDMI1-CLKP
HDMI1-RX0N
HDMI1-RX0P
HDMI1-RX1N
HDMI1-RX1P
HDMI1-RX2N
HDMI1-RX2P
VGA_HSYNC
RGB0_B+
RGB0_G+
RGB0_G­RGB0_R+
VGA_VSYNC

+3.3V_Normal

RGB1_B+
RGB1_SOG
RGB1_G+
RGB1_G­RGB1_R+

CVBS0+
CVBS_VCOM
CVBS1_OUT

LINEIN_R1
LINEIN_L1
AU_VAG
AU_VRM

VDDC

+3.3V_AU

AUDIO IN

VGA-Lin_AU
VGA-Rin_AU

AV1-Lin
AV1-Rin

VGA-Lin_AU
VGA-Rin_AU

AV1-Lin
AV1-Rin

C61 2.2uF/0603/16V
C63 2.2uF/0603/16V

C64 2.2uF/0603/16V
C65 2.2uF/0603/16V

LINEIN_L1
LINEIN_R1

LINEIN_L4
LINEIN_R4

DIF IN

VIFP

IFP

IFN

B B

USB & SPDIF_OUT

USB2_D­USB2_D+

USB1_D­USB1_D+

SPDIF_OUT

C67

0.1uF/0402/16V

VIFM

C68

0.1uF/0402/16V

USB2_D­USB2_D+

USB1_D­USB1_D+

SPDIF_OUT

C69

2.2uF/0603/16V

L6

AU_VRM
AU_VAG

C70

0.1uF/0402/16V

2.2uF/0603/16V

C71

RESET

+5V_Standby

DEBUG

A A

MUST pull high to 5VSTB

ISP AND VGA EDID

R49
100K/0402/5%

R50
10K/0402/5%

C78

2.2uF/0603/16V

UART-TX

R66 100R/0402/5%

UART-RX

R67 100R/0402/5%

3

D1
BAV99

C75

1

2

2.2uF/0603/16V

1

Q5
3906/SOT-23

R52

3 2

R54
100K/0402/5%

+5V_Standby

R64

4.7K/0402/5%

1K/0402/5%

R65

4.7K/0402/5%

5

System-RST

C77
1nF/0402/16V

UART_TX

UART_RX

0R/0603/5%

XTAL

R51

XTALO

0R/0402/5%

XTALI

FLASH

+3.3V_Normal

SPI_SCK
SPI_SDI

C81

0.1uF/0402/16V

R53

1M/0402/5%

Y1
24MHz

3

U7
MX25L3205

8

VDD

7

HOLD#

6

SCK

5

SI

C76
33pF/0402/16V

C79
33pF/0402/16V

WP#

4

TP4

HDMI2-RX0N

HDMI2-RX0P

1

131

127

128

132

129

130

U6

Test

MARK

MARK

E-PAD

RX0P_B

RX0N_B

1

RX1N_B

2

RX1P_B

3

RX2N_B

4

RX2P_B

5

AVDD_MOD

6

RXCN_A

7

RXCP_A

8

RX0N_A

9

RX0P_A

10

RX1N_A

11

RX1P_A

12

RX2N_A

13

RX2P_A

14

HSYNC0

15

BIN0P

16

GIN0P

17

GIN0M

18

RIN0P

19

VSYNC0

20

AVDD3P3_ADC

21

BIN1P

22

SOGIN1

23

GIN1P

24

GIN1M

25

RIN1P

26

VSYNC1

27

CVBS1

28

CVBS0

29

VCOM

30

CVBS_OUT1

31

VDDC

32

AVDD_AU33

33

AUR0

34

AUL0

35

AUR1

36

AUL1

37

VAG

38

VRM

AUR440AUOUTL3

AUL4

MSD3393LU

39

LINEIN_L4

LINEIN_R4

+3.3V_TU

Close to Mstar IC

R43
10K/0402/5%

IFAGC

R46

0R/0402/5%

CHIP_CONFIG

{IPAD_PWM1, PAD_PWM0}
B51_NO_EJ

PWM1

R57 4.7K/0402/5%

PWM0

R58 4.7K/0402/5%

+3.3V_Normal

1

SPI_CSN

CE#

2

SPI_SDO

SO

3

#F_WP

4

VSS

4

VDDC

HDMI2-CLKN

HDMI2-CLKP

HDMI0-RX1P

HDMI0-RX2N

HDMI0-RX2P

125

126

123

124

122

RX2P_D

RX1P_D

RX2N_D

RXCP_B

RXCN_B

AVDD5V_MHL

HDMI2-SCL

HDMI0-RX0P

120

RX1N_D

HDMI2-HPDIN

HDMI0-RX0N

HDMI0-CLKN

HDMI0-CLKP

116

117

118

119

112

115

113

114

RX0P_D

RX0N_D

RXCP_D

RXCN_D

AVDD_5V

HOTPLUG_B

GND_EFUSE

VDDC/AVDDL_DVI

HDMI0-RX1N

121

MSD3393LU

48

+3.3V_ADC

IFAGC-T

VDDC/DVDD_DDR_CMD54VDDIO_CMD

AVDD_MOD

AVDD3P3_DADC

55

53

51

52

+1.8V_DDR2

+3.3V_PLL

+3.3V_Normal

VDDC

XTALO

XTALI

TUNER_SDA

AUOUTL043AUOUTR3

41

42

LINE3OUT_L

LINE3OUT_R

LINE0OUT_L

LINE0OUT_R

C72

22nF/0402/16V

4'h00

R63
10K/0402/5%

VIFP46VIFM47AUOUTR044IFAGC45XIN50AVDD3P3_DMPLL49Xout

VIFM

VIFP

IFAGC

MHL_CABLE-DET

HDMI2-SDA

111

110

DDCDB_CL

DDCDB_DA

GPIO0/GPIO44

GPIO1/GPIO45

57

56

TUNER_SCL

MHL_VBUS-EN

HDMI1-SDA

109

MHL_DET

AMP-MUTE

HDMI1-SCL

HDMI0-SDA

107

108

DDCDA_CL

DDCDA_DA

DDCDC_DA

GPIO3/GPIO4758GPIO4/GPIO4859LVA3P61GPIO2/GPIO46

GPIO5/GPIO49

60

PWR-ON/OFF

SPDIF_OUT

VDDC

+1.8V_DDR2

ARC_DET

HDMI0-SCL

105

103

106

104

DDCDC_CL

VDDIO_DATA

VDDC/DVDD_DDR_DATA

HOTPLUG_C/D

LVA3M62LVACKP

64

63

R70
22R/0402/5%

B3_RXE3-

B2_RXE3+

B4_RXEC+

B5_RXEC-

PWR-ON/OFF

MHL_VBUS-EN

PANEL_ON/OFF

SAR2

SAR1
SAR0

AVDD_MOD

DP_P1
DM_P1
DP_P0
DM_P0
RESET

INT/GPIO64

TEST
DDCA_CK
DDCA_DA

SPI_CK
SPI_CZ

SPI_DI

SPI_DO

PWM0
PWM1

HOTPLUG_A

LDE/LVB0M
LCK/LVB0P

LVB1M
LVB1P
LVB2M
LVB2P

AVDD_MOD

LVB3M
LVB3P
LVA0M
LVA0P
LVA1M
LVA1P
LVA2M
LVA2P

LVACKM

R72
22R/0402/5%

IR-in

KEY0-SAR0

KEY1-SAR1

BRI_ADJ
VBL_CTRL

AMP-MUTE

ARC_DET

TUNER_SCL
TUNER_SDA

IRIN
CEC

ARC

102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65

FOR EMI

R7_RXO0­R6_RXO0+
R5_RXO1­R4_RXO1+
R3_RXO2­R2_RXO2+

G7_RXO3­G6_RXO3+

G3_RXE0­G2_RXE0+
G1_RXE1­G0_RXE1+

B7_RXE2­B6_RXE2+
B5_RXEC­B4_RXEC+
B3_RXE3­B2_RXE3+

3

KEY1-SAR1
KEY0-SAR0

+3.3V_Normal

USB2_D+
USB2_D­USB1_D+
USB1_D­System-RST
PANEL_ON/OFF
IR-in
HDMI-CEC

UART-RX
UART-TX
HDMI-ARC
SPI_SCK
SPI_CSN
SPI_SDI
SPI_SDO
BRI_ADJ
VBL_CTRL
HDMI1-HPDIN
HDMI0-HPDIN
R7_RXO0­R6_RXO0+
R5_RXO1­R4_RXO1+
R3_RXO2­R2_RXO2+

+3.3V_Normal

G7_RXO3­G6_RXO3+
G3_RXE0­G2_RXE0+
G1_RXE1­G0_RXE1+
B7_RXE2­B6_RXE2+

PWR-ON/OFF
PWM0
PWM1
MHL_VBUS-EN
AMP-MUTE
PANEL_ON/OFF
ARC_DET

TUNER_SCL
TUNER_SDA

R7_RXO0­R6_RXO0+
R5_RXO1­R4_RXO1+
R3_RXO2­R2_RXO2+

G7_RXO3­G6_RXO3+

G3_RXE0­G2_RXE0+
G1_RXE1­G0_RXE1+

B7_RXE2­B6_RXE2+
B5_RXEC­B4_RXEC+
B3_RXE3­B2_RXE3+

3

VDDC 1.15V

VDDC

C30

2.2uF/0603/16V

DDR2 1.8V

+1.8V_DDR2

C35

2.2uF/0603/16V

3.3V

+3.3V_Normal

C40

2.2uF/0603/16V

C31

0.1uF/0402/16V

C36

0.1uF/0402/16V

C41

0.1uF/0402/16V

0.1uF/0402/16V

C32

0.1uF/0402/16V

3.3V audio

+3.3V_Normal

C38

0.1uF/0402/16V

C42

0.1uF/0402/16V

C33

0.1uF/0402/16V

L3

0R/0603/5%

0.1uF/0402/16V
C43

Audio Line Out

LINE0OUT_L

LINE0OUT_R

LINE3OUT_L

LINE3OUT_R

Close to Mstar IC

IR&KEYB

J1
CON20W-J20-12

IR_in

1nF/0402/16V

1nF/0402/16V

1nF/0402/16V

1nF/0402/16V

1
2
3
4
5
6
7
8
9
10
11
12

+5V_Standby

R60
10K/0402/5%

R62
1K/0402/5%

C165

C57

C62

C66

+5V_Standby

KEY0-in
KEY1-in

IR_in

LED_G

LED_R

R37
200K/0402/5%

R40
200K/0402/5%

R41
200K/0402/5%

R42
200K/0402/5%

+3.3V_Normal

IR-in

C80

33pF/0402/16V

D13
ESD

2

C34

0.1uF/0402/16V

1

3.3V MPLL

+3.3V_Normal

+3.3V_AU

C37

0.1uF/0402/16V

L5

0R/0603/5%

C44

C45

0.1uF/0402/16V

AV_AUOUTL1

AV_AUOUTR1

LINEOUT_APML

LINEOUT_APMR

+3.3V_Normal

R44

8.2K/0402/5%

KEY0-in KEY0-SAR0

C74

0.1uF/0402/16V

D12
ESD

STANDBY

L4

0R/0603/5%

+3.3V_ADC

C46

2.2uF/0603/16V

R47
1K/0402/5%

R61
22K/0402/5%

+3.3V_PLL

C39

0.1uF/0402/16V

C47

0.1uF/0402/16V

+3.3V_Normal

Q7

1

3904/SOT-23

2 3

KEY1-in

R55
2K/0402/5%

LED_G

+3.3V_Normal

R45

8.2K/0402/5%

R59

4.7K/0402/5%

R48

1K/0402/5%

C73

0.1uF/0402/16V

+3.3V_Normal

Q6

1

3904/SOT-23

R56

2K/0402/5%

LED_R

2 3

KEY1-SAR1

Standby :L :Power on Green Led
H :Power off Red Led

Title

Title

Title

Size Document Number Rev

Size Document Number Rev

Size Document Number Rev
C

C

C
Date: Sheet

Date: Sheet

2

Date: Sheet

MSD3393

MSD3393

MSD3393

MAIN CHIP

MAIN CHIP

MAIN CHIP

1

1.0

1.0

29Wednesday, June 11, 2014

29Wednesday, June 11, 2014

29Wednesday, June 11, 2014

1.0

of

of

of

5

4

LVDS CONNECTOR ( 1 DIP + 2 SMT OPTIONAL )

3

2

1

HI CONNECTOR

D D

CN2
DIP/20*2

R7_RXO0­R5_RXO1­R3_RXO2­R1_RXOC­G7_RXO3-

G3_RXE0­G1_RXE1­B7_RXE2-

C C

B5_RXEC­B3_RXE3-

VCC-Panel

C85

0.1uF/0402/16V

40

A0-

38

A1-

36

A2-

34

AC-

32

A3-

30

A4-

28

GND

26

DCR-I

24

MODE

22

SG

20

B0-

18

B1-

16

B2-

14

BC-

12

B3-

10

B4-

8

GND

6

GND

4

VCC

2

VCC

A0+
A1+
A2+
AC­A3+
A4+

GND

DCR-O

GND

B0+
B1+
B2+

BC+

B3+

B4+
GND
GND

VCC
VCC

39
37
35
33
31
29
27
25
23

I/O

21
19
17
15
13
11
9
7
5
3
1

R6_RXO0+
R4_RXO1+
R2_RXO2+
R0_RXOC+
G6_RXO3+

G2_RXE0+
G0_RXE1+
B6_RXE2+
B4_RXEC+
B2_RXE3+

Power for panel

+5V_Normal

+12V_NORMAL

PANEL_ON/OFF

Net to other page

R7_RXO0­R6_RXO0+
R5_RXO1­R4_RXO1+
R3_RXO2­R2_RXO2+
G7_RXO3­G6_RXO3+

FB3 0R/1206/5%/NC

FB4 0R/1206/5%

PANEL_ON/OFF

R7_RXO0­R6_RXO0+
R5_RXO1­R4_RXO1+
R3_RXO2­R2_RXO2+
G7_RXO3­G6_RXO3+

0.1uF/0402/16V/NC

R71

4.7K/0402/5%

R73

10K/0402/5%

G3_RXE0­G2_RXE0+
G1_RXE1­G0_RXE1+
B7_RXE2­B6_RXE2+
B5_RXEC­B4_RXEC+
B3_RXE3­B2_RXE3+

R1_RXOC- B5_RXEC­R0_RXOC+ B4_RXEC+

VPANEL_IN

C82

100K/0402/5%

1

3904/SOT-23

G3_RXE0­G2_RXE0+
G1_RXE1­G0_RXE1+
B7_RXE2­B6_RXE2+
B5_RXEC­B4_RXEC+
B3_RXE3­B2_RXE3+

R68

100K/0402/5%

Q9

2 3

C83

1uF/0402/16V/NC

R69

U8 9435/SOP8

1

S

2
3
4

AO3401A/SOT-23/NC

D

S

D

S

D

G

D

Q8

C84

0.1uF/0402/16V/NC

5
6
7
8

470uF/16V/EC3.5

VCC-Panel

CA11

+

B B

A A

Title

Title

Title

Size Document Number Rev

Size Document Number Rev

Size Document Number Rev
B

B

B
Date: Sheet

Date: Sheet

5

4

3

2

Date: Sheet

MSD3393

MSD3393

MSD3393

LVDS Interface

LVDS Interface

LVDS Interface

1.0

1.0

1.0

of

of

of

39Wednesday, June 11, 2014

39Wednesday, June 11, 2014

39Wednesday, June 11, 2014

1

5

D D

4

3

2

1

AUDIO IN

P1

WHITE

1

C C

RED

RCA-2P

HD_L

2
3
4

HD_R

HD_L

HD_R

220pF/0402/16V/NC

C87

C86

220pF/0402/16V/NC

R76 10K/0402/5%

R77 10K/0402/5%

R79

12K/0402/5%

AV1-Lin

AV1-Rin

R80
12K/0402/5%

YPBPR & AV IN

B B

P2

YPbPr_PR

YPbPr_PB
AV1

YPbPr_Y

RCA-3P

12

34

56

D14
ESD

AV1-IN

R85

75R/0402/5%

R84

75R/0402/5%

75R/0402/5%

Close to Mstar IC

R83

R199

0R/0402/5%

VIDEO OUT

SPDIF OUT

R81
330R/0402/5%

SPDIF_O

R82

100R/0402/5%

P14

3

INPUT

2

VCC

1

GND

NC/FIBER-OPTIC

1

TP2

Closed to IC

+5V_Normal

NC/C88

0.1uF/0402/16V/NC

CVBS1_OUT

FOR ATV/AV DEBUG

SPDIF_OUT

C102

33pF/0402/16V

SPDIF_O

NC/RV1

ESD

A A

Title

Title

Title

Size Document Number Rev

Size Document Number Rev

Size Document Number Rev
B

B

B
Date: Sheet

Date: Sheet

5

4

3

2

Date: Sheet

MSD3393

MSD3393

MSD3393

Video Interface

Video Interface

Video Interface

1.0

1.0

1.0

of

of

of

49Monday, July 14, 2014

49Monday, July 14, 2014

49Monday, July 14, 2014

1

5

4

3

2

1

VGA

P4

D D

C C

R92

10K/0402/5%

1617

11

12

13

14

15

VGA/15 PIN

R93
10K/0402/5%

1
6
2
7
3
8
4
9
5
10

DDC_SCL_D

DDC_SDA_D

R90100R/0402/5%
R91100R/0402/5%

VGA-Rin

VGA-Gin

VGA-Bin

UART_RX

UART_TX

VGA_VSYNC
VGA_HSYNC

VGA AUDIO IN

P5
PHONEJACK

1
2
5

3
4

R86 10K/0402/5%

R87 10K/0402/5%

R88

12K/0402/5%

R89

12K/0402/5%

VGA-Lin_AU

VGA-Rin_AU

C89
220p/0402/16V

VGA-Lin_AU

VGA-Rin_AU

C90
220p/0402/16V

B B

VGA-Bin
VGA-Gin
VGA-Rin

R94

75R/0402/5%

R95

R96

75R/0402/5%

75R/0402/5%

VGA-Bin

VGA-Gin

VGA-Rin

Close to Mstar IC

A A

Title

Title

Title

MSD3393

MSD3393

MSD3393

Size Document Number Rev

Size Document Number Rev

Size Document Number Rev
A

A

A
Date: Sheet

Date: Sheet

5

4

3

Date: Sheet

VGA Interface

VGA Interface

VGA Interface

2

of

of

of

59Wednesday, May 14, 2014

59Wednesday, May 14, 2014

59Wednesday, May 14, 2014

1

1.0

1.0

1.0

5

4

3

2

1

USB INTERFACE

D

C C

5

6

5

6

P6

USB_A

5

6

5

6

1

1

2
3
4

P7USB_A

1
2
3
4

USB1_D1-_in
USB1_D1+_in

USB2_D1-_in
USB2_D1+_in

2
3
4

1
2
3
4

+5V_USB0

+5V_USB0

R97 2.2/0402/5%
R98 2.2/0402/5%

R99 2.2R
R100 2.2R

USB2_D-

USB2_D+

USB1_D­USB1_D+

USB2_D+

USB1_D­USB1_D+

USB2_D-

USB POWER

D2

+5V_USB0

C91

0.1uF/0402/16V

CA10

+

200uF/35V/ECS-5M

C93

0.1uF/0402/16V

+5V_Normal5V_USB

5V_USB

C92

2.2uF/0603/16V

5V_USB+5V_USB0

C94

2.2uF/0603/16V

D

B

A

Title

Title

Title

MSD3393

MSD3393

MSD3393

USB Interface

USB Interface

A

A

A

5

4

3

USB Interface

2

teehS:etaD

teehS:etaD

teehS:etaD

of

of

of

6 9Monday, July 14, 2014

6 9Monday, July 14, 2014

6 9Monday, July 14, 2014

1

veRrebmuN tnemucoDeziS

veRrebmuN tnemucoDeziS

veRrebmuN tnemucoDeziS

1.0

1.0

1.0

B

A