LG 32LB3RS-MB Schematic

TELEVISOR A LCD

MANUAL DE SERVIÇO

ATENÇÃO

Antes de reparar este chassis, leia as PRECAUÇÕES DE SEGURANÇA contidas neste manual.

CHASSIS : LP70A

MODELO : 32LB3RS 32LB3RS-MB

website:http://biz.LGservice.com

Internal Use Only

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CONTEÚDO

CONTEÚDO ............................................................................................. 2

PRECAUÇÕES DE SEGURANÇA ...........................................................3

ESPECIFICAÇÃO......................................................................................6

INSTRUÇÕES DE AJUSTE.....................................................................10

SOLUÇÃO DE PROBLEMAS..................................................................16

DIAGRAMA DE BLOCOS .......................................................................22

VISTAS EXPLODIDAS .......................................................................... 24

LISTA DAS VISTAS EXPLODIDAS.........................................................25

LISTA DE PEÇAS DE REPOSIÇÃO ...................................................... 26

DIAGRAMA ELÉTRICO...............................................................................

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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500

°F to 600°F)

b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500

°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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1. Application range

This specification is applied to LP70 chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

(1) Temperature : 25±5°C(77±9°F), CST : 40±5 (2) Humidity : 65%±10% (3) Power : Standard input voltage (100-240V~, 50/60Hz)

*Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

(1) Performance : LGE TV test method followed (2) Demanded other specification

Safety : CE, IEC Specification EMC : CE, IEC

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

4. General TV Specification

No Item Specification Remark

1. Video input applicable system NTSC M,PAL M/N 3-SYSTEM

2. Receivable Broadcasting System NTSC M,PAL M/N 3-SYSTEM

3. Available Channel VHF : 2~13 3-SYSTEM UHF : 14~69 CATV : 1~125

4. Input Voltage 100-240V~ / 50Hz, 60Hz

5. Market Central and South America

6. Active Screen Size 800.4 mm(diagonal) 31.51 inches 32LB3RS-TB

940.3 mm(diagonal) 37.02 inches 37LB3RS-TB

1067.308 mm (diagonal) 42.02 inches 42LB3RS-TB

7. Tuning System FVS 100 program FS

8. Operating Environment 1) Temp : 0 ~ 40 deg

2) Humidity : 10 ~ 90 %RH

9. Storage Environment 1) Temp : -20 ~ 50 deg

2) Humidity : 10 ~ 90 %RH

10. Display LCD Module 32”/37” : AUO 42” : LPL

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5. General Specification

No Item Specification Remark

1 Panel 32”, 37”, 42" TFT WXGA LCD for 120Hz 2 Frequency range H : 31 ~ 61Khz

V : 56 ~ 75Hz PC Input

3 Control Function Contrast/Brightness

H-Position / V-Position Tracking : Clock / Phase Auto Configure Reset

4 Component Jack Y/Pb/Pr : 2EA

(480i/576i/480p/576p/720p/1080i)

5 Power ON LED Power consumption

White ≤ 170W(32”)

≤ 200W(37”) ≤ 270W(42”)

Stand by RED ≤ 1W

6 LCD Module Outline 32” 760.0 x 450.0 x 48.0 (H)mm x (V)mm x (D)mm

Dimension 37” 877.0 x 516.8 x 55.5

42” 1006 x 610 x 56

Pixel Pitch 32” 0.1702 x 0.5107 x RGB

37” 0.200 x 0.600 x RGB

42” 0.227 x 0.681 x RGB Pixel Format 1366 x 768 Pixels RGB strip arrangement Coating Hard coating(3H), Anti-glare treatment of the front polarizer Back Light 32” 20EEFL

37” 20EEFL

42” 20CCFL

6. Model Specification

No Item Specification Remark

1. Market Central and South America

2. Broadcasting system NTSC M,PAL M/N

3. Available Channel BAND NTSC VHF/UHF 2~69 CATV 1~125

4. Receiving system Upper Heterodyne

5. SCART Jack(0EA) PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60

6. Video Input (2EA)/Video Output(1) NTSC, PAL M/N

7. S-Video Input (1EA) NTSC, PAL M/N

8. Component Input (2EA) Y/Cb/Cr, Y/ Pb/Pr

9. RGB Input (1EA) RGB-PC

10. HDMI Input (2EA) HDMI-PC HDMI-DTV

11. Audio Input (5 EA) PC Audio(1EA), Component (2EA), AV (2EA) L/R Input

12. Audio variable out(2EA) AV(1EA) ,Variable Audio Out(1EA)

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7. Component Video Input (Y, PB, PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Remarks

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480i(525I)

2. 720*480 15.75 60.00 13.514 SDTV, DVD 480i(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576i(625I)

4. 720*480 31.47 59.94 27.000 SDTV 480p

5. 720*480 31.50 60.00 27.027 SDTV 480p

6. 720*576 31.25 50.00 27.000 SDTV 576p

7. 1280*720 44.96 59.94 74.176 HDTV 720p

8. 1280*720 45.00 60.00 74.250 HDTV 720p

9. 1280*720 37.50 50.00 74.25 HDTV 720p 50Hz

10. 1920*1080 33.72 59.94 74.176 HDTV 1080i

11. 1920*1080 33.75 60.00 74.250 HDTV 1080i

12. 1920*1080 28.125 50.00 74.250 HDTV 1080i 50Hz,

13. 1920*1080 67.432 59.94 148.35 HDTV 1080p

14. 1920*1080 67.5 60.00 148.5 HDTV 1080p

15. 1920*1080 56.25 50.00 148.5 HDTV 1080p 50Hz,

8. RGB Input (PC)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Remarks

1 720*400 31.469 70.08 28.32 DOS

2. 640*480 31.469 59.94 25.17 VESA(VGA) 3 640*480 37.500 75.00 31.50 VESA(VGA) 4 800*600 37.879 60.31 40.00 VESA(SVGA) 5 800*600 46.875 75.00 49.50 VESA(SVGA) 6 832*624 49.725 74.55 57.28 Macintosh 7 1024*768 48.363 60.00 65.00 VESA(XGA) 8 1024*768 56.476 70.06 75.00 VESA(XGA) 9 1024*768 60.023 75.02 78.75 VESA(XGA)

10 1280*768 47.693 59.99 80.125 WXGA(42XGA,50”,60”) 11 1360*768 47.700 60.00 84.62 WXGA(42XGA,50”,60”) 12 1366*768 47.700 60.00 84.62 WXGA(42XGA,50”,60”)

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9. HDMI Input (PC)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Remarks

1 720*400 31.469 70.08 28.32 DOS 2 640*480 31.469 59.94 25.17 VESA(VGA) 3 640*480 37.500 75.00 31.50 VESA(VGA) 4 800*600 37.879 60.31 40.00 VESA(SVGA) 5 800*600 46.875 75.00 49.50 VESA(SVGA)

6. 832*624 49.725 74.55 57.28 Macintosh 7 1024*768 48.363 60.00 65.00 VESA(XGA) 8 1024*768 56.476 70.06 75.00 VESA(XGA) 9 1024*768 60.023 75.02 78.75 VESA(XGA)

10 1280*768 47.693 59.99 80.125 WXGA(42XGA,50”,60”) 11 1360*768 47.700 60.00 84.62 WXGA(42XGA,50”,60”) 12 1366*768 47.700 60.00 84.62 WXGA(42XGA,50”,60”)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Remarks

1. 720*480 31.47 59.94 27.000 SDTV 480P

2. 720*480 31.50 60.00 27.027 SDTV 480P

3. 720*576 31.25 50.00 27.000 SDTV 576P

4. 1280*720 44.96 59.94 74.176 HDTV 720P

5. 1280*720 45.00 60.00 74.250 HDTV 720P

6. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

7. 1920*1080 33.72 59.94 74.176 HDTV 1080I

8. 1920*1080 33.75 60.00 74.250 HDTV 1080I

9. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz

10. 1920*1080 67.432 59.94 148.35 HDTV 1080p

11. 1920*1080 67.5 60.00 148.5 HDTV 1080p

12. 1920*1080 56.25 50.00 148.5 HDTV 1080p 50Hz

10. HDMI2 input ( DTV )

1. Application Range

This spec. sheet is applied to all of the LP70A chassis(H3High) manufactured at LG TV Plant all over the world.

2. Specification

1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation transformer will help to protect test instruments.

2) Adjustment must be done in the correct sequence.

3) The adjustment must be performed at 25±5°C temperature

and 65±10% relative humidity if there is no specified designation.

4) The input voltage of the receiver must be kept between

100-220V, 50/60Hz.

5) Before adjustment, execute Heat-Run for 30 minutes at RF

no signal

3. Adjustment items

3.1. PCB assembly adjustment items

O Channel memory

- Download the channel data from BOM to EEPROM by using LGIDS.

O Option adjustment following BOM

- Tool Option1

- Tool Option2

- Area Option

1) Push the ADJ key in the Adjust Remote control.

2) Input the Option Number that was specified in the BOM, into the Shipping area.

3) Select "Tool Option1/ Tool Option2/ Area Option" by using

D /E(CH+/-) key, and press the number key(0~9)

consecutively ex) If the value of Tool Option1 is 7, input the data using

number key "7" (Fig. 1)

3.2. SET assembly adjustment items

O Auto AV1 Color Balance O Adjustment of White Balance O Auto Component Color Balance adjustment

- Standard equipment : MSPG925FA

O Auto RGB Color Balance adjustment

- Standard equipment : MSPG925FA

4. EDID

∆ Caution

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

* Caution : - Never connect HDMI & DVI-D & DVI-A Cable at

the same time.

- Use the proper cables below for EDID Writing.

4.1. EDID Data

(1) ANALOG(256 Bytes )

O BLOCK1 (128BYTE)

(2) HDMI(256 Bytes )

O BLOCK0 (128BYTE)

O BLOCK1 (128BYTE)

0123456789ABCDEF 00 00 FF FF FF FF FF FF FF 1E 6D a b 10 c 010301462778EAD9B0A357499C25 20 11 49 4B A5 6E 80 31 40 01 01 01 01 45 40 01 01 30 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88 40 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30 50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FD 00 38 60 4B 1F 3D 09 00 0A 20 20 20 20 20 20 70 D 00 e

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ADJUSTMENT INSTRUCTION

(Fig. 1)

For Analog EDID

D-sub to DVI-I

For Digital EDID

DVI-D to DVI-D

For HDMI EDID

DV-D to HDMI or HDMI to HDMI

Condition

GSM Digital : 1 Digital : 2

Item

Manufacturer ID

Version

Revision

Data

1E6D

01 03

LP7Ax AUO 32 120Hz S/W Version X.XX

UTT XX

Tool Option1 7 Tool Option2 161 Area Option 16

: :

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 00 00 FF FF FF FF FF FF 00 1E 6D a b 10 c 010380462778EAD9B0A357 499C25 20 11 49 4B 81 00 80 31 40 01 01 01 01 45 40 01 01 30 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88 40 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30 50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00 4C 60 47 20 54 56 0A 20 20 20 20 20 20 20 d 70 D 01 e

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 80 02 03 23 F1 50 01 07 16 02 03 11 12 13 04 14 85 90 20 21 22 1F 10 23 09 07 07 83 01 00 00 65 03 0C A0 00 10 00 01 1D 00 80 51 D0 1C 20 40 80 35 00 BC B0 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 C0 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16 00 26 D0 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71 1C 16 E0 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00 00 00 F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

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(2) HDMI(256 Bytes )

O BLOCK0(128BYTE)

=> Detail EDID Options are below (a, b, c, d, e)

a. Product ID

b. Serial No : Controlled on production line c. Month, Year : Controlled on production line:

ex) Monthly : '03' => '03'

Year : '2005' => '0F'

d. Model Name/Monitor Name

e. Checksum: Changeable by total EDID data

5. ADC Calibration

* Caution : System control RS-232C Host should be “PC” for

adjustment

- Press the FRONT-AV KEY on R/C for converting input mode (Change RS-232C Host : pc, Band Rate : 115200bps)

5.1. Adjustment of AV

* Required Equipments

O Remote controller for adjustment O 802F Pattern Generator, Master (MSPG-925FA), etc. O MSPG-925FA Pattern Generator (Which has Video

Signal: 100% Color Bar Pattern shown in Fig. 2)

=> Model : 202 / Pattern : 65 (PAL : CH)

Model : 207 / Pattern : 65 (NTSC-J)

(1) Method of Auto AV Color Balance

1) Press the FRONT-AV KEY on R/C for converting input mode.

2) Input the Video Signal: 100% Color Bar signal into AV2(MA/TA)

3) Set the PSM to Standard mode in the Picture menu.

4) Press INSTART key on R/C for adjustment.

5) Press the

G(Vol.+) key to operate the set, then it

becomes automatically.

6) Auto-RGB OK means the adjustment is completed.

(2) Requirement

O This AV color balance adjustment should be performed

before White Balance Adjustment.

5.2. Adjustment of Component.

* Required Equipments

O Remote controller for adjustment O 802F Pattern Generator, Master (MSPG-925FA), etc. O MSPG-925FA Pattern Generator

(Which has 720p@50Hz YPbPr signal : 100% Color Bar Pattern shown in Fig. 2 ) => Model: 215 / Pattern: 65

It is very import to use correct adjustment pattern like Fig.2.

- If Minimum Black Level and/or Maximum White Level

is not correct, Select 100% Color Bar Pattern.

(1) Method of Auto Component Color Balance

1) Input the Component 720p 100% Color Bar(MSPG925FA model:215, pattern:65) signal into Component. (ZA : component , TA/MA : component 1 or 2)

2) Set the PSM to Standard mode in the Picture menu.

3) Press the INSTART key on R/C for adjustment.

4) Press the

G(Vol. +) key to operate the set , then it

becomes automatically.

5) Auto-RGB OK means the adjustment is completed.

Model Name Product ID Product ID

Dec Hex EDID table

32LB3RS-MB 30120(A) 30120 75A8 A875

30121(D) 30121 75A9 A975

MSPG-

925FA

AV ADC Condition

PAL NTSC

CH model:AV3 MA model:AV1

Model:202(PAL-BGDHI) Model:201(NTSC-J)

Pattern 65 * 100% Color Bar

Component Model : 215

(720p@60Hz)

RGB Model : 60 (1024x768

@60H)

Model Name

LGTV 00 00 00 FC 00 33 32 4C 42 33 52 532D4D 41 0A 20 20

<Fig. 2>

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 00 00 FF FF FF FF FF FF 00 1E 6D a b 10 C 010380462778EAD9B0A357499C25 20 11 49 4B 81 00 80 31 40 01 01 01 01 45 40 01 01 30 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88 40 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30 50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00 4C 60 47 20 54 56 0A 20 20 20 20 20 20 20 d 70 D 01 e

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 80 02 03 23 F1 50 01 07 16 02 03 11 12 13 04 14 85 90 20 21 22 1F 10 23 09 07 07 83 01 00 00 65 03 0C

A0 00 20 00 01 1D 00 80 51 D0 1C 20 40 80 35 00 BC B0 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 C0 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16 00 26 D0 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71 1C 16 E0 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00 00 00 F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

5.3 Adjustment of RGB

* Required Equipments

Remote controller for adjustment

802F Pattern Generator, Master (MSPG-925FA), etc.

MSPG-925FA Pattern Generator

(Which has XGA [1024x768] 60Hz PC Format output signal : 100% Color Bar Pattern shown in Fig. 2 )

It is very import to use correct adjustment pattern like Fig.2.

- If Minimum Black Level and/or Maximum White Level is not correct, Select 100% Color Bar Pattern.

(1) Method of Auto RGB Color Balance

1) Input the PC 1024x768 @ 60Hz with 100% color bar pattern like Fig.2. into RGB. (Ex. MSPG-925FA, model:60, pattern:65)

2) Set the PSM to Standard mode in Picture menu.

3) Press the INSTART key on R/C for adjustment.

4) Press the

G(Vol. +) key operate To set , then it becomes

automatically.

5) Auto-RGB OK means adjustment is completed.

6. White Balance

- Before white balance,press the In-start key 2times and do the reset like Fig1.

- Use the cortez inner pattern(216 gray pattern)

- To enter White-balance mode,press the IN-START key 2times.

* Caution: System control RS-232 Host should be “PC” for

adjustment.

* Test Equipment

Color Analyzer (CA-110) PC(For communication through RS-232C) => UART Baud rate : 115200 Pattern Generator (MSPG-925FA etc.)

* Color Temperature & Color Coordinates Setting

When adjusting the Color Temperature of LCD, Color Analyzer CA-210(Matrix should be corrected through CH9 of CS-1000) should be used. Adjust the Color Temperature based below adjustment color coordinates. Even if CH9 of CA-210 is corrected with Matrix, there may be many character of Module and Filter. Therefore Refer to the below Color Coordinates Target.

O Standard Color Temperature & Color Coordinates Using

CS-1000

O LCD Color Temperature & Color Coordinates Target Using

CA-210(CH 9)

* Target Value of Brightness, Color Coordinates, Color

Temperature

- Brightness : High Light : MIN 240Cd/m2(32 WXGA, AUO)

- Color-Coordinate : High Light : Cool : X ; 0.276 ±0.002 , Y ; 0.283 ±0.002

Warm : X ; 0.313 ±0.002, Y ; 0.329 ±0.002

- Color Temperature : 11,000∞K±500ºK(Cool), 6,500ºK

±500ºK(Warm)

6.1. Manual white Balance (Inner pattern)

1) Execute CA-210(9CH) Zero Calibration.

2) Execute the SET Heat Run for 30minutes

3) Use cortez inner pattern as below Fig. 4, Supply 216Level (85 IRE) full screen pattern

4) Enter the White Balance adjustment mode by pressing the INSTART key twice(White Balance) on R/C.

5) Stick sensor to center of the screen and select each items (Red/Green/Blue Gain and Offset) using °„/°Â(CH £´/£≠) key on R/C..

6) Adjust with R / G / B Gain using ¢∏/¢∫(VOL £´/£≠) key on R/C.

7) Adjust it until color coordination becomes as below.

* Color Temperature : Cool, Medium, Warm

One of R/G.B Gain should be fixed at 80 and adjust two Gain Value with decreasing the Default values from 80.

- When R Gain is Fixed at Default value(80) Adjust G gain and B gain with decreasing Default values from 80

- When B Gain is Fixed at Default value(80) Adjust R gain and G gain with decreasing Default values from 80

- When G Gain is Fixed at Default value(80) Adjust R gain and B gain with decreasing Default values from 80

R/G/B Gain and R/G/B Offset Default Value Red Gain : 80, Green Gain : 80, Blue Gain : 80

- 12 -

(Fig. 1)

White Balance(Hex)

Color Temp. Cool Red Gain. 80 Green Gain. 80 Blue Gain. 80 Red Offset 80 Green Offset 80 Blue Offset 80 Reset

To set

216 Level (85 IRE)

Color Temperature Temp x y

Cool 11,000k 0.276 0.283

Warm 6,500k 0.313 0.329

Mode Color Coordinates Temp ∆uv

Cool 0.276±0.002 0.283±0.002 11,000K 0.000

Warm 0.313±0.002 0.329±0.002 6,500K 0.003

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